U.S. patent application number 13/393005 was filed with the patent office on 2012-10-04 for hearing aid device and a method of manufacturing a hearing aid device.
This patent application is currently assigned to SIEMENS MEDICAL INSTRUMENTS PTE. LTD.. Invention is credited to Frank Beck, James Edward De Finis, Jens-Christian Holst, Harald Klemenz, Lavlesh Lamba, Pei chyi Kristy Lim, Uwe Rass, Joseph Sauer, Amit Vaze.
Application Number | 20120250920 13/393005 |
Document ID | / |
Family ID | 42990165 |
Filed Date | 2012-10-04 |
United States Patent
Application |
20120250920 |
Kind Code |
A1 |
Beck; Frank ; et
al. |
October 4, 2012 |
HEARING AID DEVICE AND A METHOD OF MANUFACTURING A HEARING AID
DEVICE
Abstract
A hearing aid device and a method of manufacturing the hearing
aid device provide a housing and a first conductive layer. The
housing has a first non-conductive layer and a second
non-conductive layer. The first conductive layer is disposed
between the first non-conductive layer and the second
non-conductive layer.
Inventors: |
Beck; Frank; (Spardorf,
DE) ; De Finis; James Edward; (Flanders, NJ) ;
Holst; Jens-Christian; (Berlin, DE) ; Klemenz;
Harald; (Furth, DE) ; Lamba; Lavlesh;
(Piscataway, NJ) ; Lim; Pei chyi Kristy; (Furth,
DE) ; Rass; Uwe; (Nurnberg, DE) ; Sauer;
Joseph; (Strullendorf, DE) ; Vaze; Amit;
(Parlin, NJ) |
Assignee: |
SIEMENS MEDICAL INSTRUMENTS PTE.
LTD.
SINGAPORE
SG
|
Family ID: |
42990165 |
Appl. No.: |
13/393005 |
Filed: |
August 24, 2010 |
PCT Filed: |
August 24, 2010 |
PCT NO: |
PCT/US2010/046485 |
371 Date: |
June 22, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12549450 |
Aug 28, 2009 |
8224006 |
|
|
13393005 |
|
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|
Current U.S.
Class: |
381/322 ;
29/825 |
Current CPC
Class: |
Y10T 29/49117 20150115;
H04R 25/60 20130101; H04R 25/658 20130101; H04R 25/554 20130101;
H04R 25/65 20130101; H04R 25/609 20190501; B33Y 80/00 20141201;
Y10T 29/49005 20150115; H04R 2225/49 20130101; H04R 25/604
20130101 |
Class at
Publication: |
381/322 ;
29/825 |
International
Class: |
H04R 25/00 20060101
H04R025/00; B21D 53/00 20060101 B21D053/00 |
Claims
1-15. (canceled)
16. A hearing aid device, comprising: a housing having a first
non-conductive layer and a second non-conductive layer; and a first
conductive layer disposed between said first non-conductive layer
and said second non-conductive layer.
17. The hearing aid device according to claim 16, wherein said
second non-conductive layer has an inner surface, and a second
conductive layer is attached onto a portion of said inner surface
of said second non-conductive layer.
18. The hearing aid device according to claim 17, which further
comprises an electrical component to which said second conductive
layer is conductively connected.
19. The hearing aid device according to claim 18, wherein said
electrical component is a printed electrical component.
20. The hearing aid device according to claim 17, wherein said
first conductive layer and said second conductive layer are solid
freeform fabricated layers selected from the group consisting of:
an inkjet printed layer, a pneumatic sprayed layer, a screen
printed layer, a pad printed layer, a laser printed layer, a dot
matrix printed layer, a thermal printed layer, a lithographic
layer, and a 3D printed layer.
21. The hearing aid device according to claim 17, wherein said
first conductive layer and said second conductive layer include an
element selected from the group consisting of: copper, gold,
silver, and electrically conductive polymer.
22. The hearing aid device according to claim 16, wherein said
housing includes a third non-conductive layer disposed inwardly of
said first non-conductive layer and outwardly of said second
non-conductive layer.
23. The hearing aid device according to claim 22, which further
comprises a coil disposed between said third non-conductive layer
and said first non-conductive layer.
24. A method for manufacturing a hearing aid device, the method
comprising the following steps: producing a housing of the hearing
aid device having a first non-conductive layer and a second
non-conductive layer; and embedding a first conductive layer
between the first non-conductive layer and the second
non-conductive layer.
25. The method according to claim 24, which further comprises
embedding the first conductive layer between the first
non-conductive layer and the second non-conductive layer by a solid
freeform technique selected from the group consisting of: inkjet
printing, pneumatic spraying, screen printing, pad printing, laser
printing, dot matrix printing, thermal printing, lithography, and
3D printing.
26. The method according to claim 24, which further comprises
attaching a second conductive layer onto an inner surface of the
second non-conductive layer.
27. The method according to claim 26, which further comprises
conductively connecting an electrical component to the second
conductive layer.
28. The method according to claim 27, which further comprises
providing the electrical component as a printed electrical
component.
29. The method according to claim 24, which further comprises
providing a third non-conductive layer disposed inwardly of the
first non-conductive layer and outwardly of the first
non-conductive layer, and embedding a coil between the first
non-conductive layer and the third non-conductive layer.
