U.S. patent application number 13/342409 was filed with the patent office on 2012-05-03 for high density data storage medium, method and device.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Richard Anthony DiPietro, Urs T. Duerig, Jane Elizabeth Frommer, Bernd Walter Gotsmann, Erik Christopher Hagberg, James Lupton Hedrick, Armin W. Knoll, Teddie Peregrino Magbitang, Robert Dennis Miller, Russell Clayton Pratt, Charles Gordon Wade.
Application Number | 20120106314 13/342409 |
Document ID | / |
Family ID | 39584926 |
Filed Date | 2012-05-03 |
United States Patent
Application |
20120106314 |
Kind Code |
A1 |
DiPietro; Richard Anthony ;
et al. |
May 3, 2012 |
HIGH DENSITY DATA STORAGE MEDIUM, METHOD AND DEVICE
Abstract
A composition of matter for the recording medium of nanometer
scale thermo-mechanical information storage devices and a nanometer
scale thermo-mechanical information storage device. The composition
includes: one or more polyaryletherketone polymers, each of the one
or more polyaryletherketone polymers having two terminal ends, each
terminal end having two or more phenylethynyl moieties. The one or
more polyaryletherketone polymers are thermally cured and the
resulting cross-linked polyaryletherketone resin used as the
recording layers in atomic force data storage devices.
Inventors: |
DiPietro; Richard Anthony;
(Campbell, CA) ; Duerig; Urs T.; (Rueschlikon,
CH) ; Frommer; Jane Elizabeth; (San Jose, CA)
; Gotsmann; Bernd Walter; (Horgan, CH) ; Hagberg;
Erik Christopher; (Evansville, IN) ; Hedrick; James
Lupton; (Pleasanton, CA) ; Knoll; Armin W.;
(Rueschlikon, CH) ; Magbitang; Teddie Peregrino;
(San Jose, CA) ; Miller; Robert Dennis; (San Jose,
CA) ; Pratt; Russell Clayton; (Los Gatos, CA)
; Wade; Charles Gordon; (Los Gatos, CA) |
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
|
Family ID: |
39584926 |
Appl. No.: |
13/342409 |
Filed: |
January 3, 2012 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
13016492 |
Jan 28, 2011 |
8125882 |
|
|
13342409 |
|
|
|
|
12056477 |
Mar 27, 2008 |
7939620 |
|
|
13016492 |
|
|
|
|
11618945 |
Jan 2, 2007 |
7558186 |
|
|
12056477 |
|
|
|
|
Current U.S.
Class: |
369/288 ;
G9B/3.103 |
Current CPC
Class: |
C08G 65/4012 20130101;
B82Y 10/00 20130101; C08G 65/46 20130101; G11B 11/007 20130101;
G11B 9/149 20130101 |
Class at
Publication: |
369/288 ;
G9B/3.103 |
International
Class: |
G11B 3/70 20060101
G11B003/70 |
Claims
1. A method, for use with a layer of polyaryletherketone resin on a
substrate, said layer of polyaryletherketone resin formed from a
polyaryletherketone copolymer, said polyaryletherketone polymer
having two terminal ends, each terminal end having two or more
phenylethynyl moieties, repeat units of said polyaryletherketone
copolymer backbone containing ketone groups, said
polyaryletherketone resin thermally cross-linked by cyclo-addition
reactions of said phenylethynyl moieties of said
polyaryletherketone copolymer, said method comprising: heating and
bringing a thermo-mechanical device, while heated, into proximity
with said layer of polyaryletherketone resin to write information
into said layer of polyaryletherketone resin.
2. The method of claim 1, further including: bringing said
thermo-mechanical device, when unheated, into proximity with said
layer of polyaryletherketone resin to read information stored in
said layer of polyaryletherketone resin.
3. The method of claim 1, further including: heating and bringing
said thermo-mechanical device into contact with said layer of
polyaryletherketone resin to erase information from said layer of
polyaryletherketone resin.
4. The method of claim 1, wherein said thermal-mechanical probe is
heated to a temperature of greater than about 100.degree. C.
5. The method of claim 4, including: bringing said
thermal-mechanical probe into proximity with one or more of said
deformed regions to read information previously written in said
layer of polyaryletherketone resin.
