U.S. patent application number 13/340738 was filed with the patent office on 2012-04-26 for heat sink.
This patent application is currently assigned to FURUKAWA ELECTRIC CO., LTD.. Invention is credited to Shinichi Furumoto, Shinichi Ito, Kenya Kawabata.
Application Number | 20120097372 13/340738 |
Document ID | / |
Family ID | 44304387 |
Filed Date | 2012-04-26 |
United States Patent
Application |
20120097372 |
Kind Code |
A1 |
Furumoto; Shinichi ; et
al. |
April 26, 2012 |
HEAT SINK
Abstract
Provided is a heat sink capable of improving heat dissipating
characteristics and saving space with a reduced fin size. The heat
sink is provided with: a base plate which has one surface thermally
connected to a heat generating component and which has thermally
connected thereto a first heat dissipating fin section composed of
a thin plate fin; an upper plate which has a second heat
dissipating fin section thermally connected on one surface, the
second heat dissipating fin section being composed of two kinds of
thin plate fins having different heights; and a plurality of heat
pipes which are disposed between the other surface of the base
plate and the other surface of the upper plate by being thermally
connected to the surfaces and which include a heat pipe that has at
least a part thereof inserted into a part of the second heat
dissipating fin section.
Inventors: |
Furumoto; Shinichi; (Tokyo,
JP) ; Ito; Shinichi; (Tokyo, JP) ; Kawabata;
Kenya; (Tokyo, JP) |
Assignee: |
FURUKAWA ELECTRIC CO., LTD.
Tokyo
JP
|
Family ID: |
44304387 |
Appl. No.: |
13/340738 |
Filed: |
December 30, 2011 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
PCT/JP2011/050633 |
Jan 17, 2011 |
|
|
|
13340738 |
|
|
|
|
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0275 20130101;
H01L 23/427 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; H01L 23/3672 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 18, 2010 |
JP |
2010-007779 |
Claims
1. A heat sink comprising: a base plate which has one surface
thermally connected to a heat generating component or a base plate
which has one surface thermally connected to a heat generating
component and which has thermally connected thereto a first heat
dissipating fin section composed of a thin plate fin; an upper
plate which has a second heat dissipating fin section thermally
connected on one surface, the second heat dissipating fin section
having two kinds of thin plate fins having different heights; and a
plurality of heat pipes which are disposed between an opposite
surface of the base plate and an opposite surface of the upper
plate by being thermally connected to the opposite surfaces and
which include a heat pipe that has at least a part thereof inserted
into a part of the second heat dissipating fin section.
2. The heat sink of claim 1, wherein the second heat dissipating
fin section has a plurality of low thin plate fins that are
disposed vertically on the one surface of the upper plate and a
plurality of high thin plate fins that are disposed vertically in
adjacent to the low thin plate fins.
3. The heat sink of claim 1, wherein the second heat dissipating
fin section has a plurality of low thin plate fins that are
disposed vertically on the one surface of the upper plate and a
plurality of thin plate fins that are disposed horizontally at an
end of the low thin plate fins.
4. The heat sink of claim 2, wherein the first heat dissipating fin
section comprises a plurality of thin plate fins that are disposed
vertically on a part of the one surface of the base plate
corresponding to the high thin plate fins.
5. The heat sink of claim 3, wherein the first heat dissipating fin
section comprises a plurality of thin plate fins that are disposed
vertically on a part of the one surface of the base plate
corresponding to the high thin plate fins.
6. The heat sink according to claim 1, wherein the heat pipes are
heat pipes having at least one flatten part respectively which are
arranged in parallel at a center thereof and which are bent toward
respective outsides of the upper plate at both longitudinal ends of
the upper plate.
7. The heat sink according to claim 2, wherein the heat pipes are
heat pipes having at least one flatten part respectively which are
arranged in parallel at a center thereof and which are bent toward
respective outsides of the upper plate at both longitudinal ends of
the upper plate.
8. The heat sink according to claim 3, wherein the heat pipes are
heat pipes having at least one flatten part respectively which are
arranged in parallel at a center thereof and which are bent toward
respective outsides of the upper plate at both longitudinal ends of
the upper plate.
