U.S. patent application number 12/970969 was filed with the patent office on 2012-04-05 for touch panel and repairing method thereof.
This patent application is currently assigned to AU OPTRONICS CORPORATION. Invention is credited to Lih-Hsiung Chan, Hung-Wen Chou, Chin-Yueh Liao, Shine-Kai Tseng.
Application Number | 20120081300 12/970969 |
Document ID | / |
Family ID | 45889350 |
Filed Date | 2012-04-05 |
United States Patent
Application |
20120081300 |
Kind Code |
A1 |
Chan; Lih-Hsiung ; et
al. |
April 5, 2012 |
TOUCH PANEL AND REPAIRING METHOD THEREOF
Abstract
A touch panel including a substrate, a plurality of first and
second sensing series, and a plurality of conductive repairing
pattern layers is provided. The first sensing series are disposed
on the substrate and extended along a first direction. Each of the
first sensing series includes a plurality of first sensing pads and
first bridge lines, and the first bridge lines serially connect two
adjacent first sensing pads. The second sensing series are disposed
on the substrate and extended along a second direction. Each of the
second sensing series includes a plurality of second sensing pads
and second bridge lines, and the second bridge lines serially
connect two adjacent second sensing pads. Each conductive repairing
pattern layer electrically floating locates around the crossover
region of the first and second sensing series. Two adjacent sensing
pads are connected by the conductive repairing pattern layer after
a repair procedure is finished.
Inventors: |
Chan; Lih-Hsiung; (Kaohsiung
City, TW) ; Tseng; Shine-Kai; (Taoyuan County,
TW) ; Liao; Chin-Yueh; (Taipei City, TW) ;
Chou; Hung-Wen; (Taipei City, TW) |
Assignee: |
AU OPTRONICS CORPORATION
Hsinchu
TW
|
Family ID: |
45889350 |
Appl. No.: |
12/970969 |
Filed: |
December 17, 2010 |
Current U.S.
Class: |
345/173 ;
29/825 |
Current CPC
Class: |
G06F 2203/04103
20130101; G06F 3/047 20130101; G06F 3/0445 20190501; G06F
2203/04111 20130101; Y10T 29/49117 20150115; G06F 2203/04112
20130101; G06F 3/0446 20190501 |
Class at
Publication: |
345/173 ;
29/825 |
International
Class: |
G06F 3/041 20060101
G06F003/041; H01R 43/00 20060101 H01R043/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 4, 2010 |
TW |
99133743 |
Claims
1. A touch panel, comprising: a substrate; a plurality of first
sensing series, disposed on the substrate and extended along a
first direction, wherein each of the first sensing series includes
a plurality of first sensing pads and a plurality of first bridge
lines, and the first bridge lines serially connect two adjacent
first sensing pads; a plurality of second sensing series, disposed
on the substrate and extended along a second direction, wherein
each of the second sensing series includes a plurality of second
sensing pads and a plurality of second bridge lines, the second
bridge lines serially connect two adjacent second sensing pads, the
first direction is different from the second direction, and the
plurality of first sensing series and the plurality of second
sensing series are electrically insulated from each other; and a
plurality of conductive repairing pattern layers, wherein each of
the conductive repairing pattern layers is overlapped with two
adjacent first sensing pads in the same first sensing series, and
the conductive repairing pattern layers are electrically
floating.
2. The touch panel as claimed in claim 1, further comprising a
first dielectric layer, disposed on the substrate to cover the
conductive repairing pattern layers, wherein the first dielectric
layer includes a plurality of contact windows, and the first
sensing pads and the second sensing pads are disposed on the first
dielectric layer.
3. The touch panel as claimed in claim 2, wherein the first
dielectric layer further covers the first bridge lines, the first
sensing pads connect to the first bridge lines through the contact
windows, and the second bridge lines are disposed on the first
dielectric layer.
4. The touch panel as claimed in claim 2, wherein the first
dielectric layer further covers the second bridge lines, the second
sensing pads connect to the second bridge lines through the contact
windows, and the first bridge lines are disposed on the first
dielectric layer.
5. The touch panel as claimed in claim 2, further comprising a
second dielectric layer, disposed on the first dielectric layer to
cover the first sensing series and the second sensing series.
6. The touch panel as claimed in claim 1, further comprising a
first dielectric layer, disposed on the substrate to cover the
first sensing pads and the second sensing pads, wherein the first
dielectric layer includes a plurality of contact windows, and the
conductive repairing pattern layers are disposed on the first
dielectric layer.
7. The touch panel as claimed in claim 6, wherein the first
dielectric layer further covers the first bridge lines, the second
bridge lines are disposed on the first dielectric layer, and the
second sensing pads connect to the second bridge lines through the
contact windows.
8. The touch panel as claimed in claim 6, wherein the first
dielectric layer further covers the second bridge lines, the first
bridge lines are disposed on the first dielectric layer, and the
first sensing pads connect to the first bridge lines through the
contact windows.
9. The touch panel as claimed in claim 1, wherein a material of the
conductive repairing pattern layers comprises a transparent
conductive material.
10. The touch panel as claimed in claim 1, wherein a material of
the conductive repairing pattern layers comprises a metallic
conductive material.
11. The touch panel as claimed in claim 1, wherein the first bridge
lines and the conductive repairing pattern layers are made up of
the same layer.
12. The touch panel as claimed in claim 1, wherein the second
bridge lines and the conductive repairing pattern layers are made
up of the same layer.
13. The touch panel as claimed in claim 1, wherein a material of
the first sensing pads, a material of the first bridge lines and a
material of the second sensing pads are the same.
14. The touch panel as claimed in claim 1, wherein each of the
conductive repairing pattern layers comprises a mesh repairing
pattern layer, the mesh repairing pattern layer is overlapped with
the corresponding two adjacent first sensing pads, and is
overlapped with the corresponding two adjacent second sensing
pads.
15. The touch panel as claimed in claim 1, wherein each of the
conductive repairing pattern layers comprises a plurality of first
repairing lines electrically connected, and each of the first
repairing lines is overlapped with the corresponding two adjacent
first sensing pads.
16. The touch panel as claimed in claim 1, wherein each of the
conductive repairing pattern layers is further overlapped with two
adjacent second sensing pads in the same second sensing series.
17. The touch panel as claimed in claim 16, wherein each of the
conductive repairing pattern layers comprises a plurality of first
repairing lines electrically connected and a plurality of second
repairing lines electrically connected, each of the first repairing
lines is overlapped with the corresponding two adjacent first
sensing pads, each of the second repairing lines is overlapped with
the corresponding two adjacent second sensing pads, and the first
repairing lines are electrically connected to the second repairing
lines.
18. The touch panel as claimed in claim 1, further comprising a
plurality of dummy electrodes, disposed between the first sensing
pads and the second sensing pads.
19. The touch panel as claimed in claim 1, further comprising a
plurality of peripheral connecting lines, electrically connected to
corresponding first sensing series and corresponding second sensing
series respectively.
