U.S. patent application number 13/004904 was filed with the patent office on 2012-03-01 for magnetic stack structure and manufacturing method thereof.
Invention is credited to Ching-Ming LEE, Te-Ho WU, Lin-Hsiu YE.
Application Number | 20120052193 13/004904 |
Document ID | / |
Family ID | 42981213 |
Filed Date | 2012-03-01 |
United States Patent
Application |
20120052193 |
Kind Code |
A1 |
WU; Te-Ho ; et al. |
March 1, 2012 |
MAGNETIC STACK STRUCTURE AND MANUFACTURING METHOD THEREOF
Abstract
A magnetic stack structure is disclosed. The magnetic stack
structure includes two metal layers and a free layer sandwiched by
the two metal layers. The thickness of the free layer is 1-30 nm.
The thickness of the metal layers are 0.1-20 nm respectively.
Inventors: |
WU; Te-Ho; (Yunlin, TW)
; YE; Lin-Hsiu; (Yunlin, TW) ; LEE;
Ching-Ming; (Yunlin, TW) |
Family ID: |
42981213 |
Appl. No.: |
13/004904 |
Filed: |
January 12, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12449802 |
Aug 27, 2009 |
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13004904 |
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Current U.S.
Class: |
427/130 ;
427/131 |
Current CPC
Class: |
Y10T 428/115 20150115;
Y10T 428/1107 20150115; G11B 5/66 20130101; H01F 10/3254 20130101;
B82Y 25/00 20130101; H01F 10/3268 20130101; G11B 5/84 20130101;
B82Y 40/00 20130101; H01F 41/302 20130101; G01R 33/098 20130101;
H01F 41/307 20130101 |
Class at
Publication: |
427/130 ;
427/131 |
International
Class: |
H01F 41/14 20060101
H01F041/14; H01F 41/22 20060101 H01F041/22 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 16, 2009 |
TW |
98112666 |
Claims
1. A method of manufacturing a magnetic stack structure,
comprising: forming a first metal layer on a substrate, and the
thickness of the first metal layer is 0.1-20 nm; forming a free
layer on the first metal layer, the free layer is made of a rare
earth-transition metal alloy, and the thickness of the free layer
is 1-30 nm; and forming a second metal layer on the free layer, and
the thickness of the second metal layer is 0.1-20 nm.
2. The method of claim 1, further comprising: annealing the
magnetic stack structure under various temperatures ranging from
25-300.degree. C.
3. The method of claim 1, wherein the free layer is made of TbFeCo,
GdFeCo or DyFeCo.
4. The method of claim 1, wherein the first metal layer is made of
Al, Mg, Ti, Ta, Pt, Pd, alloys thereof or metallic compound
thereof.
5. The method of claim 1, wherein the second metal layer is made of
Al, Mg, Ti, Ta, Pt, Pd, alloys thereof or metallic compound
thereof.
Description
RELATED APPLICATIONS
[0001] The present application is a divisional of the application
Ser. No. 12/449,802, filed Jul. 9, 2009, the entire contents of
which are hereby incorporated herein by reference.
BACKGROUND
[0002] 1. Field of Invention
[0003] The present invention relates to an element for static
information storage. More particularly, the present invention
relates to magnetic storage elements.
[0004] 2. Description of Related Art
[0005] Magnetic Random Access Memory (MRAM) is a non-volatile
memory. The magnetic structure of MRAM uses the reluctance
variation to store data.
[0006] Since 1995, tunneling magneto resistance (TMR) is
discovered. The structure of TMR is a free layer, a tunneling
barrier, and a pinned layer arranged in sequentially. The tunneling
barrier is an insulating layer. The free layer and the pinned layer
are ferromagnetic layers. The direction of the magnetic moment of
the pinned layer is fixed. The magnetic moment of the free layer
can be altered by an external magnetic field. When the magnetic
moment of the free layer is altered by an external magnetic field,
the alignment of the magnetic moments of the free layer and the
pinned layer can be parallel or anti-parallel. Therefore, the
tunneling barrier can exhibit two different electrical resistances
to respectively denote the data "0" and "1".
SUMMARY
[0007] According to one embodiment of the present invention, a
magnetic stack structure is disclosed. The magnetic stack structure
includes a free layer, a first metal layer and a second metal
layer. The free layer is made of a rare earth-transition metal
alloy. The thickness of the free layer is 1-30 nm. The first metal
layer contacts one side of the free layer. The thickness of the
first metal layer is 0.1-20 nm. The second metal layer contacts the
other side of the free layer. The thickness of the second metal
layer is 0.1-20 nm.
[0008] According to another embodiment of the present invention, a
method of manufacturing a magnetic stack structure is disclosed.
The method includes: A first metal layer is formed on a substrate,
wherein the thickness of the first metal layer is 0.1-20 nm. A free
layer is formed on the first metal layer, wherein the free layer is
made of a rare earth-transition metal alloy and the thickness of
the free layer is 1-30 nm. A second metal layer is formed on the
free layer, wherein the thickness of the second metal layer is
0.1-20 nm.
