U.S. patent application number 13/278771 was filed with the patent office on 2012-11-01 for multi-media device containing a plurality of image capturing devices.
This patent application is currently assigned to OPENPEAK INC.. Invention is credited to Bharat Vakil.
Application Number | 20120274800 13/278771 |
Document ID | / |
Family ID | 45975916 |
Filed Date | 2012-11-01 |
United States Patent
Application |
20120274800 |
Kind Code |
A1 |
Vakil; Bharat |
November 1, 2012 |
MULTI-MEDIA DEVICE CONTAINING A PLURALITY OF IMAGE CAPTURING
DEVICES
Abstract
A multi-media device and a method for manufacturing the
multi-media device is described herein. The multi-media device
includes a first and second substrate coupled to each other. Both
the first and second substrates have a first side and a second side
opposite to the first side. The multi-media device further includes
a first camera coupled to the first side of the first substrate and
a second camera coupled to the first side of the second substrate.
The first camera includes a first lens housing, which houses one or
more first lenses. The second camera includes a second lens
housing, which houses one or more second lenses. The second
substrate is coupled to the first substrate in a manner such that
the one or more first lenses and the one or more second lenses
receive light from opposite directions.
Inventors: |
Vakil; Bharat; (Coral
Springs, FL) |
Assignee: |
OPENPEAK INC.
Boca Raton
FL
|
Family ID: |
45975916 |
Appl. No.: |
13/278771 |
Filed: |
October 21, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61405271 |
Oct 21, 2010 |
|
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|
Current U.S.
Class: |
348/222.1 ;
29/829; 348/373; 348/E5.025 |
Current CPC
Class: |
H04N 5/2257 20130101;
Y10T 29/49124 20150115; H04N 5/2252 20130101 |
Class at
Publication: |
348/222.1 ;
348/373; 29/829; 348/E05.025 |
International
Class: |
H04N 5/225 20060101
H04N005/225; H05K 3/00 20060101 H05K003/00 |
Claims
1. A multi-media device, comprising: a first substrate having a
first side and a second side opposite to the first side of the
first substrate; a second substrate having a first side and a
second side opposite to the first side of the second substrate,
wherein the second substrate is coupled to the first substrate; a
first camera coupled to the first side of the first substrate, the
first camera comprising a first lens housing, which houses one or
more first lenses; and a second camera coupled to the first side of
the second substrate, comprising a second lens housing, which
houses one or more second lenses; wherein the second substrate is
coupled to the first substrate in a manner such that the one or
more first lenses are configured to receive light from a first
direction and the one or more second lenses are configured to
receive light from a second direction that is opposite to the first
direction.
2. The multi-media device of claim 1, wherein the second substrate
is coupled to the first substrate in a manner such that the second
substrate is laterally positioned with respect to the first
substrate.
3. The multi-media device of claim 1, further comprising: a display
unit, wherein the display unit is located in a space at least
partly defined by the second side of the first substrate and the
second lens housing.
4. The multi-media device of claim 1, wherein the first camera
further comprises: a first image sensor; and an image signal
processor; wherein the first lens housing further houses the first
image sensor and the image signal processor.
5. The multi-media device of claim 4, wherein the first image
sensor and the image signal processor are integrated on a same
silicon substrate.
6. The multi-media device of claim 4, wherein the second camera
further comprises: a second image sensor; wherein the second lens
housing further houses the second image sensor, and wherein the
second image sensor is communicatively coupled to the image signal
processor.
7. The multi-media device of claim 6, wherein the image signal
processor processes images captured by both the first image sensor
and the second image sensor.
8. The multi-media device of claim 4, further comprising: a third
substrate coupled to the first substrate; and a host processor
coupled to the third substrate, wherein the host processor is
communicatively coupled to the image signal processor.
9. The multi-media device of claim 8, further comprising: a first
control interface communicatively coupling the host processor with
the first camera; and a second control interface communicatively
coupling the host processor with the second camera, wherein the
first control interface transmits control signals from the host
processor to the first camera and the second control interface
transmits control signals from the host processor to the second
camera.
10. The multi-media device of claim 8, further comprising: a common
interface, wherein the common interface communicatively couples the
image signal processor to the host processor and the common
interface transmits processed images from the image signal
processor to the host processor.
11. The multi-media device of claim 8, wherein the host processor
further processes images captured by both the first image sensor
and the second image sensor.
12. The multi-media device of claim 8, wherein the third substrate
includes an opening formed to receive at least a portion of the
first lens housing.
13. The multi-media device of claim 1, wherein the first substrate
is coupled to the second substrate using a zero insertion force
connector.
14. The multi-media device of claim 8, wherein the first substrate
is coupled to the third substrate using a board-to-board
connector.
15. A method for manufacturing a multi-media device, comprising:
coupling a first substrate to a second printed circuit, wherein the
first substrate has a first side and a second side opposite to the
first side of the first substrate, and wherein the second substrate
has a first said and a second side opposite to the first side of
the second substrate; coupling a first camera to the first side of
the first substrate, the first camera comprising: a first lens
housing, which houses one or more first lenses; and coupling a
second camera to the first side of the second substrate, the second
camera comprising: a second lens housing, which houses one or more
second lenses; wherein the second substrate is coupled to the first
substrate in a manner such that the one or more first lenses are
configured to receive light from a first direction and the one or
more second lenses are configured to receive light from a second
direction that is opposite to the first direction.
16. The method for manufacturing a multi-media device of claim 15,
wherein the second substrate is coupled to the first substrate in a
manner such that the second substrate is laterally positioned with
respect to the first substrate.
17. The method for manufacturing a multi-media device of claim 15,
wherein the first camera further comprises: a first image sensor;
and an image signal processor; wherein the first lens housing
further houses the first image sensor and the image signal
processor.
18. The method for manufacturing a multi-media device of claim 17,
wherein the first image sensor and the image signal processor are
integrated on a same silicon substrate.
19. The method for manufacturing a multi-media device of claim 17,
wherein the second camera further comprises: a second image sensor,
wherein the second lens housing further houses the second image
sensor.
20. The method for manufacturing a multi-media device of claim 19,
further comprising: communicatively coupling the second image
sensor to the image signal processor.
21. The method for manufacturing a multi-media device of claim 19,
wherein the image signal processor is configured to process images
captured by both the first image sensor and the second image
sensor.
22. The method for manufacturing a multi-media device of claim 17,
further comprising: coupling a third substrate to the first
substrate; and coupling a host processor to the third substrate,
wherein the host processor is communicatively coupled to the image
signal processor.