9. The heat sink according to claim 4, wherein the heat pipes are
heat pipes having at least one flatten part respectively which are
arranged in parallel at a center thereof and which are bent toward
respective outsides of the upper plate at both longitudinal ends of
the upper plate.
10. The heat sink according to claim 5, wherein the heat pipes are
heat pipes having at least one flatten part respectively which are
arranged in parallel at a center thereof and which are bent toward
respective outsides of the upper plate at both longitudinal ends of
the upper plate.
11. The heat sink of claim 2, wherein the heat pipe inserted into
the part of the second heat dissipating fin section is a heat pipe
that is arranged at one side and passes through the vertically
disposed high thin plate fins laterally from one direction to
another.
12. The heat sink of claim 3, wherein the heat pipe inserted into
the part of the second heat dissipating fin section is a heat pipe
that is arranged at both longitudinal ends of the upper plate and
passes vertically through the horizontally disposed thin plate
fins.
Description
TECHNICAL FIELD
[0001] The present invention relates to a heat sink used to cool a
component to be cooled (hereinafter, referred to as "cooled
component"), for example, a heat generating component such as CPU
or MPU in an electronic device.
BACKGROUND ART
[0002] Recently, various electric and electronic devices such as a
personal computer have been enhanced in performance and downsized.
However, enhancement in performance of CPU, MPU and the like
mounted on a notebook-size personal computer, a laptop or desktop
computer causes an associated increase in generated heat. On the
other hand, demands for downsizing of the electric and electronic
devices and saving space inside the electric and electronic devices
have grown more.
[0003] Cooling of heat generating components such as
high-performance CPU and MPU has been always weighted heavily as an
important technical issue. Also for electric and electronic devices
other than computers, cooling of high-performance heat generating
components and heat generating elements has been weighted heavily
as an important issue for saving space inside the electric and
electronic devices.
[0004] As a method for cooling an electronic component mounted on
the electric or electronic device, for example, there is a method
of mounting a fan on the device, rotating the fan by an electric
motor and using cooling wind to decrease temperatures of air inside
the device housing. There is another method of mounting a cooling
member on a component to be cooled and cooling the component
directly without using a fan.
[0005] Such a cooling member mounted on the component to cool is
often of a plate material having excellent thermal performance such
as copper or aluminum. Besides, various heat pipes are often used
as cooling members. Specifically, a heat sink having a base plate
thermally connected to a heat generating component and thin plate
fins thermally connected to the base plate is used and combined
with various heat pipes.
[0006] Inside a heat pipe, a space is provided as a fluid path of
working fluid. The working fluid accommodated in the space is
subjected to phase change such as evaporation and condensation and
movement so that heat is transferred. That is, at the heat
absorbing side of the heat pipe, heat generated by a component to
cool and transferred via a material of the heat pipe is used to
vaporize the working fluid, and its vapor is transferred to the
heat dissipating side of the heat pipe. At the heat dissipating
side, the vapor of the working fluid is cooled to go back to liquid
again. Then, the working fluid that has got back to fluid is moved
to the heat absorbing side again (back-flow). Such phase change and
movement of the working fluid causes heat transfer.
CITATION LIST
Patent Literature
[0007] Patent Literature 1 (PL 1): Japanese Patent Application
Laid-Open No. 2009-198173
[0008] Patent Literature 2 (PL 2): Japanese Patent Application
Laid-Open No. H10(1988)-107192
SUMMARY OF INVENTION
Technical Problem
[0009] For the heat sink having a base plate thermally connected to
the heat generating component and thin plate fins thermally
connected to the base plate, the thin plate fins are large in size
to enhance the heat dissipating performance from the fins and the
heat sink is difficult to downsize.
[0010] If a fan is mounted, the fan needs mounting space but it is
difficult to arrange it in a space-saving thin housing. Further, if
the fan is increased in size to enhance the fan performance or the
number of revolutions is increased, there occurs a problem of heavy
noise and vibration.
[0011] Accordingly, the present invention has an object to provide
a heat sink capable of enhancing the heat dissipating performance
and saving space with small-sized fins.
[0012] Here, in PL1, at least one heat pipe is provided extending
in the longitudinal direction of plate fins, sandwiched between a
first plate member and a second member and thermally connected
thereto. However, the heat dissipating performance is not
sufficient to cool high-performance heat generating components such
as CPU and MPU.
