U.S. patent application number 12/977306 was filed with the patent office on 2012-06-28 for combinatorial non-contact wet processing.
Invention is credited to Rajesh Kelekar.
Application Number | 20120164841 12/977306 |
Document ID | / |
Family ID | 46317715 |
Filed Date | 2012-06-28 |
United States Patent
Application |
20120164841 |
Kind Code |
A1 |
Kelekar; Rajesh |
June 28, 2012 |
COMBINATORIAL NON-CONTACT WET PROCESSING
Abstract
An apparatus and method for combinatorial non-contact wet
processing of a liquid material may include a source of a liquid
material, a first reaction cell, a second reaction cell, a first
plurality of gas jets disposed within an interior of the first
reaction cell, the first plurality of gas jets configured to
atomize the liquid material transferred to the interior of the
first reaction cell, a second plurality of gas jets disposed within
an interior of the second reaction cell, the second plurality of
gas jets configured to atomize the liquid material transferred to
the interior of the second reaction cell, a first vacuum element
disposed along a periphery of the first reaction cell, and a second
vacuum element disposed along a periphery of the at least a second
reaction cell.
Inventors: |
Kelekar; Rajesh; (Los Altos,
CA) |
Family ID: |
46317715 |
Appl. No.: |
12/977306 |
Filed: |
December 23, 2010 |
Current U.S.
Class: |
438/758 ;
118/722; 257/E21.211 |
Current CPC
Class: |
C40B 60/14 20130101;
B01J 2219/00612 20130101; B05B 7/00 20130101; B05C 5/00 20130101;
C40B 50/14 20130101; B01J 19/0046 20130101; H01L 21/02282 20130101;
B01J 2219/0036 20130101; B01J 2219/00443 20130101; B01J 2219/00605
20130101; B01J 2219/00756 20130101; B01J 2219/00596 20130101; B01J
2219/00531 20130101 |
Class at
Publication: |
438/758 ;
118/722; 257/E21.211 |
International
Class: |
H01L 21/30 20060101
H01L021/30; C23C 16/52 20060101 C23C016/52; C23C 16/455 20060101
C23C016/455 |
Claims
1. An apparatus for non-contact wet processing, comprising: a
source of a liquid material; a reaction cell, wherein the reaction
cell is configured for positioning at a selected distance from a
surface of a substrate, wherein the reaction cell includes a liquid
inlet, the liquid inlet configured to transfer the liquid material
from the liquid source to an interior of the reaction cell; a
plurality of gas jets disposed within the interior reaction cell,
the gas jets configured to atomize the liquid material transferred
to the interior of the reaction cell; and a vacuum element, the
vacuum element disposed along a periphery of the reaction cell, the
vacuum element configured to contain the liquid material within a
selected region of the substrate.
2. The apparatus for non-contact wet processing of claim 1, further
comprising: a gas curtain element configured to flow a gas at the
periphery of the reaction cell in order to contain the liquid
material within the selected region of the substrate.
3. The apparatus for non-contact wet processing of claim 2, wherein
the gas curtain element comprises: a gas curtain ring, wherein the
gas curtain ring is disposed along a circumferential periphery of
the reaction cell.
4. The apparatus for non-contact wet processing of claim 2, wherein
the gas curtain element comprises: a gas curtain bar, wherein the
gas curtain bar is disposed along an edge of the reaction cell.
5. The apparatus for non-contact wet processing of claim 1, wherein
at least two or more of the plurality of gas jets are arranged so
as to intersect a first gas stream from a first gas jet and at
least a second gas stream from a second gas jet at a selected
spatial point within the interior of the reaction cell.
6. The apparatus for non-contact wet processing of claim 1, wherein
the selected distance is a function of a material property of the
substrate.
7. The apparatus for non-contact wet processing of claim 1, wherein
the selected distance is a function of a material property of the
liquid material.
8. The apparatus for non-contact wet processing of claim 1, wherein
the liquid inlet comprises: a showerhead device.
9. The apparatus for non-contact wet processing of claim 1, wherein
the vacuum element comprises: a vacuum ring, wherein the vacuum
ring is disposed along a circumferential periphery of the reaction
cell.
10. The apparatus for non-contact wet processing of claim 1,
wherein the vacuum element comprises: a vacuum bar, wherein the
vacuum bar is disposed along an edge of the reaction cell.
11. An apparatus for combinatorial non-contact wet processing,
comprising: a source of a liquid material; a first reaction cell,
wherein the first reaction cell is configured for positioning at a
first selected distance from the surface of a substrate; at least a
second reaction cell, wherein the at least a second reaction cell
is configured for positioning at a second distance from the surface
of a substrate, wherein the first reaction cell and the at least a
second reaction cell include a liquid inlet; a first plurality of
gas jets disposed within an interior of the first reaction cell,
the first plurality of gas jets configured to atomize the liquid
material transferred to the interior of the first reaction cell; at
least a second plurality of gas jets disposed within an interior of
the at least a second reaction cell, the at least a second
plurality of gas jets configured to atomize the liquid material
transferred to the interior of the at least a second reaction cell;
a first vacuum element, the first vacuum element disposed along a
periphery of the first reaction cell, the first vacuum element
configured to contain the liquid material within a first selected
region of the substrate; and at least a second vacuum element, the
at least a second vacuum element disposed along a periphery of the
at least a second reaction cell, the at least a second vacuum
element configured to contain the liquid material within a second
selected region of the substrate.
12. The apparatus for combinatorial non-contact wet processing of
claim 11, further comprising: a liquid flow control system
configured to control a flow of the liquid material from the source
of a liquid material to at least one of the first reaction cell or
the at least a second reaction cell.
13. The apparatus for combinatorial non-contact wet processing of
claim 11, further comprising: a gas flow control system configured
to control a flow of a gas through at least one of the first
plurality of gas jets or the at least a second plurality of gas
jets.
14. The apparatus for combinatorial non-contact wet processing of
claim 11, wherein the liquid inlet comprises: a liquid inlet
configured to transfer the liquid material from the source of the
liquid material to an interior of at least one of the first
reaction cell or the at least a second reaction cell.
15. A method for combinatorial non-contact wet processing,
comprising: providing a liquid material; transporting a first
portion of the liquid material from a source of the liquid material
to a first reaction cell, wherein the first reaction cell is
configured for positioning at a first selected distance from the
surface of a substrate; transporting at least a second portion of
the liquid material from the source of the liquid material to at
least a second reaction cell, wherein the at least a second
reaction cell is configured for positioning at a second selected
distance from the surface of a substrate; converting the first
portion of the liquid material to a first atomized spray of liquid
particles; converting the at least a second portion of the liquid
material to at least a second atomized spray of liquid particles;
containing a portion of the first atomized spray of liquid
particles within a first selected region of the substrate;
containing a portion of the at least a second atomized spray of
liquid particles within at least a second selected region of the
substrate; applying a portion of the first atomized spray of
particles onto the first selected region of the substrate; and
applying a portion of the at least a second atomized spray of
particles onto the at least a second selected region of the
substrate.
16. The method for combinatorial non-contact wet processing of
claim 15, wherein the converting the first portion of the liquid
material to a first atomized spray of liquid particles comprises:
converting a portion of the liquid material to an atomized spray of
liquid particles via two or more gas jets disposed within an
interior of a reaction cell.