23. The method for manufacturing a multi-media device of claim 22,
further comprising: positioning a display unit of the multi-media
device in a space at least partly defined by the second side of the
first substrate and the second lens housing; and coupling the
display unit of the multi-media device to the third substrate.
24. The method for manufacturing a multi-media device of claim 22,
further comprising: communicatively coupling the host processor to
the first camera via a first control interface; and communicatively
coupling the host processor to the second camera via a second
control interface, wherein the first control interface is
configured to transmit control signals from the host processor to
the first camera and the second control interface is configured to
transmit control signals from the host processor to the second
camera.
25. The method for manufacturing a multi-media device of claim 22,
further comprising: communicatively coupling the image signal
processor to the host processor via a common interface, wherein the
common interface is configured to transmit processed images from
the image signal processor to the host processor.
26. The method for manufacturing a multi-media device of claim 22,
wherein the host processor further is configured to process images
captured by both the first image sensor and the second image
sensor.
27. The method for manufacturing a multi-media device of claim 22,
further comprising: forming an opening in the third substrate,
wherein the opening is adapted to receive at least a portion of the
first lens housing.
28. The method for manufacturing a multi-media device of claim 15,
wherein the first substrate is coupled to the second substrate
using a zero insertion force connector.
29. The method for manufacturing a multi-media device of claim 22,
wherein the first substrate is coupled to the third substrate using
a board-to-board connector.
30. A mobile device, comprising: a front-facing camera, wherein the
front-facing camera faces a first direction; a rear-facing camera,
wherein the rear-facing camera faces a second direction that is
substantially opposite to the first direction; a host processor;
and an image signal processor that is communicatively coupled to
the host processor, wherein the image signal processor processes
images captured by both the front-facing camera and the rear-facing
camera.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional Patent
Application No. 61/405,271, filed Oct. 21, 2010, the entirety of
which is incorporated by reference herein.
BACKGROUND
[0002] 1. Field
[0003] The present subject matter generally relates to multi-media
devices. In particular, the present subject matter relates to
multi-media devices that contain a plurality of image capturing
devices.
[0004] 2. BACKGROUND
[0005] Manufacturers of multi-media devices are constantly faced
with the task of providing more and more features for their
products while limiting the footprint and expense of such
enhancements. In addition to spatial limitations and cost concerns,
engineers must consider the negative effects on battery life and
processing burdens that these new features may bring. One
particular application for these devices that has garnered recent
attention is video calling capability. Many carriers have asked
device manufacturers to incorporate this technology into the
products that the carriers offer without significantly affecting
the quality of pre-existing applications, battery life, processing
capability and cost. As such, there is a need to develop solutions
that enable the implementation of this feature without introducing
the issues described above.
BRIEF SUMMARY
[0006] Various approaches are described herein for, among other
things, incorporating multiple image processing devices into a
multi-media device while adhering to fiscal, spatial and power
restraints. For example, two cameras may be arranged in such a
manner that each camera is facing an opposite direction. The two
cameras may be positioned laterally with respect to another in
order to define, at least in part, a space in which to position a
display or some other component of the multi-media device. In
addition, a single image signal processor may be used to process
images from both cameras. By implementing the various approaches
described above and herein, the cost of manufacturing the
multi-media device, the size of the multi-media device, and the
power consumed by the multi-media device may be reduced.
[0007] For example, a multi-media device is described herein. The
multi-media device includes a first substrate that is coupled to a
second substrate. The first substrate has a first side and a second
side opposite to the first side of the first substrate. The second
substrate has a first side and a second side opposite to the first
side of the second substrate. The multi-media device further
includes a first camera coupled to the first side of the first
substrate and a second camera coupled to the first side of the
second substrate. The first camera includes a first lens housing,
which houses one or more first lenses. The second camera includes a
second lens housing, which houses one or more second lenses. The
second substrate is coupled to the first substrate in a manner such
that the one or more first lenses are configured to receive light
generally from a first direction and the one or more second lenses
are configured to receive light generally from a second direction
that is opposite to the first direction.
[0008] A method for manufacturing the multi-media device is also
described herein. The method includes coupling a first substrate to
a second substrate. The first substrate has a first side and a
second side opposite to the first side of the first substrate. The
second substrate has a first side and a second side opposite to the
first side of the second substrate. The method also includes
coupling a first camera to the first side of the first substrate.
The method further includes coupling a second camera to the first
side of the second substrate. The first camera includes a first
lens housing, which houses one or more first lenses. The second
camera includes a second lens housing, which houses one or more
second lenses. The first substrate is coupled to the second
substrate in a manner such that the one or more first lenses are
configured to receive light generally from a first direction and
the one or more second lenses are configured to receive light
generally from a second direction that is opposite to the first
direction.
[0009] A mobile device is also described herein. The mobile device
includes a front-facing camera that faces a first direction and a
second camera that faces a second direction that is substantially
opposite to the first direction. The mobile device also includes a
host processor and an image signal processor that is
communicatively coupled to the host processor. The image signal
processor processes images captured by both the front-facing camera
and the rear-facing camera.
[0010] Further features and advantages of the disclosed
technologies, as well as the structure and operation of various
embodiments, are described in detail below with reference to the
accompanying drawings. It is noted that the invention is not
limited to the specific embodiments described herein. Such
embodiments are presented herein for illustrative purposes only.
Additional embodiments will be apparent to persons skilled in the
relevant art(s) based on the teachings contained herein.
BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES
[0011] The accompanying drawings, which are incorporated herein and
form part of the specification, illustrate embodiments and,
together with the description, further serve to explain the
principles involved and to enable a person skilled in the relevant
art(s) to make and use the disclosed technologies.
[0012] FIG. 1 is an exploded perspective view of a first camera
module in accordance with one embodiment.
[0013] FIG. 2 is an exploded perspective view of a second camera
module in accordance with one embodiment.
[0014] FIG. 3 is a perspective top view of a coupled first camera
module and a second camera module in accordance with one
embodiment.
[0015] FIG. 4 is a perspective bottom view of a coupled first and
second camera module in accordance with one embodiment.
[0016] FIG. 5A is an exploded perspective view of a display unit, a
coupled first and second camera module and a substrate of a
multi-media device in accordance with one embodiment.
[0017] FIG. 5B is a perspective top view of a display unit and a
coupled first and second camera module coupled to a substrate of a
multi-media device in accordance with one embodiment.
[0018] FIG. 6 is a perspective bottom view of a substrate of a
multi-media device in accordance with one embodiment.
