U.S. patent application number 13/420865 was filed with the patent office on 2012-09-20 for mm-wave phased array antenna and system integration on semi-flex packaging.
Invention is credited to Bryce Horine, Helen K. Pan, Shmuel Ravid, Mark Ruberto.
Application Number | 20120235881 13/420865 |
Document ID | / |
Family ID | 46828033 |
Filed Date | 2012-09-20 |
United States Patent
Application |
20120235881 |
Kind Code |
A1 |
Pan; Helen K. ; et
al. |
September 20, 2012 |
MM-WAVE PHASED ARRAY ANTENNA AND SYSTEM INTEGRATION ON SEMI-FLEX
PACKAGING
Abstract
Embodiments of wireless antenna array systems to achieve
three-dimensional beam coverage are described herein. Disclosed is
an integrated multiple phased antenna array on a flexible substrate
with one RFIC. In this way the module can be molded onto the
contour of a platform such as a notebook or a hub of the personal
area network or local area network. The multiple phased array can
be 3D bent in a compact size to fit into thin mobile platforms.
Different array antennas or antennas radiate in different spherical
directions with beam scanning capabilities while driven
simultaneously by one RFIC chip.
Inventors: |
Pan; Helen K.; (Saratoga,
CA) ; Ruberto; Mark; (Haifa, IL) ; Horine;
Bryce; (Portland, OR) ; Ravid; Shmuel; (Haifa,
IL) |
Family ID: |
46828033 |
Appl. No.: |
13/420865 |
Filed: |
March 15, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61452754 |
Mar 15, 2011 |
|
|
|
Current U.S.
Class: |
343/893 |
Current CPC
Class: |
H05K 999/99 20130101;
H04B 7/0413 20130101; H01Q 3/34 20130101; H01Q 13/16 20130101; H01Q
3/36 20130101; H01Q 7/00 20130101; H01P 11/001 20130101; H01Q
1/2266 20130101; H01Q 1/20 20130101; H01Q 25/00 20130101; Y10T
29/49016 20150115; H01Q 1/2291 20130101; H01Q 21/064 20130101; H01Q
21/067 20130101; H04B 7/10 20130101; H01Q 21/0087 20130101; H01Q
13/085 20130101; H01Q 21/24 20130101; Y10T 29/49018 20150115 |
Class at
Publication: |
343/893 |
International
Class: |
H01Q 21/00 20060101
H01Q021/00 |
Claims
1. A millimeter-wave (mm-wave) communications device, comprising:
an antenna module comprising a plurality of mm-wave antennas on a
substrate, wherein the substrate can be molded or bent to radiate
in different spherical directions; and an integrated circuit on the
substrate connected to the plurality of mm-wave antennas through a
transmission line; wherein the integrated circuit is configured to
communicate using mm-wave signals.
2. The millimeter-wave communications device of claim 1, wherein
the integrated circuit is selected from a group consisting of radio
frequency integrated circuit (RFIC), baseband integrated circuit
(BBIC), or a combination thereof.
3. The millimeter-wave communications device of claim 2, wherein
the transmission line connecting the plurality of mm-wave antennas
is routed to equalize delays in the antenna module.
4. The millimeter-wave communications device of claim 2, wherein
the RFIC comprises a splitter to combine signals directed from the
plurality of mm-wave antennas and to divide a signal into a
plurality of signals to drive the antenna module.
5. The millimeter-wave communications device of claim 4, wherein
the integrated circuit is attached to the substrate by a technique
selected from chip and wire assembly, chip-on-board assembly, or
flip-chip assembly.
6. The millimeter-wave communications device of claim 5, wherein
the substrate is made from a material selected from a group
consisting of liquid crystal polymer, Teflon, Low Temperature
Co-fired Ceramic, alumina, antenna grade core materials and
laminates, duroid, high-resistivity silicon or one or more other
suitable substrates for mm-wave applications.
7. The millimeter-wave communications device of claim 6, wherein
the integrated circuit is anchored to a lower layer substrate
selected from a group consisting of printed circuit board (PCB),
glass fiber board (FR-4), temperature-resistant glass fiber board
(FR-5), ceramic substrate, metal-core PCB (MCPCB), direct copper
bonded (DCB) substrate, metal composite board, copper-coated
aluminum board, and aluminum board.
8. A communication system adapted to be installed in an electronic
device to communicate with other electronic devices comprising: an
interface adapted to transfer and to receive signals at a first
frequency from an antenna module; and the antenna module
comprising: at least one antenna array comprising a plurality of
mm-wave antennas on a substrate, wherein the substrate can be
molded or bent to radiate in different spherical directions; an
integrated circuit on the substrate connected to the plurality of
mm-wave antennas through a transmission line; wherein the
integrated circuit is configured to exchange signals between the
interface and the antenna module, and to communicate with other
electronic devices using mm-wave signals.
9. The communication system of claim 8, wherein the integrated
circuit is a radio frequency integrated circuit (RFIC) and wherein
the interface is baseband integrated circuit (BBIC).