[0009] According to another embodiment of the present invention, a
magnetic tunneling stack structure is disclosed. The magnetic
tunneling stack includes an electric conductive layer, a pinned
layer, a butter metal layer, a tunneling barrier, a first metal
layer, a free layer and a second metal layer. The electric
conductive layer is on a substrate. The pinned layer is on the
electric conductive metal layer. The pinned layer is made of a rare
earth-transition metal alloy. The butter metal layer is on the
pinned layer. The tunneling barrier is on the butter metal layer,
wherein the tunneling barrier is insulated and nonmagnetic. The
first metal layer is on the tunneling barrier, wherein the
thickness of the first metal layer is 0.1-20 nm. The free layer is
on the first metal layer. The free layer is made of a rare
earth-transition metal alloy and the thickness of the free layer is
1-30 nm. The second metal layer is on the free layer, wherein the
thickness of the second metal layer is 0.1-20 nm.
[0010] It is to be understood that both the foregoing general
description and the following detailed description are by examples,
and are intended to provide further explanation of the invention as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The invention can be more fully understood by reading the
following detailed description of the embodiment, with reference
made to the accompanying drawings as follows:
[0012] FIG. 1 is a cross-sectional view of a magnetic stack
structure according to one embodiment of the present invention;
[0013] FIG. 2 is a flowchart of a method of manufacturing a
magnetic stack structure according to another embodiment of this
invention;
[0014] FIG. 3 illustrates the hysteresis loops of different
magnetic stack structures;
[0015] In FIG. 4 illustrates the hysteresis loops of the magnetic
stack structure of FIG. 1 that is annealed under various
temperatures;
[0016] FIG. 5 illustrates the hysteresis loops of magnetic stack
structure of FIG. 1 that is annealed under various
temperatures;
[0017] FIG. 6 illustrates the hysteresis loops of magnetic stack
structure of FIG. 1 that is annealed under various temperatures;
and
[0018] FIG. 7 is a cross-sectional view of a magnetic tunneling
stack structure according to the other embodiment of the present
invention.
DETAILED DESCRIPTION
[0019] Reference will now be, made in detail to the present
embodiments of the invention, examples of which are illustrated in
the accompanying drawings. Wherever possible, the same reference
numbers are used in the drawings and the description to refer to
the same or like parts.
[0020] Generally speaking, the magnetic moment of the free layer
can be altered by an external magnetic field. Thus, a good free
layer requires a hysteresis loop with high squareness and low
coercivity, then the magnetic moment of the free layer can be
altered easily.
[0021] In general, the hysteresis loop is used to illustrate the
characteristics of a magnetic material. The unit of the x-axes of
the hysteresis loop is the Oe, which represents the external
magnetic filed H. The unit of the y-axes of the hysteresis loop is
the emu/c.c, which represents the magnetization M. When the
external magnetic filed strength increased, the inducible magnetic
moments of the magnetic material increased and reached to the
saturation magnetization Ms. In other words, the saturation
magnetization Ms represents the maximum inducible magnetic moments
of the magnetic material. After the external magnetic filed H is
removed, the remaining magnetization is called remanent
magnetization Mr.
The squareness of a hysteresis loop is defined, by the ratio of the
remanent magnetization Mr over the saturation magnetization Ms
(Mr/Ms) after removing the external magnetic field H. Therefore, if
a magnetic material has a higher squareness, the magnetic material
has a better ability to maintain the magnetic moment in a
particular direction after removing the external field H. The
coercivity of a magnetic material is defined by the required
intensity of the external magnetic filed H to reduce the remanent
magnetization Mr to zero.
[0022] Since the thickness of the free layer of conventional MRAM
is larger than 30 nm, the coercivity is greater than 1 kQe. In
other words, it requires a higher external magnetic field to alter
the magnetic moment of the free layer. However, when the thickness
of the free layer is reduced, the squareness is decreased thereby
and thus decreases the reliability of the MRAM. Or even worse, the
magnetic material can't even keep the magnetization after removing
an external field. Therefore, providing a magnetic material and a
magnetic structure for making the free layer of the MRAM to have
high squareness and low coercivity is important.
[0023] FIG. 1 is a cross-sectional view of a magnetic stack
structure according to one embodiment of the present invention. In
FIG. 1, a magnetic-stack sequentially includes a substrate 100, a
first metal layer 110, a free layer 120 and a second layer 130. The
first metal layer 110, a free layer 120 and a second layer 130 are
stacked on the substrate 100 to form a magnetic stack
structure.