[0013] Besides, if the heat pipe is tried to be inserted via the
base surface into the fin section like in PL2, the fins are
difficult to arrange at the heat pipe bent R section and there is
restriction on design freedom.
Solution to Problem
[0014] In order to solve the above-mentioned conventional problems,
the inventors have studied intensively. As a result, they have
known that when two kinds of thin plate fins having different
heights are used, low thin plate fins are arranged at a main part
and high thin plate fins are arranged at ends, all the thin plate
fins are thermally connected to heat pipes and a part of a heat
pipe is inserted into the high thin plate fins, it becomes possible
to enhance the heat dissipating performance from the fins even if
the fins are small sized.
[0015] That is, the fins can be in contact with the heat pipes
along the heat pipes, heat transferred from the heat generating
component to the heat pipes is then transferred via the upper plate
to the low thin plate fins, dissipated from the thin plate fins and
at the same time, the heat is dissipated from the thin plate fins
efficiently by the heat pipes inserted into the high thin plate
fins. This invention was carried out based on the above-mentioned
study results.
[0016] A first aspect of the present invention provides a heat sink
comprising: a base plate which has one surface thermally connected
to a heat generating component or a base plate which has one
surface thermally connected to a heat generating component and
which has thermally connected thereto a first heat dissipating fin
section composed of a thin plate fin; an upper plate which has a
second heat dissipating fin section thermally connected on one
surface, the second heat dissipating fin section having two kinds
of thin plate fins having different heights; and a plurality of
heat pipes which are disposed between an opposite surface of the
base plate and an opposite surface of the upper plate by being
thermally connected to the opposite surfaces and which include a
heat pipe that has at least a part thereof inserted into a part of
the second heat dissipating fin section.
[0017] The heat sink according to a second aspect of the present
invention is characterized in that the second heat dissipating fin
section has a plurality of low thin plate fins that are disposed
vertically on the one surface of the upper plate and a plurality of
high thin plate fins that are disposed vertically in adjacent to
the low thin plate fins.
[0018] The heat sink according to a third aspect of the present
invention is characterized in that the second heat dissipating fin
section has a plurality of low thin plate fins that are disposed
vertically on the one surface of the upper plate and a plurality of
thin plate fins that are disposed horizontally at an end of the low
thin plate fins.
[0019] The heat sink according to a fourth aspect of the present
invention is characterized in that the first heat dissipating fin
section comprises a plurality of thin plate fins that are disposed
vertically on a part of the one surface of the base plate
corresponding to the high thin plate fins.
[0020] The heat sink according to a fifth aspect of the present
invention is characterized in that the plurality of heat pipes are
consisting of heat pipes and at least one part of each heat pipe is
made flatten. Those heat pipes are arranged in parallel at a center
thereof and they are bent toward respective outsides of the upper
plate at both longitudinal ends of the upper plate.
[0021] The heat sink according to a sixth aspect of the present
invention is characterized in that the heat pipe inserted into the
part of the second heat dissipating fin section is a heat pipe that
is arranged at one side and passes through the vertically disposed
high thin plate fins laterally from one direction to another.
[0022] The heat sink according to a seventh aspect of the present
invention is characterized in that the heat pipe inserted into the
part of the second heat dissipating fin section is a heat pipe that
is arranged at each side and passes vertically through the
horizontally disposed thin plate fins.
Advantageous Effects of Invention
[0023] According to the heat sink of the present invention, two
kinds of thin plate fins having different heights are used in
adjacent to each other, low thin plate fins are provided at a main
part and high thin plate fins are arranged at ends, and all the
thin plate fins are thermally connected to the heat pipes. Besides,
as a part of a heat pipe is inserted into the high thin plate fins,
it is possible to enhance the heat dissipating performance by the
fins even when the fin size is reduced totally. Further, as the
thin plate fins are provided on the surface on which side the heat
generating component of the base plate is located and thermally
connected thereto, it is possible to enhance the heat dissipating
characteristics.
