U.S. patent application number 13/029878 was filed with the patent office on 2012-08-23 for heat sink equipped with a vapor chamber.
Invention is credited to David SHIH.
Application Number | 20120211211 13/029878 |
Document ID | / |
Family ID | 46651790 |
Filed Date | 2012-08-23 |
United States Patent
Application |
20120211211 |
Kind Code |
A1 |
SHIH; David |
August 23, 2012 |
HEAT SINK EQUIPPED WITH A VAPOR CHAMBER
Abstract
A heat sink equipped with a vapor chamber includes a heat
conduction plate and a vapor chamber. The heat conduction plate has
one side formed integrally a plurality of radiation fins and
another side with two lateral edges formed respectively and
integrally a fastening portion. The two fastening portions are
interposed by a recess to bond the vapor chamber. Each fastening
portion is fastened to a printed circuit board through at least one
screw to allow the vapor chamber to contact a heat generation
element. The fastening portion is integrally formed at a desired
thickness, thus has sufficient strength to withstand the fastening
force of the screw to prevent tight sealing between the vapor
chamber and heat generation element affected by deformation of the
heat conduction plate. Thereby the vapor chamber can smoothly
contact the heat generation element to rapidly transfer heat
outside.
Inventors: |
SHIH; David; (Chang Hwa
City, TW) |
Family ID: |
46651790 |
Appl. No.: |
13/029878 |
Filed: |
February 17, 2011 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2924/0002 20130101; F28D 2021/0029 20130101; F28D 15/0275
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101; F28D
15/0233 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A heat sink equipped with a vapor chamber, comprising: a heat
conduction plate which includes one side formed integrally a
plurality of radiation fins and another side with two lateral edges
formed respectively and integrally a fastening portion, the two
fastening portions being interposed by a recess; and a vapor
chamber being bonded to the recess.
2. The heat sink of claim 1, wherein the heat conduction plate
includes a latch flange respectively on a front side and a rear
side of the recess and an airtight compartment dug downwards, such
that the vapor chamber is positioned and surrounded by the two
latch flanges and the two fastening portions to cover and seal the
airtight compartment.
3. The heat sink of claim 2, wherein the vapor chamber includes a
plurality of heat conduction fins extended into the airtight
compartment.
4. The heat sink of claim 2, wherein the heat conduction plate
includes an air extraction vent communicating with the airtight
compartment.
5. The heat sink of claim 1, wherein each fastening portion
includes at least one aperture run through by at least one
screw.
6. The heat sink of claim 5, wherein the screw is coupled with a
spring.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a heat sink and
particularly to a heat sink equipped with a vapor chamber.
BACKGROUND OF THE INVENTION
[0002] Please refer to FIG. 1, a conventional heat sink includes a
heat conduction plate 1 and a vapor chamber 2. The heat conduction
plate 1 has one side formed a plurality of radiation fins 3 and
another side bonded to the vapor chamber 2, and two lateral sides
fastened to a printed circuit board (PCB in short, not shown in the
drawing) through at least one screw 4. The vapor chamber 2 is in
contact with a heat generation element (not shown in the drawing)
of the PCB, and is hollow and vacuumed to seal heat transfer fluid
5 (pure water) inside which can rapidly transfer heat through phase
transition between liquid and gas states. Hence the heat generated
by the heat generation element can be quickly spread by the vapor
chamber 2 to the radiation fins 3 to dissipate the heat to lower
the temperature.
[0003] To save material, reduce weight and also accelerate heat
transfer, the heat conduction plate 1 usually is fabricated at a
small thickness. Hence when the heat conduction plate 1 is fastened
to the PCB at the two lateral sides through the screws 4, the
fastening force tends to cause distortion and deformation of the
heat conduction plate 1 that could also result in deformation of
the vapor chamber 2 without closely contacting the heat generation
element. As a result, heat transfer effect suffers.
[0004] Moreover, a gap is easily generated between the vapor
chamber 2 and heat conduction plate 1 due to the aforesaid
deformation. That also diminishes the heat transfer effect and
slows heat transfer from the vapor chamber 2 to the heat conduction
plate 1. All these hamper heat dissipation effect of the heat
sink.
