U.S. patent application number 13/406081 was filed with the patent office on 2012-08-23 for nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same.
Invention is credited to Omar J. Bchir, Praveen Bhimaraj.
Application Number | 20120214008 13/406081 |
Document ID | / |
Family ID | 38432883 |
Filed Date | 2012-08-23 |
United States Patent
Application |
20120214008 |
Kind Code |
A1 |
Bhimaraj; Praveen ; et
al. |
August 23, 2012 |
NANOCLAYS IN POLYMER COMPOSITIONS, ARTICLES CONTAINING SAME,
PROCESSES OF MAKING SAME, AND SYSTEMS CONTAINING SAME
Abstract
A composition includes a bismaleimide triazine (BT) compound
with a nanoclay composited therewith. A mounting substrate includes
polymer compound with a nanoclay composited therewith to form a
core for the mounting substrate. A process includes melt blending a
polymer such as BT with a nanoclay and forming a core. A process
includes dissolving a monomer such as BT with a nanoclay and
forming a core. A system includes a nanoclay dispersed in a polymer
matrix and a microelectronic device mounted on the mounting
substrate that includes the nanoclay dispersed in the polymer
matrix.
Inventors: |
Bhimaraj; Praveen;
(Chandler, AZ) ; Bchir; Omar J.; (Chandler,
AZ) |
Family ID: |
38432883 |
Appl. No.: |
13/406081 |
Filed: |
February 27, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11395728 |
Mar 31, 2006 |
8163830 |
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13406081 |
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Current U.S.
Class: |
428/458 ;
524/430; 524/443; 524/445; 524/447; 977/773 |
Current CPC
Class: |
B32B 15/08 20130101;
B32B 2457/00 20130101; B32B 27/28 20130101; C08K 3/346 20130101;
B82Y 30/00 20130101; B32B 2605/00 20130101; B32B 27/20 20130101;
H05K 2201/0209 20130101; C08J 5/005 20130101; C08K 3/346 20130101;
Y10T 428/1157 20150115; B32B 2605/18 20130101; H05K 2201/0257
20130101; C08J 2379/04 20130101; H05K 1/0373 20130101; Y10T
428/31681 20150401; B32B 15/20 20130101; B32B 2264/10 20130101;
B32B 27/281 20130101; C08L 79/04 20130101 |
Class at
Publication: |
428/458 ;
524/445; 524/447; 524/430; 524/443; 977/773 |
International
Class: |
B32B 15/08 20060101
B32B015/08; C08K 3/10 20060101 C08K003/10; C08K 3/22 20060101
C08K003/22; C08K 3/36 20060101 C08K003/36; C08K 3/34 20060101
C08K003/34; C08L 77/10 20060101 C08L077/10; C08K 3/04 20060101
C08K003/04 |
Claims
1. A composition comprising: a polymer including a bismaleimide
triazine (BT) base; and a clay platelet having a particle size of
about 99% passing 50 nanometers.
2. The composition of claim 1, wherein the clay platelet is present
in a range from about 1% to about 15%.
3. The composition of claim 1, wherein the composition is
substantially halogen free.
4. The composition of claim 1, wherein the clay platelet is
selected from a bainite, beidellite, bentonite, hectorite,
kenyaite, mica, magadite, montmorillonite, montmorollonite,
nontronite, saponite, smectite, vermiculite, volkonskoite, and a
combination of at least two thereof.
5. The composition of claim 1, wherein the clay platelet includes a
hectorite in a first amount and a montmorollonite in a second
amount that is lesser than the first amount.
6. The composition of claim 1, further including an inorganic
particulate selected from silica, alumina, silicon nitride,
graphite, diamond, and combinations thereof.
7. The composition of claim 1, further including an inorganic
particulate filler dispersed in the BT base, wherein the filler is
in a range from about 10% to about 90%.
8. The composition of claim 1, wherein the BT base is complemented
with at least one second polymer.
9. The composition of claim 1, wherein the clay platelet is
dispersed in the BT base, selected from substantially co-planar
clustered, substantially intercalated, and substantially
exfoliated.
10. The composition of claim 1, wherein the clay platelet has a
particle size of about 99% passing minus-20 nanometers, and wherein
the clay platelet has a concentration range from about 2% to about
10%.
11. The composition of claim 1, wherein the composition is
substantially halogen free, wherein the first platelet is selected
from a bainite, beidellite, bentonite, hectorite, kenyaite, mica,
magadite, montmorillonite, montmorollonite, nontronite, saponite,
smectite, vermiculite, volkonskoite, and a combination of at least
two thereof, and wherein the BT base is complemented with at least
one of a second polymer.
12.-19. (canceled)
20. A process comprising: melt blending a first polymer and a clay
platelet to disperse the clay platelet into the first polymer,
wherein the clay platelet has a particle size of about 99% passing
minus-50 nanometers, and wherein the clay platelet has a
concentration range from about 1% to about 15%; and forming a
polymer film from the first polymer and the clay platelet on a
metallic foil.
21. The process of claim 20, wherein melt blending includes
dispersing the clay platelet into the first polymer to achieve a
dispersion selected from substantially co-planar clustered,
substantially intercalated, and substantially exfoliated.
22. The process of claim 20, wherein melt blending includes melt
the first polymer as principally a bismaleimide triazine (BT)
polymer.
23. The process of claim 20, wherein melt blending includes melt
the first polymer as principally a bismaleimide triazine (BT)
polymer, and wherein the first polymer is melt blended with at
least one of an epoxy and a polyimide.
