U.S. patent application number 13/216350 was filed with the patent office on 2012-03-01 for film deposition apparatus, film deposition method, and computer program storage medium.
This patent application is currently assigned to Tokyo Electron Limited. Invention is credited to Hitoshi Kato, Takeshi Kumagai, Shigenori OZAKI.
Application Number | 20120052693 13/216350 |
Document ID | / |
Family ID | 45697841 |
Filed Date | 2012-03-01 |
United States Patent
Application |
20120052693 |
Kind Code |
A1 |
OZAKI; Shigenori ; et
al. |
March 1, 2012 |
FILM DEPOSITION APPARATUS, FILM DEPOSITION METHOD, AND COMPUTER
PROGRAM STORAGE MEDIUM
Abstract
When alternately performing a film deposition step where a
silicon-containing gas and O.sub.3 gas are alternately supplied to
a substrate on a susceptor by rotating the susceptor thereby to
forma thin film of the reaction product, and an alteration step
where the reaction product is altered by irradiating plasma to the
substrate, plasma intensity of the plasma is changed during film
deposition. Specifically, the plasma intensity is lower when a
thickness of the thin film is small (or at an initial stage of the
film deposition--alteration step), and is increased as the thin
film becomes thicker (or as the number of the film deposition steps
is increased). Alternatively, the plasma intensity is higher when
the thin film is relatively thin and then reduced.
Inventors: |
OZAKI; Shigenori;
(Yamanashi, JP) ; Kato; Hitoshi; (Iwate, JP)
; Kumagai; Takeshi; (Iwate, JP) |
Assignee: |
Tokyo Electron Limited
Tokyo
JP
|
Family ID: |
45697841 |
Appl. No.: |
13/216350 |
Filed: |
August 24, 2011 |
Current U.S.
Class: |
438/771 ;
118/697; 118/702; 257/E21.24; 257/E21.283; 257/E21.293; 438/769;
438/776 |
Current CPC
Class: |
C23C 16/45536 20130101;
C23C 16/45548 20130101; C23C 16/402 20130101 |
Class at
Publication: |
438/771 ;
118/702; 118/697; 438/769; 438/776; 257/E21.24; 257/E21.283;
257/E21.293 |
International
Class: |
H01L 21/31 20060101
H01L021/31; H01L 21/318 20060101 H01L021/318; H01L 21/316 20060101
H01L021/316; B05C 11/00 20060101 B05C011/00; B05C 11/10 20060101
B05C011/10 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 27, 2010 |
JP |
NO. 2010-191247 |
Claims
1. A film deposition apparatus that forms a thin film on a
substrate by repeating a cycle of alternately supplying plural
kinds of reaction gases to the substrate under vacuum, wherein a
first reaction gas among the plural kinds of the reaction gases
reacts with a second reaction gas among the plural kinds of the
reaction gases, the second reaction gas being adsorbed on the
substrate, thereby to produce a reaction product, the film
deposition apparatus comprising: a susceptor that is provided in a
vacuum chamber and includes a substrate receiving area in which a
substrate is placed; an evacuation system that evacuates the vacuum
chamber; plural reaction gas supplying parts that supply the
corresponding reaction gases to the substrate placed in the
substrate receiving area; a plasma generation part that generates
plasma including a chemical component that reacts with the second
reaction gas adsorbed on the substrate, and supplies the plasma to
the substrate during formation of a thin film of the reaction
product thereby to alter the thin film on the substrate; and a
controlling part that outputs a controlling signal in order to
change plasma intensity of the plasma that is generated and
supplied to the substrate by the plasma generation part at a
predetermined point of time to a different plasma intensity before
the predetermined point of time.
2. The film deposition apparatus of claim 1, wherein the second
reaction gas serves as an oxidizing or nitriding gas with respect
to the second reaction gas adsorbed on the substrate, and wherein
the thin film is formed of one of metal oxide, silicon oxide metal
nitride, and silicon nitride.
3. The film deposition apparatus of claim 2, wherein an underlying
film of the thin film to be formed thereon includes metal or
silicon.
4. The film deposition apparatus of claim 1, wherein the
controlling part changes the plasma intensity by adjusting at least
one of high frequency power supplied to the plasma generation part
and an inner pressure in the vacuum chamber.
5. The film deposition apparatus of claim 1, wherein the
controlling part sets the plasma intensity of the plasma that is
generated and supplied to the substrate by the plasma generation
part at a first intensity in an initial stage of forming the thin
film, and sets the plasma intensity of the plasma generated and
supplied to the substrate by the plasma generation part at a second
intensity after the initial stage of forming the thin film.
6. The film deposition apparatus of claim 1, wherein the
controlling part sets the plasma intensity of the plasma that is
generated and supplied to the substrate by the plasma generation
part at a second intensity in an initial stage of forming the thin
film, and sets the plasma intensity of the plasma that is generated
and supplied to the substrate by the plasma generation part at a
first intensity that is lower than the second intensity after the
initial stage of forming the thin film.
7. The film deposition apparatus of claim 6, wherein the
controlling part sets the plasma intensity of the plasma that is
generated and supplied to the substrate by the plasma generation
part at a third intensity that is higher than the first plasma
intensity after setting the plasma intensity of the plasma that is
generated and supplied to the substrate by the plasma generation
part at the first intensity.
8. The film deposition apparatus of claim 1, wherein the plural
reaction gas supplying parts and the plasma generation part are
provided at predetermined intervals along a circumferential
direction of the vacuum chamber, wherein the film deposition
apparatus is provided with a rotating mechanism that rotates the
susceptor around a vertical axis with respect to the plural
reaction gas supplying parts and the plasma generation part so that
the substrate receiving area of the susceptor passes alternately
through areas to which the plural reaction gas supplying parts
supply the corresponding reaction gases, wherein the plasma
generation part is arranged so that the plasma generated by the
plasma generation part is supplied to the substrate in one of a
first area to which the first reaction gas that reacts with the
second reaction gas adsorbed on the substrate is supplied and a
second area located downstream relative to the first area along a
rotation direction of the susceptor, and wherein the vacuum chamber
is provided in order to separate the areas with a separation area
that is located between the areas to which the plural reaction gas
supplying parts supply the corresponding reaction gases.
9. A film deposition method that forms a thin film on a substrate
by repeating a cycle of alternately supplying plural kinds of
reaction gases to the substrate under vacuum, wherein a first
reaction gas among the plural kinds of the reaction gases reacts
with a second reaction gas among the plural kinds of the reaction
gases, the second reaction gas being adsorbed on the substrate,
thereby to produce a reaction product, the film deposition method
comprising steps of: placing a substrate in a substrate receiving
area of a susceptor provided in a vacuum chamber; evacuating the
vacuum chamber; alternately supplying plural kinds of the reaction
gases to the substrate in the substrate receiving area from
corresponding reaction gas supplying parts thereby to form a thin
film on the substrate; supplying plasma including a chemical
component that reacts with the second reaction gas adsorbed on the
substrate from a plasma generation part to the substrate when the
thin film is being formed, thereby to alter the thin film on the
substrate; and changing plasma intensity of the plasma supplied to
the substrate, at a predetermined point of time to a different
plasma intensity of the plasma that is generated and supplied to
the substrate by the plasma generation part before the
predetermined point of time.
10. The film deposition method of claim 9, wherein the first
reaction gas serves as an oxidizing or nitriding gas with respect
to the second reaction gas adsorbed on the substrate, and wherein
the thin film is formed of one of metal oxide, silicon oxide metal
nitride, and silicon nitride.
11. The film deposition apparatus of claim 10, wherein an
underlying film of the thin film to be formed thereon includes
metal or silicon.
12. The film deposition method of claim 9, wherein the plasma
intensity is changed by adjusting at least one of high frequency
power supplied to the plasma generation part and an inner pressure
in the vacuum chamber in the changing the plasma intensity.
13. The film deposition method of claim 9, wherein the plasma
intensity of the plasma that is generated and supplied to the
substrate by the plasma generation part is set at a first intensity
in an initial stage of forming the thin film, and at a second
intensity that is higher than the first intensity after the initial
stage of forming the thin film, in the changing the plasma
intensity.
14. The film deposition method of claim 9, wherein the plasma
intensity of the plasma that is generated and supplied to the
substrate by the plasma generation part is set at a second
intensity in an initial stage of forming the thin film, and at a
first intensity that is lower than the second intensity after the
initial stage of forming the thin film, in the changing the plasma
intensity.
15. The film deposition method of claim 14, wherein the plasma
intensity of the plasma that is generated and supplied to the
substrate by the plasma generation part is set at a third intensity
that is higher than the first plasma intensity after setting the
plasma intensity of the plasma that is generated and supplied to
the substrate by the plasma generation part at the first intensity,
in the changing the plasma intensity.
