U.S. patent application number 13/346518 was filed with the patent office on 2012-07-12 for led light disposed on a flexible substrate and connected with a printed 3d conductor.
Invention is credited to Aaron J. Golle, John Golle, Walter J. Paciorek.
Application Number | 20120175667 13/346518 |
Document ID | / |
Family ID | 46454597 |
Filed Date | 2012-07-12 |
United States Patent
Application |
20120175667 |
Kind Code |
A1 |
Golle; Aaron J. ; et
al. |
July 12, 2012 |
LED LIGHT DISPOSED ON A FLEXIBLE SUBSTRATE AND CONNECTED WITH A
PRINTED 3D CONDUCTOR
Abstract
An example includes subject matter (such as an apparatus)
comprising a planar substrate including a first surface that is
planar, at least one bare light emitting diode ("LED") die coupled
to the substrate and conductive ink electrically coupling the at
least one bare LED die, wherein the conductive ink is disposed on
the substrate and extends onto a surface of the LED that is
out-of-plane from the first surface.
Inventors: |
Golle; Aaron J.; (Shakopee,
MN) ; Golle; John; (Eden Prairie, MN) ;
Paciorek; Walter J.; (Phoenix, AZ) |
Family ID: |
46454597 |
Appl. No.: |
13/346518 |
Filed: |
January 9, 2012 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
61542736 |
Oct 3, 2011 |
|
|
|
Current U.S.
Class: |
257/99 ;
257/E33.066; 438/26 |
Current CPC
Class: |
F21Y 2103/10 20160801;
H05K 2201/10106 20130101; H05K 1/189 20130101; H05K 2203/1469
20130101; F21V 3/00 20130101; H01L 33/20 20130101; H01L 2224/24
20130101; H01L 29/18 20130101; B33Y 80/00 20141201; F21V 3/02
20130101; H01L 33/44 20130101; F21K 9/232 20160801; F21V 29/506
20150115; F21Y 2107/00 20160801; H01L 33/62 20130101; H01L
2933/0066 20130101; H05K 2203/1344 20130101; F21V 29/83 20150115;
F21Y 2115/10 20160801; H05K 3/305 20130101; H05K 3/14 20130101;
H01L 25/0753 20130101 |
Class at
Publication: |
257/99 ; 438/26;
257/E33.066 |
International
Class: |
H01L 33/62 20100101
H01L033/62 |
Claims
1. An apparatus, comprising: a planar substrate including a first
surface that is planar; at least one bare light emitting diode
("LED") die coupled to the first surface, the at least one bare LED
die comprising: a planar N-doped region located substantially
parallel to the planar substrate and facing away from the planar
substrate; and a P-doped region defining a mesa-shaped section
facing away from the planar substrate, the P-doped region disposed
parallel the N-doped region, further away from the planar substrate
than the N-doped region; and an insulator disposed between the
N-doped region and the planar substrate, along a portion of the at
least one bare LED die, from a side of the mesa, along the N-doped
region, and onto a side of the N-doped region.
2. The apparatus of claim 1, wherein the insulator contacts a
surface of a bare LED die that is substantially perpendicular to
first surface.
3. The apparatus of claim 1, wherein a conductive ink is disposed
over an edge of the bare LED die, onto two non planar sides of the
bare LED die.
4. The apparatus of claim 1, wherein the insulator comprises
non-conductive ink.
5. The apparatus of claim 1, wherein the at least one bare LED die
is electrically coupled with the conductive ink.
6. The apparatus of claim 3, wherein the conductive ink is disposed
on the planar substrate and extends onto a surface of the bare LED
die that is in a different plane than the planar substrate.
7. An apparatus, comprising: a planar substrate including a first
surface that is planar; at least one bare light emitting diode
("LED") die coupled to the planar substrate, the at least one bare
LED die comprising: an N-doped region; and a P-doped region
defining a mesa-shaped section on disposed further away from the
planar substrate than the N-doped region; an insulative chip
substrate disposed between the N-doped region and the planar
substrate; and conductive ink electrically connected to the at
least one bare LED die, wherein the conductive ink is disposed on
the planar substrate and extends onto a surface of the LED that is
out-of-plane from the first surface of the planar substrate.
8. The apparatus of claim 7, wherein the conductive ink includes
nanoparticle-ink.
9. The apparatus of claim 8, wherein the nanoparticle-ink comprises
silver.
10. The apparatus of claim 7, wherein the planar substrate is
flexible.
11. The apparatus of claim 7, wherein the conductive ink is
disposed on the planar substrate and the surface of the LED die
with an aerosol jet printer.
12. A method, comprising: placing at least one bare LED die on a
planar substrate having a major face; and printing conductive ink
on the planar substrate and at least one bare LED with an aerosol
jet printer to dispose the conductive ink onto the planar surface,
a leading side of the at least one bare LED die that extends along
a first side plane that intersects the major face, a top of the at
least one bare LED die, and a trailing surface of the at least one
bare LED die that extends along a second side plane that intersects
the major face.
13. The method of claim 12, wherein the head of the aerosol jet
printer is at a 45.degree. angle with respect to a plane of the
planar substrate, and the first and second side planes are
substantially parallel, perpendicular with the top and the major
face.
14. The method of claim 13, wherein the printing conductive ink
includes printing a nanoparticle ink.
15. The method of claim 14, wherein printing includes heating the
nanoparticle-ink.
16. The method of claim 12, comprising disposing a glop-top onto
the bare LED die.
17. The method of claim 16, wherein disposing a glop-top includes
disposing the glop-top to cover more than one bare LED die.
18. The method of claim 16, comprising disposing a second planar
substrate onto the glop-top.
19. The method of claim 18, wherein the second planar substrate is
at least partially transparent.
20. The method of claim 12, disposing an insulator onto the at
least one bare LED die, alongside a mesa, to cover an N-doped
portion of the bare LED die.
Description
CLAIM OF PRIORITY
[0001] This patent application claims the benefit of priority,
under 35 U.S.C. Section 119(e), to U.S. Provisional Patent
Application Ser. No. 61/542,736, entitled "LED Light Disposed on a
Flexible Substrate and Connected with a Printed 3D conductor,"
filed on Oct. 3, 2011 (Attorney Docket No. 1748.037PRV), which is
hereby incorporated by reference herein in its entirety.
