U.S. patent application number 13/218223 was filed with the patent office on 2012-03-01 for non-contact radiant heating and temperature sensing device for a chemical reaction chamber.
This patent application is currently assigned to LIFE TECHNOLOGIES CORPORATION. Invention is credited to Janice G. Shigeura, John S. Shigeura.
Application Number | 20120052564 13/218223 |
Document ID | / |
Family ID | 29739478 |
Filed Date | 2012-03-01 |
United States Patent
Application |
20120052564 |
Kind Code |
A1 |
Shigeura; John S. ; et
al. |
March 1, 2012 |
Non-Contact Radiant Heating and Temperature Sensing Device for a
Chemical Reaction Chamber
Abstract
An apparatus and methods are provided for heating and sensing
the temperature of a chemical reaction chamber without direct
physical contact between a heating device and the reaction chamber,
or between a temperature sensor and the reaction chamber. A
plurality of chemical reaction chambers can simultaneously or
sequentially be heated independently and monitored separately.
Inventors: |
Shigeura; John S.; (Portola
Valley, CA) ; Shigeura; Janice G.; (Portola Valley,
CA) |
Assignee: |
LIFE TECHNOLOGIES
CORPORATION
Carlsbad
CA
|
Family ID: |
29739478 |
Appl. No.: |
13/218223 |
Filed: |
August 25, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11925002 |
Oct 26, 2007 |
8007733 |
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13218223 |
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11423070 |
Jun 8, 2006 |
7294812 |
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11925002 |
|
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11006131 |
Dec 7, 2004 |
7173218 |
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11423070 |
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10359668 |
Feb 6, 2003 |
6833536 |
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11006131 |
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60382502 |
May 22, 2002 |
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Current U.S.
Class: |
435/289.1 ;
422/119 |
Current CPC
Class: |
G01N 2035/00366
20130101; B01J 2219/00934 20130101; B01J 2219/00943 20130101; G01N
2035/00415 20130101; B01L 2300/1838 20130101; B01L 2300/185
20130101; B01L 2300/1861 20130101; B01L 2400/0409 20130101; B01J
2219/00862 20130101; B01L 7/52 20130101; B01J 2219/00788 20130101;
B01L 2300/1872 20130101; B01L 2300/0803 20130101; B01J 19/0093
20130101; B01J 2219/00873 20130101; B01J 2219/00961 20130101; B01J
2219/00822 20130101; B01L 2200/147 20130101; B01L 3/50851
20130101 |
Class at
Publication: |
435/289.1 ;
422/119 |
International
Class: |
C12M 1/40 20060101
C12M001/40; B01J 19/00 20060101 B01J019/00 |
Claims
1. A heating system comprising: a non-contact radiant heater; a
non-contact radiant temperature sensor; and a heatable device
including a chemical reaction chamber having a volume of about 10
ml or less, the heatable device being spaced from the non-contact
radiant heater spaced from the non-contact radiant temperature
sensor, and positioned for the chemical reaction chamber to receive
heat irradiated by the non-contact radiant heater and for the
chemical reaction chamber to radiate heat toward the non-contact
radiant temperature sensor.
2. The heating system of claim 1, further comprising a first
platform region supporting the non-contact radiant heater, and a
second platform region supporting the non-contact radiant
temperature sensor.
3. The heating system of claim 2, wherein a plurality of
non-contact radiant heaters are supported by the first platform
region; and a plurality of non-contact radiant temperature sensors
are supported by the second platform region.
4. The heating system of claim 2, wherein the first platform region
and the second platform region are each a part of the same
platform.
5. The heating system of claim 1, wherein the heatable device is
spaced away from the non-contact radiant heater by a distance of
from about five mm to about 20 mm.
6. The heating system of claim 2, wherein the first platform region
also supports the heatable device.
7. The heating system of claim 1, wherein the non-contact radiant
heater comprises a laser source.
8. The heating system of claim 1, wherein the non-contact radiant
heater comprises a halogen light source.
9. The heating system of claim 1, wherein the non-contact radiant
heater produces a light that has a wavelength of about 0.7
micrometer or longer.
10. The heating system of claim 1, wherein the non-contact radiant
heater can heat the heatable device to a temperature of from about
20.degree. C. to about 100.degree. C.
11. The heating system of claim 1, wherein the non-contact
temperature sensor is capable of detecting energy having a
wavelength of from about five micrometers to about 15 micrometers.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of application Ser. No.
11/925,002 filed Oct. 26, 2007, now U.S. Pat. No. 8,007,733, which
is a continuation of application Ser. No. 11/423,070 filed Jun. 8,
2006, now U.S. Pat. No. 7,395,812, which is a continuation of
application Ser. No. 11/006,131 filed Dec. 7, 2004, U.S. Pat. No.