17. The method for combinatorial non-contact wet processing of
claim 15, wherein the containing a portion of the first atomized
spray of liquid particles within a first selected region of the
substrate comprises: containing a portion of the first atomized
spray of liquid particles within a first selected region of the
substrate via a vacuum element disposed on the periphery of a
reaction cell.
18. The method for combinatorial non-contact wet processing of
claim 15, wherein the containing a portion of the first atomized
spray of liquid particles within a first selected region of the
substrate comprises: containing a portion of the first atomized
spray of liquid particles within a first selected region of the
substrate via a gas curtain element disposed on the periphery of a
reaction cell.
19. The method for combinatorial non-contact wet processing of
claim 15, wherein the transporting a first portion of the liquid
material from a source of the liquid material to a first reaction
cell comprises: transporting a first portion of the liquid material
from a source of the liquid material to a liquid inlet of a first
reaction cell.
20. The method for combinatorial non-contact wet processing of
claim 15, further comprising: controlling the flow of the liquid
material from a source of the liquid material to at least one of
the first reaction cell or at least a second reaction cell
utilizing a liquid flow control system.
Description
TECHNICAL FIELD
[0001] The present invention generally relates to the application
of liquid material, and more particularly to the application of a
liquid material utilizing a system and process for non-contact
liquid material application onto a substrate.
BACKGROUND
[0002] As feature sizes continue to shrink, improvements, whether
in materials, unit processes, or process sequences, are continually
being sought for the deposition processes. However, semiconductor
companies conduct R&D on full wafer processing through the use
of split lots, as the deposition systems are designed to support
this processing scheme. This approach has resulted in ever
escalating R&D costs and the inability to conduct extensive
experimentation in a timely and cost effective manner.
[0003] As an example, integrated circuit (IC) manufacturing
typically includes a series of processing steps such as cleaning,
surface preparation, deposition, lithography, patterning, etching,
planarization, implantation, thermal annealing, and other related
unit processing steps. The precise sequencing and integration of
the unit processing steps enables the formation of functional
devices meeting desired performance metrics such as speed, power
consumption, and reliability.
[0004] The drive towards ever increasing performance of devices or
systems of devices such as in systems on a chip (SOCs) has led to a
dramatic increase in the complexity of process sequence integration
and device integration, or the means by which the collection of
unit processing steps are performed individually and collectively
in a particular sequence to yield devices with desired properties
and performance. This increase in complexity of device integration
has driven the need for, and the subsequent utilization of
increasingly complex processing equipment with precisely sequenced
process modules to collectively perform an effective unit
processing step.
[0005] The ability to process uniformly across an entire monolithic
substrate and/or across a series of monolithic substrates is
advantageous for manufacturing cost effectiveness, repeatability
and control when a desired process sequence flow for IC
manufacturing has been qualified to provide devices meeting desired
yield and performance specifications. However, processing the
entire substrate can be disadvantageous when optimizing,
qualifying, or investigating new materials, new processes, and/or
new process sequence integration schemes, since the entire
substrate is nominally made the same using the same material(s),
process(es), and process sequence integration scheme. Conventional
full wafer uniform processing results in fewer data per substrate,
longer times to accumulate a wide variety of data and higher costs
associated with obtaining such data. As an example, traditional
liquid chemical deposition processes are severely limited in that
they typically coat an entire substrate surface with a liquid
material. Thus, standard liquid application processes used
throughout various steps in semiconductor processing lack the
ability to perform combinatorial liquid material processing and
deposition. As a result, the manufacture and analysis of a
substrate region or structure treated with traditional liquid
chemical application processes require relatively long processing
times and increased processing steps. Additionally, the inability
to simultaneously apply liquid materials at multiple regions and
multiple materials on a single substrate surface inhibits the
ability for comparative analysis between the various regions of a
given substrate and/or substrates.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The numerous advantages of the disclosure may be better
understood by those skilled in the art by reference to the
accompanying figures in which:
[0007] FIG. 1A is a glancing angle schematic view of a system for
combinatorial non-contact wet processing, in accordance with one
embodiment of the present invention.
[0008] FIG. 1B is a simplified schematic view of a system for
combinatorial non-contact wet processing, in accordance with one
embodiment of the present invention.
[0009] FIG. 1C is a simplified schematic view of a system for
combinatorial non-contact wet processing, in accordance with one
embodiment of the present invention.
[0010] FIG. 1D is a simplified schematic view of a system for
combinatorial non-contact wet processing, in accordance with one
embodiment of the present invention.
[0011] FIG. 1E is a block diagram illustrating an implementation of
combinatorial processing and evaluation.
[0012] FIG. 1F is a simplified schematic view of a reaction cell
assembly of the system for combinatorial non-contact wet
processing, in accordance with one embodiment of the present
invention.
[0013] FIG. 1G is a schematic view of a single reaction cell of the
system for combinatorial non-contact wet processing, in accordance
with one embodiment of the present invention.
[0014] FIG. 1H is a simplified schematic view of a single reaction
cell of the system for combinatorial non-contact wet processing
illustrating a vacuum element, in accordance with one embodiment of
the present invention.
[0015] FIG. 2 is a simplified schematic view of a reaction cell
assembly of the system for combinatorial non-contact wet processing
illustrating a gas curtain element, in accordance with one
embodiment of the present invention.
[0016] FIG. 3A is a simplified schematic view of a single reaction
cell of the system for combinatorial non-contact wet processing
illustrating a showerhead device, in accordance with one embodiment
of the present invention.
[0017] FIG. 3B is a glancing angle schematic view of a showerhead
device, in accordance with one embodiment of the present
invention.
[0018] FIG. 4A is a simplified schematic view of a horizontal
reaction cell assembly of the system for combinatorial non-contact
wet processing, in accordance with one embodiment of the present
invention.
[0019] FIG. 4A is a simplified schematic view of a horizontal
reaction cell assembly of the system for combinatorial non-contact
wet processing, in accordance with one embodiment of the present
invention.
[0020] FIG. 5 is a flow chart illustrating a method for
combinatorial non-contact wet processing.
DETAILED DESCRIPTION OF THE INVENTION
[0021] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory only and are not necessarily restrictive of the
invention as claimed. The accompanying drawings, which are
incorporated in and constitute a part of the specification,
illustrate embodiments of the invention and together with the
general description, serve to explain the principles of the
invention. Reference will now be made in detail to the subject
matter disclosed, which is illustrated in the accompanying
drawings.
[0022] Referring generally to FIG. 1A through 4B, a system 100 for
combinatorial non-contact wet processing is described in accordance
with the present disclosure. The system 100 for combinatorial
non-contact wet processing may include multiple reaction cells 102
each of which are capable of isolating a selected region 108 of a
substrate 114. The isolating non-contact reaction cells 102 may be
utilized to apply a selected liquid material onto the selected
isolated regions 108 of the surface of a substrate 114. The two or
more isolating reaction cells 102 may be used combinatorially in
order to deposit materials simultaneously or sequentially at two or
more isolated substrate regions 108. The system 100 for
combinatorial non-contact wet processing provides for the
application of multiple materials in discretized regions 108 at
selected positions on the surface of a given substrate 114, such as
a silicon wafer. Moreover, the system 100 for combinatorial
non-contact wet processing allows for the application of liquid
materials to a substrate surface without the added contamination
associated to a mechanically attached reaction cell. Non-contact
spray deposition is particularly advantageous in settings where the
pristine nature of an underlying substrate is critical.