30. The method according to claim 29, which further comprises
including in the first conductive layer, the second conductive
layer and the coil an element selected from the group consisting
of: copper, gold, silver, and electrically conductive polymer.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a hearing aid device and a
method for manufacturing the hearing aid device.
BACKGROUND OF THE INVENTION
[0002] Hearing aid devices and hearing devices generally comprise a
housing, in which a microphone, an amplifier or amplifying device,
a receiver, a power supply, mostly a zinc-air battery inter alia
are arranged. The receiver is connected to an acoustic output of
the housing, which emits the acoustic signals generated and
prepared by the hearing aid device into an auditory canal of a
wearer of the hearing aid device.
[0003] In order to meet the aesthetic requirements of a wearer of
the hearing aid device, this is to be as minimally externally
visible on the wearer as possible. These requirements are
particularly high especially in the case of hearing devices worn in
the ear, referred to as in-ear hearing aid device. The components
needed for an in-ear hearing aid device are thus to be designed as
small as possible within the in-ear hearing aid device, to be
packed as tightly as possible and to be reduced to a minimum.
[0004] Additionally, the components of the hearing aid device are
to be shielded from external interferences for efficient
functioning of the hearing aid device. Compensating elements such
as coils, capacitors or certain topology of conductive lines and
cables may be arranged within the inner space of a housing of the
hearing aid device to reduce the electromagnetic interferences
(EMI) within the housing. Alternatively, a shielding layer, such as
having a gold plated layer on the inner surface of the hearing aid
device may reduce the EMI within the housing of the hearing aid
device. However, the use of compensating elements and the shielding
layer may provide limitations on the miniaturization of the hearing
aid device. Further, the manufacturing time of the hearing aid
device is increased as the compensating elements are to be
carefully positioned into the hearing aid device or the gold plated
layer is to be provided onto the inner surface of the housing after
the after has been made.
SUMMARY OF THE INVENTION
[0005] It is an object of the invention to provide shielding of
components from external electromagnetic interferences.
[0006] The above object is achieved by a hearing aid device and a
method of manufacturing the hearing aid device, wherein the hearing
aid device comprises a housing having a first non-conductive layer
and a second non-conductive layer, and a first conductive layer
between the first non-conductive layer and the second
non-conductive layer.
[0007] The first conductive layer embedded in between the first
non-conducive layer and the second non-conducive layer of the
housing of the hearing aid device shields an inner space of the
housing from external electromagnetic interferences. The inner
space of the housing accommodates the electrical components
therein. Further this facilitates further miniaturization of the
hearing aid device as the inner space of the housing may be used
more efficiently and thus the hearing aid device can be more
compact.
[0008] According to another embodiment, the hearing aid device
further comprises a second conductive layer attached onto at least
a portion of the inner surface of the second non-conductive layer.
The second conductive layer attached onto the inner surface of the
second non-conductive layer of the housing of the hearing aid
device enables in miniaturization of the hearing aid device.
Additionally, the requirement of loose wires leads may be reduced
and thus the electromagnetic interference within the housing of the
hearing aid device is reduced.
[0009] According to yet another embodiment, the second conductive
layer is conductively connected to an electrical component.
Connecting an electrical component to the second conductive layer
enables miniaturization of the hearing aid device and eliminates
the requirement of loose wire leads.
[0010] According to yet another embodiment, the electrical
component includes a printed electrical component. Printed
electrical components occupy less space and can easily be printed
during the manufacturing of the housing. Thus, printed electrical
components enable in miniaturization of the hearing aid device and
also reduce the manufacturing time of the hearing aid device.
[0011] According to yet another embodiment, the first conductive
layer and the second conductive layer are fabricated using a solid
freeform fabrication technique selected from the group consisting
of inkjet printing, pneumatic spraying, screen printing, pad
printing, laser printing, dot matrix printing, thermal printing,
lithography, and 3D printing. Fabricating or printing the first and
the second conductive layer using a solid freeform fabrication
technique enables in fabricating the first conductive layer between
the first non-conducive layer and the second non-conductive layer
and the second conductive onto the inner surface of the second
non-conductive layer of the housing at the time of the
manufacturing of the housing.
[0012] According to yet another embodiment, the first conductive
layer and the second conductive layer comprises an element from the
group consisting of copper, gold, silver and electrically
conductive polymer. These elements comprise enhanced conductive
properties and therefore enable the first conductive layer and the
second conductive layer to have good electrical conductance.
[0013] According to yet another embodiment, the housing further
comprises a third non-conductive layer arranged outwardly to the
first non-conductive layer. Providing the third non-conductive
layer enables providing additional features to the hearing aid
device.
[0014] According to yet another embodiment, the hearing aid device
further comprises a coil between the third non-conductive layer and
the first non-conductive layer. The coil enables wireless
communication with the hearing aid device. Additionally, the coil
enables wireless charging of the hearing aid device. This enables
efficient use of the inner space of the hearing aid device, and
thus, enables miniaturization of the hearing aid device.
Additionally, as the coil is provided external to the first
conductive layer, the inner space is shielded from any EMI arising
out of the coil by the first conductive layer.
[0015] Another embodiment includes a method of manufacturing a
hearing aid device,
[0016] wherein the method comprises embedding a first conductive
layer between a first non-conductive layer and a second
non-conductive layer of a housing of the hearing aid device.