7,173,218, which is a continuation of application Ser. No.
10/359,668 filed Feb. 6, 2003, now U.S. Pat. No. 6,833,536, which
claims a benefit under 35 U.S.C. .sctn.119(e) from U.S. Provisional
Patent Application No. 60/382,502 filed May 22, 2002, all of which
are incorporated herein in their entirety by reference.
FIELD
[0002] The present invention relates to an apparatus and method for
heating and sensing the temperature of a chemical reaction
chamber.
BACKGROUND
[0003] Temperature control is a common requirement for biochemical
reactions. Conventional temperature control designs typically
require some form of contact (e.g., physical engagement) or
interconnection (e.g., electrical connectors) between an instrument
and one or more discrete reaction devices to perform the
temperature control functions.
[0004] Such contact or interconnection, however, is not always
practical or desirable. For various purposes, a non-contact radiant
heating and temperature sensing device for a chemical reaction
chamber may be desirable.
[0005] All patents, applications, and publications mentioned here
and throughout the application are incorporated in their entireties
by reference herein and form a part of the present application.
SUMMARY
[0006] Various embodiments provide a system that includes a
non-contact radiant heater and a non-contact temperature sensor for
a chemical or biochemical reaction chamber. The heater can be
designed to emit radiation having a wavelength of, for example,
about 0.7 micrometer or longer, or about 1.5 micrometers or longer.
The heater can be, for example, a laser source or a halogen light
source. The sensor can detect radiant energy emitted from the
reaction chamber without contacting the reaction chamber. According
to various embodiments, the sensor can detect radiant energy having
a wavelength of from about two micrometers to about 20 micrometers,
for example, a wavelength of from about five micrometers to about
15 micrometers. The sensor can be, for example, a non-contact
infrared pyrometer.
[0007] According to various embodiments, a non-contact heating and
temperature sensing system is provided for regulating temperature
within a chemical reaction chamber. The reaction chamber can be
formed in a substrate or can be fixed, secured, mounted, or
otherwise attached or connected to a surface of a substrate or to a
holder.
[0008] According to various embodiments, a method is provided
whereby a non-contact radiant energy source is used to heat a
reaction region to effect or promote a chemical and/or biochemical
reaction. The reaction region can be within an analytical
instrument such as a polymerase chain reaction (PCR) device, a
medical diagnostic device, a DNA purification instrument, a protein
or blood gas analyzer, or other instrument. The energy source can
be designed to emit energy having a wavelength sufficient to carry
out a desired reaction or desired reaction rate. For example,
according to various embodiments, the energy source emits energy
having a wavelength of at least about 0.7 micrometer.
[0009] It is to be understood that both the foregoing description
and the following description are exemplary and explanatory only,
and are not limiting.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic view of a radiant heater, biochemical
reaction chamber, and radiant temperature sensor according to
various embodiments;
[0011] FIG. 2 is a schematic drawing of a radiant heater,
biochemical reaction chamber, radiant temperature sensor, and
control system according to various embodiments;
[0012] FIG. 3 is a cross-sectional view of a biochemical reaction
chamber formed in a device substrate and having an aluminum film
cover, according to various embodiments;
[0013] FIG. 4 is a cross-sectional view of a biochemical reaction
chamber formed in a device substrate and having a transparent film
cover, according to various embodiments;
[0014] FIG. 5 is a cross-sectional view of a biochemical reaction
chamber formed in a device substrate and having a transparent film
cover on both sides of the device, according to various
embodiments; and
[0015] FIG. 6 is a perspective exploded view of a rotating
non-contact heating and temperature-sensing system according to
various embodiments.
DESCRIPTION OF VARIOUS EMBODIMENTS
[0016] When energy is radiated from an object, the radiated energy
can be used according to various embodiments to make a
determination of the temperature of the object. The energy can be
in the visible light spectrum or in the non-visible light spectrum.
As the energy strikes a detector in a sensor, a reaction occurs
that can result in an electrical signal output from the detector.
The electrical output can be a signal that can be processed, for
example, amplified and/or linearized, as desired, to calculate
temperature according to common pyrometer techniques.
[0017] Some applicable circuits, signal processing systems,
temperature sensors, heaters, and related devices that can be
useful in constructing a system according to various embodiments
are described in U.S. Pat. Nos. 4,632,908; 5,232,667; 5,653,537;
5,882,903; 5,539,673; and 6,022,141, which are incorporated herein
in their entireties by reference.