[0019] FIG. 7 is a block diagram illustrating several components of
a multi-media device in accordance with one embodiment.
[0020] FIG. 8A depicts a flowchart of a method for assembling a
coupled first and second camera module in accordance with one
embodiment.
[0021] FIG. 8B depicts a flowchart of a method for coupling a
coupled first and second camera module to a substrate of a
multi-media device in accordance with one embodiment.
[0022] FIG. 8C depicts a flowchart of a method for coupling a
display unit of a multi-media device to a substrate of a
multi-media device in accordance with one embodiment.
[0023] FIG. 9 is a front view of a multi-media device in accordance
with one embodiment.
[0024] FIG. 10 is a rear view of a multi-media device in accordance
with one embodiment.
[0025] The features and advantages of the disclosed technologies
will become more apparent from the detailed description set forth
below when taken in conjunction with the drawings, in which like
reference characters identify corresponding elements throughout. In
the drawings, like reference numbers generally indicate identical,
functionally similar, and/or structurally similar elements. The
drawing in which an element first appears is indicated by the
leftmost digit(s) in the corresponding reference number.
DETAILED DESCRIPTION
I. Introduction
[0026] The following detailed description refers to the
accompanying drawings that illustrate exemplary embodiments.
However, the scope of the subject matter described herein is not
limited to these embodiments, but is instead defined by the
appended claims. Thus, embodiments beyond those shown in the
accompanying drawings, such as modified versions of the illustrated
embodiments, may nevertheless be encompassed by the claims.
[0027] References in the specification to "one embodiment," "an
embodiment," "an example embodiment," or the like, indicate that
the embodiment described may include a particular feature,
structure, or characteristic, but every embodiment may not
necessarily include the particular feature, structure, or
characteristic. Moreover, such phrases are not necessarily
referring to the same embodiment. Furthermore, when a particular
feature, structure, or characteristic is described in connection
with an embodiment, it is submitted that it is within the knowledge
of one skilled in the art to implement such feature, structure, or
characteristic in connection with other embodiments whether or not
explicitly described.
[0028] Several definitions that apply throughout this document will
now be presented. A "multi-media device" is defined as an
electronic device that is capable of generating, displaying and/or
broadcasting any combination of sensory-stimulating content, such
as text, audio, still images, moving images, animation and
interactivity. A "camera" is defined as a device that is capable of
capturing one or more images when activated. The term "still image
camera" means a camera that is designed to capture a single image
at a time when activated. A "moving images camera" is defined as a
camera that is designed to capture a plurality of images over a
period of time when activated. An "image signal processor" is
defined as one or more components that are configured to supplement
a host processor by at least processing any number of images
captured by a camera. The term "host processor" is defined as one
or more components that are configured to be the primary element
for coordinating and executing the functions of a multimedia
device. An "image" is defined as a representation of one or more
objects that have been reduced to a form that can be processed by a
machine. A "display" is an interface that is capable of presenting
images in a form that is viewable by a human. A "housing" is a
physical structure that at least partially encloses and/or provides
support for one or more components. The term "video call" is
defined as a communication between at least two points in which at
least a portion of the communication involves the transmission or
transfer of a plurality of images. The term "substrate" is defined
as a physical material upon which a semiconductor device (e.g., an
integrated circuit) is applied. An example of a substrate may be a
printed circuit board, or any other support structure known in the
art used to support semiconductor devices and hereinafter developed
for performing functions of a printed circuit board. The term
"printed circuit board" is defined as a board used to mechanically
support and electrically connect electronic components using
conductive pathways, tracks or signal traces etched from sheets of
conductive material (e.g., copper) laminated onto a non-conductive
substrate (e.g., plastic, fiberglass, or any other dielectric
suitable to serve as a non-conductive substrate for a printed
circuit board).
[0029] As noted earlier, manufacturers of consumer-oriented devices
are faced with the difficult task of incorporating additional
features into multi-media devices while adhering to fiscal, spatial
and power restraints. Embodiments of the present invention
described herein seek to address this issue by providing additional
camera functionality without significantly affecting the existing
performance or expense of a multi-media device.
[0030] In one embodiment, two cameras may be arranged in such a
manner that each camera is facing a substantially opposite
direction. The two cameras may be positioned laterally with respect
to another in order to define, at least in part, a space in which
to position a display or some other component of the multi-media
device. In addition, a single image signal processor may be used to
process images from both cameras. By implementing the various
approaches described above and herein, the cost of manufacturing
the multi-media device, the size of the multi-media device, and the
power consumed by the multi-media device may be reduced.
II. Example Embodiments
[0031] FIG. 1 is an exploded perspective view of a first camera
module 100 in accordance with one embodiment. As shown in FIG. 1,
first camera module 100 includes a camera 102 and a substrate 104.
Camera 102 includes a lens barrel 105, one or more lenses 106, a
lens housing 108, an image sensor 110, and an image signal
processor 112. Lens barrel 105 is configured to house one or more
lenses 106. Lens housing 108 is formed to receive and house lens
barrel 105. Lens(es) 106 are configured to receive light from a
light source via an opening 118 of lens barrel 105. Image sensor
110 is configured to detect light transmitted through lens(es) 106
and convert the detected light into an electrical signal that
represents an image. The electrical signal is transmitted to image
signal processor 112. Using various algorithms, image signal
processor 112 processes the image received from image sensor 110.
The term "processes images" or "processing the image" is defined as
one or more actions that are employed to modify or alter data
contained in an image.
[0032] Image signal processor 112 can process the captured images
in accordance with any suitable image processing algorithm. For
example, image signal processor 112 can process raw data that
represents the captured images into a suitable file format, like
Y'UV, YUV, YCbCr, YPbPr or any other file format. As another
example, image signal processor 112 can perform automatic exposure
control (AEC), automatic gain control (AGC) or automatic white
balance (AWB) and can resize images as needed. As an option, image
signal processor 112 can be configured to compress the images into
a suitable format by employing any available compression standard,
such as JPEG or MPEG and their associated variants. As will be
described below, it is not necessary that image signal processor
112 perform all these techniques, as some of them may not be
necessary or may even be executed by a host processor (e.g., host
processor 512 shown in FIG. 5A).
[0033] In an example embodiment, image sensor 110 and image signal
processor 112 may be integrated together as part of a
system-on-a-chip (SoC). Accordingly, image sensor 110 and image
signal processor 112 may be situated on the same silicon substrate.
