U.S. patent application number 13/354540 was filed with the patent office on 2012-05-17 for modem unit and mobile communication unit.
This patent application is currently assigned to Intel Mobile Communications GmbH. Invention is credited to Bernd Wurth.
Application Number | 20120120995 13/354540 |
Document ID | / |
Family ID | 41528335 |
Filed Date | 2012-05-17 |
United States Patent
Application |
20120120995 |
Kind Code |
A1 |
Wurth; Bernd |
May 17, 2012 |
Modem Unit and Mobile Communication Unit
Abstract
A modem unit includes a first semiconductor die that includes a
power management unit and an embedded flash memory. A mobile
communication unit includes a modem unit residing on a first
semiconductor die. The first semiconductor die also includes a
power management unit and an embedded flash memory.
Inventors: |
Wurth; Bernd; (Landsberg am
Lech, DE) |
Assignee: |
Intel Mobile Communications
GmbH
Neubiberg
DE
|
Family ID: |
41528335 |
Appl. No.: |
13/354540 |
Filed: |
January 20, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12190183 |
Aug 12, 2008 |
8102202 |
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13354540 |
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Current U.S.
Class: |
375/222 ;
29/25.01; 29/592.1 |
Current CPC
Class: |
H04B 1/40 20130101; Y10T
29/49002 20150115 |
Class at
Publication: |
375/222 ;
29/592.1; 29/25.01 |
International
Class: |
H04L 5/16 20060101
H04L005/16; H01L 21/02 20060101 H01L021/02; H05K 13/00 20060101
H05K013/00 |
Claims
1. A modem unit, comprising a first semiconductor die comprising a
power management unit and an embedded flash memory.
2. The modem unit according to claim 1, further comprising: a
baseband unit coupled to the power management unit.
3. The modem unit according to claim 2, wherein the baseband unit
is arranged on a second semiconductor die.
4. The modem unit according to claim 1, wherein in the embedded
flash memory one or more of calibration data, network parameters,
security data and debug data are stored.
5. The modem unit according to claim 2, further comprising: a radio
frequency unit coupled to the baseband unit.
6. The modem unit according to claim 5, wherein the radio frequency
unit is arranged on the second semiconductor die or on a third
semiconductor die.
7. A mobile communication unit, comprising: a modem unit comprising
a first semiconductor die, the first semiconductor die comprising a
power management unit and an embedded flash memory.
8. The mobile communication unit according to claim 7, further
comprising: an application unit coupled to the modem unit.
9. The mobile communication unit according to claim 8, wherein the
modem unit comprises a baseband unit, the baseband unit comprising
a central processing unit.
10. The mobile communication unit according to claim 9, wherein the
application unit comprises a memory unit containing an operation
program comprising instructions for the operation of the central
processing unit.
11. The mobile communication unit according to claim 7, wherein in
the embedded flash memory one or more of calibration data, network
parameters, security data and debug data are stored.
12. The mobile communication unit according to claim 9, wherein the
baseband unit is arranged on a second semiconductor die.
13. A mobile communication unit, comprising: a modem unit
comprising a baseband unit, the baseband unit comprising a central
processing unit, and a first memory unit configured to store
therein one or more of calibration data, network parameter,
security data and debug data; and an application unit comprising a
second memory unit configured to store therein an operation program
for the operation of the central processing unit.
14. The mobile communication unit according to claim 13, wherein
the first memory unit comprises a flash memory.
15. The mobile communication unit according to claim 13, wherein
the modem unit resides on a first semiconductor die, and wherein a
power management unit and the first memory unit also resides on the
first semiconductor die.
16. The mobile communication unit according to claim 15, wherein
the baseband unit is arranged on a second semiconductor die.
17. The mobile communication unit according to claim 16, further
comprising: a radio frequency unit arranged on the second
semiconductor die or on a third semiconductor die.