24. The process of claim 20, wherein melt blending includes
dispersing the clay platelet with a particle size of about 99%
passing minus-20 nanometers, and wherein the clay platelet has a
concentration range from about 2% to about 10%.
25. A process comprising: dissolving a first compound, selected
from a monomer, an oligomer, and combinations thereof; mixing the
first compound and a clay platelet to disperse the clay platelet
into the first compound, wherein the clay platelet has a particle
size of about 99% passing minus-50 nanometers, and wherein the clay
platelet has a concentration range from about 1% to about 15%;
polymerizing the first compound to achieve a first polymer; and
forming a polymer film from the first polymer and the clay platelet
on a metallic foil.
26. The process of claim 25, wherein polymerizing includes a
process selected from thermoset-curing, cross-linking and a
combination thereof.
27. The process of claim 25, wherein polymerizing includes
polymerizing the first compound in a range from about 30%
polymerized to about 100% polymerized.
28. The process of claim 25, wherein during melting, the clay
platelet is dispersed into the first compound to achieve a
dispersion selected from substantially co-planar clustered,
substantially intercalated, and substantially exfoliated.
29. The process of claim 25, wherein dissolving includes dissolving
the first compound as principally a bismaleimide triazine (BT)
monomer or oligomer.
30. The process of claim 25, wherein dissolving includes dispersing
the clay platelet with a particle size of about 99% passing
minus-20 nanometers, and wherein the clay platelet has a
concentration range from about 2% to about 10%.
31. A system comprising: a die; a mounting substrate including: a
polymer base including a polymer base first side and a polymer base
second side, a clay platelet dispersed in the polymer base, wherein
the clay platelet has a particle size of about 99% passing minus-50
nanometers, and wherein the clay platelet has a concentration range
from about 1% to about 15%; and a first metallic foil including a
first metallic foil first side and a first metallic foil second
side, wherein the first metallic foil is disposed on the polymer
base first side; and dynamic random-access memory coupled to the
die.
32. The system of claim 31, further including a second metallic
foil including a second metallic foil first side and a second
metallic foil second side, wherein the second metallic foil is
disposed on the polymer base second side.
33. The system of claim 31, wherein the system is disposed in one
of a computer, a wireless communicator, a hand-held device, an
automobile, a locomotive, an aircraft, a watercraft, or a
spacecraft.
34. The system of claim 31, wherein the die is selected from a data
storage device, a digital signal processor, a micro controller, an
application specific integrated circuit, and a microprocessor.
Description
RELATED APPLICATION
[0001] The present application is a Divisional of U.S. patent
application Ser. No. 11/395,728, filed on Mar. 31, 2006, entitled
"NANOCLAYS IN POLYMER COMPOSITIONS, ARTICLES CONTAINING SAME,
PROCESSES OF MAKING SAME, AND SYSTEMS CONTAINING SAME" which is
hereby incorporated herein by reference in its entirety and for all
purposes.
TECHNICAL FIELD
[0002] Embodiments relate generally to board-level structures and
integration of devices thereon.
TECHNICAL BACKGROUND
[0003] Flame retardants are used in the microelectronic industry
for safety reasons. Mounting substrates in addition to
motherboards, expansion cards, etc. have used bromide-based or
phosphorus-based compounds as flame retardants in the core
materials. Mandates from governments to eliminate halides have
caused searches elsewhere in the available materials and among new
compounds for flame-retardant qualities.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] In order to depict the manner in which the embodiments are
obtained, a more particular description of embodiments briefly
described above will be rendered by reference to exemplary
embodiments that are illustrated in the appended drawings.
Understanding that these drawings depict only typical embodiments
that are not necessarily drawn to scale and are not therefore to be
considered to be limiting of its scope, the embodiments will be
described and explained with additional specificity and detail
through the use of the accompanying drawings in which:
[0005] FIG. 1 is a cross-section elevation of a mounting substrate
according to an embodiment;
[0006] FIG. 2 is a detail section taken from FIG. 1 according to an
embodiment;
[0007] FIG. 3 is a detail section taken from FIG. 1 according to an
embodiment;
[0008] FIG. 4 is a detail section taken from FIG. 1 according to an
embodiment;
[0009] FIG. 5 is a detail section taken from FIG. 1 according to an
embodiment;
[0010] FIG. 6 is a process flow chart that describes process and
method flow embodiments;
[0011] FIG. 7 is a process flow chart that describes process and
method flow embodiments;
[0012] FIG. 8 is a cut-away elevation that depicts a computing
system according to an embodiment; and
[0013] FIG. 9 is a schematic of an electronic system according to
an embodiment.
DETAILED DESCRIPTION
[0014] Embodiments relate to a composition that includes a nanoclay
particulate dispersed in a polymer matrix. In an embodiment, the
polymer matrix includes a bismaleimide triazine (BT) base.
[0015] The following description includes terms, such as upper,
lower, first, second, etc., that are used for descriptive purposes
only and are not to be construed as limiting. The embodiments of an
apparatus or article described herein can be manufactured, used, or
shipped in a number of positions and orientations. The terms "die"
and "chip" generally refer to the physical object that is the basic
workpiece that is transformed by various process operations into
the desired integrated circuit device. A die is usually singulated
from a wafer, and wafers may be made of semiconducting,
non-semiconducting, or combinations of semiconducting and
non-semiconducting materials. A board is typically a
resin-impregnated fiberglass structure that acts as a mounting
substrate for the die.