20. A repairing method for repairing a touch panel, suitable to
repair the touch panel as claimed in claim 1 when a short defect or
an open defect occurs in a crossover region of a first bridge line
and a second bridge line of the touch panel, the repairing method
comprising: cutting the first bridge line with the defect,
therefore two adjacent first sensing pads originally connected
through the first bridge line to be electrically insulated; and
electrically connecting the two adjacent first sensing pads
electrically insulated through a conductive repairing pattern layer
overlapped with the two adjacent first sensing pads.
21. The touch panel repair method as claimed in claim 20, wherein a
method of cutting the first bridge line with the defect includes a
laser cutting process.
22. The touch panel repair method as claimed in claim 20, wherein a
method of electrically connecting the two adjacent first sensing
pads electrically insulated through the conductive repairing
pattern layer overlapped with the two adjacent first sensing pads
includes welding the conductive repairing pattern layer with the
two adjacent first sensing pads.
23. The touch panel repair method as claimed in claim 22, wherein a
method of welding includes a laser welding process.
24. A touch panel, comprising: a substrate; a plurality of first
bridge lines, disposed on the substrate, and extended along a first
direction; a plurality of conductive repairing pattern layers,
disposed on the substrate, wherein the conductive repairing pattern
layers are electrically floating; a first dielectric layer,
disposed on the substrate to cover the conductive repairing pattern
layers and the first bridge lines, wherein the first dielectric
layer includes a plurality of contact windows, and each of the
first bridge lines corresponds to two or more contact windows; a
plurality of first sensing pads, disposed on the first dielectric
layer, wherein the first bridge lines serially connect the two
adjacent first sensing pads through the contact windows, and the
first sensing pads and the first bridge lines form a plurality of
first sensing series arranged in parallel; and a plurality of
second sensing series, arranged in parallel and disposed on the
dielectric layer, and extended along a second direction, wherein
each of the second sensing series includes a plurality of second
sensing pads and a plurality of second bridge lines, the second
bridge lines serially connect two adjacent second sensing pads, and
the first direction is different from the second direction, wherein
the first sensing series and the second sensing series are
electrically insulated from each other, wherein each of the
conductive repairing pattern layers is overlapped with the
corresponding two adjacent first sensing pads, and is overlapped
with the corresponding two adjacent second sensing pads.
25. A touch panel, comprising: a substrate; a plurality of first
sensing pads, disposed on the substrate and extended along a first
direction; a plurality of second sensing series, arranged in
parallel and disposed on the substrate, and extended along a second
direction, wherein each of the second sensing series includes a
plurality of second sensing pads and a plurality of second bridge
lines, the second bridge lines serially connect two adjacent second
sensing pads, the first direction is different from the second
direction, and the first sensing pads and the second sensing series
are electrically insulated from each other; a first dielectric
layer, disposed on the substrate to cover the first sensing pads
and the second sensing series, wherein the first dielectric layer
includes a plurality of contact windows, and each of the first
sensing pads corresponds to two contact windows; a plurality of
first bridge lines, disposed on the first dielectric layer along a
first direction, wherein the first bridge lines serially connect
the two adjacent first sensing pads through the contact windows to
form a plurality of first sensing series arranged in parallel; and
a plurality of conductive repairing patterns, disposed on the first
dielectric layer, wherein the conductive repairing patterns are
electrically floating, each of the conductive repairing pattern
layers is overlapped with the corresponding two adjacent first
sensing pads, and is overlapped with the corresponding two adjacent
second sensing pads.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 99133743, filed on Oct. 4, 2010. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a panel and a repairing method
thereof, and more particularly to a touch panel and a repairing
method thereof.
[0004] 2. Description of Related Art
[0005] Based on different ways of sensing, touch panels are
generally categorized into resistant touch panels, capacitive touch
panels, optical touch panels, sonic wave touch panels, and
electromagnetic touch panels. The capacitive touch panels having
advantages of fast response speed, favorable reliability, and
durability have been used extensively in electronic devices. In
view of structures and manufacturing methods, capacitive touch
display panels can be further classified into an additive type and
an integrated/in-cell type. In an additive-type capacitive touch
display panel, sensing series are first formed on a substrate, and
the substrate having the sensing series thereon is then adhered to
an outer surface of a display panel. Consequently, the
additive-type touch display panel inevitably has a certain
thickness. Compared with the additive-type touch panel, an
integrated/in-cell type touch display panel is more conducive to
the slimness and lightness of the display.
[0006] However, in terms of fabrication, the integrated/in-cell
type touch display panel and the additive-type touch display panel
both encounter the problem of a low yield rate resulting from
electrostatic discharge, and the above problem is especially
serious in the integrated/in-cell type touch display panel. For
instance, most of the current integrated/in-cell type touch display
panels are fabricated by forming a touch-control circuit on one
surface of the substrate and then forming a color filter thin film
on the other surface of the substrate. While the color filter thin
film is formed, the touch-control circuit is often damaged due to
electrostatic discharge. Moreover, when an user touches the
integrated/in-cell type touch display panel or the additive-type
touch display panel with the fingers of the user, electrostatic
discharge may also occur, resulting in the damage of the
touch-control circuit.
[0007] Generally speaking, in the conventional capacitive touch
panel, metal bridge lines configured on a crossover region, where
an X sensing series intersect a Y sensing series, are used to
couple the adjacent sensing pads to each other to avoid the short
circuit happening on the X sensing series and the Y sensing series
around the crossover region. For example, the two adjacent sensing
pads of the X sensing series or the Y sensing series are
electrically connected through a metal bridge line. However, when
electrostatic discharge occurs, the metal bridge line in the
crossover region of the X sensing series and the Y sensing series
could be burned, causing a short defect or an open defect. As a
result, the X sensing series or the Y sensing series will be unable
to operate normally. Since electrostatic discharge is inevitable
during fabrication and use, how to swiftly repair the sensing
series when a short defect or an open defect occurs, is one of the
important issues that all designers seek to overcome.
SUMMARY OF THE INVENTION
[0008] The invention provides a touch panel having a favorable
yield.
[0009] The invention still further provides a repairing method of a
touch panel. The method repairs the sensing series of the touch
panel.
[0010] The invention provides a touch panel, including a substrate,
a plurality of first sensing series, a plurality of second sensing
series, and a plurality of conductive repairing pattern layers. The
first sensing series are disposed on the substrate and extended
along a first direction. Each of the first sensing series includes
a plurality of first sensing pads and a plurality of first bridge
lines. The first bridge lines serially connect two adjacent first
sensing pads. The second sensing series are disposed on the
substrate and extended along a second direction. Each of the second
sensing series includes a plurality of second sensing pads and a
plurality of second bridge lines. The second bridge lines serially
connect two adjacent second sensing pads. The first direction is
different from the second direction, and the first sensing series
and the second sensing series are electrically insulated from each
other. Each of the conductive repairing pattern layers is
overlapped with two adjacent first sensing pads in the same first
sensing series, and each conductive repairing pattern layer locates
around the crossover region of the first sensing series and the
second sensing series. The conductive repairing pattern layers are
electrically floating, and can connect the two adjacent sensing
pads after the repair procedure is finished.
