U.S. patent application number 12/938680 was filed with the patent office on 2012-05-03 for seal ring structure with polyimide layer adhesion.
This patent application is currently assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.. Invention is credited to Tzu-Wei Chiu.
Application Number | 20120104541 12/938680 |
Document ID | / |
Family ID | 45995746 |
Filed Date | 2012-05-03 |
United States Patent
Application |
20120104541 |
Kind Code |
A1 |
Chiu; Tzu-Wei |
May 3, 2012 |
SEAL RING STRUCTURE WITH POLYIMIDE LAYER ADHESION
Abstract
The present disclosure provides a semiconductor device,
including a substrate having a seal ring region and a circuit
region, a seal ring structure disposed over the seal ring region, a
first passivation layer disposed over the seal ring structure, the
first passivation layer having a first passivation layer aperture
over the seal ring structure, and a metal pad disposed over the
first passivation layer, the metal pad coupled to the seal ring
structure through the first passivation layer aperture and having a
metal pad aperture above the first passivation layer aperture. The
device further includes a second passivation layer disposed over
the metal pad, the second passivation layer having a second
passivation layer aperture above the metal pad aperture, and a
polyimide layer disposed over the second passivation layer, the
polyimide layer filling the second passivation layer aperture to
form a polyimide root at an exterior tapered edge of the polyimide
layer.
Inventors: |
Chiu; Tzu-Wei; (Hsin Chu,
TW) |
Assignee: |
TAIWAN SEMICONDUCTOR MANUFACTURING
COMPANY, LTD.
Hsin-Chu
TW
|
Family ID: |
45995746 |
Appl. No.: |
12/938680 |
Filed: |
November 3, 2010 |
Current U.S.
Class: |
257/508 ;
257/E21.158; 257/E27.01; 438/612 |
Current CPC
Class: |
H01L 23/3192 20130101;
H01L 23/10 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/508 ;
438/612; 257/E27.01; 257/E21.158 |
International
Class: |
H01L 27/04 20060101
H01L027/04; H01L 21/28 20060101 H01L021/28 |
Claims
1. A semiconductor device, comprising: a substrate having a seal
ring region and a circuit region; a seal ring structure disposed
over the seal ring region; a first passivation layer disposed over
the seal ring structure, the first passivation layer having a first
passivation layer aperture over the seal ring structure; a metal
pad disposed over the first passivation layer, the metal pad
coupled to the seal ring structure through the first passivation
layer aperture and having a metal pad aperture above the first
passivation layer aperture; a second passivation layer disposed
over the metal pad, the second passivation layer having a second
passivation layer aperture above the metal pad aperture; and a
polyimide layer disposed over the second passivation layer, the
polyimide layer filling the second passivation layer aperture to
form a polyimide root at an exterior tapered edge of the polyimide
layer.
2. The semiconductor device of claim 1, wherein the seal ring
structure is comprised of a stack of metal layers disposed around
the circuit region.
3. The semiconductor device of claim 1, wherein the metal pad
contacts a top metal layer of the seal ring structure exposed
through the first passivation layer aperture.
4. The semiconductor device of claim 1, wherein the first
passivation layer is formed of silicon oxide or silicon nitride and
the second passivation layer is formed of silicon nitride or
silicon oxide, respectively.
5. The semiconductor device of claim 1, wherein the first
passivation layer and the second passivation layer are comprised of
the same material.
6. The semiconductor device of claim 1, wherein the polyimide layer
has a thickness between about 5 .mu.m and about 10 .mu.m.
7. The semiconductor device of claim 1, wherein the exterior
tapered edge of the polyimide layer has an angle from horizontal
between about 70 degrees and about 75 degrees.
8. The semiconductor device of claim 1, further comprising: a
plurality of first passivation layer apertures over the seal ring
structure; a plurality of metal pad apertures above the plurality
of first passivation layer apertures; a plurality of second
passivation layer apertures above the plurality of metal pad
apertures; and a plurality of polyimide roots disposed above the
plurality of metal pad apertures.
9. A semiconductor device, comprising: a substrate having a seal
ring region and a circuit region; a seal ring structure disposed
over the seal ring region; a first passivation layer disposed over
the seal ring structure, the first passivation layer having a first
passivation layer aperture over the seal ring structure; a metal
pad disposed over the first passivation layer, the metal pad
coupled to the seal ring structure through the first passivation
layer aperture and having a metal pad aperture above the first
passivation layer aperture; a second passivation layer disposed
over the metal pad, the second passivation layer having a second
passivation layer aperture exposing the metal pad aperture; and a
polyimide layer disposed over the second passivation layer, the
polyimide layer filling the second passivation layer aperture to
form a polyimide root contacting the metal pad.
10. The semiconductor device of claim 9, wherein the seal ring
structure is comprised of a stack of metal layers disposed around
the circuit region.
11. The semiconductor device of claim 9, wherein the metal pad
contacts a top metal layer of the seal ring structure exposed
through the first passivation layer aperture.