[0016] Whenever used in this disclosure, the terms set forth may
have the following meanings.
[0017] "Clay material," "layered clay," or "layered clay material"
means any organic or inorganic material or mixtures thereof, which
is in the form of a plurality of adjacent, bound layers. The
layered clay includes platelet particles.
[0018] "Platelet particles," "platelets," "particles," or
"co-planar clustered" mean individual or aggregate unbound layers
of the layered clay material. These layers may be in the form of
individual platelet particles, ordered or disordered small
aggregates of platelet particles, also known as tactoids, and
aggregates of tactoids.
[0019] "Dispersion" or "dispersed" is a general term that refers to
a variety of levels or degrees of separation of the platelet
particles. The levels of dispersion include, but are not limited
to, "platelet particles," "intercalated," and "exfoliated."
[0020] "Intercalated" or "intercalate" means a layered clay
material that includes a structure disposed between adjacent
platelet particles or tactoids of the aggregate layers, which
increases the interlayer spacing between the adjacent platelets
and/or the tactoids. In this disclosure, the intercalated structure
can be an organic cation and can also be a matrix polymer.
[0021] "Exfoliate" or "exfoliated" means platelets dispersed
predominantly in an individual state throughout a carrier material,
such as a matrix polymer. Typically, "exfoliated" is used to denote
the highest degree of separation of platelet particles, with
"intercalated" as an intermediate degree of separation of
platelets, and "co-planar clustered" as the lowest degree of
separation. Because degrees of separation of platelets is
substantially a continuum between exfoliated and co-planar
clustered, the degree of separation will be assigned a number range
for clarity, but the scope of disclosed embodiments may be broader
than what is set forth.
[0022] "Exfoliation" means a process for forming an exfoliate from
an intercalated or otherwise less dispersed state of
separation.
[0023] "Nanocomposite(s)" or "nanocomposite composition(s)" means a
polymer or copolymer having dispersed therein a plurality of
nano-sized individual platelets obtained from an exfoliated,
layered, nanoclay material.
[0024] "Matrix polymer" means a thermoplastic or melt-processable
polymer in which the platelet particles are dispersed to form a
nanocomposite. In this disclosure, however, the platelet particles
may be "co-planar clustered," "intercalated," or "exfoliated" in
the matrix polymer to form a nanocomposite.
[0025] Reference will now be made to the drawings wherein like
structures will be provided with like suffix reference
designations. In order to show the structures of various
embodiments most clearly, the drawings included herein are
diagrammatic representations of integrated circuit structures.
Thus, the actual appearance of the fabricated structures, for
example in a photomicrograph, may appear different while still
incorporating the essential structures of the illustrated
embodiments. Moreover, the drawings show the structures necessary
to understand the illustrated embodiments. Additional structures
known in the art have not been included to maintain the clarity of
the drawings.
[0026] FIG. 1 is a cross-section elevation of a mounting substrate
100 according to an embodiment. The mounting substrate 100 includes
a core 110 with a first side 112 and a second side 114. In an
embodiment, the core 110 includes a polymer base that includes a
first clay platelet having a particle size of about 99% passing 50
nanometers (nm). In an embodiment, the core 110 is a bismaleimide
triazine (BT) polymer base that includes a first clay platelet
having a particle size of about 99% passing 50 nm. "First clay
platelet" means a first type of clay platelet, unless otherwise
noted.
[0027] In an embodiment, an article includes the core 110 and a
first metallic foil 116 that is disposed upon the core 110 first
side 112. In an embodiment, the first metallic foil 116 includes
copper and is typical of the copper that can be used in boards to
make traces and other electrical structures. A solder mask first
film 118 is disposed upon the first metallic foil 116 according to
an embodiment.
[0028] In an embodiment, the mounting substrate 100 is a board such
as a motherboard, an expansion card, a mezzanine board, a dual
in-line mounting module board or mounting substrate. During
employment of the mounting substrate 100 as a mounting substrate
for a microelectronic device, the solder mask first film 118
includes a recess 120, which exposes an upper surface 122 of the
first metallic foil 116. In an embodiment, the upper surface 122 of
the first metallic foil 116 is a bond pad for a wire bond. In an
embodiment, the upper surface 122 of the first metallic foil 116 is
a bond pad for an electrical bump.
[0029] In an embodiment, the upper surface 122 of the first
metallic foil 116 includes a flash layer of metal such as gold. In
an embodiment, the upper surface 122 of the first metallic foil 116
includes a flash layer of metal such as titanium. In an embodiment,
the upper surface 122 of the first metallic foil 116 includes a
flash layer of metal such as a dore alloy of gold and silver.
[0030] In an embodiment, the article includes the core 110 and a
second metallic foil 124 that is disposed upon the core 110 second
side 114. In an embodiment, the second metallic foil 124 includes
copper and is typical of the copper that can be used in boards to
make traces and other electrical structures. A solder mask second
film 126 is disposed upon the second metallic foil 124 according to
an embodiment.
[0031] In an embodiment, the mounting substrate 100 is a board such
as a dual in-line memory module (DIMM) or other mounting substrate
that has accessibility to both a first metallic foil 116 and a
second metallic foil 124. During employment of the mounting
substrate 100 as a board for a microelectronic device, the solder
mask second film 126 includes a recess 128, which exposes a lower
surface 130 of the second metallic foil 124. In an embodiment, the
lower surface 130 of the second metallic foil 124 is a bond pad for
a wire bond. In an embodiment, the lower surface 130 of the first
metallic foil 124 is a bond pad for an electrical bump. In an
embodiment, a flash layer is also disposed upon the lower surface
130, as set forth herein for any embodiment of the upper surface
122.
