U.S. patent application number 13/554662 was filed with the patent office on 2012-11-08 for continuous micro anode guided electroplating device and method thereof.
Invention is credited to Ting-Kang Chang, Ting-Chao Chen, Yean-Ren Hwang, Jing-Chie Lin, Jen-Hung Yang.
Application Number | 20120279862 13/554662 |
Document ID | / |
Family ID | 43219011 |
Filed Date | 2012-11-08 |
United States Patent
Application |
20120279862 |
Kind Code |
A1 |
Lin; Jing-Chie ; et
al. |
November 8, 2012 |
CONTINUOUS MICRO ANODE GUIDED ELECTROPLATING DEVICE AND METHOD
THEREOF
Abstract
A continuous micro anode guided electroplating device and a
method thereof are revealed. By real-time image monitoring and
capillary action of the micro/nanoscale tube, a three-dimensional
microstructure is deposited on a workpiece at the cathode. The
deposit is growing smoothly under the real-time image monitoring.
Moreover, the workpiece is not immersed in an electrolyte so that
contaminations of the workpiece caused by electrolyte are
reduced.
Inventors: |
Lin; Jing-Chie; (Zhongli
City, TW) ; Chang; Ting-Kang; (Zhongli City, TW)
; Yang; Jen-Hung; (Zhongli City, TW) ; Hwang;
Yean-Ren; (Zhongli City, TW) ; Chen; Ting-Chao;
(Zhongli City, TW) |
Family ID: |
43219011 |
Appl. No.: |
13/554662 |
Filed: |
July 20, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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12570080 |
Sep 30, 2009 |
|
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13554662 |
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Current U.S.
Class: |
205/82 |
Current CPC
Class: |
C25D 17/10 20130101;
C25D 17/00 20130101; C25D 5/02 20130101 |
Class at
Publication: |
205/82 |
International
Class: |
C25D 21/12 20060101
C25D021/12 |
Foreign Application Data
Date |
Code |
Application Number |
May 27, 2009 |
TW |
098117693 |
Claims
1. A method of continuous micro anode guided electroplating
comprising the steps of: disposing a micro anode above a cathode,
adding an electrolyte into the micro anode, applying a bias to the
micro anode and the cathode, generating a deposit at the cathode
from the micro anode, capturing an image between the micro anode
and the cathode, and checking a distance between the micro anode
and the cathode according to the image and controlling movement of
a loading platform so as to maintain the distance between the micro
anode and the cathode at a fixed value.
2. The device as claimed in claim 1, wherein the fixed value of the
distance ranges from 10 mm (micrometer) to 20 mm.
3. The device as claimed in claim 1, wherein the image is treated
by binary processing.
4. The device as claimed in claim 1, wherein the micro anode
includes a capillary and a conductor while the conductor is
disposed inside the capillary.
5. The device as claimed in claim 4, wherein the conductor is made
from platinum.
Description
[0001] The current application is a divisional application of, and
claims a priority to U.S. Ser. No. 12/570,080 filed on Sep. 30,
2009, which claims a foreign priority to application of Taiwan
098117693 filed on May 27, 2009.
BACKGROUND OF THE INVENTION
[0002] 1. Field of Invention
[0003] The present invention relates to a micro anode guided
electroplating device and a method thereof, especially to a
continuous micro anode guided electroplating device and a method
thereof.
[0004] 2. Description of Related Art
[0005] Along with fast development of and great advancement in
modern technology, the electronic products are getting compact and
light weighted. Similarly, the establishment of micromechanical
devices provides more benefits. When the mechanical devices are
getting smaller, its resonance frequency increases. Thus high
bandwidth accelerometers and pressure gauges are produced. The
microelements integrate drivers, limbs, sensors, processors and
power supplies so as to move around the world under the microscope
and applied to medical field.
[0006] Milling, welding and fastening of conventional mechanical
devices haven't achieved the space resolution required by the
microelements. Integrated circuits have been widely applied to
mechanical devices, electromechanical devices and
opto-electro-mechanical systems in millimeter size and micrometer
size. But the uniform thickness structure with low aspect ratio is
unable to achieve optimal performance. Although the aspect ratio
can be increased by the lithographic technology such as LIGA
(Lithography Electroforming Micro Molding), the lithographic
technology is a two-dimensional manufacturing method. The
three-dimensional structure is produced by laser cutting, Laser
Assisted Chemical Vapor Deposition, and stereolithography. The most
common way used is lithographic technology in which thin films are
selectively removed by etching to leave the desired film pattern
after deposition. By local heating or setting a small piece of
electrode near the substrate for local reaction, local deposition
rate is improved.
