U.S. patent application number 13/284576 was filed with the patent office on 2012-06-28 for cooling apparatus and electronic apparatus.
This patent application is currently assigned to FUJITSU LIMITED. Invention is credited to Shinji AOKI.
Application Number | 20120160456 13/284576 |
Document ID | / |
Family ID | 44925367 |
Filed Date | 2012-06-28 |
United States Patent
Application |
20120160456 |
Kind Code |
A1 |
AOKI; Shinji |
June 28, 2012 |
COOLING APPARATUS AND ELECTRONIC APPARATUS
Abstract
The cooling apparatus includes a heat receiving portion to
receive heat from the heating element, a radiator, a first heat
pipe having one end portion to receive heat from the heat receiving
portion and anther end portion inserted in the radiator, and a
second heat pipe to receive the heat from the heat receiving
portion via the first heat pipe, the second heat pipe including one
end portion arranged on the first pipe and another end portion
arranged around the radiator, wherein the second heat pipe overlaps
with a region of the first heat pipe extending from the heat
receiving portion to the radiator in a plan view of the cooling
apparatus.
Inventors: |
AOKI; Shinji; (Kawasaki,
JP) |
Assignee: |
FUJITSU LIMITED
Kawasaki-shi
JP
|
Family ID: |
44925367 |
Appl. No.: |
13/284576 |
Filed: |
October 28, 2011 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/4006 20130101; F28D 15/0275 20130101; F28F 19/02 20130101;
H01L 2924/0002 20130101; G06F 1/203 20130101; F28D 15/0233
20130101; H01L 2924/00 20130101; F28F 13/18 20130101; G06F 1/20
20130101; H01L 23/427 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 28, 2010 |
JP |
2010-293111 |
Claims
1. A cooling apparatus for cooling a heating element accommodated
in an electronic apparatus, the cooling apparatus comprising: a
heat receiving portion to receive heat from the heating element; a
radiator; a first heat pipe having one end portion to receive heat
from the heat receiving portion and anther end portion inserted in
the radiator; and at least one second heat pipe to receive the heat
from the heat receiving portion via the first heat pipe, the second
heat pipe including one end portion arranged on the first pipe and
another end portion arranged around the radiator, wherein the
second heat pipe overlaps with a region of the first heat pipe
extending from the heat receiving portion to the radiator in a plan
view of the cooling apparatus.
2. The cooling apparatus according to claim 1, further comprising a
second heat receiving portion different from the heat receiving
portion, wherein heat from the second heat receiving portion is
received at the one end portion of the first heat pipe.
3. The cooling apparatus according to claim 1, further comprising a
second heat receiving portion different from the heat receiving
portion, wherein heat from the second heat receiving portion is
received at the one end portion of the first heat pipe, and wherein
the second heat pipe overlaps with a region of the first heat pipe
extending from the second heat receiving portion to the radiator in
a plan view of the cooling apparatus.
4. The cooling apparatus according to claim 1, further comprising a
second heat receiving portion different from the heat receiving
portion, wherein the second heat pipe includes one end of a
radiator side and another end of a heat receiving portion side, and
wherein the anther end receives heat from the second heat receiving
portion via the first heat pipe.
5. The cooling apparatus according to claim 4, further comprising a
third heat receiving portion arranged between the heat receiving
portion and the radiator, wherein the first heat pipe receives heat
from the third heat receiving portion, and wherein the second heat
pipe receives the heat from the third heat receiving portion via
the first heat pipe.
6. The cooling apparatus according to claim 1, wherein two or more
second heat pipes overlapping each other are arranged on the first
heat pipe.
7. The cooling apparatus according to claim 1, further comprising:
a second radiator different from the radiator; and a third heat
pipe to receive the heat from the heat receiving portion via the
first heat pipe and the second heat pipe, wherein the third heat
pipe includes one end portion overlapping the second heat pipe and
another end portion inserted in the second radiator.
8. The cooling apparatus according to claim 1, wherein the first
heat pipe is formed in a flat strip shape.
9. The cooling apparatus according to claim 1, wherein the second
heat pipe is formed in a flat strip shape.
10. An electronic apparatus, comprising: a housing; a heating
element accommodating the housing; and a cooling apparatus to cool
the heating element, the cooling apparatus including: a heat
receiving portion to receive heat from the heating element; a
radiator; a first heat pipe having one end portion to receive heat
from the heat receiving portion and anther end portion inserted in
the radiator; at least one second heat pipe to receive the heat
from the heat receiving portion via the first heat pipe, the second
heat pipe including one end portion arranged on the first pipe and
another end portion arranged around the radiator, wherein the
second heat pipe overlaps with a region of the first heat pipe
extending from the heat receiving portion to the radiator in a plan
view of the cooling apparatus; and a fan to generate airflow which
flows inside and around the radiator, and flows out from an air
exhaust formed in the housing.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is based upon and claims the benefit of
priority of the prior Japanese Patent Application No. 2010-293111,
filed on Dec. 28, 2010, the entire contents of which are
incorporated herein by reference.
FIELD
[0002] This invention relates to a cooling apparatus (cooling
device), and an electronic apparatus having a cooling
apparatus.
BACKGROUND
[0003] Recently, in the field of electronic apparatus such as a
personal computer (hereafter, abbreviated as PC), sophistication of
components constituting the electronic apparatus such as CPU
(Central Processing Unit), VGA (Video Graphics Accelerator) or
other graphic chip, HDD (Hard Disk Drive) and VRAM (Video Random
Access Memory) has created a tendency to increase an amount of heat
generated in the electronic apparatus.
[0004] In particular, portable so-called laptop PCs and tablet PCs
have been made smaller, thinner, and lighter, so that the
convenience is improved especially in terms of portability. As a
result, the density of heat generating components mounted on a
substrate or the like is increased more and more. In order to deal
with such increase of heat density, various heat sinks serving as
cooling apparatuses have been proposed to improve the efficiency of
heat dissipation (see, for example, Japanese Patent Application
Laid-open No. 2004-150719).
SUMMARY
[0005] An aspect of the invention relates to a cooling apparatus
for cooling a heating element accommodated in electronic apparatus.
The cooling apparatus includes a heat receiving portion to receive
heat from the heating element, a radiator, a first heat pipe having
one end portion to receive heat from the heat receiving portion and
anther end portion inserted in the radiator, and a second heat pipe
to receive the heat from the heat receiving portion via the first
heat pipe, the second heat pipe including one end portion arranged
on the first pipe and another end portion arranged around the
radiator, wherein the second heat pipe overlaps with a region of
the first heat pipe extending from the heat receiving portion to
the radiator in a plan view of the cooling apparatus.
[0006] The object and advantages of the invention will be realized
and attained by means of the elements and combinations particularly
pointed out in the claims.