SUMMARY OF THE INVENTION
[0005] Therefore, the primary object of the present invention is to
provide a heat sink that can quickly and effectively transfer heat
outside to achieve desired cooling effect.
[0006] To achieve the foregoing object, the present invention
provides a heat sink equipped with a vapor chamber. The heat sink
includes a heat conduction plate and a vapor chamber. The heat
conduction plate has one side formed integrally a plurality of
radiation fins and another side with two lateral edges formed
respectively and integrally a fastening portion. The two fastening
portions are interposed by a recess to bond the vapor chamber.
[0007] The fastening portion is fastened to a PCB through at least
one screw to make the vapor chamber in contact with a heat
generation element. As the fastening portion is formed integrally
at a desired thickness, it has a sufficient strength to withstand
the fastening force of the screw, thus tight sealing between the
vapor chamber and heat generation element affected by deformation
of the heat conduction plate can be prevented, and the vapor
chamber can smoothly contact the heat generation element to quickly
and effectively transfer heat outside.
[0008] The foregoing, as well as additional objects, features and
advantages of the invention will be more readily apparent from the
following detailed description, which proceeds with reference to
the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a sectional view of a conventional heat sink
equipped with a vapor chamber.
[0010] FIG. 2 is an exploded view of the invention.
[0011] FIG. 3 is a perspective view of the invention.
[0012] FIG. 4 is an exploded view of another embodiment of the
invention.
[0013] FIG. 5 is a sectional view of another embodiment of the
invention.
[0014] FIG. 6 is a sectional view of yet another embodiment of the
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] Please refer to FIGS. 2 and 3, the present invention aims to
provide a heat sink equipped with a vapor chamber. The heat sink
includes a heat conduction plate 10 and a vapor chamber 20. The
heat conduction plate 10 has one side formed integrally a plurality
of radiation fins 30 and another side with two lateral edges formed
respectively and integrally a fastening portion 40. The two
fastening portions 40 are interposed by a recess 50 to bond the
vapor chamber 20. Each fastening portion 40 has at least one
aperture 41 run through by at least one screw 60 coupled with a
spring 61 to fasten to a printed circuit board (PCB in short, not
shown in the drawings) to allow the vapor chamber 20 in contact
with a heat generation element (not shown in the drawings).
[0016] Refer to FIGS. 4 and 5 for another embodiment of the
invention. The heat conduction plate 10 has a latch flange 52
respectively on a front side and a rear side of the recess 50, and
an airtight compartment 51 dug downwards. The vapor chamber 20 is
positioned and surrounded by the two latch flanges 52 and the two
fastening portions 40 to cover and seal the airtight compartment
51. The heat conduction plate 10 has an air extraction vent 11
communicating with the airtight compartment 51 to extract air
therefrom and inject into a heat transfer fluid 70 which can be
pure water capable of quickly transferring heat through phase
transition between liquid and gas states of the heat transfer fluid
70. The vapor chamber 20 also has a sealed compartment 22 holding
heat conduction fluid 71 to quickly transfer heat through phase
transition between liquid and gas states of the heat conduction
fluid 71 to rapidly transfer heat from the vapor chamber 20 to the
heat conduction plate 10.
[0017] Refer to FIG. 6 for yet another embodiment of the invention.
The vapor chamber 20 further includes a plurality of heat
conduction fins 21 extended into the airtight compartment 51 to
contact the heat transfer fluid 70 to increase the contact area
with the vapor chamber 20, thereby to further enhance heat transfer
effect to better meet use requirements.
[0018] By means of the structures set forth above, the fastening
portion 40 is integrally formed at a desired thickness, thus has
sufficient strength to withstand the fastening force of the screw
60 to prevent tight sealing between the vapor chamber 20 and heat
generation element affected by deformation of the heat conduction
plate 10, thus the vapor chamber 20 can smoothly contact the heat
generation element. With rapid heat transfer of the heat conduction
fluid 70, heat transfer effect can be further enhanced to meet use
requirements.
* * * * *