18. A mobile communication unit, comprising: a modem unit; and an
application unit comprising a memory unit, wherein the memory unit
is accessible by the modem unit and the application unit.
19. The mobile communication unit according to claim 18, wherein
the modem unit comprises a baseband unit, wherein the baseband unit
comprises a central processing unit, wherein an operation program
comprises instructions for operating the central processing unit is
stored in the memory unit.
20. The mobile communication unit according to claim 18, wherein
the modem unit resides on a first semiconductor die, and wherein a
power management unit and an embedded flash memory also resides on
the first semiconductor die.
21. The mobile communication unit according to claim 20, wherein
one or more of calibration data, network parameters, security data
and debug data are stored in the embedded flash memory.
22. The mobile communication unit according to claim 20, wherein
the modem unit further comprises a baseband unit arranged on a
second semiconductor die.
23. A method for producing a mobile communication unit, comprising:
storing one or more of calibration data, network parameters,
security data and debug data in a first memory unit; fabricating a
modem unit, wherein the modem unit comprises the first memory unit
and a baseband unit, and wherein the baseband unit comprises a
central processing unit; storing an operation program for the
operation of the central processing unit in a second memory; and
fabricating an application unit, wherein the application unit
comprises the second memory unit.
24. The method according to claim 23, further comprising:
fabricating a first semiconductor die comprising a power management
unit and the first memory unit.
25. The method according to claim 24, further comprising:
fabricating a second semiconductor die comprising the baseband
unit.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Continuation of U.S. patent
application Ser. No. 12/190,183 filed on Aug. 12, 2008 entitled
"MODEM UNIT AND MOBILE COMMUNICATION UNIT" hereby incorporated in
its entirety.
FIELD
[0002] This invention relates to a modem unit, a mobile
communication unit, and a method for producing a mobile
communication unit.
BACKGROUND
[0003] A mobile communication unit may comprise a modem
(modulator/demodulator) unit, which encodes information and
modulates a signal to be transmitted, and also demodulates a
received signal and decodes information contained therein. By use
of a modem unit a signal is produced that can be transmitted easily
and a received signal can be decoded to reproduce the original
information. Modems can be implemented not only in mobile
communication units but also in other communication units like
stationary communication units, data processing units, personal
computers or the like. Modem units can comprise memory units like
volatile and non-volatile memories for storing different kinds of
information or data therein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Aspects of the invention are made more evident by way of
example in the following detailed description of embodiments when
read in conjunction with the attached drawing figures.
[0005] FIG. 1 schematically illustrates a block diagram of a modem
unit according to an embodiment;
[0006] FIG. 2 schematically illustrates a block diagram of a modem
unit according to an embodiment;
[0007] FIG. 3 schematically illustrates a block diagram of a mobile
communication unit according to an embodiment;
[0008] FIG. 4 schematically illustrates a block diagram of a mobile
communication unit according to an embodiment;
[0009] FIG. 5 schematically illustrates a block diagram of a mobile
communication unit according to an embodiment;
[0010] FIG. 6 schematically illustrates a block diagram of a mobile
communication unit according to an embodiment; and
[0011] FIG. 7 illustrates a flow diagram of a method for producing
a mobile communication unit according to an embodiment.
DETAILED DESCRIPTION
[0012] In the following, one or more aspects and embodiments of the
invention are described with reference to the drawings, wherein
like reference numerals are generally utilized to refer to like
elements throughout. In the following description, for purposes of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of one or more aspects of
embodiments of the invention. It may be evident, however, to one
skilled in the art that one or more aspects of the embodiment of
the invention may be practiced with a lesser degree of these
specific details. In other instances, known structures and devices
are shown in block diagram form in order to facilitate describing
one or more aspects of the embodiments of the invention. The
following description is therefore not to be taken in a limiting
sense, and the scope of the invention is defined by the appended
claims.
