U.S. patent application number 13/155540 was filed with the patent office on 2012-04-05 for heat dissipating apparatus.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to JIAN FU, WEN-CHANG GAO, LI-FU XU, ZHI-JIANG YAO.
Application Number | 20120080167 13/155540 |
Document ID | / |
Family ID | 45888785 |
Filed Date | 2012-04-05 |
United States Patent
Application |
20120080167 |
Kind Code |
A1 |
GAO; WEN-CHANG ; et
al. |
April 5, 2012 |
HEAT DISSIPATING APPARATUS
Abstract
A heat dissipating apparatus includes a base and a heat pipe. A
plurality of fins partially overlaps the base; the heat pipe
comprising a first body, a second body and a third body, the second
body connected between the first body and the third body; the first
body is secured between the plurality of fins and the base, the
third body is secured to the plurality of fins, and the second body
is located in a first corner between the base and the plurality of
fins.
Inventors: |
GAO; WEN-CHANG; (Shenzhen
City, CN) ; FU; JIAN; (Shenzhen City, CN) ;
YAO; ZHI-JIANG; (Shenzhen City, CN) ; XU; LI-FU;
(Shenzhen City, CN) |
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
Shenzhen City
CN
|
Family ID: |
45888785 |
Appl. No.: |
13/155540 |
Filed: |
June 8, 2011 |
Current U.S.
Class: |
165/104.19 |
Current CPC
Class: |
H01L 23/3672 20130101;
F28D 15/0275 20130101; H01L 23/467 20130101; F28F 1/32 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 23/427
20130101; H01L 2924/00 20130101; H01L 23/4006 20130101 |
Class at
Publication: |
165/104.19 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 30, 2010 |
CN |
201010298168.7 |
Claims
1. A heat dissipating apparatus comprising: a base; a cooler,
secured to the base, comprising a first side plate, a second side
plate and a plurality of fins secured between the first side plate
and the second side plate; and a heat pipe comprising a first body,
a second body and a third body, the first body and the third body
are secured to the cooler, and the second body is connected between
the first body and the third body; wherein the first side plate is
secured to the base and located between a first edge of the base
and a second edge of the base, the second end of the base is
located between the second side plate and the first side plate, and
the second body is located in a corner between the base and the
first side plate.
2. The heat dissipating apparatus of claim 1, wherein a first angle
is defined between the first body and the second body, and the
first angle is acute.
3. The heat dissipating apparatus of claim 1, wherein a second
angle is defined between the second body and the third body, and
the second angle is obtuse.
4. The heat dissipating apparatus of claim 1, wherein the first
side plate and the second side plate are substantially
perpendicular to the base.
5. The heat dissipating apparatus of claim 1, wherein a length of
the first body is greater than a distance between the first side
plate and the second side plate.
6. The heat dissipating apparatus of claim 1, wherein the first
edge of the base is substantially parallel to the second edge of
the base.
7. The heat dissipating apparatus of claim 1, wherein the first
body is substantially parallel to the third body.
8. The heat dissipating apparatus of claim 1, wherein each of the
plurality of fins defines a receiving hole, and the third body is
located in the receiving holes of the plurality of fins.
9. The heat dissipating apparatus of claim 8, wherein the first
side plate defines an opening, the opening is aligned with the
receiving holes of the plurality of fins, and the first body is
engaged in the opening.
10. The heat dissipating apparatus of claim 1, wherein the base
defines a first receiving slot, each of the plurality of fins
defines a second receiving slot, and the first body is located in
the first receiving slot and the second receiving slot.
11. A heat dissipating apparatus comprising: a base; a plurality of
fins partially overlapping the base; and a heat pipe comprising a
first body, a second body and a third body, the second body
connected between the first body and the third body; wherein the
first body is secured between the plurality of fins and the base,
the third body is secured to the plurality of fins, and the second
body is located in a first corner between the base and the
plurality of fins.
12. The heat dissipating apparatus of claim 11, wherein a first
angle is defined between the first body and the second body, and
the first angle is acute.
13. The heat dissipating apparatus of claim 11, wherein a second
angle is defined between the second body and the third body, and
the second angle is obtuse.
14. The heat dissipating apparatus of claim 11, wherein the first
body is substantially parallel to the third body.
15. The heat dissipating apparatus of claim 11, wherein the
plurality of fins is located in a shell, and the shell comprises a
first side plate and a second side plate, the first side plate is
secured to the base and located between a first edge of the base
and a second edge of the base, the second end of the base is
located between the second side plate and the first side plate, and
the second body is located in a second corner between the first
side plate and the base.
16. The heat dissipating apparatus of claim 15, wherein each of the
plurality of fins defines a receiving hole, and the third body is
located in the receiving holes of the plurality of fins.
17. The heat dissipating apparatus of claim 16, wherein the first
side plate defines an opening, and the opening is aligned with the
receiving holes of the plurality of fins, and the first body is
engaged in the opening.
18. The heat dissipating apparatus of claim 15, wherein the first
edge of the base is substantially parallel to the second edge of
the base.
19. The heat dissipating apparatus of claim 15, wherein a length of
the first body is greater than a distance between the first side
plate and the second side plate.
20. The heat dissipating apparatus of claim 11, wherein the base
defines a first receiving slot, each of the plurality of fins
defines a second receiving slot, and the first body is located in
the first receiving slot and the second receiving slot.
Description
REARGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to heat dissipating
apparatuses.
[0003] 2. Description of Related Art
[0004] A heat dissipating module is mounted on a motherboard of an
electronic device, such as a computer or a server, for dissipating
heat generated by electronic components in the electronic device.