12. The semiconductor device of claim 9, wherein the first
passivation layer is formed of silicon oxide or silicon nitride and
the second passivation layer is formed of silicon nitride or
silicon oxide, respectively.
13. The semiconductor device of claim 9, wherein the first
passivation layer and the second passivation layer are comprised of
the same material.
14. A method of fabricating a semiconductor device, the method
comprising: providing a substrate having a seal ring region and a
circuit region; forming a seal ring structure over the seal ring
region; forming a first passivation layer over the seal ring
structure; forming in the first passivation layer a first
passivation layer aperture over the seal ring structure; forming a
metal pad over the first passivation layer aperture to couple the
metal pad to the seal ring structure exposed through the first
passivation layer aperture; forming in the metal pad a metal pad
aperture above the first passivation layer aperture; forming a
second passivation layer over the metal pad; forming in the second
passivation layer a second passivation layer aperture over the
metal pad aperture; and forming a polyimide layer over the second
passivation layer, the polyimide layer filling the second
passivation layer aperture to form a polyimide root at an exterior
tapered edge of the polyimide layer.
15. The method of claim 14, wherein the polyimide layer is formed
to have a thickness between about 5 .mu.m and about 10 .mu.m.
16. The method of claim 14, wherein polyimide layer is formed to
have the exterior tapered edge of the polyimide layer at an angle
from horizontal between about 70 degrees and about 75 degrees.
17. The method of claim 14, further comprising: forming a plurality
of first passivation layer apertures over the seal ring structure;
forming a plurality of metal pad apertures above the plurality of
first passivation layer apertures; forming a plurality of second
passivation layer apertures above the plurality of metal pad
apertures; and forming a plurality of polyimide roots disposed
above the plurality of metal pad apertures.
18. A method of fabricating a semiconductor device, the method
comprising: providing a substrate having a seal ring region and a
circuit region; forming a seal ring structure over the seal ring
region; forming a first passivation layer over the seal ring
structure; forming in the first passivation layer a first
passivation layer aperture over the seal ring structure; forming a
metal pad over the first passivation layer aperture to couple the
metal pad to the seal ring structure exposed through the first
passivation layer aperture; forming in the metal pad a metal pad
aperture above the first passivation layer aperture; forming a
second passivation layer over the metal pad; forming in the second
passivation layer a second passivation layer aperture exposing the
metal pad aperture; and forming a polyimide layer over the second
passivation layer, the polyimide layer filling the second
passivation layer aperture and the metal pad aperture to form a
polyimide root contacting the metal pad.
19. The method of claim 18, wherein the metal pad contacts a top
metal layer of the seal ring structure exposed through the first
passivation layer aperture.
20. The method of claim 18, wherein the first passivation layer is
formed of silicon oxide or silicon nitride and the second
passivation layer is formed of silicon nitride or silicon oxide,
respectively.
Description
BACKGROUND
[0001] In the design and packaging of semiconductor integrated
circuits (ICs), there are several areas of concern. Moisture needs
to be prevented from entering the circuits because: (1) moisture
can be trapped in oxides and increase the dielectric constant
thereof; (2) moisture can create trapped charge centers in gate
oxides causing threshold voltage shifts in complementary
metal-oxide-semiconductor (CMOS) transistors; (3) moisture can
create interface states at the Si-gate oxide interface causing
degradation in the transistor lifetime through increased
hot-electron susceptibility; (4) moisture can cause corrosion of
the metal interconnect, reducing the reliability of the IC; and (5)
when trapped in Si-oxide, moisture can reduce the oxide mechanical
strength and the oxide may become more prone to cracking due to
tensile stress. Ionic contaminants can also cause damage to the IC
as they can diffuse rapidly in silicon oxide. For instance, ionic
contaminants can cause threshold voltage instability in CMOS
transistors and alter the surface potential of the Si surface in
the vicinity of the ionic contaminants. Dicing processes that
separate adjacent IC dies from one another may cause potential
damage to the IC. Furthermore, subsequent wet etch and/or curing
processes can cause layer peeling.
[0002] A seal ring has been used in the industry to protect the IC
from moisture degradation, ionic contamination, and dicing
processes, but improvement has been desirable. In particular,
subsequent wet etch and curing processes may cause peeling of a
polyimide layer over the seal ring resulting from stress inducement
and chemical attack (e.g., dilute HF) at the polyimide layer
interface. Accordingly, improved methods of semiconductor device
fabrication and devices fabricated by such methods are desired.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Aspects of the present disclosure are best understood from
the following detailed description when read with the accompanying
figures. It is emphasized that, in accordance with the standard
practice in the industry, various features are not drawn to scale.
In fact, the dimensions of the various features may be arbitrarily
increased or reduced for clarity of discussion.
[0004] FIG. 1 is a flowchart illustrating a method for fabricating
a semiconductor device with a seal ring structure having a
polyimide layer root for preventing polyimide layer peeling
according to various aspects of the present disclosure.
