U.S. patent application number 13/283627 was filed with the patent office on 2012-06-14 for thin plate heat pipe.
This patent application is currently assigned to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE. Invention is credited to Seok Hwan MOON.
Application Number | 20120145357 13/283627 |
Document ID | / |
Family ID | 46198127 |
Filed Date | 2012-06-14 |
United States Patent
Application |
20120145357 |
Kind Code |
A1 |
MOON; Seok Hwan |
June 14, 2012 |
THIN PLATE HEAT PIPE
Abstract
Disclosed is a thin film heat pipe suitable for removal of hot
spots in displays such as an LCD, an LED, and a PDP. An exemplary
embodiment of the present disclosure provides a thin plate heat
pipe including: a body part having a flat plate shape; a
through-hole formed in the body part in a longitudinal direction; a
plurality of grooves formed on the inner wall of the through-hole
and in which a working fluid flows; and a wick formed in at least a
part of the through-hole.
Inventors: |
MOON; Seok Hwan; (Daejeon,
KR) |
Assignee: |
ELECTRONICS AND TELECOMMUNICATIONS
RESEARCH INSTITUTE
Daejeon
KR
|
Family ID: |
46198127 |
Appl. No.: |
13/283627 |
Filed: |
October 28, 2011 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/046 20130101;
F28D 15/0233 20130101; G02F 1/133385 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 13, 2010 |
KR |
10-2010-0126771 |
Claims
1. A thin plate heat pipe, comprising: a body part having a flat
plate shape; a through-hole formed in the body part in a
longitudinal direction; a plurality of grooves formed on the inner
wall of the through-hole and in which a working fluid flows; and a
wick formed in at least a part of the through-hole.
2. The thin plate heat pipe of claim 1, wherein the through-hole is
separated by one or more separation membranes.
3. The thin plate heat pipe of claim 1, wherein the groove has a
shape including one or more edges.
4. The thin plate heat pipe of claim 1, wherein the wick is
inserted into an evaporator section of the thin plate heat
pipe.
5. The thin plate heat pipe of claim 1, wherein the wick is one of
a sintered wick or a fabric wick.
6. The thin plate heat pipe of claim 5, wherein the sintered wick
is inserted into the through-hole separated by one or more
separation membranes formed in the through-hole.
7. The thin plate heat pipe of claim 6, wherein the sintered wick
is made of metal or ceramic.
8. The thin plate heat pipe of claim 5, wherein the fabric wick is
integrally inserted into the through-hole.
9. The thin plate heat pipe of claim 1, wherein the inside of the
through-hole is maintained in a vacuum state.
10. The thin plate heat pipe of claim 1, wherein the thin plate
heat pipe is installed at an incline or vertically.
11. The thin plate heat pipe of claim 1, wherein the heat pipe is
made of copper or aluminum.
12. The thin plate heat pipe of claim 1, wherein the thickness of
the heat pipe is 2 mm or less.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based on and claims priority from Korean
Patent Application No. 10-2010-0126771, filed on Dec. 13, 2010,
with the Korean Intellectual Property Office, the present
disclosure of which is incorporated herein in its entirety by
reference.
TECHNICAL FIELD
[0002] The present disclosure relates to a thin plate heat pipe
usable in cooling electronic components and equipment.
[0003] More particularly, the present disclosure relates to a thin
plate heat pipe suitable for removing a hot spot in a flat panel
display vertically installed, such as an LCD TV, an LED TV, and a
PDP TV.
BACKGROUND
[0004] Semiconductor components and systems packaged in electronic
equipment have gradually been high-integrated and miniaturized with
the development of a semiconductor manufacturing technology.
Following this trend, since heat emission density of components
included in the electronic equipment is significantly increased, a
cooling mechanism for effectively cooling and dissipating the
emitted heat is required. In particular, since the electronic
equipment is thinned together with miniaturization, an adopted
cooling device also needs to be small-sized.
[0005] As an example of the cooling device in the related art which
can be adopted in the small-sized electronic equipment, a heat
sink, a fan, and a heat pipe having a circular cross section having
a diameter of 3 mm or more may be used.
[0006] Since the heat sink can be fabricated with various sizes and
thicknesses and is low-priced, the heat sink has been widely used
as a basic type of cooling means in the meantime. However, when a
significant micro size is required, a heat dissipation rate is
relatively low with a decrease in a heat-transfer area.
[0007] The fan is limited in fabricating the fan with the micro
size and durability and reliability are relatively low.
