U.S. patent application number 13/215243 was filed with the patent office on 2012-11-08 for heat dissipation device.
This patent application is currently assigned to FOXCONN TECHNOLOGY CO., LTD.. Invention is credited to WEI-HANG HSU.
Application Number | 20120279696 13/215243 |
Document ID | / |
Family ID | 47089455 |
Filed Date | 2012-11-08 |
United States Patent
Application |
20120279696 |
Kind Code |
A1 |
HSU; WEI-HANG |
November 8, 2012 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes a plurality of fins connected
to each other. Each fin includes a plate and a pair of flanges
extending from the plate. Each flange includes a first section
extending perpendicularly away from the plate, a third section
extending perpendicularly towards the plate and a second section
interconnecting the first section and the third section. The first
section is parallel to the third section and the second section is
parallel to the plate. Three channels are defined by the first
flange, the second flange and the plate for allowing airflow to
flow through the fins.
Inventors: |
HSU; WEI-HANG; (Tu-Cheng,
TW) |
Assignee: |
FOXCONN TECHNOLOGY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
47089455 |
Appl. No.: |
13/215243 |
Filed: |
August 23, 2011 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
F28F 2215/10 20130101;
F28F 2240/00 20130101; F28F 7/00 20130101; F28D 2021/0029 20130101;
F28F 2275/04 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 6, 2011 |
TW |
100115876 |
Claims
1. A heat dissipation device comprising: a plurality of fins, each
of the fins comprising: a plate; and a first flange comprising a
first section extending from the plate along a direction away from
the plate, a third section extending along a direction towards the
plate, and a second section interconnecting the first section and
the second section, the first section, the second section and the
third section are non-coplanar with each other.
2. The heat dissipation device of claim 1, wherein the first
section is perpendicular to the plate.
3. The heat dissipation device of claim 2, wherein the second
section is parallel to the plate.
4. The heat dissipation device of claim 2, wherein the third
section is parallel to the first section.
5. The heat dissipation device of claim 1, wherein the each of the
fins further comprises a second flange extending from the plate,
the second flange comprising a first section extending away from
the plate, a third section extending towards the plate and a second
section interconnecting the first section and the second
section.
6. The heat dissipation device of claim 5, wherein the first
section of the second flange is parallel to the first section of
the first flange, the second section of the second flange is
parallel to the second section of the first flange, and the third
section of the second flange is parallel to the third section of
the first flange.
7. The heat dissipation device of claim 5, wherein the first flange
is extended from a top side of the plate, and the second flange is
extended from a bottom side of the plate.
8. The heat dissipation device of claim 7, wherein the first flange
and the plate enclose a first channel, the second flange and the
plate enclose a second channel, and the third sections of the first
flange and the second flange and the plate cooperatively define a
third channel.
9. The heat dissipation device of claim 8, wherein the third
channel is located between the first channel and the second
channel.
10. The heat dissipation device of claim 8, wherein the second
channel has a length more than that of the first channel.
11. The heat dissipation device of claim 8, wherein the second
channel has a width more than that of the first channel.
12. The heat dissipation device of claim 8, wherein the third
sections of the first flange and the second flange are directly
connected to the plate so that the first channel, the second
channel and the third channel are separated from each other along
the length thereof.
13. The heat dissipation device of claim 8, wherein the third
sections of the first flange, the second flange are spaced gaps
from the plate so that the first channel, the second channel and
the third channel communicate with each other along length
thereof.
14. The heat dissipation device of claim 8, wherein the first
channel and the second channel are terminated within a periphery
range of the plate so that airflow flowing out of the first channel
and the second channel disturb with airflow flowing through the
third channel at a place within the periphery range of the
plate.
15. The heat dissipation device of claim 14, wherein the first
channel and the second channel have first openings flush with a
lateral side of the plate, and second openings spaced intervals
from an opposite lateral side of the plate.
16. The heat dissipation device of claim 1, wherein each of the
fins further comprises a second flange and a third flange, the
second flange and the third flange are respectively located at a
top side and a bottom side of the plate and the first flange is
located at a middle of the plate.
17. The heat dissipation device of claim 16, wherein each of the
second flange and the third flange comprises a first section
parallel to the first section of the first flange.