[0005] FIG. 2 is a flowchart illustrating another method for
fabricating a semiconductor device with a seal ring structure
having a polyimide layer root for preventing polyimide layer
peeling according to various aspects of the present disclosure.
[0006] FIG. 3 is a top plan view of an integrated circuit (IC) die
with a seal ring structure according to various aspects of the
present disclosure.
[0007] FIGS. 4 and 5 are cross-sectional views along line I-I' in
FIG. 3 of alternative seal ring sections according to various
aspects of the present disclosure.
[0008] FIGS. 6A-6D are cross-sectional views of the semiconductor
device of FIG. 4 at various stages of fabrication according to an
embodiment of the present disclosure.
[0009] FIGS. 7A-7D are cross-sectional views of the semiconductor
device of FIG. 5 at various stages of fabrication according to
another embodiment of the present disclosure.
DETAILED DESCRIPTION
[0010] It is to be understood that the following disclosure
provides many different embodiments, or examples, for implementing
different features of the invention. Specific examples of
components and arrangements are described below to simplify the
present disclosure. These are, of course, merely examples and are
not intended to be limiting. Moreover, the formation of a first
feature over, above, or on a second feature in the description that
follows may include embodiments in which the first and second
features are formed in direct contact, and may also include
embodiments in which additional features may be formed interposing
the first and second features, such that the first and second
features may not be in direct contact. Various features may be
arbitrarily drawn in different scales for simplicity and
clarity.
[0011] Referring to the figures, FIG. 1 illustrates a flowchart of
a method 100 for fabricating a semiconductor device with a seal
ring structure having a polyimide layer root for substantially
preventing polyimide layer peeling from subsequent wet etch and/or
curing processes according to various aspects of the present
disclosure. FIG. 2 is a flowchart illustrating a method 200 for
fabricating another semiconductor device with a seal ring structure
having a polyimide layer root for preventing polyimide layer
peeling according to various aspects of the present disclosure.
FIG. 3 is a top plan view of semiconductor devices 300A or 300B
including an integrated circuit (IC) die and a seal ring structure
around the IC die according to various aspects of the present
disclosure. FIGS. 4 and 5 are cross-sectional views along line I-I'
in FIG. 3 of alternative seal ring sections according to various
aspects of the present disclosure. FIGS. 6A-6D are cross-sectional
views of the semiconductor device of FIG. 4 at various stages of
fabrication according to an embodiment of the present disclosure.
FIGS. 7A-7D are cross-sectional views of the semiconductor device
of FIG. 5 at various stages of fabrication according to another
embodiment of the present disclosure.
[0012] It is noted that similar features may be similarly numbered
for the sake of simplicity and clarity. It is further noted that
part of the semiconductor device 300A/300B may be fabricated with a
CMOS process flow. Accordingly, it is understood that additional
processes may be provided before, during, and after the method 100
of FIG. 1 and/or the method 200 of FIG. 2, and that some other
processes may only be briefly described herein. The semiconductor
device 300A/300B may be fabricated to include a backside
illuminated (BSI) device having an interlayer dielectric (ILD) such
as a low-k inter-metal dielectric (IMD) in another example.
[0013] Referring now to FIG. 1, method 100 begins with block 102 in
which a semiconductor substrate is provided having a seal ring
region and a circuit region. In an embodiment, the seal ring region
is formed around the circuit region, and the seal ring region is
for forming a seal ring structure thereon and the circuit region is
for at least forming a transistor device therein. The method 100
continues with block 104 in which an integrated circuit is formed
over the circuit region and a seal ring structure is formed over
the seal ring region. The method 100 continues with block 106 in
which a first passivation layer is formed over the seal ring
structure in the seal ring region, and with block 108 in which a
first passivation layer aperture is etched in the first passivation
layer over the seal ring structure. In one embodiment, the first
passivation layer aperture is adjacent to an exterior side of the
seal ring structure. The method continues with block 110 in which a
metal pad is formed over the first passivation layer aperture to
couple the metal pad to the seal ring structure, and at block 112,
a metal pad aperture is formed above the first passivation layer
aperture. At block 114, a second passivation layer is formed over
the metal pad, and at block 116 a second passivation layer aperture
is formed in the second passivation layer over the metal pad
aperture. At block 118, a polyimide layer is formed over and within
the second passivation layer aperture to form a polyimide root at
an exterior tapered edge of the polyimide layer. Other layers,
lines, vias, and structures may also be provided before, during, or
after the steps of method 100. In one example, backside processing
may take place. Advantageously, because the polyimide layer root is
formed in accordance with the present disclosure, peeling of the
polyimide layer from subsequent wet etch and/or curing processes
may be substantially prevented.