[0007] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory and are not restrictive of the invention, as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 is a perspective view illustrating by way of example
a cooling apparatus according to a first embodiment;
[0009] FIG. 2 is a perspective view illustrating by way of example
another cooling apparatus according to the first embodiment;
[0010] FIG. 3 is a schematic cross-sectional view obtained by
cutting the cooling apparatus illustrated in FIG. 2 along the A-A
line;
[0011] FIG. 4 is a perspective view of the cooling apparatus
illustrated in FIG. 2, as viewed from the outside of the curve of a
heat pipe;
[0012] FIG. 5 is a schematic cross-sectional view obtained by
cutting the cooling apparatus illustrated in FIG. 2 along the B-B
line;
[0013] FIG. 6 is a perspective view illustrating a modification
example of the cooling apparatus illustrated in FIG. 1;
[0014] FIG. 7 is a perspective view illustrating another
modification example of the cooling apparatus illustrated in FIG.
1;
[0015] FIG. 8 is a perspective view illustrating by way of example
a cooling apparatus according to a second embodiment;
[0016] FIG. 9 is a perspective view illustrating, by way of
example, another cooling apparatus according to the second
embodiment; and
[0017] FIG. 10 is a perspective view illustrating a modification
example of a cooling apparatus according to a third embodiment.
[0018] FIG. 11 is a perspective view illustrating a modification
example of the cooling apparatus according to the third
embodiment;
[0019] FIG. 12 is a perspective view illustrating by way of example
a cooling apparatus according to a fourth embodiment of the
invention;
[0020] FIG. 13 is an overall perspective view of electronic
apparatus;
[0021] FIG. 14 is an exploded view of the electronic apparatus as
viewed from above;
[0022] FIG. 15 is an exploded view of the electronic apparatus;
[0023] FIG. 16 is an exploded view of the electronic apparatus as
view from below;
[0024] FIG. 17A and FIG. 17B are diagrams for explaining a fan
mechanism and a cooling apparatus mounted in electronic apparatus;
and
[0025] FIG. 18 is a schematic perspective view illustrating, as a
comparison example, a cooling apparatus employing a forced air
cooling system.
DESCRIPTION OF EMBODIMENTS
[0026] Referring to the drawings, exemplary preferred embodiments
of the invention will be described. However, configurations of the
embodiments described below are provided by way of example only,
and the invention is not limited to constructions or configurations
of these embodiments. Before describing the embodiments of the
invention, a cooling apparatus as a comparison example will be
described.
Comparison Example
[0027] FIG. 18 is a schematic perspective view illustrating, as a
comparison example, a cooling apparatus employing a small-sized fan
(not illustrated). This cooling apparatus corresponds to a forced
air cooling system. A cooling apparatus 20 illustrated in FIG. 18
is configured to cool two heating elements by transporting heat
generated by these heating elements to a radiator which dissipates
the heat. The cooling apparatus 20 is composed of bases 23 and 25
each having a heat receiving portion, heat pipes 21 and 22, and a
radiator 24, and these components are thermally connected. Heat
from the heating elements is transported to the heat pipes 21 and
22 via the heat receiving portions 23 and 25 provided in the bases.
The heat conducted to the heat receiving portion of the base 23 is
further conducted to one end of the heat pipe 21 which is bent, and
is transported to the radiator 24 into which the other end of the
heat pipe 21 is inserted. The heat transferred to the heat
receiving portion of the base 25 is transferred to one end of the
heat pipe 22 which is bent, and transported to the radiator 24 into
which the other end of the heat pipe 22 is inserted. The radiator
24 has a plurality of heat dissipation fins 24a thermally connected
to the heat pipes 21 and 22. The heat dissipation fins 24a are
arranged in a row at predetermined intervals according to an amount
of heat to be dissipated. The radiator 24 dissipates the heat
transported from the heat generating components through the heat
pipes 21 and 22 by receiving forced cooling air from a small-sized
fan (not illustrated).
[0028] However, the cooling apparatus 20 illustrated in FIG. 18,
which employs a configuration in which the entire of the heat pipes
21 and 22 are arranged side by side in a planar direction, occupies
a significant area in the planar direction within the electronic
apparatus. Particularly, the cooling apparatus 20 employs a
configuration in which the other ends of the heat pipes 21 and 22
are arranged in the inside of the radiator (heat dissipation fins)
24 such that they lie side by side in a planar direction.
Therefore, the radiator 24 becomes greater in size than a radiator
configured such that a single heat pipe is inserted therein, which
hinders effective use of the limited space available within the
electronic apparatus. Furthermore, the insertion of the two heat
pipes 21 and 22 into the radiator 24 causes a problem that the heat
pipe 21 cannot receive sufficient air from the fan (not
illustrated), resulting in impediment to proper heat
dissipation.
[0029] As described above, the radiator 24 is prepared as a
different type of radiator from a radiator in which a single pipe
is inserted. However, it will be desirable if a common radiator can
be used regardless of how many heat pipes are inserted therein,
because cost reduction may be realized by decreasing the number of
radiators to be managed. Further, if the size of the radiator
remains unchanged regardless of the number of heat pipes, it will
contribute to improve the degree of freedom in layout of various
parts and components in electronic apparatus.
[0030] <<Cooling Apparatus>>
First Embodiment
[0031] FIG. 1 is a perspective view illustrating by way of example
a cooling apparatus 10 according to a first embodiment. The cooling
apparatus 10 illustrated in FIG. 1 is a cooling apparatus for
cooling a heat generating component (also referred to as "heating
element") such as CPU or other electronic circuit chip mounted on a
motherboard, a substrate or the like provided in electronic
apparatus 30 (FIG. 13). As described later, the cooling apparatus
10 illustrated here is of a basic form to be combined with other
cooling components (e.g. heat pipes).
[0032] As illustrated in FIG. 1 by way of example, the cooling
apparatus 10 has a base 3 having a heat receiving portion 3a, a
heat pipe 1, and a radiator (heat sink) 4. The base 3, the heat
pipe 1, and the radiator 4 are formed integrally. The heat pipe 1
is a flat strip-shaped heat pipe for transporting heat conducted
from the heat generating component. The heat pipe 1 is bent in a
substantially L-shape. One end of the heat pipe 1 is joined to the
heat receiving portion 3a of the base 3 by soldering, for example,
and is thermally connected to the heat receiving portion 3a. The
heat receiving portion 3a is thermally connected to a heat
generating component (not illustrated, also referred to as "heating
element") which is arranged on the lower side of the heat receiving
portion 3a as viewed in FIG. 1.
[0033] The other end of the heat pipe 1 is inserted in the radiator
4 for heat dissipation and attached thereto to be integral with the
radiator 4, whereby the heat transmitted from the heating element
to the heat receiving portion 3a is transported to the radiator 4
through the heat pipe 1. The radiator 4 has a plurality of heat
dissipation fins 41 and each of the heat dissipation fins 41 is
orthogonally in contact with the planes of the heat pipe 1 (the
upper and lower flat surfaces of the heat pipe as viewed in FIG.