18. The heat dissipation device of claim 17, wherein the first
sections of the first flange and the second flange and the plate
cooperatively define a first channel, the first section of the
third flange and the third section of the first flange and the
plate cooperatively define a second channel, and the first flange
and the plate cooperatively enclose a third channel.
19. The heat dissipation device of claim 18, wherein first channel,
the second channel and the third channel are separated from each
other along the length thereof.
20. The heat dissipation device of claim 18, wherein the third
channel is located between the first channel and the second
channel.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to heat dissipation devices,
and more particularly, to a heat dissipation device having large
heat dissipation areas.
[0003] 2. Description of Related Art
[0004] Electronic components generate a large amount of heat in
operation thereof. Therefore, heat dissipation, often in a form of
device, is required for the electronic components. As shown in FIG.
1, a typical heat dissipation device 90 includes a plurality of
fins fixed to each other. The fins each have a planar shape with
two flanges locked with that of an adjacent fin. A plurality of
channels are defined between adjacent fins for allowing airflow to
flow through the fins.
[0005] However, the heat dissipation areas of the typical heat
dissipation device 90 are limited, and cannot meet heat dissipation
requirement of high power electronic components.
[0006] What is needed, therefore, is a heat dissipation device
which can overcome the limitations described above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Many aspects of the present disclosure can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present disclosure. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the views.
[0008] FIG. 1 is a side view of a conventional heat dissipation
device.
[0009] FIG. 2 is an isometric view of a heat dissipation device in
accordance with a first embodiment of the present disclosure.
[0010] FIG. 3 is an enlarged view of a fin of the heat dissipation
device of FIG. 2.
[0011] FIG. 4 is a side view of the fin of FIG. 3.
[0012] FIG. 5 is a side view of the heat dissipation device of FIG.
2.
[0013] FIG. 6 is a side view of a fin of a heat dissipation device
in accordance with a second embodiment of the present
disclosure.
[0014] FIG. 7 is a side view of a fin of a heat dissipation device
in accordance with a third embodiment of the present
disclosure.
DETAILED DESCRIPTION
[0015] Referring to FIGS. 2-3, a heat dissipation device 10 in
accordance with a first embodiment of the present disclosure is
shown. The heat dissipation device 10 includes a plurality of fins
20 connected to each other along a lateral direction.
[0016] Also referring to FIGS. 4-5, each fin 20 includes a plate 30
and a pair of flanges 210, 220 extending from two opposite ends of
the plate 30, respectively. The plate 30 is planar and extended
along a vertical direction. The plate 30 has a rectangular shape
with an upper corner being cut away. The plate 30 has a top side
312, a bottom side 313 parallel to the top side 312, a right side
315 interconnecting right ends of the top side 312 and the bottom
side 313, an inclined side 310 extending downwardly from a left end
of the top side 312, and a left side 314 extending upwardly from a
left end of the bottom side 313 and connecting the inclined side
310 at a joint 311. The two flanges 210, 220 are similar to each
other, each including a first section 211, 221 perpendicular to the
plate 30, a second section 212, 222 perpendicular to the first
section 211, 221 and parallel to the plate 30, and a third section
213, 223 perpendicular to the second section 212, 222 and parallel
to the first section 211, 221. The first sections 211, 221 and the
third sections 213, 223 of the upper flange 210 and the lower
flange 220 have the same width. The second section 212 of the upper
flange 210 has a height smaller than the second section 222 of the
lower flange 220. The lengths of the first section 211, the second
section 212 and the third section 213 of the upper flange 210 along
an extending direction of the top side 312 are less than that of
the lower flange 220, respectively. The first section 211 of the
upper flange 210 extends from the top side 312 of the plate 30, the
second section 212 of the upper flange 210 is bended downwardly
from a front end of the first section 211, and the third section
213 of the upper flange 210 is bended inwardly from a bottom end of
the second section 212 and fixed to the plate 30. The first section
221 of the lower flange 220 extends from the bottom side 313 of the
plate 30, the second section 222 of the lower flange 220 is bended
upwardly from a front end of the first section 221, and the third
section 223 of the lower flange 220 is bended horizontally and
inwardly from a top end of the second section 220 and connected to
the plate 30. The two flanges 210, 220 are fixed to the plate 30 by
soldering or other suitable methods. The two flanges 210, 220 and
the plate 30 can also be integrally made from one piece of metal
sheet.