[0032] FIG. 2 is a detail section 200 taken from FIG. 1 according
to an embodiment. The section line 2-2 in FIG. 1 shows an
approximate region from the mounting substrate 100 in FIG. 1. The
detail section 200 is greatly simplified for illustrative
purposes.
[0033] The mounting substrate 200 includes a core 210. In an
embodiment, the core 210 includes a polymer base that includes a
first clay platelet 234 having a particle size of about 99% passing
50 nanometers (nm). In an embodiment, the core 210 is a BT polymer
base that includes a first clay platelet 234 having a particle size
of about 99% passing 50 nm.
[0034] In an embodiment, the mounting substrate 200 is an article
that includes the core 210 and a first metallic foil 216 that is
disposed upon the core 210. In an embodiment, the first metallic
foil 216 includes copper. A solder mask first film 218 is disposed
upon the first metallic foil 216 according to an embodiment.
[0035] In an embodiment, the mounting substrate 200 is an article
that also includes a second metallic foil 224 that is disposed upon
the core 210. In an embodiment, the second metallic foil 224
includes copper and is typical of the copper that can be used in
boards to make traces and other electrical structures. A solder
mask second film 226 is disposed upon the second metallic foil 224
according to an embodiment.
[0036] In an embodiment, a monomer or oligomer is provided,
depicted as clusters of dots, one of which is demarcated with the
reference numeral 232. Along with the monomer or oligomer, a first
clay platelet 234 is depicted in substantially co-planar clusters.
By "substantially co-planar clusters" it is understood that a
significant portion of the first clay platelet 234 that is present
in the mounting substrate 200 is immediately adjacent to another
first clay platelet or a plurality of first clay platelets. In FIG.
2, the substantially co-planar clusters are depicted as four clay
platelets 234 disposed in the larger matrix of the monomer or
oligomer.
[0037] In an embodiment, the substantially co-planar clusters of
the first clay platelet 234 are in a size range of about 99%
passing 50 nm. In an embodiment, the substantially co-planar
clusters of the first clay platelet 234 are present in the core 210
in a weight range from about 1% to about 15%. In an embodiment, the
substantially co-planar clusters of the first clay platelet 234 are
in a size range of about 99% passing 50 nm and in a weight range
from about 1% to about 15%.
[0038] In a process embodiment, the monomer or oligomer is first
melt blended with the first clay platelet 234, followed by curing
of the compound to form the core 210 as schematically illustrated.
In this embodiment, a complete cure of the monomer or oligomer is
not accomplished. In this embodiment, the monomer or oligomer is
cross-linked and/or cured to a completion range from about 30%
polymerized to about 99% polymerized. In an embodiment, the monomer
or oligomer is cross-linked and/or cured to a completion range from
about 50% polymerized to about 90% polymerized. In an embodiment,
the monomer or oligomer is cross-linked and/or cured to a
completion range from about 70% polymerized to about 80%
polymerized.
[0039] In a method embodiment, the core 210 is cured to a given
degree of polymerization, and is also formed as a polymer film upon
a metallic foil such as a first metallic foil 216. The method of
forming the polymer film (to become the core 210) upon the first
metallic foil 216 includes laying the first metallic foil 216 upon
a B-staged polymer-clay platelet compound according to an
embodiment. In an embodiment, the method of forming the polymer
film upon the first metallic foil 216 includes flowing a
partially-cured polymer-clay platelet compound upon the first
metallic foil 216, followed by further curing of the compound.
Other methods can be used as are known in the art for laminating a
board with a metallic foil and a solder mask, when combined with
the disclosures set forth herein.
[0040] In a process embodiment, the monomer or oligomer is first
mixed with a solvent and blended with the first clay platelet 234,
followed by allowing the solvent to escape from the solution. After
solvent is significantly removed, curing of the monomer or oligomer
is carried out. In this embodiment, a complete cure of the monomer
or oligomer is not accomplished. In this embodiment, the monomer or
oligomer is cross-linked and/or cured to a completion range from
about 30% polymerized to about 99% polymerized. In an embodiment,
the monomer or oligomer is cross-linked and/or cured to a
completion range from about 50% polymerized to about 90%
polymerized. In an embodiment, the monomer or oligomer is
cross-linked and/or cured to a completion range from about 70%
polymerized to about 80% polymerized.
[0041] FIG. 3 is a detail section 300 taken from FIG. 1 according
to an embodiment. The section line 2-2 in FIG. 1 shows an
approximate region from the mounting substrate 100 in FIG. 1. The
detail section 300 is greatly simplified for illustrative
purposes.
[0042] The mounting substrate 300 includes a core 310. In an
embodiment, the core 310 includes a polymer base that includes a
first clay platelet 334 having a particle size of about 99% passing
50 nanometers (nm). In an embodiment, the core 310 is a BT polymer
base that includes a first clay platelet 334 having a particle size
of about 99% passing 50 nm.
[0043] In an embodiment, the mounting substrate 300 is an article
that includes the core 310 and a first metallic foil 316 that is
disposed upon the core 310. In an embodiment, the first metallic
foil 316 includes copper. A solder mask first film 318 is disposed
upon the first metallic foil 316 according to an embodiment.