[0008] The heat pipe in the related art may be crimped and used to
be suitable for a thin-film structure. However, since the
small-sized heat pipe having the circular structure cross section
has a cross section which is initially designed in a circular
shape, when the small-sized heat pipe is crimped to be suitable for
electronic equipment having the small-sized and thin-film
structure, the heat-transfer performance is significantly reduced
due to a structural change of a wick.
[0009] Accordingly, a thin-film type minute heat pipe with a
thickness of approximately 2 mm or less suitable for the electronic
equipment having the small-sized and thin-film structure needs to
be developed.
[0010] In recent years, particularly, the needs for emitted heat
cooling and temperature uniformity have been acute depending on
performance improvement as well as diversification of products with
the rapid growth of a display industry of a liquid crystal display
(LCD) TV, a plasma display panel (PDP) TV, and a light emitting
diode (LED) TV. In particular, the display is significantly thinner
and wider in response to increased consumer's demands, such that
emitted heat cooling and temperature nonuniformity has become
problematic.
[0011] Since a display device is vertically installed according to
a characteristic, the highest-temperature hot spot is generated at
an upper part of the display by an effect of natural convection. A
solution for uniformizing a temperature distribution vertically
while removing the hot spot is presently required.
SUMMARY
[0012] The present disclosure has been made in an effort to achieve
high heat-transfer performance in an inclination mode in which a
heat pipe is installed to form a predetermined angle with
horizontality or in a vertical mode in which the heat pipe is
installed in a vertical direction.
[0013] Further, the present disclosure relates to a heat pipe
having a very simple mechanical shape and the present disclosure
has been made in an effort to provide a thin plate heat pipe having
an advantageous inclination angle to further improve productivity
by fabricating the heat pipe through simple extrusion and insertion
processes and variously apply to small-sized and thin-film
structure electronic equipment including a display.
[0014] An exemplary embodiment of the present disclosure provides a
thin plate heat pipe including: a body part having a flat plate
shape; a through-hole formed in the body part in a longitudinal
direction; a plurality of grooves formed on the inner wall of the
through-hole and in which a working fluid flows; and a wick formed
in at least a part of the through-hole.
[0015] The through-hole may be separated by one or more separation
membranes.
[0016] The groove may have a shape including one or more edges.
[0017] The wick may be inserted into an evaporator section of the
thin plate heat pipe.
[0018] The wick may be one of a sintered wick or a fabric wick.
[0019] The sintered wick may be inserted into the through-hole
separated by one or more separation membranes formed in the
through-hole.
[0020] The sintered wick may be made of metal or ceramic.
[0021] The fabric wick may be integrally inserted into the
through-hole.
[0022] The inside of the through-hole may be maintained in a vacuum
state.
[0023] The thin plate heat pipe may be installed at an incline or
vertically.
[0024] The heat pipe may be made of copper or aluminum.
[0025] The thickness of the heat pipe may be 2 mm or less.
[0026] According to the exemplary embodiments of the present
disclosure, a thin plate heat pipe for a display that has a thin
flat plate shape in which a predetermined through-hole is formed
therein and includes polygonally cross-sectional grooves having one
or more edges formed on the inner surface of the through-hole to
allow a liquid working fluid to flow by capillary force generated
from the edge, such that the excellent capillary force can be
acquired through structural transformation of the heat pipe itself
and heat-transfer performance can be further improved. And the
thinned flat plate heat pipe is fabricated in a simple process to
further improve productivity and be variously applied to
small-sized and thin-film structure electronic equipment.
[0027] According to the exemplary embodiments of the present
disclosure, a plurality of separation membranes are formed in one
thin plate heat pipe, such that a plurality of passages can be
formed using one thin plate heat pipe.
[0028] According to the exemplary embodiments of the present
disclosure, not throughout an overall length of the thin plate heat
pipe, an additional sintered wick is inserted into the center of
the through-hole in a partial range of an evaporator section to
generate large capillary force required for the flowing of the
working fluid. As such, the large capillary force acquired by
inserting the additional sintered wick into the through-hole can
show a large merit in heat-transfer performance when a display
operates in an inclination mode.
[0029] According to the exemplary embodiments of the present
disclosure, by inserting an additional fabric wick into the center
of the through-hole in the partial range of the evaporator section
of the thin plate heat pipe, the large capillary force required for
the flowing of the working fluid can be acquired and weak solidity
of the sintered wick can be overcome, thereby achieving a very wide
industrial application range.
[0030] The foregoing summary is illustrative only and is not
intended to be in any way limiting. In addition to the illustrative
aspects, embodiments, and features described above, further
aspects, embodiments, and features will become apparent by
reference to the drawings and the following detailed
description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 is a perspective view for describing a thin plate
heat pipe according to a first exemplary embodiment of the present
disclosure.