BACKGROUND
[0002] Artificial light sources, such as incandescent light bulbs,
burn inefficiently, sometimes with only 10% efficiency, consuming
excess power and generating waste heat. Further, these devices have
limited service lives.
[0003] Other light sources such as fluorescent tubes and/or CFLs
(compact fluorescent lights) contain mercury and are hazardous to
our environment.
[0004] Emerging tight sources including light emitting diodes
("LEDs") address many of the efficacy and life issues but currently
are expensive to manufacture and have form factors that are not
appealing to the consumers. What is needed is a new way to mass
produce solid state lighting modules that can be produced
inexpensively and meet the needs of both commercial and residential
consumers. Devices that generate less heat, last longer, and are
friendly to the environment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The drawings illustrate generally, by way of example, but
not by way of limitation, various embodiments discussed in the
present document.
[0006] FIG. 1A is an example showing a top view of a configuration
of LEDs in a circuit.
[0007] FIG. 1B is an example showing a top view of a configuration
of LEDs in a circuit.
[0008] FIG. 2 is a side view of a LED circuit with horizontal bare
LED dies, according to an example.
[0009] FIG. 3A is a side view of a LED circuit with vertical bare
LED dies, according to an example.
[0010] FIG. 3B is a partial view of a circuit, showing a connection
between a line of nanoparticle-ink and an N-pad on the bottom of a
vertical bare LED die, according to an example.
[0011] FIG. 3C is a partial view of a circuit, showing a connection
between a line of nanoparticle-ink and an N-pad on the bottom of a
vertical bare LED die, according to an example.
[0012] FIG. 4A is a side view of a LED circuit with flip chip bare
LED dies, according to an example.
[0013] FIG. 4B is a partial view of a circuit, showing a connection
between a line of nanoparticle-ink and a P-pad on the bottom of a
flip chip bare LED die, according to an example.
[0014] FIG. 4C is a partial view of a circuit, showing a connection
between a line of nanoparticle-ink and a P-pad on the bottom of a
flip chip bare LED die, according to an example.
[0015] FIG. 5 is a side view of a LED circuit with horizontal bare
LED dies, according to an example.
[0016] FIG. 6 is a side view of a LED circuit with a heat sink,
according to an example.
[0017] FIG. 7A is a side view of a LED circuit with a glop-top,
according to an example.
[0018] FIG. 7B is a side view of a LED circuit with glop-top,
according to an example.
[0019] FIG. 8A is a side view of a horizontal bare LED die,
according to an example.
[0020] FIG. 8B is a side view of a horizontal bare LED die,
according to an example.
[0021] FIG. 9 is a side view of a LED circuit with a second
substrate, according to an example.
[0022] FIG. 10 is an example of a method of creating a circuit with
one or more LEDs, according to an example.
[0023] FIG. 11 is an example of a method of creating a circuit with
one or more LEDs, according to an example.
[0024] FIG. 12 is an example of a method of creating a circuit with
one or more LEDs, according to an example.
[0025] FIG. 13A is an example of a LED circuit in a light bulb
configuration, according to an example.
[0026] FIG. 13B is an example of a LED circuit in a light bulb
configuration, according to an example.
[0027] FIG. 13C is an example of a LED circuit in a light bulb
configuration, according to an example.
[0028] FIG. 14A is a top view of a substrate with nanoparticle-ink
printed on it, according to an example.
[0029] FIG. 14B is a side view of FIG. 14A showing nanoparticle-ink
printed on the substrate.
[0030] FIG. 15A is a top view of a substrate with nanoparticle-ink
printed on it after a fusing stage, according to an example.
[0031] FIG. 15B is a side view of FIG. 15A showing the substrate
with nanoparticle-ink printed on it after the fusing stage.
DETAILED DESCRIPTION
[0032] FIG. 1A and FIG. 1B are examples of configurations of three
die 140 in a circuit 100. The present subject matter includes
circuit having one or more die. The circuit 100 can include a first
substrate 120, such as to provide a base for the components of the
circuit 100 to be fixed to. The die 140 can include one or more
light emitting diodes ("LEDs"). The LEDs 140 in the circuit 100 can
be bare LED dies. The bare LED dies can be horizontal bare LED dies
142, vertical bare LED dies 144, or flip chip bare LED dies 146.
The bare LED dies can be coupled to a power source or other bare
LED dies.
[0033] The coupling between bare LED dies or a power source can be
conductive, such as to create a circuit 100. In the configuration
of FIG. 1A, the connection pads 152 of the die 140 are disposed
along an axis 150. In the configuration of FIG. 1B, connection pads
152 of a first polarity are disposed on a first side of the axis
150, with the connection pads 152 of the other polarity disposed on
the other side of the axis 150.
[0034] FIG. 2 is a side view of a portion of a circuit 100 with
horizontal bare LED dies 142. A circuit 100 can include a first
substrate 120. Examples of substrate 120 include, but are not
limited to, rigid printed circuit board such as circuit board
including organic material and flexible printed circuit board such
as circuit board including polyimide material. The first substrate
120 can be flexible, such as to enable the circuit 100 to conform
to different shapes. The first substrate 120 can be transparent,
such as to allow light 171 to pass. The first substrate 120 can be
at least partially reflective. The first substrate 120 can comprise
metal. The first substrate 120 can comprise non-conductive metal,
such as if the metal is treated or coated.
[0035] The first substrate 120 can have an adhesive 170 applied on
one or more sides of it, such as to couple the first substrate 120
to one or more bare LED dies. Adhesive such as adhesive 170 can
comprise phosphor, such as to produce white light from light
emitted from the LED. The adhesive 170 can be conductive. The
adhesive 170 can be an electrical insulator.
[0036] The one or more bare LED dies can include a horizontal bare
LED die 142. A horizontal bare LED die 142 can emit light from the
top surface 245 of the bare LED die 142 and the bottom surface 241
of the bare LED die 142. A horizontal bare LED die 142 can have a
P-contact 230 and an N-contact 240. The polarity of the contacts
can be reversed, so that the contact on the first mesa 201 is of
the N-type. In a circuit 100, the P-contact 230 can have a
conductive element coupling the P-contact of a first horizontal
bare LED die 142 to the N-contact of a second horizontal bare LED
die 142, such as to create a conductive electrical connection
between the two bare LED dies. In a circuit 100, the P-contact can
have a conductive element coupling the P-contact of a first
horizontal bare LED die 142 to the P-contact of a second horizontal
bare LED die 142, such as to create a conductive electrical
connection between the two bare LED dies.