[0013] In addition, while a particular feature or aspect of an
embodiment may be disclosed with respect to only one of several
implementations, such features or aspects may be combined with one
or more other features or aspects of the other implementations as
may be desired and advantageous for any given or particular
application. Furthermore, to the extent that the terms "include",
"have", "with", or other variants thereof are used in either the
detailed description or the claims, such terms are intended to be
inclusive in a manner similar to the term "comprise". The terms
"coupled" and "connected", along with derivatives may be used. It
should be understood that these terms may be used to indicate that
two elements cooperate or interact with each other regardless
whether they are in direct physical or electrical contact, or they
are not in direct contact with each other. Also, the term
"exemplary" is merely meant as an example, rather than the best or
optimal.
[0014] Referring to FIG. 1, there is shown a schematic block
diagram of a modem unit according to an embodiment. The modem unit
10 comprises a semiconductor die 1 comprising a power management
unit or power supply unit 2 and an embedded flash memory 3. The
power management unit 2 is responsible for the supply of electrical
power to the sub-units and sections of the modem unit 10.
[0015] According to an embodiment of the modem unit 10 of FIG. 1,
the semiconductor die 1 with the power management unit 2 and the
embedded flash memory 3 can be housed in a package like, for
example, a mold package. The package may comprise outer electrical
contact elements connected to contact elements of the power
management unit 2 and the embedded flash memory 3, the outer
electrical contact elements being, for example, in the form of pins
or flat contact pads ("lands").
[0016] According to one embodiment of the modem unit 10 of FIG. 1,
the power management unit 2 and the embedded flash memory 3 can be
electrically connected with each other by electrical connection
elements integrated on the semiconductor die 1.
[0017] According to one embodiment of the modem unit 10 of FIG. 1,
the modem unit 10 further comprises a baseband unit or baseband
processor which can be electrically coupled to the power management
unit 2. In one embodiment the baseband unit can be fabricated on
another semiconductor die which can be packaged in its own package
or which can be integrated with the semiconductor die 1 in one
package. According to a further embodiment, the modem unit 10 may
further comprise a radio frequency (RF) transceiver unit
electrically coupled to the baseband unit. In one embodiment the
radio frequency transceiver unit can be fabricated on another
semiconductor die which can be packaged in its own package. The
radio frequency transceiver unit can also be fabricated together
with the baseband unit on a single (monolithic) semiconductor die.
This semiconductor die can be packaged in its own package or it can
be packaged together with the semiconductor die 1 in one single
package. These embodiments will be explained in more detail further
below in connection with FIG. 6.
[0018] According to one embodiment of the modem unit 10 of FIG. 1,
in the embedded flash memory 3 one or more of calibration data,
network parameters, security data and debug data are stored. As
will be explained further below, the modem unit 10 can be part of a
mobile communication unit. During production of the mobile
communication unit, calibration data like, for example, radio
frequency calibration data are generated which can be stored in the
embedded flash memory 3. Moreover, during operation of the mobile
communication unit, security data, debug information and parameters
of the communication network are generated and periodically
updated, wherein those parameters can also be stored in the
embedded flash memory 3.
[0019] According to one embodiment of the modem unit 10 of FIG. 1,
the power management unit 2 and the embedded flash memory 3 can be
processed on the semiconductor die 1 by a CMOS process technology
like, for example, a 130 nm CMOS process technology.
[0020] According to one embodiment of the modem unit 10 of FIG. 1,
the modem unit 10 further comprises a baseband unit which comprises
a central processing unit (CPU), wherein an operation program of
the central processing unit is not stored in the embedded flash
memory 3. Instead the operation program of the central processing
unit can be stored elsewhere like, for example, in a further unit
which is electrically coupled to the modem unit 10, as will be
explained in greater detail below.