[0011] An embodiment of the invention further comprises a first
dielectric layer, disposed on the substrate to cover the conductive
repairing pattern layers, wherein the first dielectric layer
includes a plurality of contact windows. The first sensing pads and
the second sensing pads are disposed on the first dielectric
layer.
[0012] In an embedment of the invention, the first dielectric layer
further covers the first bridge lines. The first sensing pads
connect to the first bridge lines through the contact windows, and
the second bridge lines are disposed on the first dielectric
layer.
[0013] In an embodiment of the invention, the first dielectric
layer further covers the second bridge lines. The second sensing
pads connect to the second bridge lines through the contact
windows, and the first bridge lines are disposed on the first
dielectric layer.
[0014] An embodiment of the invention further comprises a second
dielectric layer disposed on the first dielectric layer, so as to
cover the first sensing series and the second sensing series.
[0015] An embodiment of the invention further comprises a first
dielectric layer, disposed on the substrate to cover the first
sensing pads and the second sensing pads, wherein the first
dielectric layer includes a plurality of contact windows. The
conductive repairing pattern layers are disposed on the first
dielectric layer.
[0016] In an embodiment of the invention, the first dielectric
layer further covers the first bridge lines. The second bridge
lines are disposed on the first dielectric layer. The second
sensing pads connect to the second bridge lines through the contact
windows.
[0017] In an embodiment of the invention, the first dielectric
layer further covers the second bridge lines. The first bridge
lines are disposed on the first dielectric layer. The first sensing
pads connect to the first bridge lines through the contact
windows.
[0018] In an embodiment of the invention, a material of the
conductive repairing pattern layers is a transparent conductive
material.
[0019] In an embodiment of the invention, a material of the
conductive repairing pattern layers is a metallic conductive
material.
[0020] In an embodiment of the invention, the first bridge lines
and the conductive repairing pattern layers are made up of the same
layer.
[0021] In an embodiment of the invention, the second bridge lines
and the conductive repairing pattern layers are made up of the same
layer.
[0022] In an embodiment of the invention, a material of the first
sensing pads, a material of the first bridge lines and a material
of the second sensing pads are the same.
[0023] In an embodiment of the invention, the conductive repairing
pattern layer comprises a mesh repairing pattern layer. The mesh
repairing pattern layer is overlapped with the corresponding two
adjacent first sensing pads, and is overlapped with the
corresponding two adjacent second sensing pads.
[0024] In an embodiment of the invention, the conductive repairing
pattern layer comprises a plurality of first repairing lines
electrically connected, and each of the first repairing lines is
overlapped with the corresponding two adjacent first sensing
pads.
[0025] In an embodiment of the invention, the conductive repairing
pattern layer is further overlapped with two adjacent second
sensing pads in the same second sensing series.
[0026] In an embodiment of the invention, each of the conductive
repairing pattern layers comprises a plurality of first repairing
lines electrically connected and a plurality of second repairing
lines electrically connected. Each of the first repairing lines is
overlapped with the corresponding two adjacent first sensing pads,
and each of the second repairing lines is overlapped with the
corresponding two adjacent second sensing pads.
[0027] An embodiment of the invention further comprises a plurality
of dummy electrodes, disposed between the first sensing pads and
the second sensing pads.
[0028] An embodiment of the invention further comprises a plurality
of peripheral connecting lines, electrically connected to each
corresponding first sensing series and each corresponding second
sensing series respectively.
[0029] The invention further provides a repairing method for
repairing a touch panel. The repairing method is suitable to repair
the previously mentioned touch panel when a short defect or an open
defect occurs in a crossover region of a first bridge line and a
second bridge line of the touch panel. The first bridge line with
the defect is cut, therefore two adjacent first sensing pads
originally connected through the first bridge line are electrically
insulated. The two adjacent first sensing pads electrically
insulated are then electrically connected through a conductive
repairing pattern layer overlapped with the two adjacent first
sensing pads.
[0030] In an embodiment of the invention, a method of cutting the
first bridge line with the defect includes a laser cutting
process.
[0031] In an embodiment of the invention, the method of
electrically connecting the two adjacent first sensing pads
electrically insulated through the conductive repairing pattern
layer overlapped with the two adjacent first sensing pads includes
welding the conductive repairing pattern layer with the two
adjacent first sensing pads.
[0032] In an embodiment of the invention, the method of welding
includes a laser welding process.
[0033] The invention further provides a touch panel, including a
substrate, a plurality of first bridge lines, a plurality of
conductive repairing pattern layers, a first dielectric layer, a
plurality of first sensing pads, and a plurality of second sensing
series. The first bridge lines are disposed on the substrate, and
extended along a first direction. The conductive repairing pattern
layers are disposed on the substrate, and the conductive repairing
pattern layers are electrically floating. The first dielectric
layer is disposed on the substrate to cover the conductive
repairing pattern layers and the first bridge lines. The first
dielectric layer includes a plurality of contact windows, and each
of the first bridge lines corresponds to two or more contact
windows. The first sensing pads are disposed on the first
dielectric layer. The first bridge lines serially connect the two
adjacent first sensing pads through the contact windows, wherein
the first sensing pads and the first bridge lines forms a plurality
of first sensing series arranged in parallel. The second sensing
series are arranged in parallel and disposed on the dielectric
layer, extended along a second direction. Each of the second
sensing series includes a plurality of second sensing pads and a
plurality of second bridge lines. The second bridge lines serially
connect two adjacent second sensing pads, and the first direction
is different from the second direction, wherein the first sensing
series and the second sensing series are electrically insulated
from each other. Each of the conductive repairing pattern layers is
overlapped with the corresponding two adjacent first sensing pads,
and is overlapped with the corresponding two adjacent second
sensing pads.
[0034] The invention further provides a touch panel, including a
substrate, a plurality of first sensing pads, a plurality of second
sensing series, a first dielectric layer, a plurality of first
bridge lines, and a plurality of conductive repairing pattern
layers. The first sensing pads are disposed on the substrate and
extended along a first direction. The second sensing series are
arranged in parallel and disposed on the substrate, extended along
a second direction. Each of the second sensing series includes a
plurality of second sensing pads and a plurality of second bridge
lines. The second bridge lines serially connect two adjacent second
sensing pads. The first direction is different from the second
direction, wherein the first sensing pads and the second sensing
series are electrically insulated from each other. The first
dielectric layer is disposed on the substrate to cover the first
sensing pads and the second sensing series. The first dielectric
layer includes a plurality of contact windows, and each of the
first sensing pads corresponds to two or more contact windows. The
first bridge lines are disposed on the first dielectric layer along
a first direction. The first bridge lines serially connect the two
adjacent first sensing pads through the contact windows, forming a
plurality of first sensing series arranged in parallel. The
conductive repairing patterns are disposed on the first dielectric
layer, and the conductive repairing patterns are electrically
floating. Each of the conductive repairing pattern layers is
overlapped with the corresponding two adjacent first sensing pads,
and is overlapped with the corresponding two adjacent second
sensing pads.