[0023] The embodiments described herein enable the application of
combinatorial techniques to deposition process sequence integration
in order to arrive at a globally optimal sequence of semiconductor
manufacturing operations by considering interaction effects between
the unit manufacturing operations on multiple regions of a
substrate concurrently. Specifically, multiple process conditions
may be concurrently employed to effect such unit manufacturing
operations, as well as material characteristics of components
utilized within the unit manufacturing operations, thereby
minimizing the time required to conduct the multiple operations. A
global optimum sequence order can also be derived and as part of
this technique, the unit processes, unit process parameters and
materials used in the unit process operations of the optimum
sequence order are also considered.
[0024] The embodiments described herein are capable of analyzing a
portion or sub-set of the overall deposition process sequence used
to manufacture a semiconductor device. The process sequence may be
one used in the manufacture of integrated circuits (IC)
semiconductor devices, data storage devices, photovoltaic devices,
and the like. Once the subset of the process sequence is identified
for analysis, combinatorial process sequence integration testing is
performed to optimize the materials, unit processes and process
sequence for that portion of the overall process identified. During
the processing of some embodiments described herein, the deposition
may be used to form, modify, or complete structures already formed
on the substrate, which structures are equivalent to the structures
formed during manufacturing of substrates for production. For
example, structures on semiconductor substrates may include, but
are not limited to, trenches, vias, interconnect lines, capping
layers, masking layers, diodes, memory elements, gate stacks,
transistors, or any other series of layers or unit processes that
create a structure found on semiconductor chips. The material, unit
process and process sequence variations may also be used to create
layers and/or unique material interfaces without creating all or
part of an intended structure, which allows more basic research
into properties of the resulting materials as opposed to the
structures or devices created through the process steps. While the
combinatorial processing varies certain materials, unit processes,
or process sequences, the composition or thickness of the layers or
structures or the action of the unit process is preferably
substantially uniform within each region, but can vary from region
to region per the combinatorial experimentation.
[0025] The result is a series of regions on the substrate that
contain structures or results of unit process sequences that have
been uniformly applied within that region and, as applicable,
across different regions through the creation of an array of
differently processed regions due to the design of experiment. This
process uniformity allows comparison of the properties within and
across the different regions such that the variations in test
results are due to the varied parameter (e.g., materials, unit
processes, unit process parameters, or process sequences) and not
the lack of process uniformity. However, non-uniform processing of
regions can also be used for certain experiments of types of
screening. Namely, gradient processing or regional processing
having non-uniformity outside of manufacturing specifications may
be used in certain situations.
[0026] The term "combinatorial processing" generally refers to
techniques of differentially processing multiple regions of a
substrate. Combinatorial processing can be used to produce and
evaluate different materials, chemicals, processes, and techniques
related to semiconductor fabrication as well as build structures or
determine how the above coat, fill, or interact with existing
structures. Combinatorial processing varies materials, unit
processes and/or process sequences across multiple regions on a
substrate.
[0027] FIGS. 1A through 1D illustrate schematic views of a system
100 for combinatorial non-contact wet processing in accordance with
exemplary embodiments of the present invention. The system 100 for
combinatorial non-contact wet processing may include two or more
reaction cells 102 configured to isolate two or more selected
regions 108 of a substrate 114. As shown in FIG. 1A, the reaction
cells 104 may be arranged in an array (e.g., hexagonal array),
allowing for the precise control of the location of the isolated
application regions 108 on a corresponding substrate 114 surface.
Moreover, the system 100 may include one or more liquid material
sources 106 suitable for supplying a liquid material 107 to the
reaction cells 102. For instance, one or more liquid material
sources 106 may be in fluidic communication with one or more
reaction cells 102 of the system 100, allowing for the
transportation of one or more liquid materials 106 from the liquid
material source 107 to the reaction cells 102.
[0028] In one embodiment, illustrated in FIG. 1B, the system 100
may include a single liquid material source 106 fluidically coupled
to two or more reaction cells 102. For example, a single liquid
material 107 may be transported from a liquid material source 106
to two or more reaction cells 104 via a network of liquid
source-cell conduits 105. For instance, a first portion of the
liquid material 106 may be transported to a first non-contact
reaction cell 102 configured to isolate a first region 108 of the
substrate 114, a second portion of the liquid material 106 may be
transported to a second non-contact reaction cell 102 configured to
isolate a second region 108 of the substrate 114, and an Nth
portion of the liquid material 106 may be transported to an Nth
non-contact reaction cell 102 configured to isolate an Nth region
108 of the substrate 114.
[0029] In another embodiment, illustrated in FIG. 1C, the system
100 may include two or more liquid sources 106, wherein each liquid
source 106 is fluidically coupled to a reaction cell 102. For
example, a first liquid material source 106 may be fluidically
coupled to a first reaction cell 102, a second liquid material
source 106 may be fluidically coupled to a second reaction cell
102, and up to an including an Nth liquid material source 106 may
fluidically coupled to an Nth reaction cell 102. A portion of the
first liquid material 107 may then be transported from the first
liquid material source 106 to a first reaction cell 102. A portion
of the second liquid material 107 may then be transported from the
second liquid material source 106 to a second reaction cell 102. A
portion of the Nth liquid material 107 may then be transported from
the Nth liquid material source 106 to the Nth reaction cell 102.
For instance, the portion of the first liquid material 107 may be
transported to a first reaction cell 102 configured to isolate a
first region 108 of the substrate 114, the portion of the second
liquid material 107 may be transported to a second reaction cell
102 configured to isolate a second region 108 of the substrate 114,
and the portion of the Nth liquid material 107 may be transported
to an Nth reaction cell 102 configured to isolate an Nth region 108
of the substrate 114. It should be noted that the first, second,
and up to and including the Nth liquid materials 107 may be
comprised of the same or different liquid materials.
[0030] In another embodiment, illustrated in FIG. 1D, the system
100 may include two or more liquid sources 106, wherein the liquid
sources 106 are configured to deliver two or more liquid materials
107 to a single reaction cell 102. For instance, a portion of the
first liquid material 107, a portion of the second liquid material
107, and up to and including a portion of an Nth liquid material
107 may be intermixed. For instance, a first liquid material 107,
provided from a first liquid source 106, and second liquid material
107, from a second liquid source 106, may be mixed within a
source-cell conduit 105 while the liquids are transported to one or
more reaction cells 102. In another instance, a first liquid
material 107, provided from a first liquid source 106, and second
liquid material 107, from a second liquid source 106, may be mixed
in an associated mixing chamber. The mixed liquid material may then
be supplied to one or more reaction cells 102 as described in the
present disclosure. The preceding description should not be
interpreted as a limitation but rather merely an illustration of
combinatorial processing techniques which may be implemented with
the presently disclosed system and methods as it is contemplated
that a variety of implementations may be more or less suitable in
different contexts.
[0031] FIG. 1E is a block diagram 140 illustrating an
implementation of combinatorial processing and evaluation. The
schematic diagram 140 illustrates that the relative number of
combinatorial processes run with a group of substrates decreases as
certain materials and/or processes are selected. Generally,
combinatorial processing includes performing a large number of
processes and materials choices during a first screen, selecting
promising candidates from those processes, performing the selected
processing during a second screen, selecting promising candidates
from the second screen, and so on. In addition, feedback from later
stages to earlier stages can be used to refine the success criteria
and provide better screening results.