16. The film deposition method of claim 9, wherein the susceptor is
rotated around a vertical axis with respect to the plural reaction
gas supplying parts arranged at predetermined intervals along a
rotation direction of the susceptor so that the substrate receiving
area of the susceptor passes alternately through areas to which the
plural reaction gas supplying parts supply the corresponding
reaction gases, in the forming the thin film, wherein the plasma
generated by the plasma generation part is supplied to the
substrate in one of a first area to which the first reaction gas
that reacts with the second reaction gas adsorbed on the substrate
is supplied and a second area located downstream relative to the
first area along a rotation direction of the susceptor, in the
altering the thin film, and the film deposition method further
comprising supplying a separation gas from a separation area that
is located between the areas to which the plural reaction gas
supplying parts supply the corresponding reaction gases in order to
separate the areas.
17. A film deposition method that forms a thin film on a substrate
by repeating a cycle of alternately supplying plural kinds of
reaction gases to the substrate under vacuum, wherein a first
reaction gas among the plural kinds of the reaction gases reacts
with a second reaction gas among the plural kinds of the reaction
gases, the second reaction gas being adsorbed on the substrate,
thereby to produce a reaction product, the film deposition method
comprising steps of: placing a substrate in a substrate receiving
area of a susceptor provided in a vacuum chamber; evacuating the
vacuum chamber; supplying the plural kinds of the reaction gases
from corresponding reaction gas supplying parts toward the
susceptor; supplying plasma including a chemical component that
reacts with one of the second reaction gas adsorbed on the
substrate and at least apart of the substrate from the plasma
generation part toward the susceptor; and rotating the susceptor
around a vertical axis so that the substrate receiving area passes
alternately through a supplying area to which the second reaction
gas is supplied, a reaction area where the first reaction gas
reacts with the second reaction gas adsorbed on the substrate, and
a plasma area that is arranged downstream relative to the reaction
area along a rotation direction of the susceptor and where the
plasma is supplied, wherein the supplying area, the reaction area,
and the plasma area are arranged at intervals along a
circumferential direction of the vacuum chamber.
18. A computer readable storage medium that stores a computer
program to be used in a film deposition apparatus that forms a thin
film on a substrate by repeating a cycle of alternately supplying
plural kinds of reaction gases to the substrate, the computer
program including groups of instructions that cause the film
deposition apparatus to perform the film deposition method of claim
9.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of priority of Japanese
Patent Application No. 2010-191247, filed on Aug. 27, 2010 with the
Japanese Patent Office, the entire contents of which are hereby
incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates to a film deposition apparatus and a
film deposition method, where two or more kinds of reaction gases
are alternately supplied to a surface of a substrate under vacuum,
thereby to deposit a thin film on the substrate, and a storage
medium that stores a computer program that causes the film
deposition apparatus to perform the film deposition method.
[0004] 2. Description of the Related Art
[0005] When, for example, a silicon oxide film is deposited on a
substrate such as a semiconductor wafer made of silicon (referred
to as a wafer hereinafter) having patterns including pillar-shaped
or line-shaped convex portions formed on the surface of the wafer,
a film deposition method called an Atomic Layer Film deposition
(ALD) method or a Molecular Layer Film deposition (MLD) method may
be used. Specifically, a thin film of silicon oxide is formed on
the wafer by alternately supplying an organic material gas
containing silicon and an oxidizing gas to the wafer under vacuum,
thereby to accumulate an atomic layer or a molecular layer made of
the reaction product. The thin film formed by such a film
deposition method may have lower density because organic substances
originating from the organic material gas remain in the thin film.
This may be caused in part because a film deposition temperature of
the film deposition method is relatively lower than that of a
conventional Chemical Vapor Film deposition (CVD) method.
[0006] Then, densification of the thin film has been investigated
by exposing the wafer to plasma of an alteration gas including
oxygen (O.sub.2), thereby to alter or densify the reaction product.
However, when the thin film becomes thicker than a film thickness
(or depth) through which the plasma can penetrate, a lower part of
the thin film cannot be altered. On the other hand, when the thin
film is thinner than the penetration depth, the plasma can reach an
underlying layer of the thin film, so that an upper surface of the
underlying layer made of, for example, silicon may be oxidized, as
shown in FIG. 1. In this case, a width d of the convex portion may
become smaller than designed, which makes it difficult to obtain
desired electrical properties.
[0007] Incidentally, when the silicon oxide film to be used as a
gate oxide film is formed by the CVD method or the ALD method, a
boundary between the thin film and the silicon wafer may become
less flat, which may lead to defects, compared to where the silicon
oxide film is formed by a thermal oxidization process. Patent
Documents below do not address such a problem, while describing the
ALD method.
[0008] Patent Document 1: U.S. Pat. No. 7,153,542.
[0009] Patent Document 2: Japanese Patent Publication No.
3,144,664.
[0010] Patent Document 3: U.S. Pat. No. 6,869,641.
SUMMARY OF THE INVENTION
[0011] The present invention has been made in view of the above,
and is directed to a technology that can yield a thin film having a
sufficient density along a thickness direction when the thin film
is deposited on a substrate by repeatedly alternately supplying
plural kinds of gases to the substrate under vacuum. In addition,
the present invention provides a technology contributing to
fabrication of high-performance semiconductor devices.
[0012] According to a first aspect of the present invention, there
is provided a film deposition apparatus that forms a thin film on a
substrate by repeating a cycle of alternately supplying plural
kinds of reaction gases to the substrate under vacuum, wherein a
first reaction gas among the plural kinds of the reaction gases
reacts with a second reaction gas among the plural kinds of the
reaction gases, the second reaction gas being adsorbed on the
substrate, thereby to produce a reaction product. The film
deposition apparatus includes a susceptor that is provided in a
vacuum chamber and includes a substrate receiving area in which a
substrate is placed; an evacuation system that evacuates the vacuum
chamber; plural reaction gas supplying parts that supply the
corresponding reaction gases to the substrate placed in the
substrate receiving area; a plasma generation part that generates
plasma including a chemical component that reacts with the second
reaction gas adsorbed on the substrate, and supplies the plasma to
the substrate during formation of a thin film of the reaction
product thereby to alter the thin film on the substrate; and a
controlling part that outputs a controlling signal in order to
change plasma intensity of the plasma that is generated and
supplied to the substrate by the plasma generation part at a
predetermined point of time to a different plasma intensity before
the predetermined point of time.
[0013] According to a second aspect of the present invention, there
is provided a film deposition method that forms a thin film on a
substrate by repeating a cycle of alternately supplying plural
kinds of reaction gases to the substrate under vacuum, wherein a
first reaction gas among the plural kinds of the reaction gases
reacts with a second reaction gas among the plural kinds of the
reaction gases, the second reaction gas being adsorbed on the
substrate, thereby to produce a reaction product. The film
deposition method includes steps of placing a substrate in a
substrate receiving area of a susceptor provided in a vacuum
chamber; evacuating the vacuum chamber; alternately supplying
plural kinds of the reaction gases to the substrate in the
substrate receiving area from corresponding reaction gas supplying
parts thereby to form a thin film on the substrate; supplying
plasma including a chemical component that reacts with the second
reaction gas adsorbed on the substrate from a plasma generation
part to the substrate when the thin film is being formed, thereby
to alter the thin film on the substrate; and changing plasma
intensity of the plasma supplied to the substrate, at a
predetermined point of time to a different plasma intensity of the
plasma that is generated and supplied to the substrate by the
plasma generation part before the predetermined point of time.