10. The communication system of claim 9, wherein the transmission
line connecting the plurality of mm-wave antennas is routed to
equalize delays in the at least one antenna array.
11. The communication system of claim 9, wherein the RFIC comprises
a splitter to combine signals directed from the plurality of
mm-wave antennas and to divide a signal into a plurality of signals
to drive the plurality of mm-wave antennas.
12. The communication system of claim 11, wherein the integrated
circuit is attached to the substrate by a technique selected from
chip and wire assembly, chip-on-board assembly, or flip-chip
assembly.
13. The communication system of claim 12, wherein the substrate is
made from a material selected from a group consisting of liquid
crystal polymer, Teflon, Low Temperature Co-fired Ceramic, alumina,
antenna grade core materials and laminates, duroid,
high-resistivity silicon or one or more other suitable substrates
for mm-wave applications.
14. The communication system of claim 13, wherein the integrated
circuit is anchored to a lower layer substrate selected from a
group consisting of printed circuit board (PCB), glass fiber board
(FR-4), temperature-resistant glass fiber board (FR-5), ceramic
substrate, metal-core PCB (MCPCB), direct copper bonded (DCB)
substrate, metal composite board, copper-coated aluminum board, and
aluminum board.
15. A multipoint wireless communications device installed in an
electronic device to communicate with other electronic devices
comprising: a flexible substrate comprising an antenna module with
a plurality of mm-wave antennas, wherein the flexible substrate
comprises a pliable material that can be configured to alter the
radiation pattern of the antenna array module; and an integrated
circuit on the flexible substrate connected to the plurality of
mm-wave antennas through a transmission line; wherein the
integrated circuit is configured to communicate using mm-wave
signals.
16. The multipoint wireless communications device of claim 15,
wherein the integrated circuit is selected from a group consisting
of radio frequency integrated circuit (RFIC), baseband integrated
circuit (BBIC), or a combination thereof.
17. The multipoint wireless communications device of claim 16,
wherein the transmission line connecting the plurality of mm-wave
antennas is routed to equalize delays in the antenna array.
18. The multipoint wireless communications device of claim 16,
wherein the RFIC comprises a splitter to combine signals directed
from the plurality of mm-wave antennas and to divide a signal into
a plurality of signals to drive the antenna array.
19. The multipoint wireless communications device of claim 18,
wherein the integrated circuit is attached to the substrate by a
technique selected from chip and wire assembly, chip-on-board
assembly, or flip-chip assembly.
20. The multipoint wireless communications device of claim 19,
wherein the substrate is made from a material selected from a group
consisting of liquid crystal polymer, Teflon, Low Temperature
Co-fired Ceramic, alumina, antenna grade core materials and
laminates, duroid, high-resistivity silicon or one or more other
suitable substrates for mm-wave applications.
21. The multipoint wireless communications device of claim 20,
wherein the integrated circuit is anchored to a lower layer
substrate selected from a group consisting of printed circuit board
(PCB), glass fiber board (FR-4), temperature-resistant glass fiber
board (FR-5), ceramic substrate, metal-core PCB (MCPCB), direct
copper bonded (DCB) substrate, metal composite board, copper-coated
aluminum board, and aluminum board.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional
Application No. 61/452,754, entitled "ANTENNA ARCHITECTURE, ANTENNA
SYSTEM AND A METHOD THEREOF," filed Mar. 15, 2011, the entire
disclosure of which is incorporated herein by reference in its
entirety.
BACKGROUND
[0002] 1. Field of the Disclosed Embodiments
[0003] The present invention relates generally to mm-wave receivers
and transmitters in general and particularly to an integrated
mm-wave device that employs a phased array.
[0004] 2. Introduction
[0005] In recent years, the operating frequency of commercial
communications and radar applications has also increased towards
the upper end of the radio frequency spectrum, including operation
at mm wavelengths. With the silicon chip assuming greater
functionality at higher frequencies in a smaller area at a lower
cost, it is becoming economically feasible to manufacture
high-frequency wideband ICs for both commercial and consumer
electronic applications. High-frequency wideband IC applications
now include millimeter (mm) wave applications such as short range
communications at 24 GHz and 60 GHz and automotive radar at 24 GHz
and 77 GHz.
[0006] Technological developments permit digitization and
compression of large amounts of voice, video, imaging, and data
information. The need to transfer data between devices in wireless
mobile radio communication requires reception of an accurate data
stream at a high data rate. It would be advantageous to provide
antennas that allow radios, especially wireless mobile devices, to
handle the increased capacity while providing an improved quality
that achieves antenna coverage in both azimuth and elevation. It
would also be advantageous to provide mobile internet devices
and/or access points with a smaller form factor that incorporates
integrated, compact, high performance antennas.