[0032] For example, thousands of materials are evaluated during a
materials discovery stage 142. Materials discovery stage 142 is
also known as a primary screening stage performed using primary
screening techniques. Primary screening techniques may include
dividing wafers into regions and depositing materials using varied
processes. The materials are then evaluated, and promising
candidates are advanced to the secondary screening stage (i.e., the
materials and process development stage 144). Evaluation of the
materials is performed using metrology tools such as physical and
electronic testers and imaging tools.
[0033] The materials and process development stage 144 may evaluate
hundreds of materials (i.e., a magnitude smaller than the primary
stage) and may focus on the processes used to deposit or develop
those materials. Promising materials and processes are again
selected, and advanced to the tertiary screening stage (i.e., the
process integration stage 146), where tens of materials and/or
processes and combinations are evaluated. The tertiary screening
stage, or process integration stage 146, may focus on integrating
the selected processes and materials with other processes and
materials into structures.
[0034] The most promising materials and processes from the tertiary
screening stage are advanced to the device qualification stage 148.
In the device qualification stage 148, the materials and processes
selected are evaluated for high volume manufacturing, which
normally is conducted on full wafers within production tools, but
need not be conducted in such a manner. The results are evaluated
to determine the efficacy of the selected materials, processes, and
integration. If successful, the use of the screened materials and
processes can proceed to the manufacturing stage 150.
[0035] The schematic diagram 140 represents an example of various
techniques that may be used to evaluate and select materials,
processes, and integration for the development of semiconductor
devices. The descriptions of primary, secondary, etc. screening and
the various stages 142-150 are arbitrary and the stages may
overlap, occur out of sequence, be described and be performed in
many other ways.
[0036] While the preceding description is directed at the
implementation of multiple reaction cells 102 in accordance with
the present invention, the following description will, in part,
describe aspects of a single reaction cell assembly 101. It is
contemplated that the following description of components and
implementations within the context of a single reaction cell
assembly 101 should be interpreted to extend to the multiple
reaction cell configuration of the preceding description.
[0037] FIG. 1F illustrates a partial cross-sectional schematic view
of a single reaction cell assembly 101 of the system 100 for
combinatorial non-contact wet processing in accordance with an
exemplary embodiment of the present invention. The single assembly
101 of the system 100 may include a liquid material source 106
configured to supply a selected amount of a liquid material 107 to
a non-contact reaction cell 102. The liquid material source 106 may
be placed in fluidic communication with the non-contact reaction
cell 102 utilizing a source-cell conduit 104. The liquid material
107 may be transported from the liquid source 106 to an inlet 116
of the non-contact reaction cell 102 through the source-cell
conduit 104.
[0038] In addition, the single assembly 101 of the system 100 may
include a plurality of gas jets 110 disposed within the interior
132 of the non-contact reaction cell 102. The gas jets 110 may be
used to atomize a portion of the liquid material 107 transported
from the liquid material source 106 to the inlet 116 of the
reaction cell via the source-cell conduit 104 into a spray of
liquid material 122. For instance, one or more gas streams 120
emanating from one or more gas jets 110 may be impinged onto one or
more liquid droplets 118 which enter the interior 132 of the
deposit cell 102 through the cell inlet 116.
[0039] Moreover, the non-contact reaction cell 102 of the assembly
101 may be configured to direct the spray of the liquid material
107 from the inlet 116 of the reaction cell 102 onto an isolated
region 108 of the surface of a substrate 114. The reaction cell 102
may be situated such that the non-contact reaction cell 102 is in
close proximity to but not in physical contact with the surface of
the substrate, allowing for the deposition of spray of liquid
material 122 onto an isolated selected region 108 of the substrate
114. For instance, the reaction cell 102 may be positioned at a
selected distance above the surface of the substrate 114, wherein
the selected distance is a function of both the material properties
of the implemented liquid material and the substrate surface. After
atomization by the gas jets 110, the droplets of the spray of
liquid material 122 may accelerate (e.g., via gravitational forces)
from the top of the reaction cell 102 to the surface of the
substrate 114.
[0040] Furthermore, the single assembly 101 of the system 100 may
include one or more vacuum elements 127 disposed along an edge of
the non-contact reaction cell 102. The vacuum elements 127 may
facilitate the flow of the liquid spray 122 toward the surface of
the substrate 114. In addition, the vacuum elements 127 may act to
contain the deposited liquid material 111 within a selected region
108 of the substrate 114 by evacuating portions of the liquid
material 111 that migrate toward the edge of the region 108
demarked by the vacuum element(s) 127.
[0041] In some embodiments, the region 108 may include one region
and/or a series of regular or periodic regions pre-formed on the
substrate. The region may have any convenient shape (e.g., circular
shape, rectangular shape, elliptical shape, wedge-shaped, or the
like). In the semiconductor field, a region may include, but is not
limited to, a test structure, a single die, a multiple die, a
portion of a die, a defined portion of a substrate, or an undefined
area of a blanket substrate, which is defined through the
processing.
[0042] In some embodiments, the system 100 for combinatorial
non-contact wet processing may include one or more liquid flow
control systems 112. A liquid flow control system 112 may be
utilized to control the flow of a liquid material 107 from a liquid
source 106 to one or more non-contact reaction cells 102 of the
system 100. For example, in a single assembly 101 of the system
100, a liquid flow control system 112 may control the flow of a
liquid material 107 from a liquid material source 106 to an inlet
116 of the non-contact reaction cell 102 through a source-cell
conduit 104, such as a plastic tubing (e.g., polyvinyl chloride
tubing or polyethylene tubing) conduit or a metal tubing conduit
(e.g., aluminum tubing, copper tubing, or brass tubing).
[0043] In additional embodiments, one or more liquid flow control
systems 112 may include one or more actuated valves configured to
control the flow of a liquid material 107 from a liquid source 106
to one or more reaction cells 102. For example, an actuated valve
of the liquid control system 112 may be opened allowing a liquid
material 107 to flow from a liquid material source 106 (e.g.,
pressurize liquid material source) to a liquid inlet of a reaction
cell 102. By way of another example, an actuated valve of the
liquid control system 112 may be closed, stopping the liquid
material 107 from flowing from a pressurized liquid material source
106 to the liquid inlet of a reaction cell 102.
[0044] In another embodiment, one or more liquid flow control
systems 112 may include one or more pumps. For example, a pump of
the liquid control system 112 may be used to transport the liquid
material 107 from the liquid material source 106 to the liquid
inlet of the reaction cell 102. For instance, the pump may include
a liquid pump used to pump the liquid material 107 from the liquid
material source 106 to a liquid inlet of the reaction cell 102. In
another instance, the pump may include a gas pump used to
pressurize a sealed container of the liquid material 107.
[0045] In a further embodiment, one or more liquid control systems
112 may include one or more computer control systems. For example,
a computer control system of the liquid control system 112 may be
used to control one or more valves or one or more pumps of a liquid
control system 112. Moreover, it is further contemplated that a
computer control system may include preprogrammed software suitable
for providing instructions to the computer system output, which in
turn signals the one or more actuated valves or pumps of a liquid
control system 112. Additionally, the computer control system 112
may be responsive to an operator input, wherein the computer
control system in response to the operator input provides
instructions to the computer system output, which in turn signals
the one or more actuated valves or pumps of the liquid control
system 112. Further, it is also contemplated that the computer
control system 112 may be responsive to a signal transmitted by
another control system (e.g., a global control system) of the
system 100, wherein the computer control system of the liquid
control system 112, responsive to a signal from another control
system, provides instructions to the computer system output, which
in turn signals the one or more actuated valves or pumps of the
liquid control system 112.
