U.S. patent application number 13/166506 was filed with the patent office on 2012-08-02 for low-profile inducator and its fabrication method.
Invention is credited to Chia-Ping MO.
Application Number | 20120194314 13/166506 |
Document ID | / |
Family ID | 44851462 |
Filed Date | 2012-08-02 |
United States Patent
Application |
20120194314 |
Kind Code |
A1 |
MO; Chia-Ping |
August 2, 2012 |
LOW-PROFILE INDUCATOR AND ITS FABRICATION METHOD
Abstract
A low-profile inductor includes two flat substrates each flat
substrate having opposing inner surface and outer surface, a set of
metal wire conductors radially arranged in the inner surface, a
connection contact located on each end of each metal wire conductor
and a circuit layout arranged in the outer surface, a solder
material set in between the flat substrates to electrically connect
the connection contacts and the metal wire conductors of the flat
substrates into two series, and a metal core bonded to the inner
surface of each flat substrate with an adhesive and set between the
metal wire conductors of the two flat substrates such that an
induction zone is defined between the two flat substrates
corresponding to the metal wire conductors to provide a continuous
winding type metal magnetic coil inductive effect, enhancing
rectifying and filtering performance.
Inventors: |
MO; Chia-Ping; (Keelung
City, TW) |
Family ID: |
44851462 |
Appl. No.: |
13/166506 |
Filed: |
June 22, 2011 |
Current U.S.
Class: |
336/200 ;
29/602.1 |
Current CPC
Class: |
H01F 17/0033 20130101;
H05K 1/165 20130101; H01F 2017/0066 20130101; H05K 2201/09709
20130101; H05K 2201/086 20130101; Y10T 29/4902 20150115 |
Class at
Publication: |
336/200 ;
29/602.1 |
International
Class: |
H01F 5/00 20060101
H01F005/00; H01F 41/00 20060101 H01F041/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 28, 2011 |
TW |
100103361 |
Claims
1. A low-profile inductor, comprising: two symmetric flat
substrates arranged in parallel, each said flat substrate
comprising opposing inner surface and outer surface, a set of metal
wire conductors radially arranged in said inner surface, a
connection contact located on each of two distal ends of each of
said metal wire conductors and a circuit layout arranged in said
outer surface; a solder material set in between said flat
substrates to electrically connect the metal wire conductors of
said flat substrates in two series; and a metal core bonded to the
inner surface of each said flat substrate by an adhesive and set
between the metal wire conductors at each of said two flat
substrates such that an induction zone is defined between said flat
substrates corresponding to the respective set of metal wire
conductors to provide a continuous winding type metal magnetic coil
inductive effect.
2. The low-profile inductor as claimed in claim 1, wherein said
flat substrates are printed circuit boards or flexible circuit
boards, each carrying a circuit layout at the respective outer
surface.
3. The low-profile inductor as claimed in claim 2, wherein each
said flat substrate comprises a plurality of metal input contacts
and metal output contacts arranged in the outer surface thereof and
electrically connected to said circuit layout; the two series of
the electrically connected metal wire conductors and connection
contacts at each said flat substrate are extended out of said
induction zone and respectively electrically connected between said
metal input contacts and said metal output contacts.
4. The low-profile inductor as claimed in claim 1, wherein said
metal core is selected from the group of iron based, iron-nickel
based and cobalt based non-crystalline alloys and iron based bulk
nanocrystalline alloy, and made in one of the shapes of annular,
rectangular, polygonal and multilateral open frames.
5. The low-profile inductor as claimed in claim 1, wherein said
adhesive is selected from the group of polymer adhesive, plastic
resin glue, chloroprene phenolic adhesive and quick dry
adhesive.
6. A low-profile inductor fabrication method, comprising the steps
of: (i) preparing two flat substrates each having opposing inner
surface and outer surface, and then employing a process to form
metal wire conductors in the inner surface of each said flat
substrate subject to a predetermined radially extended pattern and
to form a circuit layout in the outer surface of each said flat
substrate subject to a predetermined circuit layout pattern; (ii)
forming a connection contact at each of two distal ends of each of
the metal wire conductors at each said flat substrate; (iii)
preparing a metal core, and then applying an adhesive to adhere two
opposing sides of said metal core to the inner surfaces of said two
flat substrates between the metal wire conductors at the inner
surface of each said flat substrates and between the two connection
contacts at each said metal wire conductor; (iv) applying a solder
material to the connection contacts at said metal wire conductors
to electrically connect the metal wire conductors at one said flat
substrate with the metal wire conductors at the other said flat
substrate into two series, enabling the metal wire conductors to
provide a continuous winding type metal magnetic coil inductive
effect; and (v) after bonding of the metal wire conductors at one
said flat substrate with the metal wire conductors at the other
said flat substrate, said flat substrates, said metal wire
conductors, said solder material and said metal core constitute an
inductor.