[0021] Referring to FIG. 2, there is shown a schematic block
diagram of a modem unit according to an embodiment. The modem unit
20 comprises a semiconductor die 1 comprising a power management
unit 2 and an embedded flash memory 3. The semiconductor die 1 with
the power management unit 2 and the embedded flash memory 3 is
electrically coupled to a baseband unit 4 like a baseband
processor. The electrical connection between the semiconductor die
1 and the baseband unit 4, in one embodiment, can be comprised of
one or several uni-directional electrical connection lines, each
one for transmitting signals and messages in one direction,
respectively. In principle it is also possible to provide a
bi-directional electrical connection line, in particular one single
bi-directional electrical connection line as the electrical
connection between the semiconductor die 1 and the baseband unit
4.
[0022] The modem unit 20 of FIG. 2 further comprises a radio
frequency (RF) transceiver unit 5 which is electrically coupled to
the baseband unit 4. The electrical connection between the baseband
unit 4 and the radio frequency transceiver unit 5 can also be
comprised of one or several uni-directional electrical connection
lines, each one for transmitting signals and messages in one
direction, respectively. In principle it is also possible to
provide a bi-directional electrical connection line as the
electrical connection between the semiconductor die 1 and the
baseband unit 4 between the baseband unit 4 and the radio frequency
transceiver unit 5.
[0023] In one exemplary embodiment the modem unit 20 of FIG. 2 can
be part of a mobile communication unit as will be outlined below in
connection with further embodiments.
[0024] According to one embodiment of the modem unit 20 of FIG. 2,
RF calibration data which are generated during production of the
modem unit 20 or at other times, in particular the RF transceiver
unit 5, can be stored in the embedded flash memory 3. Moreover,
network parameters of the communication network to be used with the
mobile communication unit can also be stored in the embedded flash
memory 3.
[0025] According to one embodiment of one of the modem units 10 or
20 of FIGS. 1 and 2, the modem unit 10 or 20 in addition includes a
volatile memory like, for example, a RAM.
[0026] Referring to FIG. 3, there is shown a schematic block
diagram of a mobile communication unit according to one embodiment.
The mobile communication unit 100 comprises a modem unit 10
comprising a semiconductor die 1, wherein the semiconductor die 1
comprises a power management unit 2 and an embedded flash memory
3.
[0027] According to one embodiment of the mobile communication unit
100 of FIG. 3, the mobile communication unit 100 further comprises
an application unit which is electrically coupled to the modem unit
10. The application unit or application sub-system can perform
particular functions which are not or at least not directly related
to the mobile communication functions of the mobile communication
unit. These particular functions can, for example, be comprised of
video games control, photo-camera control, audio function control
(MP3 player, etc.) or address book functions. The mobile
communication unit 100 can thus consist of or be comprised of a
so-called smart phone.
[0028] According to one embodiment of the mobile communication unit
100 of FIG. 3, the modem unit 10 further comprises a baseband unit
like a baseband processor, the baseband unit comprising a central
processing unit (CPU). According to a further embodiment thereof,
in case that the mobile communication unit 100 comprises an
application unit, the application unit comprises a memory unit
containing an operation program for the operation of the central
processing unit of the baseband unit. The memory unit can, for
example, comprise a non-volatile memory like, for example, a flash
memory like a NOR flash memory or a NAND flash memory. The memory
unit may in addition comprise a volatile memory like, for example,
a RAM.
[0029] According to one embodiment of the mobile communication 100
of FIG. 3, in the embedded flash memory 3 one or more of
calibration data, like RF calibration data, network parameters of
the communication network used by the mobile communication unit,
security data and debug data are stored.
[0030] It is to be noted that embodiments of the mobile
communication unit 100 of FIG. 3 can be provided based on the
embodiments of the modem unit presented above in connection with
FIGS. 1 and 2.
[0031] Referring to FIG. 4, there is shown a schematic diagram of a
mobile communication unit according to one embodiment. The mobile
communication unit 200 comprises a modem unit 30 comprising a
baseband unit 31, said baseband unit 31 comprising a central
processing unit (CPU) 31.1, and a first memory unit 32 storing one
or more of calibration data, network parameters, security data and
debug data, and the mobile communication unit 200 further
comprising an application unit 40 comprising a second memory unit
41 storing an operation program for the operation of the central
processing unit 31.1.