[0032] FIG. 2 is a cross-sectional view for describing a thin plate
heat pipe according to the first exemplary embodiment of the
present disclosure.
[0033] FIG. 3 is a perspective view for describing a thin plate
heat pipe according to a second exemplary embodiment of the present
disclosure.
[0034] FIG. 4 is a cross-sectional view for describing a thin plate
heat pipe according to the second exemplary embodiment of the
present disclosure.
DETAILED DESCRIPTION
[0035] In the following detailed description, reference is made to
the accompanying drawing, which form a part hereof. The
illustrative embodiments described in the detailed description,
drawing, and claims are not meant to be limiting. Other embodiments
may be utilized, and other changes may be made, without departing
from the spirit or scope of the subject matter presented here.
[0036] FIG. 1 is a perspective view for describing a thin plate
heat pipe for a display according to a first exemplary embodiment
of the present disclosure.
[0037] Referring to FIG. 1, the thin plate heat pipe for a display
according to the first exemplary embodiment of the present
disclosure is constituted by a relatively thin flat plate-shaped
body part 100. The flat plate-shaped body part 100 may be
configured as a pipe-type or polyhedron-type metallic plate
fabricated using the extrusion process. Body part 100 may be made
of copper or aluminum and may be made of other materials except
copper and aluminum depending on processability, corrosion
resistance, durability, and the shape of a body part.
[0038] A predetermined through-hole 110 is formed in body part 110
to transport a working fluid injected from the outside.
Through-hole 110 has an empty space with a predetermined shape.
[0039] A plurality of polygonal cross-section-shaped grooves 120
extended in the same longitudinal direction as through-hole 110 are
formed on the inner surface of through-hole 110. Capillary force is
generated by edges of the polygonal cross-section-shaped groove 120
to allow the liquid working fluid to flow. For example, groove 120
may have a polygonal structure having edges with various shapes
such as a triangular shape, a rectangular shape, a trapezoidal
shape, a hemispherical shape, or a parabolic shape. For a design to
generate optimal capillary force, the cross section may be
optimally designed in terms of performance and cost by adjusting
the shape of groove 120 and the number and angles of the edges, and
concave-convex portions of grooves 120.
[0040] A plurality of separation membranes 140 may be formed in
through-hole 110 in order to form a plurality of flow paths. When
the width of the heat pipe is small, even one separation membrane
may be enough, but when the width is large, the plurality of
separation membranes may be formed.
[0041] As described above, in the thin plate heat pipe for a
display according to the first exemplary embodiment of the present
disclosure, the liquid working fluid flows by the capillary force
generated from the edges of polygonal and complicatedly-curved or
concave-convex-shaped grooves 120, instead of a wick in the related
art serving as a passage for allowing the liquid working fluid to
flow (return) from a condenser section to an evaporator
section.
[0042] The liquid working fluid injected while the inside of the
thin plate heat pipe for a display according to the first exemplary
embodiment of the present disclosure configured as above is
maintained in a vacuum state serves to emit heat of the display to
the outside and reduce the hot spot while the liquid working fluid
performs the phase changes between liquid and gas. Therefore, the
type of the liquid requires a characteristic in which the liquid
performs the phase changes between liquid and gas within an
operational temperature range of the heat pipe.
[0043] The thin plate heat pipe for a display according to the
first exemplary embodiment of the present disclosure has a
structure in which several grooves 120 extended in the longitudinal
direction are formed on the inner surface of through-hole 110 and
an additional sintered wick 130 is inserted into the middle of the
inner surface of through-hole 110.
[0044] Since sintered wick 130 may generate relatively large
capillary force, the working fluid may flow in a gravity direction
(for example, a vertical direction from the bottom to the top) when
the display is installed in an inclination mode. In this case, a
flowing direction of the working fluid in the inclination mode or a
vertical mode may vary depending on detailed situations such as the
position of the hot spot and the gravity direction.
[0045] As described above, the capillary force required for the
flowing of the working fluid is acquired by even an additionally
inserted sintered wick 130 as well as grooves 120 installed on the
inner surface of through-hole 110, such that the heat-transfer
performance of the thin plate heat pipe can be significantly
improved.
[0046] Meanwhile, sintered wick 130 is not installed throughout an
overall length of the heat pipe but at only at least one portion of
the evaporator section unlike the sintered wick heat pipes in the
related art. Further, as described above, a difference from the
related art is even in that sintered wick 130 is positioned at the
center of the through-hole on the cross section of the heat
pipe.