[0046] It is further contemplated that a global liquid control
system may be used to control individual liquid flows in the single
assemblies 101 of the system 100. For example, a global liquid
control system may be utilized to control a first liquid flow from
a first liquid material source 106 to a first reaction cell 102, a
second liquid flow from a second liquid material source 106 to a
second reaction cell 102, and a up to and including an Nth liquid
flow from an Nth liquid material source 106 to an Nth reaction cell
102.
[0047] The preceding description of the one or more liquid control
systems 112 should not be interpreted as a limitation but rather
merely an illustration as it is contemplated that a variety of
implementations may be more or less suitable in different
contexts.
[0048] In some embodiments, the system 100 for combinatorial
non-contact wet processing may include one or more gas flow control
systems 152. A gas flow control system 152 may be utilized to
control the rate at which a gas is supplied from a gas source 154
to the gas jets 110 disposed in a non-contact reaction cell 102.
For example, in a single assembly 101 of the system 100, one or
more gas flow control systems 152 may include one or more actuated
valves configured to regulate the gas flow 156 between a gas source
154 and gas jet 110. The regulation of gas flow 156 between the gas
source 154 and the gas jet 110 allows for control of the
atomization process of the liquid material 106 in the reaction cell
102. For example, an actuated gas valve of the gas flow control
system 152 may be adjusted in order to adjust the flow rate of the
gas stream 156 flowing from the gas source 154 to the gas jets 110
and in turn regulating the conversion of the liquid material 106 to
a liquid spray material 122.
[0049] In other embodiments, one or more gas flow control systems
152 of the system 100 for combinatorial non-contact wet processing
may include one or more electronic mass flow control systems. For
example, a mass flow control system of the gas flow control system
152 may be adjusted in order to adjust the flow rate of the gas
stream 156 flowing from the gas source 154 to the gas jets 110
disposed in a non-contact reaction cell 102.
[0050] In some embodiments, one or more gas flow control systems
152 of the system 100 for combinatorial non-contact wet processing
may include one or more actuated orifices. For example, an actuated
orifice 129 of a gas flow control system 152 may be utilized to
adjust the flow rate of the gas stream 156 flowing from the gas
source 154 to the gas jets 110 disposed in a non-contact reaction
cell 102.
[0051] In further embodiments, one or more gas flow control systems
152 may include a computer control system configured to control the
actuated valves of a gas flow control system 152. For instance, in
response to an input instruction from an operator, the computer
control system may transmit an electronic signal to one or more
actuated valves or a mass flow control system configured to respond
(e.g., open or close) to an electronic signal. In another instance,
a preprogrammed computer control system may maintain or establish a
selected gas flow rate by adjusting one or more actuated valves or
one or more mass flow control systems located between the gas
source 154 and the gas jets 110 disposed in a non-contact reaction
cell 102.
[0052] Further, one or more gas flow control systems 152 may be
controlled by the liquid flow control system 112. For instance, the
computer control system of a liquid flow control system 112 may
transmit instruction signals to one or gas flow control system 152
in order to regulate the flow rate of a gas being transported from
a gas source 154 to the gas jets 110 disposed in a non-contact
reaction cell 102.
[0053] It is further contemplated that the computer control system
of a gas flow control system 152 may be responsive to a global
control system, which is configured to control the various
subsystems (e.g., liquid control system(s) 112, gas flow control
system(s) 152, or vacuum element systems(s) 127) of the system 100.
Moreover, it is further recognized that the computer control system
of one or more liquid flow control systems 112 and the computer
control system of one or more of the gas flow control systems 152
may in fact be subsystems of a single global computer control
system, wherein the computer control system of the liquid flow
control system 112 and the computer control system of the gas flow
control system 152 are modules of the global computer control
system.
[0054] It is further contemplated that a global gas flow control
system may be used to control individual gas flow rates in the
single assemblies 101 of the system 100. For example, a global gas
flow control system may be utilized to control a first gas flow
from a first gas source 154 to the gas jets 110 of a first reaction
cell 104, a second gas flow from a second gas source 154 to a
second reaction cell 102, and a up to and including an Nth gas flow
from an Nth gas source to an Nth reaction cell 102. The preceding
description of the one or more gas flow control systems 152 should
not be interpreted as a limitation but rather merely an
illustration as it is contemplated that a variety of
implementations may be more or less suitable in different
contexts.
[0055] In some embodiments, one or more source-cell conduits 104 of
the system 100 may include a laminar flow element. For example, a
source-cell conduit 104 may include a straight pipe section
configured to produce substantially laminar flow in the liquid flow
113 between the liquid source 106 and the reaction cell 102. It
should be appreciated by those skilled in the art that the
non-turbulent laminar flow that may occur in a source-cell conduit
104 may allow for more precise control of application conditions as
the fluid movement of the liquid flow 113 is more readily predicted
and controlled.
[0056] It is further contemplated that in the context of the system
100 for combinatorial non-contact wet processing multiple
source-cell conduits 104 may be implemented. For example, as shown
in FIG. 1B, the conduits 104 may be used to fluidically couple a
single liquid material source 106 to multiple reaction cells 102.
In another example, as shown in FIG. 1C, a conduit 104 may be used
to couple a single liquid material source 106 to a single reaction
cell 102. Further, as shown in FIG. 1D, a network of conduits 104
may be implemented to fluidically couple emerging liquid flows 113
from multiple liquid material sources 106, allowing the combined
intermixed liquid flow 113 to be transported to the individual
reaction cells 102 of the system 100.
[0057] In some embodiments, the material used to fabricate one or
more reaction cells 102 of the system 100 for combinatorial
non-contact wet processing may include, but is not limited to, a
metal material or a plastic material. For example, a reaction cell
102 of the system 100 for combinatorial non-contact wet processing
may include an aluminum reaction cell. By way of another example, a
reaction cell 102 of the system 100 for combinatorial non-contact
wet processing may include a Teflon reaction cell. In another
example, a reaction cell 102 of the system 100 for combinatorial
non-contact wet processing may include an acrylic reaction cell. An
acrylic reaction cell is particularly advantageous when optical
monitoring of the spray deposition process or subsequent treatment
processes are required. Further, ultraviolet ("UV") transparent
acrylic may be implemented in situations where the deposited liquid
material 111 of liquid material spray 122 requires further UV
treatment (e.g., UV curing).
[0058] A variety of reaction cell 102 shapes may be implemented in
accordance with the present invention. For example, the reaction
cell 102 may include a cylindrical shaped reaction cell, as
illustrated in FIGS. 1A through 1F. In another example, the
reaction cell 102 may include a rectangular shaped reaction cell,
as illustrated in FIGS. 4A and 4B. In a general sense, the reaction
cell 102 may be of any convenient shape (e.g., cylinder,
rectangular cuboid, a cone, a pyramid, and the like) and may depend
on the specifics of its implementation.
[0059] A variety of substrates may be implemented in accordance
with the present invention. For example, the substrate 114 may
include, but is not limited to, a silicon substrate, a gallium
arsenide substrate, glass, quartz, ruby or the like. The preceding
lists of substrate materials should not be considered a limitation
as there exists a variety of substrate materials suitable for
implementation in accordance with the present invention. In a
general sense, a substrate should be interpreted as any object with
which a thin film material may be deposited utilizing the present
invention.