[0035] Based on the above, in the touch panel and repairing method
of the invention, each of the conductive repairing pattern layers
is overlapped with two adjacent sensing pads in the same sensing
series. As such, when the crossover region of the two sensing
series has a short defect or an open defect, the conductive
repairing pattern layers can be used to repair the defects, so the
two sensing series can provide a normal sensing operation. As a
result, the touch panel has a favorable yield and simple repair
method.
[0036] In order to make the aforementioned and other features and
advantages of the invention more comprehensible, several
embodiments accompanied with figures are described in detail
below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0037] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate exemplary embodiments
and, together with the description, serve to explain the principles
of the disclosure.
[0038] FIG. 1A is a schematic top view of a touch panel according
to a first embodiment of the invention.
[0039] FIG. 1B is a partially enlarged schematic diagram of FIG.
1A.
[0040] FIG. 1C is schematic cross-sectional views taken along a
line I-I', a line II-II', and a line III-III' in FIG. 1B.
[0041] FIG. 2A to FIG. 2D are schematic top views illustrating the
manufacturing process of a touch panel in FIG. 1A.
[0042] FIG. 3A to FIG. 3D are respectively schematic
cross-sectional views taken along a line I-I', a line II-II', and a
line III-III' in FIG. 2A to FIG. 2D.
[0043] FIG. 4A and FIG. 4B depicts a repairing method of a touch
panel according to an embodiment of the invention.
[0044] FIG. 5A and FIG. 5B depicts a repairing method of a touch
panel according to an embodiment of the invention.
[0045] FIG. 6A is a schematic top view of a touch panel according
to a second embodiment of the invention.
[0046] FIG. 6B is a partially enlarged schematic diagram of FIG.
6A.
[0047] FIG. 6C is schematic cross-sectional views taken along a
line I-I', a line II-II', and a line III-III' in FIG. 6B.
[0048] FIG. 7A to FIG. 7D are schematic top views illustrating the
manufacturing process of a touch panel in FIG. 6A.
[0049] FIG. 8A to FIG. 8D are respectively schematic
cross-sectional views taken along a line I-I', a line II-II', and a
line III-III' in FIG. 7A to FIG. 7D.
[0050] FIG. 9A and FIG. 9B depicts a repairing method of a touch
panel according to an embodiment of the invention.
DESCRIPTION OF EMBODIMENTS
The First Embodiment
[0051] FIG. 1A is a schematic top view of a touch panel according
to a first embodiment of the invention. FIG. 1B is a partially
enlarged schematic diagram of FIG. 1A. FIG. 1C is schematic
cross-sectional views taken along a line I-I', a line II-II', and a
line III-III' in FIG. 1B. Referring to FIG. 1A to FIG. 1C, in the
embodiment, the touch panel 100 includes a substrate 102, a
plurality of first sensing series 110, a plurality of the second
sensing series 120, a plurality of conductive repairing pattern
layers 130, and a first dielectric layer 140. The substrate 102 is,
for example, a glass substrate, a plastic substrate, a flexible
substrate, or other substrates. The substrate 102 can also be a
printed circuit board or a display panel, such as a liquid crystal
display panel, an organic display panel, an electrophoresis display
panel, a plasma display panel, or other type display panels, and
can directly assembly on the display panel or in the display panel.
Taking a liquid crystal display panel as an example, the liquid
crystal display panel can be manufactured as an additive touch
liquid crystal display panel, an integrated type touch liquid
crystal display panel, or an in-cell type touch liquid crystal
display panel. The above details are well-known to persons skilled
in the art, and so no further descriptions are provided herein. In
the embodiment, the first dielectric layer 140 is, for example,
disposed on the substrate 102 to cover the conductive repairing
pattern layers 130, wherein the first dielectric layer 140 has a
plurality of contact windows 142. The contact windows 142 can be
dielectric through holes, dielectric openings, or dielectric vias,
exposing part of the conductive repairing pattern layers 130.
[0052] The first sensing series 110 are disposed on the substrate
102 and extended along a first direction D1. The first sensing
series 110 includes a plurality of first sensing pads 112 and a
plurality of first bridge lines 114. The first bridge lines 114
serially connect two adjacent first sensing pads 112. In the
embodiment, the first sensing series 110 are, for example, disposed
parallel to each other. The first direction D1 is, for example, an
x-axis direction. The first bridge lines 114 are, for example,
disposed on the substrate 102 and covered by the first dielectric
layer 140, wherein the first bridge lines 114 correspond to two
contact windows 142. The first sensing pads 112 are, for example,
disposed on the first dielectric layer 140, wherein the first
bridge lines 114, for example, serially connect two adjacent first
sensing pads 112 through the contact windows 142. A material of the
first sensing pads 112 is, for example, a transparent conductive
material, including indium tin oxide (ITO), indium zinc oxide
(IZO), or other transparent conductive metallic oxides. A material
of the first bridge lines 114 is, for example, a metallic
conductive material, including aluminum, copper, molybdenum,
titanium, silver, gold, platinum and other alloys or metals.
[0053] The second sensing series 120 are disposed on the substrate
102 and extended along a second direction D2. Each of the second
sensing series 120 includes a plurality of second sensing pads 122
and a plurality of second bridge lines 124. The second bridge lines
124 serially connect two adjacent second sensing pads 122. The
first direction D1 is different from the second direction D2. In
the embodiment, the second sensing series 120 are, for example,
disposed parallel to each other. The second direction D2 is, for
example, a y-axis direction, wherein the first direction D1 is, for
example, perpendicular to the second direction D2. The second
sensing pads 122 and the second bridge lines 124 are, for example,
disposed on the first dielectric layer 140. In the embodiment, the
second sensing pad 122 and the second bridge line 124 are, for
example, made up of the same conductive layer, wherein the material
is, for example, a transparent conductive material, including
indium tin oxide (ITO), indium zinc oxide (IZO), or other
transparent conductive metallic oxides. In an alternative
embodiment, the first sensing pads 112 and the second sensing pads
122 can be also formed by a mesh metallic material. The above
details are well-known to persons skilled in the art, and so no
further descriptions are provided herein.
[0054] In the embodiment, the touch panel 100 further comprises a
plurality of dummy electrodes 126, disposed between the first
sensing pads 112 and the second sensing pads 122. A material of the
dummy electrodes 126 is, for example, a transparent conductive
material or a mesh metallic material.
[0055] The first sensing series 110 and the second sensing series
120 are electrically insulated from each other. In detail, in the
embodiment, a crossover region of the first sensing series 110 and
the second sensing series 120 is, for example, at the first bridge
lines 114 and the second bridge lines 124. The first dielectric
layer 140 is disposed between the first bridge lines 114 and the
second bridge lines 124. Thus, the first sensing series 110 and the
second sensing series 120 are electrically insulated from each
other.
[0056] Please simultaneously refer to FIG. 1B and FIG. 1C. The
conductive repairing pattern layer 130 is overlapped with the two
adjacent first sensing pads 112 disposed in the same first sensing
series 110, overlapped with the two adjacent second sensing pads
122 disposed in the same second sensing series 120, or overlapped
with both of the above, and the conductive repairing pattern layers
130 are electrically floating. In the embodiment, the conductive
repairing pattern layers 130 are, for example, disposed on the
substrate 102 and covered by the first dielectric layer 140.