7. The low-profile inductor fabrication method as claimed in claim
6, wherein the metal wire conductors at said two flat substrates
define an induction zone for providing a continuous winding type
metal magnetic coil inductive effect.
8. The low-profile inductor fabrication method as claimed in claim
7, wherein each said flat substrate defines opposing input side and
output side at the outer surface thereof opposite to said induction
zone.
9. The low-profile inductor fabrication method as claimed in claim
6, wherein said metal core is selected from the group of iron
based, iron-nickel based and cobalt based non-crystalline alloys
and iron based bulk nanocrystalline alloy, and made in one of the
shapes of annular, rectangular, polygonal and multilateral open
frames.
10. The low-profile inductor fabrication method as claimed in claim
6, wherein said adhesive is selected from the group of polymer
adhesive, plastic resin glue, chloroprene phenolic adhesive and
quick dry adhesive.
Description
[0001] This application claims the priority benefit of Taiwan
patent application number 100103361 file on Jan. 28, 2011.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to electrical inductors and
more particularly, to a low-profile inductor, which includes two
flat substrates electrically arranged in parallel, and a metal core
set between a set of radially arranged metal wire conductors at
each of the two flat substrates to provide a continuous winding
type metal magnetic coil inductive effect, facilitating fabrication
and eliminating the drawback of complicated winding procedure of
the fabrication of a prior art inductor using an enabled wire
winding technique
[0004] 2. Description of the Related Art
[0005] Following fast development of computer technology, many
advanced, high-speed. Small-size electronic and electrical products
have been created and have appeared on the market. These advanced
electronic and electrical products have the common time-saving,
labor-saving and high performance characteristics. Further, to
adapt to improvement of new generation electronic and electrical
products, the related control systems, circuit boards and
components must be relatively improved. Nowadays, electronic
products having light, thin, short and small characteristics have
become the mainstream products in the market. In consequence,
electronic component parts must have low profile and small size
characteristics, saving circuit board space.
[0006] An inductor or choke is a passive electrical component
commonly used in many different electronic products to store energy
in a magnetic field created by the electric current passing through
it. Typically an inductor, as shown in FIG. 8, is a conducting wire
shaped as a coil B wound on a core A. The loops of the coil B help
to create a strong magnetic field inside the coil. Due to the
time-varying magnetic field inside the coil, a voltage is induced.
Inductors are basic components used in electronics where current
and voltage change with time, due to the ability of inductors to
delay and reshape alternating currents. This design of inductor or
choke is still not satisfactory in function due to the following
drawbacks: [0007] 1. After winding of the coil B on the core A, the
dimension is greatly increased. When used in a circuit board, the
inductor occupies much circuit board space, affecting the circuit
arrangement of the circuit board. [0008] 2. When winding an
enameled wire on the core A to form the coil B, it is difficult to
control the gap between each two adjacent loops of the coil B.
Further, because the coil B is exposed to the outside, it tends to
be scratched or damaged by an external object during installation
or delivery, affecting the performance. [0009] 3. Winding an
enabled wire on the core A to form the desired coil B must be done
manually by labor, complicating the fabrication of the inductor and
wasting much labor and time.
[0010] Therefore, it is desirable to provide an inductor that
eliminates the drawbacks of the aforesaid prior art design.
SUMMARY OF THE INVENTION
[0011] The present invention has been accomplished under the
circumstances in view. It is one object of the present invention to
provide a low-profile inductor, which has a low profile
characteristic, saving much installation space. It is another
object of the present invention to provide a low-profile inductor,
which is suitable for mass production, saving much fabrication
labor and time.