[0032] The modem unit 30 and the application unit 40 can be
electrically coupled to each other by one or several
uni-directional electrical connection lines, each one for
transmitting signals and messages in one direction, respectively.
In principle it is also possible to provide a bi-directional
electrical connection line, in particular one single bi-directional
electrical connection line as the electrical connection between the
modem unit 30 and the application unit 40.
[0033] According to one embodiment of the mobile communication unit
200 of FIG. 4, the first memory unit 32 is a flash memory.
[0034] According to one embodiment of the mobile communication unit
200 of FIG. 4, the modem unit 30 comprises at least a first
semiconductor die, the first semiconductor die comprising a power
management unit and the first memory unit. According to a further
embodiment thereof, the first memory unit can be an embedded flash
memory and the power management unit and the embedded flash memory
are integrated on the first semiconductor die. According to a
further embodiment thereof, the baseband unit 31 can be fabricated
on a second semiconductor die and the second semiconductor die can
be packaged together with the first semiconductor die within one
package. According to a further embodiment thereof, the modem unit
30 further comprises a radio frequency (RF) transceiver unit. The
radio frequency transceiver unit can be fabricated on a third
semiconductor die which can be packaged in its own package. The
radio frequency transceiver unit can also be fabricated together
with the baseband unit on the second semiconductor die. The second
semiconductor die can be packaged in its own package or it can be
packaged together with the first semiconductor die 1 in one single
package. These embodiments will be explained in more detail further
below in connection with FIG. 6.
[0035] Referring to FIG. 5, there is shown a schematic block
diagram of a mobile communication unit according to one embodiment.
The mobile communication unit 300 comprises a modem unit 50 and an
application unit 60 comprising a memory unit 61, said memory unit
61 being accessible by the modem unit 50 and the application unit
60.
[0036] The modem unit 50 and the application unit 60 can be
electrically coupled with each other by use of one or several
uni-directional electrical connection lines, each one for
transmitting signals and messages in one direction, respectively.
In principle it is also possible to provide a bi-directional
electrical connection line, in particular one single bi-directional
electrical connection line as the electrical connection between the
modem unit 50 and the application unit 60.
[0037] According to one embodiment of the mobile communication unit
300 of FIG. 5, the modem unit 50 comprises a baseband unit, wherein
the baseband unit comprises a central processing unit (CPU),
wherein an operation program for operating the central processing
unit is stored in the memory unit 61.
[0038] According to an embodiment of the mobile communication unit
300 of FIG. 5, the modem unit 50 comprises a first semiconductor
die comprising a power management unit and an embedded flash
memory. According to a further embodiment thereof, one or more of
calibration data, network parameters, security data and debug data
are stored in the embedded flash memory. According to another
embodiment the modem unit 50 further comprises a baseband unit
which may also be arranged or integrated on the semiconductor
die.
[0039] Referring to FIG. 6, there is shown a schematic block
diagram of a mobile communication unit according to one embodiment.
The mobile communication unit 400 comprises a modem unit or modem
sub-system 410 and an application unit or application sub-system
420. The modem unit 410 and the application unit 420 are
electrically coupled to each other by means of one or several
uni-directional electrical connection lines, each one for
transmitting signals and messages in one direction, respectively.
In principle it is also possible to provide a bi-directional
electrical connection line, in particular one single bi-directional
electrical connection line as the electrical connection between the
modem unit 410 and the application unit 420. The modem unit 410
comprises a combined power management and storage unit 411. The
power management and storage unit 411 is comprised of a first
semiconductor die comprising a power management unit 411.1 and an
embedded flash memory 411.2. The modem unit 410 further comprises a
baseband unit 412 which is electrically coupled to the power
management and storage unit 411 by means of one or several
uni-directional electrical connection lines as denoted with the
reference sign 413, wherein each one of the lines is for
transmitting signals and messages in one direction, respectively.
