U.S. patent application number 13/409593 was filed with the patent office on 2012-06-28 for cooler having ground heated plane for cooling heating electronic component.
Invention is credited to Chih-Hung Cheng, Ken Hsu, Chen-Hsiang Lin, Kuo-Len Lin, Jui-Ho Liu.
Application Number | 20120160458 13/409593 |
Document ID | / |
Family ID | 45000911 |
Filed Date | 2012-06-28 |
United States Patent
Application |
20120160458 |
Kind Code |
A1 |
Lin; Kuo-Len ; et
al. |
June 28, 2012 |
COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC
COMPONENT
Abstract
A method for making heated plane of a cooler to obtain better
flatness and roughness includes a grinder with a grinding plate and
a fixture. Then, the cooler is arranged onto the fixture. Next, the
abrasive is injected into the gap between the grinding plate and
the heated plane, making the fixture press and clamp the cooler in
a way, such that the heated plane of the cooler contacts the
abrasive closely. Finally, the grinding plate is rotated to make at
least one grinding process to the heated plane, making the heated
plane obtain a surface with better roughness and flatness, further
enhancing the contact tightness between the heated plane and a
heating element, and therefore promoting the thermally conductive
efficiency between the cooler and the heating element.
Inventors: |
Lin; Kuo-Len; (New Taipei
City, TW) ; Lin; Chen-Hsiang; (New Taipei City,
TW) ; Liu; Jui-Ho; (New Taipei City, TW) ;
Cheng; Chih-Hung; (New Taipei City, TW) ; Hsu;
Ken; (New Taipei City, TW) |
Family ID: |
45000911 |
Appl. No.: |
13/409593 |
Filed: |
March 1, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12482000 |
Jun 10, 2009 |
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13409593 |
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Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
B24B 37/12 20130101;
F28F 13/182 20130101; B24B 37/04 20130101; F28D 15/0233 20130101;
B24B 57/02 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101; H01L 23/467 20130101; B24B 37/30 20130101; F28D 15/0275
20130101; H01L 2924/0002 20130101; H01L 23/427 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A cooler having ground heated plane for cooling heating
electronic component, mainly including a cooler, which has a heated
plane pressed and clamped to a grinder by a fixture and, after the
heated plane is ground, a roughness on a surface of the heated
plane is under Ra 0.03 .mu.m and a flatness thereof is under 10
.mu.m.
2. The cooler having ground heated plane according to claim 1,
wherein the surface roughness of the heated plane is between Ra
0.03 .mu.m and Ra 0.01 .mu.m.
3. The cooler having ground heated plane according to claim 1,
wherein the flatness of the heated plane is between 0.3 .mu.m and
10 .mu.m.
4. The cooler having ground heated plane according to claim 1,
wherein the cooler includes a flat-plate heat pipe and a plurality
of cooling fins arranged by being passed through by the flat-plate
heat pipe, and the flat-plate heat pipe has a flat evaporation
section, which is the heated plane.
5. The cooler having ground heated plane according to claim 1,
wherein the cooler includes a thermally conductive seat, at least
one heat pipe and a plurality of cooling fins passed through by the
heat pipe, and the thermally conductive seat has a bottom plane
having at least one slot corresponding to a quantity of the heat
pipe, and the heat pipe has a flat evaporation section insect into
the slot and flush with the bottom plane, and the heated plane
includes the bottom plane and the flat evaporation section.
6. The cooler having ground heated plane according to claim 1,
wherein the cooler includes a thermally conductive seat, at least
one heat pipe and a plurality of cooling fins passed through by the
heat pipe, and the thermally conductive seat has a bottom plane
having at least one slot corresponding to a quantity of the heat
pipe, and the heat pipe has a flat evaporation section insect into
the slot and higher than the bottom plane, and the heated plane is
the flat evaporation section.