[0037] The conductive element can be an ink 110, such as
nanoparticle-ink. Nanoparticle-ink can be nanoink. The conductive
ink 110 can include silver. The conductive ink 110 can include
copper. The conductive ink 110 can include gold. Nanoink can
comprise nanoparticles and a carrier solvent. Consolidation of the
nanoparticles can occur by low temperature sintering. Consolidation
can occur when there is particle-to-particle contact, such as when
the solvent or a protective material surrounding the nanoparticles
evaporates.
[0038] The conductive ink 110 can comprise conductive metallic
particles, a polymeric binder, and a carrier solvent. The metallic
particles can be small enough to be aerosol jet printed. The
conductive ink 110 can comprise a polymeric binder, such as to form
a film when the conductive ink 110 is dried and fused. A conductive
ink 110 that comprises a polymeric binder can be more robust than
other conductive inks 110. The conductive ink 110 can comprise
nanoink and an ink that comprises conductive metallic particles, a
polymeric binder, and a carrier solvent.
[0039] The conductive ink 110 can be printed onto the first
substrate 120. The conductive ink 110 can be printed onto a
horizontal bare LED die 142. The conductive ink 110 can be printed
onto a horizontal bare LED die 142 with a jet printer. The
conductive ink 110 can be printed onto a horizontal bare LED die
142 with an aerosol jet printer.
[0040] An aerosol jet printer can be used to print the conductive
ink 110 on to a horizontal bare LED die 142, such as on more than
one side of the horizontal bare LED die 142. The conductive ink 110
can be printed onto more than one side of the horizontal bare LED
die 142, such as to eliminate the need to flood the area between
horizontal bare LED dies 142 in order to electrically couple them.
Flooding the area between the horizontal bare LED dies 142 can be
used, such as when the printer cannot print on a two perpendicular
surfaces.
[0041] Aerosol jet printers can print in 3-dimensions. Printing
with an aerosol jet printer can create a continuous line of
conductive ink 110 over a corner of the horizontal bare LED die
142. Printing the conductive ink 110 with an aerosol jet printer
can prevent a gap in the conductive ink 110. A gap can occur when
printing conductive ink with a jet printer.
[0042] Aerosol jet printers can print using different inks. The
particle size of one ink that is printed using an aerosol jet
printer can have a different particle size from another ink that is
printed with an aerosol jet printer. In an example, an aerosol jet
printer can print ink with a particle size up to 0.5 .mu.m. Aerosol
jet print can print ink with a particle size smaller than 0.5
.mu.m.
[0043] The conductive ink 110 can be printed on one or more
surfaces of a horizontal bare LED die 142. For example, two
nonplanar surfaces can be printed onto. Curved surfaces can be
printed onto. Irregular surfaces can be printed onto. Surfaces that
are non continuous, such as those on the exterior of a polyhedron,
can be printed onto.
[0044] The head of the printer can be at an angle other than
vertical, such as to encourage a continuous line of conductive ink
110. A continuous line of conductive ink 110 can be formed by
printing in 3 dimensions, such as to connect a line of conductive
ink 110 on the first substrate 120 to a line of conductive ink 110
on the top surface of a horizontal bare LED die 142. Printing
conductive ink 110 in 3 dimensions can include printing on
intersecting planes, for example via adjustment along, and/or
printing onto x, y and z planes. Printing conductive ink 110 in 3
dimensions can include printing on parallel planes. The angle of
the aerosol jet printer head can be 45.degree.. Other angles of the
aerosol jet printer head are possible.
[0045] The conductive ink 110 can be disposed in a continuous,
monolithic path, such as to form a conductive trace. The conductive
ink 110 can be printed in dots. The conductive ink 110 can be
heated, such as to melt the dots of conductive ink 110 or fuse the
dots of conductive ink 110, so that the dots of conductive ink 110
become electrically conductive with one another. The dots can be
melted or fused such as to form a conductive unit of conductive ink
110. The conductive ink 110 can be melted between 200.degree. C.
and 220.degree. C. The conductive ink 110 can be melted between
130.degree. C. and 150.degree. C. Other ranges for the melting
point of the conductive ink 110 are possible.
[0046] FIG. 3A is a side view of a LED circuit 100 with vertical
bare LED dies 144. A circuit 100 can include one or more vertical
bare LED dies 144. A circuit 100 with vertical bare LED dies 144
can include two lines of conductive ink 110. A first line of
conductive ink 110 can connect the N-pads 240 of the vertical bare
LED dies 144 in the circuit 100. A second line of conductive ink
111 can connect the P-pads 230 of the vertical bare LED dies 144 in
the circuit 100. The polarity of the contacts can be reversed, so
that the contact on the top is the P-type.
[0047] Both lines of conductive ink 110, 111 can be printed on the
first substrate 120. The lines of conductive ink 110, 111 can be
substantially parallel to one another. The lines of conductive ink
110, 111 can be electrically insulated from each other, such as by
a gap or a non-conductive material 171. The non-conductive material
can be a non-conductive ink. In an example, a second line of
conductive ink 111 can be printed on the first substrate 120 and
non-conductive ink can be printed over the second line of
conductive ink 111. A first line of conductive ink 110 can be
printed on the non-conductive ink, such that the non-conductive ink
can electrically insulate the first line of conductive ink 110 from
the second line of conductive ink 111.
[0048] FIG. 3B is an example of a connection between a line of
conductive ink 110 and an N-pad 240 on the bottom of a vertical
bare LED die 144. An adhesive 170 can be used to couple a vertical
bare LED die 144 to the first substrate 120. The adhesive 170 can
be nonconductive. If the adhesive 170 is nonconductive, a
continuous line of conductive ink 110 can be printed on the
substrate. The line of conductive ink 110 can run between the N-pad
240 of the vertical bare LED die 144 and the first substrate
120.
[0049] FIG. 3C is an example of a connection between a line of
conductive ink 110 and an N-pad 240 on the bottom of a vertical
bare LED die 144. An adhesive 170 can be used to couple a vertical
bare LED die 144 to the first substrate 120. The adhesive 170 can
be conductive. If the adhesive 170 is conductive, there can be gaps
in a line of conductive ink 110. The adhesive 170 can be located in
the gaps, such as to conduct electricity with the conductive ink
110. The adhesive 170 can be coupled to the N-pad 240 of the
vertical bare LED die 144, such as to conduct electricity to the
vertical bare LED die 144.