[0018] According to various embodiments, a heating and
temperature-sensing system is provided, for example, as shown in
FIG. 1. The system of FIG. 1 includes a first platform, first
platform region, or radiant heater platform 30 that includes a
heater support 32 supporting a non-contact radiant heater 10. The
non-contact radiant heater 10 can emit radiant energy 11 in a
direction toward a chemical reaction chamber 12. The reaction
chamber 12 can be an individual chamber defined by sidewalls 13 or
can be formed in a substrate of an assembly or device (not shown in
FIG. 1). The reaction chamber 12 can be supported by a device
support 50 that can include a holding feature such as, for example,
a recess 52 as shown, for receiving and supporting the reaction
chamber 12 for heating the reaction chamber 12. The holding feature
instead or additionally includes a clamp, a threaded rod or
threaded hole, a magnetic attachment device, a suction or vacuum
holding device, a snap-fit connection, a recess in a spinnable
platen, or any other holding feature that would be apparent to one
skilled in the art. The system can further include a second
platform or second platform region 40 having a support 42 for
supporting a non-contact radiant temperature sensor 14. Radiant
energy 15 emitted from the heated reaction chamber 12 radiates at
least in a direction toward the non-contact temperature sensor 14
and is detected by the temperature sensor 14.
[0019] According to various embodiments of the present invention,
the radiant heater 10 can heat the reaction chamber 12 without
physically contacting the reaction chamber 12 or a reaction mixture
in the reaction chamber 12. The temperature sensor 14 can sense the
temperature of the reaction chamber 12 and/or the contents of the
reaction chamber 12 via radiant energy emissions without contacting
the reaction chamber 12.
[0020] The radiant heater 10 can be spaced away from the reaction
chamber 12 by a distance of, for example, from about one millimeter
to about 10 cm, or more. The radiant heater 10 can be spaced away
from the reaction chamber 12 a distance of at least about two
millimeters, for example, a distance of from about five millimeters
to about 20 mm away from the reaction chamber 12.
[0021] The temperature sensor 14 can be spaced away from the
reaction chamber 12 by a distance of, for example, from about one
millimeter to about 10 cm, or more. The temperature sensor 14 can
be spaced away from the reaction chamber 12 a distance of at least
about two millimeters, for example, a distance of from about five
millimeters to about 20 mm away from the reaction chamber 12.
[0022] The distance of the radiant heater 10 from the reaction
chamber 12 can be the same as, or different than, the distance of
the temperature sensor 14 from the reaction chamber 12.
[0023] The device support 50, non-contact radiant heater support
32, and the temperature sensor support 42, can be commonly secured,
mounted, affixed, or otherwise attached to a common structure, such
as the housing for a work station. Exemplary work stations that can
include various supports, whether or not directly or indirectly
mounted to the work station housing, include devices to carry out
PCR. Other exemplary work stations or platforms that can be used or
adopted for use include, for example, devices to heat-treat a
heat-curable material such as glue disposed between components of
an assembly, and other instruments that require heating.
[0024] The reaction chamber 12 can be adapted to hold samples, for
example, fluids that can include, for example, polynucleotide
primers, polynucleotide probes, nucleic acids, deoxyribonucleic
acids, dideoxyribonucleic acids, ribonucleic acids, peptide nucleic
acids, individual polynucleotides, buffers, other ingredients known
or used in conjunction with PCR techniques, and combinations
thereof. The reaction chamber 12 can be sealed sufficiently to
prevent or minimize evaporation and contamination of a liquid
sample, such as a PCR fluid, disposed in the reaction chamber.
[0025] Herein, the "chemical reaction chamber" and "reaction
chamber" can include, for example, any chamber, vessel, container,
sample well, purification tray, microtiter tray, capsule, sample
array, centrifuge tube, or other containing, retaining,
restraining, or confining device, without limitation, that is able
to retain one or more chemicals or biochemicals for a reaction
thereof. The reaction chamber can be formed in a substrate or can
be fixed, secured, mounted, or otherwise attached or connected to a
surface of a substrate or to a holder.
[0026] The reaction chamber can have a cylindrical shape, a cubical
shape, a rectangular shape, a parallelepiped shape, or any other
shape. The reaction chamber can comprise a reaction chamber in a
microanalytical device such as a card-type assay device. The volume
of the reaction chamber can be, for example, from about 1 .mu.l to
about 10 ml, from about 0.1 .mu.l to about 1 ml, from about 0.1
.mu.l to about 100 .mu.l, or from about 0.1 .mu.l to about 10
.mu.l.
[0027] The reaction chamber can have at least one dimension of
about 600 .mu.m or less, for example, a reaction chamber having at
least one dimension of about 500 .mu.m or less, or of about 400
.mu.m or less, or of about 300 .mu.m or less. For example, the
reaction chamber can be cylindrical in shape, can have a diameter
of from about 0.5 mm to about 3.0 mm, for example, from about 1.0
mm to about 2.0 mm, and a depth of from about 100 .mu.m to about
600 .mu.m, for example, from about 200 .mu.m to about 500
.mu.m.