[0060] Further, the substrate 114 may be a conventional round 200
millimeter, 300 millimeter or any other larger or smaller
substrate/wafer size. In other embodiments, substrate 114 may be a
square, rectangular, or other shaped substrate. One skilled in the
art will appreciate that substrate 114 may be a blanket substrate,
a coupon (e.g., partial wafer), or even a patterned substrate
having predefined regions. In another embodiment, substrate 114 may
have regions defined through the processing described herein.
[0061] Referring now to FIG. 1H, one or more vacuum elements 127 of
the system 100 may be fluidically coupled to a vacuum trap 134. For
example, a vacuum element 127 of a reaction cell 102 of a single
assembly 101 of the system 100 may be utilized to transport
coalesced liquid material 106 deposited on the substrate 114 from
the interior 132 of the reaction cell 102 to a vacuum trap 134. It
should also be recognized that the pressure differential created by
the vacuum trap 134 may also act to accelerate the spray of liquid
material 122 from the inlet 116 of the reaction cell 102 to the
substrate 114 surface.
[0062] In a further embodiment, a vacuum element 127 of a reaction
cell 102 may include one or more exhaust ports 124 configured to
allow for the evacuation of liquid material 107 from the inner
region 132 of the reaction cell 102 to the external vacuum trap
134. For example, an exhaust port 124 may be located on the wall
128 of a reaction cell 102 and may be fluidically coupled to the
vacuum trap 134 via a cell-trap conduit 136, such as plastic (e.g.,
polyethylene or polyvinyl chloride) tubing or metal (e.g.,
stainless steel, copper, aluminum, or brass) tubing.
[0063] Further, a vacuum element 127 of a reaction cell 102 may
include one or more exhaust channels 126. For example, an exhaust
channel 126 of a reaction cell 102 may be defined by a wall 128
located within the interior of a reaction cell 102 and extending
from the top of the reaction cell 102 towards the bottom of the
reaction cell 102. A vacuum element inlet 129 at the bottom of the
reaction cell 102 allows liquid material 107 to pass from the
surface of the substrate 114 to the exhaust channel 126 of the
reaction cell 102. Moreover, the exhaust channel 126 acts to
transport the liquid material 107 from the vacuum element inlet 129
to the exhaust port 124 of the reaction cell 102. It should be
recognized that the preceding description pertaining to the vacuum
element(s) 127 of a single assembly 101 of the system 100 for
combinatorial non-contact wet processing should not be interpreted
as a limitation but merely as an illustration as other exhaust
system arrangements may be more or less suitable in different
contexts.
[0064] In a further embodiment, a vacuum element 127 may include
one or more actuated valves fluidically coupled to an exhaust port
124 of a reaction cell 102 and a vacuum trap 134. For instance, one
or more actuated valves may be connected in series between the
exhaust port 124 and the vacuum trap 134 along the cell-trap
conduit 136.
[0065] In another embodiment, a vacuum element 127 may include one
or more actuated orifices fluidically coupled to an exhaust port
124 of a reaction cell 102 and a vacuum trap 134. For instance, one
or more actuated orifices (e.g., pressure activated orifice) may be
connected in series between the exhaust port 124 and the vacuum
trap 134 along the cell-trap conduit 136.
[0066] In a further embodiment, one or more vacuum elements 127 may
include a computer control system configured to control the
actuated valves or actuated orifices of the one or more vacuum
elements 127. For instance, in response to an input instruction
from an operator, the computer control system may transmit an
electronic signal to one or more actuated valves or one or more
orifices configured to respond to an electronic signal. In another
instance, a preprogrammed computer control system may maintain or
establish a selected liquid uptake rate by adjusting one or more
actuated valves or one or more actuated orifices located between
the exhaust port 124 and the vacuum trap 134. It is further
contemplated that the computer control system may be responsive to
a global control system, which is configured to control the various
subsystems (e.g., liquid control system 112, gas flow control
system 152, or vacuum elements 127) of the system 100.
[0067] In some embodiments, one or more vacuum elements 127 may
include a ring shaped vacuum element. For example, as illustrated
in FIGS. 1F through 1H, a circular shaped vacuum element may be
disposed on the circumference of a cylindrically shaped reaction
cell 102. In other embodiments, one or more vacuum elements 127 may
include a bar shaped vacuum element. For example, as illustrated in
FIGS. 4A and 4B, a bar shaped vacuum element may be disposed along
one or more edges of a rectangular shaped reaction cell 102. The
preceding description of the one or more vacuum elements 127 should
not be interpreted as a limitation but rather merely an
illustration as it is contemplated that a variety of
implementations may be more or less suitable in different contexts.
Moreover, the specific shape of a given vacuum element 127 may
greatly depend on the geometry of the implement reaction cell
102.
[0068] Referring now to FIG. 2, the system 100 for combinatorial
non-contact wet processing may include one or more gas curtain
elements 202 configured to contain the applied liquid material 107
within a selected region 108 of the substrate 114. For example, a
gas curtain element 202 may flow a gas stream 204 at the periphery
of a reaction cell 102 in order to contain the applied liquid
material 107 within the selected region 108 of the substrate 114.
For instance, a curtain gas source 206 may supply gas to a gas
curtain element 202. The gas curtain element may then flow one or
more gas streams 204 at the bottom edge of the reaction cell 102,
directing the gas stream toward the vacuum element inlet 129, in
order to contain the applied liquid material 107 within the
selected region 108 of the surface of the substrate 114. It will be
recognized by those skilled in the art that the requisite flow rate
of the utilized gas curtain stream 204 will be a function of the
cell-substrate distance, the type of liquid material 107, and the
type of substrate surface.
[0069] In some embodiments, the curtain gas source may include an
inert gas source. For example, the gas source may include a
nitrogen gas source or an argon gas source. For instance, a
nitrogen gas source 206 may supply gas to a gas curtain element
202. The gas curtain element may then flow one or more nitrogen gas
streams 204 at the bottom edge of the reaction cell 102, directing
the nitrogen gas stream toward the vacuum element inlet 129, in
order to contain the deposited liquid material 107 within the
selected region 108 of the surface of the substrate 114.
[0070] In some embodiments, a gas curtain element 202 may include a
ring shaped gas curtain element. For example, as illustrated in
FIG. 2, a circular shaped vacuum element may be disposed on the
circumference of a cylindrically shaped reaction cell 102. In other
embodiments, one or more gas curtain elements 202 may include a bar
shaped gas curtain element 406. For example, as illustrated in
FIGS. 4A and 4B, a bar shaped gas curtain element 406 may be
disposed along one or more edges of a rectangular shaped reaction
cell 102. The preceding description of the one or more gas curtain
elements 202 should not be interpreted as a limitation but rather
merely an illustration as it is contemplated that a variety of
implementations may be more or less suitable in different contexts.
Moreover, the specific shape of a given gas curtain element 202 may
greatly depend on the geometry of the implemented reaction cell
102.
