U.S. patent application number 13/025160 was filed with the patent office on 2012-08-16 for heat sink module.
Invention is credited to Tsung-Hsien Huang.
Application Number | 20120205084 13/025160 |
Document ID | / |
Family ID | 46636014 |
Filed Date | 2012-08-16 |
United States Patent
Application |
20120205084 |
Kind Code |
A1 |
Huang; Tsung-Hsien |
August 16, 2012 |
HEAT SINK MODULE
Abstract
A heat sink module includes at least one heat conduction base,
at least one heat conduction pipe and a fin heat sink. The heat
conduction base has a recess and at least one engaging protrusion
on the recess. The heat conduction pipe has a heat absorption end
and a heat dissipation end. The heat absorption end is attached to
the recess of the heat conduction base and engaged with the
engaging protrusion. The heat dissipation end is coupled to the fin
heat sink. The fin heat sink is composed of a plurality of fins
which are disposed side by side and connected by the heat
dissipation end of the heat conduction pipe. The fin heat sink has
an engaging groove for engagement of a curved section of a fixing
plate of a heat dissipation fan. The heat dissipation fan can be
quickly coupled to the fin heat sink, simplifying the assembly of
the heat sink module.
Inventors: |
Huang; Tsung-Hsien; (I-Lan
Hsien, TW) |
Family ID: |
46636014 |
Appl. No.: |
13/025160 |
Filed: |
February 11, 2011 |
Current U.S.
Class: |
165/181 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28F 1/32 20130101; F28F 1/30 20130101; H01L 23/427 20130101; H01L
2924/0002 20130101; F28F 2013/001 20130101; H01L 2924/0002
20130101; G06F 1/203 20130101; H01L 2924/00 20130101; F28D 15/0275
20130101 |
Class at
Publication: |
165/181 |
International
Class: |
F28F 1/12 20060101
F28F001/12 |
Claims
1. A heat sink module, comprising at least one heat conduction
base, at least one heat conduction pipe and a fin heat sink; the
heat conduction base being in the form of a thin plate, the heat
conduction base having a recess and at least one engaging
protrusion on an inner surface of the recess; the heat conduction
pipe having a heat absorption end and a heat dissipation end, the
heat absorption end being attached to the recess of the heat
conduction base and engaged with the engaging protrusion, the heat
dissipation end being coupled to the fin heat sink; the fin heat
sink being composed of a plurality of fins which are disposed side
by side and connected by the heat dissipation end of the heat
conduction pipe.
2. The heat sink module as claimed in claim 1, wherein the recess
and the engaging protrusion of the heat conduction base are formed
by stamping.
3. The heat sink module as claimed in claim 1, wherein the recess
and the engaging protrusion of the heat conduction base are formed
by die-casting.
4. The heat sink module as claimed in claim 1, wherein the engaging
protrusion is in the form of a strip.
5. The heat sink module as claimed in claim 1, wherein the engaging
protrusion is in the form of a non-continuous strip.
6. The heat sink module as claimed in claim 1, wherein the engaging
protrusion is in the form of a plurality of convex dots.
7. The heat sink module as claimed in claim 1, further comprising a
heat dissipation fan connected to the fin heat sink, the fins of
the fin heat sink each having a notch to form an engaging groove
when the fins are connected, the heat dissipation fan having a
fixing plate with a curved section, the curved section being
inserted in the engaging groove of the fin heat sink.
8. The heat sink module as claimed in claim 7, wherein the curved
section has a barb portion at a distal end thereof and the notch
has a corresponding barb portion at a distal end thereof to engage
with each other.
9. The heat sink module as claimed in claim 7, wherein the fixing
plate of the heat dissipation fan has a pair of connection lugs at
two sides thereof.
10. The heat sink module as claimed in claim 9, wherein the
connection lugs are fixed to two sides of the fin heat sink by
screws.
11. The heat sink module as claimed in claim 9, wherein the
connection lugs are fixed to two sides of the fin heat sink by
rivets.
12. The heat sink module as claimed in claim 1, wherein the heat
conduction pipe is connected to more than one heat conduction
plate.
13. The heat sink module as claimed in claim 1, wherein the heat
conduction base has more than one recess.