[0017] Embedding the first conductive layer between the first
non-conductive layer and the second non-conductive layer of the
housing provides shielding of the inner space of the housing from
EMI interferences. Further this facilitates further miniaturization
of the hearing aid device as the inner space of the housing may be
used more efficiently and thus the hearing aid device can be more
compact.
[0018] According to yet another embodiment, the embedding includes
fabricating the first conductive layer between the first
non-conductive layer and the second non-conductive layer using a
solid freeform technique selected from the group consisting of
inkjet printing, pneumatic spraying, screen printing, pad printing,
laser printing, dot matrix printing, thermal printing, lithography,
and 3D printing.
[0019] According to another embodiment, the method further
comprises attaching a second conductive layer onto an inner surface
of the second non-conductive layer. The second conductive layer
attached onto the inner surface of the second non-conductive layer
of the housing of the hearing aid device enables in miniaturization
of the hearing aid device. Additionally, the requirement of loose
wires leads may be reduced and thus the electromagnetic
interference within the housing of the hearing aid device is
reduced.
[0020] According to yet another embodiment, the second conductive
layer is conductively connected to an electrical component.
[0021] According to yet another embodiment, wherein the electrical
component includes a printed electrical component.
[0022] According to yet another embodiment, the method comprises
embedding a coil between the first non-conductive layer and a third
non-conductive layer, the third non-conductive layer arranged
outwardly to the first non-conductive layer.
[0023] According to yet another embodiment, wherein the first
conductive layer, the second conductive layer and the coil
comprises an element from the group consisting of copper, silver,
gold and electrically conductive polymer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The present invention is further described hereinafter with
reference to illustrated embodiments shown in the accompanying
drawings, in which:
[0025] FIG. 1 illustrates a cross sectional view of a housing of a
hearing aid device according to an embodiment herein,
[0026] FIG. 2 illustrates a schematic block diagram of electrical
components essential for a hearing aid function,
[0027] FIG. 3 illustrates a cross sectional view of housing
comprising an additional conductive layer according to an
embodiment herein,
[0028] FIG. 4a illustrates one example where two conductive layers
are separated by an insulating medium to form a positive and a
negative contact,
[0029] FIG. 4b illustrates an insulating medium provided to act as
a barrier between two additional conductive layers
[0030] FIG. 5 illustrates a pattern of attaching additional
conductive layers on an inner surface of a second non-conductive
layer of a housing of a hearing aid device according to an
embodiment herein,
[0031] FIG. 6 illustrates another pattern of attaching additional
conductive layers on an inner surface of a second non-conductive
layer of a housing of a hearing aid device according to an
embodiment herein,
[0032] FIG. 7 illustrates connection of an electrical component to
the additional conductive layers according to an embodiment
herein,
[0033] FIG. 8 illustrates connection between an electrical
component and additional conductive layers attached onto an inner
surface of a second non-conductive layer in more detail,
[0034] FIG. 9 illustrates connection between an electrical
component and additional conductive layers using connection leads
attached onto an inner surface of a second non-conductive layer
according to an embodiment herein,
[0035] FIG. 10a illustrates connection between an electrical
component and conductive layers attached onto an inner surface of a
housing of a hearing aid device using soft rings,
[0036] FIG. 10b illustrates a soft ring in detail,
[0037] FIG. 11a illustrates separation of a plurality of conductive
layers using insulating mediums in accordance to an embodiment
herein,
[0038] FIG. 11b is an enlarged side view of the encircled area of
FIG. 11a,
[0039] FIG. 12a illustrates connection between two electrical
components using the additional conductive layers attached onto an
inner surface of a second non-conductive layer of a housing of a
hearing aid device and extended onto an outer surface of a casing
of the electrical components,
[0040] FIG. 12b additional conductive layers of FIG. 12a,
[0041] FIG. 13 illustrates connection between an electrical
component and an additional conductive layer using a casing of an
electrical component,
[0042] FIG. 14 illustrates a side view of a slot on an inner side
of a housing of a hearing aid device according to an embodiment
herein,
[0043] FIG. 15 is a cross sectional view of a housing of a hearing
aid device illustrating a coil printed onto a layer of the hearing
aid device between a first non-conductive layer and a conductive
layer according to an embodiment herein, and
[0044] FIGS. 16a-16c illustrate a method of manufacturing a housing
of a hearing aid device according to an embodiment herein.
DETAILED DESCRIPTION OF THE INVENTION
[0045] Various embodiments are described with reference to the
drawings, wherein like reference numerals are used to refer to like
elements throughout. In the following description, for purpose of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of one or more embodiments. It may
be evident that such embodiments may be practiced without these
specific details.
[0046] FIG. 1, illustrates a cross sectional view of a housing 10
of a hearing aid device 12 according to an embodiment herein. The
housing 10 comprises a conductive layer 18 between a first
non-conductive layer 14 and a second non-conductive layer 15. The
conductive layer 18 with the first non-conductive layer 14 and the
second non-conductive layer 15 forms the wall of the housing 10.
The conductive layer 18 provides shielding of an inner space 20
within the housing 10 from electromagnetic interference (EMI).
[0047] The hearing aid device 12 includes, but not limited to,
in-ear hearing aid device, baby worn hearing aid device, behind the
ear (BTE) hearing aid device, receiver in the canal (RIC) or ear
hearing aid device, in the canal (ITC) hearing aid device, mini
canal (MIC) hearing aid device, completely in the canal (CIC)
hearing aid device, extended wear hearing aid device, open fit
hearing aid devices, eye glass hearing aid devices and the
like.