Generally, the heat dissipating module comprises a cooler and a
fan. The cooler is secured to an electronic component and comprises
a plurality of fins. An airflow path is defined between each two
adjacent fins, and the fan is located in the path of the airflow,
to remove heat from the electronic device. However, with the cooler
fixed directly and entirely on the one electronic component, the
cooler itself will block airflow to cool the other electronic
components behind the cooler, which is inefficient.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the embodiments can be better understood
with references to the following drawings. The components in the
drawings are not necessarily drawn to scale, the emphasis instead
being placed upon clearly illustrating the principles of the
embodiments. Moreover, in the drawings, like reference numerals
designate corresponding parts throughout the several views.
[0006] FIG. 1 is an assembled, isometric view of a heat dissipation
apparatus and a computer in accordance with one embodiment.
[0007] FIG. 2 is an exploded, isometric view of the heat
dissipation apparatus and the computer of FIG. 1.
[0008] FIG. 3 is an assembled, isometric view of the heat
dissipation apparatus of FIG. 1.
[0009] FIG. 4 is an exploded, isometric view of FIG. 3.
[0010] FIG. 5 is a cross section view of the heat dissipation
apparatus of FIG. 3.
DETAILED DESCRIPTION
[0011] The disclosure is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings in
which like references indicate similar elements. It should be noted
that references to "an" or "one" embodiment in this disclosure are
not necessarily to the same embodiment, and such references mean at
least one.
[0012] Referring to FIG. 1 and FIG. 2, a heat dissipation apparatus
100 in accordance with an embodiment is secured to a computer
30.
[0013] The computer 30 includes a bottom plate 31 and a main board
50. The main board 50 is secured to the bottom plate 31 and defines
a plurality of positioning holes 53. An electronic component 51 is
secured to the main board 50. In one embodiment, the main board 50
may be a motherboard, and the electronic component 51 may be a
CPU.
[0014] Referring to FIG. 3 and FIG. 4, the heat dissipating
apparatus 100 includes a cooler 10, two heat pipes 19, a fan 20,
and a base 40.
[0015] The cooler 10 includes a shell 60 and a plurality of fins
16. The shell 60 includes a top plate 13, a first side plate 15,
and a second side plate 17. In one embodiment, the top plate 13 is
substantially perpendicular to the first side plate 15 and the
second side plate 17, and the first side plate 15 is substantially
parallel to the second side plate 17. The first side plate 15
defines two openings 151 and a notch 153. The notch 153 extends
from a bottom edge of the first side plate 15. A plurality of
mounting pieces 18 extends from a side edge of each of the first
side plate 15 and the second side plate 17. Each mounting piece 18
defines a mounting hole 181. The fins 16 are received in the shell
60 and enclosed by the top plate 13, the first side plate 15, and
the second side plate 17. Each fin 16 defines two receiving holes
161, and the receiving holes 161 correspond to the openings 151.
Each fin 16 defines two first receiving slots 163. The two first
receiving slots 163 correspond to the notch 153. In one embodiment,
the cross-section of each first receiving slot 163 is
semicircular.
[0016] Each heat pipe 19 includes a first body 191, a second body
193, and a third body 195. In one embodiment, the heat pipes 19 are
generally substantially "U" shaped. The second body 193 is
connected between the first body 191 and the third body 195. A
length of the first body 191 is longer than a distance between the
first side plate 15 and the second side plate 17, and a length of
the third body 195 is substantially equal to the distance between
the first side plate 15 and the second side plate 17. A first angle
is defined between the first body 191 and the second body 193. In
one embodiment, the first angle is acute. In one embodiment, a
cross-section of each heat pipe is round. The cooling fan 20
defines a plurality of through holes 21.
[0017] The base 40 defines two second receiving slots 43 and a
plurality of locking holes 41. The locking holes 41 correspond to
the positioning holes 53. In one embodiment, a cross-section of
each second receiving slot 43 is semicircular.
[0018] In assembly, the cooler 10 is secured to the base 40, and
the first receiving slots 163 are aligned with the second receiving
slots 43. The first side plate 15 is secured to the base 40 and
located between a first edge of the base 40 and a second edge of
the base 40. The second end of the base 40 is substantially
parallel to the first edge of the base 40 and located between the
second side plate 17 and the first side plate 15. The fins 16 are
partially overlapping the base 40. The first body 191 is received
in the first receiving slot 163 and the second receiving slot 43
and sandwiched between the base 40 and the fins 16. The third body
195 is inserted through the opening 151 and the receiving holes
161. The second body 193 is located in a corner between the base 40
and the first side plate 15. A second angle is defined between the
second body 193 and the third body 195. In one embodiment, the
second angle is obtuse. A plurality of locking members (not
labeled), such as screws, is inserted into the locking holes 41 and
the corresponding positioning holes 53, so that the base 40 is
secured to the main board 50 on the electronic component 51.
[0019] In use, heat generated by the electronic component 51 is
transferred to the first body 191 by the base 40. The first body
191 transfers the heat along a first direction, which is towards
the cooler 10, and to the second body 193 along a second direction.
The second body 193 transfers the heat to the fins 16 via the third
body 195. The cooling fan 20 removes the heat from the cooler 10,
and the electronic component 51 is cooled thereby.
[0020] It is to be understood, however, that even though numerous
characteristics and advantages have been set forth in the foregoing
description of embodiments, together with details of the structures
and functions of the embodiments, the disclosure is illustrative
only and changes may be made in detail, especially in matters of
shape, size, and arrangement of parts within the principles of the
disclosure to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
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