7. The cooler having ground heated plane according to claim 1,
wherein the cooler includes a thermally conductive seat, at least
two heat pipes and a plurality of cooling fins passed through by
the heat pipes, and the thermally conductive seat has a bottom
plane arranged an accommodating groove, and each heat pipes has a
flat evaporation section, and the flat evaporation sections are
arranged in parallel, flush with each other and flush with the
bottom plane by being pressed and clamped in the accommodating
groove, and the heated plane includes the bottom plane and the flat
evaporation sections.
8. The cooler having ground heated plane according to claim 1,
wherein the cooler includes a thermally conductive seat, at least
two heat pipes and a plurality of cooling fins passed through by
the heat pipes, and the thermally conductive seat has a bottom
plane arranged an accommodating groove, and each heat pipes has a
flat evaporation section, and the flat evaporation sections are
arranged in parallel, flush with each other and higher than the
bottom plane by being pressed and clamped in the accommodating
groove, and the heated plane is the flat evaporation sections.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional application of U.S.
application Ser. No. 12/482,000 filed on Jun. 10, 2009. The entire
disclosure is incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention in general relates to a cooler, in
particular, to a cooler, a heated plane of which is ground, and to
a grinding method thereof.
[0004] 2. Description of Prior Art
[0005] Following progress of technology, computer hardware is
developed toward the directions of high speed and high frequency
for increasing its execution efficiency, but its power consumption
is also increased relatively. Compared to the prior arts, the heat
generated from today's electronic component is much more
significant than the past's. If the accumulative heat is not
removed in time, the electronic component will be overheated to
lower down the operation efficiency, even cause damage. So, most
electronic component needs cooling device to control the working
temperature and keep it operated under normal condition.
[0006] When operated, a cooling device, including vapor chamber or
heat pipe, is first combined to a thermally conductive seat and is
arranged a plurality of cooling fins thereon. Next, one side of the
thermally conductive seat is contacted closely with the heating
electronic component. Thereby, the heat generated from the heating
electronic component is thermally conducted. However, since of the
limitation of many factors, such as cooling space and power
consumption, how to promote cooling efficiency as high as we can
becomes an issue intended to be addressed urgently by industry.
[0007] Nonetheless, the more flat a heated face of a cooler is, the
more compact a thermal contact between the heated face and the
heating electronic component will be. In other words, a good
flatness of the heated face will promote the thermally conductive
efficiency of the cooler. In addition, the heated face of a general
cooler is usually configured as a matte, which looks flat and
smooth after machined. However, in practice, the roughness and
flatness on the surface of the heated face is still poor, making
the heated face and the heating component unable to be contacted
closely, thereby, limiting the thermal conduction between the
heated face and the heating electronic component. Therefore, if the
roughness and the flatness on the heated face can be further
improved, the contact tightness between the heated face and the
heating electronic component will be thereby increased, so is the
thermally conductive effect.
[0008] Accordingly, after a substantially devoted study, in
cooperation with the application of relative academic principles,
the inventor has finally proposed the present invention that is
designed reasonably to possess the capability to improve the
drawbacks of the prior art significantly.
SUMMARY OF THE INVENTION
[0009] The invention is mainly to provide a cooler with ground
heated plane and a grinding method and apparatus thereof. By
grinding the heated plane of the cooler, the roughness and flatness
on the surface of the heated plane is improved. Furthermore, the
thermally conductive effect is enhanced due to a better contact
relative to the heating electronic component.
[0010] Secondly, the invention is to provide a method for grinding
the heated plane of a cooler, the method including the following
steps: (a) providing a grinder and a fixture, which have a grinding
plate; (b) providing a cooler, which has a heated plane, and
arranging the cooler to the fixture; (c) injecting an abrasive into
the gap between the grinding plate and the heated plane; (d) making
the fixture press and clamp the cooler, thereby, the heated plane
being contacted closely with the abrasive; and (e) rotating the
grinding plate, and undergoing at least one grinding process to the
heated plane.