[0014] Referring now to FIG. 2, method 200 begins with block 102
and continues with blocks 104 and 106 in substantially the same
steps as in method 100 of FIG. 1. At block 102, a semiconductor
substrate is provided having a seal ring region and a circuit
region. In an embodiment, the seal ring region is formed around the
circuit region, and the seal ring region is for forming a seal ring
structure thereon and the circuit region is for at least forming a
transistor device therein. At block 104, an integrated circuit is
formed over the circuit region and a seal ring structure is formed
over the seal ring region, and at block 106 a first passivation
layer is formed over the seal ring structure in the seal ring
region. At block 208, a first passivation layer aperture is formed
over the seal ring structure, but in this embodiment, the first
passivation layer aperture is set apart from an exterior side of
the seal ring structure. At step 210, a metal pad is formed over
the first passivation layer aperture to couple the metal pad to the
seal ring structure, and at step 212, a metal pad aperture is
formed above the first passivation layer aperture. At step 214, a
second passivation layer is formed over the metal pad, and at step
216 a second passivation layer aperture is formed exposing the
metal pad aperture. At step 218, a polyimide layer is formed over
the second passivation layer filling the second passivation layer
aperture and the metal pad aperture to form a polyimide root
contacting the metal pad. Advantageously, because the polyimide
layer root is formed in accordance with the present disclosure,
peeling of the polyimide layer from subsequent wet etch and/or
curing processes may be substantially prevented.
[0015] Referring now to FIG. 3, a top plan view of a device 300A or
300B is illustrated including an integrated circuit (IC) die 302, a
seal ring structure 310 around the IC die 302, and an assembly
isolation region 304 therebetween according to various aspects of
the present disclosure. Alternative cross-sectional views of the
seal ring region along line I-I' are illustrated in FIGS. 4 and 5
according to embodiments of the present disclosure.
[0016] Referring now to FIG. 4 in conjunction with FIGS. 1 and 3, a
cross-sectional view is illustrated of an embodiment of
semiconductor device 300A at a stage of fabrication according to
the method 100 of FIG. 1. The semiconductor device 300A may include
a semiconductor substrate 402 such as a silicon substrate (e.g., a
p-doped substrate) having a seal ring region 310 and assembly
isolation region 304 surrounding IC die 302 in a circuit region. In
an embodiment, the seal ring region 310 is formed around the
circuit region, and the seal ring region is for forming a seal ring
structure thereon and the circuit region is for forming at least a
transistor device therein. The substrate 402 may alternatively
include silicon germanium, gallium arsenic, or other suitable
semiconductor materials. The substrate 402 may further include
doped regions, such as a P-well, an N-well, and/or a doped active
region such as a P+ doped active region. In one aspect, the doped
active regions may be disposed within other regions. The substrate
402 may further include other features such as a buried layer,
and/or an epitaxy layer. Furthermore, the substrate 402 may be a
semiconductor on insulator such as silicon on insulator (SOI). In
other embodiments, the semiconductor substrate 402 may include a
doped epitaxy layer, a gradient semiconductor layer, and/or may
further include a semiconductor layer overlying another
semiconductor layer of a different type such as a silicon layer on
a silicon germanium layer. In other examples, a compound
semiconductor substrate may include a multilayer silicon structure
or a silicon substrate may include a multilayer compound
semiconductor structure.
[0017] The device 300A may further include isolation structures,
such as shallow trench isolation (STI) features or LOCOS features
formed in the substrate 402 for isolating active regions from other
regions of the substrate. The active regions may be configured as
an NMOS device (e.g., nFET) or as a PMOS device (e.g., pFET) in one
example.
[0018] The device 300A may further include dummy gate and/or gate
structures (not shown) overlying the substrate 402, which may be
formed from various material layers and by various
etching/patterning techniques over various regions of device
300A.
[0019] The device 300A further includes contact bars 404 to
electrically couple active regions to the subsequently formed seal
ring structure 412. It is noted that other layers may be provided
in the seal ring region to form various features over and/or under
the seal ring structure such as passivation layers, nitride layers,
and polyimide layers deposited by CVD, spin-on techniques, or the
like.
[0020] The semiconductor substrate 402 may further include
underlying layers, overlying layers, devices, junctions, and other
features formed during prior process steps or which may be formed
during subsequent process steps, such as with backside
processing.
[0021] Device 300A includes seal ring structure 412 disposed over
substrate 402 in the seal ring region 310. Seal ring structure 412
may be comprised of various stacked conductive layers 408 and via
layers 410 disposed through dielectric layers 406. Seal ring
structure 412 may have a width between about 5 microns and about 15
microns in one example. Seal ring structure 412 is further
comprised of an exterior portion or side adjacent to the chip edge
and scribe line and an interior portion or side adjacent to the
assembly isolation 304 and the circuit region.
[0022] Device 300A further includes a first passivation layer 414
disposed over the seal ring structure 412. In one example, the
first passivation layer 414 may be deposited by a high aspect ratio
process (HARP) and/or a high density plasma (HDP) CVD process.