[0028] According to various embodiments, the system can include a
plurality of non-contact radiant heaters, a plurality of
non-contact temperature sensors, or a plurality of both. One
reaction chamber can be heated and temperature-sensed according to
various embodiments of the present invention, or a plurality of
reaction chambers can be heated simultaneously or sequentially
and/or sensed simultaneously or sequentially.
[0029] The temperature range of the radiant heating device
according to various embodiments can be from about 20.degree. C. up
to and including about 100.degree. C., and can encompass the
typical temperature ranges needed for conventional biochemical
reactions, for example, temperatures desirable for PCR reactions,
for example, between about 60.degree. C. and about 95.degree.
C.
[0030] The radiant heating source according to various embodiments
can operate to generate radiation in the infrared or near infrared
region of the electromagnetic radiation spectrum, for example,
wavelengths of equal to or greater than about 0.5 micrometer, for
example, equal to or greater than about 0.7 micrometer. The
temperature sensor device of the present invention can, according
to various embodiments, detect temperatures in the infrared region
of the electromagnetic radiation spectrum, that is, radiant energy
of wavelengths of at least about five micrometers, for example,
from about five micrometers to about 15 micrometers.
[0031] According to various embodiments, the radiant heater can
comprise a laser source, a halogen bulb, a lamp heater, and/or a
photon or light source heater that emits radiation having a
wavelength of at least about 0.5 micrometer or greater, for
example, at least about 0.7 micrometer. The radiant heater can
unidirectionally emit a radiation beam toward the reaction chamber.
According to such embodiments, the unidirectional emission avoids
wasting energy due to emissions in directions not toward the
reaction chamber.
[0032] The temperature sensor, according to various embodiments,
can be a thermopile and/or any other suitable optical
temperature-sensing device.
[0033] FIG. 2 shows a temperature control system according to
various embodiments of the present invention that can be used to
carry out methods according to various embodiments. FIG. 2 shows a
non-contact radiant heater 10, a chemical reaction chamber 12, a
temperature sensor 14, and a temperature control system 16. Also
shown in FIG. 2 is a control mechanism 18 that is adapted to
measure the actual temperature (T.sub.actual) detected from the
reaction chamber, for example, in degrees Centigrade (.degree. C.),
and is adapted to respond to a signal for a desired or target
temperature (T.sub.target), for example, in degrees Centigrade.
[0034] According to various embodiments, the control unit 18 can
be, for example, a CPU or other processor or microprocessor. The
control unit can be adapted to determine, based on detector
responses received from the temperature sensor, and/or in
combination with the temperature sensor, the temperature of the
reaction chamber. The reaction chamber temperature can be
determined from radiant energy exiting the reaction chamber
through, for example, a transparent film or transparent wall that
at least partially defines the reaction chamber. The temperature of
the reaction chamber can be determined from a measured radiant
energy radiating from a black or opaque film, or a black or opaque
wall, that at least partially defines the reaction chamber. The
control unit 18 can receive a signal from the temperature sensor
indicating the temperature of the reaction chamber, and optionally
can also record the temperature detected. The control unit 18 can
be a computer (e.g., a programmed general computer, or a special
purpose computer) or a microprocessor adapted to send a command to
the radiant heater to begin, increase, maintain, decrease, or end
the radiant heat emission or output of the radiant heater. The
control unit 18 can therefore be provided with a microprocessor on
which, or within which, is embedded a software program for
receiving and/or responding to signals or to pre-set conditions for
temperature maintenance. The radiant heater can be adapted or
controlled with the control unit to receive signals from the
control unit 18, and respond accordingly to begin, increase,
maintain, decrease, or end the heat energy output.
[0035] According to various embodiments, the control unit 18 can
also include a timer or a time-keeping program, or can be used in
conjunction with a timer or a time-keeping program. The control
unit 18 can be programmed to control the radiant output of the
non-contact radiant heater based on a signal provided by the
temperature sensor, the timer, the time-keeping program, or a
combination thereof.
[0036] FIG. 3 shows a system according to various embodiments that
includes a chemical reaction chamber 12 having a length "a" that
can be from about one micrometer up to and exceeding one
centimeter, for example, from about one to about two millimeters.
The dimension "a" can be a diameter if the reaction chamber is
round, or a length if the reaction chamber is linear, square,
rectangular, or the like. As in the embodiment of FIG. 1, the
reaction chamber 12 can be formed in a substrate 20 of an assembly
21.
[0037] According to various embodiments, materials useful for the
assembly of substrate 20 include those having structures and/or
comprised of materials that together provide a low thermal
conductivity, for example, structures including a reaction chamber
width (or diameter) to sidewall depth ratio of greater than 1:1,
and materials having a thermal conductivity of below about 1.0
W/m.degree. C. Materials that can be used for the substrate
include, for example, polycarbonate, other plastics, glass, other
thermally resistant materials, and combinations thereof.