1).
[0034] The base 3 is a plate-like metallic member, and serves as a
base plate to fix the heat pipe 1 and radiator 4 formed integrally
with the base 3 inside the housing of the electronic apparatus. The
base 3 is provided with a plurality of (three in FIG. 1) through
holes for receiving support members 11 therein. The support members
11 are fixed by means of these through holes. Each of the support
members 11 functions as a projection having a spring and projecting
from the front surface (upper surface in FIG. 1) of the base 3 and
a projection projecting from the rear surface (lower surface in
FIG. 1) (see FIG. 4). Each of the support member 11 has a through
hole passing through the front- and rear-side projections. A screw
is inserted through the through hole so that the cooling apparatus
10 is fixed to the electronic apparatus by means of the screw. The
base 3 has the heat receiving portion 3a, which is arranged to face
the heating element within the housing of the electronic apparatus.
This allows the heat from the heating element to be transferred to
the heat receiving portion.
[0035] The heat receiving portion 3a is a rectangular plate-shaped
metallic member, and is formed integrally with the base 3. The heat
receiving portion 3a conducts heat from the heat generating
component. The base 3 has a substantially rectangular cutout
portion 3b matching the shape of the heat receiving portion 3a, and
the heat receiving portion 3a is received in the cutout portion 3b.
One surface (the lower surface as viewed in FIG. 1) of the heat
receiving portion 3a is arranged to face the heat generating
component so that heat from the heat generating component is
received by the heat receiving portion 3a. The other surface (the
upper surface in FIG. 1) of the heat receiving portion 3a is joined
to one end 1a of the heat pipe 1 by soldering. The heat receiving
portion 3a and the heat pipe 1 may be joined together by other
joining methods such as bonding with heat-conductive tape or
grease, and mechanical fastening such as caulking. The heat pipe 1
receives heat from the heat generating component at its one end 1a
via the heat receiving portion 3a, and transports the heat to the
other end 1b of the heat pipe 1. The heat transported to the other
end 1b of the heat pipe 1 is diffused within the radiator 4, and is
diffused by receiving air from a fan mechanism 39 arranged in front
of the radiator 4 (FIG. 14). The heat receiving portion 3a and the
base 3 may be formed integrally as a single component. In this
case, the base 3 and the heat pipe 1 are joined together by
soldering or the like.
[0036] The radiator 4 is a heat sink having a substantially
rectangular parallelepiped shape, and has a plurality of heat
dissipation fins 41 and an anti-air-leak sheet 42. The heat
dissipation fins 41 are arranged at predetermined intervals along a
longitudinal direction of the radiator 4 (along the direction of
the Y-axis in FIG. 1). The plurality of heat dissipation fins 41
are arranged orthogonally to the anti-air-leak sheet 42, and one of
the sides of the radiator 4 in the longitudinal direction forms an
opening 41c for introducing air from the fan. This means that the
radiator 4 is opened at the other side thereof and at the lower
surface as viewed in FIG. 1 (the opposite face to the surface where
the anti-air-leak sheet 42 is provided). A fan mechanism 39 (FIG.
14) is arranged on the opening 41c side and sends forced cooling
air toward the opening 41c. The airflow generated by the fan
mechanism 39 passes between the heat dissipation fins 41 arranged
in a row and through the periphery of the radiator 4 toward the
other opened side of the radiator 4 (in the direction of the
X-axis). The heat from the heat generating component that has been
transported through the heat pipe 1 is dissipated by the airflow
generated by the fan mechanism via the thermally connected heat
dissipation fins 41. The heat dissipation fins 41 may be formed by
plates of a metal having a high heat conductivity such as aluminum
or copper, but the material of the heat dissipation fins 41 is not
limited particularly.
[0037] The anti-air-leak sheet 42 improves the cooling efficiency
by preventing the air that is supplied from the fan and passes
through the heat dissipation fins 41 from leaking out of the heat
dissipation fins 41. The anti-air-leak sheet 42 is bonded on the
heat dissipation fins 41. The anti-air-leak sheet 42 has a flat
portion 42a extending in a longitudinal direction (the Y-axis
direction), and a slope portion 42b inclined in a tapered shape and
connected to the flat portion 42a. The slope portion 42b is formed
to be located outside the curved end 1b of the heat pipe 1 inserted
into the radiator 4, and has a stepped structure having a height in
the direction of the Z axis. The slope portion 42b is formed to be
located on the side (on the side to which the air (see arrows in
FIG. 5) from the afore-mentioned fan mechanism passes through) of
the radiator 4 which is opened facing the fan mechanism.
[0038] As illustrated in FIG. 1, the slope portion 42b is inclined
upward from the flat portion 42a in the direction of the Z axis.
The anti-air-leak sheet 42 may be bonded also to the side of the
radiator 4 where the opening 41c is formed, such that the opening
is covered with the anti-air-leak sheet 42. In order to increase
the heat capacity, the anti-air-leak sheet 42 may be formed of a
metallic plate and joined to the heat dissipation fins 41. Further,
instead of using the anti-air-leak sheet 42, an upper portion
and/or a lower portion of each of the heat dissipation fins 41
illustrated in FIG. 5 may be bent in the direction along which the
heat dissipation fins 41 are arranged such that the cross section
of each fin assumes an L-shape or U-shape as viewed from the fan
mechanism side. A similar air leakage preventing function to that
of the anti-air-leak sheet 42 can be realized in this manner.
[0039] FIG. 2 is a perspective view illustrating by way of example
a cooling apparatus 10a having a basic configuration that is the
same as that of the cooling apparatus 10. Whereas the cooling
apparatus 10 is for cooling a single heat generating component
(heating element), the cooling apparatus 10a is for cooling a
plurality of heat generating components mounted on a motherboard or
the like provided in the electronic apparatus 30. These heat
generating components include, for example, electronic components
or electronic chips, such as a central processing unit (CPU) and a
video graphics accelerator (VGA). However, the heat generating
components are not limited to CPU and VGA.
[0040] The cooling apparatus 10a illustrated by way of example in
FIG. 2 has a base 3 as a first base, a base 5 as a second base, a
heat pipe 1 as a first heat pipe, a heat pipe 6 as a second heat
pipe, and a radiator 4. The heat pipe 1 and the radiator 4 used in
the cooling apparatus 10a are common parts with the cooling
apparatus 10 illustrated in FIG. 1. Thus, the cooling apparatus 10a
is formed by adding, to the basic configuration of the cooling
apparatus 10, the base 5 having a heat receiving portion 5a and the
heat pipe 6.