DETAILED DESCRIPTION OF THE DISCLOSED EMBODIMENTS
[0007] The subject matter regarded as the invention is particularly
pointed out and distinctly claimed in the concluding portion of the
specification. The invention, however, both as to organization and
method of operation, together with objects, features, and
advantages thereof, may best be understood by reference to the
following detailed description when read with the accompanying
drawings in which:
[0008] FIG. 1 is a block diagram illustrating devices using
extremely high frequency radio signals to communicate in a wireless
network in accordance to an embodiment;
[0009] FIG. 2 is a block diagram of an N element mm-wave
transceiver RFIC architecture in accordance to an embodiment;
[0010] FIG. 3 is an illustration of a conformal antenna module
using semi-flex packaging with flexible layers on the top for
antenna integration and FR-4 packaging below in accordance to an
embodiment;
[0011] FIG. 4 is an illustration mm-wave phased antenna array on
flexible substrate is integrated with BBIC/RFIC on standard FR-4
stackup in accordance to an embodiment;
[0012] FIG. 5 is an illustration of an antenna module consisting of
a 2.times.8 rectangular array on the top and a 2.times.8
rectangular array to provide top and front area beam scan coverage
in accordance to an embodiment;
[0013] FIG. 6 is an illustration of a 3D phased antenna array
wrapping to provide top, side, and front spatial coverage in
accordance to an embodiment;
[0014] FIG. 7 is an illustration of a 3D phased antenna array
wrapping with an attached single high gain antenna to provide top,
side, and front spatial coverage in accordance to an
embodiment;
[0015] FIG. 8 shows a pair of co-linear mm-wave taper slot antenna
array (2.times.8) and associated radiation pattern in accordance to
an embodiment;
[0016] FIG. 9 illustrates the relationship between phased array
antenna configuration and scan angle in accordance to an
embodiment;
[0017] FIG. 10 shows a slot loop antenna and associated radiation
pattern in accordance to an embodiment; and
[0018] FIG. 11 shows a phased antenna array (2.times.8) bent
slightly up to provide a desired coverage and the array's scanning
radiation pattern for mm-wave applications in accordance to an
embodiment.
[0019] The term PBSS control point (PCP) as used herein, is defined
as a station (STA) that operates as a control point of the mmWave
network.
[0020] The term access point (AP) as used herein, is defined as any
entity that has STA functionality and provides access to the
distribution services, via the wireless medium (WM) for associated
STAs.
[0021] The term wireless network controller as used herein, is
defined as a station that's operates as PCP and/or as AP of the
wireless network.
[0022] The term directional band (DBand) as used herein is defined
as any frequency band wherein the Channel starting frequency is
above 45 GHz.
[0023] The term DBand STA as used herein is defined as a STA whose
radio transmitter is operating on a channel that is within the
DBand.
[0024] The term personal basic service set (PBSS) as used herein is
defined as a basic service set (BSS) which forms an ad hoc
self-contained network, operates in the DBand, includes one PBSS
control point (PCP), and in which access to a distribution system
(DS) is not present but an intra-PBSS forwarding service is
optionally present.
[0025] The term scheduled service period (SP) as used herein is
scheduled by a quality of service (QoS) AP or a PCP. Scheduled SPs
may start at fixed intervals of time, if desired.
[0026] The terms "traffic" and/or "traffic stream(s)" as used
herein, are defined as a data flow and/or stream between wireless
devices such as STAs. The term "session" as used herein is defined
as state information kept or stored in a pair of stations that have
an established a direct physical link (e.g., excludes forwarding);
the state information may describe or define the session.
[0027] The term "wireless device" as used herein includes, for
example, a device capable of wireless communication, a
communication device capable of wireless communication, a
communication station capable of wireless communication, a portable
or non-portable device capable of wireless communication, or the
like. In some embodiments, a wireless device may be or may include
a peripheral device that is integrated with a computer, or a
peripheral device that is attached to a computer. In some
embodiments, the term "wireless device" may optionally include a
wireless service
[0028] The embodiments of the invention described herein may
include an active conformal phased array antenna module for 60 GHz
Wireless personal area network and/or a wireless local area network
(WPAN/WLAN) communication systems. The design approach described
here is guided by the need to deploy as few active antenna modules
at 60 GHz as possible on a platform to get full, or pseudo-omni
coverage with low cost and low power consumption in high volume
manufacture production.
[0029] An exemplary embodiment of the invention may include a
notebook, and/or notebook platform, which is assumed to be the hub
of the personal area network or local area network, although the
scope of the invention is not limited in this respect. Embodiments
of the invention may be equally applied to handheld, tablet and any
other communication device, if desired.
[0030] Although the scope of the present invention is not limited
in this respect, the best approach with the given technology for
cost reduction may be to have a number of antennas printed on to a
single thin conformal (flexible) package material that may be
molded onto the contour of the platform while driven with a single
radio frequency integrated circuit (RFIC) chip, if desired.