BRIEF DESCRIPTION OF DRAWINGS
[0024] FIG. 1 is a perspective view for explaining a heat sink
according to an embodiment of the present invention;
[0025] FIG. 2 is a view illustrating a back surface of the heat
sink according to the embodiment of FIG. 1;
[0026] FIG. 3 is a top view of the heat sink of the present
invention;
[0027] FIG. 4 is a rear view of the heat sink of the present
invention seen from a high thin plate fin (B) side;
[0028] FIG. 5 is a side view of the heat sink;
[0029] FIG. 6 is a side view of the heat sink seen from the
opposite side to FIG. 5;
[0030] FIG. 7 is a perspective view for explaining a heat sink
according to another embodiment of the present invention;
[0031] FIG. 8 is a view illustrating a back surface of the heat
sink according to the embodiment of FIG. 7;
[0032] FIG. 9 is a top view of the heat sink of the present
invention;
[0033] FIG. 10 is a rear view of the heat sink of the present
invention, seen from a side of plural laminated thin plate fins (D)
in contact with a top surface of a low thin plate fin (E) ;
[0034] FIG. 11 is a side view of the heat sink; and
[0035] FIGS. 12A, 12B and 12C are cross sectional views each
schematically illustrating an example of thin plate fins bonded to
a base plate or upper plate.
DESCRIPTION OF EMBODIMENTS
[0036] With reference to the drawings, a heat sink of the present
invention will be described below.
[0037] The heat sink according to an embodiment of the present
invention has a base plate which has one surface thermally
connected to a heat generating component and which has thermally
connected thereto a first heat dissipating fin section composed of
a thin plate fin; an upper plate which has a second heat
dissipating fin section thermally connected to one surface, the
second heat dissipating fin section being composed of two kinds of
thin plate fins having different heights; and a plurality of heat
pipes which are disposed between the other surface of the base
plate and the other surface of the upper plate by being thermally
connected to the surfaces and which include a heat pipe that has at
least a part thereof inserted into a part of the second heat
dissipating fin section. The first heat dissipating fin section is
preferably connected to the base plate, but may not be connected
thereto. If it is connected, the first heat dissipating fin section
is connected to an entire surface or a part of the base plate other
than a part connected to the heat generating component.
[0038] FIG. 1 is a perspective view for explaining the heat sink
according to an embodiment of the present invention. In this
embodiment, the second heat dissipating fin section composed of two
kinds of thin plate fins having different heights has a plurality
of low thin plate fins (A) disposed vertically on one surface of
the upper plate and a plurality of high thin plate fins (B)
disposed vertically in adjacent to the plural low thin plate
fins.
[0039] In other words, as illustrated in FIG. 1, on the base plate
2 (lower side in FIG. 1) connected thermally to the heat generating
component, the first heat dissipating fin section (described in
detail later) is connected thermally thereto at the same side of
the heat generating component. The upper plate 3 is disposed at the
opposite side of the base plate 2 to sandwich the plural heat pipes
8 between the upper plate 3 and the base plate 2. On the front
surface of the upper plate 3 (upper side in FIG. 1), the second
heat dissipating fin section 5 is disposed and connected thermally
thereto. The second heat dissipating fin section 5 has two kinds of
thin plate fins composed of a plurality of low thin plate fins (A)
arranged in parallel to each other and a plurality of high thin
plate fins (B) arranged in parallel to each other. In this
embodiment, both of the low thin plate fins (A) and the high thin
plate fins (B) are arranged vertically on the top surface of the
upper plate.
[0040] In the second heat dissipating fin section 5, the plural low
thin plate fins (A) are disposed vertically almost over the upper
plate 3 other than an end of the upper plate 3 and the plural high
thin plate fins (B) are disposed vertically on the one end of the
upper plate 3. As the low thin plate fins (A) occupy the most part
of the upper plate 3, the space required for fins can be
reduced.
[0041] The plural high thin plate fins (B) that are large in area
are provided in adjacent to the plural low thin plate fins (A)
thereby to enhance the heat dissipating performance of the heat
sink.
[0042] FIG. 2 is a view illustrating a back surface of the heat
sink of the embodiment in FIG. 1. With reference to FIG. 2,
description is made about arrangement of heat pipes. As illustrated
in FIG. 2, at the one end of the base plate 2 connected thermally
to the hat generating component 10, the above-mentioned first heat
dissipating fin section 7 is disposed and thermally connected
thereto. The first heat dissipating fin section 7 has a plurality
of parallel thin plate fins (c) disposed vertically on the surface
of the base plate 2 on which side the heat generating component is
disposed and thermally connected to the surface. The thin plate
fins (C) are arranged at the end corresponding to the high thin
plate fins (B) of the second heat dissipating fin section 5.