[0014] According to a third embodiment of the present invention,
there is provided a film deposition method that forms a thin film
on a substrate by repeating a cycle of alternately supplying plural
kinds of reaction gases to the substrate under vacuum, wherein a
first reaction gas among the plural kinds of the reaction gases
reacts with a second reaction gas among the plural kinds of the
reaction gases, the second reaction gas being adsorbed on the
substrate, thereby to produce a reaction product. The film
deposition method includes steps of placing a substrate in a
substrate receiving area of a susceptor provided in a vacuum
chamber; evacuating the vacuum chamber; supplying the plural kinds
of the reaction gases from corresponding reaction gas supplying
parts toward the susceptor; supplying plasma including a chemical
component that reacts with one of the second reaction gas adsorbed
on the substrate and at least apart of the substrate from the
plasma generation part toward the susceptor; and rotating the
susceptor around a vertical axis so that the substrate receiving
area passes alternately through a supplying area to which the
second reaction gas is supplied, a reaction area where the first
reaction gas reacts with the second reaction gas adsorbed on the
substrate, and a plasma area that is arranged downstream relative
to the reaction area along a rotation direction of the susceptor
and where the plasma is supplied, wherein the supplying area, the
reaction area, and the plasma area are arranged at intervals along
a circumferential direction of the vacuum chamber.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a schematic view illustrating a thin film obtained
by a conventional method;
[0016] FIG. 2 is a cross-sectional view illustrating a film
deposition apparatus according to an embodiment of the present
invention, where the view is taken along I-I' line in FIG. 4;
[0017] FIG. 3 is a perspective view illustrating an inner structure
of the film deposition apparatus;
[0018] FIG. 4 is a plan view illustrating the film deposition
apparatus;
[0019] FIG. 5 is a perspective view illustrating apart of the inner
structure of the film deposition apparatus;
[0020] FIG. 6 is a cross-sectional view illustrating a part of the
inner structure of the film deposition apparatus;
[0021] FIG. 7 is another cross-sectional view illustrating a part
of the inner structure of the film deposition apparatus;
[0022] FIG. 8 is a cross-sectional view illustrating an example of
an activated gas injector provided in the film deposition
apparatus;
[0023] FIG. 9 is a cross-sectional view illustrating a substrate
subject to a process performed in the film deposition
apparatus;
[0024] FIG. 10 is a schematic view illustrating a process performed
in the film deposition apparatus;
[0025] FIG. 11 is an explanatory view for explaining plasma
intensity;
[0026] FIG. 12 is a schematic view illustrating a process flow;
[0027] FIG. 13 is another schematic view illustrating a process
flow, following FIG. 12;
[0028] FIG. 14 is yet another schematic view illustrating a process
flow, following FIG. 13;
[0029] FIG. 15 is a schematic view illustrating an alteration step
performed in the film deposition apparatus;
[0030] FIG. 16 is a schematic view illustrating gas flow in the
film deposition apparatus;
[0031] FIG. 17 is a schematic view illustrating a substrate
processed in the film deposition apparatus;
[0032] FIG. 18 is a schematic view illustrating another process
performed in the film deposition apparatus;
[0033] FIG. 19 is a schematic view illustrating yet another process
performed in the film deposition apparatus;
[0034] FIG. 20 is an explanatory view for explaining another
example of the present invention;
[0035] FIG. 21 is a schematic view illustrating a process performed
with respect to a substrate, according to another example of the
present invention;
[0036] FIG. 22 is another schematic view illustrating a process
performed with respect to a substrate, according to another example
of the present invention;
[0037] FIG. 23 is a schematic view illustrating a process performed
with respect to a substrate, according to another example of the
present invention;
[0038] FIG. 24 is a schematic view illustrating a process performed
with respect to a substrate, according to another example of the
present invention;
[0039] FIG. 25 is an explanatory view for explaining a process
according to another example of the present invention;
[0040] FIG. 26 is a schematic view illustrating another process
according to another example of the present invention;
[0041] FIG. 27 is a schematic view illustrating another process
according to another example of the present invention;
[0042] FIG. 28 is a schematic view illustrating another process
according to another example of the present invention;
[0043] FIG. 29 is a schematic view illustrating another process
according to another example of the present invention;
[0044] FIG. 30 is a cross-sectional view of another film deposition
apparatus according to another example of the present
invention;
[0045] FIG. 31 is a graph illustrating a relationship between an
oxide film thickness and an inner pressure in a vacuum chamber of
the film deposition apparatus;
[0046] FIG. 32 is a graph illustrating a relationship between an
oxide film thickness and high frequency power supplied to
electrodes thereby to generate plasma;
[0047] FIG. 33 is a graph illustrating a relationship between a
film shrinkage and an oxide film thickness; and
[0048] FIG. 34 is a graph illustrating a relationship between an
increased film thickness and plasma irradiation time.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0049] According to embodiments of the present invention, a thin
film formed on a substrate by repeatedly alternately supplying
plural kinds of gases to the substrate under vacuum can be
sufficiently densified along a thickness direction, because an
alteration step where the substrate is exposed to plasma during the
film deposition is carried out. In addition, because plasma
intensity of the plasma is changed during the film deposition,
influence incurred on the underlying layer of the thin film by the
plasma can be controlled, and properties of the thin film can be
uniform along the thickness direction, thereby contributing to
fabrication of high-performance semiconductor devices.
A First Embodiment
[0050] A film deposition apparatus according to a first embodiment
of the present invention is explained referring to FIGS. 1 through
7. The film deposition apparatus has a vacuum chamber 1 having a
flattened cylinder shape, and a turntable 2 that is located inside
the chamber 1 and has a rotation center at a center of the vacuum
chamber 1. The vacuum chamber 1 is made so that a ceiling plate 11
can be separated from a chamber body 12. The ceiling plate 11 is
pressed onto the chamber body 12 via a sealing member such as an O
ring 13, so that the vacuum chamber 1 is sealed in an airtight
manner. On the other hand, the ceiling plate 11 can be raised by a
driving mechanism (not shown) when the ceiling plate 11 has to be
removed from the chamber body 12.
[0051] The turntable 2 is attached on a cylindrically shaped core
portion 21. The core portion 21 is attached on a top end of a
rotational shaft 22 that extends in a vertical direction. The
rotational shaft 22 goes through a bottom portion 14 of the chamber
body 12 and is attached at the lower end to a driving mechanism 23
that can rotate the rotational shaft 22 clockwise, in this
embodiment. The rotational shaft 22 and the driving mechanism 23
are housed in a case body 20 having a cylinder with a bottom. The
case body 20 is attached in an airtight manner to a bottom surface
of the bottom portion 14 via a flange part, which maintains
airtightness of an inner environment of the case body 20 from an
outer environment.
[0052] As shown in FIGS. 2 and 3, plural (five in the illustrated
example) circular concave portions 24, each of which receives a
substrate wafer W (referred to as a wafer), are formed in an upper
surface of the turntable 2. The concave portions 24 are located
along a circumferential direction (or a rotational direction of the
turntable 2). The wafer W has plural convex parts 90 having pillar
or line shapes on the upper surface of the wafer W, as shown in
FIG. 9. Incidentally, only one wafer W placed in one of the concave
portions 24 is illustrated in FIG. 3.
[0053] As shown in FIG. 4, the concave portion 24 has a diameter
slightly larger, for example, by 4 mm than the diameter of the
wafer W and a depth equal to a thickness of the wafer W. Therefore,
when the wafer W is placed in the concave portion 24, a surface of
the wafer W is at the same elevation of a surface of an area of the
turntable 2, the area excluding the concave portions 24. The
concave portions 24 are wafer W receiving areas provided to
position the wafers W and prevent the wafers W from being thrown
out by centrifugal force caused by rotation of the turntable 2. In
the bottom of the concave portion 24 there are formed three
through-holes (not shown) through which three corresponding
elevation pins (described later) are raised/lowered. The elevation
pins support a back surface of the wafer W and raise/lower the
wafer W.
[0054] As shown in FIGS. 3 and 4, a first reaction gas nozzle 31, a
second reaction gas nozzle 32, separation gas nozzles 41, 42, and
an activated gas injector 220, all of which may be formed of, for
example, quartz, are arranged in radial directions and at
predetermined angular intervals in the circumferential direction
(or the rotation direction of the turntable 2). The nozzles 31, 32,
41, 42 oppose an area through which the concave portions 24 of the
turntable 2 pass. In the illustrated example, the activated gas
injector 220, the separation gas nozzle 41, the first reaction gas
nozzle 31, the separation gas nozzle 42, and the second reaction
gas nozzle 31 are arranged in this order in a clockwise direction
(or the rotation direction of the turntable 2) from a transfer
opening 15 (described later). The activated gas injector 220 and
the nozzles 31, 32, 41, 42 are introduced into the vacuum chamber 1
from an outer circumferential wall of the chamber body 12, in order
to extend along a radius direction of the chamber body 12 and to be
parallel with the upper surface of the turntable 2. Gas
introduction ports 31a, 32a, 41a, 42a serving as base ends of the
corresponding nozzles 31, 32, 41, 42 go through the outer
circumferential wall of the chamber body 12. The first reaction gas
nozzle 31 and the second reaction gas nozzle 32 serve as a first
reaction gas supplying portion and a second reaction gas supplying
portion, respectively; and the separation gas nozzles 41, 42 serve
as a separation gas supplying portion. The activated gas injector
220 is described later.
[0055] The reaction gas nozzle 31 is connected to a gas supplying
source (not shown) of a first reaction gas containing silicon (Si)
such as a diisopropyl amino silane (DIPAS) gas and a bis
(tertiary-butylamino) silane (SiH.sub.2 (NH--C
(CH.sub.3).sub.3).sub.2: BTBAS) gas, via a flow rate control valve
(not shown). The second reaction gas nozzle 32 is connected to a
gas supplying source (not shown) of a second reaction gas such as a
mixed gas of ozone (O.sub.3) gas and oxygen (O.sub.2) gas, or the
combination thereof, via a flow rate control valve (not shown). The
separation gas nozzles 41, 42 are connected to a gas supplying
source (not shown) of nitrogen (N.sub.2) gas serving as a
separation gas, via a flow rate control valve (not shown).