[0048] Still referring to FIG. 1, advantageously, the first
non-conductive layer 14 and the second non-conductive layer 15 are
manufactured using non-conductive materials, for example a resin,
an adhesive, a paint or a synthetic material, such that the first
non-conductive layer 14 and the second non-conductive layer 15 do
not exhibit any electrical conductance property. The conductive
layer 18 is manufactured using conductive materials such that the
conductive layer 18 is electrically conductive.
[0049] Preferably, the conductive layer 18 extends substantially at
the interior of the housing 10 between the first non-conductive
layer 14 and the second non-conductive layer 15. This provides
efficient shielding of the inner space 20. In an implementation,
the conductive layer 18 can be a thin foil. Advantageously, the
conductive layer 18 may be embedded between the first conductive
layer 14 and the second conductive layer 15 during the
manufacturing of the housing 10. Alternatively, the housing 10 may
be manufactured such that the housing 10 comprises only the
conductive layer 18 and the second non-conductive layer 15.
However, it may not be preferred to manufacture the housing 10 such
that it comprises only the conductive layer 18 and the second
non-conductive layer 15, as it may cause inconvenience to the user
of the hearing aid device 12 because of the hardness of the
conductive layer 18. The housing 10 having the conductive layer 18
between the first non-conductive layer 14 and the second conductive
layer 15 shields the inner space 20 from EMI. Providing the
conductive layer 18 between the first non-conductive layer 14 and
the second non-conductive layer 15 enables efficient usage of the
inner space 20 of the housing 10.
[0050] Advantageously, the conductive layer 18 may be provided such
that the conductive layer 18 encircles a substantial surface area
of the second non-conductive layer 15. However, the conductive
layer 18 may be provided such that it encircles only a particular
region or portion of interest of the second non-conductive layer
15.
[0051] FIG. 2 illustrates a schematic block diagram of electrical
components essential for a hearing aid function. The hearing aid
device 12 comprises therein the electrical components essential for
the hearing aid function, such as, a microphone 22, an amplifier
24, a receiver 26 and a power source 28. The electrical component
may also include resistors, capacitors, coils and the like. The
electrical components such as the resistor, capacitor or the coil
may also be printed using solid freeform fabrication techniques,
such as a 3D printing technique. The hearing aid device 1 records
ambient noise with the aid of the microphone 22, amplifies these by
means of the amplifier 24 and forwards them to the receiver 26. The
power supply required for the amplifier 24 for amplification is
provided by the power source 28. The sound signals from the
receiver 26 are conveyed to the ear drum of the wearer by means of
an outlet canal, tube or wire.
[0052] Referring now to FIG. 1 and FIG. 2, the electrical
components are typically arranged in the inner space 20 of the
housing 10. In an aspect, the conductive layer 18 shields the inner
space 20 within the housing 10 from EMI. This shields the
electrical components arranged within the inner space 20 from
EMI.
[0053] FIG. 3 illustrates a cross sectional view of housing 10
comprising an additional conductive layer according to an
embodiment herein. The housing 10 of the hearing aid device 12
comprises therein the electrical components essential for the
functioning of the hearing aid device 12. In the shown example of
FIG. 3, the housing 10 comprises the conductive layer 18 between
the first non-conductive layer 14 and the second non-conductive
layer 15. In an aspect herein, an additional conductive layer 21
may be attached onto the inner surface 16 of the second
non-conductive layer 15 of the housing 10.
[0054] The conductive layer 21 is attached onto the inner surface
16 of the second non-conductive layer 15 of the housing 10 as the
second non-conductive layer 15 is manufactured using a
non-conductive material. The inner surface 16 of the second
non-conductive layer 15 acts as a support for the conductive layer
21.
[0055] In the shown example of FIG. 3, the additional conductive
layer 21 may represent a positive contact or a negative contact.
However, multiple conductive layers may be attached onto the inner
surface 16 of the second non-conductive layer 15. For example, if
two conductive layers are attached the conductive layers may
represent a positive and a negative contact. If multiple conductive
layers are attached onto the inner surface 16 of the second
non-conductive layer 15, the conductive layers would have to be
separated using an insulating medium.
[0056] FIG. 4a illustrates one example where two conductive layers
21, 30 are separated by an insulating medium 32 to form a positive
and a negative contact. The insulating medium 32 may be a
non-conducting layer of the inner surface 16 of the second
non-conductive layer 15 or an insulating layer attached between the
conductive layers 21, 30. In certain embodiments, the insulating
medium 32 may be an insulating layer such that the insulating layer
acts as a barrier between the two additional conductive layers 21,
30 as illustrated in FIG. 4b.
[0057] FIG. 5 illustrates a pattern of attaching additional
conductive layers on the inner surface of second non-conductive
layer the housing of the hearing aid device according to an
embodiment herein. In the shown example of FIG. 5, a plurality of
additional conductive layers 21, 30 are attached on the inner
surface 16 of FIG. 3 of the second non-conducive layer 15 of FIG. 3
in a stripe pattern. For example, one of the additional conductive
layers may represent a positive contact and the other may represent
a negative contact. For example, the additional conductive layers
21 may represent a positive contact and the additional conductive
layers 30 may represent a negative contact. The additional
conductive layers 21 are separated from the additional conductive
layers 30 by an insulating medium 32. The insulating medium 32 in
the present embodiment is portions of the inner surface 16 of the
second non-conducive layer 15 onto which no conductive layers 21,
30 are attached.