[0041] In FIG. 2, the heat receiving portion 3a of the base 3
transfers heat from a first heating element (e.g. CPU) to the heat
pipe 1. The base 5 is formed integrally with the base 3 such that
it is arranged on the same plane as the base 3. The base 5 has a
heat receiving portion 5a for receiving heat from a second heating
element (e.g. VGA chip) that is different from the first heating
element. The heat receiving portion 5a is connected by soldering to
an intermediate portion 1c between the one end 1a and the other end
1b of the heat pipe 1. Thus, heat from the second heating element
covered with the heat receiving portion 5a is transferred to the
heat pipe 1 via the heat receiving portion 5a. Although the base 5
in the example illustrated in FIG. 2 is a metallic component formed
integrally with the base 3, the base 5 may be formed separately
from the base 3. The base 5 has two cutout portions 52a each having
a substantially rectangular shape matching the shape of the heat
receiving portion 5a.
[0042] The base 5, having fastening holes for support members, is
mounted on the electronic apparatus 30 by means of the support
members 11 inserted through these fastening holes. The heat
receiving portion 5a and the base 5 may be formed integrally as a
single component. In this case, the base 5 and the heat pipe 1 are
joined to each other by soldering or the like.
[0043] The heat pipe 6 is a planar cooling component for
transporting heat conducted from the second heat generating
component. One end 6a of the heat pipe 6 is laid on top of the heat
receiving portion 5a with the heat pipe 1 interposed therebetween
and thus joined by soldering to the heat pipe 1. The joining
between the heat pipe 6 and the heat pipe 1 may be performed by any
other joining method such as bonding with heat-conductive tape or
grease, or mechanical fastening such as caulking. The heat pipe 6
is shaped into a substantially L-shape having the same curvature as
the heat pipe 1. The other end 6b of the heat pipe 6 is placed on
the anti-air-leak sheet 42 of the radiator 4. However, the other
end 6b may be bonded to the anti-air-leak sheet 42, or may be
separated from the anti-air-leak sheet 42. Further, the other end
6b may be arranged between the anti-air-leak sheet 42 and the heat
dissipation fins 41 and bonded to the heat dissipation fins 41. In
this case, the anti-air-leak sheet 42 assumes a configuration in
which the anti-air-leak sheet 42 covers the other end 6b of the
heat pipe 6 and is bonded to the heat dissipation fins 41.
[0044] The heat pipe 6 has a similar width to that of the heat pipe
1, and is arranged to extend along the same path as the heat pipe 1
from one end to the other end thereof. In other words, the heat
pipe 6 is superposed on the heat pipe 1 in the X-Y plane. The heat
pipe 1 can be referred to as the base pipe since it serves as a
base which the heat pipe 6 is laid on and joined to.
[0045] In this manner, it is made possible, by laying the heat pipe
6 on top of the heat pipe 1, to allow the heat from the second heat
generating component that is received by the heat pipe 1 from the
heat receiving portion 5a to be transferred to the one end 6a of
the heat pipe 6, transported to the other end 6b of the heat pipe
6, and dissipated by the radiator 4.
[0046] FIG. 3 is a schematic cross-sectional view obtained by
cutting the cooling component 10a illustrated in FIG. 2 along the
A-A line. As is obvious from FIG. 3, the heat pipe 6 is superposed
on the surface of the thin flat heat pipe 1. The heat pipe 6 is
formed such that the thickness thereof in the Z-axis direction is
substantially the same as that of the heat pipe 1, and the width
thereof in the Y-axis direction is smaller than that of the heat
pipe 1. However, the width of the heat pipe 6 may be the same or
slighter greater than that of the heat pipe 1.
[0047] The lower flat surface in the Z-axis direction of the heat
pipe 1 is joined by soldering to the heat receiving portion 5a that
is attached so as to be supported by the cutout portions 52a, and
receives heat from a heat generating component arranged to face the
heat receiving portion 5a, via the heat receiving portion 5a. When
the heat receiving portion 5a and the base 5 are formed integrally
as a single component, the heat pipe 1 may receive the heat from
the heat generating component via the base 5.
[0048] The lower flat surface of the heat pipe 6 is superposed on
the upper flat surface in the Z-axis direction of the heat pipe 1
in contact therewith. The upper flat surface of the heat pipe 1 and
the lower flat surface of the heat pipe 6 are thermally connected
with each other by being joined together at their contact surface
by means of solder or other bonding material having high heat
conductivity. Various joining methods can be used to join the heat
pipe 1 and the heat pipe 6, as described above. The contact surface
area between the heat pipe 1 and the heat pipe 6 can be increased
by joining the flat surfaces thereof, which enables proper heat
transfer from the heat pipe 1 to the heat pipe 6. Accordingly, the
amount of heat that can be transported to the radiator 4 is
increased by superposing the heat pipe 6 on the heat pipe 1, in
comparison with when only the heat pipe 1 is provided. Thus, the
heat conducted from the heat generating components can be
transported properly to the radiator 4.
[0049] Returning to FIG. 2, the heat pipe 6, which is superposed at
the one end 6a thereof on the heat pipe 1 at a position
corresponding to the heat receiving portion 5a, is extended to the
radiator 4 along the same path as the heat pipe 1 in the X-Y plane.
The heat pipe 6 extended to the radiator 4 is arranged such that
its end is in contact with the anti-air-leak sheet 42 provided in
the radiator 4 having its longitudinal direction in the Y-axis
direction. Since the other end 1b of the heat pipe 1 is inserted
into the radiator 4, the heat pipe 6 joined to the heat pipe 1 at
the heat receiving portion 5a is bent such that it is gently
inclined upward in the Z-axis direction on the heat transfer path
leading to the radiator 4, before the radiator 4.
[0050] FIG. 4 is a perspective view illustrating the cooling
apparatus 10a as viewed from the outside of the curve of the heat
pipe 1. As illustrated in FIG. 4, the heat pipe 6 is inclined
upward in the Z-axis direction before the radiator 4 so as to be
separated from the heat pipe 1, and arranged on the radiator 4.
This means that the one end 6a of the heat pipe 6 is joined to the
heat pipe 1 in contact therewith, while the other end 6b is
separated from the heat pipe 1.
[0051] FIG. 5 is a schematic cross-sectional view obtained by
cutting the cooling apparatus 10a illustrated in FIG. 2 along the
B-B line. As illustrated in FIG. 5, the lower flat surface of the
heat pipe 6 provided on the radiator 4 is arranged in contact with
the flat portion 42a of the anti-air-leak sheet 42. The heat pipe 1
(the other end 1b thereof) is arranged orthogonally to the heat
dissipation fins 41. Accordingly, the radiator 4 is thermally
connected to the heat pipe 1 via the heat dissipation fins 41, and
is thermally connected to the heat pipe 6 via the anti-air-leak
sheet 42. Heat conducted from the heat generating component is
transported through the heat pipe 6 and dissipated in a
longitudinal direction of the anti-air-leak sheet 42a.