In principle it is also possible to provide a bi-directional
electrical connection line, in particular one single bi-directional
electrical connection line as the electrical connection between the
baseband unit 412 and the power management and storage unit 411.
The baseband unit 412 comprises a central processing unit 412.1.
The modem unit 410 further comprises a radio frequency transceiver
unit 414 which is electrically connected to the baseband unit 412
by means of one or several uni-directional electrical connection
lines as denoted with the reference sign 415, wherein each one of
the lines is for transmitting signals and messages in one
direction, respectively. In principle it is also possible to
provide a bi-directional electrical connection line, in particular
one single bi-directional electrical connection line as the
electrical connection between the baseband unit 412 and the RF
transmission unit 414.
[0040] The application unit 420 comprises an application processor
421 which is electrically connected to the baseband unit 412 of the
modem unit 410 by means of the electrical connection 430. The
application unit 420 further comprises a memory unit 422 which is
electrically connected to the application processor 421 by means of
one or several uni-directional electrical connection lines as
denoted with the reference sign 423, wherein each one of the lines
is for transmitting signals and messages in one direction,
respectively. In principle it is also possible to provide a
bi-directional electrical connection line, in particular one single
bi-directional electrical connection line as the electrical
connection between the memory unit 422 and the application
processor 421. The memory unit 422 can comprise a non-volatile
memory like, for example, a flash memory like a NAND flash memory
or a NOR flash memory or a PCM (phase change memory), and it can
further comprise a volatile memory like, for example, an SDRAM
memory. The memory unit 422, in one particular example, the
non-volatile memory, stores the operation program of the central
processing unit 412.1 of the baseband unit 412 of the modem unit
410. The embedded flash memory 411.2 of the combined power
management and storage unit 411 of the modem unit 410 stores one or
more of radio frequency calibration data, network parameters,
security data and debug data of the communication network. The
application unit 420 further comprises an application power
management unit 424.
[0041] In one embodiment of the combined power management and
storage unit 411, the embedded flash memory 411.2 is integrated
together with the power management unit 411.1 on one semiconductor
die as made possible by process technologies such as, for example,
a 130 nm CMOS technology which combines high-voltage and
high-current support with digital (130 nm) and low-density
non-volatile memory properties.
[0042] One advantage of the mobile communication unit 400 of FIG. 6
is that the modem unit 410 never needs to access the flash memory
unit ("system flash") of the memory unit 422 of the application
unit 420 after the boot sequence of the central processing unit
412.1 of the baseband unit 412 has been completed. The flash memory
unit of the memory unit 422 contains the operation program of the
central processing unit 412.1 of the baseband unit 412 and it can
be accessed via driver software running on the central processing
unit of the application processor 421. Therefore only at the
beginning, i.e. during a boot period the baseband unit 412 will
access to the flash memory unit of the memory unit 422 via the
application processor 421 in order to copy the operation program of
its central processing unit 412.1, as stored in the flash memory
unit of the memory unit 422, to a volatile memory (RAM) that is
comprised in the modem unit 410 or that is comprised in the memory
unit 422.
[0043] A further advantage of the mobile communication unit 400 of
FIG. 6 is that radio frequency calibration data can be stored
locally in the power management and storage unit 411, i.e. in the
embedded flash memory 411.2 contained therein. This means that
during production of the modem unit 410, radio frequency
calibration data can be stored on the modem sub-system so that the
modem unit 410 can be produced independent from the production of
the application unit 420.
[0044] According to one embodiment it is one advantageous aspect of
the mobile communication unit 400 of FIG. 6 that the modem unit's
410 code and non-volatile data (such as calibration data and
network parameters) are partitioned between the flash memory 411.2
contained in the power management and storage unit 411 of the modem
sub-system 410 and the memory unit 422 of the application
sub-system 420, in particular the flash memory contained
therein.