[0011] Thirdly, the invention is to provide an apparatus for
grinding the heated plane of a cooler, in which a heated plane of a
cooler is ground. The apparatus includes a grinder and a fixture,
in which the grinder has a grinding plate and an abrasive supply
barrel that is arranged above the grinding plate for supplying
abrasive into the gap between the heated plane and the grinding
plate. In the meantime, the fixture is combined to the grinder and
has at least one pressure plate for arranging the cooler. Thereby,
the pressure plate presses and clamps the cooler, making the heated
plane of the cooler contact closely to the abrasive.
[0012] Fourthly, the invention is to provide a cooler having ground
heated plane for cooling a heating electronic component, mainly
including a cooler, which has a heated plane that is undergone a
grinding process by being pressed and clamped by a fixture. After
being ground, the roughness on the surface of the heated plane is
under Ra 0.03 .mu.m and the flatness is under 10 .mu.m.
[0013] Compared with the prior arts, the invention is to arrange a
fixture to a grinder. The fixture presses and clamps a cooler via a
point contact manner, whereby the heated plane of the cooler can
possess a better flatness and surface roughness after being ground.
Therefore, the contact tightness between the heated plane and the
heating electronic component is increased, further generating a
better effect of thermal conduction and enhancing the
practicability of the invention.
BRIEF DESCRIPTION OF DRAWING
[0014] The features of the invention believed to be novel are set
forth with particularity in the appended claims. The invention
itself, however, may be best understood by reference to the
following detailed description of the invention, which describes a
number of embodiments of the invention, taken in conjunction with
the accompanying drawings, in which:
[0015] FIG. 1 is an assembled illustration of a grinder and a
fixture according to the present invention;
[0016] FIG. 2 is an illustration of a cooler pressed and clamped by
a fixture according to the present invention;
[0017] FIG. 3 is a cross-sectional view of a cooler pressed and
clamped by a fixture according to the present invention;
[0018] FIG. 4 is a using illustration showing a cooler under a
grinding process according to the present invention;
[0019] FIG. 5 is a lateral view of the invention when undergoing a
grinding process;
[0020] FIG. 6 is an illustration showing a grinding action of the
invention;
[0021] FIG. 7 is a locally enlarging illustration of the invention
when undergoing a grinding process;
[0022] FIG. 8 is a flowchart diagram showing a grinding method of
the invention, in which a heated plane of a cooler is ground;
[0023] FIG. 9 shows a cooler with ground heated plane according to
an embodiment of the invention;
[0024] FIG. 10 shows a cooler with ground heated plane according to
another embodiment of the invention; and
[0025] FIG. 11 shows a cooler with ground heated plane according to
a further embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0026] In cooperation with attached drawings, the technical
contents and detailed description of the present invention are
described thereinafter according to a number of preferable
embodiments, not used to limit its executing scope. Any equivalent
variation and modification made according to appended claims is all
covered by the claims claimed by the present invention.
[0027] Please refer to FIG. 1, which is an assembled illustration
of a grinder and a fixture according to the present invention. The
invention is to provide a method for grinding the heated plane of a
cooler, in which a grinder 10 having grinding plate 11 and fixing
frame 15 is provided. The grinding plate 11 is actuated by a motor
12 to rotate. The fixing frame 15 is fixed onto the grinder 10 and
is arranged an abrasive supply barrel 13 thereon. The abrasive
supply barrel 13 is filled with abrasive and has a nozzle 131 to
inject the abrasive onto the grinding plate 11.
[0028] Above the grinding plate 11, the grinder 10 is additionally
connected a fixture 20. At least one elastic element 14 (e.g.,
spring, etc.) is arranged between the fixture 20 and the grinder
10. The elastic element 14 keeps a gap 100 between the fixture 20
and the grinder 11, such that the fixture 20 can be displaced
upwardly and downwardly in an elastic way. In addition, a driving
device 21, such as hydraulic cylinder or pneumatic cylinder, is
arranged on the fixing frame 15. The driving device 21 is connected
by abutting against the fixture. By elevating or lowering the
driving device 21, the fixture 20 is moved toward or far away the
grinding plate 11.