[0017] The upper flange 210 encloses an upper channel 41 together
with the plate 30, the lower flange 220 encloses a lower channel 42
together with the plate 30, and the third sections 213, 223 of the
upper flange 210 and the lower flange 220 define a middle channel
43 together with the plate 30. The upper channel 41 has an inner
size smaller than that of the lower channel 42 so that more airflow
can flow through the lower channel 42. The upper channel 41, the
middle channel 43 and the lower channel 42 provide different
pathways for the airflow flowing through the fins 20. The upper
channel 41 and the lower channel 42 has a right opening flush with
the right side 315 of the plate 30, and a left opening spaced a
distance from the inclined side 310 and the left side 314 of the
plate 30, respectively. That is to say, the upper channel 41 and
the lower channel 42 are terminated within a periphery range of the
plate 30. Therefore, the airflow flowing out of the left openings
of the upper channel 41 and the lower channel 42 can disturb with
the airflow flowing through the middle channel 43 at a left area of
the plate 30, thereby increasing heat exchange with the plate
30.
[0018] FIG. 6 shows a fin 20a of a heat dissipation device in
accordance with a second embodiment of the present disclosure. The
fin 20a includes a plate 30a and a pair of flanges 210a, 220a each
including a first section 211a, 221a, a second section 212a, 222a
and a third section 213a, 223a. The plate 30a of this embodiment
has a configuration same as that of the plate 30 of the first
embodiment, and the flanges 210a, 220a of this embodiment have
configurations same as that of the flanges 210, 220 of the first
embodiment except the third sections 213a, 223a. In this
embodiment, the third sections 213a, 223a of the upper flange 210a
and the lower flange 220a are spaced from the plate 30a, two gaps
are defined between the plate 30a and corresponding distal ends of
the third sections 213a, 223a, so that the upper channel 41a and
the lower channel 42a communicate with the middle channel 43a via
the gaps all over the length thereof. The upper flange 210a and the
lower flange 220a are directly bended from the plate 30a.
[0019] FIG. 7 shows a fin 20b in accordance with a third embodiment
of the present disclosure. Different from the first embodiment and
the second embodiment, the upper flange 210b and the lower flange
220b of this embodiment each only include the first section 211b,
221b, and the plate 30b further forms a middle flange 230b which
includes a first section 231b, a second section 232b and a third
section 233b. The first section 231b and the third section 233b of
the middle flange 230b are perpendicularly connected to the plate
30b, and the second section 232b of the middle flange 230b is
connected to the first section 231b and the third section 233b and
parallel to the plate 30b. The first sections 211b, 231b of the
upper flange 210b and the middle flange 230b and the plate 30b
cooperatively define an upper channel 41b, the middle flange 230b
and the plate 30b cooperatively enclose a middle channel 43b, and
the first section 221b of the lower flange 220b, the third section
233b of the middle flange 230b and the plate 30b cooperatively
define a lower channel 42b. The upper channel 41b, the middle
channel 43b and the lower channel 42b are separated from each other
along the length thereof. The upper flange 210b and the lower
flange 220b are directly bended from the plate 30b, and the middle
flange 230b is fixed to the plate 30b by soldering or other
suitable methods.
[0020] According to the foresaid embodiments, the flanges 210,
210a, 210b of the fins 20, 20a, 20b each have a plurality of parts
non-coplanar with each other. So, the fins 20, 20a, 20b of the heat
dissipation device 10 have large areas by increasing the areas of
the flanges 210, 210a, 210b, 220, 220a, 220b, 230b, whereby the
heat dissipation capacity of the heat dissipation device 10 is
enhanced.
[0021] It is believed that the present embodiments will be
understood from the foregoing description, and it will be apparent
that various changes may be made thereto without departing from the
spirit and scope of the present disclosure or sacrificing all of
its material advantages, the examples hereinbefore described merely
being preferred or exemplary embodiments.
* * * * *