Other deposition techniques may be used. In one example, the first
passivation layer 414 includes a dielectric and is one of a silicon
oxide or silicon nitride. The first passivation layer 414 includes
two first passivation layer apertures 416a, 416b over the seal ring
structure 412. First passivation layer aperture 416a is at an
exterior side of seal ring structure 412 closer to the chip edge
and scribe line, and first passivation layer aperture 416b is at an
interior side of seal ring structure 412 closer to the assembly
isolation and circuit region. Various patterning and etching
techniques and processes may be used to form the first passivation
layer apertures 416a, 416b.
[0023] Device 300A further includes a metal pad 418 disposed over
the first passivation layer 414 filling the first passivation layer
apertures 416a, 416b to couple metal pad 418 to seal ring structure
412, and in one example the metal pad 418 is coupled to a top metal
layer 408a of seal ring structure 412. In one example, metal pad
418 may be comprised of aluminum and the metal layers of the seal
ring structure may be comprised of copper. Other metals are
applicable and may be used. Metal pad 418 includes metal pad
apertures 420a and 420b above first passivation layer apertures
416a and 416b, respectively.
[0024] Device 300A further includes a second passivation layer 422
disposed over seal ring structure 412, first passivation layer 414,
and metal pad 418. Second passivation layer 422 includes second
passivation layer apertures 424a and 424b above metal pad apertures
420a and 430b and first passivation layer apertures 416a and 416b,
respectively. In one example, the second passivation layer 422
includes a dielectric and is one of a silicon nitride or silicon
oxide. In yet another example, the first passivation layer 414 is
formed of silicon oxide or silicon nitride and the second
passivation layer 422 is formed of silicon nitride or silicon
oxide, respectively. In yet another example, the first passivation
layer 414 and the second passivation layer 422 may be comprised of
the same material.
[0025] Device 300A further includes a polyimide layer 426 disposed
over the seal ring structure 412 and second passivation layer 422
filling the second passivation layer apertures 424a and 424b to
form polyimide roots 430a and 430b. Polyimide layer 426 includes an
exterior tapered edge 428 having, in one example, an angle from
horizontal "y" between about 70 degrees and about 75 degrees and a
complementary angle from horizontal "x" between about 105 degrees
and about 110 degrees. In one embodiment, exterior tapered edge 428
of polyimide layer 426 is tapered at an angle moving vertically
away from the chip edge or scribe line and toward the assembly
isolation or circuit region. Polyimide root 430a is disposed at the
exterior tapered edge 428 of the polyimide layer 426.
Advantageously, polyimide shrink forces and/or peeling effects are
reduced with a greater vertical angle of the exterior edge of the
polyimide layer. Polyimide layer 426 further has a thickness from
second passivation layer 422 ranging between about 5 micron and
about 10 micron in one example. Advantageously, polyimide shrink
forces and/or peeling effects are reduced with reduced thickness of
the polyimide layer. Furthermore, a plurality of polyimide roots at
the interface between polyimide layer 426 and second passivation
layer 422 improves adhesion of the polyimide layer to second
passivation layer 422 and reduces peeling effects.
[0026] The various passivation layers, metal pads, and polyimide
layer may undergo patterning and etch steps to form the structure
profiles as desired. As note above, device 300A may undergo further
processing to form various features such as contacts/vias,
interconnect metal layers, interlayer dielectric, passivation
layers, backside processing, etc. to form semiconductor circuits as
is known in the art.
[0027] Referring now to FIG. 5 in conjunction with FIGS. 2 and 3, a
cross-sectional view is illustrated of an embodiment of
semiconductor device 300B at a stage of fabrication according to
the method 200 of FIG. 2. Some of the structures may be
substantially similar to the embodiment disclosed in FIG. 4 and the
descriptions of common structures are not repeated here although
fully applicable in this embodiment as well.
[0028] In this embodiment, the semiconductor device 300B include
semiconductor substrate 402 having a seal ring region 310 and
assembly isolation region 304 surrounding IC die 302 in a circuit
region. In an embodiment, the seal ring region 310 is formed around
the circuit region, and the seal ring region is for forming a seal
ring structure thereon and the circuit region is for forming at
least a transistor device therein.
[0029] Device 300B includes seal ring structure 412 disposed over
substrate 402 in the seal ring region 310. Seal ring structure 412
may be comprised of various stacked conductive layers 408 and via
layers 410 disposed through dielectric layers 406, and may have a
width between about 5 microns and about 15 microns in one example.
Seal ring structure 412 is further comprised of an exterior portion
or side adjacent the chip edge and scribe line and an interior
portion or side adjacent the assembly isolation 304 and the circuit
region.
[0030] Device 300B further includes a first passivation layer 514
disposed over the seal ring structure 412. In one example, the
first passivation layer 514 may be deposited by a high aspect ratio
process (HARP) and/or a high density plasma (HDP) CVD process. In
one example, the first passivation layer 514 includes a dielectric
and is one of a silicon oxide or silicon nitride. The first
passivation layer 514 includes a first passivation layer aperture
516 formed over the seal ring structure 412. In this embodiment,
first passivation layer aperture 516 is centrally disposed over
seal ring structure 412.