[0038] According to various embodiments, the reaction chamber 12
can be closed on the top by a thin cover 22. The cover 22 can be
rigid or flexible. The cover 22 can be optically transparent,
translucent, or opaque, for example, black in color. In various
embodiments wherein the reaction chamber is at least partially
defined by a cover, the cover can have, for example, a high thermal
conductivity, e.g., a thermal conductivity of greater than about
1.0 W/m.degree. C., and an emissivity of about 0.1 or higher, for
example, about 0.5 or higher, on a scale of from zero to one. Such
materials can include, for example, an aluminum film blackened on
the top by anodizing, painting, or some other coating material or
technique, or a thin black plastic film such as a pigmented
polycarbonate. Because black-anodized aluminium has a high thermal
conductivity (e.g., 1.0 W/m.degree. C. or greater), it can be used
as a thin or thick film cover, for example, as a film cover having
a thickness of from about 0.01 mm to about 1.0 mm or greater. A
rigid plate, for example, made of pigmented polycarbonate, can be
used as the cover 22. Materials of low thermal conductivity (e.g.,
less than 1 W/m.degree. C.) can be used as thin film covers
provided they are thin enough to exhibit a suitable thermal
conductivity, for example, an optically transparent polycarbonate
film having a thickness of from about 0.01 mm to about 1.0 mm, for
example, a thickness of from about 0.01 mm to about 0.5 mm.
[0039] Radiant energy can be used to heat the chemical materials by
conduction through the cover 22 or by transmission of radiant
energy through the cover in situations where, for example, the
cover comprises an optically transparent or optically translucent
material. Black or opaque covers that absorb heat from the
non-contact radiant heater can be used and can heat-up and conduct
heat to components in a reaction chamber at least partially defined
by the cover. The bottom surface 23 of the cover 22 can be in
direct contact with a reaction liquid or materials in the reaction
chamber 12.
[0040] In the embodiment shown in FIG. 3, the radiant energy source
10 can emit radiation toward cover 22. In various embodiments, the
cover 22 can be black or opaque and can absorb heat from the
non-contact radiant heater, then conduct the heat to the underlying
or adjacent reaction chamber and components therein. In various
embodiments, the cover 22 can be optically transparent or optically
translucent and can transmit heat radiated from the non-contact
radiant heater through the cover 22, and heat the reaction chamber
or components therein without the need to conduct heat from the
cover 22 into the reaction chamber. In various embodiments, the
cover 22 is removed or absent and the radiation from the radiant
energy heating source 10 strikes and heats directly the chemical
materials in the reaction chamber 12, or strikes and heats the
desired materials after passing through a transparent, non
heat-absorbing film or other cover. According to various
embodiments, there is no direct physical contact between the
radiant energy heating source 10 and either the reacting materials
in reaction chamber 12 or the cover film 22.
[0041] The temperature sensor 14 shown in FIG. 3 can operate on the
same side of the substrate 20 as the heating source 10, as shown.
The sensor can sense or detect the temperature of the cover 22 that
in turn is about the same as, or correlates in a known manner to,
the temperature in the interior of the reaction chamber 12.
[0042] FIG. 4 shows another embodiment, including an assembly 121
having a reaction chamber 112 similar to the chamber 12 shown in
FIG. 3. The assembly 121 includes a thin transparent film cover
123. The film cover 123 can include a transparent film, for
example, of polycarbonate, polyethylene, polyester, polypropylene,
other plastics, copolymers, composites thereof, combinations
thereof, and the like. According to the embodiment of FIG. 4,
radiant energy passes through the transparent cover film 123 from a
radiant heater 10 to heat reacting material contained beneath the
cover 123 and within the reaction chamber 112 in substrate 120. A
temperature sensor 14 detects radiation emitted from the reaction
chamber 112 that radiates outwardly through the cover 123. The
cover film 123 can, according to various embodiments, be of any
suitable thickness, for example, less than or equal to 2.0 mm, or
less than 1.0 mm. According to various embodiments wherein the
cover 123 is optically transparent or optically translucent, the
cover can exhibit an emissivity high enough to transmit radiant
heat indicative of the temperature of the reaction chamber from the
reaction chamber toward the non-contact radiant temperature
sensor.
[0043] According to various embodiments wherein the cover 123 is
black or opaque, the cover can exhibit an emissivity high enough to
absorb heat from the reaction chamber and, in turn, radiate heat
indicative of the temperature of the reaction chamber toward the
non-contact radiant temperature sensor. The cover 123 can have an
emissivity of about 0.1 or higher, for example, about 0.5 or
higher, or 0.75 or higher, on a scale of from zero to one. Such
materials can include, for example, an aluminum film blackened on
the top by anodizing, painting, or some other coating material or
technique, or a thin black plastic film such as a pigmented
polycarbonate.