[0058] FIG. 6 illustrates another pattern of attaching additional
conductive layers on the inner surface of the housing of the
hearing aid device according to an embodiment herein. In the shown
example of FIG. 5, the additional conductive layer 21 is attached
on one half of the inner surface 16 of FIG. 3 of the second
non-conductive layer 15 of FIG. 3 and the conductive layer 30 is
attached onto the other half of the inner surface 16 of the second
non-conductive layer 15. The conductive layer 21 is separated from
the conductive layer 30 by an insulating medium 32. The insulating
medium 32 in the present embodiment is portion of the inner surface
16 of the second non-conductive layer 15 onto which no conductive
layers 21, 30 are attached.
[0059] Attaching multiple conductive layers enable, conductively
connecting multiple conductive layers to the electrical components.
This enables in increasing the fault tolerance of the hearing aid
device 1 as redundant connections to the electrical components can
be made.
[0060] In the shown example of FIG. 3, the additional conductive
layer 21 extends over a substantial surface area of the inner
surface 16 of the second non-conductive layer 15. However, the
additional conductive layer 21 may be attached onto only a portion
of the inner surface 16 of the second non-conductive layer 21. If
the additional conductive layer 21 is attached onto only a portion
of the inner surface 16 of the second non-conductive layer 15, it
may be required that the additional conductive layer 21 is to be
attached onto the inner surface 16 of the second non-conductive
layer 15 such that the position of the additional conductive layer
21 is suitable for making connections with electrical components.
If a single additional conductive layer is attached onto the inner
surface 16 of the second non-conductive layer 15, the additional
conductive layer may extend over a substantial area of the inner
surface 16 of the second non-conductive layer 15. However, the
additional conductive layer can also extend over a portion or
region of the surface of the inner surface 16 of the second
non-conductive layer 15.
[0061] Referring now to FIG. 7, an electrical component, for
example a receiver 26 may be connected to the conductive layers 21,
30 using connector leads 34, 36. The receiver 24 illustrated in
FIG. 7 is shown as an example and other electrical components may
also be connected in a similar manner. Other connector means, such
as soft rings and the like may also be used to connect an
electrical component to the conductive layers 21, 30. The connector
leads 34, 36 may pierce into the respective conductive layers 21,
30. The connector leads 34, 34 enable suspending the receiver 9
rigidly and thus, reduce shocks and vibrations encountered by the
receiver due to the movement of the user of the hearing aid device.
Additionally, the use of connector leads 34, 36 enable to eliminate
the requirement of soldering and thus, make the manufacturing
process easy and less time consuming.
[0062] In an embodiment, multiple connections from the conductive
layers 21, 30 to the electrical component may be made to increase
fault tolerance. For example, a plurality of connector leads 34, 36
may be used to make the connections between the conductive layers
21, 30 and the electrical component.
[0063] FIG. 8 illustrates connection between an electrical
component and conductive layers attached onto the inner surface of
the housing connector leads in more detail. In the shown example of
FIG. 8, a receiver 26 is connected to the conductive layers 21, 30
using connector leads 34, 36. The connector leads 34, 36 may pierce
into the conductive layers 21, 30. The connector leads 34, 36
connect to a connection pad and the connection pad in turn connects
to the contact terminal of the receiver 26. In the shown example of
FIG. 6, the receiver 26 is held in a suspended position rigidly and
thus reduces the chances of device failure due to shock and
vibration. The multiple connector leads 34, 36 enables in
increasing fault tolerance of the hearing aid device 12 of FIG.
7.
[0064] Referring again to FIG. 7, in an alternative implementation,
the housing 10 may be manufactured such that connector leads 34, 36
are attached to the housing 10. The receiver 26 may be connected to
the connector leads 34, 36 and thus connect to the additional
conductive layers 21, 30. FIG. 9 illustrates connection between an
electrical component and conductive layers using connection leads
attached onto the inner surface of the housing. The receiver 26 is
connected to the conductive layers 21, 30 using connector leads 34,
36. The connector leads 34, 36 are attached to the housing 10 of
the hearing aid device 12 and are conductively connected to the
conductive layers 21, 30. The connector leads 34, 36 may be
attached to the housing 10 during fabrication of the housing
12.
[0065] Referring now to FIG. 7 and FIGS. 10a through 10b, in
another implementation soft ring 42 may be used to connect the
receiver 26 to the conductive layers 21, 30 and also to suspend the
receiver 26 rigidly. FIG. 10a illustrates connection between an
electrical component and conductive layers attached onto the inner
surface of the housing of the hearing aid device using soft rings.
In the shown example of FIG. 10a, a receiver 26 is connected to the
additional conductive layers 21, 30 using soft rings 42. FIG. 10b
illustrates a soft ring 42 in detail. The soft ring 42 comprises
conductive medium 44 which are connected to the additional
conductive layers 21, 30 of FIG. 10a. The conductive mediums 44
connect to a connection pad 46 on the soft ring 42 and the
connection pad 44 connects to the contact terminal of the receiver
26 of FIG. 10a. The multiple conductive mediums 44 enable multiple
connections between the receiver 26 and the conductive layers 21,
30. This increases the fault tolerance of the hearing aid device 12
as redundant connections may be made to an electrical component. In
the shown example of FIG. 10a, the receiver 26 is held in a
suspended position rigidly and thus reduces the chances of device
failure due to shock and vibration.