[0057] In the embodiment, the conductive repairing pattern layer
130 is, for example, overlapped with two adjacent first sensing
pads 112 in the same first sensing series 110, and is overlapped
with two adjacent second sensing pads 122 in the same second
sensing series 120. In other words, the conductive repairing
pattern layer 130 is, for example, simultaneously overlapped with
two adjacent first sensing pads 112 and two adjacent second sensing
pads 122. For example, as shown in FIG. 1B, the conductive
repairing pattern layer 130 is disposed around the crossover region
of the first sensing series 110 and the second sensing series 120,
and accordingly around the crossover region of the first bridge
line 114 and the second bridge line 124. The conductive repairing
pattern layers 130, for example, include a plurality of first
repairing lines 132 and a plurality of second repairing lines 134.
The first repairing line 132 is overlapped with the corresponding
two adjacent first sensing pads 112, and the second repairing line
134 is overlapped with the corresponding two adjacent second
sensing pads 122. In the embodiment, the first repairing line 132
and the second repairing line 134 of the conductive repairing
pattern layer 130 are, for example, substantially integrated as a
whole, and made up of a mesh repairing pattern layer. In this case,
the mesh repairing pattern layer is overlapped with the
corresponding two adjacent first sensing pads 112, and is
overlapped with the corresponding two adjacent second sensing pads
122. A material of the conductive repairing pattern layers 130
includes, for example, a transparent conductive material or a mesh
metallic material. In the embodiment, a material of the conductive
repairing pattern layers 130 is, for example, a transparent
conductive material, and a material of the first bridge lines 114
includes, for example, a mesh metallic material. However, in other
embodiments, the conductive repairing pattern layers 130 and the
first bridge lines 114 are, for example, made up of the same layer.
When the conductive repairing pattern layers 130 uses a metallic
conductive material and is directly integrated in the display
panel, the line width of the conductive repairing pattern layers
130 is preferably smaller than 20 micrometers, so as to avoid the
conductive repairing pattern layers 130 being a visual
structure.
[0058] It should be noted that although in the embodiment the
conductive repairing pattern layer 130 is simultaneously overlapped
with two adjacent first sensing pads 112 and two adjacent second
sensing pads 122, and has a mesh structure, in an embodiment, the
conductive repairing pattern layer 130 can also be overlapped with
two adjacent first sensing pads 112 or two adjacent second sensing
pads 122. For example, in an embodiment, the conductive repairing
pattern layer 130 can comprise a first repairing line 132 or a
plurality of first repairing lines 132, and the first repairing
line 132 is overlapped with the corresponding two adjacent first
sensing pads 112. In addition, even though the embodiment uses the
conductive repairing pattern layer 130 shown in FIG. 1B, the
conductive repairing pattern layer 130 can also have other
structures; the invention is not limited thereto.
[0059] In the embodiment, the touch panel 100 further comprises a
plurality of peripheral connecting lines 150 and a plurality of
peripheral connecting pads 152. The peripheral connecting lines 150
respectively connect the first sensing series 110 and the second
sensing series 120 to the corresponding peripheral connecting pad
152. A material of the peripheral connecting line 150 and the
peripheral connecting pad 152 is, for example, a metallic
conductive material, and the peripheral connecting pad 152 is
further covered by a transparent conductive pattern 154. A material
of the transparent conductive patterns 154 is, for example, a
transparent conductive metallic oxide. In addition, in the
embodiment, the touch panel 100 further includes a second
dielectric layer 160 disposed on the first dielectric layer 140 to
cover the first sensing series 110 and the second sensing series
120. The first dielectric layer 140 and the second dielectric layer
160 exposes the peripheral connecting pads 152 through the contact
windows 144, 162.
[0060] Further provided is a manufacturing process of the touch
panel of the invention, and FIG. 2A to FIG. 2D are schematic
partial top views illustrating the manufacturing process of a touch
panel in FIG. 1A. FIG. 3A to FIG. 3D are respectively schematic
cross-sectional views taken along a line I-I', a line II-II', and a
line III-III' FIG. 2A to FIG. 2D. Please simultaneously refer to
FIG. 2A and FIG. 3A. First, a plurality of first bridge lines 114,
a plurality of conductive repairing pattern layers 130, a plurality
of peripheral connecting lines 150, and a plurality of peripheral
connecting pads 152 are formed on a substrate 102. In the
embodiment, a material of the first bridge lines 114, the
peripheral connecting lines 150, and the peripheral connecting pads
152 is, for example, a metallic conductive material, and a material
of the conductive repairing pattern layers 130 is, for example, a
transparent conductive material. Thus, the step, for example,
includes the following. A metallic material layer (not shown) is
formed on the substrate 102, and the metallic material layer is
then patterned to form the plurality of first bridge lines 114, the
plurality of peripheral connecting lines 150, and the plurality of
peripheral connecting pads 152. A transparent conductive material
layer (not shown) is formed on the substrate 102, and the
transparent conductive material layer is then patterned to foam the
plurality of conductive repairing pattern layers 130.
Alternatively, in an embodiment, the conductive repairing pattern
layers 130 and the first bridge lines 114 can also be made up of
the same layer, that is, all of them are formed from a metallic
material layer. As such, the conductive repairing pattern layers
130, the first bridge lines 114, the peripheral connecting lines
150 and the peripheral connecting pads 152 can be formed in one
patterning process, to simplify the manufacturing steps of the
touch panel 100.
[0061] Please simultaneously refer to both FIG. 2B and FIG. 3B.
Next, a first dielectric layer 140 is formed on the substrate 102
to cover the first bridge lines 114 and the conductive repairing
pattern layers 130, wherein the first dielectric layer 140 has a
plurality of contact windows 142. The first bridge line 114, for
example, corresponds to two contact windows 142. In the embodiment,
the first dielectric layer 140 further covers the peripheral
connecting lines 150, and exposes the peripheral connecting pads
152 through the contact window 144.
[0062] Please simultaneously refer to FIG. 2C and FIG. 3C. Next, a
plurality of first sensing pads 112, a plurality of second sensing
pads 122, a plurality of second bridge lines 124, and transparent
conductive patterns 154 are formed on the first dielectric layer
140, wherein the first sensing pads 112 are formed in the contact
windows 142 of the first dielectric layer 140 to contact the first
bridge lines 114. In the embodiment, the step further comprises
forming a plurality of dummy electrodes 126 between the first
sensing pads 112 and the second sensing pads 122. In detail, in the
embodiment, the step includes the following, for example. A
transparent conductive material layer (not shown) is foamed on the
first dielectric layer 140 and patterned, to simultaneously form
the first sensing pads 112, the second sensing pads 122, the second
bridge lines 124, the transparent conductive patterns 154, and the
dummy electrodes 126. The first sensing pads 112 and the first
bridge lines 114 electrically connected thereto form the first
sensing series 110, and the second sensing pad 122 and the second
bridge line 124 electrically connected thereto form the second
sensing series 120. In the embodiment, the conductive repairing
pattern layer 130 is, for example, simultaneously overlapped with
two adjacent first sensing pads 112 and two adjacent second sensing
pads 122.