[0044] FIG. 5 is a cross-sectional view of an assembly 221
including a chemical reaction chamber 212 having a film cover 222
and a film cover 223. The materials for covers 222 and 223 can be,
for example, optically transparent, optically translucent, opaque,
black, or a combination thereof, as described in connection with
FIGS. 3 and 4. The film cover 222 can be, for example, an optically
transparent or optically translucent film on the top side 224 of
the substrate 220, and the film cover 223 can be, for example, an
opaque or black film cover 223 on a bottom side 226 of the
substrate 220. FIG. 5 depicts the chemical reaction chamber 212 as
a through-hole 228 in the substrate 220. The through-hole 228 is
sealed with the covers 222 and 223. The radiant heater 10 and
temperature sensor 14 can be placed on opposite sides of the
assembly 221 and can be located at different positions of the
reaction chamber. According to various embodiments, the radiant
heater 10 and the temperature sensor 14 are coaxially aligned and
in use can be used in an alternating manner such that the
temperature sensor can sense the temperature of the reaction
chamber while the non-contact radiant heater is not heating the
reaction chamber.
[0045] As shown in FIG. 5, the non-contact temperature sensor 14
receives radiant energy from directions encompassed by a line of
sight or field of view 250. According to various embodiments, the
field of view 250 of the non-contact radiant temperature sensor 14
can diverge conically toward the reaction chamber 212 and intersect
with a first surface 230 of film cover 223 in an area having a
diameter D referred to herein as the field of view viewing area.
The field of view can intersect the reaction chamber or an outer
wall thereof in a viewing area having a shape other than circular,
but having a diameter. To minimize background radiation that can
affect or distort the temperature sensed by non-contact temperature
sensor 14, the periphery of the field of view of the sensor can be
wholly encompassed by a surface. For example, the periphery of the
field of view can (e.g., an outer surface) of the reaction chamber
being sensed. For example, the periphery of the field of view can
fall wholly on a portion of a film cover surface that defines the
reaction chamber, as shown in FIG. 5.
[0046] The field of view viewing area at the surface of the
reaction chamber can be smaller than the area of the reaction
chamber wall or surface being temperature-sensed. The field of view
viewing area can wholly fall within a corresponding reaction
chamber or reaction chamber surface having an optically transparent
or optically translucent film cover that is adjacent the reaction
chamber. The field of view viewing area can have an area that is
larger, smaller, or the same area as the area of a corresponding
reaction chamber surface or reaction chamber film cover surface to
be temperature-sensed. The ratio of the field of view viewing area
to the reaction chamber surface area can be from about 2:1 to about
1:20, for example, from about 1:10 to about 9:10, from about 1:6 to
about 1:2, or from about 1:5 to about 1:3. The field of view
viewing area can have a diameter or smallest dimension, for
example, of from about 0.1 mm to about 10 mm or greater, for
example, a diameter or smallest dimension of from about 0.5 mm to
about 5 mm, or from about 1.0 mm to about 2.0 mm. Exemplary
non-contact radiant heaters that can be used according to various
embodiments include those described in U.S. Pat. Nos. 5,232,667 and
6,367,972, which are incorporated herein in their entireties by
reference. Exemplary sensors that can be used include infrared
sensors having a focused line of sight.
[0047] According to various embodiments, the reaction chamber can
be within a device that is covered with a cover, such as, but not
limited to, a metal cover. Exemplary metal covers for the reaction
chamber include a black aluminum cover that can receive radiant
energy from the radiant heater, according to various
embodiments.
[0048] In various embodiments, the reaction chamber can be in a
device that is covered, at least in part, with a transparent film.
Thin films, such as films of 0.1 mm thickness or less, are useful
as covers for the reaction chamber of various embodiments. Such a
thin film can comprise, but is not limited to, a plastic such as
polycarbonate, or any other material optically transparent to a
wavelength, that is, which transmits about 100% of the energy of
the wavelength desired for heating reactants in the chemical
reaction chamber.
[0049] The assembly designs depicted in FIGS. 3-5 can accommodate,
according to various embodiments, two or more chemical reaction
chambers. Heating and temperature sensing of a plurality of
chemical reaction chambers together can be accomplished by various
embodiments. Each reaction chamber of a plurality of reaction
chambers can be moved in turn under a single non-contact radiant
heater, or can be aligned with a respective non-contact radiant
heater. Each reaction chamber of a plurality of reaction chambers
can be lined up with a temperature-sensing device, or each reaction
chamber of a plurality of reaction chambers can be lined-up with a
respective temperature sensor. According to various embodiments, a
plurality of reaction chambers can be arranged in a heatable
device, for example, a microfluidic analytical device such as a
microcard device, and together rotated about an axis of rotation
central to the heatable device or a platform holding the device. An
example of such a device is shown in FIG. 6.