[0031] Device 300B further includes a metal pad 518 over the first
passivation layer 514 filling the first passivation layer aperture
516 to couple metal pad 518 to seal ring structure 412, and in one
example the metal pad 518 is coupled to a top metal layer 408a of
seal ring structure 412. In one example, metal pad 518 may be
comprised of aluminum and the metal layers of the seal ring
structure may be comprised of copper. Other metals may be
applicable. Metal pad 518 includes a metal pad aperture 520 above
first passivation layer aperture 516.
[0032] Device 300B further includes a second passivation layer 522
disposed over seal ring structure 412, first passivation layer 514,
and metal pad 518. Second passivation layer 522 includes a second
passivation layer aperture 524 above metal pad aperture 520 and
first passivation layer aperture 516. In this embodiment, second
passivation layer aperture 524 exposes the metal pad and metal pad
aperture 520. In one example, the second passivation layer 522
includes a dielectric and is one of a silicon nitride or silicon
oxide. In yet another example, the first passivation layer 514 is
formed of silicon oxide or silicon nitride and the second
passivation layer 522 is formed of silicon nitride or silicon
oxide, respectively. In yet another example, the first passivation
layer 514 and the second passivation layer 522 may be comprised of
the same material.
[0033] Device 300B further includes a polyimide layer 526 over the
seal ring structure 412 and second passivation layer 522 filling
the second passivation layer aperture 524 and metal pad aperture
520 to form a polyimide root 530 that contacts the metal pad 518.
Advantageously, such a polyimide root that contacts the metal pad
improves adhesion of the polyimide layer to the second passivation
layer and reduces peeling effects.
[0034] The various passivation layers, metal pads, and polyimide
layer may undergo patterning and etch steps to form the structure
profiles as desired. As note above, device 300B may undergo further
processing to form various features such as contacts/vias,
interconnect metal layers, interlayer dielectric, passivation
layers, backside processing, etc. to form semiconductor circuits as
is known in the art.
[0035] Advantageously, the polyimide layer roots formed in
accordance with the present disclosure as described above
substantially prevents peeling of the polyimide layer from
subsequent wet etch and/or curing processes. Furthermore, the metal
pads formed in accordance with the present disclosure as described
above may substantially prevent die saw peeling effects and thereby
protect the interior circuit device from layer peeling.
[0036] Referring now to FIGS. 6A-6D in conjunction with FIGS. 1 and
3, cross-sectional views are illustrated of the semiconductor
device 300A of FIG. 4 at various stages of fabrication according to
embodiments of the present disclosure.
[0037] FIG. 6A illustrates the forming of a substrate 402, a seal
ring structure 412 over the seal ring region, and a first
passivation layer 414 over the seal ring structure 412. In one
example, the first passivation layer 414 may be deposited by a high
aspect ratio process (HARP) and/or a high density plasma (HDP) CVD
process. Other applicable processes may be used. In one example,
the first passivation layer 414 includes a dielectric and is one of
a silicon oxide or silicon nitride. The first passivation layer 414
includes two first passivation layer apertures 416a, 416b formed
over the seal ring structure 412. First passivation layer aperture
416a is formed at an exterior side of seal ring structure 412 and
first passivation layer aperture 416b is formed at an interior side
of seal ring structure 412. Apertures 416a and 416b may be formed
by various applicable patterning and etching techniques.
[0038] FIG. 6B illustrates the deposition and etch of a metal over
the first passivation layer 414 and in the apertures 416a, 416b to
form metal pad 418. The first passivation layer apertures 416a,
416b are adjacent to top metal layer 408a of seal ring structure
412, and the metal pad 418 is directly coupled to the top metal
layer 408a. Metal pad 418 includes metal pad apertures 420a and
420b above first passivation layer apertures 416a and 416b,
respectively. Metal pad apertures 420a, 420b may be formed by the
deposition technique of the metal that forms metal pad 418 over the
first passivation layer apertures or the metal pad apertures may be
formed by patterning and etching techniques.
[0039] FIG. 6C illustrates the forming of second passivation layer
422 over first passivation layer 414 and metal pad 418. Second
passivation layer apertures 424a and 424b are formed above metal
pad apertures 420a and 430b and first passivation layer apertures
416a and 416b, respectively. In one example, the second passivation
layer 422 includes a dielectric and is one of a silicon nitride or
silicon oxide. In yet another example, the first passivation layer
414 is formed of silicon oxide or silicon nitride and the second
passivation layer 422 is formed of silicon nitride or silicon
oxide, respectively. In yet another example, the first passivation
layer 414 and the second passivation layer 422 may be comprised of
the same material. Second passivation layer 422 may be deposited by
a high aspect ratio process (HARP) and/or a high density plasma
(HDP) CVD process. Other applicable processes may be used.