[0066] Referring again to FIG. 7, another electrical component, for
example, an amplifier 24 may be connected to the conductive layers
21, 30 using connector leads 38, 40. Soft rings 42 of FIG. 10a and
FIG. 10b may also be used to connect the amplifier 24 to the
conductive layers 21, 30. Thus, connecting the receiver 26 and the
amplifier 24 to the conductive layers 21, 30 enable conductively
connecting the receiver 26 to the amplifier 24 without the
requirement of loose wire leads. Moreover, the connector leads 34,
36 hold the receiver 26 in a suspended position which is rigid and
reduce shocks and vibrations encountered by the receiver 26 due to
the movement of the user of the hearing aid device. Suspending the
receiver 26 inside the housing 10 eliminates the need of extra
caution to be taken while the hearing aid device is being
manufactured. Alternatively, the manufacturing time for the hearing
aid device 12 is reduced.
[0067] In an embodiment, a face plate 23 is provided at the distal
end of the hearing aid device 12. Typically, the amplifier 24 is
mounted onto the face plate 23. In an implementation, the face
plate 22 and the amplifier 24 may also be printed using the solid
freeform techniques.
[0068] Still referring to FIG. 7, preferably, the additional
conductive layers 21, 30 are attached onto the inner surface 16 of
the second non-conductive layer 15 by fabricating the housing 10
and the conductive layers 21, 30. While fabricating the housing 22,
the conductive layers 21, may be fabricated onto the inner surface
16 of the second non-conductive layer 15. In certain implementation
additional non-conductive layers of the housing 10 may be
fabricated onto the inner surface 16 to which the conductive layers
18, 30 are fabricated. Additional non-conductive layers of the
housing 10 may be fabricated for fabricating multiple layers of
additional conductive layers or for providing insulation as the
housing 10 is manufactured using a non-conducting material.
[0069] Multiple additional conductive layers one above the other
may also be provided. Advantageously, one additional conductive
layer may be separated from another by an insulating medium.
Alternatively an insulating layer may be attached onto the inner
surface 16 of the second non-conductive layer 15 to separate two
additional conductive layers. In an example, if the additional
conductive layers are conductive pathways, the point of
intersection of two additional conductive layers may be separated
by having an insulating layer therein. FIG. 11a illustrates
separation of a plurality of additional conductive layers using
insulating mediums. A plurality of additional conductive layers 21a
through 21e are separated from each other using insulating mediums
32a through 32f respectively. In the example of FIG. 11b, an
enlarged side view of the encircled area of FIG. 11a is shown. It
is seen that the additional conductive layers 21a and 21b are
separated by the insulating medium 32a. The insulating medium 32a
enables to prevent conduction between the additional conductive
layers 21a and 21b. Thus, multiple additional conductive layers may
be printed by having respective insulating mediums between
them.
[0070] Referring now to FIG. 11a and FIG. 11b, in an implementation
the conductive layers 21a through 21e may be filaments and the
point of intersections can be separated by having insulating
mediums 32a through 32f therein.
[0071] In another embodiment, the electrical components may be
fixedly positioned onto the inner surface comprising the conductive
layers. The conductive layers may be extended onto the outer
surface of a casing of the electrical component and thus complete
the connection. FIG. 12a illustrates connection between two
electrical components using the additional conductive layers
attached onto the inner surface of the second non-conductive layer
of the housing of the hearing aid device and extended onto an the
outer surface of the casing. In the shown example of FIG. 12a,
electrical components, for example, a receiver 26 and an amplifier
24 may be held fixedly onto the inner surface 16 of the second
non-conductive layer 15. The conductive layers 21, 30 may be
printed onto the inner surface 16 of the second non-conductive
layer 15 and onto the outer surface 48 of the casing 50 of the
receiver 26 and the amplifier 24 to connect the receiver 26 and the
amplifier 24. Alternatively, the additional conductive layers 21,
30 may be conductively connected to a single electrical component
to provide power to the electrical component. The conductive layers
21, 30 printed onto the outer surface 48 of the casing 50 make
contact with connection pads 52 to connect the receiver 26 to the
conductive layers 21, 30. An insulating medium 32 may be provided
between the conductive layers 21, 30 for separating the conductive
layers 21, 30. Preferably, the insulating medium 32 is provided at
the point of intersection of the conductive layers 21, 30. However,
the insulating medium 32 may be provided over the entire surface
also. Preferably, in the present embodiment, the conductive layers
21, 30 are conductive pathways printed onto the inner surface 16 of
the second non-conductive layer 15 and the outer surface 48 of the
casing 50 of the receiver 26.
[0072] FIG. 12b illustrates a side view of the connection between
the electrical components using the conductive layers of FIG. 12a.
In the example of FIG. 12b, only the conductive layer 21 is
illustrated for understanding purposes. It is seen that the
conductive layer 21 is printed onto the inner surface 16 and over
the outer surface 48 of the casing 50 of the amplifier 24 and the
receiver 26. The present embodiment provides the advantage of
connecting an electrical component to the conductive layers 21, 30
by printing the conductive layers 21, 30 on the outer surface 48 of
the casing 50 of the electrical component.