[0050] In various embodiments, a non-contact radiant heating and
temperature-sensing system 590 is provided, as shown in FIG. 6. The
system 590 can include a rotatable heating assembly 600. Any number
of individual non-contact radiant heaters 602 can be mounted,
fixed, connected, attached, or otherwise supported by or secured to
the heater assembly 600. The heater assembly 600 can be rotated
about an axis of rotation 601 on a shaft 604. An appropriate motor
and drive system can be provided to rotate the shaft 604 and
corresponding heater assembly 600 as desired. Appropriate circuitry
and electronics can be provided to selectively activate one or more
of the individual heaters 602 of the heater assembly 600 and/or to
coordinate a sequence of activations of the various heaters. In
FIG. 6, non-contact radiant heater 602' is the only heater of the
heater assembly 600 that is shown emitting radiant heat 606 in the
drawing. Radiant heat 606 can be directed, for example, by rotation
of heater assembly 600, so as to radiate, for example, linearly,
toward a reaction chamber 622'.
[0051] Reaction chamber 622' can be one of a plurality of reaction
chambers 622 in a reaction chamber assembly 620. Although the
heater assembly 600 can be spaced-apart from the reaction chamber
assembly 620 in the proportions shown in FIG. 6, FIG. 6 is an
exploded view of the system 590, and the distance between heater
602' and reaction chamber 622' can be from about 0.1 mm to about
100 mm, for example, from about 1 mm to about 30 mm, or from about
5 mm to about 20 mm. Reaction chamber assembly 620 can be supported
for rotation about axis of rotation 601 by a support device 630
that can include a support arm 632, a motor, and transmission
components (not shown) to rotate the reaction chamber assembly 620.
Motor and transmission components can be provided that rotate the
reaction chamber assembly 620 to position one or more of the
reaction chambers 622 with respect to one or more of the
non-contact radiant heaters 602, and/or to spin the reaction
chamber assembly 620 at rpms sufficient to effect a centripetal
manipulation of a sample in a reaction chamber. The reaction
chamber assembly can be spun at speeds of 100 rpm or greater, for
example, speeds of 1000 rpm or greater, 3000 rpm or greater, or
5000 rpm or greater.
[0052] According to various embodiments, a heated reaction chamber
622'' can be temperature-sensed by a non-contact radiant
temperature sensor 610' at the same time that the non-contact
radiant heater 602' heats reaction chamber 622'. Non-contact
radiant heater 602' can be activated at the same time that sensor
610' is activated so that heat from reaction chamber 622' does not
distort sensing of temperature by sensor 610'. Non-contact radiant
temperature sensor 610' can be one of many temperature sensors 610
commonly supported, mounted, connected, attached, or otherwise
affixed or secured to a temperature-sensing assembly 608. Although
the temperature-sensing assembly 608 can be spaced-apart from the
reaction chamber assembly 620 in the proportions shown in FIG. 6,
FIG. 6 is an exploded view of the system 590. The
temperature-sensing assembly 608 can be spaced, for example, from
about 0.1 mm to about 100 mm away from the reaction chamber
assembly 620, for example, from about 1 mm to about 30 mm, or from
about 5 mm to about 20 mm away from the reaction chamber assembly
620. Temperature-sensing assembly 608 can be rotated about the axis
of rotation 601 by a motor and transmission system that rotates a
shaft 612 attached to the temperature-sensing assembly 608 for
rotation of the same.
[0053] Each of the heater assembly 600, reaction chamber assembly
620, and temperature sensing assembly 608 can independently be
stationary or rotatable. For example, one or more of these three
assemblies or all three assemblies, can be rotated about an axis of
rotation 601 to effect any of various alignments of the non-contact
radiant heaters 602 and/or the non-contact temperature sensors 610
with the various reaction chambers 622. One or more of the heater
assembly 600, reaction chamber assembly 620, and temperature
sensing assembly 608 can be provided with a rotatable platform so
that one or more of the heater assembly 600, reaction chamber
assembly 620, and temperature sensing assembly 608 can be rotated
individually or jointly about axis of rotation 601, as shown. One
or more of the heater assembly 600, reaction chamber assembly 620,
and temperature sensing assembly 608 can be stationarily supported
on, for example, a platform or a support, for example, shaft 604 as
shown in FIG. 6. A control system can be included to activate one
or more of the non-contact radiant heaters 602 in response to a
signal provided indicative of one or more temperatures of one or
more of the reaction chambers 622. A plurality of the non-contact
radiant heaters can be activated sequentially or simultaneously in
response to detected temperatures of a corresponding plurality of
reaction chambers 622.