In another example embodiment, image sensor 110 and image signal
processor 112 may be located on separate chips. Accordingly, image
sensor 110 and image signal processor 112 may be situated on
different silicon substrates.
[0034] In accordance with one embodiment, first camera 102 may be a
fixed focus camera. In accordance with another embodiment, first
camera 102 may an autofocus camera. In accordance with this
embodiment, lens housing 108 may comprise a voice coil motor (VCM),
which includes a coil 114 and one or more magnets (not shown). As
is known in the art, a VCM acts as an actuator that moves lens(es)
106 along an optical axis direction 116 by virtue of an interaction
between a magnetic field generated by a current flowing through
coil 114 and the magnetic field of the one or more magnets. The
interaction between the magnetic field generated by the current
flowing through coil 114 and the magnetic field of the one or more
magnets generate a rotational force. The rotational force acts as a
driving force to rotate lens barrel 105, which houses lens(es) 106,
along optical axis 116. Lens barrel 105 is rotated until an
appropriate focal length of the camera is reached.
[0035] In accordance with another embodiment, first camera 102 may
be a moving images camera, which can be used for example to conduct
video calls. In accordance with another implementation, first
camera 102 may be a still image camera.
[0036] Substrate 104 has a top side 120 and a bottom side 404 (as
shown in FIG. 4). Image sensor 110 and image signal processor 112
may be directly mounted mechanically and electrically to top side
120. Image sensor 110 and image signal processor 112 may be mounted
mechanically and electrically to top side 120 using any of a
variety of surface mounting techniques known in the art (e.g.,
flip-chip, wire bonding, ball bonding, chip bonding, and/or the
like). As shown in FIG. 3, lens housing 108 is also configured to
be directly mounted mechanically and/or electrically to top side
120. Lens housing 108 may be mounted to top side 120 in a manner
such that lens housing 108 covers image sensor 110 and image signal
processor 112. Accordingly, lens housing 108 may also house image
sensor 110 and image signal processor 112 along with lens barrel
105 and lens(es) 106.
[0037] As further shown in FIG. 1, top side 120 of substrate 104
includes a first connector 124 and a second connector 126. First
connector 124 and second connector 126 are communicatively coupled
to first camera 102 (in particular, to image sensor 110 and image
signal processor 112 of first camera 102) via an
electrically-conductive material (not shown). The
electrically-conductive material may include, but is not limited to
trace lines, wire bond pads, solder pads, and/or the like. First
connector 124 is configured to electrically and mechanically
connect substrate 104 to another substrate (e.g., substrate 502
shown in FIGS. 5A, 5B and 6). As will be described below, first
camera 102 receives signals from and transmits signals to a host
processor (e.g., host processor 512 shown in FIG. 5A), which is
coupled to another substrate, via first connector 124. In one
embodiment, first camera 102 may receive signals from and transmit
signals to a host processor via a first control interface (e.g.,
first control interface 714 shown in FIG. 7).
[0038] In one embodiment, first connector 124 is a board-to-board
connector. While first connector 124 is shown to be a female
connector (and therefore configured to connect to a corresponding
male connector), it is noted that first connector 124 may be a male
connector, which is configured to connect to a corresponding female
connector, or some other connector type.
[0039] Second connector 126 is configured to electrically and
mechanically connect substrate 104 to another substrate (e.g.,
substrate 204 shown in FIGS. 2-4). As will be described below,
image signal processor 112 receives signals from and transmits
signals to a second camera (e.g., second camera 202 shown in FIG.
2) via second connector 126, and the second camera 202 is coupled
to another substrate.
[0040] In one embodiment, second connector 126 is a zero insertion
force (ZIF) wire-to-board connector. In accordance with this
embodiment, second connector 126 is configured to receive the bare
ends of wires that are pre-stripped and formed into a ribbon cable
(e.g., a flexible flat cable). While second connector 126 is shown
to be a ZIF wire-to-board connector, it is noted that second
connector 126 may be replaced with a ribbon cable, which is
configured to connect to a ZIF wire-to-board connector located on
another substrate. Still other implementations of second connector
126 may be used.
[0041] FIG. 2 is an exploded perspective view of a second camera
module 200 in accordance with one embodiment of the present
invention. As shown in FIG. 2, second camera module 200 includes
second camera 202 and substrate 204. Second camera 202 includes a
lens barrel 205, one or more lenses 206, a lens housing 208, and an
image sensor 210. Lens barrel 205 is configured to house lens(es)
206. Lens housing 208 is formed to receive and house lens barrel
205. Lens(es) 206 are configured to receive light from a light
source via an opening 218 of lens barrel 205. Image sensor 210 is
configured to detect light transmitted through lens(es) 206 and
convert the detected light to an electrical signal that represents
an image. The electrical signal is transmitted to image signal
processor 112 (as shown in FIG. 1) for processing. Accordingly,
image signal processor 112 is configured to process images captured
from both first camera 102 and second camera 202. As will be
described below, the electrical signal may be transmitted to image
signal processor 112 via a connector 214.
[0042] In accordance with one embodiment, second camera 202 may be
a fixed focus camera. In accordance with another embodiment, second
camera 202 may be an autofocus camera. In accordance with yet
another embodiment, second camera 202 may be a moving images
camera, which can be used for example to conduct video calls. In
accordance with yet a further embodiment, second camera 202 may be
a still image camera.
[0043] Substrate 204 has a top side 212 and bottom side 302 (as
shown in FIG. 3). Image sensor 210 may be directly mounted
mechanically and electrically to top side 212. Image sensor 210 may
be mounted mechanically and electrically to top side 212 via any of
a variety of surface mounting techniques known in the art (e.g.,
flip-chip, wire bonding, ball bonding, chip bonding, and/or the
like). As shown in FIG. 4, lens housing 208 is also configured to
be directly mounted mechanically and/or electrically to top side
212. Lens housing 208 may be mounted to top side 212 in a manner
such that lens housing 208 covers image sensor 210. Accordingly,
lens housing 208 may also house image sensor 210 along with lens
barrel 205 and lens(es) 206.
[0044] As best shown in FIG. 2, top side 212 of substrate 204
includes connector 214. Connector 214 is communicatively coupled to
second camera 202 (in particular, to image sensor 210 of second
camera 202) via an electrically-conductive material (not shown).