[0044] In an embodiment, the mounting substrate 300 is an article
that also includes a second metallic foil 324 that is disposed upon
the core 310. In an embodiment, the second metallic foil 324
includes copper and is typical of the copper that can be used in
boards to make traces and other electrical structures. A solder
mask second film 326 is disposed upon the second metallic foil 324
according to an embodiment.
[0045] In an embodiment, a monomer or oligomer is provided,
depicted as linked, cured, or cross-linked polymers, one of which
is demarcated with the reference numeral 332. Along with the
linked, cured, or cross-linked polymers 332, a first clay platelet
334 is depicted in substantially co-planar clusters. In FIG. 3, the
substantially co-planar clusters are depicted as four clay
platelets 334 disposed in the larger matrix of the linked, cured,
or cross-linked polymers 332.
[0046] In an embodiment, the substantially co-planar clusters of
the first clay platelet 334 are in a size range of about 99%
passing 50 nm. In an embodiment, the substantially co-planar
clusters of the first clay platelet 334 is present in the core 310
in a weight range from about 1% to about 15%. In an embodiment, the
substantially co-planar clusters of the first clay platelet 334 are
in a size range of about 99% passing 50 nm and in a weight range
from about 1% to about 15%.
[0047] FIG. 4 is a detail section 400 taken from FIG. 1 according
to an embodiment. The section line 2-2 in FIG. 1 shows an
approximate region from the mounting substrate 100 in FIG. 1. The
detail section 400 is greatly simplified for illustrative
purposes.
[0048] The mounting substrate 400 includes a core 410. In an
embodiment, the core 410 includes a polymer base that includes a
first clay platelet 434 having a particle size of about 99% passing
50 nanometers (nm). In an embodiment, the core 410 is a BT polymer
base that includes a first clay platelet 434 having a particle size
of about 99% passing 50 nm.
[0049] In an embodiment, the mounting substrate 400 is an article
that includes the core 410 and a first metallic foil 416 that is
disposed upon the core 410. In an embodiment, the first metallic
foil 416 includes copper. A solder mask first film 418 is disposed
upon the first metallic foil 416 according to an embodiment.
[0050] In an embodiment, the mounting substrate 400 is an article
that also includes a second metallic foil 424 that is disposed upon
the core 410. In an embodiment, the second metallic foil 424
includes copper and is typical of the copper that can be used in
boards to make traces and other electrical structures. A solder
mask second film 426 is disposed upon the second metallic foil 424
according to an embodiment.
[0051] In an embodiment, a monomer or oligomer is provided,
depicted as linked, cured, or cross-linked polymers, one of which
is demarcated with the reference numeral 432. Along with the
linked, cured, or cross-linked polymers 432, a first clay platelet
434 is depicted in substantially intercalated clusters. By
"substantially intercalated clusters" it is understood that a
significant portion of the first clay platelet 434 that is present
in the mounting substrate 400 is immediately adjacent to another
first clay platelet or a plurality of first clay platelets, but the
clusters have been intercalated with the linked, cured, or
cross-linked polymers 432. In FIG. 4, the substantially
intercalated clusters are depicted as four clay platelets 434
disposed in the larger matrix of the linked, cured, or cross-linked
polymers.
[0052] In an embodiment, the polymer base is BT. In an embodiment,
the nanoclay platelets 434 are assisted in fire-retardant qualities
with an hydroxide moiety such as aluminum hydroxide, Al(OH).sub.3.
In an embodiment, where the amount of the nanoclay could be present
alone in the range from about 1% to about 15%, when the
Al(OH).sub.3 moiety is present in an amount of about 5%, the
maximum nanoclay platelets 434 are present in an amount of about
12%.
[0053] In an embodiment, the substantially intercalated clusters of
the first clay platelet 434 are in a size range (individual
platelets 434) of about 99% passing 50 nm. In an embodiment, the
substantially intercalated clusters of the first clay platelet 434
are present in the core 410 in a weight range from about 1% to
about 15%. In an embodiment, the substantially intercalated
clusters of the first clay platelet 434 are in a size range of
about 99% passing 50 nm and in a weight range from about 1% to
about 15%.
[0054] FIG. 5 is a detail section 500 taken from FIG. 1 according
to an embodiment. The section line 2-2 in FIG. 1 shows an
approximate region from the mounting substrate 100 in FIG. 1. The
detail section 500 is greatly simplified for illustrative
purposes.
[0055] The mounting substrate includes a core 510. In an
embodiment, the core 510 includes a polymer base that includes a
first clay platelet 534 having a particle size of about 99% passing
50 nanometers (nm). In an embodiment, the core 510 is a BT polymer
base that includes a first clay platelet 534 having a particle size
of about 99% passing 50 nm.
[0056] In an embodiment, the mounting substrate is part of an
article that includes the core 510 and a first metallic foil 516
that is disposed upon the core 510. In an embodiment, the first
metallic foil 516 includes copper. A solder mask first film 518 is
disposed upon the first metallic foil 516 according to an
embodiment.
[0057] In an embodiment, the mounting substrate is part of an
article that also includes a second metallic foil 524 that is
disposed upon the core 510. In an embodiment, the second metallic
foil 524 includes copper and is typical of the copper that can be
used in boards to make traces and other electrical structures. A
solder mask second film 526 is disposed upon the second metallic
foil 524 according to an embodiment.