[0063] Please simultaneously refer to FIG. 2D and FIG. 3D.
Subsequently, the second dielectric layer 160 is formed on the
substrate 102, to cover the first sensing series 110 and the second
sensing series 120, and the manufacture of the touch panel 100 is
completed. In the embodiment, the second dielectric layer 160
exposes the transparent conductive patterns 154 on the peripheral
connecting pads 152 through the contact windows 162.
[0064] The invention provides a repairing method for repairing the
aforementioned touch panel 100 when the crossover region of the
first bridge line 114 of the first sensing series 110 and the
second bridge line of the second sensing series 120 has a short
defect or an open defect. FIG. 4A and FIG. 4B are schematic top
views depicting a repairing method of the touch panel 100 in FIG.
1A when crossover region of the first bridge line 114 and the
second bridge line 124 has a short defect or an open defect. Please
refer to FIG. 4A. First, the first bridge line 114 with the defect
is cut, therefore two adjacent first sensing pads 112 originally
connected through the first bridge line 114 are electrically
insulated. The method of cutting the first bridge line 114 with the
defect is, for example, using a laser cutting process, and the
method of cutting the first bridge line 114 is, for example,
cutting the connecting part between the first bridge line 114 and
the first sensing pad 112. As such, the two adjacent first sensing
pads 112 are electrically insulated.
[0065] Please refer to FIG. 4B. Next, the two adjacent first
sensing pads 112 electrically insulated are electrically connected
through the conductive repairing pattern layer 130 overlapped with
the two adjacent first sensing pads 112. In the embodiment, a laser
welding method, for instance, is used to weld the conductive
repairing pattern layer 130 and the two adjacent first sensing pads
112, so a welding point 170 is formed where the conductive
repairing pattern layer 130 is overlapped with two adjacent first
sensing pads 112. In detail, for instance, the first repairing line
132 of the conductive repairing pattern layer 130 is welded with
the two adjacent first sensing pads 112, so that the welding point
170 is formed where the first repairing line 132 is overlapped with
the two adjacent first sensing pads 112. As such, the two adjacent
first sensing pads 112 use the electrical connection between the
welding point 170 and the conductive repairing pattern layers 130,
so that the two adjacent first sensing pads 112 use the path in
FIG. 4B to connect electrically. Therefore, the first sensing
series 110 can provide a normal sensing operation. In addition,
since the first bridge line 114 with the defect is electrically
insulated from the first sensing series 110 after repairing, thus
the first sensing series 110 and the second sensing series 120 are
again electrically insulated. Therefore, the first sensing series
110 and the second sensing series 120 can provide a normal sensing
operation. In other words, the touch panel 100 can provide a normal
sensing operation.
[0066] On the other hand, when the crossover region of the first
bridge line 114 of the first sensing series 110 and the second
bridge line 124 of the second sensing series 120 has a short defect
or an open defect, the repairing method may also cut the second
bridge line 124. FIG. 5A and FIG. 5B are schematic top views
depicting a repairing method of the touch panel 100 in FIG. 1A when
the crossover region of the first bridge line 114 and the second
bridge line 124 has a short defect or an open defect. Please refer
to FIG. 5A. In the embodiment, first, the second bridge line 124
with the defect is cut, therefore two adjacent second sensing pads
122 originally connected through the second bridge line 124 are
electrically insulated. The method of cutting the second bridge
line 124 with the defect is, for example, using a laser cutting
process, and the method of cutting the second bridge line 124 is,
for example, cutting the connecting part between the second bridge
line 124 and the second sensing pad 122. As such, the two adjacent
second sensing pads 122 are electrically insulated.
[0067] Please refer to FIG. 5B. Next, the two adjacent second
sensing pads 122 electrically insulated are electrically connected
through the conductive repairing pattern layer 130 overlapped with
the two adjacent second sensing pads 122. In the embodiment, a
laser welding method, for instance, is used to weld the conductive
repairing pattern layer 130 and the two adjacent second sensing
pads 122, so a welding point 170 is formed where the conductive
repairing pattern layer 130 is overlapped with two adjacent second
sensing pads 122. In detail, for instance, the second repairing
line 134 of the conductive repairing pattern layer 130 is welded
with the two adjacent second sensing pads 122, so that the welding
point 170 is formed where the second repairing line 134 is
overlapped with the two adjacent second sensing pads 122. As such,
the two adjacent second sensing pads 122 use the electrical
connection between the welding point 170 and the conductive
repairing pattern layers 130, so that the two adjacent second
sensing pads 122 use the path in FIG. 5B to connect electrically.
Therefore, the second sensing series 120 can provide a normal
sensing operation. In addition, since the second bridge line 124
with the defect is electrically insulated from the second sensing
series 120 after repairing, thus the first sensing series 110 and
the second sensing series 120 are again electrically insulated.
Therefore, the first sensing series 110 and the second sensing
series 120 can provide a normal sensing operation. In other words,
the touch panel 100 can provide a normal sensing operation.
[0068] In the touch panel 100 of the embodiment, the conductive
repairing pattern layer 130 is, for example, overlapped with two
adjacent first sensing pads 112 in the same first sensing series
110, and is overlapped with at least one of the two adjacent second
sensing pads 122 in the same second sensing series 120. Thus, when
the first bridge line 114 used to connect the two adjacent first
sensing pads 112 and the second bridge line 124 used to connect the
two adjacent second sensing pads 122 has a short defect or an open
defect, the conductive repairing pattern layer 130 can be used as a
substitute for the first bridge line 114 to connect the two
adjacent first sensing pads 112, or be used as a substitute for the
second bridge line 124 to connect the two adjacent second sensing
pads 122. As such, after using the conductive repairing pattern
layers 130 for repairing, the first sensing series 110 and the
second sensing series 120 are again electrically insulated.
Therefore, the first sensing series 110 and the second sensing
series 120 can provide a normal sensing operation. Thus, the touch
panel of the embodiment has a favorable yield and simple repairing
method, so the waste of discarding touch panels is avoided, and
further reduces the touch panel production cost.
[0069] On the other hand, since the touch panel of the embodiment
has a favorable yield and simple repairing method, thus the touch
panel of the embodiment is suitable for manufacturing an additive
touch display panels and an integrated/in cell type touch display
panels. Particularly, for an integrated/in-cell type touch display
panel, the invention can resolve a short defect or an open defect
in the crossover region of the sensing series resulting from
electrostatic discharge. In other words, the manufacturing method
of the touch panel of the embodiment can pair with current color
filter substrate manufacturing processes, and at the same time
substantially raise the yield of the touch panel.