The electrically-conductive material may include, but is not
limited to, trace lines, wire bond pads, solder pads, and/or the
like. Connector 214 is also configured to electrically and
mechanically connect substrate 204 to another substrate (e.g.,
substrate 104 shown in FIGS. 1, 3 and 4). As will be described
below, upon coupling substrate 204 to substrate 104, second camera
202 is configured to receive signals from and transmit signals to a
host processor (e.g., host processor 512 shown in FIG. 5A), which
is coupled to another substrate, via first connector 124 of
substrate 104 (as shown in FIG. 1). In one embodiment, second
camera 202 may receive signals from and transmit signals to a host
processor via a second control interface (e.g., second control
interface 710 shown in FIG. 7).
[0045] In addition, second camera 202 is also able to receive
signals from and transmit signals to image signal processor 112 (as
shown in FIG. 1) located on substrate 104 via connector 214.
[0046] In one embodiment, connector 214 is a ribbon wire (e.g., a
flexible flat cable). In accordance with this embodiment, the
ribbon wire is configured to be coupled to a ZIF wire-to-board
connector located on another substrate. While connector 214 is
shown to be a ribbon cable, it is noted that connector 214 may be
replaced with a ZIF wire-to-board connector, which is configured to
receive a ribbon cable coupled to another substrate. Still other
implementations of connector 214 may be used. First camera module
100 is now shown
[0047] FIG. 3 is a perspective top view 300 of a coupled first
camera module 100 (the components of which are encompassed by the
smaller dashed enclosure shown in FIG. 3) and a second camera
module 200 (the components of which are encompassed by the larger
dashed enclosure shown in FIG. 3) in accordance with one embodiment
of the present invention. First camera module 100 is
communicatively coupled to second camera module 200 via second
connector 126 located on top side 120 of substrate 104 and
connector 214 located on top side 212 of substrate 204. In the
embodiment depicted in FIG. 3, second connector 126 is a ZIF
wire-to-board connector, and connector 214 is a flexible flat
cable. By using a flexible flat cable, the position of second
camera module 200 with respect to first camera 100 may be easily
adjusted during the manufacturing stages of a multi-media device
housing first camera module 100 and second camera module 200. It is
noted that in accordance with other embodiments of the invention,
substrate 104 may be coupled to substrate 204 using other types of
connectors that are known in the art without departing from the
spirit and scope of the present invention.
[0048] As shown in FIG. 3, second camera module 200 is
communicatively coupled to first camera module 100 in a manner such
that second camera module 200 is laterally positioned with respect
to the first camera module 100. As further shown in FIG. 3, second
camera module 200 is inverted with respect to first camera module
100 such that top side 120 of substrate 104 is aligned with bottom
side 302 of substrate 204 along the same plane. Accordingly, first
camera 102 and second camera 202 are facing in substantially
opposite directions. As a result, lens(es) 106 of first camera 102
are configured to generally receive light from a first direction,
while lens(es) 206 of second camera 202 are configured to generally
receive light from a second direction that is opposite to the first
direction.
[0049] In accordance with one embodiment, first camera 102 is a
rear-facing camera of the multi-media device, and second camera 202
is a front-facing camera of the multi-media device. In accordance
with another embodiment, first camera 102 is a front-facing camera
of the multi-media device, and second camera 202 is a rear-facing
camera of a multi-media device.
[0050] With continued reference to FIG. 3, lens housing 108 is
coupled to top side 120 of substrate 104. As previously stated,
lens housing 108 houses lens barrel 105, which houses lens(es) 106
(shown in FIG. 1). Lens housing 108 also houses image sensor 110
(shown in FIG. 1) and image signal processor 112 (shown in FIG.
1).
[0051] FIG. 4 is a perspective bottom view 400 of the coupled first
camera module 100 and second camera module 200 in accordance with
one embodiment of the present invention. As shown in FIG. 4, second
camera module 100 is communicatively coupled to first camera module
200 in a manner such that second camera module 200 board is
laterally positioned with respect to first camera module 100. As
further shown, first camera module 100 is inverted with respect to
second camera module 200 such that top side 212 of substrate 204 is
aligned with bottom side 404 of substrate 104 along the same plane.
Accordingly, first camera 102 and second camera 202 are facing in
substantially opposite directions. As a result, lens(es) 106 of
first camera 102 are configured to receive light from a first
direction, while lens(es) 206 of second camera 202 are configured
to receive light from a second direction that is opposite to the
first direction.
[0052] With continued reference to FIG. 4, lens housing 208 is
coupled to top side 212 of substrate 204. As previously stated,
lens housing 208 houses lens barrel 205 (shown in FIG. 2), which
houses lens(es) 206 (shown in FIG. 2). Lens housing 208 also houses
image sensor 210 (shown in FIG. 2).
[0053] As previously mentioned, in accordance with one embodiment,
first camera 102 is a rear-facing camera of the multi-media device,
and second camera 202 is a front-facing camera of the multi-media
device. In accordance with this embodiment, bottom side 404 of
substrate 102 and second camera 202 (in particular, lens housing
208 of second camera 202) may at least partly define a space in
which a display unit of a multi-media device may be located. This
is further shown in FIG. 5B, which will be described below.
[0054] FIG. 5A is an exploded perspective view 500A of a display
unit 502, the coupled first camera module 100 and second camera
module 200, and a substrate 504 of a multi-media device in
accordance with one embodiment. Substrate 504 has a top side 505
and a bottom side 602 (shown in FIG. 6). Substrate 504 also
includes an opening 506, a first connector 508, a second connector
510, and a host processor 512. As shown in FIG. 5A, opening 506 is
formed to receive at least a portion of first camera 102. In
particular, opening 506 is formed to be substantially square-shaped
in order to receive the cube-shaped lens housing 108 of first
camera 102. It is noted that while opening 506 is shown to be
substantially square-shaped, opening 506 may be formed to
correspond to any shape that is suitable to receive a
similarly-shaped lens housing of a camera. For example, if the lens
housing of a camera is circular, then opening 506 may be formed to
be a substantially circular shape. If the lens housing of a camera
is rectangular, then opening 506 may be formed to be a
substantially rectangular shape. By providing opening 506 to
receive at least a portion a camera, the thickness of the
multi-media device that houses substrate 504, the coupled first
camera module 100 and second camera module 200, and display unit
502 may be advantageously reduced.
[0055] Display unit 502 may be a liquid crystal display (LCD),
light-emitting diode (LED) display, an active matrix organic LED
(AMOLED) display, or the like. In accordance with certain
embodiments, display unit 502 may be a touch screen capable of
sensing input from an object, such as a finger or stylus, which
touches the touch screen or is positioned above the touch screen.