Although this first heat dissipating fin section 7 is preferably
arranged at the end corresponding to the high thin plate fins (B)
of the second heat dissipating fin section 5, it may be larger in
area or may not be arranged.
[0043] As described above, a plurality of heat pipes 8 is arranged
between the upper plate 3 and the base plate 2. An example of
arrangement of the plural heat pipes 8 is indicated by the dotted
line in FIG. 2. In the example of FIG. 2, out of the plural pipes
8, center heat pipes 8-3 and 8-4 are arranged almost straight along
the longitudinal direction of the heat sink 1 and one ends of these
heat pipes 8-3 and 8-4 are bent outward the heat sink 1. In the
example of FIG. 2, the heat pipes 8-1 to 8-4 have thin tubular
structures in which operating fluid is inserted. These heat pipes
are vertically larger in area and in contact with the base plate 2
and the upper plate 3. In this embodiment, the cross section of a
heat pipe is in the shape of a rectangle between the base plate and
the upper plate. The cross section of the heat pipe may have an
appropriate shape depending on its location. For example, apart of
the heat pipe passing through the thin plate fins may be a tubular
member having a round cross section or may be larger in width to
increase a contact area, and thus, the heat pipe may have various
shapes in accordance with required functions and environments.
[0044] The heat pipes 8-1 and 8-2 at both sides are arranged
straight in parallel to the other heat pipes at the center in the
longitudinal direction. One ends of these heat pipes are bent
outward the heat sink 1. At the other ends (that is, the ends where
the thin plate fins (c) are arranged), the side heat pipe 8-1 is
arranged bent toward the outside of the heat sink and the other
heat pipe 8-2 is arranged bent toward the outside of the heat sink,
raised upward and inserted laterally through the high thin plate
fins (B). In the embodiment illustrated in FIG. 2, a tip end 9 of
the heat pipe can be recognized. Here, each of the plural heat
pipes 8 is flat except a part, compressed in width and has greater
contact area with the base plate 2 and the upper plate 3 thereby to
facilitate heat transfer.
[0045] As described above, as at least one of the plural heat pipes
8 passes laterally through the plural high thin plate fins (B) that
are large in area, heat is transferred from the heat pipes 8 to the
thin plate fins (B). Preferably, the heat pipes 8 and the high thin
plate fins (B) have as large a contact area as possible and are low
in heat resistance. Therefore, for example, through holes of the
thin plate fins are formed by burling and the heat pipes 8 are
connected by soldering or brazing. Thus, as the heat pipes 8 and
the high thin plate fins (B) are connected thermally, the heat
dissipating performance of the heat dissipating fins is enhanced.
In other words, heat of the heat generating component 10 is
transferred via the base plate to the plural heat pipes 8-1, 8-2,
8-3 and 8-4 and further to the upper palate 3 thereby to expedite
heat dissipation. Here, in this embodiment, the heat pipe 8-2 is
only structured to insert the high thin plate fins (B)
therethrough, but other heat pipes 8 may be also structured to
insert the high thin plate fins (B) therethrough.
[0046] Further, with the plural pipes 8 having curved parts, the
heat is dissipated from all the low thin plate fins (A) disposed
vertically on and connected thermally to the top surface of the
upper plate 3. Furthermore, as the end of at least one heat pipe
out of the plural heat pipes 8 passes laterally through the high
thin plate fins (B) having high heat dissipating performance, the
heat dissipating performance of the fins is enhanced more.
Accordingly, according to the heat sink of the present invention,
it is possible to enhance the heat dissipating performance with
small sized fins.
[0047] The thin plate fins may be worked to have holes or ends into
U shape so that the heat pipes passes therethrough. The holes may
be formed by burling. After the heat pipes are inserted into the
fins, they may be connected by soldering or brazing where
necessary.