[0045] According to one embodiment shown in FIG. 6, the modem unit
410 is comprised of a 2-chip-modem sub-system wherein the term
"chip" has the meaning of a semiconductor package. The 2-chip-modem
sub-system comprises a first semiconductor package combining the
baseband processor 412 and the power management and storage unit
411 containing the embedded flash memory 411.2, and a second
semiconductor package containing the radio frequency transceiver
unit 414. In this embodiment each one of the power management and
storage unit 411, the baseband processor 412 and the RF transceiver
unit 414 is fabricated on its own semiconductor die,
respectively.
[0046] According to one embodiment of the mobile communication unit
as shown in FIG. 6, the modem unit 410 is comprised of a
single-chip modem sub-system comprising one single semiconductor
package combining the baseband processor 412, the radio frequency
transceiver 414 and the power management and storage unit 411 which
contains the flash memory 411.2. According to one embodiment
thereof the baseband processor 412, the radio frequency transceiver
414 and the power management and storage unit 411 are each
fabricated on a separate semiconductor die. In another embodiment
the baseband processor 412 and the radio frequency transceiver 414
are integrated together on a first semiconductor die and the power
management and storage unit 411 is integrated together with the
flash memory 411.2 on a second semiconductor die.
[0047] According to one embodiment of the mobile communication unit
of FIG. 6, the modem unit 410 is comprised of a 3-chip-modem
sub-system including a first semiconductor package that combines
the baseband processor 412 and the power management and storage
unit 411 which contains the flash memory unit 411.2, a second
semiconductor package comprising the radio frequency transceiver
unit 414, and a third semiconductor package comprising a random
access memory (RAM) for the following purpose. During boot time of
the central processing unit 412.1 of the baseband unit 412, the
baseband unit 412 accesses the memory unit 422 of the application
unit 420 via the application processor 421 by copying code out the
memory unit 422. The code can then be copied to the RAM memory as
arranged on the third semiconductor package of the modem unit 410
and the code can be used for loading the operational program into
the CPU.
[0048] Referring to FIG. 7, there is shown a flow diagram of one
embodiment of a method for producing a mobile communication unit.
While the exemplary method is illustrated and described below as a
series of acts or events, it will be appreciated that the present
invention is not limited by the illustrated ordering of such acts
or events. For example, some acts may occur in different orders
and/or concurrently with other acts or events apart from those
illustrated and/or described herein, in accordance with the
invention. In addition, not all illustrated steps may be required
to implement a methodology in accordance with the present
invention. The method comprises storing one or more of calibration
data, network parameters, security and debug data in a first memory
unit at s1. The method further comprises fabricating a modem unit,
wherein the modem unit comprises a first memory unit and a baseband
unit, and wherein the baseband unit comprises a central processing
unit at s2. The method still further comprises storing an operation
program for the operation of the central processing unit in a
second memory unit at s3, and fabricating an application unit,
wherein the application unit comprises the second memory unit.
[0049] According to one embodiment of the method of FIG. 7, the
method further comprises fabricating a semiconductor die comprising
a power management unit and the first memory unit.
[0050] According to one embodiment of the method of FIG. 7, the
method further comprises fabricating a semiconductor die comprising
a power management unit, the first memory unit and the baseband
unit.
[0051] It is to be understood that the above description is
intended to be illustrative and not restrictive. The application is
intended to cover any variations of the invention. The scope of the
invention includes any other embodiments and applications in which
the above structures and methods may be used. The scope of the
invention should therefore be determined with reference to the
appended claims along with the scope of equivalence to which such
claims are entitled.
[0052] It is emphasized that the abstract is provided to comply
with 37 CFR. Section 1.72(b) requiring an abstract that will allow
the reader to quickly ascertain the nature and gist of a technical
disclosure. It is submitted with the understanding that it will not
be used to interpret or limit the scope of meaning of the
claims.
* * * * *