In accordance with this embodiment, display unit 502 may be based
on any suitable type of technology that can be used for sensing
input. For example, display unit 502 may use resistance,
capacitance, surface acoustic waves, infrared, strain gauges,
optical imaging, dispersive signals or acoustic pulse recognition
for sensing input. It should also be noted that one or more
components other than the display unit 502 can be positioned in
this arrangement, such as a speaker, an antenna or a processor.
[0056] First connector 508 is attached to top side 505 of substrate
504 and is configured to be coupled with first connector 124 of
substrate 104. Accordingly, when coupled (as shown in FIG. 5B),
substrate 104 is electrically and mechanically coupled to substrate
504.
[0057] In one embodiment, first connector 508 is a board-to-board
connector. While first connector 508 is shown to be a male
connector (and therefore configured to connect to a corresponding
female connector (e.g., first connector 124)), it is noted that
first connector 508 may be a male connector, which is configured to
connect to a corresponding female connector. It is noted that in
accordance with other embodiments, substrate 104 may be coupled to
substrate 504 using other types of mechanical and electrical
connectors that are known in the art.
[0058] Second connector 510 is attached to top side 505 of
substrate 504 and is configured to be coupled to display connector
518, which is attached to display unit 502. In the embodiment shown
in FIG. 5A, second connector 510 is a ZIF wire-to-board connector,
and display connector 518 is a ribbon cable (e.g., a flexible flat
cable). While second connector 510 is shown to be a ZIF
wire-to-board connector, it is noted that second connector 510 may
be replaced with a ribbon cable that is attached to substrate 504,
which is configured to connect to a ZIF wire-to-board connector
located on display unit 502. It is further noted that in accordance
with other embodiments, display unit 502 may be coupled to
substrate 504 using other types of connectors that are known in the
art.
[0059] With continued reference to FIG. 5A, host processor 512 is
electrically and mechanically mounted to top side 505 of substrate
504. Host processor 512 may be electrically and mechanically
mounted to top side 505 using any of a variety of surface mounting
techniques known in the art (e.g., flip-chip, wire bonding, ball
bonding, chip bonding, and/or the like). Host processor 512 is also
communicatively coupled to first connector 508 and second connector
510 via an electrically-conductive material (not shown). The
electrically-conductive material may include, but is not limited to
trace lines, wire bond pads, solder pads, and/or the like.
[0060] Host processor 512 is configured to control and manage many
of the primary functions of the multi-media device, which houses
substrate 504, the coupled first camera module 100 and second
camera module 200, display unit 502 and host processor 512. Host
processor 512 may be configured to further process the images
processed by image signal processor 112 (shown in FIG. 1). As
previously mentioned, image signal processor 112 may process images
received from first camera 102 and/or second camera 202. In one
embodiment, image signal processor 112 may transmit the images it
processes to host processor 512 via a common interface (e.g.,
common interface 712 shown in FIG. 7).
[0061] Host processor 512 may further be configured to receive user
input and translate those inputs into signals for first camera 102
and/or second camera 202. The signals may be used to perform a
variety of different operations, including, but not limited to,
activation of first camera 102 and/or second camera 202, image
capture, autofocus, picture resolution configuration, and other
operations that configure parameters and settings that may affect a
picture.
[0062] When activating the autofocus of a camera (e.g., first
camera 102), host processor 512 may generate a signal that causes a
current to pass through coil 114 (shown in FIG. 1) of first camera
102. As previously mentioned, the current flowing through coil 114
will then generate a magnetic field. The magnetic field generated
by the current flowing through coil 114 interacts with a magnetic
field of one or more magnets (not shown) in lens housing 108 to
generate a rotational force. The rotational force acts as a driving
force to rotate lens barrel 105 (shown in FIG. 1) along an optical
axis 116 (shown in FIG. 1). Lens barrel 105 is rotated until an
appropriate focal length of first camera 102 is reached.
[0063] FIG. 5B is a perspective top view 500B of display unit 502
and the coupled first camera module 100 and second camera module
200 coupled to substrate 504 of a multi-media device in accordance
with one embodiment of the present invention. As shown, substrate
504 is communicatively coupled to substrate 104 via first connector
508 of substrate 504 and first connector 124 of substrate 104.
Accordingly, host processor 512 is communicatively coupled to first
camera 102 located on substrate 104 and second camera 202 (using
the connection formed between first camera module 100 and second
camera module 200 via second connector 126 of substrate 104 and
connector 214 of substrate 204 as discussed above).
[0064] As further shown, display unit 502 is communicatively
coupled to second connector 510 via display connector 518. In
addition, display unit 502 is positioned into a space that is at
least partly defined by lens housing 208 of second camera 202 and
bottom side 404 of substrate 104. In particular, display unit 502
is situated on top of bottom side 404 and below lens housing 208.
Additionally, in view of the unique positioning of the lens housing
208, the image-capturing ability of the second camera 202 is
unobstructed by the display unit 502. This advantageously creates a
compact form factor and reduces the thickness of the multi-media
device housing substrate 504, the coupled first camera module 100
and second camera module 200, and display unit 502, while enabling
a multiple camera arrangement for such a device.
[0065] As further shown, display unit 502 is also situated on top
of host processor 512. However, it is noted that host processor 512
may be mounted in a location on substrate 504 such that display
unit 502 does not cover host processor 512.
[0066] FIG. 6 is a perspective bottom view 600 of substrate 502 of
the multi-media device in accordance with one embodiment.
Accordingly, a bottom side 602 of substrate 502 is shown. As
further shown in FIG. 6, at least a portion of first camera 102 is
received through opening 506, which advantageously reduces the
thickness of the multi-media device housing substrate 504, the
coupled first camera module 100 and second camera module 200, and
display unit 502.
[0067] FIG. 7 is a block diagram 700 illustrating several
components of a multi-media device in accordance to one embodiment.
As shown, the multi-media device may include a first camera 702, a
second camera 704, an image signal processor 706 and a host
processor 708. First camera 702 may comprise one implementation of
first camera 102 described above in reference to FIGS. 1, 3-5A and
6. Second camera 704 may comprise one implementation of second
camera 202 described above in reference to FIGS. 2-5B. Image signal
processor 706 may comprise one implementation of image signal
processor 112 described above in reference to FIG. 1. Host
processor 708 may comprise one implementation of host processor 512
described above in reference to FIGS. 5A and 5B.
[0068] The multi-media device may also include a common interface
712, a first control interface 714, and a second control interface
710. Common interface 712 couples image signal processor 706 to
host processor 708. First control interface 714 couples host
processor 708 to first camera 702. Second control interface 710
couples host processor 708 to second camera 704.