Incidentally, the following explanation is made with the O.sub.3
gas used as the second reaction gas.
[0056] The reaction gas nozzles 31, 32 have plural ejection holes
(not shown) open downward arranged in longitudinal directions of
the reaction gas nozzles 31, 32, for example, at equal intervals
thereby to eject the corresponding source gases to the turntable 2.
An area below the reaction gas nozzle 31 is a first process area P1
in which the silicon-containing gas is adsorbed on the wafer W. An
area below the second reaction gas nozzle 32 is a second process
area P2 in which the silicon-containing gas adsorbed on the wafer W
is oxidized by the O.sub.3 gas.
[0057] The separation gas nozzles 41, 42 have plural ejection holes
(not shown) arranged, for example, at equal intervals in
longitudinal directions of the separation gas nozzles 41, 42
thereby to eject the separation gases downward from the plural
ejection holes 40. The separation nozzles 41, 42 form corresponding
separation areas D that separate the first process area P1 and the
second process area P2. In the separation area D, a convex portion
4 having a top view shape of a sector is provided on the lower
surface of the ceiling plate 11 of the vacuum chamber 1, as shown
in FIGS. 3 and 4. The separation gas nozzles 41, 42 are housed in
groove portions (not shown) in the corresponding convex portions
4.
[0058] With the above configuration, there are flat low ceiling
surfaces 44 (first ceiling surfaces) on both sides of the
separation gas nozzle 41 (or 42), and high ceiling surfaces 45
(second ceiling surfaces) outside of the corresponding low ceiling
surfaces 44. Taking for an example the separation area D where the
separation gas nozzle 41 is provided, this separation area D
impedes the second reaction gas, which flows in the rotation
direction of the turntable 2, from entering a space below the
convex portion 4, and the first reaction gas, which flows in a
direction opposite to the rotation direction of the turntable 2,
from entering the space below the convex portion 4.
[0059] On the other hand, a protrusion portion 5 is provided on the
lower surface of the ceiling plate 11, as shown in FIGS. 6 and 7.
The protrusion portion 5 is formed to be continuous with the inner
arc of the convex portion 4, in this embodiment, so that the lower
surface of the protrusion portion 5 is at the same level as that of
the convex portion 4 (or the ceiling surface 44). FIGS. 3 and 4
illustrate the vacuum chamber 1 as if the vacuum chamber 1 was
horizontally severed at a level lower than the ceiling surface 45
and higher than the separation nozzles 41, 42. In addition, FIG. 2
illustrates a vertical cross section of the vacuum chamber 1 where
the high ceiling surfaces 45 are provided, and FIG. 6 illustrates
half of a vertical cross section of the vacuum chamber 1 where the
low ceiling surface 44 is provided.
[0060] In a circumferential portion of the sector-shaped convex
portion 4 (or an outer circumferential portion facing the inner
surface of the chamber body 12), there is provided a bent portion
46 that bends in an L-shape, as shown in FIGS. 3 and 6. The bent
portion 46 opposes the outer circumferential surface of the
turntable 2 with a slight gap in relation to the inner
circumferential surface of the chamber body 12. The bent portion 46
is provided in order to impede the reaction gases from entering the
separation area D from the both sides of the separation area D and
from being mixed. Gaps between the outer circumferential surface of
the turntable 2 and the inner circumferential surface of the bent
portion 46 and between the outer circumferential surface of the
bent portion 46 and the inner circumferential surface of the
chamber body 12 may be as narrow as the height of the ceiling
surface 44 with respect to the turntable 2, for example.
[0061] A circumferential wall of the chamber body 12 is indented
outward in areas that do not correspond to the separation areas D,
as shown in FIGS. 2 and 4, so that there is a relatively large
space with respect to the outer circumferential surface of the
turntable 2 and from the bottom of the chamber body 12 up to the
outer circumferential surface of the turntable 2. In the following
explanation, the space having substantially a box shape is referred
to as an evacuation area. Specifically, the evacuation area in
gaseous communication with the first process area P1 is referred to
as a first evacuation area E1, and the evacuation area in gaseous
communication with the second process area P2 is referred to a
second evacuation area E2, hereinafter (see FIG. 4). At the bottoms
of the first and the second evacuation areas E1, E2, a first
evacuation port 61 and a second evacuation port 62 are formed,
respectively, as shown in FIGS. 2 and 4. The first and the second
evacuation ports 61, 62 are connected to a vacuum pump 64 serving
as an evacuation unit via an evacuation pipe 63, as shown in FIG.
2. The evacuation pipe 63 is provided with a pressure controller 65
that controls an inner pressure in the vacuum chamber 1.
[0062] As shown in FIGS. 2 and 6, a heater unit 7 serving as a
heating portion is provided in a space between the bottom portion
14 of the chamber body 12 and the turntable 2, so that the wafers W
placed on the turntable 2 can be heated through the turntable 2 at
a predetermined temperature, for example 300.degree. C., which is
determined by a process recipe. In addition, a ring-shaped cover
member 71 is provided beneath the turntable 2 and near the outer
circumference of the turntable 2 in order to surround the heater
unit 7, so that the space where the heater unit 7 is placed is
partitioned from the outside area of the cover member 71, thereby
impeding the gas from entering the space below the turntable 2. The
cover member 71 includes an inner member 71a provided to face the
outer circumferential portion of the turntable 2 and an area
outside of the turntable 2 from below, and an outer member 71b
provided between the inner member 71a and the inner circumferential
surface of the chamber body 12, as shown in FIG. 6. The outer
member 71b is severed in part in order to leave spaces above the
evacuation ports 61, 62, thereby allowing a space above the
turntable 2 to be in gaseous communication with the evacuation
ports 61, 62. In addition, the upper surface of the outer member
71b comes close to the bent portion 46.
[0063] Referring to FIG. 2, a part of the bottom portion 14 of the
vacuum chamber 1 comes close to the lower surface of the core
portion 21. This part is referred to as a protrusion portion 12a.
There is a narrow space between the protrusion portion 12a and the
core portion 21, and the case body 20 is provided with a purge gas
supplying pipe 72. In addition, plural purge gas supplying pipes 73
are arranged along the circumferential direction of the chamber
body 12 and connected to areas below the heater unit 7 in order to
purge the space where the heater unit 7 is housed. A cover member
7a, which may be formed of, for example, quartz glass, is supported
by the upper surface of the cover member 71 and the upper portion
of the protrusion portion 12a, so that the heater unit 7 is covered
by the cover member 7a and thus gases are substantially impeded
from entering the space where the heater unit 7 is housed.
[0064] In addition, a separation gas supplying pipe 51 is connected
to the top center portion of the ceiling plate 11 of the vacuum
chamber 1, so that N.sub.2 gas is supplied as a separation gas to a
space 52 between the ceiling plate 11 and the core portion 21. The
separation gas supplied to the space 52 flows through a narrow gap
50 between the protrusion portion 5 and the turntable 2 and then
along the top surface of the turntable 2 to the outer circumference
of the turntable 2, thereby impeding the reaction gases
(silicon-containing gas and O.sub.3 gas) from being intermixed
through the center portion of the turntable 2. Incidentally, an
area defined by the ceiling plate 11, the core portion 21, and the
protrusion portion 5 is referred to as a center area C.
[0065] Moreover, the vacuum chamber 1 is provided in the outer
circumferential wall with the transport opening 15 through which
the wafer W is transferred into or out from the vacuum chamber 1 by
a transfer arm 10 (see FIG. 3). The transfer opening 15 is provided
with a gate valve (not shown) by which the transfer opening 15 is
opened or closed. Because the wafer W is transferred into the
vacuum chamber 1 through the transfer opening 15 and placed in the
concave portion 24 in the turntable 2, lift pins are provided in an
area facing the transfer opening 16 below the turntable 2. The lift
pins can be moved upward/downward through corresponding
through-holes (not shown) formed in the turntable 24 by an
elevation mechanism (not shown), so that the wafer W is transferred
between the transfer arm 10 and the concave portion 24 of the
turntable 2.
[0066] Next, the activated gas injector 220 is described. The
activated gas injector 220 is arranged to generate plasma in an
area above the concave portions 24 of the turntable 2 and along the
radius direction of the turntable 2 thereby to alter properties of
a silicon oxide film deposited on the wafers W through reaction of
the silicon-containing gas and the O.sub.3 gas. As shown in FIGS. 5
and 8, the activated gas injector 220 is provided with a gas
introduction nozzle 34 that may be made of, for example, quartz
glass and serves as a property alteration gas supplying portion
that supplies a process gas from which plasma is substantially
generated in the vacuum chamber 1, and a pair of sheath pipes 35a,
35b located downstream relative to the gas introduction nozzle 34
along the rotation direction of the turntable 2. The sheath pipes
35a, 35b extend parallel with each other and generate the plasma
from the process gas supplied from the gas introduction nozzle 34.