[0052] The arrows in FIG. 5 indicate flows or streams of forced
cooling air generated by a fan mechanism (not illustrated). Heat
from the heat pipes 1 and 6 is dissipated by the flows of air. As
illustrated in FIG. 5, the boundary between the flat portion 42a
and the slope portion 42b of the anti-air-leak sheet 42 is formed
linearly along a longitudinal direction of the anti-air-leak sheet
42. Thus, this boundary defines a guideline to specify a position
where the heat pipe 6 is to be arranged in contact with the
anti-air-leak sheet 42. As described above, the heat pipe 6 (the
other end 6b thereof) may be arranged between the anti-air-leak
sheet 42 and the heat dissipation fins 41 and joined to the heat
dissipation fins 41. This configuration is preferable in terms of
improvement in cooling efficiency because the heat transferred
through the heat pipe 6 can be directly conducted to the radiator
4.
[0053] Since the heat pipe 1 and the radiator 4 can be used in
common in the cooling apparatus 10 and the cooling apparatus 10a
according to the first embodiment, the types of parts and
components to be manufactured and the number of parts and
components to be managed can be reduced, resulting in cost
reduction.
[0054] Further, the cooling apparatus 10a, which has a simple
configuration in which the bases 3 and 5 having the first heat
receiving portion 3a and the second heat receiving portion 5a,
respectively, are provided for two heat generating components, and
the heat pipe 6 as the second heat pipe for assisting the heat pipe
1 in heat transportation is attached on top of the heat pipe 1, is
capable of properly transporting the heat emitted from the second
heating element and received by the heat receiving portion 5a to
the radiator 4 (the other end 6b thereof).
[0055] When the cooling apparatus 10a is configured in this manner,
its thickness in the Z direction is increased by the provision of
the heat pipe 6. However, when viewing the cooling apparatus 10a in
the X-Y plane, the surface area occupied by the heat pipe 6 in the
X-Y plane is not increased since the heat pipe 6 is placed on top
of the heat pipe 1.
[0056] The base 5 is arranged to be located in an intermediate part
of the heat pipe 1 in the cooling apparatus 10a. Therefore, the
surface area occupied by the cooling apparatus 10a in the X-Y plane
is increased by the portions of the base 5 sticking out of the heat
pipe 1 in the width direction. Nevertheless, the increase of the
occupied area in the X-Y plane can be suppressed in comparison with
the cooling apparatus of the comparison example as illustrated in
FIG. 18. This means that two heat generating components can be
cooled with the cooling apparatus having a reduced size in
comparison with the cooling apparatus of the comparison example.
Further, since the heat pipe 1 and the heat pipe 6 are formed into
a plate-like shape, the superposition of these heat pipes does not
affect significantly to the thickness. This is advantageous for
example to reduce the thickness of the electronic apparatus.
[0057] Further, unlike the cooling apparatus of the comparison
example (FIG. 18), the cooling apparatus 10a does not employ the
configuration in which two heat pipes are inserted in the radiator.
Therefore, the problem that one of inserted two heat pipes hinders
heat dissipation of the other heat pipe (obstructs the flow of air
introduced into the radiator) can be avoided, whereby a desirable
cooling effect can be obtained.
Modification Example
[0058] As described above, the cooling apparatus according to the
invention is embodied not only in the cooling apparatus 10 having a
basic configuration but also in various variations (modified
embodiments) according to an amount of heat generated by a heat
generating component and relative layout of components. A modified
embodiment of the cooling apparatus will be described, by way of
example, in consideration of an amount of heat generated by a heat
generating component and relative positional relationship of
components.
[0059] FIG. 6 is a perspective view illustrating a cooling
apparatus 10b that is a modification example of the cooling
apparatus 10 according to the first embodiment. FIG. 7 is a
perspective view illustrating a cooling apparatus 10d that is
another modification example of the cooling apparatus 10a according
to the first embodiment.
[0060] The cooling apparatus 10b illustrated in FIG. 6 is
applicable to a heat generating component generating a greater
amount of heat than a heat generating component to which the
cooling apparatus 10 is applied. The cooling apparatus 10b differs
from the cooling apparatus 10 in having a heat pipe 61 with a
substantially equivalent length (path length) to that of the heat
pipe 1 in order to increase the amount of heat transported to the
radiator 4.
[0061] The heat pipe 61 has substantially the same shape as the
heat pipe 1, and has one end 61a, the other end 61b, and an
intermediate portion 61c. The heat pipe 61 is arranged so as to be
laid on the heat pipe 1 in the X-Y plane from the one end 61a to
the other end 61b, while the one end and the other end of the heat
pipe 61 are arranged to align with the one end and the other end of
the heat pipe 1, respectively. In this manner, the one end 61a of
the heat pipe 61 is enabled to receive heat from the heat receiving
portion 3a via the heat pipe 1, and to conduct the received heat to
the other end 61b via the intermediate portion 61c. The other end
61b is arranged on the upper face of the radiator 4 in the same
manner as the other end 6b of the heat pipe 6 (FIG. 2).
[0062] The cooling apparatus 10b illustrated in FIG. 6 is capable
of properly transporting heat emitted from the heat generating
component to the radiator 4 by means of the heat pipe 1 and the
heat pipe 61. This means that, even if the amount of heat that the
heat pipe 1 is able to transfer is not enough to transport the
amount of heat generated by the heat generating component, the
amount of heat that cannot be transported by the heat pipe 1 can be
covered by the heat pipe 61. Such increase of amount of
transportable heat can be achieved only by modifying the cooling
apparatus 10 by arranging the heat pipe 61 on top of the heat pipe
1 and joining them. Thus, a cooling apparatus with an increased
amount of transportable heat can be obtained with a simple
modification.
[0063] FIG. 7 illustrates a cooling apparatus 10c that is a
modification example of the cooling apparatus 10a (FIG. 2), in
which a heat pipe 61 is superposed on the heat pipe 1 in the same
manner as in the cooling apparatus 10b illustrated in FIG. 6. In
other words, one end of the heat pipe 6 illustrated in FIG. 2 is
extended up to one end of the heat pipe 1.
[0064] The cooling apparatus 10c having such configuration provides
substantially the same effects as the cooling apparatus 10b.
Specifically, the cooling apparatus 10c is capable of properly
transporting heat emitted from the first heat generating component
and received by the heat receiving portion 3a to the radiator 4 by
means of not only the heat pipe 1 but also the heat pipe 61.