Apertures 424a and 424b may be formed by deposition of the
passivation layer over the metal pad apertures or various
applicable patterning and etching techniques may be used.
[0040] FIG. 6D illustrates the forming of polyimide layer 426 over
the seal ring structure 412 and second passivation layer 422
filling the second passivation layer apertures 424a and 424b to
form polyimide roots 430a and 430b. Polyimide layer 426 is formed
to include exterior tapered edge 428 having, in one example, an
angle from horizontal "y" between about 70 degrees and about 75
degrees and an angle from horizontal "x" between about 105 degrees
and about 110 degrees. Polyimide root 430a is disposed at the
exterior tapered edge 428 of the polyimide layer 426.
Advantageously, polyimide shrink forces and/or peeling effects are
reduced with greater vertical angle of the polyimide exterior edge.
Polyimide layer 426 is formed to have a thickness from second
passivation layer 422 ranging between about 5 micron and about 10
micron in one example. Advantageously, polyimide shrink forces
and/or peeling effects are reduced with reduced thickness of the
polyimide layer. Furthermore, forming a plurality of polyimide
roots at the interface between polyimide layer 426 and second
passivation layer 422 improves adhesion of the polyimide layer and
reduces peeling effects. Polyimide layer 526 may be formed by
various deposition techniques.
[0041] The various passivation layers, metal pads, and polyimide
layer may undergo patterning and etch steps to form the structure
profiles as desired. As note above, device 300A may undergo further
processing to form various features such as contacts/vias,
interconnect metal layers, interlayer dielectric, passivation
layers, backside processing, etc. to form semiconductor circuits as
is known in the art.
[0042] Referring now to FIGS. 7A-7D in conjunction with FIGS. 2 and
3, cross-sectional views are illustrated of the semiconductor
device 300B of FIG. 5 at various stages of fabrication according to
embodiments of the present disclosure.
[0043] FIG. 7A illustrates the formation of semiconductor substrate
402 having a seal ring region 310 and assembly isolation region 304
surrounding IC die 302 in a circuit region. In an embodiment, the
seal ring region 310 is formed around the circuit region, and the
seal ring region is for forming a seal ring structure thereon and
the circuit region is for forming at least a transistor device
therein. Seal ring structure 412 is formed over substrate 402 in
the seal ring region 310. Seal ring structure 412 may be comprised
of various stacked conductive layers 408 and via layers 410
disposed through dielectric layers 406, and may have a width
between about 5 microns and about 15 microns in one example. Seal
ring structure 412 is further formed to include an exterior portion
or side adjacent the chip edge and scribe line and an interior
portion or side adjacent the assembly isolation 304 and the circuit
region.
[0044] First passivation layer 514 is formed over the seal ring
structure 412, in one example being deposited by a high aspect
ratio process (HARP) and/or a high density plasma (HDP) CVD
process. Other applicable deposition techniques may be used. In one
example, the first passivation layer 514 includes a dielectric and
is one of a silicon oxide or silicon nitride. First passivation
layer aperture 516 is formed over the seal ring structure 412, and
in this embodiment, first passivation layer aperture 516 is
centrally formed over seal ring structure 412. Conventional
patterning and etch techniques may be used to form first
passivation layer aperture 516.
[0045] FIG. 7B illustrates the formation of metal pad 518 over the
first passivation layer 514 filling the first passivation layer
aperture 516 to couple metal pad 518 to seal ring structure 412. In
one example, the metal pad 518 is coupled to a top metal layer 408a
of seal ring structure 412. In one example, metal pad 518 may be
comprised of aluminum and the metal layers of the seal ring
structure may be comprised of copper. Other metals may be
applicable. Metal pad aperture 520 is formed above first
passivation layer aperture 516 by the deposition technique over
first passivation layer aperture 515 or by known patterning and
etching techniques.
[0046] FIG. 7C illustrates the forming of second passivation layer
522 over seal ring structure 412, first passivation layer 514, and
metal pad 518. Second passivation layer aperture 524 is formed
above metal pad aperture 520 and first passivation layer aperture
516. In this embodiment, second passivation layer aperture 524 is
formed to expose the metal pad and metal pad aperture 520. In one
example, the second passivation layer 522 includes a dielectric and
is one of a silicon nitride or silicon oxide. In yet another
example, the first passivation layer 514 is formed of silicon oxide
or silicon nitride and the second passivation layer 522 is formed
of silicon nitride or silicon oxide, respectively. In yet another
example, the first passivation layer 514 and the second passivation
layer 522 may be comprised of the same material. Second passivation
layer 522 may be deposited by a high aspect ratio process (HARP)
and/or a high density plasma (HDP) CVD process in one example.
Other applicable deposition techniques may be used. Conventional
patterning and etch techniques may be used to form second
passivation layer aperture 524.