[0031] For example, to print a number of phased array or fixed
antennas onto a single material flexible substrate may enable
different array antennas and/or other types of antennas to radiate
in different spherical directions with beam scanning capabilities
while driven simultaneously by a single RFIC chip. Implemented the
digital signal processing algorithms within the RFIC chip may
enable seamless beam scanning across different orthogonal
directions. In this approach, the single mm-wave module has
capability to provide complete quasi-omni coverage in all the
directions. The only requirement is that one region of the platform
needs to be rugged enough to accommodate the flip chip attachment
of the RFIC to the platform and to allow porting of all of the
digital/bias and RF low intermediate frequency (IF) frequency
signals as well as cable ports and/or solder landing pads to
accommodate attachment of external cabling. For example, the RFIC
may include an integrated mm-wave transceiver and the phase array
antenna may include a conformal antenna.
[0032] It should be understood that the present invention may be
used in a variety of applications. Although the present invention
is not limited in this respect, the circuits and techniques
disclosed herein may be used in many apparatuses such as stations
of a radio system. Stations intended to be included within the
scope of the present invention include, by way of example only,
WLAN stations, wireless personal network (WPAN), and the like.
[0033] Types of WPAN stations intended to be within the scope of
the present invention include, although are not limited to,
stations capable of operating as a multi-band stations, stations
capable of operating as PCP, stations capable of operating as an
AP, stations capable of operating as DBand stations, mobile
stations, access points, stations for receiving and transmitting
spread spectrum signals such as, for example, Frequency Hopping
Spread Spectrum (FHSS), Direct Sequence Spread Spectrum (DSSS),
Complementary Code Keying (CCK), Orthogonal Frequency-Division
Multiplexing (OFDM) and the like.
[0034] Additional features and advantages of the disclosure will be
set forth in the description which follows, and in part will be
obvious from the description, or may be learned by practice of the
disclosure. The features and advantages of the disclosure may be
realized and obtained by means of the instruments and combinations
particularly pointed out in the appended claims. These and other
features of the present disclosure will become more fully apparent
from the following description and appended claims, or may be
learned by the practice of the disclosure as set forth herein.
[0035] Various embodiments of the disclosure are discussed in
detail below. While specific implementations are discussed, it
should be understood that this is done for illustration purposes
only. A person skilled in the relevant art will recognize that
other components and configurations may be used without parting
from the spirit and scope of the disclosure.
[0036] Although embodiments of the invention are not limited in
this regard, discussions utilizing terms such as, for example,
"processing," "computing," "calculating," "determining,"
"applying," "receiving," "establishing", "analyzing", "checking",
or the like, may refer to operation(s) and/or process(es) of a
computer, a computing platform, a computing system, or other
electronic computing device, that manipulate and/or transform data
represented as physical (e.g., electronic) quantities within the
computer's registers and/or memories into other data similarly
represented as physical quantities within the computer's registers
and/or memories or other information storage medium that may store
instructions to perform operations and/or processes.
[0037] Although embodiments of the invention are not limited in
this regard, the terms "plurality" and "a plurality" as used herein
may include, for example, "multiple" or "two or more". The terms
"plurality" or "a plurality" may be used throughout the
specification to describe two or more components, devices,
elements, units, parameters, or the like. For example, "a plurality
of resistors" may include two or more resistors. The term coupled
as used herein, is defined as operably connected in any desired
form for example, mechanically, electronically, digitally,
directly, by software, by hardware and the like.
[0038] FIG. 1 is a schematic block diagram of a wireless
communication system 100 in accordance to an embodiment. The system
100 comprises a pair of multi-band capable stations 102 and 104
such as peer Quality of Service (QSTAs) stations. Although only two
stations (STAs) are shown for simplicity, the invention is not
limited to any particular number of STAs. Using the first
multi-band capable station 102 as an example, each STA includes a
station management entity (SME) 126 and 146 having a MAC interface
(not shown) for transceiving primitives, a processor 120 to convert
between primitives and MAC frames, and a physical layer interface
(not shown) to transceive primitive-converted MAC frames. A
physical layer (PHY) entity 116 has a MAC interface (not shown) to
transceive MAC frames and a physical layer interface on line (not
shown) connected to a peer STA PHY entity such as STA 104 to
transceive physical layer communications.
[0039] Typically, the PHY entities (116 in STA 102 and 104)
communicate via a wireless link represented by reference designator
121 through antenna 160 (STA 102) and antenna 260 (STA 104)
comprising antennas printed on to a single thin conformal
(flexible) package material that can be molded onto the contour of
the platform while driven with one RFIC 250 which in association
with the antenna array perform the function of transmitter 140 and
receiver 150. Antenna 160 or 260 may include an internal and/or
external RF antenna, for example, a dipole antenna, a monopole
antenna, an omni-directional antenna, an end fed antenna, a
circularly polarized antenna, a micro-strip antenna, a diversity
antenna, or any other type of antenna suitable for transmitting
and/or receiving wireless communication signals, blocks, frames,
transmission streams, packets, messages and/or data. In some
embodiments, station 110 may include for example one or more
processors 120, one or more memory units 130, one or more
transmitters 140, one or more receivers 150, and one or more
antennas 160 or 260. Station 110 may further include other suitable
hardware components and/or software components. While the RFIC 250
and antenna 260 are shown as discrete components it is contemplated
that these devices can be integrated into a single substrate and
that other components can be added or remove without affecting the
functionality of the devices. Additionally, the RFIC 250 may
include an integrated mm-wave transceiver and the antenna 260 may
include a conformal antenna. Implementing digital signal processing
algorithms within the RFIC 250 enables seamless a single mm-wave
module to provide complete quasi-omni coverage in all the
directions.