Therefore, the cooling apparatus 10c is capable of properly cooling
a heat generating component which generates a greater amount of
heat than the first heat generating component to which the cooling
apparatus 10a is applied. The cooling apparatus 10c can be realized
by such a simple modification of the cooling apparatus 10a as to
attach the heat pipe 61 thereto. Accordingly, even if the amount of
heat generated by a heat generating component due to change of the
heat generating component, the cooling apparatus 10c capable of
properly cooling the heat generating component by a simple
modification of the cooling apparatus 10a.
Second Embodiment
[0065] A cooling apparatus according to a second embodiment will be
described. The second embodiment has common features with the first
embodiment. Therefore, the following description will be focused on
differences between the first and second embodiments, while like
components will be assigned with like reference numerals and
description thereof will be omitted.
[0066] FIG. 8 is a perspective view illustrating a configuration
example of a cooling apparatus 10d according to the second
embodiment. The cooling apparatus 10d corresponds to a modification
example of the cooling apparatus 10 according to the first
embodiment. In the cooling apparatus 10a, the first and second heat
generating components to be cooled are arranged on a straight line
extended from the heat pipe 1 as viewed in plan (that is, the
second heat generating component is arranged at a position
overlapping the intermediate portion 1c of the heat pipe 1).
Therefore, in this cooling apparatus 10a, the configuration is
employed in which the heat receiving portion 3a as the first heat
receiving portion and the heat receiving portion 5a as the second
heat receiving portion are both joined to the heat pipe 1. In
contrast to this, the cooling apparatus 10d according to the second
embodiment has a configuration in which, although the second heat
generating component is not arranged on a path extended from the
heat pipe 1, cooling of the second heat generating component is
enabled with the use of the basic configuration (of the cooling
apparatus 10 of FIG. 1).
[0067] Specifically, in the cooling apparatus 10d illustrated in
FIG. 8, the base 3 having the heat receiving portion 3a, the heat
pipe 1, and the radiator 4 are the same as those of the cooling
apparatus 10 (FIG. 1). However, the cooling apparatus 10d differs
from the cooling apparatus 10 in the following respects.
[0068] (1) A second base 7 having a heat receiving portion 7a for
receiving heat from the second heat generating component is
provided at a position further away from the radiator 4 than the
base 3 in the X-Y plane. The base 7 has threaded holes 7b so that
the base 7 is screw fastened to the housing, a motherboard, or
other component of the electronic apparatus.
[0069] (2) A heat pipe 62 is provided to transport heat from the
heat receiving portion 7a to the radiator 4. The heat pipe 62 is
joined to the heat receiving portion 7a at its one end 7a, and
joined to the one end 1a of the heat pipe 1 on the heat receiving
portion 3a. The heat pipe 62 is extended so as to overlap with the
heat pipe 1 from the one end 1a to the other end 1b of the heat
pipe 1.
[0070] The following is a description of the heat pipe 62 in
comparison with the heat pipe 61 illustrated in FIG. 6. The
configuration of the part of the heat pipe 62 overlapping with the
heat pipe 1 is the same as that of heat pipe 61. However, one end
62a of the heat pipe 1 functions as an extension portion which
extends further than the one end 1a of the heat pipe 1, and this
extension portion is joined to the heat receiving portion 7a of the
base 7.
[0071] Accordingly, the heat pipe 62 is able to transport heat
conducted from the heat receiving portion 7a onto the radiator 4
where the other end 62b is arranged. If the amount of heat
transportable by the heat pipe 62 allows, heat emitted from the
heat receiving portion 3a and conducted from the heat pipe 1 can
also be transported to the radiator 4 through the heat pipe 62.
[0072] The cooling apparatus 10d illustrated in FIG. 8 has the base
7 and the heat pipe 62 added to the basic configuration of the
cooling apparatus 10, whereby the cooling apparatus 10d is enable
to also cool the second heat generating component arranged near the
first heat generating component corresponding to the heat receiving
portion 3a. Since a major part of the heat pipe 62 functioning as
the heat conduction path is arranged to be laid on top of the heat
pipe 1, the increase in the surface area occupied by the cooling
apparatus 10d in the X-Y plane is limited to the increase of the
area of extension portion (one end) 62a of the heat pipe 62 and of
the base 7. Thus, the cooling apparatus 10d can be obtained, which
is able to cool the second heat generating component different from
the first heat generating component with an almost minimum increase
in the surface area.
[0073] FIG. 9 is a perspective view illustrating a configuration
example of another cooling apparatus 10e according to the second
embodiment. The cooling apparatus 10e corresponds to a modification
example of the cooling apparatus 10a according to the first
embodiment. Specifically, the cooling apparatus 10e is a cooling
apparatus in which the base 7 and the heat pipe 62 illustrated in
FIG. 8 are applied to the cooling apparatus 10a. As illustrated in
FIG. 9, the base 7 is provided for cooling a third heat generating
component that is different from the first and second heat
generating components the heat from which is received by the bases
3 and 5, and the heat pipe 62 is provided to transport the heat
from the heat receiving portion 7a to the radiator 4. Particulars
of the base 7 and heat pipe 62 are the same as those of the base 7
and heat pipe 62 illustrated in FIG. 8, and hence description
thereof will be omitted.
[0074] In addition to the advantageous effects provided by the
cooling apparatuses 10 and 10a, the cooling apparatuses 10d and 10e
illustrated in FIGS. 8 and 9 are capable of realizing the cooling
of another heat generating component (heat generating region) while
suppressing the increase in size of the cooling apparatus in the
X-Y direction (in the planar direction), by such a simple method as
adding the base 7 and the heat pipe 62.
Third Embodiment
[0075] A cooling apparatus according to a third embodiment will be
described. Since this third embodiment has common features with the
first and second embodiments, the following description will be
focused on their differences. Like components will be assigned with
the same reference numerals and description thereof will be
omitted.
[0076] FIGS. 10 and 11 illustrate a cooling apparatus 10f according
to a third embodiment which is a modification example of the
cooling apparatus 10a illustrated in FIG. 6. If the amount of heat
transportable by the heat pipe 1 and the heat pipe 6 is not enough
for the amount of heat received by the heat receiving portion 3a,
two heat pipes 61 are arranged on top of each other as illustrated
in FIGS. 10 and 11. In this manner, by providing a plurality of
heat pipes 61 superposed on each other in accordance with the
desired amount of heat to be transported, the heat from the heat
generating components can be properly transported to the radiator
4.
[0077] Particulars of the cooling apparatus 10f illustrated in
FIGS. 10 and 11 will be described below. The cooling apparatus 10f
corresponds to a modification example of the cooling apparatus 10b,
in which the heat pipe 61 illustrated in FIG. 6 is laid in
plurality (two in the figure) on top of the heat pipe 1, while
being overlapped. A cooling apparatus 10f is another modification
of the cooling apparatus 10b illustrated in FIG. 6, in which one
more heat pipe 61 is arranged on top of and in contact with the
illustrated heat pipe 61. The upper flat surface of the heat pipe
61 to be superposed on the heat pipe 1 and the lower flat surface
of the heat pipe 61 additionally superposed on the heat pipe 61 are
joined in contact with each other and thermally connected to each
other. The joined two heat pipes 61 extend integrally along the
same path as the heat pipe 1 in the X-Y plane to reach the radiator
4.