6. The method of claim 1, wherein said polyaryletherketone
copolymer has the structure: ##STR00006## wherein R.sup.1 is
##STR00007## wherein R.sup.2 is selected from the group consisting
of ##STR00008## wherein R.sup.3 is selected from the group
consisting of ##STR00009## and wherein n is an integer from about 5
to about 50.
7. The method of claim 1, wherein said layer of polyaryletherketone
resin has a thickness between about 10 nm and about 500 nm.
8. The method of claim 1, wherein said polyaryletherketone resin is
cross-linked by said phenylethynyl moieties.
9. The method of claim 1, wherein repeat units of backbones of said
polyaryletherketone copolymer contain ketone groups.
10. The method of claim 1, wherein said polyaryletherketone resin
has a glass transition temperature of between about 100.degree. C.
and about 180.degree. C.
11. The method of claim 1, wherein said polyaryletherketone resin
has a glass transition temperature of less than about 180.degree.
C.
12. The method of claim 1, wherein said polyaryletherketone
copolymer has a molecular weight between about 3,000 Daltons and
about 10,000 Daltons.
13. The method of claim 1, wherein said polyaryletherketone
copolymer has a molecular weight between about 4,000 Daltons and
about 5,000 Daltons.
14. The method of claim 1, wherein said polyaryletherketone
copolymer has the structure: ##STR00010## where n is an integer
from about 5 to about 50.
Description
RELATED APPLICATIONS
[0001] This application is a division of U.S. patent application
Ser. No. 13/016,492 filed on Jan. 28, 2011 which is a division of
U.S. patent application Ser. No. 12/056,477 filed on Mar. 27, 2008
which is a continuation of U.S. patent application Ser. No.
11/618,945 filed on Jan. 2, 2007 now U.S. Pat. No. 7,558,186 issued
Jul. 7, 2009.
FIELD OF THE INVENTION
[0002] The present invention relates to the field of high-density
data storage and read-back and more specifically to a data storage
and read-back medium, a data storage and read-back system, and a
data storage and read-back method.
BACKGROUND OF THE INVENTION
[0003] Current data storage and imaging methodologies operate in
the micron regime. In an effort to store ever more information in
ever-smaller spaces, data storage density has been increasing. In
an effort to reduce power consumption and increase the speed of
operation of integrated circuits, the lithography used to fabricate
integrated circuits is pressed toward smaller dimensions and denser
imaging. As data storage size increases and density increases and
integrated circuit densities increase, there is a developing need
for compositions of matter for the storage media that operate in
the nanometer regime.
SUMMARY OF THE INVENTION
[0004] A first aspect of the present invention is a composition of
matter, comprising: one or more polyaryletherketone polymers, each
of the one or more polyaryletherketone polymers having two terminal
ends, each terminal end having two or more phenylethynyl
moieties.
[0005] A second aspect of the present invention is a method,
comprising: forming a layer of the one or more polyaryletherketone
polymers of the first aspect on a substrate; thermally curing the
one or more polyaryletherketone polymers of the first aspect to
form a polyaryletherketone resin, the polyaryletherketone resin
cross-linked by cyclo-addition reactions of the phenylethynyl
moieties; heating and bringing a thermo-mechanical device into
contact with the polyaryletherketone resin to write information
into the polyaryletherketone resin; bringing the thermo-mechanical
device, when unheated, into proximity to the polyaryletherketone
resin to read information stored in the polyaryletherketone resin;
and heating and bringing the thermo-mechanical device into
proximity with the polyaryletherketone resin to erase information
from the polyaryletherketone resin.
[0006] A third aspect of the present invention is a method,
comprising: forming a layer of polyaryletherketone resin on a
substrate by thermally curing one or more polyaryletherketone
polymers, each of the one or more polyaryletherketone polymers
having two terminal ends, each terminal end having two or more
phenylethynyl moieties, and bringing a thermal-mechanical probe
heated to a temperature of greater than about 100.degree. C. into
proximity with the layer of a polyaryletherketone resin multiple
times to induce deformed regions at points in the layer of the
polyaryletherketone resin, thereby writing information in the layer
of the resin.