[0073] FIG. 13 illustrates connection between an electrical
component and a conductive layer using a casing of the electrical
component. Preferably, the conductive layer 21 extends over a
substantial surface area of the inner surface 16 of the second
non-conductive layer 15. However, the conductive layer 21 may
extend over only a particular portion or region of the inner
surface 16. In the present example, the conductive layer 21 may be
adapted to operate either as a positive contact or a negative
contact. The electrical component, for example the receiver 26
comprises a casing 53 having a conductive outer surface 54. The
receiver 26 is fixedly positioned onto the conductive layer 21
attached onto the inner surface 16 such that the outer surface 54
of the casing 53 of the receiver 26 is in contact with the
conductive layer 21. The receiver 26 is shown for the purposes of
illustration only and other electrical components may also be
positioned onto the conductive layer 21. Internally, the outer
surface 54 of the casing 53 may be connected to a connection point
so that the outer surface 54 of the casing 53 is connected to the
internal circuitry of the electrical component, i.e., the receiver
26. In an alternative embodiment, the casing 53 may be made using a
conductive material such that the outer surface 54 and an inner
surface of the casing 53 are conductive. In an implementation, only
a portion of the outer surface 54 of the casing 53 may be
conductive. If only a portion of the outer surface 54 of the casing
53 is conductive, it may be required that the receiver 26 be
positioned onto the conductive layer 21 such that the conductive
portion of the outer surface 54 of the casing 53 in is contact with
the conductive layer 21. Accordingly, the electrical component may
be conductively connected to the conductive layer 21. Additionally,
one electrical component may be conductively connected to another
electrical component using the conductive layer 21.
[0074] For an example, the conductive layer 21 may be adapted to
operate as a common ground and the outer surface 54 of the casing
53 may be connected to the conductive layer 21 to connect the
electrical component to the ground. Alternatively, the conductive
layer 21 may be adapted to operate as a positive contact and the
outer surface 54 of the casing 53 may be connected to the
conductive layer 21 to connect the electrical component to a
positive contact.
[0075] In an embodiment, the housing 22 may comprise a slot to
receive an electrical component, for example the receiver 26. FIG.
14 illustrates a side view of a slot 55 on the inner side 56 of the
housing 10. The slot 55 is provided on the inner side 56 of the
housing 10. The electrical component when positioned into the slot
55 is conductively connected to the conductive layer 21. The
conductive layer 21 may be attached onto a substantial area of the
inner surface 16 of the second non-conductive layer 15, including
the slot 55. Alternatively, the conductive layer 21 may be attached
onto a portion of the inner surface 16 only within the slot 55.
[0076] This enables in reducing the requirement of loose wire leads
and thus reduces the electromagnetic interference within the
hearing aid device. Additionally, as there is no requirement of
soldering, the manufacturing time is reduced and also there is
possibility of miniaturizing the hearing aid device as the area
covered by a soldering point is substantially large.
[0077] FIG. 15 is a cross sectional view of the housing of the
hearing aid device illustrating a coil provided on the first
non-conductive layer. In the shown example of FIG. 15, a coil 58 is
provided on the first non-conductive layer 14 of the housing 10.
Typicaaly, the coil 58 comprises a structure of a helix and spirals
around the non-conductive layer 14 of the housing 10. The housing
10 may comprises an additional non-conductive layer 60 over the
coil 58. The additional non-conductive layer 60 prevents the coil
58 from being damaged and also prevents inconvenience to the user
of the hearing aid device 12 due to the presence of the coil
58.
[0078] The coil 58 may be used for wireless communication or for
wireless charging of the hearing aid device 12. This enables
efficient use of the inner space 20 of FIG. 1 of the hearing aid
device 12, and thus, enables miniaturization of the hearing aid
device 12. Additionally, as the coil 58 is provided external to the
first conductive layer 18, the inner space 20 is shielded from any
EMI arising out of the coil 58 by the first conductive layer
18.
[0079] Referring now to FIG. 1 through FIG. 15, the housing 10 of
the hearing aid device 12 is manufactured by embedding the first
conductive layer 18 between the first non-conductive layer 14 and
the second non-conductive layer 15. Advantageously, the conductive
layer 18 is embedded between the first non-conductive layer 14 and
the second non-conductive layer 15 using a solid freeform
fabrication technique. The solid freeform fabrication technique
includes, but not limited to inkjet printing, pneumatic spraying,
screen printing, pad printing, laser printing, dot matrix printing,
thermal printing, lithography, and 3D printing. Solid freeform
fabrication technique provides the advantages of enabling the
manufacturing of the first conductive layer 18, the first
non-conductive layer 14 and the second non-conductive layer 15
simultaneously such that the housing 22 comprises the first
conductive layer 18 between the first non-conductive layer 14 and
the second non-conductive layer 15. This decreases the
manufacturing time of the hearing aid device 1 and also reduces the
complexities. Moreover, using solid freeform fabrication technique
to manufacture the housing 10 eliminates the requirement for having
separate moulds for individual hearing aid device 12 design.
However, the housing 10 may be manufactured using other
manufacturing techniques such as MID and inset molding. If the
hearing aid device is manufactured using a MID or an inset molding
technique, a mould may be required to be created for each hearing
aid device. Additionally, the manufacturing time of the hearing aid
device 12 may be increased as the conductive layer 18, the first
non-conductive layer 14 and the second non-conductive layer 15 will
have to be manufactured one at a time.