[0078] As is obvious from the FIG. 11, one of the two heat pipe 61
integrally extended to the radiator 4, namely the lower heat pipe
61 in the Z-axis direction has its lower flat surface arranged in
contact with the flat portion 42a of the anti-air-leak sheet 42.
The radiator 4 is thermally connected to the two overlapped and
joined heat pipes 61 via the anti-air-leak sheet 42. The heat pipe
1 and the overlapped and joined two heat pipes are separated upward
and downward in the Z-axis direction before the radiator 4, and the
overlapped and joined two heat pipes extend integrally onto the
radiator 4.
[0079] Conductive heat from the heat generating component that is
received by the heat pipe 1 in the heat receiving portion 3a is
conducted to the lower heat pipe 61 via the lower flat surface of
the lower heat pipe 61 joined to the heat pipe 1. Further, since
the lower flat surface of the upper heat pipe 61 arranged on the
upper side in the Z-axis direction is joined in contact with the
upper flat surface of the lower heat pipe 61, the conductive heat
conducted to the lower heat pipe 61 is conducted to the upper heat
pipe 61. Accordingly, the cooling apparatus 10f of this
modification example is capable of increasing the amount of heat
transported to the radiator 4, in comparison with the configuration
of the cooling apparatus 10b illustrated by way of example in FIG.
6.
[0080] This configuration of overlapping a plurality of heat pipes
61 is also applicable to the heat pipe 62 illustrated by way of
example in FIGS. 8 and 9. Further, a modified embodiment can also
be envisaged in which the heat pipe 61 is superposed on the heat
pipe 62 to increase the amount of transportable heat.
Fourth Embodiment
[0081] A cooling apparatus according to a fourth embodiment of the
invention will be described. In the embodiments described in
relation to FIGS. 6 to 11, the radiator 4 and the heat pipe 1 are
used as common cooling components, and modified embodiments thereof
are proposed by way of example in which additional heat pipes are
provided to be superposed on each other in accordance with an
amount of heat generated by the heat generating components or
positions where the heat generating components are arranged. In
addition to these modifications, a modification illustrated in FIG.
12 is also possible.
[0082] FIG. 12 is a perspective view illustrating by way of example
a cooling apparatus according to the fourth embodiment. In the
cooling apparatus 10g illustrated in FIG. 12, a heat pipe 63 one
end of which is inserted into a radiator 4a different from the
radiator 4 is superposed on and joined to the heat pipe 61 of the
cooling apparatus 10b illustrated in FIG. 6. The radiator 4a has
the substantially same configuration as that of the radiator 4
except that the heat pipe is inserted in mutually different
directions. The heat pipe inserted into the radiator 4a may be one
like the heat pipe 1, or may be one like the heat pipe 61. A
radiator different from the radiator 4 also can be used as the
radiator 4a.
[0083] The upper flat surface of the heat pipe 61 and the lower
flat surface of the heat pipe 63 are joined in contact with each
other and thermally connected to each other. The heat pipe 61 and
the heat pipe 63 are separated leftward and rightward in the Y-axis
direction at the position where the heat pipe 61 and the heat pipe
1 are separated upward and downward in the Z-axis direction. The
end of the heat pipe 63 separated from the heat pipe 61 is inserted
into the radiator 4a. Heat from the heat generating component
conducted via the upper flat surface of the heat pipe 61 is
transported to the radiator 4a through the heat pipe 63. The heat
conducted from the heat generating component and transported to the
radiator 4a is dissipated by means of the heat dissipation fins
41a. A fan (not illustrated) is arranged in front of the radiator
4a (on the near side from the radiator 4a as viewed in FIG. 12) for
supplying cooling air.
[0084] In the cooling apparatus 10g, when the heat generating
components possibly cannot be cooled enough by the configuration of
the cooling apparatus 10b (see FIG. 2), the configuration of the
cooling apparatus 10g in which the radiator 4a and the heat pipe 63
are provided can be employed so that the heat is transported by the
heat pipe 63 to the additional radiator 4a to be dissipated
thereby.
[0085] In the cooling apparatus 10g, the heat emitted from the heat
generating component, received by the heat receiving portion 3a and
conducted thereto can be transported to corresponding one of the
radiators 4 and 4a by the heat pipe 1, the heat pipe 61 and the
heat pipe 63. Further, the configuration of the cooling apparatus
10g is able realize a cooling apparatus capable of properly cooling
the heat generating components with a simple modification of adding
the heat pipe 63 and the radiator 4a to the cooling apparatus
10a.
[0086] <<Electronic Apparatus>>
[0087] Electronic apparatus to which the cooling apparatuses
according to the first to fourth embodiments of the invention are
applicable will be described with reference to FIGS. 13 to 17. FIG.
13 is an overall perspective view of electronic apparatus 30. FIGS.
14 to 16 are exploded views of the electronic apparatus 30. FIG. 14
is an exploded view of the electronic apparatus 30 as viewed from
above, and FIG. 16 is an exploded view of the electronic apparatus
as viewed from below. FIGS. 17A and 17B are explanatory diagrams of
a fan mechanism 39 and a cooling apparatus to be mounted on the
electronic apparatus 30. The following description will be made in
terms of a laptop PC as an example of the electronic apparatus
30.
[0088] As illustrated in FIGS. 13 and 14, the electronic apparatus
30 has a lower housing 31, an upper housing 32, and a display 33.
The lower housing 31 and the upper housing 32 define an internal
space by being joined to each other. The display 33 is connected to
the upper housing 32 such that the display 33 is pivotable or
rotatable around a pivot shaft 34 within a predetermined range of
pivot angle with respect to the upper housing 32.
[0089] As illustrated in FIG. 13, the display 33 is opened in its
substantially central portion and provided with a display portion
33a that is formed for example of a liquid crystal display or
organic EL (Electro-Luminescence) display. There is attached, on
the upper surface of the lower housing 31, a keyboard 32a including
input means such as key input means or touch input means.
[0090] As illustrated in FIG. 14, there are accommodated, in the
internal space defined by the lower housing 31 and upper housing 32
when joined to each other, a CPU, a VGA, or an electronic circuit
chip such as a LSI to be cooled by a cooling apparatus, a wiring
board (motherboard) 35 on which electric and electronic circuits
and connectors are mounted, and a cooling apparatus according to an
embodiment of the invention. The wiring board 35 may be a
motherboard or the like on which a main processor circuit of the
electronic apparatus is mounted. The cooling apparatus used in the
illustrated example is the cooling apparatus 10a according to the
second embodiment which has the heat pipe 1, the radiator 4, the
bases 3 and 5, and the heat pipe 6.