[0048] FIG. 3 is a top view of the heat sink of the present
invention. As illustrated in FIG. 3, on the top surface of the
upper plate, the plural thin plate fins (A) are arranged vertically
over the entire surface except one end. Further, at the one end,
the plural high thin plate fins that are great in area are disposed
in adjacent to the low thin plate fins (A). At parts of both sides
of the heat sink, fixing parts 6 are provided to fix the upper
plate 3 and the base plate 2 with heat pipes 8 therebetween.
[0049] FIG. 4 is a rear view of the heat sink of the present
invention seen from the high thin plate fins (B) side. As
illustrated in FIG. 4, an end 9 of one heat pipe of the plural heat
pipes 8 arranged between the base plate 2 and the upper plate 3 is
raised upward and passes laterally through the plural high thin
plate fins (B). In FIG. 4, the thin plate fins (C) are disposed at
the position of the base plate corresponding to the high thin plate
fins (B).
[0050] FIG. 5 is a side view of the heat sink. FIG. 6 is a side
view seen from the opposite side to FIG. 5. As illustrated in FIGS.
5 and 6, at the end of the base plate 2 thermally connected to the
heat generating component, the plural parallel thin plate fins (C)
of the first heat dissipating fin section 7 is disposed vertically.
On the top surface of the upper plate 3, the low thin plate fins
(A) and the high thin plate fins (B) of the second heat dissipating
fin section 5 are disposed. The high thin plate fins (B) are
provided at the end which side corresponds to the thin plate fins
(C). The base plate 2 and the upper plate 3 are fixed by the fixing
parts 6 with the heat pipes 8 between them. The end 9 of at least
one heat pipe of the plural heat pipes 8 is raised upward and
passes laterally through the high thin plate fins (B) of the second
heat dissipating fin section 5. As described above, the most part
of the heat dissipating fin section is composed of the low thin
plate fins, the fins are small-sized, the large-area high thin
plate fins are disposed at the end and a part of the heat pipe is
inserted laterally thereby to increase the heat dissipating
performance of the fins.
[0051] FIG. 7 is a perspective view for explaining a heat sink
according to another embodiment of the present invention. In this
embodiment, the second heat dissipating fin section composed of two
kinds of thin plate fins having different heights has a plurality
of low thin plate fins vertically disposed on one surface of the
upper plate and a plurality of thin plate fins stacked in the
horizontal direction on one end of the plural low thin plate
fins.
[0052] In other words, as illustrated in FIG. 7, in the base plate
2 (lower side in FIG. 7) connected thermally to the heat generating
component, the first heat dissipating fin section 7 is thermally
connected thereto at the same side of the heat generating
component. The upper plate 3 is disposed to sandwich the plural
heat pipes 8. On the front surface of the upper plate 3 (upper side
in FIG. 7), the second heat dissipating fin section 5 is thermally
connected thereto. The second heat dissipating fin section 5 has a
plurality of parallel low thin plate fins (E) arranged vertically
on the entire top surface of the upper plate 3 and a plurality of
thin plate fins (D) stacked in the horizontal direction on one end
of the plural low thin plate fins. In this embodiment, the low thin
plate fins (E) are arranged vertically on the top surface of the
upper plate 3 and the stacked thin plate fins (D) are arranged
stacked in parallel and upward on the top surface of the upper
plate 3.
[0053] On the second heat dissipating fin section 5, the plural low
thin plate fins (E) are arranged vertically almost over the upper
plate 3 and the plural stacked thin plate fins (D) are arranged in
parallel to the upper plate on the end top surface of the low thin
plate fins (E). In this way, as the low thin plate fins (E) occupy
the most part of the upper plate 3, the space required for the fins
can be reduced.
[0054] As the plural stacked thin plate fins (D) having larger
areas are provided in contact with the end top surface of the
plural low thin plate fins (E), the heat dissipating performance of
the heat sink is enhanced.
[0055] FIG. 8 is a view illustrating a back surface of the heat
sink according to the embodiment of FIG. 7. With reference to FIG.
8, arrangement of the heat pipe is explained. As illustrated in
FIG. 8, at an end of the base plate thermally connected to the heat
generating component 10, the above-mentioned first heat dissipating
fin section 7 is thermally connected thereto. The first heat
dissipating fin section 7 has a plurality of parallel thin plate
fins (C) vertically disposed on one surface of the base plate 2 on
which side the heat generating component is positioned and
thermally connected thereto. The thin plate fins (C) are disposed
at the end corresponding to the stacked thin plate fins (D) of the
second heat dissipating fin section 5. This first heat dissipating
fin section 7 may be larger in area unless it is in contact with
the heat generating component or may not be disposed.