[0050] FIG. 4A is a side view of a LED circuit 100 with flip chip
bare LED dies 146. A circuit 100 can include one or more flip chip
bare LED dies 146. A circuit 100 with flip chip bare LED dies 146
can include a single line of conductive ink 110. A single line of
conductive ink 110 can connect a flip chip bare LED die 146 to
another flip chip bare LED die 146, such as to include both bare
LED dies in a circuit 100.
[0051] When a circuit 100 includes more than one bare LED die, the
circuit 100 can include different types of bare LED dies. In an
example, a circuit 100 can include one or more horizontal bare LED
dies 142 and one or more vertical bare LED dies 144 or one or more
flip chip bare LED dies 146. In an example, a circuit 100 can
include at least one of each type of bare LED die. In an example, a
circuit 100 can include both flip chip 146 and vertical bare LED
dies 144. A circuit 100 can include LED dies that emit different
colors of lights, such as red, green, blue, amber, or ultraviolet.
Different colored LED dies can be powered in combinations, such as
to produce light of another color or white light.
[0052] FIG. 4B is an example of a connection between a line of
conductive ink 110 and a P-pad 230 on the bottom of a flip chip
bare LED die 146. An adhesive 170 can be used to couple a flip chip
bare LED die 146 to the first substrate 120. The adhesive 170 can
be nonconductive. If the adhesive 170 is nonconductive, a line of
conductive ink 110 can be printed onto the substrate. The P-pad 230
of the flip chip bare LED die 146 can be placed on the line of
conductive ink 110. The N-pad 240 can be set up in a similar
manner. The adhesive 170 can be located between the P-pad 230 and
the N-pad 240 of the flip chip bare LED die 146.
[0053] FIG. 4C is an example of a connection between a line of
conductive ink 110 and a P-pad 230 on the bottom of a flip chip
bare LED die 146. An adhesive 170 can be used to couple a flip chip
bare LED die 146 to the first substrate 120. The adhesive 170 can
be conductive. If the adhesive 170 is conductive, a line of
conductive ink 110 printed on the first substrate 120. Adhesive 170
can be added to the end of the line of conductive ink 110. The
P-pad 230 on the bottom of a flip chip bare LED die 146 can be
located in the adhesive 170, such as to couple the flip chip bare
LED die 146 to the first substrate 120. The P-pad 230 on the bottom
of a flip chip bare LED die 146 can be located in the adhesive 170,
such as to conduct electricity from the line of conductive ink 110
to the P-pad 230. The N-pad 240 can be set up in a similar
manner.
[0054] A first substrate 120 can have a circuit 100 on more than
one side of the first substrate 120. In an example, a first
substrate 120 can have a circuit 100 on the top surface 243 of the
first substrate 120 and a circuit 100 on the bottom surface 245 of
the first substrate 120.
[0055] FIG. 5 is a side view of a LED circuit 100 with horizontal
bare LED dies 142. In an example, the bare LED dies can be placed
next to each other, such as to print the conductive ink 110 on a
first bare LED die and then onto a second bare LED die, without
printing on the substrate. In an example, one or more portions of
the circuit 100 can be printed directly from a bare LED die to
another bare LED die and other portions of the circuit 100 can be
printed from a bare LED die to the first substrate 120 to another
bare LED die. Printing directly from a bare LED die to another bare
LED die can result in a higher density of bare LED dies. In the
example, printing extends from atop a first mesa 201, from a P-type
connection point or pad 230 down onto an N-type connection or pad
240. The N-type connection or pad 240 can be on a second mesa 202.
The second mesa 202 can be in a different plane than the first mesa
201. The second mesa 202 can be in a plane that is closer to the
first substrate 120, than the plane the first mesa 201 is located
in. The first mesa 201 and the second mesa 202 can be substantially
parallel to each other. Accordingly, the conductive ink 110 can
have a step-shape along a cross section extending through a
vertical cross-section.
[0056] FIG. 6 is a side view of a LED circuit 100 with a heat sink
200. The circuit 100 can include a heat sink 200. A heat sink 200
can be coupled to the circuit 100, such as to remove heat from the
circuit 100. The heat sink 200 can be coupled to the first
substrate 120 on the opposite side of the first substrate 120 from
the circuit 100. The heat sink 200 can be coupled to the first
substrate 120 on the same side of the first substrate 120 as the
circuit 100. More than one heat sink 200 can be coupled to the
first substrate 120. Other locations for a heat sink 200 are
possible.
[0057] FIG. 7A and FIG. 7B are side views of a LED circuit 100 with
a glop-top 180. A glop-top 180 can cover the topside of a
horizontal bare LED die 142, vertical bare LED die 144, or flip
chip bare LED die 146. The glop-top 180 can cover a single bare LED
die. The glop-top 180 can cover more than one bare LED die. There
can be more than one glop-top 180 in a circuit 100. The glop-top
180 can encapsulate a bare LED die. The glop-top 180 can include
phosphor, such as to create white light. The glop-top 180 can
include adhesive 170.
[0058] FIG. 8A is a side view of a horizontal bare LED die 142. A
horizontal bare LED die 142 can include a first mesa 201. Printing
a line of conductive ink 110 on the first mesa 201 can affect the
performance of the horizontal bare LED die 142, such as by
providing a current path between the P-region and the N-region.
Accordingly, an insulator 220 can be disposed, for example by
printing, on the die 142. The insulator 220 can insulate the
N-region from the P-region so that conductive ink 110 can extend
across a portion of the die where the N-region and the P-region are
disposed adjacent one another. In the illustrated example, an
insulator extends from alongside a P-type pad, across an exposed
top portion of a P-region, down along a side portion of die
P-region, and onto an N-region.
[0059] The insulator 220 can be printed on the die 142, such as
with an aerosol jet printer. An aerosol jet printer can print the
insulator, such as to insulate the N-region from the conductive ink
110 that is coupled to the P-region.
[0060] Examples of insulator 220 include, but are not limited to,
nonconductive materials such as polymer films, sprays, tape and
other electrically insulative materials. Insulating the first mesa
201 from the conductive ink 110 can improve performance of the
horizontal bare LED die 142. The insulator 220 can be printed on
the first mesa 201 prior to the conductive ink 110 being printed.