[0007] A fourth aspect of the present invention is a data storage
device, comprising: a recording medium comprising a layer of
polyaryletherketone resin overlying a substrate, in which
topographical states of the layer of the polyaryletherketone resin
represent data, the polyaryletherketone resin comprising thermally
cured one or more polyaryletherketone polymers, each of the one or
more polyaryletherketone polymers having two terminal ends, each
terminal end having two or more phenylethynyl moieties; a
read-write head having one or more thermo-mechanical probes, each
of the one or more thermo-mechanical probes including a resistive
region for locally heating a tip of the thermo-mechanical probe in
response to electrical current being applied to the one or more
thermo-mechanical probes; and a scanning system for scanning the
read-write head across a surface of the recording medium.
BRIEF DESCRIPTION OF DRAWINGS
[0008] The features of the invention are set forth in the appended
claims. The invention itself, however, will be best understood by
reference to the following detailed description of an illustrative
embodiment when read in conjunction with the accompanying drawings,
wherein:
[0009] FIGS. 1A through 1C illustrate the structure and operation
of a tip assembly for a data storage device including the data
storage medium according to the embodiments of the present
invention;
[0010] FIG. 2 is an isometric view of a local probe storage array
including the data storage medium according to the embodiments of
the present invention; and
[0011] FIG. 3 is a diagram illustrating formation of a cured
polyaryletherketone resin by cross-linking of reactive endgroups of
a polyaryletherketone polymer according to embodiments of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0012] FIGS. 1A through 1C illustrate the structure and operation
of a tip assembly 100 for a data storage device including the data
storage medium according to the embodiments of the present
invention. In FIG. 1A, probe tip assembly 100 includes a U-shaped
cantilever 105 having flexible members 105A and 105B connected to a
support structure 110. Flexing of members 105A and 105B provides
for substantial pivotal motion of cantilever 105 about a pivot axis
115. Cantilever 105 includes an indenter tip 120 fixed to a heater
125 connected between flexing members 105A and 105B. Flexing
members 105A and 105B and heater 125 are electrically conductive
and connected to wires (not shown) in support structure 110. In one
example, flexing members 105A and 105B and indenter tip 120 are
formed of highly-doped silicon and have a low electrical
resistance, and heater 125 is formed of lightly doped silicon
having a high electrical resistance sufficient to heat indenter tip
120, in one example, to between about 100.degree. C. and about
500.degree. C. when current is passed through heater 125. The
electrical resistance of heater 125 is a function of
temperature.
[0013] Also illustrated in FIG. 1A is a storage medium (or a
recording medium) 130 comprising a substrate 130A, and a cured
polyaryletherketone resin layer 130B. In one example, substrate
130A comprises silicon. Cured polyaryletherketone resin layer 130B
may be formed by solution coating, spin coating, dip coating or
meniscus coating polyaryletherketone polymer and reactive diluent
formulations and performing a curing operation on the resultant
coating. In one example, cured polyaryletherketone resin layer 130B
has a thickness between about 10 nm and about 500 nm. The
composition of cured polyaryletherketone resin layer 130B is
described infra. An optional penetration stop layer 130C is shown
between cured polyaryletherketone resin layer 130B and substrate
130A. Penetration stop layer 130C limits the depth of penetration
of indenter tip 120 into cured polyaryletherketone resin layer
130B.
[0014] Turning to the operation of tip assembly 100, in FIG. 1A, an
indentation 135 is formed in cured polyaryletherketone resin layer
130B by heating indenter tip 120 to a writing temperature T.sub.W
by passing a current through cantilever 105 and pressing indenter
tip 120 into cured polyaryletherketone resin layer 130B. Heating
indenter tip 120 allows the tip to penetrate the cured
polyaryletherketone resin layer 130B forming indentation 135, which
remains after the tip is removed. In a first example, the cured
polyaryletherketone resin layer 130B is heated by heated indenter
tip 120, the temperature of the indenter tip being not greater than
about 500.degree. C., to form indentation 135. In a second example,
the cured polyaryletherketone resin layer 130B is heated by heated
indenter tip 120, the temperature of the indenter tip being not
greater than about 400.degree. C., to form indentation 135. In a
third example, the cured polyaryletherketone resin layer 130B is
heated by heated indenter tip 120, the temperature of the indenter
tip being between about 200.degree. C. and about 500.degree. C., to
form indentation 135. In a fourth example, the cured
polyaryletherketone resin layer 130B is heated by heated indenter
tip 120, the temperature of the indenter tip being between about
100.degree. C. and about 400.degree. C., to form indentation 135.