In addition, the gas introduction nozzle 34 and the sheath pipes
35a, 35b are introduced in an air-tight manner from the outer
circumferential wall of the chamber body 12 to the center of the
turntable 2, are parallel with the wafer W on the turntable 2, and
orthogonally traverse the rotation direction of the turntable 2.
Protection pipes 37 are connected to a base end side of the sheath
pipes 35a, 35b (FIGS. 3 and 8). Plural gas holes 341 are formed in
and along a longitudinal direction of the gas introduction nozzle
34.
[0067] Referring to FIG. 4, the gas introduction nozzle 34 is
connected to one end of a plasma gas introduction line 251 that
supplies the process gas for generating the plasma, and the other
end of the plasma gas introduction line 251 is branched into two
branch lines that are connected to an argon (Ar) gas supplying
source 254 and an oxygen (O.sub.2) gas supplying source 255,
respectively. Each of the two branch lines is provided with a valve
252 and a flow rate controller 253.
[0068] The sheath pipes 35a, 35b may be made of, for example,
quartz, alumina (aluminum oxide), ittria (ittrium oxide), or the
like. As shown in FIG. 8, electrodes 36a, 36b are inserted into the
corresponding sheath pipes 35a, 35b thereby to constitute parallel
electrodes. The electrodes 36a, 36b may be made of, for example,
nickel alloy, titanium, or the like. A distance k between the
electrodes 36a, 36b and the wafer W on the turntable 2 is about 7
mm in this embodiment. These electrodes 36a, 36b are connected to a
high frequency power supply 224 via a matching box 225, as shown in
FIG. 4. High frequency electric power, which may have, for example,
a frequency of 13.56 MHz and electric power of 500 W or less, is
supplied to the electrodes 36a, 36b from the high frequency power
supply 224. Incidentally, the sheath pipes 35a, 35b are simplified
in the drawings except for FIG. 8.
[0069] As shown in FIG. 8, the gas introduction nozzle 34 and the
sheath pipes 35a, 35b are provided with a cover body 221. The cover
body 221 is arranged to cover a top and side (both sides along the
long and short edges) of the gas introduction nozzle 34 and the
sheath pipes 35a, 35b. The cover body 221 is made of an insulating
material such as quartz. In addition, the cover body 221 is
provided with flow limiting surfaces 222 that extend in a flange
shape. Specifically, the flow limiting surfaces 222 are provided
from one end through the other end of the cover body 221 along the
longitudinal direction of the cover body 221 and extend outward
from the corresponding lower edge portions of the cover body 221.
According to the flow limiting surfaces 222, the gases such as the
O.sub.3 gas and the N.sub.2 gas flowing along the rotation
direction of the turntable 2 over the upper surface of the
turntable 2 are impeded from entering the inside of the cover body
221. In addition, the flow limiting surfaces 222 are arranged close
to the upper surface of the turntable 2 so that a gap t between the
flow limiting surface 222 and the upper surface of the turntable 2
is small enough to efficiently impede the gases from entering the
inside of the cover body 221. Moreover, the flow limiting surface
222 has a width u that becomes greater in the rotation direction of
the turntable 2 along a direction toward the inner circumferential
surface of the chamber body 12. The cover body 221 is supported by
plural supporting members 223 (see FIG. 6) connected to the ceiling
plate 11 of the vacuum chamber 1.
[0070] In addition, the film deposition apparatus according to this
embodiment is provided with a controlling part 100, which is made
of a computer, for controlling entire operations of the film
deposition apparatus. The controlling part 100 includes a memory
device (not shown) that stores a computer program that causes the
film deposition apparatus to carry out a film
deposition--alteration step including a film deposition step and an
alteration step. Here, the film deposition step and the alteration
step are briefly explained. In the film deposition step, the
silicon oxide film, which is made of the reaction product of the
silicon-containing gas and the O.sub.3 gas, is formed, and in the
alteration step, the reaction product is altered or densified. In
addition, the film deposition step and the alteration step are
alternately repeated so that plural layers of the reaction product
are accumulated on the wafer W. In this case, the controlling part
100 outputs a controlling signal to the high frequency power source
224 in order to adjust (or change) plasma intensity in the
alteration step so that the silicon oxide film is uniformly altered
in a thickness direction of the silicon oxide film while the plasma
is prevented from penetrating through the silicon oxide film to
reach the wafer W, which is made of silicon. For example, when a
film thickness of the silicon oxide is small, or at an initial
stage of the repeatedly performed film deposition and alteration
step, the plasma intensity is zero, and as the film thickness is
increased, or as the number of the film deposition steps is
increased, the plasma intensity is increased in a stepwise manner,
as shown in FIG. 10. Incidentally, the controlling portion 100 may
output a controlling signal to the pressure controller 65 in order
to adjust the inner pressure in the vacuum chamber 1.
[0071] Here, "plasma intensity" is referred to as intensity of
plasma to which the wafer W is exposed, and differs depending on
electric power supplied to the electrodes 36a, 36b, an inner
pressure in the vacuum chamber 1, an exposure time of the plasma to
the wafer W, a distance k between the electrodes 36a, 36b, and the
like. In order to quantitatively express the "plasma intensity", a
film thickness j of a silicon oxide film obtained by continuously
exposing the upper surface of the wafer W (or a silicon layer) to
plasma for 180 s, as shown in FIG. 10, is used as an indicator in
this embodiment. For example, when a silicon oxide film having a
thickness of 1 nm is obtained after the upper surface of the wafer
W is exposed to plasma for 180 s under certain conditions, the
plasma intensity in this case is expressed as "plasma intensity
corresponding to the film thickness j of 1 nm". Similarly, when a
silicon oxide film having a thickness of 2 nm is obtained, the
plasma intensity is expressed as "plasma intensity corresponding to
the film thickness j of 2 nm".
[0072] When the film deposition--alteration process is being
carried out, the plasma intensity is adjusted with electric power
supplied to the electrodes 36a, 36b while other parameters such as
the inner pressure in the vacuum chamber 1 are kept constant.
Specifically, when the distance k between the electrodes 36a, 36b
and the wafers W having diameters of 300 mm is set to the above
value and the inner pressure in the vacuum chamber 1 is kept at 266
Pa (2 Torr), the electric power supplied to the electrodes 36a, 36b
of 30 W provides the film thickness j corresponding to 1 nm, and
the electric power supplied to the electrodes 36a, 36b of 65 W
provides the film thickness j corresponding to 2 nm. A relationship
between the electric power and the film thickness j depends on
process conditions, and thus preferably is obtained in advance by,
for example, carrying out an experiment using, for example, test
wafers, under predetermined conditions.
[0073] Incidentally, the program includes groups of steps or
instructions that cause the constituting members or parts of the
film deposition apparatus to perform the film
deposition--alteration process. The program is stored in a memory
portion 101 (FIG. 4), which is a computer readable storage medium
such as a hard disk, a compact disk, a magneto-optical disk, a
memory card, a flexible disk, or the like, and installed into the
control part 100.
[0074] Next, the operations of the film deposition apparatus
according to this embodiment (film deposition method) are described
in the following. First, the wafer W is transferred into the vacuum
chamber 1 through the transfer opening 15 by the transferring arm
10, after the gate valve (not shown) is opened. Specifically, when
one of the concave portions 24 of the turntable 2 is in alignment
with the transfer opening 15 by appropriately rotating the
turntable 2, the wafer W is placed in the concave portion 24 of the
turntable 2 by the lift pins (not shown) and the transfer arm 10
that cooperatively operate. Such operations are intermittently
repeated so that five wafers W are placed in the corresponding
concave portions 24 of the turntable 2. Next, after the transfer
arm 10 recedes from the vacuum chamber 1, the gate valve (not
shown) is closed, and the vacuum chamber 1 is evacuated to the
lowest reachable pressure by the vacuum pump 64. Then, the
turntable 2 starts rotating in a clockwise direction at a
rotational speed of, for example, 120 revolutions per minute, and
the wafers W on the turntable are heated at, for example,
300.degree. C. The N.sub.2 gas is supplied at predetermined flow
rates from the separation gas nozzles 41, 42, the separation gas
supplying pipe 51, and the purge gas supplying pipes 72.
Subsequently, the silicon-containing gas is supplied from the
reaction gas nozzle 31; the O.sub.3 gas is supplied from the second
reaction gas nozzle 32; and the Ar gas and the O.sub.2 gas are
supplied at flow rates of, for example, 9.5 standard liters per
minute (slm) and 0.5 slm, respectively, from the gas introduction
nozzle 34. The vacuum chamber 1 is maintained at a predetermined
pressure, for example, 266 Pa (2 Torr) by the pressure controller
65.
