U.S. patent application number 12/902924 was filed with the patent office on 2012-04-12 for heat-dissipating structure for motor stator.
Invention is credited to Chu-Hsien Chou.
Application Number | 20120085519 12/902924 |
Document ID | / |
Family ID | 45924220 |
Filed Date | 2012-04-12 |
United States Patent
Application |
20120085519 |
Kind Code |
A1 |
Chou; Chu-Hsien |
April 12, 2012 |
HEAT-DISSIPATING STRUCTURE FOR MOTOR STATOR
Abstract
A heat-dissipating structure for a motor stator is applied to a
heat-dissipating fan and includes a silicon steel set and at least
one heat pipe. The silicon steel set has a plurality of silicon
steel pieces stacked up each other. Magnetic poles of the
respective silicon steel pieces are stacked up to form at least one
magnetic post. At least one coil set is wound on the magnetic
poles. The heat pipe is connected to the silicon steel pieces for
thermally conducting the heat of the silicon steel set and the coil
set. With this arrangement, the temperature of the silicon steel
set and the coil set is lowered, and the performance of the
heat-dissipating fan is improved.
Inventors: |
Chou; Chu-Hsien; (Sinjhuang
City, TW) |
Family ID: |
45924220 |
Appl. No.: |
12/902924 |
Filed: |
October 12, 2010 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H02K 9/20 20130101; H02K
1/20 20130101; H02K 1/187 20130101; H02K 11/33 20160101; F28D
15/0275 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A heat-dissipating structure for a motor stator, including: a
silicon steel set having a plurality of silicon steel pieces
stacked up each other, the silicon steel pieces extending outwards
to form a plurality of magnetic poles, the magnetic poles being
stacked up to form at least one magnetic posts, at least one coil
set being wound on the magnetic posts; and at least one heat pipe
connected to the silicon steel pieces for thermally conducting the
heat of the coil set and the silicon steel set.
2. The heat-dissipating structure for a motor stator according to
claim 1, further including a fan circuit board connected to one
side of the silicon steel set, the heat pipe being disposed through
the fan circuit board.
3. The heat-dissipating structure for a motor stator according to
claim 1, wherein one end of the magnetic pole has an expanding
portion, the magnetic poles are stacked up to form the magnetic
post, the expanding portions are stacked up to form a magnetic pole
end.
4. The heat-dissipating structure for a motor stator according to
claim 3, wherein the heat pipe is connected to the magnetic pole
end.
5. The heat-dissipating structure for a motor stator according to
claim 1, wherein the center of the silicon steel piece has a hole,
the holes of the respective silicon steel pieces are stacked up to
form a channel.
6. The heat-dissipating structure for a motor stator according to
claim 5, wherein the heat pipe is connected to the silicon steel
piece and adjacent to the channel.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat-dissipating
structure for a motor stator, and in particular to a
heat-dissipating structure for a motor stator whereby the
temperature of a silicon steel piece and a coil set is lowered and
the performance of a heat-dissipating fan is improved.
[0003] 2. Description of Prior Art
[0004] With the advancement of the electronic industry, the
operating speed of an electronic element is continuously increased
so that its performance is substantially enhanced. Since the
operating speed of a chip set within the electronic element raises
and more chips are installed in a chip set, the amount of heat
generated by the chips is also increased greatly. If the heat
generated by the chips is not dissipated to the outside
immediately, the performance of the electronic element will be
deteriorated, reducing the operating speed of the electronic
element. Even, the heat is accumulated so much that the electronic
element may be burned out. Thus, heat dissipation of the electronic
element is very important.
[0005] In a conventional heat-dissipating device, a
heat-dissipating fan is used to generate airflow for taking away
the heat absorbed by heat-dissipating fins to increase the
heat-dissipating effect of the whole device. Thus, the
heat-dissipating fan is an important component in the
heat-dissipating device.
[0006] The conventional heat-dissipating fan is constituted of a
rotor set, a stator set and a fan circuit board. The rotor set is
provided on one side of the stator set, and the fan circuit board
is provided on the other side of the stator set. The stator set
includes a silicon steel set. A magnetic post extends outwards from
the silicon steel set. A coil set is wound on the magnetic post.
The coil set is electrically connected to the fan circuit board and
the electronic components arranged thereon. Thus, when the
heat-dissipating fan is in operation, the fan circuit board is
electrically connected to the electronic components, so that the
electronic components drive the coil set wound on the magnetic post
to generate magnetic poles. Then, the magnetic poles generated by
the coil set drive the rotor set to rotate. When the electronic
components drive the coil set to generate the magnetic poles, the
temperature of the coil set and the silicon steel set is increased.
However, there is no heat-dissipating device near the coil set and
the silicon steel set, which makes the heat generated by the coil
set unable to be dissipated to the outside but accumulated in the
coil set. As a result, the performance of the heat-dissipating fan
is deteriorated.
[0007] According to the above, the conventional heat-dissipating
fan has problems as follows: (1) the heat generated by the coil set
and the silicon steel set cannot be dissipated effectively; (2) the
performance of the heat-dissipating fan is deteriorated; and (3)
the heat-dissipating fan cannot exhibit a sufficient
heat-dissipating efficiency.
SUMMARY OF THE INVENTION
[0008] In order to solve the above problems, an objective of the
present invention is to provide a heat-dissipating structure for a
motor stator, whereby the temperature of the silicon steel set and
the coil set can be lowered.
[0009] Another objective of the present invention is to provide a
heat-dissipating structure for a motor stator, whereby the
performance of a heat-dissipating fan can be increased.