[0040] Processor 120 may include, for example, a Central Processing
Unit (CPU), a Digital Signal Processor (DSP), a microprocessor, a
controller, a chip, a microchip, an Integrated Circuit (IC), or any
other suitable multi-purpose or specific processor or controller.
Processor 120 may, for example, process data received by station
102, and/or process data intended for transmission by station
102.
[0041] Memory unit 130 may include, for example, a Random Access
Memory (RAM), a Read Only Memory (ROM), a Dynamic RAM (DRAM), a
Synchronous DRAM (SD-RAM), a Flash memory, a volatile memory, a
non-volatile memory, a cache memory, a buffer, a short term memory
unit, a long term memory unit, or other suitable memory units or
storage units Memory unit 130 may, for example, store data received
by station 104, and/or store data intended for transmission by
station 102 and/or store instructions for carrying out the
operation of station 102 including for example embodiments of a
method described herein.
[0042] Transmitter 140, may include, for example, a wireless Radio
Frequency (RF) transmitter able to transmit RF signals, e.g.,
through antenna 160, and may be capable of transmitting a signal
generated by for example a Multi-Stream Multi-Band Orthogonal
Frequency Division Modulation (MSMB OFDM) system in accordance with
some embodiments of the present invention. Transmitter 140 may be
implemented using for example a transmitter, a transceiver, or a
transmitter-receiver, or one or more units able to perform separate
or integrated functions of transmitting and/or receiving wireless
communication signals, blocks, frames, transmission streams,
packets, messages and/or data. One approach to system
implementation can include a split module topology where baseband
signals (IF Signal) are modulated onto an IF carrier in a module
that may be physically remote from the antenna module platform
consisting of circuitry and antennas. The IF signal from the
baseband module is then ported to one or more conformal antenna
modules via cabling, and then up-converted to the desired frequency
such as 60 GHz by a radio frequency circuit that is integrated in
the conformal antenna module. The upconverted 60 GHz signal is then
split N times by splitter to drive N on-chip transceivers such as
the plurality of mm-wave antennas on a substrate. Each transceiver
is bidirectional containing a phase shifter 264 and low noise
amplifier (LNA) and/or power amplifier (PA) 266 like shown in FIG.
2.
[0043] Receiver 150 may include, for example, a wireless Radio
Frequency (RF) receiver able to receive RF signals, e.g., through
antenna 160, and may be capable of receiving a signal generated by
for example a Multi-Stream Multi-Band Orthogonal Frequency Division
Modulation (MSMB OFDM) system in accordance with some embodiments
of the present invention. Receiver 150 may be implemented using for
example a receiver, transceiver, or a transmitter-receiver, or one
or more units able to perform separate or integrated functions of
receiving and/or transmitting/receiving wireless communication
signals, blocks, frames, transmission streams, packets, messages
and/or data.
[0044] FIG. 2 is a block diagram of N element mm-wave transceiver
RFIC architecture in accordance to an embodiment. Each of the N
transceivers may be connected to an antenna element 260 in the
N-element phased array antenna. In one exemplary embodiment the
antenna module comprises a plurality of mm-wave antennas (N=32)
with a 2 GHz baseband signal that is modulated such as onto a 12
GHz carrier in a remote module like a baseband integrated circuit
(BBIC). The 12 GHz modulated signal may arrive to the conformal
antenna module and ported in the Si CMOS RFIC 250 at the IF Signal
IN/OUT port such as port 252 of the RFIC shown in the block diagram
of RFIC 250.
[0045] According to the exemplary embodiment in transmitter (TX) or
receiver (RX) mode, the single-ended 12 GHz modulated signal at
port 252 may be upconverted/downconverted to 60 GHz in the passive
bidirectional mixer 254. The signal then passes through a
bidirectional amplifier 258 and is split N times at splitter 262.
The phase of the signal is then controlled by a phase shifter 262
and passes through a PA/LNA 266 in TX/RX modes, respectively. The
signal then passes into the package material with integrated
antenna via a flip bump. An oscillator 256 generates an output
signal that is fed to the passive bidirectional mixer 254 to
upconvert/downconvert the IF signal at port 252. The oscillator 256
has an input/output port 257 to provide a sample output signal at
the same frequency as the upconverted signal (60 GHZ) or to receive
a signal from an external source such as a control signal. The
oscillator (crystal) 256 can be in a different package due to its
sensitivity to temperature variance. A balun circuit such as balun
253 may be used to balance signals between circuits. Also, omni RX
input signals can be further amplified through an amplifier circuit
such as amplifier 259.