[0071] Referring now to FIGS. 3A and 3B, the system 100 for
combinatorial non-contact wet processing may include one or more
showerhead devices 302 disposed within in the interior 132 of the
non-contact reaction cell 102. A showerhead device 302 may be
utilized to improve the uniform spatial distribution of the
droplets of the spray of liquid material 122 by acting to diffuse
the liquid material 107 into a spray of liquid material 122. For
example, in a single assembly 101 of the system 100, a liquid
material 107 may be transported from a liquid source 106 to a
showerhead device 302 fluidically coupled to the inlet 116 of the
reaction cell 102 and disposed within the reaction cell 102. The
liquid material 107 may then pass through the openings 304 of the
showerhead device 302, which act to diffuse the liquid material
107. After passing through the showerhead device 302, liquid spray
122 may then flow from the showerhead device 302 to the surface of
a substrate 114. It is further recognized that the showerhead
device may be implemented in conjunction with a plurality of gas
jets 110, wherein the energy imparted by the gas stream of the gas
jets act to further atomize the diffused liquid material.
[0072] In a further embodiment, a showerhead device 302 may be
arranged substantially parallel to the substrate 114 surface and
may be located within an interior 132 of a reaction cell 102. For
example, in a single assembly 101 of the system 100, the liquid
material 107 may be transported from a liquid source 106 to the
inlet 116 of a reaction cell 102 through a source-cell conduit 104.
After entering the interior of the reaction cell 132, the liquid
material may then pass through the showerhead device 302, aligned
substantially parallel with the surface of the substrate 114. The
showerhead device 302 may act to diffuse the liquid material 107
prior to deposition onto the substrate 114 surface. Upon emerging
from the showerhead device 302, the spray of liquid material 122
may follow a path substantially perpendicular with respect to the
substrate 114 (i.e., path is substantially vertical) before being
deposited onto the surface of the substrate 114.
[0073] In another embodiment, one or more showerhead devices 302
may include an inlet configured to directly fluidically couple the
showerhead device 302 to a source-cell conduit 104. For example,
the liquid material 107 may be transported from the liquid source
107 to the inlet of a showerhead device 302 through a source-cell
conduit 104. The showerhead device 302 may be arranged to
effectively function as the inlet of a reaction cell 102. After
entering the inlet of the showerhead device 302 and then passing
through the openings 304 of the showerhead device 302, the liquid
spray 122 may enter the interior 132 of the reaction cell 102.
After entering the interior 132 of the reaction cell 102, the spray
of material 122 may follow a path substantially perpendicular with
respect to the substrate (i.e., path is substantially vertical)
before being deposited onto the surface of the substrate 114.
[0074] In some embodiments, one or more showerhead devices 302 may
include a disk shaped showerhead device 302 having a plurality of
openings 304 configured to transport the liquid material 107 from
the liquid source 106 side of the showerhead device 302 to the
substrate side of the showerhead device 302. It should be
appreciated that a variety of showerhead device 302 arrangements
may be suitable for implementation in context of the present
invention. For instance, the exact number and arrangement of
showerhead device openings 304 may depend on the specific
application in question.
[0075] In some embodiments, one or more showerhead devices 302 may
include a metal showerhead device 302. For example, a showerhead
head device 302 may include, but is not limited to, an aluminum
showerhead device, a brass showerhead device, or a stainless steel
showerhead device. For example, in a single assembly 101 of the
system 100, a liquid material 107 may be transported from the
liquid source 106 to an aluminum showerhead device. The liquid
material 107 may then pass through the openings 304 of the aluminum
showerhead device 302. After passing through the aluminum
showerhead device 302, the diffused liquid material spray 122 may
then flow from the aluminum showerhead device 302 to the surface of
the substrate 114, where the liquid spray 122 may be deposited on
the substrate 114 surface.
[0076] In some embodiments, one or more showerhead devices 302 may
include a plastic showerhead device 302. For example, a showerhead
head device 302 may include, but is not limited to, a polyvinyl
chloride (PVC) showerhead device or a polytetrafluoroethylene
(PTFE) showerhead device. For example, in a single assembly 101 of
the system 100, a liquid material 107 may be transported from the
liquid source 106 to PVC showerhead device. The liquid material 107
may then pass through the openings 304 of the PVC showerhead device
302. After passing through the PVC showerhead device 302, the
diffused liquid material spray 122 may then flow from the PVC
showerhead device 302 to the surface of the substrate 114, where
the liquid spray 122 may be deposited on the substrate 114 surface.
It should be recognized that the preceding description pertaining
to material types suitable for implementation in one or more
showerhead devices 302 of the present invention is not a limitation
but merely an illustration as other showerhead materials may be
more or less appropriate in different contexts (e.g., corrosive
resistance, electrical conductivity and etc.).
[0077] It is further contemplated that the one or more showerhead
devices 302 of the system 100 may be located at various distances
from the surface of the substrate 114. It should be recognized that
different showerhead-substrate distances may be more or less
appropriate in different contexts. For instance, when choosing an
appropriate distance, the specific liquid material 106 implemented,
the flow rate of the liquid material 106, the size of the isolated
application region, and a variety of other factors may be
considered.
[0078] In a further embodiment, the showerhead device 302 may
include a rotatable showerhead device. It should be recognized by
those skilled in the art that utilizing a rotatable showerhead
device provides for more uniform liquid material spray 122
application on the surface of the substrate.
[0079] Referring now to FIGS. 4A and 4B, it is further contemplated
that a horizontal liquid application process may be employed by the
present invention. The horizontal non-contact application system
400 may include an injection element 402 (e.g., an injection bar).
For example, a liquid material 107 may be supplied from a liquid
material source 106 to an inlet of an injection element 402. The
injection element 402 may then apply a portion of the liquid
material 107 by depositing droplets of the liquid material 107 onto
the surface of the substrate 114 via an injection element 402
outlet 403. Further, the horizontal non-contact deposition system
400 may include a horizontal gas curtain element 406 (e.g., gas
curtain bar). For example, an inert gas (e.g., nitrogen or argon)
may be supplied from an inert gas source to an inlet 405 of the
horizontal gas curtain element 406. The gas curtain element 406 may
then act to contain the applied liquid material 106 by directing a
gas flow 408 emanating from a curtain element outlet 407 toward the
edge of the selected region 108 of liquid material deposition. In
addition, the horizontal non-contact deposition system 400 may
include a vacuum element 404 (e.g., a vacuum bar). For example, the
vacuum bar 404 may act to uptake liquid material 106 that flows
from the gas curtain element 406 and the injection element 402
toward the vacuum bar 404.
[0080] Referring now to FIG. 5, a method 500 for combinatorial
non-contact wet processing is described in accordance with the
present disclosure. It is contemplated that the method described
below may be carried out utilizing the system 100 described in the
present disclosure. The method 500 for combinatorial non-contact
wet processing includes providing 502 a liquid material 107. Then,
the method 500 includes transporting a first portion 504 of the
liquid material 107 from a source of the liquid material 106 to a
first reaction cell 102, wherein the first reaction cell 102 is
configured for positioning at a first selected distance from the
surface of a substrate. For example, the first portion of the
liquid material 107 may be transported from the liquid material
source 106 to the first reaction cell 102 via the source-cell
conduit 104. Next, the method 500 includes transporting at least a
second portion 506 of the liquid material 107 from the source of
the liquid material 106 to at least a second reaction cell 102,
wherein the at least a second reaction cell is configured for
positioning at a second selected distance from the surface of a
substrate. Then, the method 500 includes converting the first
portion 508 of the liquid material 107 to a first atomized spray of
liquid particles. For example, a plurality of gas jets 110 disposed
within the interior of a reaction cell 102 may be utilized to
convert the liquid material 107 into a first spray of liquid
material 122. Next, the method 500 includes converting the at least
a second portion 510 of the liquid material 107 to at least a
second atomized spray of liquid particles 122. Then, the method 500
includes containing a portion of the first atomized spray 512 of
liquid particles within a first selected region 108 of the
substrate 114. For example, a vacuum element 127 may be utilized to
contain the first liquid material within a first selected region
108 of the substrate. Next, the method 500 includes containing a
portion of the at least a second atomized spray 514 of liquid
particles within at least a second selected region of the
substrate. Similarly, a vacuum element 127 may be utilized to
contain the second spray of liquid material within a second
selected region 108 of the substrate. Then, the method 500 includes
applying 516 a portion of the first atomized spray of particles
onto the first selected region of the substrate. Next, the method
includes applying a portion of the at least a second atomized spray
of particles onto the at least a second selected region of the
substrate.