14. The heat sink module as claimed in claim 1, wherein another
surface of the heat conduction base is provided with auxiliary
fins.
15. The heat sink module as claimed in claim 1, wherein another
surface of the heat conduction base is provided with heat
dissipation protrusions.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The present invention relates to a heat sink module, and
more particularly to a heat sink module for a notebook computer.
The heat sink module includes a heat conduction base, a heat
conduction pipe and a fin heat sink or further includes a heat
dissipation fan, which can be assembled quickly and securely.
[0003] (b) Description of the Prior Art
[0004] A notebook computer has a CPU, a north bridge chip, a south
bridge chip, a display chip, or the like therein. These electronic
elements will generate heat when running. It is required to couple
the notebook computer with a heat sink and a fan to dissipate the
heat for providing a stable running.
[0005] A conventional heat sink module comprises a heat conduction
base, a heat conduction pipe, a fin heat sink and a fan. The heat
conduction base has a recess (or a through hole) for insertion of a
heat absorption end of the heat conduction pipe. A heat dissipation
end of the heat conduction pipe is welded or coupled to the fin
heat sink. The heat conduction base of the conventional heat sink
module is a thick rectangular block. The inner surface of the
recess (or the through hole) of the heat conduction base is smooth
and the outer surface of the heat conduction pipe is also smooth,
so the connection of the heat absorption end of the heat conduction
pipe is not stable. The heat absorption end of the heat conduction
pipe may become loose, thus causing a bad contact and the heat of
the heating element cannot be transmitted to the fin heat sink.
Accordingly, the inventor of the present invention has devoted
himself with his many years of practical experiences to solving
this problem.
SUMMARY OF THE INVENTION
[0006] The primary object of the present invention is to provide a
heat sink module which solves the aforementioned problem. The heat
sink module comprises a heat conduction base, a heat conduction
pipe and a fin heat sink. The heat conduction base is in the form
of a thin plate. The heat conduction base has a recess for
insertion of a heat absorption end of the heat conduction pipe. The
heat conduction base has a reduced weight and can be produced with
ease and cost-effectively. The heat conduction base further has an
engaging protrusion on an inner surface of the recess. In
particular, the heat absorption end of the heat conduction pipe is
matched with the recess of the heat conduction base, providing a
stable connection. Thus, the heat absorption end and the recess
won't be loosened easily. The heat absorption end of the heat
conduction pipe has a better contact with a heating element to
ensure that the heat of the heating element can be transmitted to
the fin heat sink.
[0007] Preferably, the engaging protrusion on the inner surface of
the recess of the heat conduction base is in the form of a strip,
in the form of a non-continuous strip, or in the form of a
plurality of convex dots. The purpose of the engaging protrusion is
to firmly engage the inner surface of the recess with the heat
absorption end of the heat conduction pipe.
[0008] Preferably, the fin heat sink comprises a plurality of fins
which are disposed side by side and connected by the heat
dissipation end of the heat conduction pipe. Each fin of the fin
heat sink has a notch to form an engaging groove when the fins are
connected. The heat dissipation fan has a fixing plate with a
curved section. The curved section is inserted in the engaging
groove of the fin heat sink, so that the heat dissipation fan can
be connected to the fin heat sink quickly to simplify the
connection of the heat sink module and the heat dissipation
fan.
[0009] Preferably, the fixing plate of the heat dissipation fan has
a pair of connection lugs at two sides thereof. The connection lugs
are fixed to two sides of the fin heat sink to strengthen the
connection of the heat dissipation fan and the fin heat sink,
preventing the fixing plate from becoming loose. The connection
lugs are fixed to the two sides of the fin heat sink by screws or
rivets.
[0010] Preferably, the heat conduction pipe is connected to more
than one heat conduction base. The single heat conduction pipe is
used to transmit the heat of a heating element disposed on the more
than one heat conduction base.
[0011] Preferably, the heat conduction base has more than one
recess to accommodate a plurality of heat conduction pipes.