[0080] In a preferred embodiment, the housing 10 is fabricated a 3D
printing technology. Solid freeform fabrication techniques, such as
the 3D printing technology enables fabricating a product using
multiple materials. For example, a first printer head may print the
first non-conductive layer 14 of the housing, a second printer head
may print the conductive layer 18 and a third printer head may
print the second non-conductive layer 15. The first printer head
may be used to print the second non-conductive layer 15 as
typically, the first conductive layer 14 and the second conductive
layer 15 comprises the same non-conducting materials. The printing
is done by fabricating layers one after the next successively in
physical space until the model or the product is completed.
[0081] For example, the conductive layer 18, the first conductive
layer 18, the first non-conductive layer 14 and the second
non-conductive layer 15 may be printed by the respective printer
heads by dispersion of suitable respective printing compositions.
The printing composition for printing the non-conductive layers 14,
15 may comprise particles of non-conducting elements, for example a
resin. The printing composition for printing the conductive layer
18 may comprise particles of conductive elements, such as copper,
gold, silver, electrically conductive polymer, and the like. The
respective printing compositions for printing the non-conductive
layers 14, 15 and the conductive layer 18 may comprise
nanoparticles of elements suitable for printing the respective
layers. The conductive layer 21 may be printed onto the inner
surface 16 of the second non-conductive layer 15 in a similar
manner. Also the coil 58 and the additional non-conductive layer 60
may be printed in a similar manner.
[0082] Solid freeform fabrication techniques, such as the 3D
printing technology enables fabricating a product using multiple
materials. It will be apparent to a person skilled in the art that
the layers of the housing 10 and the conductive layer 18 may be
printed simultaneously using freeform fabrication techniques using
the respective printing heads such that the end product is the
housing 10 having the conductive layer 18 between the first
non-conducive layer 14 and the second non-conductive layer 15.
[0083] FIGS. 16a through 16c illustrate a method of manufacturing a
housing of a hearing aid device according to an embodiment herein.
Referring now to FIG. 16a a first non-conductive layer 14 of the
housing 10 of FIG. 1 is printed. The first non-conductive layer 14
comprises an inner surface 66 and an outer surface. Next, as
illustrated in FIG. 16b, a conductive layer 18 is printed onto the
inner surface 66 of the first non-conductive layer 14. The
conductive layer 18 comprises an inner surface 68. In FIG. 16c, a
second non-conductive layer 15 is printed onto an inner surface 68
of FIG. 16b of the conductive layer 18. Thus the conductive layer
18 is positioned between the first non-conductive layer 14 and the
second non-conductive layer 15.
[0084] Thus, the conductive layer 18 is embedded between the first
non-conductive layer 14 and the second non-conductive layer 15 of
the housing 10.
[0085] The embodiments described herein provide a shielding layer
for shielding the inner space of the hearing aid device from EMI.
The inner space of the hearing aid device accommodates electrical
components essential for the hearing aid function. Moreover, this
enables efficient use of the inner space of the housing and thus
enables the design of the hearing aid device to me more compact.
Additionally, the requirement of loose wire leads to connect
electrical components of a hearing aid device may be eliminated.
Moreover, the manufacturing time of the hearing aid device is
reduced. Eliminating the need of loose wire leads also enables the
electronic component to be inserted independently into the housing
during manufacturing of the hearing aid device, and thus
eliminating the extra caution required during manufacturing.
Moreover, certain embodiments provide a means to suspend the
receiver rigidly so that the possibility of the failure of the
hearing aid device is reduced. Suspension of the receiver
independently enables the receiver to be pushed into position and
thus enable easy repairing of the hearing aid device. Additionally,
the elimination of loose wire leads enable in reducing the
electromagnetic interference within the hearing aid device.
Militarization of the hearing aid device is also possible as the
requirement of soldering is eliminated.
[0086] While this invention has been described in detail with
reference to certain preferred embodiments, it should be
appreciated that the present invention is not limited to those
precise embodiments. Rather, in view of the present disclosure
which describes the current best mode for practicing the invention,
many modifications and variations would present themselves, to
those of skill in the art without departing from the scope and
spirit of this invention. The scope of the invention is, therefore,
indicated by the following claims rather than by the foregoing
description. All changes, modifications, and variations coming
within the meaning and range of equivalency of the claims are to be
considered within their scope.
LIST OF REFERENCE SIGNS
[0087] 10 Housing [0088] 12 Hearing aid device [0089] 14 First
non-conductive layer [0090] 15 Second non-conductive layer [0091]
15 Inner surface [0092] 18 Conductive layer [0093] 20 Inner space
[0094] 21 30 Additional conductive layers [0095] 22 Microphone
[0096] 23 Face plate [0097] 24 Amplifier [0098] 26 Receiver [0099]
28 Power source [0100] 32 Insulating medium [0101] 34 36 Connector
leads [0102] 38 40 Connector leads [0103] 42 Soft ring [0104] 44
Conductive medium [0105] 46 Connection pad [0106] 48 Outer surface
of the casing 50 [0107] 50 Casing [0108] 52 Connection pad [0109]
53 Casing [0110] 54 Outer surface of the casing 53 [0111] 55 Slot
[0112] 56 Inner side [0113] 58 Coil [0114] 60 Third non-conductive
layer [0115] 66 Inner surface of the first non-conductive layer 15
[0116] 68 Inner surface of the conductive layer 18
* * * * *