[0075] With the rotation of the turntable 2, the silicon-containing
gas is adsorbed on the upper surface of the wafer W in the first
process area P1, and the adsorbed silicon-containing gas on the
upper surface of the wafer W is oxidized by the O.sub.3 gas in the
second process area P2, so that one molecular layer or plural
molecular layers of the reaction product, i.e., silicon oxide is
formed in the film deposition step (or a cycle of supplying
reaction gases to the upper surface of the wafer W). In this case,
because no high frequency power is supplied to the electrodes 36a,
36b, the plasma intensity is zero (a first plasma intensity). With
this, the molecular layer or the plural molecular layers may
include impurities such as organic groups and/or moisture (OH
groups), which originate from, for example, the silicon-containing
gas. After the film deposition step is continued by rotating the
turntable 2 until a film thickness of the silicon oxide film
becomes 1 nm, as shown in FIGS. 10 and 12, high frequency power of
45 W (a second plasma intensity) is applied across the electrodes
36a, 36b so that the plasma intensity corresponds to the oxide film
thickness j of 1.5 nm. Incidentally, FIG. 12 schematically
illustrates the wafer W and the reaction product deposited on the
wafer W. FIGS. 13 and 14, which are referred to later, also
schematically illustrate the wafer W and the reaction product.
[0076] In the activated gas injector 220, the Ar gas ejected from
the gas introduction nozzle 34 toward the sheath pipes 35a, 35b is
activated by high frequency electric power between the sheath pipes
35a, 35b into plasma including ions and/or radicals, which in turn
flow downward toward the wafers W on the turntable 2, which is
rotated, below the activated gas injector 220. When the wafer W
reaches the area below the activated gas injector 220, the wafer W
is exposed to the plasma and thus the alteration step that alters
the silicon oxide film is carried out. Specifically, because the
wafer W is bombarded with, for example, the ions and/or radicals,
the impurities are degassed from the silicon oxide film, and the
silicon atoms and the oxygen atoms are rearranged, resulting in
densification of the silicon oxide film, as schematically shown in
FIG. 15.
[0077] In this case, because the plasma intensity is set as
described above, the plasma can enter or penetrate the silicon
oxide film from the upper surface thereof through a vicinity of the
upper surface of the underlying substance, which is the wafer W
(silicon) in the illustrated example, as shown on the left side
view of FIG. 13. Therefore, the silicon oxide film formed at the
plasma intensity of zero (see the right side view of FIG. 12) can
be uniformly altered in the thickness direction by the penetrating
plasma, while the upper surface of the wafer W (silicon) is
prevented from being oxidized. This film deposition--alteration
step including the film deposition step and the alteration step is
repeated plural times by rotating the turntable 2 until a film
thickness of the silicon oxide film becomes 2 nm. With this, a
thickness of the silicon oxide film is increased, and thus the
lowest level (or the depth from the upper surface of the silicon
oxide film) that the plasma can reach becomes gradually moved away
from the upper surface of the wafer W. Incidentally, arrows in FIG.
13 schematically illustrate the plasma intensity. Arrows in FIG.
14, which is referred to later, also illustrate the plasma
intensity.
[0078] Because the separation area D is not provided between the
activated gas injector 220 and the second reaction gas injector 32
in the vacuum chamber 1, the O.sub.3 gas and the separation gas
(N.sub.2 gas) flow toward the activated gas injector 220 from the
upstream side of the activated gas injector 220 because of rotation
of the turntable 2. However, such gases are least likely to flow
through the space between the activated gas injector 220 and the
turntable 2, because the gases flow through above the activated gas
injector 220. This is because the activated gas injector 220 is
provided with the cover body 221. Incidentally, the impurities
removed from the silicon oxide film during the alteration step are
turned into gas, and then the gas is evacuated together with the
O.sub.2 gas and the N.sub.2 gas.
[0079] In addition, because the N.sub.2 gas is supplied between the
first process area P1 and the second process area P2 and the
N.sub.2 gas is supplied to the center area C, the
silicon-containing gas and the O.sub.3 gas are not intermixed with
each other and are evacuated to the corresponding evacuation ports
61, 62. Incidentally, because the area below the turntable 2 is
purged with the N.sub.2 gas, for example, the silicon-containing
gas that has flowed into the evacuation area E1 (or E2) cannot flow
into the area where the O.sub.3 gas is supplied through the space
below the turntable 2.
[0080] Then, high frequency power is applied, for example, at 150 W
across the electrodes 36a, 36b in order to obtain the plasma
intensity corresponding to the oxide film thickness j of 3.7 nm. In
this case, the plasma can only reach the vicinity of the upper
surface of the wafer W, as shown in FIG. 14, so that the silicon
oxide film deposited on the wafer W is uniformly altered, but the
upper surface of the wafer W is prevented from being oxidized.
Next, the film deposition--alteration step is continued until a
thickness of the silicon oxide film becomes 10 nm, a silicon oxide
film, which has been densified along the film thickness direction,
is formed to cover the convex portions 90 formed on the upper
surface of the wafer W, while the upper surface of the wafer W is
prevented from being oxidized, as shown in FIG. 17. Therefore,
reduction of the width d of the convex portion 90, which may be
caused by silicon oxide grow due to irradiation of plasma, can be
avoided.
[0081] According to this embodiment, when the film
deposition--alteration process composed of the film deposition
step, where the reaction product is formed on the wafer W using the
silicon-containing gas and the O.sub.3 gas, and the alteration
step, where the reaction product is altered by plasma, is repeated
plural times, the plasma intensity is set to zero when a thickness
of the reaction product (or at an initial stage of the film
deposition--alteration process), and then the plasma intensity of
the plasma supplied to the wafer W is increased in a stepwise
manner as a thickness of the reaction product is increased (or as
the number of the film deposition steps is increased). Therefore,
the thin film, which is densified along the thickness direction
uniformity, can be obtained while the upper surface of the wafer W
can be prevented from being oxidized, thereby yielding an excellent
device structure with a desired feature as shown in FIG. 17.
[0082] In addition, in the film deposition--alteration process, the
alteration step is carried out with respect to the wafer W when the
wafer W moves along from the second process area P2 to the first
process area P1 in the vacuum chamber 1 every time after the film
deposition step, in such a manner that the film deposition is not
influenced by the alteration step. In addition, because the
alteration process is carried out every time after the film
deposition step in the film deposition--alteration process, the
thin film can be altered in a shorter time compared to a case where
the thin film is altered after the film deposition is
completed.
[0083] Incidentally, while the plasma intensity is increased in a
stepwise manner in the above example, the plasma intensity is
continuously increased as the number of the film deposition steps
is increased, or every turn of the turntable 2, as shown in FIGS.
18 and 19. Also in this case, the plasma intensity is set to zero
at an initial stage of the film deposition--alteration process, or
until a thickness of the reaction process reaches, for example, 1
nm. By adjusting the plasma intensity, the plasma can reach the
vicinity of the upper surface of the wafer W, which underlies the
thin film of the reaction product, in the alteration step.
Therefore, the film can be uniformly altered along the thickness
direction. Incidentally, FIG. 19 schematically illustrates the
wafer W and the reaction product on the wafer W, where the plasma
intensity is schematically represented by arrows.
[0084] Here, at the initial stage of the film
deposition--alteration process, the high frequency power may be
supplied at 5 W to the electrodes 36a, 36b so that the plasma
intensity corresponds to the oxide film thickness j of 0.2 nm.
However, the plasma intensity is preferably set to zero because it
is not easy to maintain the plasma at such a lower level.
A Second Embodiment
[0085] Next, a second embodiment of the present invention is
explained, where a silicon oxide film serving as a gate electrode
film is formed on a substrate. While it is especially important for
the gate electrode film to have excellent flatness at a boundary
between the silicon oxide film and the underlying silicon wafer, a
silicon oxide film formed by a conventional Chemical Vapor
Deposition (CVD) method, an Atomic Layer Deposition (ALD) method or
a Molecular Layer Deposition (MLD) method may have relatively
degraded flatness, as schematically illustrated in FIG. 20,
compared to a thermally grown silicon oxide film. In the following,
a film deposition method according to the second embodiment of the
present invention, which can form a silicon oxide film having
excellent flatness at a boundary between the silicon oxide film and
the underlying silicon wafer.
[0086] Specifically, when the film deposition step and the
alteration step are alternately performed by rotating the turntable
2, the alteration step is performed at a second plasma intensity,
which corresponds to the oxide film thickness j of 5.3 nm (or by
setting the high frequency power supplied to the electrodes 36a,
36b to 400 W) until a thickness of the reaction product reaches 3
nm, as shown in FIG. 24. This plasma can reach the wafer W through
the thin film of the reaction product, thereby oxidizing the upper
surface (or portion) of the wafer W, as shown in FIG. 21.
