Heat-dissipating Structure For Motor Stator

Chou; Chu-Hsien

Patent Application Summary

U.S. patent application number 12/902924 was filed with the patent office on 2012-04-12 for heat-dissipating structure for motor stator. Invention is credited to Chu-Hsien Chou.

Application Number20120085519 12/902924
Document ID /
Family ID45924220
Filed Date2012-04-12

United States Patent Application 20120085519
Kind Code A1
Chou; Chu-Hsien April 12, 2012

HEAT-DISSIPATING STRUCTURE FOR MOTOR STATOR

Abstract

A heat-dissipating structure for a motor stator is applied to a heat-dissipating fan and includes a silicon steel set and at least one heat pipe. The silicon steel set has a plurality of silicon steel pieces stacked up each other. Magnetic poles of the respective silicon steel pieces are stacked up to form at least one magnetic post. At least one coil set is wound on the magnetic poles. The heat pipe is connected to the silicon steel pieces for thermally conducting the heat of the silicon steel set and the coil set. With this arrangement, the temperature of the silicon steel set and the coil set is lowered, and the performance of the heat-dissipating fan is improved.


Inventors: Chou; Chu-Hsien; (Sinjhuang City, TW)
Family ID: 45924220
Appl. No.: 12/902924
Filed: October 12, 2010

Current U.S. Class: 165/104.26
Current CPC Class: H02K 9/20 20130101; H02K 1/20 20130101; H02K 1/187 20130101; H02K 11/33 20160101; F28D 15/0275 20130101
Class at Publication: 165/104.26
International Class: F28D 15/04 20060101 F28D015/04

Claims



1. A heat-dissipating structure for a motor stator, including: a silicon steel set having a plurality of silicon steel pieces stacked up each other, the silicon steel pieces extending outwards to form a plurality of magnetic poles, the magnetic poles being stacked up to form at least one magnetic posts, at least one coil set being wound on the magnetic posts; and at least one heat pipe connected to the silicon steel pieces for thermally conducting the heat of the coil set and the silicon steel set.

2. The heat-dissipating structure for a motor stator according to claim 1, further including a fan circuit board connected to one side of the silicon steel set, the heat pipe being disposed through the fan circuit board.

3. The heat-dissipating structure for a motor stator according to claim 1, wherein one end of the magnetic pole has an expanding portion, the magnetic poles are stacked up to form the magnetic post, the expanding portions are stacked up to form a magnetic pole end.

4. The heat-dissipating structure for a motor stator according to claim 3, wherein the heat pipe is connected to the magnetic pole end.

5. The heat-dissipating structure for a motor stator according to claim 1, wherein the center of the silicon steel piece has a hole, the holes of the respective silicon steel pieces are stacked up to form a channel.

6. The heat-dissipating structure for a motor stator according to claim 5, wherein the heat pipe is connected to the silicon steel piece and adjacent to the channel.
Description



BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a heat-dissipating structure for a motor stator, and in particular to a heat-dissipating structure for a motor stator whereby the temperature of a silicon steel piece and a coil set is lowered and the performance of a heat-dissipating fan is improved.

[0003] 2. Description of Prior Art

[0004] With the advancement of the electronic industry, the operating speed of an electronic element is continuously increased so that its performance is substantially enhanced. Since the operating speed of a chip set within the electronic element raises and more chips are installed in a chip set, the amount of heat generated by the chips is also increased greatly. If the heat generated by the chips is not dissipated to the outside immediately, the performance of the electronic element will be deteriorated, reducing the operating speed of the electronic element. Even, the heat is accumulated so much that the electronic element may be burned out. Thus, heat dissipation of the electronic element is very important.

[0005] In a conventional heat-dissipating device, a heat-dissipating fan is used to generate airflow for taking away the heat absorbed by heat-dissipating fins to increase the heat-dissipating effect of the whole device. Thus, the heat-dissipating fan is an important component in the heat-dissipating device.

[0006] The conventional heat-dissipating fan is constituted of a rotor set, a stator set and a fan circuit board. The rotor set is provided on one side of the stator set, and the fan circuit board is provided on the other side of the stator set. The stator set includes a silicon steel set. A magnetic post extends outwards from the silicon steel set. A coil set is wound on the magnetic post. The coil set is electrically connected to the fan circuit board and the electronic components arranged thereon. Thus, when the heat-dissipating fan is in operation, the fan circuit board is electrically connected to the electronic components, so that the electronic components drive the coil set wound on the magnetic post to generate magnetic poles. Then, the magnetic poles generated by the coil set drive the rotor set to rotate. When the electronic components drive the coil set to generate the magnetic poles, the temperature of the coil set and the silicon steel set is increased. However, there is no heat-dissipating device near the coil set and the silicon steel set, which makes the heat generated by the coil set unable to be dissipated to the outside but accumulated in the coil set. As a result, the performance of the heat-dissipating fan is deteriorated.

[0007] According to the above, the conventional heat-dissipating fan has problems as follows: (1) the heat generated by the coil set and the silicon steel set cannot be dissipated effectively; (2) the performance of the heat-dissipating fan is deteriorated; and (3) the heat-dissipating fan cannot exhibit a sufficient heat-dissipating efficiency.

SUMMARY OF THE INVENTION

[0008] In order to solve the above problems, an objective of the present invention is to provide a heat-dissipating structure for a motor stator, whereby the temperature of the silicon steel set and the coil set can be lowered.

[0009] Another objective of the present invention is to provide a heat-dissipating structure for a motor stator, whereby the performance of a heat-dissipating fan can be increased.