[0056] As described with reference to FIG. 8, the plural pipes 8
are arranged between the upper plate 3 and the base plate 2. As
indicated by the dotted line in FIG. 8, out of the plural heat
pipes 8, center heat pipes 8-3 and 8-4 are disposed almost straight
along the longitudinal direction of the heat sink and their one
ends are bent toward respective outsides of the heat sink 1.
[0057] Side heat pipes 8-1 and 8-2 are disposed straight almost in
parallel with the other heat pipes 8-3 and 8-4 at the center in the
longitudinal direction. One ends of the heat pipes 8-1 and 8-2 are
bent toward respective outsides of the heat sink 1. The other end
9-1 of the heat pipe 8-1 (end where the thin plate fins (c) are
arranged) is raised upward and passes through the stacked thin
plate fins (D) vertically. In the same way, the end 9-2 of the heat
pipe 8-2 is raised upward and passes through the stacked thin plate
fins (D) vertically. The plural heat pipes 8 are formed flat except
their parts (ends 9-1 and 9-2), compressed in width and their
contact areas with the base plate 2 and the upper plate 3 are
increased thereby to facilitate heat transfer.
[0058] As described above, as at least two of the plural heat pipes
have ends passing through the stacked thin plate fins (D)
vertically, the heat dissipating performance of the heat
dissipating fins is increased. That is, the heat of the heat
generating component 10 is transferred via the base plate to the
plural heat pipes 8-1, 8-2, 8-3 and 8-4 and then to the upper plate
3.
[0059] Further, with the plural heat pipes 8 with curved or bent
parts, the heat is dissipated from the entire part of the low thin
plate fins (E) disposed vertically on and thermally connected to
the top surface of the upper plate 3. Furthermore, as at least two
heat pipes 8-1 and 8-2 of the plural heat pipes 8 have ends 9-1 and
9-2 passing vertically through the stacked thin plate fins (D)
having high heat dissipating performance, the heat dissipating
performance is further enhanced. Accordingly, in the heat sink of
the present invention, it is possible to enhance the fin heat
dissipating performance with small-sized fins.
[0060] FIG. 9 is a top view of the heat sink of the present
invention. As illustrated in FIG. 9, the plural low thin plate fins
(E) are disposed vertically on the entire top surface of the upper
plate 3. Further, on one end top surface of the low thin plate fins
(E), the plural stacked thin plate fins (D) are disposed in contact
with the top surface of the low thin plate fins (E). At parts of
both outsides of the heat sink 1, fixing parts 6 are provided to
fix the upper plate 3 and the base plate 2 with the plural heat
pipes 8 therebetween.
[0061] FIG. 10 is a rear view of the heat sink of the present
invention seen from the side of the plural stacked thin plate fins
(D) in contact with the top surface of the low thin plate fins (E).
As illustrated in FIG. 10, among of heat pipes sandwiched by base
plate 2 and upper plate 3, two heat pipes rise upward so as to be
inserted into the stacked thin plate fins (D) in vertical
direction. According to FIG. 10, the thin plate fins (C) are
arranged at a part of the base plate corresponding to the stacked
thin plate fins (D). A through hole is formed in each of the thin
plate fins (D) for insertion in the vertical direction and this
through hole may be formed by burling. After the pipes are inserted
into the fins, they may be connected by soldering, brazing or the
like where necessary.
[0062] FIG. 11 is a side view of the heat sink. As illustrated in
FIG. 11, the plural parallel thin plate fins (C) of the first heat
dissipating fin section 7 are disposed vertically on the end of the
base plate 5 thermally connected to the heat dissipating component.