[0087] Therefore, a first silicon oxide film 92 that is formed
through the oxidization of the wafer W and a second silicon oxide
film 93 that is formed by the film deposition--alteration process
are formed on an underlying layer 91, which corresponds to an upper
portion of the wafer W, as shown in FIG. 22. Namely, a silicon
oxide film 94 composed of the first silicon oxide film 92 and the
second silicon oxide film 93 is formed on the wafer W (the
underlying film 91). Because the plasma-oxidized first silicon
oxide film is generally likely to provide better flatness at the
boundary in relation to the underlying film than the thermally
grown silicon oxide film, an excellent flatness can be achieved
between the silicon oxide film 94 and the underlying film 91.
[0088] Then, the film deposition step and the alteration step,
which is performed at a first plasma intensity corresponding to the
oxide film thickness j of 3.7 nm, are alternately performed until a
thickness of the reaction product reaches 10 nm. With this, a thin
film that is densified along the thickness direction and provides
excellent flatness at the boundary in relation to the underlying
film 91 can be obtained. Here, the plasma intensity is reduced from
that corresponding to the oxide film thickness j of 5.3 nm to that
corresponding to the oxide film thickness j of 3.7 nm, in order to
avoid a further increase of a thickness of the first silicon oxide
film 92 and to desirably control a thickness of the silicon oxide
film 94.
[0089] Incidentally, while the plasma intensity is set to be
relatively large at the initial stage of the film deposition in
order to oxidize the upper surface (or portion) of the wafer W to
form the plasma-oxidized silicon oxide film 92 in this embodiment,
the plasma-oxidized silicon oxide film may be formed in the
following manner in other embodiments.
[0090] Namely, after the wafers W are placed in the substrate
receiving areas 24 of the turntable 2, the vacuum chamber 1 is
maintained at a predetermined pressure with the N.sub.2 gas
supplied from the separation gas supplying portions 41, 42 and the
like and the turntable 2 starts rotating. Then, the plasma is
generated by the activated gas injector 220. In this case, because
the upper surface of the wafer W is exposed to the plasma, the
upper surface is readily oxidized, so that the plasma-oxidized
silicon oxide film is obtained. Next, after the turntable 2 is
rotated plural (or at least two) times, the silicon-containing gas,
the oxidizing gas, and the separation gases are supplied to the
vacuum chamber 1 from the corresponding gas supplying nozzles 31,
32, 41, and 42, so that the film deposition step and the alteration
step are alternately repeated. Even in this case, the densified
silicon oxide film 94 can be formed on the wafer W. In this case,
the plasma intensity may be lower after the film deposition step
starts than before it starts, or may be the same after and before
the film deposition step starts.
[0091] In the first and the second embodiments, influence incurred
on the underlying layer of the thin film by the plasma can be
controlled by adjusting the plasma intensity.
A Third Embodiment
[0092] Next, a third embodiment of the present invention is
explained. FIG. 25 schematically illustrates multilayers of the
reaction product and the plasma irradiated to the reaction product.
Specifically, the plasma irradiated to the reaction product is
indicated by arrows in the drawing, while a thickness of the
reaction product is increased. More specifically, a vertical length
(or range) of each of the arrows indicates a thickness of the
reaction product that is exposed to the plasma as the thickness is
increased. In other words, the leftmost arrow indicates that the
plasma can penetrate through the reaction product having a
thickness of about 3 nm into the wafer W from the upper surface of
the reaction product.
[0093] When paying attention to a particular layer of the reaction
product having a thickness of 3 nm to 10 nm, if the layer is close
to the upper surface of the wafer W, the layer is exposed to the
plasma certain times as long as the plasma can penetrate through
the layer, because the alteration step is repeated. However, if the
layer is close to the upper surface of the reaction product having
a thickness of 10 nm, the layer is exposed to the plasma fewer
times. Namely, the reaction product goes through the plasma
alteration step different times depending on a thickness of the
reaction product. On the other hand, when the plasma intensity is
set to the oxide film thickness j of 5.3 nm with respect to the
reaction product having a thickness of 3 nm or less, and is set to
the oxide film thickness j of less than 5.3 nm with respect to the
reaction product having a thickness of 3 nm through 10 nm, an
irradiation amount of the plasma irradiated to the layer near the
upper surface of the wafer W becomes larger than that irradiated to
the layer near the upper surface of the reaction product having a
thickness of 10 nm.
[0094] In view of the above, the plasma intensity is adjusted in
this embodiment so that the irradiation amount of the plasma
irradiated to the reaction product is equalized irrespective of a
thickness of the reaction product. Specifically, as shown in FIGS.
26 and 27, an upper portion of the reaction product, which may
correspond to thicknesses of 8 nm to 10 nm, is exposed to the
plasma having a third plasma intensity corresponding to the oxide
film thickness j of 5.3 nm. The third plasma intensity is greater
than that of the plasma irradiated to the reaction product having a
thickness of 8 nm to 10 nm in the second embodiment (see FIG. 24).
In addition, the plasma intensity is set to the oxide film
thickness j of 1.5 nm in order to reduce the irradiation amount of
the plasma irradiated to the reaction product having a thickness of
3 nm or less, and linearly increased to the oxide film thickness j
of 3.7 nm as a thickness of the reaction product is increased from
3 nm to 8 nm. By adjusting the plasma intensity in such a manner, a
degree of alteration is equalized along the thickness direction of
the reaction product, and thus a thin film having uniform film
properties can be obtained.
[0095] In addition, the plasma intensity is set to the oxide film
thickness j of 5.3 nm with respect to the reaction product until a
thickness of the reaction product reaches 1 nm in order to oxidize
the underlying film 91 into the silicon oxide film 92, and
gradually increased to the oxide film thickness j of 5.3 nm as a
thickness of the reaction product is increased from 1 nm to 10 nm,
as shown in FIG. 24.
[0096] Moreover, properties of the reaction product can be
equalized along the thickness direction of the reaction product
even in the first embodiment, in the same manner as the third
embodiment. Specifically, the plasma intensity is gradually
increased from the oxide film thickness j of 1.5 nm to the oxide
film thickness j of 2 nm as a thickness of the reaction product is
increased from zero to 4 nm, and the plasma intensity is set to
zero when a thickness of the reaction product is from 4 nm to 7 nm.
Then, the plasma intensity is gradually increased from the oxide
film thickness j of 3 nm (or the high frequency power of 110 W
supplied to the electrodes 36a, 36b) to the oxide film thickness j
of 5.3 nm as a thickness of the reaction product is increased from
7 nm to 10 nm. By adjusting the plasma intensity in such a manner,
a thin film having uniform film properties along the thickness
direction can be obtained while the oxidization of the wafer W
underneath the thin film (reaction product) is reduced. Even in
this case, the plasma intensity may be set to zero at the initial
stage of the film deposition step (or until a thickness of the
reaction product becomes, for example, 1 nm).
[0097] As stated above, according to embodiments of the present
invention, the plasma intensity may be adjusted as a thickness of
the reaction product is increased, depending on desired properties
of semiconductor devices. The adjustment of the plasma intensity
may be made in order to make the properties of the thin film of the
reaction product uniform or non-uniform along the thickness
direction. For example, when the silicon oxide film is used as a
gate oxide film, the flat boundary between the underlying film 91
and the silicon oxide film 94 can be obtained, so that carrier
mobility in a channel of a field effect transistor can be
increased. In addition, the first silicon oxide film 92 and the
second silicon oxide film 93 of the silicon oxide film 94 (FIG. 22)
can become low leakage, high reliability films by exposing the
oxide films 92, 93 to the plasma having the plasma intensity
sufficient to appropriately alter the oxide films 92, 93. Moreover,
the upper silicon oxide film 93 of the silicon oxide film 94 may
have a high density and a high gas barrier characteristic by
increasing the plasma intensity. In such ways, the film properties
along the thickness direction can be arbitrarily adjusted.
[0098] In the above embodiments, the film deposition step and the
alteration step are alternately performed. Namely, supplying the
silicon-containing gas and the O.sub.3 gas and irradiating the
plasma to the wafer W are performed while the turntable 2 is
rotated. However, the alteration step may be performed every plural
film deposition step. In this case, the high frequency power is not
supplied to the electrodes 36a, 36b when the film deposition step
is performed plural times, but supplied to the electrodes 36a, 36b
only when the alteration step is performed. In addition, when the
alteration step is performed, the silicon-containing gas and the
O.sub.3 gas are not supplied to the corresponding process areas P1,
P2 (FIG. 3). In this case, the alteration step can be continuously
performed plural times by rotating the turntable 2.