The Second Embodiment
[0070] FIG. 6A is a schematic top view of a touch panel according
to a second embodiment of the invention. FIG. 6B is a partially
enlarged schematic diagram of FIG. 6A. FIG. 6C is schematic
cross-sectional views taken along a line I-I', a line II-II', and a
line III-III' in FIG. 6B. Please simultaneously refer to FIG. 6A to
FIG. 6C. In the embodiment, the touch panel 100 includes a
substrate 102, a plurality of first sensing series 110, a plurality
of the second sensing series 120, a plurality of conductive
repairing pattern layers 130, a first dielectric layer 140, a
second dielectric layer 160, a plurality of peripheral connecting
lines 150, and a plurality of peripheral connecting pads 152. In
the embodiment, the first dielectric layer 140 is, for example,
disposed on the substrate 102, and includes a plurality of contact
windows 142.
[0071] In the embodiment, the first sensing series 110 are disposed
on the substrate 102 and extended along a first direction D1. The
first sensing series 110 includes a plurality of first sensing pads
112 and a plurality of first bridge lines 114. The first bridge
lines 114 serially connect two adjacent first sensing pads 112. In
the embodiment, the first sensing series 110 are, for example,
disposed parallel to each other. The first direction D1 is, for
example, an x-axis direction. The first sensing pads 112 are, for
example, disposed on the substrate 102 and covered by the first
dielectric layer 140, wherein the first sensing pads 112, for
example, correspond to two contact windows 142. The first bridge
lines 114 are, for example, disposed on the first dielectric layer
140, and the first bridge line 114 fills in the contact window 142,
so that the first bridge lines 114 serially connect two adjacent
first sensing pads 112 through the contact windows 142. In the
embodiment, the first sensing pads 112 are, for example, made of a
transparent conductive material, and the first bridge lines 114
are, for example, made of a metallic material.
[0072] The plurality of second sensing series 120 are disposed on
the substrate 102 and extended along a second direction D2. Each of
the second sensing series 120 includes a plurality of second
sensing pads 122 and a plurality of second bridge lines 124. The
second bridge lines 124 serially connect two adjacent second
sensing pads 122. The first direction D1 is different from the
second direction D2. In the embodiment, the second sensing series
120 are, for example, disposed parallel to each other. The second
direction D2 is, for example, a y-axis direction, wherein the first
direction D1 is, for example, perpendicular to the second direction
D2. The second sensing pads 122 and the second bridge lines 124
are, for example, disposed on the substrate 102 and covered by the
first dielectric layer 140. In the embodiment, the second sensing
pads 122 and the second bridge lines 124 are, for example, made of
the same conductive layer, wherein the material is, for example, a
transparent conductive material.
[0073] In the embodiment, a crossover region of the first sensing
series 110 and the second sensing series 120 is, for example, at
the first bridge lines 114 and the second bridge lines 124. The
first dielectric layer 140 is disposed between the first bridge
lines 114 and the second bridge lines 124. Thus, the first sensing
series 110 and the second sensing series 120 are electrically
insulated from each other. In addition, the touch panel 100 further
comprises a plurality of dummy electrodes 126, disposed between the
first sensing pads 112 and the second sensing pads 122.
[0074] Please simultaneously refer to FIG. 6B and FIG. 6C. The
conductive repairing pattern layer 130 is overlapped with the two
adjacent first sensing pads 112 disposed in the same first sensing
series 110, is overlapped with the two adjacent second sensing pads
122 disposed in the same second sensing series 120, or is
overlapped with both of the above, and the conductive repairing
pattern layers 130 are electrically floating. In the embodiment,
the conductive repairing pattern layers 130 are, for example,
disposed on the first dielectric layer 140.
[0075] In the embodiment, the conductive repairing pattern layer
130 is, for example, overlapped with two adjacent first sensing
pads 112 in the same first sensing series 110, and is overlapped
with two adjacent second sensing pads 122 in the same second
sensing series 120. In other words, the conductive repairing
pattern layer 130 is, for example, simultaneously overlapped with
two adjacent first sensing pads 112 and two adjacent second sensing
pads 122. The conductive repairing pattern layers 130, for example,
include a plurality of first repairing lines 132 and a plurality of
second repairing lines 134. The first repairing line 132 is
overlapped with the corresponding two adjacent first sensing pads
112, and the second repairing line 134 is overlapped with the
corresponding two adjacent second sensing pads 122. In the
embodiment, the first repairing line 132 and the second repairing
line 134 of the conductive repairing pattern layer 130 are, for
example, substantially integrated as a whole, and made up of a mesh
repairing pattern layer. The mesh repairing pattern layer is
overlapped with the corresponding two adjacent first sensing pads
112, and is overlapped with the corresponding two adjacent second
sensing pads 122. The conductive repairing pattern layers 130 and
the first bridge lines 114 are, for example, made up of the same
layer, with a material such as a transparent conductive material or
a mesh metallic material.
[0076] It should be noted that although in the embodiment the
conductive repairing pattern layers 130 simultaneously overlap with
two adjacent first sensing pads 112 and two adjacent second sensing
pads 122, and has a mesh structure, in an embodiment, the
conductive repairing pattern layers 130 can also overlap with two
adjacent first sensing pads 112 or two adjacent second sensing pads
122. For example, in an embodiment, the conductive repairing
pattern layer 130 can comprise a first repairing line 132 or a
plurality of first repairing lines 132, and the first repairing
line 132 is overlapped with the corresponding two adjacent first
sensing pads 112. In addition, even though the embodiment uses the
conductive repairing pattern layer 130 shown in FIG. 6B, the
conductive repairing pattern layer 130 can also have other
structures; the invention is not limited thereto.
[0077] In the embodiment, the touch panel 100 further includes a
second dielectric layer 160 disposed on the first dielectric layer
140 to cover the first sensing series 110 and the second sensing
series 120. The first dielectric layer 140 and the second
dielectric layer 160 exposes the peripheral connecting pads 152
through the contact windows 144, 162. The peripheral connecting
lines 150 and the peripheral connecting pads 152 represent similar
descriptions that can be referred to in the first embodiment, and
thus are not reiterated herein.
[0078] Further provided is a manufacturing process of the touch
panel of the invention, and FIG. 7A to FIG. 7D are schematic
partial top views illustrating the manufacturing process of a touch
panel in FIG. 6A. FIG. 8A to FIG. 8D are respectively schematic
cross-sectional views taken along a line I-I', a line II-II', and a
line III-III' in FIG. 7A to FIG. 7D. Please simultaneously refer to
FIG. 7A and FIG. 8A. First, a plurality of first sensing pads 112,
a plurality of second sensing pads 122, and a plurality of second
bridge lines 124 are formed on a substrate 102. In the embodiment,
the step further comprises forming a plurality of dummy electrodes
126 between the first sensing pads 112 and the second sensing pads
122. In the embodiment, the step, for example, includes the
following. A transparent conductive material layer (not shown) is
formed on the substrate 102, and the transparent conductive
material layer is then patterned to form the first sensing pads
112, the second sensing pads 122, the second bridge lines 124, and
the dummy electrodes 126. Next, a metallic material layer (not
shown) is formed on the substrate 102, and the metallic material
layer is then patterned to form the peripheral connecting lines 150
and the peripheral connecting pads 152. The second sensing pads 122
and the second bridge lines 124 electrically connected thereto form
the second sensing series 120.