[0010] In order to achieve the above objective, the present
invention is to provide a heat-dissipating structure for a motor
stator, applied to a heat-dissipating fan and including: a silicon
steel set and at least one heat pipe. The silicon steel set has a
plurality of silicon steel pieces stacked up each other. A
plurality of magnetic poles extends outwards from the silicon steel
pieces. At least one magnetic post is stacked up between the
magnetic poles of the respective silicon steel pieces. At least one
coil set is wound on the magnetic poles. The heat pipe is connected
to the silicon steel pieces for thermally conducting the heat of
the silicon steel set and the coil set. With this arrangement, the
temperature of the silicon steel set and the coil set is lowered,
and the performance of the heat-dissipating fan is increased.
[0011] According to the above, the present invention has
advantageous features as follows: (1) the temperature of the
silicon steel set and the coil set is lowered; (2) the performance
of the heat-dissipating fan is improved; and (3) the
heat-dissipating fan exhibits a sufficient heat-dissipating
efficiency.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an exploded perspective view showing a preferred
embodiment of the present invention;
[0013] FIG. 2 is a perspective view showing the preferred
embodiment of the present invention;
[0014] FIG. 3 is a cross-sectional view showing the preferred
embodiment of the present invention;
[0015] FIG. 4 is a perspective view showing another preferred
embodiment of the present invention;
[0016] FIG. 5 is a cross-sectional view showing another preferred
embodiment of the present invention;
[0017] FIG. 6 is a perspective view showing a further preferred
embodiment of the present invention;
[0018] FIG. 7 is a cross-sectional view showing a further preferred
embodiment of the present invention;
[0019] FIG. 8 is a perspective view showing a still further
preferred embodiment of the present invention; and
[0020] FIG. 9 is a cross-sectional view showing a still further
preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0021] The above objectives and structural and functional features
of the present invention will be described in more detail with
reference to preferred embodiments thereof shown in the
accompanying drawings
[0022] Please refer to FIGS. 1 to 3. The present invention provides
a heat-dissipating structure for a motor stator, which is applied
to a heat-dissipating fan in a preferred embodiment. The motor
stator 1 includes a silicon steel set 2, at least one heat pipe 4
and a fan circuit board 5. The silicon steel set 2 has a plurality
of silicon steel pieces 21. The center of each silicon steel piece
21 is formed with a hole 23, and the peripheral end of the silicon
steel piece relative to the hole 23 is formed with an expanding
portion 24. The silicon steel pieces 21 are stacked up to form the
silicon steel set 2. When the silicon steel pieces 21 are stacked
up each other, magnetic poles 22 of the respective silicon steel
pieces 21 are stacked up to form at least one magnetic post 221 and
the holes 23 form a channel 231. The expanding portions 24 outside
the holes 23 are stacked up to form at least one magnetic pole end
241. Both ends of the silicon steel set 2 are provided with an
electrical-insulating portion 25. At least one coil set 3 is wound
on the electrical-insulating portion 25. The heat pipe 4 is
connected to the silicon steel set 2 for thermally conducting the
heat of the coil set 3 and the silicon steel set 2. The fan circuit
board 5 is connected to one side of the silicon steel set 2 and
electrically connected to the coil set 3. The board circuit board 5
is provided with at least one electronic element 51.
[0023] The heat pipe 4 is connected to the silicon steel set 2. In
the present embodiment, the heat pipes 4 are connected to the
magnetic pole ends 241 respectively. When the fan circuit board 5
is electrically connected to an electronic element 51, the fan
circuit board 5 and the electronic element 51 together drive the
coil set 3 and the silicon steel set 2 to generate the magnetic
poles 22. When the magnetic poles 22 are generated, the temperature
of the coil set 3 and the silicon steel set 2 rises and heat is
accumulated therein. At this time, the heat pipe 4 adjacent to the
magnetic pole end 241 absorbs the heat of the silicon steel set 2
and the coil set 3, thereby lowering the temperature of the coil
set 3 and the silicon steel set 2 and improving the performance of
the heat-dissipating fan.
[0024] Please refer to FIGS. 4 and 5 showing another preferred
embodiment of the present invention. In the present embodiment, the
structural relationship among the elements is substantially the
same as that of the present embodiment, and thus the redundant
description is omitted for simplicity. The difference between the
present embodiment and the previous embodiment lies in that: the
heat pipe 4 is connected to the silicon steel set 2 and also
assembled on the fan circuit board 5, thereby electrically
connecting the fan circuit board 5 to the electronic element 51.
With this arrangement, when the electronic element 51 generates
heat, the heat pipe 4 thermally conducts the heat of the electronic
element 51 to lower the temperature of the electronic element 51 on
the fan circuit board 5.
[0025] Please refer to FIGS. 6 and 7 showing a further preferred
embodiment of the present invention. In the present embodiment, the
structural relationship among the elements is substantially the
same as that of the present embodiment, and thus the redundant
description is omitted for simplicity. The difference between the
present embodiment and the previous embodiment lies in that: the
heat pipe 4 is serially connected to the silicon steel set 2 and
adjacent to the channel 231 for absorbing the heat of the silicon
steel set 2 and the coil set 3, thereby lowering the temperature of
the coil set 3 and the silicon steel set 2.
[0026] Please refer to FIGS. 8 and 9 showing a still further
preferred embodiment of the present invention. In the present
embodiment, the heat pipe 4 is serially connected to the silicon
steel set 2 and exposed from the channel 231. The heat pipe 4
absorbs the heat of the silicon steel set 2 and the coil set 3, and
the exposed portion of the heat pipe from the channel 231 is used
for heat dissipation.
[0027] Although the present invention has been described with
reference to the foregoing preferred embodiments, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
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