[0007] Moreover, mechanical devices can also be produced by local
micro electroplating. In the local micro electroplating, a
three-dimensional micro positioning member drives a micro anode so
that the micro anode moves in a constant speed along a preset
track. The potential is controlled to perform DC (direct current)
electroplating. However, the deposition rate is not constant so
that the micro anode moving in a constant speed will not lead to
constant growing of the deposit. If the micro anode moves too fast,
the deposit is gradually reduced in size and finally grows nothing
with increasing the distance between the electrodes. On the
contrary, if the micro anode moves too slowly, the deposits contact
with the micro anode and a short circuit occurs.
[0008] The meaning of the constant speed has been lost.
[0009] Thus the constant movement of the micro anode is unable to
ensure a stable deposit rate. Thus the deposit is grown in
non-uniform size or the electroplating may be interrupted. Both
have affected the quality of electroplated micro components
significantly.
SUMMARY OF THE INVENTION
[0010] Therefore it is a primary object of the present invention to
provide a micro anode guided electroplating device and a method
thereof in which a workpiece is not soaked in an electrolyte
(electroplating solution) so as to reduce the contaminations of the
workpiece caused by the electrolyte.
[0011] It is another object of the present invention to provide a
micro anode guided electroplating device and a method thereof in
which real-time image monitoring and capillary action of
micro/nanoscale capillary are combined. A three-dimensional
microstructure is deposited on a workpiece at the cathode. The
deposit is growing smoothly by the real-time image monitoring of
the electroplating process.
[0012] It is a further object of the present invention to provide a
micro anode guided electroplating device and a method thereof in
which an electric field strength of the micro anode is controlled
so that the electric field strength between the micro anode and the
cathode remains stable for generating deposit with a smooth and
uniform surface.
[0013] It is a further object of the present invention to provide a
micro anode guided electroplating device and a method thereof in
which a monitor is used to monitor the distance between the micro
anode and the cathode and control a loading platform carrying the
cathode so as to maintain the distance between the micro anode and
the cathode at a fixed value and avoid defects in the deposit.
[0014] In order to achieve above object, a continuous micro anode
guided electroplating device and a method thereof according to the
present invention consists of a micro anode, a loading platform, a
cathode, a power supply and a monitor. The micro anode is formed by
a micro/nanoscale capillary filled with an electrolyte and a
conductor disposed in the capillary. The loading platform is
arranged under the micro anode while the cathode is a workpiece
that is put on the loading platform to be electroplated. The power
supply is connected to the conductor of the micro anode as well as
the cathode so as to supply a bias to the micro anode and the
cathode and generate a deposit on the surface of the cathode. The
monitor is connected to the power supply as well as the loading
platform. The power supply provides the monitor electricity and the
monitor checks the distance between the micro anode and the cathode
so as to control movement of the loading platform and adjust the
distance between the micro anode and the cathode into a fixed
value.