As indentations 135 are formed, a ring 135A of cured
polyaryletherketone resin is formed around the indentation.
Indentation 135 represents a data bit value of "1", a data bit
value of "0" being represented by an absence of an indentation.
Indentations 135 are nano-scale indentations (several to several
hundred nanometers in width).
[0015] FIGS. 1B and 1C illustrate reading the bit value. In FIGS.
1B and 1C, tip assembly 100 is scanned across a portion of cured
polyaryletherketone resin layer 130B. When indenter tip 120 is over
a region of cured polyaryletherketone resin layer 130B not
containing an indentation, heater 125 is a distance D1 from the
surface of the cured polyaryletherketone resin layer (see FIG. 1B).
When indenter tip 120 is over a region of cured polyaryletherketone
resin layer 130B containing an indentation, heater 125 is a
distance D2 from the surface of the cured polyaryletherketone resin
layer (see FIG. 1C) because the tip "falls" into the indentation.
D1 is greater than D2. If heater 125 is at a temperature T.sub.R
(read temperature), which is lower than T.sub.W (write
temperature), there is more heat loss to substrate 130A when
indenter tip 120 is in an indentation than when the tip is not.
This can be measured as a change in resistance of the heater at
constant current, thus "reading" the data bit value. It is
advantageous to use a separate heater for reading, which is
mechanically coupled to the tip but thermally isolated from the
tip. A typical embodiment is disclosed in Patent Application EP
05405018.2, 13 Jan. 2005.
[0016] "Erasing" (not shown) is accomplished by positioning
indenter tip 120 in close proximity to indentation 135, heating the
tip to a temperature T.sub.E (erase temperature), and applying a
loading force similar to writing, which causes the previously
written indent to relax to a flat state whereas a new indent is
written slightly displaced with respect to the erased indent. The
cycle is repeated as needed for erasing a stream of bits whereby an
indent always remains at the end of the erase track. T.sub.E is
typically greater than T.sub.W. The erase pitch is typically on the
order of the rim radius. In a first example, the cured
polyaryletherketone resin layer 130B is heated by heated indenter
tip 120, the temperature of the indenter tip is not greater than
about 500.degree. C., and the erase pitch is 10 nm to eliminate
indentation 135. In a second example, the cured polyaryletherketone
resin layer 130B is heated by heated indenter tip 120, the
temperature of the indenter tip is not greater than about
400.degree. C., and the erase pitch is 10 nm to eliminate
indentation 135. In a third example, the cured polyaryletherketone
resin layer 130B is heated by heated indenter tip 120, the
temperature of the indenter tip is between about 200.degree. C. and
about 400.degree. C., and the erase pitch is 10 nm to eliminate
indentation 135. In a fourth example, the cured polyaryletherketone
resin layer 130B is heated by heated indenter tip 120, the
temperature of the indenter tip is between about 200.degree. C. and
about 500.degree. C., and the erase pitch is 10 nm to eliminate
indentation 135.
[0017] FIG. 2 is an isometric view of a local probe storage array
140 including the data storage medium according to the embodiments
of the present invention. In FIG. 2, local probe storage array 140
includes substrate 145 having a cured polyaryletherketone resin
layer 150 (similar to cured polyaryletherketone resin layer 130B of
FIGS. 1A, 1B and 1C), which acts as the data-recording layer. An
optional tip penetration stop layer may be formed between cured
polyaryletherketone resin layer 150 and substrate 145. In one
example, substrate 145 comprises silicon. Cured polyaryletherketone
resin layer 150 may be formed by solution coating, spin coating,
dip coating or meniscus coating uncured polyaryletherketone resin
formulations and performing a curing operation on the resultant
coating. In one example, cured polyaryletherketone resin layer 150
has a thickness between about 10 nm and about 500 nm and a root
mean square surface roughness across a writeable region of cured
polyaryletherketone resin layer 150 of less than about 1.0 nm
across the cured polyaryletherketone resin layer. The composition
of cured polyaryletherketone resin layer 150 is described infra.