There can be more than one insulator 220 printed on a horizontal
bare LED die 142.
[0061] FIG. 8B is a side view of a horizontal bare LED die 142. A
horizontal bare LED die 142 can include a first mesa 201. Printing
a line of conductive ink 110 on the first mesa 201 can affect the
performance of the horizontal bare LED die 142, such as by
providing a current path between the P-region and the N-region.
Accordingly, an insulator 220 can be printed on the die 142, such
as to insulate the N-region from the P-region so that conductive
ink 110 can extend across a portion of the die where the N-region
and the P-region are disposed adjacent one another, in the
illustrated example, an insulator extends from alongside a P-type
pad, across an exposed top portion of a P-region, down along a side
portion of the P-region, and onto an N-region. In the pictured
example, the insulator has an L-shaped cross-section. In the
example, there is no raised P-type connection pad, and the
conductive ink 110 extends onto the P-region.
[0062] FIG. 9 is a side view of a LED circuit 100 with a second
substrate 130. The second substrate 130 sandwiches the die 142
against the first substrate 120. In an example, a glop-top 180 is
disposed on a die 142 and is sandwiched between the first substrate
120 and the second substrate 130. The second substrate 130 can be
transparent. The second substrate 130 can be the same material as
the first substrate 120. The second substrate 130 can be the same
shape as the first substrate 120. The second substrate 130 can be
the same size as the first substrate 120. The second substrate 130
can comprise a diffusing material, such as to reduce the pointing
effect of the LEDs 140. The circuit 100 can be enclosed by the
first substrate 120 and the second substrate 130. A circuit 100 can
extend onto more than one side of a substrate, such as by wrapping
around to opposing major faces of a ribbon-shaped substrate. In an
example, the glop-top 130 can conform to the second substrate
130.
[0063] FIG. 10 is an example of a method 1000 of creating a
circuit, such as circuit 100, with one or more horizontal bare LED
dies, such as dies 142, according to an example. A circuit, such as
circuit 100, can be formed using a method including printing
conductive ink, such as ink 110, onto a substrate or a horizontal
bare LED die, such as die 142. At 1002, a blank substrate can be
used for the first substrate, such as substrate 120. At 1004, the
first substrate, such as substrate 120, can have a reflective
material added to it, such as to reflect light from the bottom
surface of a horizontal bare LED die, such as die 142. At 1006, an
adhesive, such as adhesive 170, can be added to the first
substrate, such as substrate 120. The adhesive, such as adhesive
170, can include phosphor. The adhesive, such as adhesive 170, can
be conductive. The adhesive, such as adhesive 170, can be an
insulator.
[0064] At 1008, one or more horizontal bare LED die, such as die
142, can be placed in the adhesive, such as adhesive 170, on the
first substrate, such as substrate 120. The adhesive, such as
adhesive 170, can be uncured when a horizontal bare LED dies, such
as dies 142, is placed in the adhesive, such as adhesive 170, on
the first substrate, such as substrate 120. The adhesive, such as
adhesive 170, can couple a horizontal bare LED die, such as die
142, to the first substrate, such as substrate 120, such as to
secure the horizontal bare LED die, such as die 142.
[0065] In an example, a horizontal bare LED die, such as die 142,
can have a mesa, such as first mesa 201. At 1010, an insulator,
such as insulator 220, can be printed. In an example, the insulator
is printed on a mesa, such as first mesa 201, such as to insulate
the mesa, such as first mesa 201, from the conductive ink, such as
ink 110. At 1012, conductive ink, such as ink 110, can be printed
on the first substrate, such as substrate 120. Conductive ink, such
as ink 110, can be printed on one or more horizontal bare LED dies,
such as dies 142. Conductive ink, such as ink 110, can be printed
on the first substrate, such as substrate 120, and the horizontal
bare LED dies, such as dies 142, such as to connect the bare LED
dies in order to create a circuit, such as circuit 100, or part of
a circuit.
[0066] At 1014, heat can be added to the circuit, such as circuit
100, such as to melt or fuse the conductive ink, such as ink 110.
Conductive ink, such as ink 110, can be printed in a series of
dots. Heating the conductive ink, such as ink 110, can melt or fuse
the dots. Fusing the dots of conductive ink, such as ink 110, can
connect each dot together, such as to create a line of conductive
ink, such as ink 110, that can conduct electricity to each part of
the circuit, such as circuit 100. A line of conductive ink, such as
ink 110, can conduct electricity to each part of the circuit, such
as circuit 100, such as to electrically connect each component of
the circuit, such as circuit 100.
[0067] At 1016, a glop-top, such as glop-top 180, can be added to
the circuit, such as circuit 100, such as to encapsulate a bare LED
die. The glop-top, such as glop-top 180, can encapsulate a single
bare LED die. The glop-top, such as glop-top 180, can encapsulate a
plurality of bare LED dies. There can be more than one glop-top,
such as glop-top 180, in a circuit, such as circuit 100. The
glop-top, such as glop-top 180, can comprise adhesive, such as
adhesive 170. The glop-top, such as glop-top 180, can comprise
phosphor.
[0068] At 1018, a second substrate 130 can be added to the circuit,
such as circuit 100. The second substrate 130 can be on the
opposite side of the circuit, such as circuit 100, from the first
substrate, such as substrate 120. The second substrate 130 can be
the same shape as the first substrate, such as substrate 120. The
second substrate 130 can be the same size as the first substrate,
such as substrate 120. The second substrate 130 can be the same
material as the first substrate, such as substrate 120.
[0069] The circuit, such as circuit 100, can be enclosed by the
first substrate, such as substrate 120, and the second substrate
130. The circuit, such as circuit 100, can be attached to a power
source, such as to power the bare LED dies. At 1020, the bare LED
dies can be powered such as to ensure that each of the bare LED
dies in the circuit, such as circuit 100, is properly connected to
the circuit, such as circuit 100. Powering to the bare LED dies can
aid in curing the adhesive, such as adhesive 170, such as if the
bare LED die emits UV rays.
[0070] FIG. 11 is an example of a method of creating a circuit,
such as circuit 100, with one or more vertical bare LED dies, such
as dies, such as dies 144, according to an example. At 1002, a
blank substrate can be used for the first substrate, such as
substrate 120. At 1004, one or more lines of conductive ink, such
as ink 110, can be printed on the first substrate, such as
substrate 120. One line can be for the N-pads, such as N-pads 240,
and a second line can be for the P-pads 230.