[0046] FIG. 3 is an illustration of a conformal antenna module
using semi-flex packaging with flexible layers on the top for
antenna integration and FR-4 packaging below in accordance to an
embodiment. An RFIC 250 flip chip launched on conformal mm-wave
antenna modules is shown. The Figure illustrates the Direct Chip
Attachment (DCA) for RFIC 250 and BBIC 340 on a hybrid laminate
module (semi-flex packaging) substrate 310 such as PCIe card
module, but it could also be only an RFIC integrated on the module
with IF interface as descript in previous paragraphs concerning
FIG. 1. The RFIC 250 or BBIC 340 chips are flip-chip landed 350 on
conformal antenna module with die area routing. The antenna module
260 is built on top layer of the laminate packaging. While shown as
a single layer it may not be limited to single layer and may be
multiple flexible top layers. The top flexible layer may use low
tangent loss material to achieve lowest mm-wave loss and best
mm-wave antenna performance. There are various flexible material
substrate 310 which may be implemented on the top layers, such as,
liquid crystal polymer (LCP) such as Ultralam3000, polyimide,
Teflon, Low Temperature Co-fired Ceramic, alumina, antenna grade
core materials and laminates, duroid, high-resistivity silicon or
one or more other suitable substrates for mm-wave applications.
Under the die area, a standard FR-4 laminate 330 is positioned
below the flexible layers for digital/power/ground routing that are
not critical mm-wave RF signals and achieve lowest manufacture
cost. The RFIC 259 circuit is anchored to a bottom substrate such
as a glass fiber board like FR-4 packaging so that one region of
the platform (flexible substrate 310) is rugged enough to
accommodate the flip chip attachment of the RFIC to the platform
and to allow porting of all of the digital/bias and RF low
intermediate frequency (IF) frequency signals as well as cable
ports and/or solder landing pads to accommodate attachment of
external cabling. The RFIC 250 can also be anchored by other
substrates selected from a group consisting of printed circuit
board (PCB), temperature-resistant glass fiber board (FR-5),
ceramic substrate, metal-core PCB (MCPCB), direct copper bonded
(DCB) substrate, metal composite board, copper-coated aluminum
board, and aluminum board.
[0047] In this design approach, the mm-wave phased array antenna or
other any other antenna designs may be conformal to provide
flexibility to fit in any mobile platform such as a notebook or
mobile device and preserve best electromagnetic performance in term
of gain, bandwidth and scan-ability. An antenna element is
traditionally controlled by its own active device. However, the
active devices used in controlling the antenna elements can be
expensive, and in some cases may even require one or more stages of
amplifiers. Even when the active devices are relatively
inexpensive, the system may require a large digital memory to
support a large set of field of views (FOVs). For a phased array
system having a single controller, an issue is the signal delay in
the routing 320 between the different antenna array element arms.
To minimize delays the routing 320 is maintained substantially
equal distant to control group delay for broadband beam pattern
stability. The length of the line is chosen so that the antenna
element will be excited in-phase with the rest of the antenna
elements or when receiving signals from a communicating device so
that signals would substantially arrive at the RFIC 250 at the same
time. Depending on the topology, this requires transmission line
meandering to equalize the delay between the different arms in the
package.
[0048] FIG. 4 is an illustration mm-wave phased antenna array on
flexible substrate is integrated with BBIC/RFIC on standard FR-4
stackup in accordance to an embodiment. According to another
embodiment a phased antenna array implementation is provided. Since
the slot loop antenna array design is on a single layer dielectric
substrate, it can be implemented with an extended low cost flexible
layer combined with low cost FR-4 board/HDI (high density
interconnect) technology 330 for RFIC/BBIC 410 routing 320 as
shown. The phased antenna array may be bent into different
configurations such as bent 405 to be vertical for spatial coverage
and still preserve compact size. The whole mm-wave phased antenna
array including the integrated packaging and ICs can take the shape
of a compact form factor. The phased antenna array may also be
designed by splitting half of the array on each side of a flexible
substrate and finally bent together on the platform as shown in
FIG. 4. In this way there is easy trace routing and it also
minimizes antenna element coupling by feeding traces as shown with
respect to routing 320. The top half of the phased antenna array is
bent slightly up to provide coverage on the top that may not be
achieved with conventional phased array designs.
[0049] There are many antenna array designs which may be
implemented to provide broad spatial beam scan coverage. The
following figures, FIGS. 5-11, demonstrate many different antenna
array configurations to provide different spatial directivity gain
and spatial coverage. It is noted that the mm-wave antenna designs
and configuration are not limited the illustrations shown below.
Depending on the platform and application, it may be implemented in
many other ways to utilize the conformal antenna module.