[0012] To achieve this and other objects of the present invention,
a low-profile inductor comprises two symmetric flat substrates
arranged in parallel, each flat substrate comprising opposing inner
surface and outer surface, a set of metal wire conductors radially
arranged in the inner surface, a connection contact located on each
of two distal ends of each metal wire conductor and a circuit
layout arranged in the outer surface, a solder material set in
between the flat substrates to electrically connect the connection
contacts and the metal wire conductors of the flat substrates in
two series, and a metal core bonded to the inner surface of each of
the two flat substrates with an adhesive and set between the metal
wire conductors of the two flat substrates such that an induction
zone is defined between the two flat substrates corresponding to
the metal wire conductors to provide a continuous winding type
metal magnetic coil inductive effect, enhancing rectifying and
filtering performance.
[0013] Further, the solder material can be tin solder, solder
balls, or silver glue. Further, the bonding technique employed to
electrically connect the connection contacts and the metal wire
conductors can be, for example, reflow soldering. Further, each
flat substrate defines opposing input side and output side at the
outer surface thereof opposite to the induction zone. The two
initial ones and two last ones of the two electrically connected
series of the connection contacts of the metal wire conductors in
the induction zone at the inner surface of each of the two flat
substrates are respectively electrically connected to input side
and output side at the outer surfaces of the flat substrates.
[0014] Further, the outer surface of each of the two flat
substrates is formed of a copper foil layer. After formation of the
designed circuit layout, the copper foil layer of the outer surface
of each of the two flat substrates is coated with an insulative
resin layer, and then coated with a layer of green color
photosensitive lacquer by means of screen printing, curtain coating
or electrostatic spraying techniques, and then heat dried and then
cooled down, and then radiated by ultraviolet rays in an UV
exposure machine under the use of a patterned mask to polymerize
the green color photosensitive lacquer. After polymerization of the
green color photosensitive lacquer at the outer surface of each of
the two flat substrates, apply sodium carbonate solution to remove
the part of the coating that is not radiated by the ultraviolet
rays. Thereafter, apply a high temperature heating process to cure
the resin in the green color photosensitive lacquer. Thus, the
circuit layout in the outer surface of each of the two flat
substrates is well protected against oxidation or accidental short
circuit during welding.
[0015] Further, the metal core is selected from the group of iron
based, iron-nickel based and cobalt based non-crystalline alloys
and iron based bulk nanocrystalline alloy, and made in one of the
shapes of annular, rectangular, polygonal and multilateral open
frames.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is an oblique top elevational view of an inductor in
accordance with the present invention.
[0017] FIG. 2 is an exploded view of the inductor in accordance
with the present invention.
[0018] FIG. 3 corresponds to FIG. 2 when viewed from another
angle.
[0019] FIG. 4 is a sectional side view of the inductor in
accordance with the present invention.
[0020] FIG. 5 is an inductor fabrication flow according to the
present invention.
[0021] FIG. 6 is a perspective view of the inductor in accordance
with the present invention.
[0022] FIG. 7 is a perspective view of an alternate form of the
inductor in accordance with the present invention.
[0023] FIG. 8 is an elevational view of an inductor according to
the prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0024] Referring to FIGS. 1-4, a low-profile inductor in accordance
with the present invention is shown comprising two symmetric flat
substrates 1 and at least one metal core 2.
[0025] Each flat substrate 1 has opposing inner surface 11 and
outer surface 12. Metal wire conductors 111 are radially arranged
at the center area of the inner surface 11 of each flat substrate
1, each having a connection contact 112 at each of the opposing
ends thereof. The outer surface 12 of each flat substrate 1
provides a circuit layout having a filter function. The circuit
layout is an electric loop consisting of different electronic
components 121, forming an electrical loop.
[0026] Each metal core 2 is an annular non-crystalline metal
core.
[0027] During installation of the inductor, the metal core 2 is set
between the metal wire conductors 111 at the inner surfaces 11 of
the flat substrates 1 and bonded thereto with an adhesive 21 (the
adhesive can be coated on the metal wire conductors 111 at the
inner surfaces 11 of the flat substrates 1 or the two opposing
sides of the metal core 2). Thereafter, a solder material 113 is
applied to electrically and alternatively connect the connection
contacts 112 of the metal wire conductors 111 at the inner surfaces
11 of the flat substrates 1 into two series. After the two
symmetric flat substrates 1 and the at least one metal core 2 are
assembled to form an inductor, the two electrically connected
series of the metal wire conductors 111 work with the metal core 2
to produce a continuous winding type metal magnetic coil inductive
effect.