[0091] The lower housing 31 is provided, for example, with a HDD
device, a battery power source, and a fan mechanism 39 including a
fan. There is formed, in a side face of the lower housing 31, a
louver (air exhaust) 31a to face the air outlet of the fan
mechanism 39. The louver 31a is opened toward a lateral and
obliquely downward direction of the lower housing 31. The louver
(air exhaust) 31a is formed for the purpose of discharging heat
emitted from the heat generating component and dissipated by the
radiator 4, out of the electronic apparatus 30.
[0092] The wiring board 35 has a plurality of threaded holes
(through holes) 35Z, and is fastened to the upper housing 32 with
screws (not illustrated) using the threaded holes 35Z. The
screw-fastened wiring board 35 is fixed such that its element
mounting surface faces the lower housing 31. In a state in which
the element mounting surface faces the lower housing 31 as
illustrated in FIG. 16, the heat generating components 36a and 36b
project downward.
[0093] The cooling apparatus 10a is accommodated within the
electronic apparatus 30 while being interposed between the wiring
board 35 and the lower housing 31 such that, unlike the state
illustrated in FIG. 2, the side of the cooling apparatus, on which
the heat pipe 6 and the heat pipe 1 are exposed, faces downward
(that is, the cooling apparatus is turned upside down from the
state illustrated in FIG. 2). Accordingly, when the cooling
apparatus 10a is accommodated in the electronic apparatus, there
are arranged sequentially from the top to the bottom, the upper
housing 32, the wiring board 35, the cooling apparatus 10a, and the
lower housing 31.
[0094] As illustrated in FIGS. 15 and 16, the cooling apparatus 10a
is positioned such that the heat receiving portions 3a and 5a
provided in the bases 3 and 5 cover the heat generating components
36a and 36b mounted on the wiring board 35. The wiring board 35 has
through holes passing through the wiring board 35 at the positions
corresponding to the through holes provided in the projections of
the support members 11a to 11d when the cooling apparatus 10a is
positioned in this manner. Attachment parts having threaded holes
35a to 35d are arranged on the surface of the wiring board 35 which
defines the rear face of the wiring board 35 on which the cooling
apparatus 10a is arranged (for example, the upper surface of the
wiring board 35 in FIG. 15). These threaded holes 35a to 35d are
provided in the respective attachment parts at positions
corresponding to the through holes provided in the wiring board
35.
[0095] When attaching the cooling apparatus 10a to the wiring board
35, the cooling apparatus 10a and the attachment parts are firstly
arranged on the wiring board 35 such that the through holes formed
in the projections of the support members 11a to 11d of the cooling
apparatus 10a, the through holes in the wiring board 35, and the
threaded holes of the attachment parts are all aligned with each
other. Screws are inserted in the through holes formed in the
projections of the support members 11a to 11d of the cooling
apparatus 10a, and these screws are fastened to the threaded holes
of the attachment parts via the through holes in the wiring board
35. According to such an attachment configuration, the relative
position between the wiring board 35 and the cooling apparatus 10a
(particularly, the opposing position between the heat generating
components 36a, 36b and the heat receiving portions 3a, 5a) will
not vary even if vibration occurs in the components of the
electronic apparatus 30 due to carrying of the electronic
apparatus. Therefore, the cooling apparatus 10a is capable of
ensuring stable heat exhaust capacity for the heat generating
components.
[0096] When the electronic apparatus 30 is powered on and an OS
(Operating System) stored in a HDD device or the like is started,
heat from the heat generating components 36a, 36b is conducted to
the heat pipes 1 and 6 via the heat receiving portions 3a and 5a
which are arranged to face and cover the heat generating components
36a, 36b. The heat from the heat generating component conducted
from the heat pipes 1 and 6 is transported to the radiator 4
through these heat pipes 1 and 6 serving as heat conduction paths.
The radiator 4 of the cooling apparatus 10a is accommodated in a
space between the fan mechanism 39 and the louver (air exhaust) 31a
provided in the lower housing 31. Forced cooling air introduced
through the opening 41c of the radiator 4 facing the air outlet of
the fan mechanism 39 passes through between the heat dissipation
fins 41 of the radiator 4 and discharged out of the electronic
apparatus 30 via the louver (air exhaust) 31a.
[0097] FIGS. 17A and 17B illustrate a positional relationship among
the cooling apparatus 10a fixed to the electronic apparatus 30, the
fan mechanism 39 and the louver (air exhaust) 31a. The opening 41c
of the radiator 4 accommodated in the lower housing 31 faces the
air outlet of the fan mechanism 39. Airflow generated by the fan
mechanism 39 and introduced through the opening 41c passes through
between the heat dissipation fins while catching the conductive
heat dissipated via the heat dissipation fins 41, and is discharged
out of the electronic apparatus 30 through the louver (air exhaust)
31a. Accordingly, the conductive heat from the heat generating
components which has been conducted and transported through the
heat pipe 1 and the heat pipe 6 is discharged out of the electronic
apparatus 30 through the louver (air exhaust) 31a together with the
airflow generated by the fan mechanism 39.
[0098] In the C-C cross-sectional view of FIG. 17B, the arrows
indicate directions in which the airflow generated by the fan
mechanism 39 passes through. As is seen from the C-C
cross-sectional view of FIG. 17B, in the state in which the cooling
apparatus 10a is held and fixed in the electronic apparatus 30, a
space is formed between the heat pipe 6 in contact with the
anti-air-leak sheet 42 of the radiator 4 and the lower inner
surface of the lower housing 31. This gap structure allows part of
the airflow generated by the fan mechanism 39 to pass through the
space between the flat face of the heat pipe 6 and the lower inner
surface of the lower housing 31 to be discharged out of the
electronic apparatus 30 through the louver (air exhaust) 31a.
[0099] Thus, the cooling apparatus according to this embodiment is
enabled, by being mounted on the electronic apparatus 30, to assume
a heat exhaust configuration utilizing the housing structure of the
electronic apparatus 30. This improves the heat diffusion capacity
of the heat pipe 6 fastened to the anti-air-leak sheet 42 of the
radiator 4. The configurations of the aforementioned embodiments
can be combined as required without departing from the scope of the
invention.
[0100] All examples and conditional language recited herein are
intended for pedagogical purposes to aid the reader in
understanding the invention and the concepts contributed by the
inventor to furthering the art, and are to be construed as being
without limitation to such specifically recited examples and
conditions, nor does the organization of such examples in the
specification relate to a showing of the superiority and
inferiority of the invention. Although the embodiments of the
present invention have been described in detail, it should be
understood that the various changes, substitutions, and alterations
could be made hereto without departing from the spirit and scope of
the invention.
* * * * *