[0047] FIG. 7D illustrates the forming of polyimide layer 526 over
the seal ring structure 412 and second passivation layer 522
filling the second passivation layer aperture 524 and metal pad
aperture 520 to form polyimide root 530 that contacts the metal pad
518. Advantageously, such a polyimide root that contacts the metal
pad improves adhesion of the polyimide layer to the second
passivation layer and reduces peeling effects.
[0048] The various passivation layers, metal pads, and polyimide
layer may undergo patterning and etch steps to form the structure
profiles as desired. As note above, device 300B may undergo further
processing to form various features such as contacts/vias,
interconnect metal layers, interlayer dielectric, passivation
layers, backside processing, etc. to form semiconductor circuits as
is known in the art.
[0049] The present disclosure provides for many different
embodiments and the methods, techniques, and structures of the
present disclosure may be used in a CMOS image sensor (CIS)
backside illuminated (BSI) product, and products which need wafer
bonding processes such as in microelectromechanical systems (MEMS)
products. Furthermore, semiconductor devices may be formed having a
frontside metal pad coupled to a seal ring structure, a backside
metal pad coupled to a seal ring structure, or both metal pads
coupled to a seal ring structure.
[0050] One of the broader forms of the present disclosure involves
a semiconductor device. The semiconductor device includes a
substrate having a seal ring region and a circuit region, a seal
ring structure disposed over the seal ring region, a first
passivation layer disposed over the seal ring structure, the first
passivation layer having a first passivation layer aperture over
the seal ring structure, and a metal pad disposed over the first
passivation layer, the metal pad coupled to the seal ring structure
through the first passivation layer aperture and having a metal pad
aperture above the first passivation layer aperture. The device
further includes a second passivation layer disposed over the metal
pad, the second passivation layer having a second passivation layer
aperture above the metal pad aperture, and a polyimide layer
disposed over the second passivation layer, the polyimide layer
filling the second passivation layer aperture to form a polyimide
root at an exterior tapered edge of the polyimide layer.
[0051] Another of the broader forms of the present disclosure
involves a semiconductor device including a substrate having a seal
ring region and a circuit region, a seal ring structure disposed
over the seal ring region, a first passivation layer disposed over
the seal ring structure, the first passivation layer having a first
passivation layer aperture over the seal ring structure, and a
metal pad disposed over the first passivation layer, the metal pad
coupled to the seal ring structure through the first passivation
layer aperture and having a metal pad aperture above the first
passivation layer aperture. The device further includes a second
passivation layer disposed over the metal pad, the second
passivation layer having a second passivation layer aperture
exposing the metal pad aperture, and a polyimide layer disposed
over the second passivation layer, the polyimide layer filling the
second passivation layer aperture to form a polyimide root
contacting the metal pad.
[0052] Another of the broader forms of the present disclosure
involves a method of fabricating a semiconductor device. The method
includes providing a substrate having a seal ring region and a
circuit region, forming a seal ring structure over the seal ring
region, forming a first passivation layer over the seal ring
structure, and forming in the first passivation layer a first
passivation layer aperture over the seal ring structure. The method
further includes forming a metal pad over the first passivation
layer aperture to couple the metal pad to the seal ring structure
exposed through the first passivation layer aperture, forming in
the metal pad a metal pad aperture above the first passivation
layer aperture, forming a second passivation layer over the metal
pad, forming in the second passivation layer a second passivation
layer aperture over the metal pad aperture, and forming a polyimide
layer over the second passivation layer, the polyimide layer
filling the second passivation layer aperture to form a polyimide
root at an exterior tapered edge of the polyimide layer.
[0053] Another of the broader forms of the present disclosure
involves a method of fabricating a semiconductor device. The method
includes providing a substrate having a seal ring region and a
circuit region, forming a seal ring structure over the seal ring
region, forming a first passivation layer over the seal ring
structure, and forming in the first passivation layer a first
passivation layer aperture over the seal ring structure. The method
further includes forming a metal pad over the first passivation
layer aperture to couple the metal pad to the seal ring structure
exposed through the first passivation layer aperture, forming in
the metal pad a metal pad aperture above the first passivation
layer aperture, forming a second passivation layer over the metal
pad, forming in the second passivation layer a second passivation
layer aperture exposing the metal pad aperture, and forming a
polyimide layer over the second passivation layer, the polyimide
layer filling the second passivation layer aperture and the metal
pad aperture to form a polyimide root contacting the metal pad.
[0054] The foregoing has outlined features of several embodiments
so that those skilled in the art may better understand the detailed
description that follows. Those skilled in the art should
appreciate that they may readily use the present disclosure as a
basis for designing or modifying other processes and structures for
carrying out the same purposes and/or achieving the same advantages
of the embodiments introduced herein. Those skilled in the art
should also realize that such equivalent constructions do not
depart from the spirit and scope of the present disclosure, and
that they may make various changes, substitutions and alterations
herein without departing from the spirit and scope of the present
disclosure.
* * * * *