[0028] Further, the flat substrates 1 can be regular printed
circuit boards or flexible circuit boards. The metal wire
conductors 111 can be formed in the inner surfaces 11 of the flat
substrates 1 by means of a mechanical process or photolithography
technique. After formation of the metal wire conductors 111 in the
inner surface 11 of each flat substrate 1, an induction zone 13 is
defined between the copper foils at the two flat substrates 1
corresponding to the metal wire conductors 111. Further, two
initial ones and two last ones of the two electrically connected
series of the connection contacts 112 of the metal wire conductors
111 in the induction zone 13 at the inner surface 11 of each of the
flat substrates 1 are respectively electrically connected to
respective metal input contacts 114 and metal output contacts 115
at the outer surface 12 of the respective flat substrate 1.
[0029] Further, as stated above, the metal core 2 according to the
present preferred embodiment is an annular non-crystalline metal
core. The metal core 2 can be made by iron based, iron-nickel based
or cobalt based non-crystalline alloy, or iron based bulk
nanocrystalline alloy. The annular configuration is not a
limitation. Alternatively, the metal core 2 can be made in the
shape of a rectangular, polygonal or multilateral open frame.
[0030] Referring to FIGS. 5-7 and FIG. 2, the inductor is made
subject to the following manufacturing steps:
[0031] (100) Prepare two flat substrates 1 each having opposing
inner surface 11 and outer surface 12, and then employ a PC board
manufacturing process including hole drilling, image transfer,
plating, etching, anti-soldering and/or surface treatment steps to
form metal wire conductors 111 in the inner surface 11 of each of
the flat substrates 1 subject to a predetermined pattern for
enabling an induction zone 13 to be defined between the two flat
substrates 1 corresponding to the metal wire conductors 111, and
also to form a circuit layout consisting of different electronic
components 121, metal input contacts 114 and metal output contacts
115 in the outer surface 12 of each flat substrate 1 subject to a
predetermined circuit layout pattern.
[0032] (101) Form a connection contact 112 at each of the two
opposing ends of each of the metal wire conductors 111 at each of
the two flat substrates 1.
[0033] (102) Prepare a metal core 2, and then apply an adhesive 21
to adhere two opposing sides of the metal core 2 to the inner
surfaces 11 of the two flat substrates 1 between the metal wire
conductors 111 at the inner surface 11 of each of the two flat
substrates 1 and between the two connection contacts 112 at each
metal wire conductor 111.
[0034] (103) Apply a solder material 113 (solder paste, solder
balls, silver glue) to the connection contacts 112 at the metal
wire conductors 111 to electrically connect the metal wire
conductors 111 at one flat substrate 1 with the metal wire
conductors 111 at the other flat substrate 1 into two series,
enabling the metal wire conductors 111 to provide a continuous
winding type metal magnetic coil inductive effect.
[0035] (104) After bonding between the metal wire conductors 111 at
one flat substrate 1 with the metal wire conductors 111 at the
other flat substrate 1, the flat substrates 1 and the metal core 2
constitute a low-profile inductor capable of providing a continuous
winding type metal magnetic coil inductive effect.
[0036] Further, the metal wire conductors 111 can be formed in the
inner surface 11 of each of the flat substrates 1 subject to a
predetermined pattern by means of screen printing, etching or
electroplating technique so that an induction zone 13 can be
defined between the two flat substrates 1 corresponding to the
metal wire conductors 111. Further, the desired circuit layout with
the related electronic components 121, metal input contacts 114 and
metal output contacts 115 are formed in the outer surface 12 of
each of the flat substrates 1 subject to a predetermined circuit
layout patter. Further, the two initial ones and two last ones of
the two electrically connected series of the connection contacts
112 of the metal wire conductors 111 are respectively electrically
connected to respective metal input contacts 114 and metal output
contacts 115 at the outer surfaces 12 of the flat substrates 1.
[0037] Further, the metal core 2 is set between the metal wire
conductors 111 at the inner surfaces 11 of the flat substrates 1
and bonded thereto with an adhesive 21. The adhesive 21 can be
coated on the metal wire conductors 111 at the inner surface 11 of
each of the flat substrates 1 or the two opposing sides of the
metal core 2. Further, the adhesive 21 is selected from the group
of polymer adhesive, plastic resin glue, chloroprene phenolic
adhesive and quick dry adhesive. Further, the metal core 2 is
selected from the group of iron based, iron-nickel based and cobalt
based non-crystalline alloys and iron based bulk nanocrystalline
alloy. Further, the metal core 2 can be made in one of the shapes
of annular, rectangular, polygonal and multilateral open
frames.