[0054] According to various embodiments such as shown in FIG. 6,
the system can heat and control the temperatures of the plurality
of chemical reaction chambers individually. The plurality of
reaction chambers can be individually cooled, or cooled together by
any of a variety of cooling apparatus and methods. For example,
cool or ambient air or fluid can be directed toward the reaction
chambers, a cooling fan can be provided to blow a cooling fluid at
the reaction chambers, the reaction chambers can be spun and cooled
by the spinning action in ambient or cool air, the reaction
chambers can be immersed in a cooling liquid, the reaction chambers
can cooled by conduction against a cooling surface, or any other
suitable cooling device or cooling method can be used. Such a
design also allows each reaction chamber to be monitored
individually. An assembly can be provided, according to various
embodiments, wherein a separate radiant heater and a separate heat
sensor are provided for each of a plurality of reaction chambers.
The radiant heater can be position mounted on a static or on a
movable platform. The heat sensor can be position mounted on a
static or a movable platform.
[0055] In embodiments such as those shown in FIGS. 3-5, and wherein
multiple heaters and sensors are used, the radiant or optical
heating sources 10 and the temperature sensors 14 can be operated
either simultaneously or alternately. Alternate operation of the
heater 10 and sensor 14 can be used to reduce detection by the
sensor of radiation that might be reflected by a cover in
embodiments where a non-contact radiant heater and a non-contact
temperature sensor are used on the same side of a reaction chamber.
Alternate heating and temperature sensing can also reduce or
eliminate the sensing of radiant heat emanating from the
non-contact radiant heater and not from the reaction chamber.
[0056] According to various embodiments, method of non-contact
heating and temperature sensing are provided for conducting a
chemical reaction. For example, the method can involve (i)
directing radiation towards a reaction mixture from a radiant
heating source spaced away from the reaction mixture; (ii)
detecting radiation emanating from the reaction mixture, and (iii)
determining the temperature of the reaction mixture based on the
detected radiation. The method can include directing radiation
toward a reaction mixture in a reaction chamber having a volume of
less than about 10 ml, for example, having a volume of from about
1.0 .mu.l to about 10 .mu.l. The method can include detecting
radiation with a temperature sensor having a field of view viewing
area diameter of from about 0.1 mm to about 10 mm, for example, of
from about 1.0 mm to about 2.0 mm. The method can include directing
radiation toward a reaction mixture in a reaction chamber having at
least one dimension of about 600 .mu.m or less, for example, a
reaction chamber having at least one dimension of about 500 .mu.m
or less, of about 400 .mu.m or less, or of about 300 .mu.m or
less.
[0057] According to various embodiments, a method can be provided
that can include providing a non-contact heating and temperature
sensing system for a chemical reaction chamber, wherein the system
can include: i) a source of radiant energy that emits radiation
having a wavelength of at least about 0.7 micrometer; ii) a
temperature sensor able to detect radiant energy without contacting
the source of the radiant energy, wherein the sensor can detect a
wavelength of at least about five micrometers; and (iii) a chemical
reaction chamber arranged to receive radiant energy emitted from
the source and to emit radiant energy toward the sensor.
[0058] According to various embodiments, the method can include
providing one or more chemical or biochemical materials in the
chemical reaction chamber, causing the source of radiant energy to
emit radiation with a wavelength of at least about 0.7 micrometer
in at least a direction toward the reaction chamber, whereby the
emitted radiation directly or indirectly irradiates, illuminates,
or otherwise heats the chemical or biochemical materials in the
chemical reaction chamber, and measuring the temperature of the
chemical or biochemical materials by detecting the radiant energy
emitted from the chemical or biochemical materials with the
temperature sensor.
[0059] According to various embodiments of the present invention,
the radiant heating and sensing methods allow two or more chemical
reaction chambers to be maintained simultaneously at different
temperatures. The system for such a method can include a control
unit for controlling various heaters and various temperatures
simultaneously.
[0060] The radiant heating and temperature sensing is not dependent
upon contact between a chemical reaction device and thermal
components. The non-contact technique allows a heatable device to
be easily moved inside a chemical reaction instrument or system and
to be easily removed from the instrument or system. The heatable
device can also be easily replaced after use.
[0061] In other various embodiments, a plurality of reaction
chambers is conveyed to and from heating and temperature sensing
regions on a continuous belt or line, such as on a conveyor
belt.
[0062] Other embodiments of the present invention will be apparent
to those skilled in the art from consideration of the specification
and practice of the invention disclosed herein. It is intended that
the specification and examples be considered as exemplary only.
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