[0012] Preferably, the heat conduction base is in an irregular
shape. Another surface of the heat conduction base is provided with
auxiliary fins or heat dissipation protrusions, such that the heat
conduction base provides a better heat dissipation effect.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 is a perspective view according to a first embodiment
of the present invention;
[0014] FIG. 2 is a partially exploded view according to the first
embodiment of the present invention;
[0015] FIG. 3 is a sectional view showing the heat conduction pipe
attached to the recess of the heat conduction base according to the
first embodiment of the present invention;
[0016] FIG. 4 is a top view showing the engaging protrusion in the
form of a non-continuous strip according to the first embodiment of
the present invention;
[0017] FIG. 5 is a top view showing the engaging protrusion in the
form of a plurality of convex dots according to the first
embodiment of the present invention;
[0018] FIG. 6 is a perspective view according to a second
embodiment of the present invention connected with a heat
dissipation fan;
[0019] FIG. 7 is an exploded view according to the second
embodiment of the present invention;
[0020] FIG. 8 is a perspective view according to a third embodiment
of the present invention;
[0021] FIG. 9 is an exploded view according to the third embodiment
of the present invention;
[0022] FIG. 10 is a perspective view according to a fourth
embodiment of the present invention;
[0023] FIG. 11 is a perspective view according to a fifth
embodiment of the present invention;
[0024] FIG. 12 is a bottom view according to the fifth embodiment
of the present invention;
[0025] FIG. 13 is a perspective view according to a sixth
embodiment of the present invention; and
[0026] FIG. 14 is a bottom view according to the sixth embodiment
of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0027] Embodiments of the present invention will now be described,
by way of example only, with reference to the accompanying
drawings.
[0028] As shown in FIG. 1 and FIG. 2, a heat sink module according
to a first embodiment of the present invention comprises a heat
conduction base 1, a heat conduction pipe 2, and a fin heat sink
3.
[0029] The heat conduction base 1 is in the form of a thin plate.
As shown in FIG. 2, the heat conduction base 1 has a recess 11 and
at least one engaging protrusion 111 on an inner surface of the
recess 11. In this embodiment, the engaging protrusion 111 is in
the form of a plurality of strips.
[0030] The heat conduction pipe 2 has a heat absorption end 21 and
a heat dissipation end 22. The heat absorption end 21 is attached
to the recess 11 of the heat conduction base 1 and engaged with the
engaging protrusion 111, as shown in FIG. 3. The heat dissipation
end 22 is coupled to the fin heat sink 3. As shown in the drawings
of this embodiment, the heat dissipation end 22 is tightly inserted
in the fin heat sink 3.
[0031] The fin heat sink 3 comprises a plurality of fins 31 which
are disposed side by side and connected by the heat dissipation end
22 of the heat conduction pipe 2.
[0032] The heat conduction base 1, the heat conduction pipe 2 and
the fin heat sink 3 of the heat sink module are tightly connected
into an integral one. The heat conduction base 1 is in the form of
a thin plate, which has a reduced weight and can be produced with
ease and cost-effectively. In particular, the heat absorption end
21 of the heat conduction pipe 2 is matched with the recess 11 of
the heat conduction base 1, providing a stable connection. Thus,
the heat absorption end 21 and the recess 11 won't be loosened
easily, so that the heat absorption end 21 of the heat conduction
pipe 2 has a good contact with a heating element, such as a CPU, a
north bridge chip, a south bridge chip, a display chip, or the
like, to ensure that the heat of the heating element can be
transmitted to the fin heat sink 3.
[0033] The recess 11 and the engaging protrusion 111 of the heat
conduction base 1 are formed by stamping or die-casting.
[0034] The shape of the engaging protrusion 111 on the inner
surface of the recess 11 of the heat conduction base 1 is not
limited to the strip form as shown in FIG. 2. The engaging
protrusion 111a can be in the form of a non-continuous strip as
shown in FIG. 4, or the engaging protrusion 111b is in the form of
a plurality of convex dots as shown in FIG. 5. The purpose of the
engaging protrusion 111, 111a, 111b is to firmly engage the inner
surface of the recess 11 with the heat absorption end 21 of the
heat conduction pipe 2.