[0071] The N-pad, such as N-pad 240, can be on the bottom of the
vertical bare LED die, such as die 144. The P-pad, such as P-pad
230, can be on the top of the vertical bare LED die, such as die
144. The lines can be non-continuous.
[0072] At 1106, adhesive, such as adhesive 170, can be added to the
substrate, such as to couple the vertical bare LED dies, such as
dies 144, to the first substrate, such as substrate 120. The
adhesive, such as adhesive 170, can be conductive. The adhesive,
such as adhesive 170, can connect the non-continuous segments of
the line of conductive ink, such as ink 110, for the N-pads, such
as N-pads 240.
[0073] At 1108, the vertical bare LED dies, such as dies 144, for
the circuit, such as circuit 100, can be placed in the adhesive,
such as adhesive 170, such as to couple the vertical bare LED dies,
such as dies 144, to the first substrate, such as substrate
120.
[0074] The adhesive, such as adhesive 170, can be uncured when the
bare LED dies are placed in the adhesive, such as adhesive 170. The
adhesive, such as adhesive 170, can connect the N-pad, such as
N-pad 240, of the vertical bare LED die, such as die 144, to the
line for the N-pads, such as N-pads 240, such as to create an
electrical connection between the N-pad, such as N-pad 240, and the
first line of conductive ink, such as ink 110.
[0075] At 1110, a second stage of printing can include printing a
second line of conductive ink, such as ink 110, such as if only one
line of conductive ink, such as ink 110, was printed in the first
stage of printing. The second line of conductive ink, such as ink
110, can be for the P-pads, such as P-pads 230. The second stage of
printing can include printing conductive ink, such as ink 110, to
create a continuous second line of conductive ink, such as ink 110.
The second line of conductive ink, such as ink 110, can include
contact with each of the P-pads, such as P-pads 230, in the
circuit, such as circuit 100, such as to create an electrical
connection between the P-pads, such as P-pads 230, and the second
line of conductive ink, such as ink 110.
[0076] The conductive ink, such as ink 110, can be printed from the
first substrate, such as substrate 120, up the side of the vertical
bare LED die, such as die 144. The conductive ink, such as ink 110,
can be printed up the side of the vertical bare LED die, such as
die 144, and across the top of the vertical bare LED die, such as
die 144. The conductive ink, such as ink 110, can be printed across
the P-pad, such as P-pad 230. The conductive ink, such as ink 110,
can be printed on a second side of the vertical bare LED die, such
as die 144. The conductive ink, such as ink 110, can be printed
from the second side of the vertical bare LED die, such as die 144,
to a line of conductive ink, such as ink 110, on the first
substrate, such as substrate 120.
[0077] At 1112, heat can be added to the circuit, such as circuit
100, such as to melt or fuse the dots of conductive ink, such as
ink 110. Fusing the dots of conductive ink, such as ink 110, can
connect each dot together, such as to create a line of conductive
ink, such as ink 110, that can conduct electricity to each part of
the circuit, such as circuit 100. A line of conductive ink, such as
ink 110, can conduct electricity to each part of the circuit, such
as circuit 100, such as to electrically connect each component of
the circuit, such as circuit 100.
[0078] At 1114, a glop-top, such as glop-top 180, can be added to
the circuit, such as circuit 100, such as to encapsulate a bare LED
die. The glop-top, such as glop-top 180, can encapsulate a single
bare LED die. The glop-top, such as glop-top 180, can encapsulate a
plurality of bare LED dies. There can be more than one glop-top,
such as glop-top 180, in a circuit, such as circuit 100. The
glop-top, such as glop-top 180, can comprise adhesive, such as
adhesive 170. The glop-top, such as glop-top 180, can comprise
phosphor.
[0079] At 1116, a second substrate 130 can be added to the circuit,
such as circuit 100. The second substrate 130 can be on the
opposite side of the circuit, such as circuit 100, from the first
substrate, such as substrate 120. The second substrate 130 can be
the same shape as the first substrate, such as substrate 120. The
second substrate 130 can be the same size as the first substrate,
such as substrate 120. The second substrate 130 can be the same
material as the first substrate, such as substrate 120.
[0080] The circuit, such as circuit 100, can be enclosed by the
first substrate, such as substrate 120, and the second substrate
130. The circuit, such as circuit 100, can be attached to a power
source, such as to power the bare LED dies. At 1118, the bare LED
dies can be powered such as to ensure that each of the bare LED
dies in the circuit, such as circuit 100, is properly connected to
the circuit, such as circuit 100. Powering to the bare LED dies can
aid in curing the adhesive, such as adhesive 170, such as if the
bare LED die emits UV rays.
[0081] FIG. 12 is an example of a method of creating a circuit,
such as circuit 100, with one or more flip chip bare LED dies 146,
according to an example. At 1202, a blank substrate can be used for
the first substrate, such as substrate 120. One or more lines of
conductive ink, such as ink 110, can be printed onto the first
substrate, such as substrate 120. The lines can be non-continuous,
such as to allow placement of flip chip bare LED die 146.
[0082] At 1206, adhesive, such as adhesive 170, can be added to the
first substrate, such as substrate 120, such as to couple the flip
chip bare LED dies 146 to the first substrate, such as substrate
120. The adhesive, such as adhesive 170, can be conductive or
non-conductive. Non-conductive adhesive, such as adhesive 170, can
couple the flip chip bare LED dies 146 to the first substrate, such
as substrate 120. Conductive adhesive, such as adhesive 170, can
couple the flip chip bare LED dies 146 to the first substrate, such
as substrate 120, and connect the N-pads, such as N-pads 240, and
the P-pads, such as P-pads 230, to the printed lines of conductive
ink, such as ink 110. At 1208, the flip chip bare LED dies 146 can
be placed in the adhesive, such as adhesive 170, such as to couple
the flip chip bare LED dies 146 to the first substrate, such as
substrate 120.