[0069] In accordance with one embodiment, common interface 712 may
be a parallel data bus to transmit image data from image signal
processor 706 to host processor 708 in a parallel fashion. In
accordance with another embodiment, common interface 712 may be a
serial data bus to transmit image data from image signal processor
706 to host processor 708 in a serial fashion. For example, common
interface 712 may be a Mobile Industry Processor Interface
(MIPI).
[0070] First control interface 714 and second control interface 710
may be configured to transmit control signals to first camera 702
and second camera 704 from host processor 708. For example, as
previously mentioned, host processor 708 may be configured to
receive user input and translate those inputs into signals for
first camera 702 and/or second camera 704. The signals may be used
to perform a variety of different operations, such as activation of
first camera 702 and/or second camera 704, image capture,
autofocus, picture resolution configuration and other operations
that configure parameters and settings that may affect picture
quality or content.
[0071] In accordance with an embodiment, first control interface
714 and second control interface 710 may be configured to
communicate with an Inter-Integrated Circuit (I2C) bus.
Accordingly, commands transmitted via first control interface 714
and second control interface 710 may be configured to be
transmitted using the I2C bus.
[0072] Image signal processor 706 is communicatively coupled to
both first camera 702 and second camera 704. In particular, image
signal processor 706 may be communicatively coupled to an image
sensor associated with first camera 702 and an image sensor
associated with second camera 704.
[0073] Generally, host processor 708 may be configured to control
and manage many of the primary functions of the multi-media device.
To alleviate some of the burden placed on the host processor 708,
image signal processor 706 processes images captured by first
camera 702 and second camera 704.
[0074] Image signal processor 706 may process images captured by
first camera 702 and second camera 704 in accordance with any
suitable image processing algorithm. For example, as previously
mentioned, image signal processor 706 may process raw data from the
captured images into a suitable file format, like Y'UV, YUV, YCbCr,
YPbPr or any other file format. As another example, image signal
processor 706 may perform automatic exposure control (AEC),
automatic gain control (AGC) or automatic white balance (AWB) and
can resize images as needed. As an option, image signal processor
706 may be further configured to compress the images into a
suitable format by employing any available compression standard,
such as JPEG or MPEG and their associated variants. It is not
necessary that image signal processor 706 perform all these
techniques, as some of them may not be necessary or may even be
executed by the host processor 708. For example, host processor 708
may be configured to conduct the compression of the captured
images.
[0075] By using a single image signal processor 706 for the two
cameras (i.e., single camera 702 and second camera 704) as opposed
to dedicating a separate image signal processor 706 for first
camera 702 and second camera 704, the efficiency of the multi-media
device may advantageously be improved. For example, a single image
signal processor arrangement can reduce the footprint required on a
substrate, can reduce the amount of power needed to process the
images and decrease the costs normally associated with such an
arrangement.
[0076] Once image signal processor 706 processes the images, image
signal processor 706 may transmit the images to host processor 708
via common interface 712. Common interface 712 allows for a single
interface to be employed to transfer the images (from both first
camera 702 and second camera 704) to host processor 708, further
reducing spatial requirements and expense. Once received, host
processor 708 may further process the images in accordance with any
suitable method, such as by compressing the images into an
appropriate form. It is noted, however, that more than one
interface can be used to transfer images from image signal
processor 706 to host processor 708. Additionally, image signal
processor 706 is not limited to receiving images from two cameras,
as image signal processor 706 may be configured to receive such
data from three or more cameras. Moreover, the multi-media device
may include multiple image signal processors 706 and/or host
processors 708 to process images received from a plurality of
cameras.
[0077] FIGS. 8A-8C depict flowcharts of a method for manufacturing
a multi-media device having two cameras in accordance with an
embodiment. In particular, FIG. 8A depicts a flowchart 800A of a
method for assembling a coupled first and second camera module in
accordance with one embodiment. FIG. 8B depicts a flowchart 800B of
a method for coupling the coupled first and second camera module to
a substrate formed to receive the coupled first and second camera
module in accordance with one embodiment. FIG. 8C depicts a
flowchart 800C of a method for coupling a display unit (or some
other suitable component) of a multi-media device to the substrate
formed to receive the coupled first and second camera module in
accordance with one embodiment. The steps illustrated in flowcharts
800A, 800B, and 800C may be performed in any order or concurrently
unless specified otherwise. Some embodiments do not require that
each and every step be performed.
[0078] The methods of flowcharts 800A, 800B and 800C are described
herein by way of example only and are not intended to be limiting.
Furthermore, although the steps of flowcharts 800A, 800B and 800C
will be described herein with reference to components illustrated
in FIGS. 1-7 persons skilled in the relevant art(s) will readily
appreciate that the method need not be implemented using such
components.
[0079] Turning now to FIG. 8A, the method of flowchart 800A begins
at step 802, in which a first substrate (e.g., substrate 104) is
coupled to a second substrate (e.g., substrate 204). The first
substrate has a first side (e.g., top side 120) and a second side
(e.g., bottom side 404) that is opposite to the first side. The
second printed circuit also has a first side (e.g., top side 212)
and a second side (e.g., bottom side 302) opposite to the first
side of the second substrate.
[0080] In accordance with an embodiment, the first substrate is
coupled to the second substrate using a ZIF connector.
[0081] At step 804, a first camera (e.g., first camera 102) is
mechanically and electrically coupled to the first side of the
first substrate. The first camera includes a first lens housing
(e.g., lens housing 108), which houses one or more first lenses
(e.g., lens(es) 106), a first image sensor (e.g., image sensor
110), and an image signal processor (image signal processor 112).
The image signal processor is configured to process images captured
from the first image sensor. Accordingly, the first image sensor
and the image signal processor are communicatively coupled
together. In accordance with one example embodiment, the first
image sensor and the image signal processor may be integrated
together as part of an SoC. Accordingly, the image sensor and the
image signal processor may be situated on the same silicon
substrate. In accordance with another example embodiment, the image
sensor and the image signal processor may be located on separate
chips. Accordingly, the image sensor and the image signal processor
may be situated on different silicon substrates.
[0082] At step 806, a second camera (e.g., second camera 202) is
mechanically and electrically coupled to the first side of the
second substrate. The second camera includes one or more second
lenses (e.g., lens(es) 206) and a second image sensor (e.g., image
sensor 210).
[0083] In accordance with an embodiment, the second substrate is
coupled to the first substrate in a manner such that the one or
more first lenses of the first camera are configured to receive
light generally from a first direction and the one or more second
lenses of the second camera are configured to receive light
generally from a second direction that is opposite to the first
direction.