[0099] While the two parallel electrodes 36a, 36b are used in order
to generate the plasma (so-called Capacitively Coupled Plasma
(CCP)) in the above embodiments, a U-shaped electrode may be used.
In this case, it is preferable when a curved portion of the
U-shaped electrode is arranged near the center of the vacuum
chamber 1 and two straight portions separately go through the outer
circumferential wall of the chamber body 12 in an airtight manner.
When high frequency power is supplied to the U-shaped electrode,
so-called Inductively Coupled Plasma (ICP) is generated in the
vacuum chamber 1. In addition, not only CCP and ICP but also
Surface Wave Plasma (SWP) using microwaves and Electron Cyclotron
Resonance (ECR) Plasma may be employed.
[0100] Moreover, the oxidizing gas may be supplied to the wafer W
on which the silicon-containing gas is adsorbed, through the
activated gas injector 220 rather than the second reaction gas
nozzle 32. In this case, a process gas (Ar gas and O.sub.2 gas) is
supplied to and activated by the activated gas injector 220, so
that the silicon-containing gas adsorbed on the wafer W is oxidized
and so-formed silicon oxide is altered by the process gas from the
activated gas injector 220.
[0101] Furthermore, while the high frequency power is adjusted in
order to change the plasma intensity in the above embodiments, the
inner pressure in the vacuum chamber 1 may be adjusted instead of
or in addition to the high frequency power, as explained later.
Additionally, O.sub.2 gas or O.sub.3 gas may be used as the
oxidizing gas supplied from the second reaction gas nozzle 32, and
Ar gas and O.sub.3 gas may be used as a process gas for generating
the plasma.
[0102] In addition, while the silicon-containing gas and the
O.sub.3 gas are used to form the silicon oxide film in the above
embodiments, the silicon-containing gas and ammonia (NH.sub.3) gas
may be used as the first reaction gas and the second reaction gas,
respectively, thereby forming a silicon nitride film. In this case,
a mixed gas of Ar and ammonia or a mixed gas of Ar and nitrogen may
be used as a process gas from which the plasma is generated. The
film deposition step and the alteration step are alternately
performed using these gases. Namely, when the plasma intensity is
reduced or set to zero at the initial stage of the film deposition
step and then increased as a thickness of the silicon nitride film
is increased, the silicon nitride film having uniform density along
the thickness direction while the upper surface of the wafer W is
prevented from being nitrided. On the other hand, when the plasma
intensity is so high that the plasma reaches the upper surface of
the wafer W at the initial stage of the film deposition step, the
upper surface of the wafer W is nitrided, and thus excellent
flatness is achieved at the boundary between the silicon nitride
film and the underlying layer.
[0103] In addition, titanium chloride (TiCl.sub.2) gas and ammonia
(NH.sub.3) gas may be used as the first reaction gas and the second
reaction gas, thereby forming titanium nitride (TiN) film. In this
case, a substrate made of silicon is used as the wafer W, and Ar
gas or nitrogen gas is used as a process gas from which the plasma
is generated.
[0104] In addition, the film deposition step and the alteration
step may be performed in not only the film deposition apparatus (a
so-called semi-batch apparatus) shown in FIG. 2 but also a
single-wafer apparatus. As shown in FIG. 30, such a single-wafer
apparatus is provided with, for example, a vacuum chamber 1, a
susceptor 2 that is provided in the vacuum chamber 1 and on which
the wafer W is placed, and a gas showerhead 200 arranged above the
susceptor 2 in order to oppose the susceptor 2. The showerhead 200
has plural gas ejection holes 201 on the lower surface. In
addition, gas supplying lines 202, 203, 204, and 205 are connected
to corresponding gas conduits (not shown) formed in the showerhead
200. With this configuration, a first reaction gas, a second
reaction gas, a separation gas (purge gas), and a process gas from
which the plasma is generated are separately supplied toward the
susceptor 2 from the corresponding gas ejection holes 201 through
the corresponding gas supplying lines 202, 203, 204, and 205 and
the corresponding gas conduits. In addition, a high frequency power
source 206 is connected to the showerhead 200, so that the
showerhead 200 serves as parallel planar electrodes together with
the susceptor 2. Incidentally, a reference symbol 210 represents a
transfer opening through which the wafer W is transferred into/out
from the vacuum chamber 1; a reference symbol 211 represents an
evacuation port; and a reference symbol 212 represents an
insulating member.
[0105] When the film deposition step is performed in the
single-wafer apparatus, the first reaction gas and the second
reaction gas are alternately supplied to the vacuum chamber 1 with
purging periods therebetween. In each of the purging periods, the
purge gas is supplied to the vacuum chamber 1 while the vacuum
chamber 1 is evacuated. When the alteration step is performed,
after the vacuum chamber 1 is purged with the purge gas and
evacuated to vacuum, the process gas from which the plasma is
generated is supplied to the vacuum chamber 1, and the high
frequency power is supplied across the showerhead 200 and the
susceptor 2. In such a manner, the film deposition step and the
alteration step are alternately performed with the purging periods
therebetween.
[0106] Next, experiments carried out in order to study the
influence of the plasma intensity in the alteration step and their
results are explained.
Example 1
[0107] First, dependence of the plasma intensity of the plasma on
the inner pressure in the vacuum chamber 1 and the high frequency
power was studied. In this experiment, the batch type experimental
apparatus was used. This apparatus is provided with a vacuum
chamber, a susceptor inside the vacuum chamber, and an ICP type
plasma source arranged to oppose the susceptor. Distance between
the plasma source and the wafer W is set to 80 mm. After the wafer
W was placed on the susceptor and the plasma was irradiated to the
wafer W for 180 s, the oxide film thickness j of the silicon oxide
film formed on the upper surface of the wafer W was measured. Such
an experiment was carried out repeatedly, with different pressures
of the vacuum chamber while the high frequency power was maintained
at 200 W, and with different high frequency powers while the inner
pressure in the vacuum chamber was maintained at 266 Pa (2
Torr)
[0108] As a result, it has been found that the plasma intensity can
be adjusted by changing the inner pressure in the vacuum chamber,
as shown in FIG. 31, and by changing the high frequency power, as
shown in FIG. 32.
Example 2
[0109] Next, shrinkage rates of silicon oxide films are explained.
The silicon oxide films used were formed on the wafers W by
performing only the film deposition step without the alteration
step. The shrinkage rates were calculated using thicknesses of the
silicon oxide films before and after the alteration step was
performed with respect to the silicon oxide films at various plasma
intensities.
[0110] As a result, it has been found as shown in FIG. 33 that the
shrinkage rate is in linear proportion with the plasma intensity.
This result indicates that the film properties along the thickness
direction can be adjusted by changing the plasma intensity.
Example 3
[0111] Next, oxidation of the silicon wafer W by the plasma
including O.sub.2 gas was studied. In this experiment, a bare
silicon wafer with the clean upper surface (or with silicon
exposed) and a test silicon wafer with a thermal silicon dioxide
layer having a thickness of 10 nm were used. The upper surfaces of
the bare silicon wafer and the test silicon wafer with the thermal
silicon dioxide layer are exposed to the plasma for different
periods of time while the turntable 2 is rotated in the film
deposition apparatus explained with reference to FIGS. 2 through
8.
[0112] As a result, after the upper surface of the bare silicon
wafer was exposed to the plasma for 10 minutes, a silicon oxide
film having a thickness of 2.8 nm was formed thereon, as shown in
FIG. 34. This result indicates that the silicon oxide can be formed
with a controlled thickness by adjusting the plasma intensity as
the thickness is increased, as explained with reference to FIGS. 21
and 22.
[0113] On the other hand, a silicon oxide film having a thickness
of only 0.6 nm was formed on the thermal silicon dioxide layer on
the test silicon wafer, after the test silicon wafer (the thermal
silicon dioxide layer) was exposed to the plasma for 10 minutes.
When the silicon oxide is formed through the irradiation of the
plasma, the silicon oxide is grown through the plasma-oxidization
of the upper surface of the silicon wafer. Therefore, when the
thermal silicon dioxide is formed on the upper surface of the
silicon wafer, the plasma cannot penetrate deep into the silicon
wafer, and thus the silicon oxide film having a thickness of only
0.6 nm was obtained. In addition, this result indicates that the
plasma can penetrate into the silicon wafer even when the thermal
silicon dioxide layer is formed on the test silicon wafer.
Therefore, it has been confirmed that the plasma can oxidize the
upper surface of the wafer W through the silicon oxide film
deposited in the film deposition step, while altering the
properties of the deposited silicon oxide film.
[0114] While the present invention has been described in reference
to the foregoing embodiments, the present invention is not limited
to the disclosed embodiments, but may be modified or altered within
the scope of the accompanying claims.
* * * * *