[0083] At 1210, the adhesive, such as adhesive 170, can be uncured
when the bare LED dies are place in the adhesive, such as adhesive
170. Heat can be added to the circuit, such as circuit 100, such as
to melt or fuse the dots of conductive ink, such as ink 110. Fusing
the dots of conductive ink, such as ink 110, can connect each dot
together, such as to create a line of conductive ink, such as ink
110, that can conduct electricity to each part of the circuit, such
as circuit 100. A line of conductive ink, such as ink 110, can
conduct electricity to each part of the circuit, such as circuit
100, such as to electrically connect each component of the circuit,
such as circuit 100.
[0084] At 1202, a glop-top, such as glop-top 180, can be added to
the circuit, such as circuit 100, such as to encapsulate a bare LED
die. The glop-top, such as glop-top 180, can encapsulate a single
bare LED die. The glop-top, such as glop-top 180, can encapsulate a
plurality of bare LED dies. There can be more than one glop-top,
such as glop-top 180, in a circuit, such as circuit 100. The
glop-top, such as glop-top 180, can comprise adhesive, such as
adhesive 170. The glop-top, such as glop-top 180, can comprise
phosphor.
[0085] At 1204, a second substrate 130 can be added to the circuit,
such as circuit 100. The second substrate 130 can be on the
opposite side of the circuit, such as circuit 100, from the first
substrate, such as substrate 120. The second substrate 130 can be
the same shape as the first substrate, such as substrate 120. The
second substrate 130 can be the same size as the first substrate,
such as substrate 120. The second substrate 130 can be the same
material as the first substrate, such as substrate 120.
[0086] The circuit, such as circuit 100, can be enclosed by the
first substrate, such as substrate 120, and the second substrate
130. The circuit, such as circuit 100, can be attached to a power
source, such as to power the bare LED dies. At 1216, the bare LED
dies can be powered such as to ensure that each of the bare LED
dies in the circuit, such as circuit 100, is properly connected to
the circuit, such as circuit 100. Powering to the bare LED dies can
aid in curing the adhesive, such as adhesive 170, such as if the
bare LED die emits UV rays.
[0087] FIG. 13A is an example of a LED circuit 100 in a light bulb
250. In a light bulb 250, there can be a base 270, a circuit 100,
and a bulb 260. There can be a base 270 to a tight bulb 250, such
as to couple the light bulb 250 to light fixture. The base 270 can
contain a converter such as to convert an external power supply to
the power supply requirement of the circuit 100. The light bulb 250
can include a bulb 260. The bulb 260 can enclose the circuit 100,
such as to protect the circuit 100. The bulb 260 can be configured
to different shapes.
[0088] The bulb 260 can be standard shape. The bulb 260 can be
bullet shape. The bulb 260 can be globe shape. The bulb 260 can be
tube shape. The bulb 260 can be flare shape. The bulb 260 can be
candle shape. The bulb 260 can be reflector shape. Other shapes of
the bulb 260 are possible. The bulb 260 can comprise glass. The
bulb 260 can comprise plastic. The bulb 260 can comprise a
plurality of materials. The bulb 260 can be transparent. The bulb
260 can be colored. The bulb 260 can include diffusing material,
such as to equal disperse the light.
[0089] The circuit 100 can be in a strip. The strip can be
configured to different shapes within the bulb 260. The strip can
be in a twisted "U" shape. The strip can have a circuit 100 on one
side. The strip can have a circuit 100 on more than one side. The
strip can be twisted, such as to have LEDs 140 pointing in a
plurality of directions. There can be a single strip in a bulb 260.
There can be more than one strip in a bulb 260.
[0090] FIG. 13B is an example of a LED circuit 100 in a light bulb
250. In an example, the circuit 100 can be in a double helix
configuration. In a double helix configuration there can be cross
members 290 between the two sides. The cross members 290 can be a
heat sink 200, such as to remove heat from the circuit 100.
Additional heat sinks 200 can be added. The cross members 290 can
be supportive, such as to aid in supporting the circuit 100 in the
double helix configuration. Additional supportive elements can be
added.
[0091] FIG. 13C is an example of a LED circuit 100 in a light bulb
250. In an example, the circuit 100 can form a "U" shape. Vents 280
can be added to the bulb 260, such as to allow the passage of air.
The passage of air can remove heat from the bulb 260, such as to
prevent overheating.
[0092] FIG. 14A is a top view of a substrate with conductive ink
110 printed on it. FIG. 14B is a side view of a substrate with
conductive ink 110 printed on it. Conductive ink 110 can be printed
in dots of ink along the substrate. A continuous line of conductive
ink 110 can be made up of a series of dots of conductive ink 110.
The dots can be separate from each other prior to the ink being
melted or fused.
[0093] After the conductive ink 110 is printed on the substrate a
fusing stage can take place. During the fusing stage, the dots of
conductive ink 110 can be fused together. The dots of conductive
ink 110 can lose their dot shape during the fusing process.
[0094] FIG. 15A is a top view of a substrate with conductive ink
110 printed on it after the fusing stage. FIG. 15B is a side view
of a substrate with conductive ink 110 printed on it after the
fusing stage. After the fusing stage, the continuous line of
conductive ink 110 can be a single element that has the ability to
conduct electricity.
Various Notes & Examples
[0095] Example 1 includes subject matter (such as an apparatus)
comprising a planar substrate including a first surface that is
planar, at least one bare light emitting diode ("LED") die coupled
to the first surface, the at least one bare LED die comprising: a
planar N-doped region located substantially parallel to the planar
substrate and facing away from the planar substrate and a P-doped
region defining a mesa-shaped section facing away from the planar
substrate, the P-doped region disposed parallel the N-doped region,
further away from the planar substrate than the N-doped region; and
an insulator disposed between the N-doped region and the planar
substrate, along a portion of the at least one bare LED die, from a
side of the mesa, along the N-doped region, and onto a side of the
N-doped region.
[0096] Example 2 includes the subject matter of example 1, wherein
the insulator contacts a surface of a bare LED die that is
substantially perpendicular to first surface.
[0097] Example 3 includes the subject matter of any one of examples
1-2, wherein a conductive ink is disposed over an edge of the bare
LED die, onto two non planar sides of the bare LED die.
[0098] Example 4 includes the subject matter of any one of examples
1-3, wherein the insulator comprises non-conductive ink.
[0099] Example 5 includes the subject matter of any one of examples
1-4, wherein the at least one bare LED die is electrically coupled
with the conductive ink.
[0100] Example 6 includes the subject matter of any one of examples
1-5; wherein the conductive ink is disposed on the planar substrate
and extends onto a surface of the bare LED die that is in a
different plane than the planar substrate.