[0029] Please refer to FIG. 2 and FIG. 3, which are an illustration
and a cross-sectional view of a cooler that is pressed and clamped
by a fixture according to the present invention. The fixture 20 can
corresponds to the grinding plate 11 and is shown as a disk
configuration. The circumference of the fixture 20 is divided
equally to project out a plurality of pressure plates 22, each of
which is arranged a cooler 30. In addition, the bottom portion of
the pressure plate 22 is arranged a pointed bulge 221 that is
abutted against the center of the cooler 30, thereby, the fixture
20 pressing and clamping the cooler 30 via a point contact
manner.
[0030] In a preferable embodiment, the cooler 30 includes a
thermally conductive seat 31, at least one heat pipe 32 and a
plurality of cooling fins 33. The heat pipe 32 has a flat
evaporation section 321 and a condensation section 322. The
thermally conductive seat 31 is arranged at least one slot 310,
into which the flat evaporation section 321 is inset. In the
meantime, the plural cooling fins 33 are arranged by being passed
through by the condensation section 322 of the heat pipe 32. In
this case, the flat evaporation section 321 is formed as a heated
plane 34 provided for contacting the heat source. When the top
portion of the thermally conductive seat 31 is pressed and clamped
by the pointed bulge 221 of the pressure plate 22, the heated plane
34 of the cooler 30 is abutted against the grinding plate 11 and is
arranged correspondingly.
[0031] Please refer to FIG. 4 through FIG. 7, separately showing a
using illustration of a cooler under a grinding process according
to the present invention, a lateral view of the invention when
undergoing a grinding process, an illustration of a grinding action
of the invention, and a locally enlarging illustration of the
invention when undergoing a grinding process. Firstly, a cooler 30
is separately arranged under each pressure plate 22 of the fixture
20. Secondly, an abrasive 132 is injected into the gap 100 between
the grinder 11 and the heated plane 34. The abrasive 132 includes
grinding liquid 1321 and grinding particle 1322, as shown in FIG.
7. Then, the driving device 21 is actuated, making the fixture 20
lowered down and the pressure plate 22 separately press and clamp
the top portion of each thermally conductive seat 31. In so doing,
the pointed bulge 221 presses and clamps at the center of the
thermally conductive seat 31, making each heated plane 34 touch the
abrasive 132 and closely contact the grinding plate 11. Next, the
motor 12 is actuated to bring along the grinding plate 11 to make a
circular rotation. By centrifugal force and pressing (clamping)
operation, the abrasive 132 can uniformly grind the heated plane
34. Thereby, the flatness of the heated plane 34 is improved to
obtain a best value of roughness on the surface. After the grinding
is finished, the driving device 21 is actuated again and lifted up.
In so doing, the fixture 20 is rid of press and clamp and lifted up
due to the elastically recovering force of the elastic element 14.
Finally, the heated plane 34 of the cooler 30 gets rid of the
relative contact with the grinding plate 11.
[0032] Subsequently, the coolers 30 can be moved to another
grinding machine to undergo next grinding. Or, a series of grinding
can be made in a grinder by separately injecting different
abrasives 132 with different particle sizes. For example, a
grinding process can first be undergone by injecting an abrasive
132 with larger particles. After the first grinding process,
another abrasive 132 with finer particle is then injected to
undergo a second grinding process. Following each grinding process,
a finer abrasive 132 is injected until the required accuracy of the
heated plane 34 is reached. In an embodiment, the value of the
surface roughness is under Ra 0.03 .mu.m, preferably, between Ra
0.03 .mu.m and Ra 0.01 .mu.m and the flatness is between 0.3 .mu.m
and 10 .mu.m.