[0035] FIG. 6 and FIG. 7 show a second embodiment of the present
invention, which is substantially similar to the first embodiment
with the exceptions described hereinafter. The fin heat sink 3 is
connected with a heat dissipation fan 4. Each fin 31 of the fin
heat sink 3 has a notch 311 to form an engaging groove 300 when the
fins 31 are connected. The heat dissipation fan 4 has a fixing
plate 41 with a curved section 411. The curved section 411 is
inserted in the engaging groove 300 of the fin heat sink 3, so that
the heat dissipation fan 4 can be quickly connected to the fin heat
sink 3 to simplify the connection of the heat sink module and the
heat dissipation fan 4. The curved section 411 has a barb portion
412 at a distal end thereof and the notch 311 has a corresponding
barb portion 312 at a distal end thereof to engage with each other
when the curved section 411 is inserted in the engaging groove 300,
preventing the fixing plate 41 of the heat dissipation fan 4 from
becoming loose or disengaged.
[0036] The fixing plate 41 of the heat dissipation fan 4 has a pair
of connection lugs 42 at two sides thereof. The connection lugs 42
are fixed to two sides of the fin heat sink 3 to strengthen the
connection of the heat dissipation fan 4 and the fin heat sink 3,
preventing the fixing plate 4 from becoming loose. The connection
lugs 42 are fixed to the two sides of the fin heat sink 3 by screws
or rivets.
[0037] FIG. 8 and FIG. 9 show a third embodiment of the present
invention, which is substantially similar to the second embodiment
with the exceptions described hereinafter. The third embodiment
comprises two heat conduction bases 1a, 1b, two heat conduction
pipes 2a, 2b, a fin heat sink 3, and a heat dissipation fan 4. The
first heat conduction base 1a has two recesses 11 to accommodate
the heat conduction pipes 2a, 2b. The second heat conduction base
1b has an irregular shape. The first heat conduction pipe 2a is
connected to the two heat conduction bases 1a, 1b in sequence to
dissipate the heat from the heat conduction bases 1a, 1b. The
second heat conduction pipe 2b is only connected to the first heat
conduction base 1a. The heat dissipation ends 22a, 22b of the two
heat conduction pipes 2a, 2b are coupled to the fin heat sink 3.
which is connected with the heat dissipation fan 4.
[0038] FIG. 10 shows a fourth embodiment of the present invention,
which is substantially similar to the third embodiment without the
heat dissipation fan.
[0039] FIG. 11 and FIG. 12 show a fifth embodiment of the present
invention, which is substantially similar to the aforesaid
embodiments with the exceptions described hereinafter. The fifth
embodiment comprises two heat conduction bases 1c, 1d, three heat
conduction pipes 2a, 2b, 2c and the fin heat sink 3. The two heat
conduction bases 1c, 1d are in an irregular shape. As shown in FIG.
12, another surface 12c of the heat conduction base 1c is provided
with auxiliary fins 13c, such that the heat conduction base 1c
provides a better heat dissipation effect.
[0040] FIG. 13 and FIG. 14 show a sixth embodiment of the present
invention, which is substantially similar to the fifth embodiment
with the exceptions described hereinafter. As shown in FIG. 14,
another surface 12e of the heat conduction base 1e is provided with
heat dissipation protrusions 121e, such that the heat conduction
base 1e provides a better heat dissipation effect.
[0041] In the aforesaid embodiments, the heat conduction base 1,
1a, 1b, 1c, 1d, 1e can be connected with a foot seat 5 which is
fixed to a circuit board. The foot seat 5 is a traditional element,
and won't be described herein.
[0042] The heat conduction pipe 2, 2a, 2b, 2c is also a traditional
element. In general, it is made of copper which is a soft material,
so it can be attached to the recess 11 and engaged with the
engaging protrusion 111, 111a, 111b. Accordingly, the heat
conduction pipe 2, 2a, 2b, 2c and the heat conduction base 1, 1a,
1b, 1c, 1d, 1e can be tightly connected.
[0043] Although particular embodiments of the present invention
have been described in detail for purposes of illustration, various
modifications and enhancements may be made without departing from
the spirit and scope of the present invention. Accordingly, the
present invention is not to be limited except as by the appended
claims.
* * * * *