[0084] In accordance with yet another embodiment, the second
substrate is coupled to the first substrate in a manner such that
the second substrate is laterally positioned with respect to the
first substrate.
[0085] At step 808, the second image sensor is communicatively
coupled to the image signal processor in order to process images
captured by the second image sensor. Accordingly, the image signal
processor is configured to process images captured by both the
first image sensor of the first camera and the second image sensor
of the second camera.
[0086] Turning now to FIG. 8B, the method of flowchart 800B begins
at step 810, in which an opening (e.g., opening 508) is formed in a
third substrate (e.g., substrate 504). The opening is adapted to
receive at least a portion of the first lens housing of the first
camera. Accordingly, the opening is shaped to correspond to or
otherwise accommodate the shape of the first lens housing.
[0087] At step 812, the third substrate is coupled to the first
substrate. In accordance with an embodiment, the third substrate is
coupled to the first substrate using a board-to-board
connector.
[0088] At step 814, a host processor (e.g., host processor 512) is
mechanically and electrically coupled to the third substrate.
[0089] At step 816, the host processor is communicatively coupled
to the image signal processor of the first camera. The image signal
processor may transmit processed images to the host processor using
a common interface (e.g., common interface 712). Accordingly, host
processor is configured to process images captured by both the
first image sensor of the first camera and the second image sensor
of the second camera.
[0090] In accordance to one embodiment, the common interface is
parallel interface. In accordance to another embodiment of the
invention, the common interface is a serial interface. For example,
the common interface may be a MIPI interface.
[0091] At step 818, the host processor is communicatively coupled
to the first camera via a first control interface (e.g., first
control interface 714). The first control interface is configured
to transmit control signals from the host processor the first
camera.
[0092] At step 820, the host processor is communicatively coupled
to the second camera via a second control interface (e.g., second
control interface 710). The first control interface is configured
to transmit control signals from the host processor the second
camera.
[0093] In accordance to an embodiment, the first and second control
interface may be an I2C interface. Using the first control
interface, the host processor may perform various operations for
both the first camera and the second camera. Such operations
include, but are not limited to, camera activation, image capture,
autofocus, picture resolution configuration and other operations
that configure parameters and settings that may affect picture
quality or content.
[0094] Referring now to FIG. 8C, the method of flowchart 800C
begins at step 820, in which a display unit (e.g., display unit
502) or some other component of the multi-media device is
positioned in a space at least partly defined by the second side of
the first substrate and the second lens housing of the second
camera. In particular, the display unit is situated on top of the
second side of the first substrate and below the lens housing. This
advantageously creates a compact form factor and reduces the
thickness of the multi-media device housing the third substrate
(e.g., substrate 504), the coupled first camera module and second
camera module, and the display unit (e.g., display unit 502).
[0095] At step 822, the display unit of the multi-media device is
coupled to the third substrate. In accordance with an embodiment,
the display unit is coupled to the third substrate using a ZIF
connector.
[0096] FIG. 9 is a front view of a multi-media device 900 in
accordance with one embodiment. In various embodiments, multi-media
device 900 may be a mobile device, such as, but not limited to, a
cell phone, a tablet, a personal data assistant (PDA), a laptop
computer, a handheld computer or a netbook computer. As shown,
multi-media device 900 includes a housing 905, a display 910, and a
first camera 930. Display 910 may comprise one implementation of
display unit 502 described above in reference to FIGS. 5A-6. First
camera 930 may comprise one implementation of first camera 102
described above in reference to FIGS. 1, 3-5A and 6.
[0097] As shown, housing 905 has a front side 915, which is the
surface of housing 905 that normally faces a user during use of
multi-media device 900. Housing 905 at least partially encloses
display 910. Accordingly, display 910 is positioned at or on a
first side 915 of housing 905. Referring briefly to FIG. 5B, front
side 915 may be adjacently-proximate to top side 505 of substrate
504. Accordingly, front side 915 covers top side 505 of substrate
504.
[0098] First camera 930 is also shown to be positioned at or on
front side 915. Accordingly, first camera 930 is a front-facing
camera. In one embodiment, first camera 130 may be a moving images
camera, which can be used to conduct video calls. As shown, first
camera 930 is positioned above display 910.
[0099] Display 910 may be a liquid crystal display (LCD),
light-emitting diode (LED) display, an active matrix organic LED
(AMOLED) display, or the like. In accordance with certain
embodiments, display 910 may be a touch screen 920 capable of
sensing input from an object, such as a finger or stylus, which
touches touch screen 920 or is positioned above touch screen 920.
In accordance with this embodiment, display 910 may be based on any
suitable type of technology that can be used for sensing input. For
example, display 910 may use resistance, capacitance, surface
acoustic waves, infrared, strain gauges, optical imaging,
dispersive signals or acoustic pulse recognition for sensing input.
In one embodiment, a keypad or keyboard (not shown) may also be
implemented into the multi-media device 900 to supplement or take
the place of touch screen 920.
[0100] FIG. 10 is a rear view of multi-media device 900 in
accordance to one embodiment of the invention. Accordingly, a rear
side 1025 of housing 905, which is opposite to the front side 915,
is shown. Referring briefly to FIG. 6, rear side 1025 may be
adjacently-proximate to bottom side 602 of substrate 504.
Accordingly, rear side 1025 covers bottom side 602 of substrate
504.
[0101] Multi-media device 900 includes a second camera 1035. Second
camera 1035 may comprise one implementation of second camera 202
described above in reference to FIGS. 2-5B. Because second camera
1035 is positioned at or on rear side 1025, second camera 1035 is a
rear-facing camera. In one embodiment, second camera 1035 may be
still image camera.
[0102] It is noted that while FIGS. 9 and 10 show two cameras
(i.e., first camera 930 and second camera 1035), it is understood
that multi-media device 900 may contain a greater (or lesser)
number of cameras. Moreover, first camera 930 and second camera
1035 may be positioned at locations on multi-media device 900 other
than those shown in FIGS. 9 and 10.
III. Conclusion
[0103] While various embodiments have been described above, it
should be understood that they have been presented by way of
example only, and not limitation. It will be apparent to persons
skilled in the relevant art(s) that various changes in form and
details can be made therein without departing from the spirit and
scope of the subject matter described herein. Thus, the breadth and
scope of such subject matter should not be limited by any of the
above-described exemplary embodiments, but should be defined only
in accordance with the following claims and their equivalents.
* * * * *