Positioned over cured polyaryletherketone resin layer 150 is a
probe assembly 155 including an array of probe tip assemblies 100
(described supra). Probe assembly 155 may be moved in the X, Y and
Z directions relative to substrate 145 and cured
polyaryletherketone resin layer 150 by any number of devices as is
known in the art. Switching arrays 160A and 160B are connected to
respective rows (X-direction) and columns (Y-direction) of probe
tip assemblies 100 in order to allow addressing of individual probe
tip assemblies. Switching arrays 160A and 160B are connected to a
controller 165 which includes a write control circuit for
independently writing data bits with each probe tip assembly 100, a
read control circuit for independently reading data bits with each
probe tip assembly 100, an erase control circuit for independently
erasing data bits with each probe tip assembly 100, a heat control
circuit for independently controlling each heater of each of the
probe tip assembles 100, and X, Y and Z control circuits for
controlling the X, Y and Z movement of probe assembly 155. The Z
control circuit controls a contact mechanism (not shown) for
contacting the cured polyaryletherketone resin layer 150 with the
tips of the array of probe tip assemblies 100.
[0018] During a write operation, probe assembly 155 is brought into
proximity to cured polyaryletherketone resin layer 150 and probe
tip assemblies 100 are scanned relative to the cured
polyaryletherketone resin layer. Local indentations 135 are formed
as described supra. Each of the probe tip assemblies 100 writes
only in a corresponding region 170 of cured polyaryletherketone
resin layer 150. This reduces the amount of travel and thus time
required for writing data.
[0019] During a read operation, probe assembly 155 is brought into
proximity to cured polyaryletherketone resin layer 150 and probe
tip assemblies 100 are scanned relative to the cured
polyaryletherketone resin layer. Local indentations 135 are
detected as described supra. Each of the probe tip assemblies 100
reads only in a corresponding region 170 of cured
polyaryletherketone resin layer 150. This reduces the amount of
travel and thus the time required for reading data.
[0020] During an erase operation, probe assembly 155 is brought
into proximity to cured polyaryletherketone resin layer 150, and
probe tip assemblies 100 are scanned relative to the cured
polyaryletherketone resin layer. Local indentations 135 are erased
as described supra. Each of the probe tip assemblies 100 reads only
in a corresponding region 170 of cured polyaryletherketone resin
layer 150. This reduces the amount of travel and thus time required
for erasing data.
[0021] Additional details relating to data storage devices
described supra may be found in the articles "The Millipede--More
than one thousand tips for future AFM data storage," P. Vettiger et
al., IBM Journal of Research and Development. Vol. 44 No. 3, May
2000 and "The Millipede--Nanotechnology Entering Data Storage," P.
Vettiger et al., IEEE Transaction on Nanotechnology, Vol. 1, No, 1,
Mar. 2002. See also U.S. Patent Publication 2005/0047307, Published
Mar. 3, 2005 to Frommer et al. and U.S. Patent Publication
2005/0050258, Published Mar. 3, 2005 to Frommer et al., both of
which are hereby included by reference in their entireties.
[0022] Turning to the composition of cured polyaryletherketone
resin layer 130B of FIGS. 1A through 1C, it should be understood
that for the purposes of the present invention curing a polymer
implies cross-linking the polymer to form a cross-linked polymer or
resin.
[0023] The polyaryletherketone resin medium or imaging layer of the
embodiments of the present invention advantageously meets certain
criteria. These criteria include high thermal stability to
withstand millions of write and erase events, low wear properties
(little or no pickup of material by tips), low abrasion (tips do
not easily wear out), low viscosity for writing, glassy character
with no secondary relaxations for long data bit lifetime, and shape
memory for erasability.
[0024] Cured polyaryletherketone resins according to embodiments of
the present invention have high temperature stability while
maintaining a low glass transition temperature (Tg). In a first
example, cured polyaryletherketone resins according to embodiments
of the present invention have a Tg of less than about 180.degree.
C. In a second example, cured polyaryletherketone resins according
to embodiments of the present invention have a Tg of between about
100.degree. C. and about 180.degree. C.