[0047] Sintered wick 130 may be fabricated using a metallic
material and a ceramic based material. Sintered wick 130 is
separately inserted into through-hole 110 separated by separation
membranes 140.
[0048] FIG. 2 is a cross-sectional view for describing a thin plate
heat pipe according to the first exemplary embodiment of the
present disclosure.
[0049] Referring to FIG. 2, the cross-sectional structure of
through-hole 110, the shape of groove 120, and the structure of
separation membrane 140 in the thin plate heat pipe according to
the first exemplary embodiment of the present disclosure can be
verified in detail.
[0050] In particular, additionally inserted sintered wick 130 is
positioned in a middle space between grooves 120 installed on the
wall of through-hole 110 and is separated into pieces and inserted
into each through-hole 110 separated by separation membranes
140.
[0051] FIG. 3 is a perspective view for describing a thin plate
heat pipe for a display according to a second exemplary embodiment
of the present disclosure.
[0052] Referring to FIG. 3, the thin plate heat pipe for a display
according to the second exemplary embodiment of the present
disclosure is constituted by a thinned flat plate-shaped body part
300 similarly as in the first exemplary embodiment of the present
disclosure.
[0053] As described above, the thin plate heat pipe for a display
according to the second exemplary embodiment of the present
disclosure has a structure and a function similar to the first
exemplary embodiment. That is, the heat pipe has a relatively thin
flat plate-shaped outer profile and has a longitudinal through-hole
310 therein. A plurality of longitudinal grooves are formed on the
inner surface of through hole 310 to seal the working fluid which
performs the phase change within the operational temperature range
of the heat pipe, such that the working fluid flows in a liquid
phase through the groove and the wick is included in the
through-hole. However, the wick additionally inserted into the
center of through-hole 310 is constituted by a wick 330 made of a
fiber material.
[0054] In the thin plate heat pipe for a display according to the
first exemplary embodiment, the wick inserted to generate large
capillary force is sintered wick 103, but in the thin plate heat
pipe for a display according to the second exemplary embodiment, a
fabric wick 303 is inserted, such that large capillary force can be
generated and a structural demerit in which sintered wick 130 tends
to be easily broken can be overcome.
[0055] As shown in FIG. 3, when fabric wick 330 is inserted into
the center of through-hole 310, the wick is not separated by
separation membranes 340 but integrally inserted into through-hole
310 while being not separated with being hung on separation
membranes 340. As shown in FIG. 3, separation membranes 340 are not
extended throughout the longitudinal direction of body part 300 but
may be formed at only the center other than the end. Further,
fabric wick 330 may have a structure in which one wick is inserted
into one separated through-hole similarly as in sintered wick
103.
[0056] Meanwhile, since the thin plate heat pipe for a display
according to the second exemplary embodiment of the present
disclosure has the same operations and effects as the first
exemplary embodiment of the present disclosure, a detailed
description thereof may refer to the first exemplary embodiment of
the present disclosure.
[0057] FIG. 4 is a cross-sectional view for describing a thin plate
heat pipe for a display according to the second exemplary
embodiment of the present disclosure.
[0058] Referring to FIG. 4, the cross-sectional structure of
through-hole 310, the shape of a groove 320, and the structure of
separation membrane 340 in the thin plate heat pipe according to
the second exemplary embodiment of the present disclosure can be
verified in detail.
[0059] In particular, additionally inserted fabric wick 330 is
positioned in the middle space between grooves 320 installed on the
wall of through-hole 310 and separation membranes 340 do not
separate the entirety of body part 300, such that fabric wick 330
may be connected throughout through-hole 310.
[0060] As described above, the thin plate heat pipe for a display
according to the first and second exemplary embodiments of the
present disclosure has a minute thickness of approximately 2 mm or
less and excellent heat dissipation and heat-transfer performance
and in particular, shows a very effective operational
characteristic in the inclination mode, and as a result, the thin
plate heat pipe can be effectively used as means to achieve removal
of the hot spot and temperature uniformity of the display.
[0061] Although the thin plate heat pipe for a display according to
the exemplary embodiments of the present disclosure has been
described, various modifications can be made within the scopes of
the appended claims, the detailed description of the present
disclosure, and the accompanying drawings are also included in the
present disclosure.
[0062] From the foregoing, it will be appreciated that various
embodiments of the present disclosure have been described herein
for purposes of illustration, and that various modifications may be
made without departing from the scope and spirit of the present
disclosure. Accordingly, the various embodiments disclosed herein
are not intended to be limiting, with the true scope and spirit
being indicated by the following claims.
* * * * *