[0058] In an embodiment, a monomer or oligomer is provided,
depicted as linked, cured, or cross-linked polymers, one of which
is demarcated with the reference numeral 532. Along with the
linked, cured, or cross-linked polymers 532, a first clay platelet
534 is depicted in a substantially exfoliated configuration. By a
"substantially exfoliated configuration" it is understood that the
first clay platelet 534 that is present in the mounting substrate
500 is separated from most or all adjacent first clay platelets or
a plurality of all adjacent first clay platelets, and the platelets
have been separated by the linked, cured, or cross-linked polymers
532. In FIG. 5, the substantially exfoliated configuration of
platelets are depicted as separated clay platelets 534 disposed in
the larger matrix of the linked, cured, or cross-linked
polymers.
[0059] In an embodiment, the substantially exfoliated configuration
of platelets of the first clay platelet 534 is in a size range of
about 99% passing 50 nm. In an embodiment, the substantially
exfoliated configuration of platelets of the first clay platelet
534 is present in the core 510 in a weight range from about 1% to
about 15%. In an embodiment, the substantially exfoliated
configuration of platelets of the first clay platelet 534 is in a
size range of about 99% passing 50 nm and in a weight range from
about 1% to about 15%.
[0060] Aspect ratios of the nanoclay platelets are selected
according to specific applications. In an embodiment, exfoliating
the nanoclay into the matrix can be done by using dispersed nano
platelets with high aspect ratio in a range from about 1:1 to about
200:1. The resulting nanoclay composite material has improved high
acceleration stress test ("HAST") performance, and slows the
release of volatile components for reduced pump-out, bleed-out, and
dry-out of the core material. The nanoclay particles also improve
the thermo-oxidative stability of the core for improved bake and
thermal cycling ("TC") performance.
[0061] The addition of the nanoclay platelet particles to the core
materials results in semiconductor or microelectronic packages that
have improved reliability and performance. The improved reliability
and performance results from reduced pump-out, reduced dry out, and
improved thermo-oxidative stability of the thermal interfaced
material. Pump-out, dry out, and thermo-oxidative stability are
governed by diffusion processes. The polymer-nanoclay composite
embodiments may be mixed by a wide variety of process.
[0062] This disclosure may be practiced with a wide variety of
matrix organics. In an embodiment, the matrix organic is BT. In
addition to the BT polymer, other organics can be added. In an
embodiment, BT is present in a major amount and is complement with
a second polymer or the like that is present in a minor amount. In
an embodiment, an olefinic resin is present as a polymer second
organic, which is second to the BT polymer first organic. In an
embodiment the olefinic resin is at least one of polyethylene,
polypropylene, polystyrene, paraffin wax, unsaturated olefin
rubbers like polybutadiene or polyisoprene, saturated rubbers like
ethylene-propylene, ethylene-propylene-diene monomer (EPDM),
hydrogenated polyisoprene, and the like. In an embodiment, a can
polyimide core material also be added as a stand-alone core matrix,
or as a component of a core matrix.
[0063] In an embodiment, the polymer-nanoclay compound includes a
thermal conductivity of greater than about 50 W/mK. Examples of
useful fillers include ceramics, such as aluminum oxide, boron
nitride, aluminum nitride, and the like; metals, such as aluminum,
copper, silver, and the like; and solders, such as indium, tin,
tin-indium, silver, tin-silver, tin-indium-silver, and the like.
Typically, the amount of thermally conductive filler is in a range
from about 10% to about 90%, depending on several factors required
in specific applications, including the desired bulk thermal
conductivity and the selection of the specific nanoclay
platelets.
[0064] In an embodiment, more than one quality of nanoclay
platelets is used. Useful nanoclay materials include natural,
synthetic, and modified phyllosilicates. Natural clays include
smectite clays, such as montmorillonite, saponite, hectorite, mica,
vermiculite, bentonite, nontronite, beidellite, volkonskoite,
magadite, kenyaite, and the like. Synthetic clays include synthetic
mica, synthetic saponite, synthetic hectorite, and the like.
[0065] In an embodiment, the nanoclays are present as at least two
different nanoclays. For example, the nanoclays include hectorite
in a first amount and a montmorollonite in a second amount that is
lesser than the first amount.
[0066] In an embodiment, the nanoclays are substantially halogen
free. By "substantially halogen free" it is meant that halogens are
not used in raw materials and/or supplies for the preparation of
the nanoclays and the polymer bases, such that halogens are not
detected under ordinary analytical techniques, except for
detectable impurities.
[0067] In an embodiment, an intercalated layered clay material is
prepared by the reaction of a swellable layered clay with one or
more organic cations, preferably ammonium compounds, to effect
partial or complete cation exchange. Numerous methods to modify
layered clays with organic cations can be used, and any of these
may be used in the practice embodiments. One embodiment is the
organic modification of a layered nanoclay with an organic cation
salt (non-halide) by the process of dispersing a layered clay or
mixture of clays into hot water (50 to 80.degree. C.), adding the
organic cation salt (heated or dissolved in water or alcohol) with
agitation, then blending for a period of time sufficient for the
organic cations to exchange most of the metal cations present in
the galleries between the layers of the clay material(s). Then, the
organically modified layered clay material(s) is isolated by
methods known in the art, including filtration, centrifugation,
spray drying, and their combinations.
[0068] In an embodiment, the nanoclay is further treated for the
purposes of aiding exfoliation in the composite and/or improving
the strength of the polymer/clay interface. Any treatment that
achieves the above goals may be used. Examples of useful treatments
include intercalation with water-soluble or water-insoluble
polymers, organic reagents or monomers, silane compounds, metals or
organometallics, and/or their combinations.