[0010] In order to achieve the above objective, the present invention is to provide a heat-dissipating structure for a motor stator, applied to a heat-dissipating fan and including: a silicon steel set and at least one heat pipe. The silicon steel set has a plurality of silicon steel pieces stacked up each other. A plurality of magnetic poles extends outwards from the silicon steel pieces. At least one magnetic post is stacked up between the magnetic poles of the respective silicon steel pieces. At least one coil set is wound on the magnetic poles. The heat pipe is connected to the silicon steel pieces for thermally conducting the heat of the silicon steel set and the coil set. With this arrangement, the temperature of the silicon steel set and the coil set is lowered, and the performance of the heat-dissipating fan is increased.

[0011] According to the above, the present invention has advantageous features as follows: (1) the temperature of the silicon steel set and the coil set is lowered; (2) the performance of the heat-dissipating fan is improved; and (3) the heat-dissipating fan exhibits a sufficient heat-dissipating efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG. 1 is an exploded perspective view showing a preferred embodiment of the present invention;

[0013] FIG. 2 is a perspective view showing the preferred embodiment of the present invention;

[0014] FIG. 3 is a cross-sectional view showing the preferred embodiment of the present invention;

[0015] FIG. 4 is a perspective view showing another preferred embodiment of the present invention;

[0016] FIG. 5 is a cross-sectional view showing another preferred embodiment of the present invention;

[0017] FIG. 6 is a perspective view showing a further preferred embodiment of the present invention;

[0018] FIG. 7 is a cross-sectional view showing a further preferred embodiment of the present invention;

[0019] FIG. 8 is a perspective view showing a still further preferred embodiment of the present invention; and

[0020] FIG. 9 is a cross-sectional view showing a still further preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0021] The above objectives and structural and functional features of the present invention will be described in more detail with reference to preferred embodiments thereof shown in the accompanying drawings

[0022] Please refer to FIGS. 1 to 3. The present invention provides a heat-dissipating structure for a motor stator, which is applied to a heat-dissipating fan in a preferred embodiment. The motor stator 1 includes a silicon steel set 2, at least one heat pipe 4 and a fan circuit board 5. The silicon steel set 2 has a plurality of silicon steel pieces 21. The center of each silicon steel piece 21 is formed with a hole 23, and the peripheral end of the silicon steel piece relative to the hole 23 is formed with an expanding portion 24. The silicon steel pieces 21 are stacked up to form the silicon steel set 2. When the silicon steel pieces 21 are stacked up each other, magnetic poles 22 of the respective silicon steel pieces 21 are stacked up to form at least one magnetic post 221 and the holes 23 form a channel 231. The expanding portions 24 outside the holes 23 are stacked up to form at least one magnetic pole end 241. Both ends of the silicon steel set 2 are provided with an electrical-insulating portion 25. At least one coil set 3 is wound on the electrical-insulating portion 25. The heat pipe 4 is connected to the silicon steel set 2 for thermally conducting the heat of the coil set 3 and the silicon steel set 2. The fan circuit board 5 is connected to one side of the silicon steel set 2 and electrically connected to the coil set 3. The board circuit board 5 is provided with at least one electronic element 51.

[0023] The heat pipe 4 is connected to the silicon steel set 2. In the present embodiment, the heat pipes 4 are connected to the magnetic pole ends 241 respectively. When the fan circuit board 5 is electrically connected to an electronic element 51, the fan circuit board 5 and the electronic element 51 together drive the coil set 3 and the silicon steel set 2 to generate the magnetic poles 22. When the magnetic poles 22 are generated, the temperature of the coil set 3 and the silicon steel set 2 rises and heat is accumulated therein. At this time, the heat pipe 4 adjacent to the magnetic pole end 241 absorbs the heat of the silicon steel set 2 and the coil set 3, thereby lowering the temperature of the coil set 3 and the silicon steel set 2 and improving the performance of the heat-dissipating fan.

[0024] Please refer to FIGS. 4 and 5 showing another preferred embodiment of the present invention. In the present embodiment, the structural relationship among the elements is substantially the same as that of the present embodiment, and thus the redundant description is omitted for simplicity. The difference between the present embodiment and the previous embodiment lies in that: the heat pipe 4 is connected to the silicon steel set 2 and also assembled on the fan circuit board 5, thereby electrically connecting the fan circuit board 5 to the electronic element 51. With this arrangement, when the electronic element 51 generates heat, the heat pipe 4 thermally conducts the heat of the electronic element 51 to lower the temperature of the electronic element 51 on the fan circuit board 5.

[0025] Please refer to FIGS. 6 and 7 showing a further preferred embodiment of the present invention. In the present embodiment, the structural relationship among the elements is substantially the same as that of the present embodiment, and thus the redundant description is omitted for simplicity. The difference between the present embodiment and the previous embodiment lies in that: the heat pipe 4 is serially connected to the silicon steel set 2 and adjacent to the channel 231 for absorbing the heat of the silicon steel set 2 and the coil set 3, thereby lowering the temperature of the coil set 3 and the silicon steel set 2.

[0026] Please refer to FIGS. 8 and 9 showing a still further preferred embodiment of the present invention. In the present embodiment, the heat pipe 4 is serially connected to the silicon steel set 2 and exposed from the channel 231. The heat pipe 4 absorbs the heat of the silicon steel set 2 and the coil set 3, and the exposed portion of the heat pipe from the channel 231 is used for heat dissipation.

[0027] Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

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