[0079] Please simultaneously refer to both FIG. 7B and FIG. 8B.
Next, a first dielectric layer 140 is formed on the substrate 102
to cover the first sensing pads 112 and the second sensing series
120, wherein the first dielectric layer 140 has a plurality of
contact windows 142. In the embodiment, the first dielectric layer
140 further covers the peripheral connecting lines 150, and exposes
the peripheral connecting pads 152 through the contact window
144.
[0080] Please simultaneously refer to FIG. 7C and FIG. 7D, FIG. 8C
and FIG. 8D. Next, a plurality of first bridge lines 114, a
plurality of conductive repairing pattern layers 130, a plurality
of peripheral connecting lines 150, and a plurality of peripheral
connecting pads 152 are formed on the first dielectric layer 140,
wherein the first bridge line 114 fills in the corresponding two
contact windows 142, to connect the two adjacent first sensing pads
112. In the embodiment, the step is, for example, first forming a
metallic material layer (not shown) on the first dielectric layer
140 and patterning the metallic material layer, so as to form the
plurality of first bridge lines 114, the plurality of peripheral
connecting lines 150, and the plurality of peripheral connecting
pads 152 shown in FIG. 7C and FIG. 8C. Next, a transparent
conductive material layer (not shown) is formed on the first
dielectric layer 140 and patterned, to form the plurality of
conductive repairing pattern layers 130 and the plurality of
transparent conductive patterns 154 shown in FIG. 7D and FIG.
8D.
[0081] Please simultaneously refer to FIG. 7D and FIG. 8D.
Subsequently, the second dielectric layer 160 is formed on the
substrate 102, to cover the first sensing series 110 and the second
sensing series 120, and the manufacture of the touch panel 100 is
completed. In the embodiment, the second dielectric layer 160
exposes the transparent conductive pattern 154 on the peripheral
connecting pads 152 through the contact windows 162.
[0082] The invention provides a repairing method for repairing the
aforementioned touch panel 100 when the crossover region of the
first bridge line 114 of the first sensing series 110 and the
second bridge line of the second sensing series 120 has a short
defect or an open defect. FIG. 9A and FIG. 9B are schematic top
views depicting a repairing method of the touch panel 100 in FIG.
6A when the crossover region of the first bridge line 114 and the
second bridge line 124 has a short defect or an open defect. Please
refer to FIG. 9A. First, the first bridge line 114 with the defect
is cut, therefore two adjacent first sensing pads 112 originally
connected through the first bridge line 114 are electrically
insulated. The method of cutting the first bridge line 114 with the
defect is, for example, using a laser cutting process, and the
method of cutting the first bridge line 114 is, for example,
cutting the connecting part between the first bridge line 114 and
the first sensing pad 112. As such, the two adjacent first sensing
pads 112 are electrically insulated.
[0083] Please refer to FIG. 9B. Next, the two adjacent first
sensing pads 112 electrically insulated are electrically connected
through the conductive repairing pattern layer 130 overlapped with
the two adjacent first sensing pads 112. In the embodiment, a laser
welding method, for instance, is used to weld the conductive
repairing pattern layer 130 and the two adjacent first sensing pads
112, so a welding point 170 is formed where the conductive
repairing pattern layer 130 is overlapped with two adjacent first
sensing pads 112. In detail, for instance, the first repairing line
132 of the conductive repairing pattern layer 130 is welded with
the two adjacent first sensing pads 112, so that the welding point
170 is formed where the first repairing line 132 is overlapped with
the two adjacent first sensing pads 112. As such, the two adjacent
first sensing pads 112 use the electrical connection between the
welding point 170 and the conductive repairing pattern layers 130,
so that the two adjacent first sensing pads 112 use the path in
FIG. 9B to connect electrically. Therefore, the first sensing
series 110 can provide a normal sensing operation. In addition,
since the first bridge line 114 with the defect is electrically
insulated from the first sensing series 110 after repairing, thus
the first sensing series 110 and the second sensing series 120 are
again electrically insulated. Therefore, the first sensing series
110 and the second sensing series 120 can provide a normal sensing
operation. In other words, the touch panel 100 can provide a normal
sensing operation.
[0084] On the other hand, when the crossover region of the first
bridge line 114 of the first sensing series 110 and the second
bridge line 124 of the second sensing series 120 has a short defect
or an open defect, the repairing method may also have second bridge
line 124 cut and may weld the conductive repairing pattern layers
130 with the two adjacent second sensing pads 122. Since this
repairing method and the repairing method of cutting the first
bridge line 114 is the same, the description is not reiterated
herein.
[0085] In the touch panel 100 of the embodiment, the conductive
repairing pattern layer 130 is, for example, overlapped with two
adjacent first sensing pads 112 in the same first sensing series
110, and is overlapped with at least one of the two adjacent second
sensing pads 122 in the same second sensing series 120. Thus, when
the first bridge line 114 used to connect the two adjacent first
sensing pads 112 and the second bridge line 124 used to connect the
two adjacent second sensing pads 122 has a short defect or an open
defect, the conductive repairing pattern layer 130 can be used as a
substitute for the first bridge line 114 to connect the two
adjacent first sensing pads 112, or be used as a substitute for the
second bridge line 124 to connect the two adjacent second sensing
pads 122. As such, after using the conductive repairing pattern
layers 130 for repairing, the first sensing series 110 and the
second sensing series 120 are again electrically insulated.
Therefore, the first sensing series 110 and the second sensing
series 120 can provide a normal sensing operation. Thus, the touch
panel of the embodiment has a favorable yield and simple repairing
method, so the waste of discarding touch panels is avoided, and
further reduces the touch panel production cost.
[0086] On the other hand, since the touch panel of the embodiment
has a favorable yield and simple repairing method, thus the touch
panel of the embodiment is suitable for manufacturing an additive
touch display panels and an integrated/in cell type touch display
panels. Particularly, for an integrated/in-cell type touch display
panel, the invention can resolve a short defect or an open defect
in the crossover region of the sensing series resulting from
electrostatic discharge. In other words, the manufacturing method
of the touch panel of the embodiment can pair with current color
filter substrate manufacturing processes, and at the same time
substantially raise the yield rate of the touch panel.
[0087] Generally, in the touch panel and repairing method of the
invention, each of the conductive repairing pattern layers is
overlapped with two adjacent sensing pads in the same sensing
series. As such, when the crossover region of the two sensing
series has a short defect or an open defect, the conductive
repairing pattern layers can be used to repair the defects, so the
two sensing series can provide a normal sensing operation. As a
result, the touch panel has a favorable yield and simple repair
method. More particularly, since the touch panel of the invention
is easily repaired, thus, it is especially suitable for
manufactured integrated/in-cell type touch display panels, so as to
solve the short defect or the open defect in the crossover region
of the touch sensing series caused by the manufacture of color
filter thin films. Thus, the manufacturing method of the touch
panel of the invention can pair with current color filter substrate
manufacturing processes, and at the same time substantially raise
the yield of the touch panel.
[0088] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
invention cover modifications and variations of this invention
provided they fall within the scope of the following claims and
their equivalents.
* * * * *