[0050] FIG. 5 is an illustration of an antenna module consisting of
a 2.times.8 rectangular array on the top and a 2.times.8
rectangular array on the front to provide top and front area beam
scan coverage in accordance to an embodiment. The two 2.times.8
rectangular arrays provide equal gain and coverage to the top and
front as shown in top beam 430 and front area beam 440 scan
coverage. This topology can be implemented in a laptop lid or base
to provide spatial coverage away from the users. The RFIC 250 chip
is shown on the upper part of the antenna module near the bent
region 420 which separates the rectangular arrays. The arrays could
be further modified by having a single row array (1.times.8) and
adding a row to the front array (3.times.8). In this topology, the
top scan has same coverage with about 2 dB array gain degradation.
But since mm-wave application may be used in indoor environment.
The space coverage from the modified device may be less than (L.T.)
three meter range. On the other hand, the front coverage is
increased by using the additional elements rectangular array to
achieve higher gain.
[0051] FIG. 6 is an illustration of a 3D phased antenna array
wrapping to provide top, side, and front spatial coverage in
accordance to an embodiment. The embodiment in FIG. 6 integrates
multiple phased antenna arrays on a flexible substrate with a
single RFIC. In this way the module may be molded onto the contour
of the platform such as a laptop or notebook computer. The multiple
phased arrays may be 3D bent in a compact size to fit into thin
mobile platform. This embodiment provides a solution to integration
RFIC with phased antenna array and delivers quasi-omni mm-wave
spatial coverage. In order to achieve complete three dimensions
spatial coverage, the illustrated antenna configuration may be
used, if desired. Illustrated are four sub-arrays, a 2.times.8
rectangular array 604 to provide spatial coverage in the front 630,
a 1.times.8 linear array 602 to provide spatial coverage to the top
area 620, and two liner 1.times.4 arrays 605 to provide coverage at
short range on two sides 610. Using laptop as example, due to the
camera and microphone placement in the center of the lid, one of
the side linear array has much longer trace routing and higher path
loss on mm-wave trace. Even though, it still may provide array
gains (about 5-6 dB) incorporate longer trace loss. It may provide
coverage on the near by side device communication link. And also
the other end of communication link device may have much higher
antenna gain (about 10-15 dB) to enhance coverage area. It is also
may be implemented with a single high gain antenna on the right to
overcome the blockage from lid electronics placed in the center of
the laptop lid. The scan top 620, scan front 630, and scan size 610
spatial coverages are shown.
[0052] FIG. 7 is an illustration of a 3D phased antenna array
wrapping with an attached single high gain antenna to provide top,
side, and front spatial coverage in accordance to an embodiment. A
Taper Slot antenna (TSA) is illustrated with its scan side 720
spatial coverage. The single high gain antenna 710 may be yagi,
periodic antenna or any other high gain antenna designs. Due to use
single high gain antenna 710, there is no scan capability to that
side, but with fixed directional gain. The single high gain antenna
also needs to overcome the lid center electronics blockage as well.
In all the designs, edge dummy antenna elements placed on the edge
of the antenna array designs may be included. The purpose of the
edge dummy antenna element is to stabilize antenna array bandwidth
and frequency coverage as beam scan to different angles. Those edge
dummy antenna element are terminated with load resistor.
[0053] FIG. 8 shows a pair of co-linear mm-wave taper slot antenna
array (2.times.8) and associated radiation pattern in accordance to
an embodiment. This embodiment places the linear phased antenna
arrays on the top 810 and bottom 820 layer of the packaging design.
The inter two linear array spacing may be less than five hundred
microns (500 .mu.m). The linear phased array antenna placement is
not limited to the top 810 and bottom 820 layer of the packaging
design. When more than two linear arrays are required, they may
also be placed on top and bottom layers of the board for instance,
and the module can be placed in the middle of the mobile platform
base along height dimension. An example of the co-linear 2.times.8
Taper slot endfire array antenna is illustrated. As is shown, the
antenna element design is not limited to taper slot antennas and it
may also be Yagi, folded dipole, bending dipole/monopole design and
the like. This methodology may use 180 offset feeding to achieve
higher isolation and enable dense antenna array placement. As shown
in element mm-wave TSA array radiation pattern 830, the N element
(16) dense mm-wave array delivers an increase in array antenna gain
(.gtoreq.15 dBi). To extend the design concept, there are multiple
array antenna designs which may be integrated with one RFIC and
deliver quasi-omni spatial coverage.
[0054] Currently, planar end-fire array antennas are either a
single linear array or implemented into a 3D structure. The single
linear array antenna has higher packaging path loss and is harder
to implement for large numbers of array elements. The 3D array
structure is bulky, expensive and hard to fit into a mobile
platform. This embodiment allows multiple linear arrays to stack up
in a thin planar packaging. In this way, a high density integration
may be achieved.
[0055] According to embodiments of the invention, the antenna may
include implements of two linear arrays in a thin planar packaging
structure and may use 180 phase offset method to minimize crosstalk
and allow dense integration. It allows more than one of linear
array integrates in a dense thin packaging multiple layer
structure.