[0025] The glass transition temperature should be adjusted for good
write performance. To optimize the efficiency of the write process
there should be a sharp transition from the glassy state to the
rubbery state. A sharp transition allows the cured resin to flow
easily when a hot tip is brought into contact and quickly return to
the glassy state once the hot tip is removed. However, too high a
T.sub.g leads to high write currents and damage to the probe tip
assemblies described supra.
[0026] A formulation of polyaryletherketone polymer according to
embodiments of the present invention comprises one or more
polyaryletherketone polymers. Each of the polyaryletherketone
polymers has the structure:
##STR00001##
wherein R.sup.1 is selected from the group consisting of:
##STR00002##
wherein R.sup.2 is selected from the group consisting of:
##STR00003##
wherein R.sup.3 is selected from the group consisting of
poly(arylacetylenes), poly(phenylethynyls),
##STR00004##
and wherein n is a integer from about 5 to about 50.
[0027] In a first example, polyaryletherketone polymers according
to embodiments of the present invention advantageously have a
molecular weight between about 3,000 Daltons and about 10,000
Daltons. In a second example, polyaryletherketone polymers
according to embodiments of the present invention advantageously
have a molecular weight between about 4,000 Daltons and about 5,000
Daltons.
[0028] The endgroups R.sup.3 react during thermal curing with each
other to cross-link the polyaryletherketone polymers into a
polyaryletherketone resin by cyclo-addition. Note endgroups (XV)
and (XVI) are examples of an endgroup having two phenylethynyl
linkages that provide two cross-linking sites (as illustrated in
FIG. 3). Endgroup (XVII) is an example of a reactive endgroup
having four phenylethynyl linkages that provides four cross-linking
sites. Other phenylethynyl containing endgroups having two or more
phenylethynyl moieties may be substituted for endgroups (XIV),
(XVI) and (XVII).
[0029] FIG. 3 is a diagram illustrating formation of a cured
polyaryletherketone resin by cross-linking of reactive endgroups of
a polyaryletherketone polymer according to embodiments of the
present invention. In FIG. 3, a straight chain polyaryletherketone
polymer 250 of repeating units n and having two endgroups 255, each
having two phenylethynyl moieties 260 is heat cured to produce a
cross-linked polyaryletherketone resin 265. In polyaryletherketone
resin 265, polyaryletherketone polymers 250 are linked to each
other through respective phenylethynyl moieties 260 of reactive
endgroups 255. Cross-linking of polyaryletherketone polymers 250 in
polyaryletherketone resin 265 is by cyclo-addition of the
phenylethynyl moieties 260.
[0030] In FIG. 3, only cross-linking of two phenylethynyl groups on
the ends of two different polymer has been illustrated. It should
be understood that three or more phenylethynyl groups, each on a
end of a different polymer, can react by cascading cyclo-addition
so that three or more polymer ends are cross-linked at a single
point.
SYNTHESIS EXAMPLES
[0031] All materials were purchased from Aldrich and used without
further purification unless otherwise noted.
Synthesis of the Reactive Endgroup
3,5-bis(4-(phenylethynyl)phenyl)phenol (Structure XV):
[0032] Synthesis of 4-(phenylethynyl)-1-bromobenzene (JACS, 2004,
126, 4540): 1-Bromo-4-iodobenzene (20.0 g, 70.7 mmol),
bis(triphenylphospine)palladium(II) dichloride
(PdCl.sub.2(PPh.sub.3).sub.2) (250 mg), and CuI (68 mg) were
suspended in 50 mL triethylamine (NEt.sub.3) and 100 mL
tetrahydrofuran (THF). The suspension was treated with 3 cycles of
evacuation and refilling with N.sub.2. Phenylacetylene (7.21 g,
7.75 mL, 1.0 eq) was added in 0.5 mL portions every 5 minutes to
the stirred suspension. The solution was then stirred at room
temperature for 22 hours. The solvents were then evaporated.
Methylene chloride (100 mL) and 1 M HCl (aqueous) (50 mL) were
added, the organic layer was retained, and then was washed again
with 1 M HCl (aqueous) (50 mL) and 2.times.50 mL water, dried
(MgSO.sub.4), filtered, and the solvent evaporated in vacuum to
give 18 g of the title compound as a yellow solid, which was used
without further purification.