[0101] Example 7 includes the subject matter (such as an apparatus)
comprising a planar substrate including a first surface that is
planar; at least one bare light emitting diode ("LED") die coupled
to the planar substrate, the at least one bare LED die comprising:
an N-doped region; and a P-doped region defining a mesa-shaped
section on disposed further away from the planar substrate than the
N-doped region; an insulative chip substrate disposed between the
N-doped region and the planar substrate; and conductive ink
electrically connected to the at least one bare LED die, wherein
the conductive ink is disposed on the planar substrate and extends
onto a surface of the LED that is out-of-plane from the first
surface of the planar substrate.
[0102] Example 8 includes the subject matter of example 7, wherein
the conductive ink includes nanoparticle-ink.
[0103] Example 9 includes the subject matter of any one of examples
7-8, wherein the nanoparticle-ink comprises silver.
[0104] Example 10 includes the subject matter of any one of
examples 7-9, wherein the planar substrate is flexible.
[0105] Example 11 includes the subject matter of any one of
examples 7-10, wherein the conductive ink is disposed on the planar
substrate and the surface of the LED die with an aerosol jet
printer.
[0106] Example 12 includes the subject matter (such as a method)
comprising placing at least one bare LED die on a planar substrate
having a major face; and printing conductive ink on the planar
substrate and at least one bare LED die with an aerosol jet printer
to dispose the conductive ink onto the planar surface, a leading
side of the at least one bare LED die that extends along a first
side plane that intersects the major face, a top of the at least
one bare LED die, and a trailing surface of the at least one bare
LED die that extends along a second side plane that intersects the
major face.
[0107] Example 13 includes the subject matter of example 12,
wherein the head of the aerosol jet printer is at a 45.degree.
angle with respect to a plane of the planar substrate, and the
first and second side planes are substantially parallel,
perpendicular with the top and the major face.
[0108] Example 14 includes the subject matter of any one of
examples 12-13, wherein the printing conductive ink includes
printing a nanoparticle ink.
[0109] Example 15 includes the subject matter of any one of
examples 12-14, wherein printing includes heating the
nanoparticle-ink.
[0110] Example 16 includes the subject matter of any one of
examples 12-15, comprising disposing a glop-top onto the bare LED
die.
[0111] Example 17 includes the subject matter of any one of
examples 12-16, wherein disposing a glop-top includes disposing the
glop-top to cover more than one bare LED die.
[0112] Example 18 includes the subject matter of any one of
examples 12-17, comprising disposing a second planar substrate onto
the glop-top.
[0113] Example 19 includes the subject matter of any one of
examples 12-18, wherein the second planar substrate is at least
partially transparent.
[0114] Example 20 includes the subject matter of any one of
examples 12-19, disposing an insulator onto the at least one bare
LED die, alongside a mesa, to cover an N-doped portion of the bare
LED die.
[0115] These non-limiting examples can be combined in any
permutation combination.
[0116] The above detailed description includes references to the
accompanying drawings, which form a part of the detailed
description. The drawings show, by way of illustration, specific
embodiments in which the invention can be practiced. These
embodiments are also referred to herein as "examples." Such
examples can include elements in addition to those shown or
described. However, the present inventors also contemplate examples
in which only those elements shown or described are provided.
Moreover, the present inventors also contemplate examples using any
combination or permutation of those elements shown or described (or
one or more aspects thereof), either with respect to a particular
example (or one or more aspects thereof), or with respect to other
examples (or one or more aspects thereof) shown or described
herein.
[0117] In the event of inconsistent usages between this document
any documents so incorporated by reference, the usage in this
document controls.
[0118] In this document, the terms "a" or "an" are used, as is
common in patent documents, to include one or more than one,
independent of any other instances or usages of "at least one" or
"one or more." in this document, the term "or" is used to refer to
a nonexclusive or, such that "A or B" includes "A but not B," "B
but not A," and "A and B," unless otherwise indicated. In this
document, the terms "including" and "in which" are used as the
plain-English equivalents of the respective terms "comprising" and
"wherein." Also, in the following claims, the terms "including" and
"comprising" are open-ended, that is, a system, device, article,
composition, formulation, or process that includes elements in
addition to those listed after such a term in a claim are still
deemed to fall within the scope of that claim. Moreover, in the
following claims, the terms "first," "second," and "third," etc.
are used merely as labels, and are not intended to impose numerical
requirements on their objects.
[0119] Method examples described herein can be machine or
computer-implemented at least in part. Some examples can include a
computer-readable medium or machine-readable medium encoded with
instructions operable to configure an electronic device to perform
methods as described in the above examples. An implementation of
such methods can include code, such as microcode, assembly language
code, a higher-level language code, or the like. Such code can
include computer readable instructions for performing various
methods. The code may form portions of computer program products.
Further, in an example, the code can be tangibly stored on one or
more volatile, non-transitory, or non-volatile tangible
computer-readable media, such as during execution or at other
times. Examples of these tangible computer-readable media can
include, but are not limited to, hard disks, removable magnetic
disks, removable optical disks (e.g., compact disks and digital
video disks), magnetic cassettes, memory cards or sticks, random
access memories (RAMS), read only memories (ROMs), and the
like.
[0120] The above description is intended to be illustrative, and
not restrictive. For example, the above-described examples (or one
or more aspects thereof) may be used in combination with each
other. Other embodiments can be used, such as by one of ordinary
skill in the art upon reviewing the above description. The Abstract
is provided to comply with 37 C.F.R. .sctn.1.72(b), to allow the
reader to quickly ascertain the nature of the technical disclosure.
It is submitted with the understanding that it will not be used to
interpret or limit the scope or meaning of the claims. Also, in the
above Detailed Description, various features may be grouped
together to streamline the disclosure. This should not be
interpreted as intending that an unclaimed disclosed feature is
essential to any claim. Rather, inventive subject matter may lie in
less than all features of a particular disclosed embodiment. Thus,
the following claims are hereby incorporated into the Detailed
Description as examples or embodiments, with each claim standing on
its own as a separate embodiment, and it is contemplated that such
embodiments can be combined with each other in various combinations
or permutations. The scope of the invention should be determined
with reference to the appended claims, along with the full scope of
equivalents to which such claims are entitled.
* * * * *