[0056] Embodiments of the invention may deliver a compact mm-wave
array antenna design and RFIC integration as well as providing high
gain for directional adaptive beam forming. This invention enables
a thin planar packaging integration for mm-wave array antenna that
other method may not provide.
[0057] Alternatively, but not limited to, endfire radiation pattern
antenna arrays may only provide azimuth coverage on the horizontal
plane, but no coverage on the broadside. For example, laptops and
other mobile devices that require multiple phased antenna arrays on
the platform cost, size and platform implementation are the major
constraints to enabling 60 GHz technology. According to some
embodiments of the invention, in order to solve the above described
problems, embodiments of the invention may provide a single
flexible dielectric substrate slot loop antenna array which
provides complete half sphere spatial coverage for mobile devices
and provides greater than eleven gigahertz (>11 GHz) bandwidth
coverage for worldwide 60 GHz technology deployment. For example,
the mm-wave antenna element design may replace a conventional
broadside radiation pattern antenna element, a slot loop antenna
forms a magnetic loop which is equivalent to an electrical dipole
like shown in FIG. 10. By tuning the loop two edge length ratio
(a/b), a broader radiation pattern is achieved. The slot loop
antenna design may be circular or rectangular.
[0058] FIG. 9 illustrates the relationship between phased array
antenna configuration and scan angle in accordance to an
embodiment. Phased Array Antenna Configuration 910 and radiation
patterns at zero degrees)(0.degree.) 920, thirty
degrees)(30.degree.) 930, and forty five degrees)(45.degree.) 940.
Implementing tilting radiation pattern antenna element in the
antenna array as shown, the rectangular mm-wave antenna element
(2.times.8) provide 10 dBi gain at 90 degree and 15 dBi at
broadside. If using two antenna arrays on two edges of a laptop or
mobile device, it will have the complete front and side of
coverage. As can be seen from the patterns the linear 1.times.16
array provides interference mitigation along YZ, but has
sensitivity to movement. The 2.times.8 array is a compromise
between interference mitigation and sensitivity to movement. The
4.times.4 array is less sensitive to movement but is not as strong
in interference mitigation.
[0059] FIG. 10 shows a slot loop antenna and associated radiation
pattern in accordance to an embodiment. According to another
embodiment of the invention, a slot loop antenna 260 may provide
both a broadside radiation pattern 1010 and close to a half sphere
omni radiation pattern along xz plane 1020 as shown. The broader
radiation pattern along xz plane 1020 may provide a broad beam
scanning range 180 degrees long x axis 1005. The mm-wave slot loop
antenna design uses single layer dielectric to simplify the
structure with a separate metal to eliminate the back radiation.
The return loss is below (<10 dB) across 55-66 GHz and provides
greater (>11 GHz) bandwidth coverage for worldwide 60 GHz
technology deployment. According to this embodiment, the slot loop
antenna array may also be immune to mutual coupling. This provides
better performance in antenna array beam scanning. The slot loop
antenna could be tilted to change the gain in a particular
direction. For example, antenna design on a planar surface may
provide 45 degree titled beam. The rectangular slot loop antenna
backed by ground plane with offset stripline feeding achieved 45
tilting beam. The tuning in two edge ratio (a/b) and open slot gap
will achieve 45 degree tilting beam pattern. Broad antenna
bandwidth can be achieved (range of 55-64 GHz) with peak gain
(range of 4 dB-8 dB). The mm-wave antenna element design can use
low loss polytetrafluoroethylene (PTFE) substrate material that is
used in standard FR-4 manufacture process.
[0060] FIG. 11 shows a phased antenna array (2.times.8) bent
slightly up to provide a desired coverage and the array's scanning
radiation pattern for mm-wave applications in accordance to an
embodiment. The top half of the phased antenna array 260 is bent
slightly up to provide coverage on the top 1110 that may not be
achieved with conventional phased array designs like rectangular
array (2.times.8) shown in FIG. 9. Due to the small angle of
bending on the top half antenna array 260, those antenna elements
still provide radiation gain to the front of antenna array. This
array has can achieve increases in gain (about 15-17 dB) in the
front area along Y axis 1120. The individual antenna element has
close to omni radiation pattern along Y axis. Therefore, it also
provides side radiation pattern coverage 1130. The conformal single
layer flexible mm-wave phased antenna array is very easy to be
implemented in mobile platforms such as the laptop lid. It may be
held in place with a simple clip on the lid wall of the mobile
platform.
[0061] Although the above description may contain specific details,
they should not be construed as limiting the claims in any way.
Other configurations of the described embodiments of the disclosure
are part of the scope of this disclosure. For example, the
principles of the disclosure may be applied to each individual user
where each user may individually deploy such a system. This enables
each user to utilize the benefits of the disclosure even if any one
of the large number of possible applications do not need the
functionality described herein. In other words, there may be
multiple instances of the components each processing the content in
various possible ways. It does not necessarily need to be one
system used by all end users. Accordingly, the appended claims and
their legal equivalents should only define the disclosure, rather
than any specific examples given.
* * * * *