On the top surface of the upper plate 3, the low thin plate fins
(E) and the stacked thin plate fins (D) of the second heat
dissipating fin section 5 are arranged. The stacked thin plate fins
(D) are provided at the end corresponding to the thin plate fins
(C) and in contact with the top end surfaces of the low thin plate
fins (E). The base plate 2 and the upper plate 3 are fixed by the
fixing parts 6 with the plural heat pipes 8 sandwiched
therebetween. At least two heat pipes 8-1 and 8-2 of the plural
heat pipes 8 have ends 9-1 and 9-2 raised upward and passing
vertically through the stacked thin plate fins (D) of the second
heat dissipating fin section 5. As described above, the low thin
plate fins occupy the most part of the heat dissipating fin
section, the fins are small-sized, the stacked thin plate fins are
arranged at ends of the fins, and the parts of the heat pipes are
inserted into the fins vertically thereby to increase the heat
dissipating performance of the fins.
[0063] FIGS. 12A, 12B and 12C are cross sectional views each for
explaining the form of the thin plate fins of the heat sink of the
present invention bonded to the base plate, the upper plate and the
like. The thin plate fins may take various shapes in accordance
with the location of the heat sink, space where it can be arranged
and other conditions. Besides, the thin plate fins having various
shapes may be combined freely. In FIGS. 12A, 12B and 12C, the
bonding forms of each of the thin plate fins C when the thin plate
fin section 7 is provided on the base plate 2 are illustrated.
These forms may be applied to the cases of the thin plate fins A
and B bonded to the upper plate 3.
[0064] In the form illustrated in FIG. 12A, the thin plate fins
each of which is composed of a bottom surface, a vertical surface
and top surface and has a U shaped cross section are arranged in
parallel in the lateral direction to forma heat dissipating fin
section. In this form, plural bottom surfaces are arranged in
parallel to form a flat heat receiving surface, which is thermally
connected to the base plate 2. At the same time, plural top
surfaces of the thin plate fins are also arranged in parallel to
form a flat surface. The connecting method may be of any well-known
technique such as soldering or brazing (the same goes for other
examples).
[0065] In the form illustrated in FIG. 12B, the thin plate fins
each of which is composed of a bottom surface and a vertical
surface and has an L shaped cross section are arranged in parallel
to form a heat dissipating fin section. Also in this form, the
plural top surfaces are arranged in parallel to form a flat heat
receiving surface, and the heat dissipating fin section is open at
the top surface side.
[0066] In the form illustrated in FIG. 12C, the above-mentioned
thin plate fins each of which is composed of a bottom surface, a
vertical surface and a top surface and has a U shaped cross section
and the above-mentioned thin plate fins each of which is composed
of a bottom surface and a vertical surface and has an L shaped
cross section are combined appropriately to form a thin dissipating
fin section 4. Combination is not limited to the form illustrated
in FIG. 12C, but may be determined freely. For example, the heat
dissipating fin section explained with reference to FIG. 12B may be
arranged at each end and the heat dissipating fin section explained
with reference to FIG. 12A may be combined into the center thereof.
The above-described thin plate fins illustrated in FIGS. 12A, 12B
and 12C have the bottom surfaces which are bonded and fixed to the
base plate 2 by soldering, brazing or the like. Here, out of the
thin plate fins illustrated in FIGS. 12A, 12B and 12C, thin plate
fins having identical shapes or different shapes may be combined
appropriately on both surfaces of the base plate 2. For example,
the thin plate fins illustrated in FIG. 12A may be mounted on the
bottom surface of the base plate 2 and the thin plate fins
illustrated in FIG. 12A may be mounted on the top surface of the
base plate 2.
[0067] As described up to this point, the heat sink of the present
invention uses two kinds of thin plate fins having different
heights, which are provided in adjacent to each other with almost
no space therebetween. The heat pipes can be in contact with the
fins all over the second heat dissipating fin section including the
plural parallel high thin plate fins (B) or stacked thin plate fins
(D) thereby to enhance the heat dissipating performance and save
space with small-sized fins. Further, as the thin plate fins are
provided vertically on the surface on which side the heat
generating component of the base plate is located an thermally
connected thereto, it is possible to enhance the heat dissipating
characteristics.
REFERENCE NUMERALS
[0068] 1 heat sink [0069] 2 base plate [0070] 3 upper plate [0071]
A low thin plate fin [0072] B high thin plate fin [0073] C thin
plate fin [0074] 5 second heat dissipating fin section [0075] 6
fixing part [0076] 7 first heat dissipating fin section [0077] 8
heat pipe [0078] 9 end of heat pipe [0079] 10 heat generating
component
* * * * *