U.S. patent application number 12/888432 was filed with the patent office on 2012-03-08 for enclosure of electronic device.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to YAO-TING CHANG.
Application Number | 20120055940 12/888432 |
Document ID | / |
Family ID | 45769926 |
Filed Date | 2012-03-08 |
United States Patent
Application |
20120055940 |
Kind Code |
A1 |
CHANG; YAO-TING |
March 8, 2012 |
ENCLOSURE OF ELECTRONIC DEVICE
Abstract
An enclosure of an electronic device includes a bottom wall and
a sidewall. The sidewall includes at least two non-coplanar
portions. Each of the non-coplanar portions defines a plurality of
through holes for heat dissipation.
Inventors: |
CHANG; YAO-TING; (Tu-Cheng,
TW) |
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
45769926 |
Appl. No.: |
12/888432 |
Filed: |
September 23, 2010 |
Current U.S.
Class: |
220/676 |
Current CPC
Class: |
G06F 1/20 20130101; G06F
1/181 20130101; H05K 5/0213 20130101 |
Class at
Publication: |
220/676 |
International
Class: |
B65D 90/02 20060101
B65D090/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 8, 2010 |
TW |
99130360 |
Claims
1. An enclosure comprising: a bottom wall; and a sidewall extending
from the bottom wall and comprising at least two non-coplanar
portions, wherein each of the at least two non-coplanar portions
defines a plurality of through holes for heat dissipation.
2. The enclosure of claim 1, wherein the at least two non-coplanar
portions comprise a first portion substantially perpendicularly
extending from the bottom wall, a second portion substantially
parallel to the first portion, and a third portion connected
between the first portion and the second portion.
3. The enclosure of claim 2, wherein the third bend portion is
substantially parallel to the bottom wall.
4. The enclosure of claim 1, wherein the at least two non-coplanar
portions comprise a first portion slantingly extending from the
bottom wall, and a second portion extending from the first portion
opposite and substantially perpendicular to the bottom wall.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to an enclosure of an
electronic device.
[0003] 2. Description of Related Art
[0004] As shown in FIG. 3, an enclosure 10 of an electronic device
often includes a sidewall 12 defining a number of through holes 122
for heat dissipation. However, the area and quantity of the through
holes both are often less then desired because of the size of the
sidewall, which is insufficient for heat dissipation.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, all the views
are schematic, and like reference numerals designate corresponding
parts throughout the several views.
[0006] FIG. 1 is a schematic, isometric view of a first embodiment
of an enclosure of an electronic device.
[0007] FIG. 2 is a schematic, isometric view of a second embodiment
of an enclosure of an electronic device.
[0008] FIG. 3 is a schematic, isometric view of an enclosure of an
electronic device of a related art.
DETAILED DESCRIPTION
[0009] The disclosure, including the accompanying drawings, is
illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0010] Referring to FIG. 1, a first exemplary embodiment of an
enclosure 20 of an electronic device, such as a computer, includes
a bottom wall 21 and a sidewall 22. The sidewall 22 includes three
non-coplanar portions, a first portion 224, a second portion 222,
and a third portion 226 connected between the first portion 224 and
the second portion 222. The first portion 224 substantially
perpendicularly extends from the bottom wall 21. The first portion
224 and the second portion 222 are parallel to each other and
perpendicular to the bottom wall 21. The third portion 226 is
parallel to the bottom wall 21 and substantially perpendicular to
the first and second portions 224 and 222 by opposite sides of the
third portion 226. A number of through holes 288 is defined in the
first to third portions 224, 222, and 226.
[0011] Referring to FIG. 2, a second exemplary embodiment of an
enclosure 30 of an electronic device, such as a computer, includes
a bottom wall 31 and a sidewall 32. The sidewall 32 includes two
non-coplanar portions, a first portion 324 and a second portion 322
connected to the first portion 322. The first portion 324
slantingly extends from the bottom wall 31. The second portion 322
extends from the first portion 324. The second portion 322 is
opposite and substantially perpendicular to the bottom wall 31. A
number of through holes 328 is defined in both the first portion
324 and the second bend 322.
[0012] In this application, the sidewalls 22 and 32 include several
non-coplanar portions, such that more through holes can be defined
in the sidewall 22 and 32, increasing heat dissipation
efficiency.
[0013] It is to be understood, however, that even though numerous
characteristics and advantages of the embodiments have been set
forth in the foregoing description, together with details of the
structure and function of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the present disclosure to the full extent indicated
by the broad general meaning of the terms in which the appended
claims are expressed.
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