[0015] In a continuous micro anode guided electroplating device and
a method thereof of the present invention, the micro anode is
firstly set above the cathode and an electrolyte is added into the
micro anode. Then apply a bias to the micro anode and the cathode
so that a deposit is generated at the cathode. Next take an image
between the micro anode and the cathode. Finally, check a distance
between the micro anode and the cathode according to the image and
the loading platform is controlled so as to maintain the distance
between the micro anode and the cathode into a fixed value.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein
[0017] FIG. 1 is a schematic drawing showing structure of an
embodiment according to the present invention; and
[0018] FIG. 2 is a flow chart of an embodiment according to the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0019] Refer to FIG. 1, a continuous micro anode guided
electroplating device 1 includes a micro anode 1, a loading
platform 12, a cathode 14, a power supply 16 and a monitor 18. The
micro anode 10 consists of a micro/nanoscale capillary 101 and a
conductor 103. The conductor 103 is made from platinum and is
disposed inside the capillary 101 that is filled with an
electrolyte (electroplating solution) 2. The loading platform 12 is
set under the micro anode 10 and is having a driving device 121
therein. The driving device 121 drives the loading platform 12 to
move. In this embodiment, the driving device 121 is a motor. The
cathode 14 is a workpiece that is put on the loading platform 12
for electroplating. The power supply 16 is composed of an anode and
a cathode. The anode of the power supply 16 is connected to the
micro anode 10 and the cathode of the power supply 16 is connected
to the cathode 14. The power supply 16 supplies a bias to the micro
anode 10 and the cathode 14 so that a deposit is generated at the
cathode 14. The monitor 18 consists of an image capture device 181
and a controller 183. In this embodiment, the image capture device
181 is a CCD (Charge-coupled Device). The image capture device 181
takes an image between the micro anode 10 and the cathode 14 and
sends the image back to the controller 183. Then the controller 183
performs binary image processing so as to check and calculate the
distance between the micro anode 10 and the cathode 14. The
distance between the micro anode 10 and the cathode 14 must be
maintained at a fixed value. Thus the controller 183 controls the
movement of the loading platform 12 according to the distance
between the micro anode 10 and the cathode 14 calculated by means
of the image so as to adjust and maintain the distance between
micro anode 10 and the cathode 14 at a fixed value. The controller
183 is a computer.
[0020] Refer to FIG. 2, a flow chart of an embodiment is revealed.
As shown in figure, a continuous micro anode guided electroplating
is performed by the device mentioned above. At first, take the step
S10, disposed the micro anode 10 above the cathode 14 and the micro
anode 10 is slowly close to the cathode 14. Then run the step S12,
add an electrolyte 2 into a micro/nanoscale capillary 101 of the
micro anode 10 and the electrolyte 2 forms a semicircular drop on
an opening of the capillary 101. When the micro anode 10 is getting
close to the cathode 14, the semicircular drop contacts with the
surface of the cathode 14 in a semilunar form (a great C-shaped)
due to surface tension.
[0021] Next refer to the step S14, apply a bias to the micro anode
10 and the cathode 14. Then take the step S16, metal ions in the
electrolyte 2 of the micro anode 10 are deposited at the cathode 14
to grow into a deposit on the surface of the cathode 14. While the
deposit is growing, run the step S18, take an image between the
micro anode 10 and the cathode 14 by the image capture device 181
of the monitor 18 and the image is sent to the controller 183 of
the monitor 18 by the image capture device 181. Later take the step
S19, estimate a distance between the micro anode 10 and the cathode
14 by the controller 183 according to the image because the
distance between the micro anode 10 and the cathode 14 must be
maintained at a fixed value. The fixed distance ranges from 10 mm
(micrometer) to 20 mm. Thus the controller 183 calculates the
distance between the micro anode 10 and the cathode 14 according to
the image and controls the movement of the loading platform 12.
[0022] At last, repeat the step S10 to the step S19 mentioned above
until the deposit grows into a preset shape and structure. By the
real-time image monitoring and capillary action of the
micro/nanoscale tube, a three-dimensional microstructure is
deposited on the workpiece at the cathode. The deposit is growing
smoothly under the real-time image monitoring.
[0023] In summary, a micro anode guided electroplating device and a
method thereof of the present invention reduce contaminations of
the workpiece because the workpiece is not immersed in the
electrolyte. The micro anode guided electroplating device and the
method thereof combines real-time image monitoring with capillary
action of the micro/nanoscale tube. A three-dimensional
microstructure is deposited on the workpiece at the cathode. The
deposit is growing smoothly under the real-time image monitoring.
Moreover, an electric field strength of the micro anode of the
present invention is controlled so that an electric field strength
between the micro anode and the cathode remains stable. Thus the
deposit is with a smooth and uniform surface. Furthermore, by a
monitor, the distance between the micro anode and the cathode is
monitored and the loading platform carrying the cathode is
controlled so as to maintain the distance between the micro anode
and the cathode at a fixed value and prevent defects in the
deposit.
[0024] Additional advantages and modifications will readily occur
to those skilled in the art. Therefore, the invention in its
broader aspects is not limited to the specific details, and
representative devices shown and described herein. Accordingly,
various modifications may be made without departing from the spirit
or scope of the general inventive concept as defined by the
appended claims and their equivalents.
* * * * *