[0033] Please refer to FIG. 8, which is a flowchart diagram showing
a grinding method of the invention, in which a heated plane of a
cooler is ground. As shown in this diagram, a grinder 10 and a
fixture 20, with a grinding plate 11, is first provided (step 61);
next, a cooler 30 with a heated plane 34 is further provided (step
62); then, an abrasive 132 is injected into the gap between the
grinding plate 11 and the heated plane 34 (step 63); during a
series of grindings, different abrasives 132 with different
particle sizes can be injected and, in the meantime, the fixture 20
presses and clamps the cooler 30 via a point contact manner, for
example, another side of the heated plane 34 being pressed and
clamped, making the heated plane 34 contact closely to the grinding
plate 11 to touch the abrasive 132 (step 64); finally, the grinding
plate 11 is rotated, making the heated plane 34 undergone at least
one grinding process (step 65).
[0034] Please refer to FIG. 9 showing a cooler with ground heated
plane according to an embodiment of the invention. In this
embodiment, the thermally conductive seat 31 has a bottom plane 311
that is arranged at least one slot 310, into which the flat
evaporation section 321 of the heat pipe 32 is inset. When the
surface of the flat evaporation sections 321 is higher than the
bottom plane 311 of the thermally conductive seat 31, the flat
evaporation sections 321 are the heated plane 34. Nonetheless, when
the surface of the flat evaporation sections 321 is flush with the
bottom plane 311 of the thermally conductive seat 31, the heated
plane 34 then includes the flat evaporation sections 321 and the
bottom plane 311. After the heated plane 34 is ground, a delicate
plane like mirror is obtained, which is provided for closely
contacting a heating electronic component to dissipate the heat
thereof.
[0035] Please refer to FIG. 10 showing a cooler with ground heated
plane according to another embodiment of the invention. This
embodiment is substantially same as the first embodiment. The
differences are that the bottom plane 311' of the thermally
conductive seat 31' is only arranged an accommodating groove 310';
the cooler 30' has three heat pipes 32', each of which has a flat
evaporation section 321' passing through a plurality of cooling
fins 33'; the three heat pipes 32' arranged in parallel and pressed
(clamped) in the accommodating groove 310' are flush with each
other to form a flat evaporation section 321'; similarly, when the
surface of the flat evaporation sections 321' is higher than the
bottom plane 311' of the thermally conductive seat 31', the flat
evaporation sections 321' are the heated plane 34'; on the other
hand, when the surface of the flat evaporation sections 321' is
flush with the bottom plane 311' of the thermally conductive seat
31', the heated plane 34' then includes the flat evaporation
sections 321' and the bottom plane 311'.
[0036] Please refer to FIG. 11 showing a cooler with ground heated
plane according to a further embodiment of the invention. In this
case, the cooler 40 is a flat-plate heat pipe 41 that has a flat
evaporation section 411 and is arranged a plurality of cooling fins
43. The flat evaporation section 411 is the heated plane 42 that is
ground to make its surface possess better surface roughness and
flatness, thereby, the heated plane 42 contacting the heating
electronic component further closely to increase its thermally
conductive effect.
[0037] Accordingly, through the constitution of aforementioned
assemblies, a cooler with ground heated plane according to the
invention is thus obtained.
[0038] Summarizing aforementioned description, the ground heated
plane according to the invention is an indispensably design for a
cooler indeed, which may positively reach the expected usage
objective for solving the drawbacks of the prior arts, and which
extremely possesses the innovation and progressiveness to
completely fulfill the applying merits of new type patent,
according to which the invention is thereby applied. Please examine
the application carefully and grant it as a formal patent for
protecting the rights of the inventor.
[0039] However, the aforementioned description is only a number of
preferable embodiments according to the present invention, not used
to limit the patent scope of the invention, so equivalently
structural variation made to the contents of the present invention,
for example, description and drawings, is all covered by the claims
claimed thereinafter.
* * * * *