[0033] Synthesis of 4-(phenylethynyl)phenyl boronic acid (JACS,
2004, 126, 5798): In a flame-dried flask,
4-(phenylethynyl)-1-bromobenzene (15.0 g, 58.4 mmol) was dissolved
in dry THF (225 mL). The solution was treated with 3 cycles of
evacuation and refilling with N.sub.2, then chilled to -78.degree.
C. in a dry ice/acetone bath. To the stirred solution was added a
solution of n-butyllithium in hexanes (1.6 M, 40 mL, 1.1 eq) by
syringe over the course of 10 minutes. The resulting solution was
stirred for an additional 30 minutes before trimethylborate (9.77
mL, 9.1 g, 1.5 eq) was added slowly over 15 minutes. After stirring
for an additional 15 minutes, the cooling bath was removed and the
solution was allowed to warm to room temperature and stir for 16 h.
At this time, 2 M HCl (aqueous) (375 mL) was added, and the
biphasic system was stirred vigorously for 2 hours. Ethyl acetate
was added, and the organic layer was separated, dried (MgSO.sub.4),
filtered and evaporated. Methylene chloride (100 mL) was added to
the solid residue, which was crushed and mixed into a paste, then
filtered and washed with additional portions of methylene chloride
to give 8.5 g of the title compound as a white powder.
[0034] Synthesis of 3,5-bis(4-(phenylethynyl)phenyl)phenol:
4-(Phenylethynyl)phenyl boronic acid (4.65 g, 20.9 mmol) was
dissolved in 100 mL of toluene/ethanol (4:1 (v/v)),
3,5-dibromophenol (2.52 g, 10 mmol) was added, and then 20 mL of 2
M Na.sub.2CO.sub.3 (aqueous) was added. The resulting mixture was
treated with 3 cycles of evacuation and refilling with N.sub.2.
Solid tetrakis(triphenylphospine)palladium(II)
(Pd(PPh.sub.3).sub.4) (232 mg) was then added, followed by 3 more
cycles of evacuation and refilling with N.sub.2. The reaction
mixture was then heated to 85.degree. C. in an oil bath for 5
hours. The reaction was cooled, and water (100 mL) and methylene
chloride (100 mL) were added. The organic layer was separated,
washed with water (50 mL), then dried (MgSO.sub.4), filtered, and
evaporated. The crude product was purified by column chromatography
(silica, CH.sub.2Cl.sub.2) or alternately by trituration with
CH.sub.2Cl.sub.2 followed by filtration to give in either case
about 2.5 g of the title compound as a white solid.
[0035] Example synthesis of a polyaryletherketone polymer
(Structure XVIII):
##STR00005##
[0036] In a multi-necked flask equipped with a mechanical stirring
apparatus and a Dean-Stark trap, 4,4'-difluorobenzophenone (1.4187
g, 6.502 mmol), resorcinol (0.6658 g, 6.047 mmol),
3,5-bis(4-(phenylethynyl)phenyl)phenol (403.1 mg, 0.9037 mmol), and
potassium carbonate (3 g, 22 mmol) were suspended in a mixture of
DMF (10 mL) and toluene (20 mL). The reaction mixture was
vigorously stirred and heated to 130.degree. C. for 16 hours under
a slow flow of dry nitrogen, and toluene was removed periodically
via the Dean-Stark trap. At the end of the 16 hour period, the
temperature was increased to 150.degree. C. for another 8 hours.
The reaction was then cooled and the polymer was isolated by
multiple precipitations using THF and methanol. Molecular weights
were adjusted by using different proportions of monomers and
endcaps and several different molecular weight polymers were
prepared.
[0037] Thus, the embodiments of the present invention provide for
compositions of matter for the storage media that operate in the
nanometer regime.
[0038] The description of the embodiments of the present invention
is given above for the understanding of the present invention. It
will be understood that the invention is not limited to the
particular embodiments described herein, but is capable of various
modifications, rearrangements and substitutions as will now become
apparent to those skilled in the art without departing from the
scope of the invention. Therefore, it is intended that the
following claims cover all such modifications and changes as fall
within the true spirit and scope of the invention.
* * * * *