[0069] In an embodiment, the nanoclays are dispersed in the polymer
matrix such that most of the nanoclay material exists as individual
platelet particles (exfoliated), small tactoids (intercalated), and
small aggregates of tactoids (platelet clusters) with dimensions of
less than about 20 nm. Compositions with the higher concentration
of individual platelet particles and fewer tactoids or aggregates
can also be used.
[0070] FIG. 6 is a process flow chart 600 that describes process
and method flow embodiments. At 610 the process includes melt
blending a polymer and a nanoclay to form a compound. In this
embodiment, the compound includes the nanoclay, whether co-planar
clustered, intercalated, or exfoliated, in the polymer matrix. The
degree of separation of the nanoclay platelets can be extended
during melt blending by the mechanical shear of a melt-blending
apparatus. Accordingly, the melt blending can be extended to
achieve, e.g. substantially exfoliated nanoclay platelets in a
polymer matrix.
[0071] At 620, the process includes applying the compound to a
metallic foil to form a mounting substrate. Several embodiments of
mounting substrates are depicted in this disclosure including the
text supporting FIGS. 2-5. In an embodiment, the process commences
at 610 and terminates at 620.
[0072] At 630, the process includes assembling a microelectronic
device to the mounting substrate. An illustration of a
microelectronic device assembled to a mounting substrate is
depicted in FIG. 8. In an embodiment, the process commences at 610
and terminates at 630.
[0073] At 640 the process flows from 610 to curing the polymer to
form a core. Several embodiments of mounting substrates are
depicted in this disclosure including the text supporting FIGS.
1-5. In an embodiment, the process commences at 610 and terminates
at 640. In an embodiment, the process commences at 610, flows to
620, and terminates at 640.
[0074] At 642, the process includes applying the core to a metallic
foil to form a mounting substrate. In an embodiment, the process
commences at 610 and terminates at 640. In an embodiment, the
process commences at 610, flows to 640, and 642, and terminates at
630.
[0075] FIG. 7 is a process flow chart 700 that describes process
and method flow embodiments. At 710 the process includes dissolving
a monomer or oligomer, or both, to form a solvent-nanoclay
dispersion. The process of dissolving the organics etc., to form a
solution can include achieving a degree of separation of the
nanoclay platelets by the mechanical shear of a mixing
apparatus.
[0076] At 720, the process includes evaporating the solvent to form
a monomer (or oligomer, etc.) nanoclay compound. In an embodiment,
the process commences at 710 and terminates at 720.
[0077] At 730, the process includes applying the compound to a
metallic foil to form a mounting substrate. Several embodiments of
mounting substrates are depicted in this disclosure including the
text supporting FIGS. 2-5. In an embodiment, the process commences
at 710 and terminates at 730.
[0078] At 740, the process includes assembling a microelectronic
device to the mounting substrate. An illustration of a
microelectronic device assembled to a mounting substrate is
depicted in FIG. 8. In an embodiment, the process commences at 710
and terminates at 740.
[0079] At 750 the process flows from 720 to curing the monomer or
oligomer to form a core. Several embodiments of mounting substrates
are depicted in this disclosure including the text supporting FIGS.
1-5. In an embodiment, the process commences at 710 and terminates
at 750. In an embodiment, the process commences at 710, flows to
730, and terminates at 750.
[0080] At 752, the process includes applying the core to a metallic
foil to form a mounting substrate. In an embodiment, the process
commences at 710 and terminates at 752. In an embodiment, the
process commences at 710, flows to 750, and 752, and terminates at
740.
[0081] FIG. 8 is a cut-away elevation that depicts a computing
system 800 according to an embodiment. One or more of the foregoing
embodiments of the nanoclay-in-a-polymer matrix core may be
utilized in a computing system, such as a computing system 800 of
FIG. 8. Hereinafter any nanoclay-in-a-polymer matrix core
embodiment alone, or in combination with any other embodiment, is
referred to as an embodiment(s) configuration.
[0082] The computing system 800 includes at least one processor
(not pictured), which is enclosed in an IC chip package 810, a data
storage system 812, at least one input device such as a keyboard
814, and at least one output device such as a monitor 816, for
example. In an embodiment, the data storage system 812 is
random-access memory such as dynamic random-access memory (DRAM),
polymer memory, flash memory, of phase-change memory. The computing
system 800 includes a processor that processes data signals, and
may include, for example, a microprocessor, available from Intel
Corporation. In addition to the keyboard 814, the computing system
800 can include another user input device such as a mouse 818, for
example. The computing system 800 can include a structure, after
processing as depicted in FIGS. 1, 3, 4, and 5 of a given
nanoclay-in-a-polymer matrix core embodiment. In an embodiment, the
computing system 800 includes a housing 822 such as the box for a
desktop computer.
[0083] For purposes of this disclosure, a computing system 800
embodying components in accordance with the claimed subject matter
may include any system that utilizes a microelectronic device
system, which may include, for example, at least one of the
nanoclay-in-a-polymer matrix core embodiments that is coupled to
data storage such as the DRAM, polymer memory, flash memory, or the
phase-change memory. In this embodiment, the embodiment(s) is
coupled to any combination of these functionalities by being
coupled to a processor. In an embodiment, however, an embodiment(s)
configuration set forth in this disclosure is coupled to any of
these functionalities. For an example embodiment, data storage
includes an embedded DRAM cache on a die. Additionally in an
embodiment, the embodiment(s) configuration that is coupled to the
processor (not pictured) is part of the system with an
embodiment(s) configuration that is coupled to the data storage of
the DRAM cache. Additionally in an embodiment, an embodiment(s)
configuration is coupled to the data storage 812.