[0038] Subject to the thin sheet design of the flat substrates 1
and the use of thin thickness metal core 2, the inductor has the
characteristics of low profile, excellent induction and current
rectification ability. For the advantage of space saving, the
invention is practical for use in an electronic product having
light, thin, short and small characteristics. When an electric
current is guided through the metal input contacts 114 at one flat
substrate 1, it goes through the connection contacts 112 at the
metal wire conductors 111 and the induction zone 13 to the
respective metal output contacts 115 for output to an external
circuit for enabling inductance components to perform charging,
discharging, rectifying and chocking operations stably. When an
electric current goes through the filter components, the induced
magnetic field does not interfere with other surrounding electronic
components.
[0039] Further, the outer surface 12 of each of the two flat
substrates 1 is formed of a copper foil layer. After formation of
the designed circuit layout, the copper foil layer of the outer
surface 12 of each of the two flat substrates 1 is coated with an
insulative resin layer, and then coated with a layer of green color
photosensitive lacquer by means of screen printing, curtain coating
or electrostatic spraying techniques, and then heat dried and then
cooled down, and then radiated by ultraviolet rays in an UV
exposure machine under the use of a patterned mask to polymerize
the green color photosensitive lacquer. After polymerization of the
green color photosensitive lacquer at the outer surface 12 of each
of the two flat substrates 1, apply sodium carbonate solution to
remove the part of the coating that is not radiated by the
ultraviolet rays. Thereafter, apply a high temperature heating
process to cure the resin in the green color photosensitive
lacquer. Thus, the circuit layout in the outer surface 12 of each
of the two flat substrates 1 is well protected against oxidation or
accidental short circuit during welding.
[0040] In conclusion, the invention provides an inductor comprising
two flat substrates 1 each having opposing inner surface 11 and
outer surface 12, a set of metal wire conductors 111 radially
arranged at the center area of the inner surface 11 of each flat
substrate 1 and a connection contact 111 at each of the opposing
ends of each of the metal wire conductors 111, a solder material
113 electrically and alternatively connecting the connection
contacts 112 of the metal wire conductors 111 at the inner surface
11 of each of the flat substrates 1 into two series to have an
induction zone 13 be defined between the two flat substrates 1
corresponding to the metal wire conductors 111, and a metal core 2
set in the induction zone 13 between the two flat substrates 1 and
adhered to the radially arranged metal wire conductors 111 with an
adhesive 21 to provide a continuous winding type metal magnetic
coil inductive effect for filtering, rectifying and chocking
functions, avoiding interference. Thus, the inductor has the
characteristics of low profile, excellent induction and current
rectification ability
[0041] During application, the inductor of the invention has the
advantages and features as follows:
[0042] By means of setting the metal core 2 between the two flat
substrates to form the desired inductor, the inductor has a low
profile characteristic practical for in an electronic product
having light, thin, short and small characteristics.
[0043] The metal core 2 is set between the radially arranged metal
wire conductors 111 at the inner surface 11 of each of the flat
substrates 1 within the induction zone 13 and bonded thereto with
an adhesive 21 to provide a continuous winding type metal magnetic
coil inductive effect, eliminating the complicated winding
procedure in the fabrication of a prior art inductor using an
enabled wire winding technique.
[0044] The inductor has low profile and small size characteristics.
Thus, when a magnetic field is induced upon conduction of electric
current through the respective metal wire conductors 111,
connection contacts 112 and solder material 113 and the induction
zone 13, the induced magnetic field does not interfere with
surrounding electronic components, enhancing high performance of
the connected circuit board in current or signal transmission or
current rectification.
[0045] Subject to the arrangement of the metal wire conductors 111
and the metal core 2 to provide a continuous winding type metal
magnetic coil inductive effect, the inductor eliminates the
drawback of complicated winding procedure in the fabrication of a
prior art inductor using an enabled wire winding technique, thereby
lowering the manufacturing cost.
[0046] Although a particular embodiment of the invention has been
described in detail for purposes of illustration, various
modifications and enhancements may be made without departing from
the spirit and scope of the invention. Accordingly, the invention
is not to be limited except as by the appended claims.
* * * * *