[0081] Those having skill in the art will recognize that the state
of the art has progressed to the point where there is little
distinction left between hardware and software implementations of
aspects of systems; the use of hardware or software is generally
(but not always, in that in certain contexts the choice between
hardware and software can become significant) a design choice
representing cost vs. efficiency tradeoffs. Those having skill in
the art will appreciate that there are various vehicles by which
processes and/or systems and/or other technologies described herein
can be effected (e.g., hardware, software, and/or firmware), and
that the preferred vehicle will vary with the context in which the
processes and/or systems and/or other technologies are deployed.
For example, if an implementer determines that speed and accuracy
are paramount, the implementer may opt for a mainly hardware and/or
firmware vehicle; alternatively, if flexibility is paramount, the
implementer may opt for a mainly software implementation; or, yet
again alternatively, the implementer may opt for some combination
of hardware, software, and/or firmware. Hence, there are several
possible vehicles by which the processes and/or devices and/or
other technologies described herein may be effected, none of which
is inherently superior to the other in that any vehicle to be
utilized is a choice dependent upon the context in which the
vehicle will be deployed and the specific concerns (e.g., speed,
flexibility, or predictability) of the implementer, any of which
may vary. Those skilled in the art will recognize that optical
aspects of implementations will typically employ optically-oriented
hardware, software, and or firmware.
[0082] Those skilled in the art will recognize that it is common
within the art to describe devices and/or processes in the fashion
set forth herein, and thereafter use engineering practices to
integrate such described devices and/or processes into data
processing systems. That is, at least a portion of the devices
and/or processes described herein can be integrated into a data
processing system via a reasonable amount of experimentation. Those
having skill in the art will recognize that a typical data
processing system generally includes one or more of a system unit
housing, a video display device, a memory such as volatile and
non-volatile memory, processors such as microprocessors and digital
signal processors, computational entities such as operating
systems, drivers, graphical user interfaces, and applications
programs, one or more interaction devices, such as a touch pad or
screen, and/or control systems including feedback loops and control
motors (e.g., feedback for sensing position and/or velocity;
control motors for moving and/or adjusting components and/or
quantities). A typical data processing system may be implemented
utilizing any suitable commercially available components, such as
those typically found in data computing/communication and/or
network computing/communication systems.
[0083] The herein described subject matter sometimes illustrates
different components contained within, or connected with, different
other components. It is to be understood that such depicted
architectures are merely exemplary, and that in fact many other
architectures can be implemented which achieve the same
functionality. In a conceptual sense, any arrangement of components
to achieve the same functionality is effectively "associated" such
that the desired functionality is achieved. Hence, any two
components herein combined to achieve a particular functionality
can be seen as "associated with" each other such that the desired
functionality is achieved, irrespective of architectures or
intermedial components. Likewise, any two components so associated
can also be viewed as being "operably connected", or "operably
coupled", to each other to achieve the desired functionality, and
any two components capable of being so associated can also be
viewed as being "operably couplable", to each other to achieve the
desired functionality. Specific examples of operably couplable
include but are not limited to physically mateable and/or
physically interacting components and/or wirelessly interactable
and/or wirelessly interacting components and/or logically
interacting and/or logically interactable components.
[0084] While particular aspects of the present subject matter
described herein have been shown and described, it will be apparent
to those skilled in the art that, based upon the teachings herein,
changes and modifications may be made without departing from the
subject matter described herein and its broader aspects and,
therefore, the appended claims are to encompass within their scope
all such changes and modifications as are within the true spirit
and scope of the subject matter described herein.
[0085] Furthermore, it is to be understood that the invention is
defined by the appended claims. It will be understood by those
within the art that, in general, terms used herein, and especially
in the appended claims (e.g., bodies of the appended claims) are
generally intended as "open" terms (e.g., the term "including"
should be interpreted as "including but not limited to," the term
"having" should be interpreted as "having at least," the term
"includes" should be interpreted as "includes but is not limited
to," etc.). It will be further understood by those within the art
that if a specific number of an introduced claim recitation is
intended, such an intent will be explicitly recited in the claim,
and in the absence of such recitation no such intent is present.
For example, as an aid to understanding, the following appended
claims may contain usage of the introductory phrases "at least one"
and "one or more" to introduce claim recitations. However, the use
of such phrases should not be construed to imply that the
introduction of a claim recitation by the indefinite articles "a"
or "an" limits any particular claim containing such introduced
claim recitation to inventions containing only one such recitation,
even when the same claim includes the introductory phrases "one or
more" or "at least one" and indefinite articles such as "a" or "an"
(e.g., "a" and/or "an" should typically be interpreted to mean "at
least one" or "one or more"); the same holds true for the use of
definite articles used to introduce claim recitations. In addition,
even if a specific number of an introduced claim recitation is
explicitly recited, those skilled in the art will recognize that
such recitation should typically be interpreted to mean at least
the recited number (e.g., the bare recitation of "two recitations,"
without other modifiers, typically means at least two recitations,
or two or more recitations). Furthermore, in those instances where
a convention analogous to "at least one of A, B, and C, etc." is
used, in general such a construction is intended in the sense one
having skill in the art would understand the convention (e.g., "a
system having at least one of A, B, and C" would include but not be
limited to systems that have A alone, B alone, C alone, A and B
together, A and C together, B and C together, and/or A, B, and C
together, etc.). In those instances where a convention analogous to
"at least one of A, B, or C, etc." is used, in general such a
construction is intended in the sense one having skill in the art
would understand the convention (e.g., "a system having at least
one of A, B, or C" would include but not be limited to systems that
have A alone, B alone, C alone, A and B together, A and C together,
B and C together, and/or A, B, and C together, etc.). It will be
further understood by those within the art that virtually any
disjunctive word and/or phrase presenting two or more alternative
terms, whether in the description, claims, or drawings, should be
understood to contemplate the possibilities of including one of the
terms, either of the terms, or both terms. For example, the phrase
"A or B" will be understood to include the possibilities of "A" or
"B" or "A and B."
[0086] Although particular embodiments of this invention have been
illustrated, it is apparent that various modifications and
embodiments of the invention may be made by those skilled in the
art without departing from the scope and spirit of the foregoing
disclosure. Accordingly, the scope of the invention should be
limited only by the claims appended hereto.
[0087] It is believed that the present disclosure and many of its
attendant advantages will be understood by the foregoing
description, and it will be apparent that various changes may be
made in the form, construction and arrangement of the components
without departing from the disclosed subject matter or without
sacrificing all of its material advantages. The form described is
merely explanatory, and it is the intention of the following claims
to encompass and include such changes.
* * * * *