[0084] In an embodiment, the computing system 800 can also include
a die that contains a digital signal processor (DSP), a micro
controller, an application specific integrated circuit (ASIC), or a
microprocessor. In this embodiment, the embodiment(s) configuration
is coupled to any combination of these functionalities by being
coupled to a processor. For an example embodiment, a DSP is part of
a chipset that may include a stand-alone processor and the DSP as
separate parts of the chipset on the board 820, which is a
nanoclay-in-a-polymer matrix core embodiment. In this embodiment,
an embodiment(s) configuration is coupled to the DSP, and a
separate embodiment(s) configuration may be present that is coupled
to the processor in the IC chip package 810. Additionally in an
embodiment, an embodiment(s) configuration is coupled to a DSP that
is mounted on the same board 820 as the IC chip package 810. It can
now be appreciated that the embodiment(s) configuration can be
combined as set forth with respect to the computing system 800, in
combination with an embodiment(s) configuration as set forth by the
various embodiments of the nanoclay-in-a-polymer matrix core within
this disclosure and their equivalents.
[0085] It can now be appreciated that embodiments set forth in this
disclosure can be applied to devices and apparatuses other than a
traditional computer. For example, a die can be packaged with an
embodiment(s) configuration, and placed in a portable device such
as a wireless communicator or a hand-held device such as a personal
data assistant and the like. In this embodiment, the system housing
can be a shell for a wireless telephone or the like. Another
example is a die that can be packaged with an embodiment(s)
configuration and placed in a vehicle such as an automobile, a
locomotive, a watercraft, an aircraft, or a spacecraft.
[0086] FIG. 9 is a schematic of an electronic system 900 according
to an embodiment. The electronic system 900 as depicted can embody
the computing system 800 depicted in FIG. 8, but the electronic
system is depicted more generically. The electronic system 900
incorporates at least one mounting substrate, for example the board
820 depicted in FIG. 8, with an electronic assembly, such as an
integrated circuit (IC) die 910. In an embodiment, the electronic
system 900 is a computer system that includes a system bus 920 to
electrically couple the various components of the electronic system
900. The system bus 920 is a single bus or any combination of
busses according to various embodiments. The electronic system 900
includes a voltage source 930 that provides power to the integrated
circuit 910. In some embodiments, the voltage source 930 supplies
current to the integrated circuit 910 through the system bus
920.
[0087] The integrated circuit 910 is electrically coupled to the
system bus 920 and includes any circuit, or combination of circuits
according to an embodiment. In an embodiment, the integrated
circuit 910 includes a processor 912 that can be of any type. As
used herein, the processor 912 means any type of circuit such as,
but not limited to, a microprocessor, a microcontroller, a graphics
processor, a digital signal processor, or another processor. Other
types of circuits that can be included in the integrated circuit
910 are a custom circuit or an ASIC, such as a communications
circuit 914 for use in wireless devices such as cellular
telephones, pagers, portable computers, two-way radios, and similar
electronic systems. In an embodiment, the processor 910 includes
on-die memory 916 such as SRAM. In an embodiment, the processor 910
includes on-die memory 916 such as eDRAM.
[0088] In an embodiment, the electronic system 900 also includes an
external memory 94 that in turn may include one or more memory
elements suitable to the particular application, such as a main
memory 942 in the form of RAM, one or more hard drives 944, and/or
one or more drives that handle removable media 946, such as
diskettes, compact disks (CDs), digital video disks (DVDs), flash
memory keys, and other removable media known in the art.
[0089] In an embodiment, the electronic system 900 also includes a
display device 950, and an audio output 960. In an embodiment, the
electronic system 900 includes an input device 970, such as a
keyboard, mouse, trackball, game controller, microphone,
voice-recognition device, or any other device that inputs
information into the electronic system 900.
[0090] As shown herein, the integrated circuit 910 can be
implemented in a number of different embodiments, including an
electronic package, an electronic system, a computer system, one or
more methods of fabricating an integrated circuit, and one or more
methods of fabricating an electronic assembly that includes the
integrated circuit mounted on a board, and the
nanoclay-in-a-polymer matrix core embodiments as set forth herein
in the various embodiments and their art-recognized equivalents.
The elements, materials, geometries, dimensions, and sequence of
operations can all be varied to suit particular packaging
requirements.
[0091] The Abstract is provided to comply with 37 C.F.R.
.sctn.1.72(b) requiring an abstract that will allow the reader to
quickly ascertain the nature and gist of the technical disclosure.
It is submitted with the understanding that it will not be used to
interpret or limit the scope or meaning of the claims.
[0092] In the foregoing Detailed Description, various features are
grouped together in a single embodiment for the purpose of
streamlining the disclosure. This method of disclosure is not to be
interpreted as reflecting an intention that the claimed embodiments
of the disclosure require more features than are expressly recited
in each claim. Rather, as the following claims reflect, inventive
subject matter lies in less than all features of a single disclosed
embodiment. Thus the following claims are hereby incorporated into
the Detailed Description, with each claim standing on its own as a
separate preferred embodiment.
[0093] It will be readily understood to those skilled in the art
that various other changes in the details, material, and
arrangements of the parts and method stages which have been
described and illustrated in order to explain the nature
embodiments may be made without departing from the principles and
scope of the disclosure as expressed in the subjoined claims.
* * * * *