[0024] The substrate 100 is made of Si, for example. The first
metal layer 110 and the second metal layer 130 are made of metal,
such as Al, Mg, Ti, Ta, Pt or Pd, or alloys thereof or metallic
compound, for example. The alloy is a metal that consists of two or
more metals mixed together. The metallic compound is a substance
containing atoms from two or more elements especially containing
some metals. The thickness of the first metal layer 110 and the
second metal layer 130 are 0.1-20 nm. The free layer 120 is made of
rare earth-transition metal alloys, such as GdFeCo, TbFeCo or
DyFeCo. The thickness of the free layer 120 is 1-30 nm.
[0025] FIG. 2 is a flowchart of a method of manufacturing a
magnetic stack structure according to another embodiment of this
invention. In step 200, first metal layer is formed on a substrate.
In step 210, a magnetic layer is formed on the first metal layer.
In step 220, a second metal layer is formed on the magnetic layer
to form a magnetic stack structure including the first metal layer,
the magnetic layer, and the second metal layer. In step 230, the
temperature is raised to 25-300.degree. C. to anneal the magnetic
stacked structure. The first metal layer, the magnetic layer, and
the second metal layer are made by sputtering, for example.
The Effect of Magnetic Structure on the Squareness of the
Hysteresis Loop
[0026] FIG. 3 illustrates the hysteresis loops of different
magnetic stack structures. The material of the magnetic
stacked-layer and the squareness of the hysteresis loop thereof are
shown in Table 1 as following.
TABLE-US-00001 TABLE 1 The first The free The second Squareness
metal layer layer metal layer (Mr/Ms) Example 1 Al GdFeCo Al 0.99
Comparison SiNx GdFeCo SiNx 0.98 Example 1 Comparison SiNx GdFeCo
Al 0.86 Example 2 Comparison Al GdFeCo SiNx 0.95 Example 3
[0027] In FIG. 3 and Table 1, the hysteresis loop of Example 1 is
shown as line 330, which is presented as a magnetic stack structure
as in FIG. 1. The hysteresis loops of Comparison Example 1, 2 and 3
are shown as line 300, line 310 and line 320, respectively. In
Example 1 the thickness of the first metal layer, the free layer
and the second metal layer are 20 nm, 10 nm and 10 nm,
respectively. In Table 1, Example 1 has the highest squareness.
Therefore, the free layer has the better ability to maintain the
magnetic moment in a particular direction after removing an
external field when the free layer is sandwiched by two metal
layers.
Effect of Annealing Temperature on Coercivity
[0028] FIG. 4 illustrates the hysteresis loops of the magnetic
stack structure of FIG. 1 that is annealed under various
temperatures. The material of the magnetic stack structure, the
annealing temperature, and the coercivity are shown in Table 2. In
FIG. 4 and Table 2, the material of the free layer is GdFeCo.
TABLE-US-00002 TABLE 2 The first The second Annealing metal The
free metal temper- Coer- layer layer layer ature civity Example 1
Al GdFeCo Al 191 Oe Example 2 Al GdFeCo Al 100.degree. C. 191 Oe
Example 3 Al GdFeCo Al 150.degree. C. 143 Oe Example 4 Al GdFeCo Al
200.degree. C. 131 Oe Example 5 Al GdFeCo Al 250.degree. C. 77 Oe
Example 6 Al GdFeCo Al 300.degree. C. 28 Oe Comparison Al GdFeCo Al
350.degree. C. Example 4
[0029] In FIG. 4 and Table 2, the hysteresis loop of Example 1 is
shown as line 400, which is without annealing. The hysteresis loops
of Examples 2-6 and Comparison Example 4 are shown as lines
410-460. The thickness of the first metal layer, the free layer and
the second metal layer, in all examples and the comparison example
4, are 20 nm, 10 nm and 10 nm, respectively. Annealing changed the
properties of the free layer, such as strength and hardness.
Therefore, the higher temperature the magnetic stack structure is
annealed, the lower coercivity it is. But, when the magnetic stack
structure is annealed under 350.degree. C., the hysteresis loops
disappeared. Thus, the annealing temperature range is
150-300.degree. C.
[0030] FIG. 5 illustrates the hysteresis loops of magnetic stack
structure of FIG. 1 that is annealed under various temperatures.
The material of the magnetic stack structure, the annealing
temperature, and the coercivity are shown in Table 3. In FIG. 5 and
Table 3, the material of the free layer was changed to TbFeCo.
TABLE-US-00003 TABLE 3 The first The second Annealing metal The
free metal temper- Coer- layer layer layer ature civity Example 7
Al TbFeCo Al 1000 Oe Example 8 Al TbFeCo Al 100.degree. C. 813 Oe
Example 9 Al TbFeCo Al 150.degree. C. 425 Oe Example 10 Al TbFeCo
Al 200.degree. C. 58 Oe Comparison Al TbFeCo Al 250.degree. C.
Example 5
[0031] In FIG. 5 and Table 3, the hysteresis loop of Example 7 is
shown as line 500, which is without annealing. The hysteresis loops
of Examples 8-10 and Comparison Example 5 are shown as lines
510-540. The thickness of the first metal layer, the free layer and
the second metal layer, in all examples and the comparison example
5, are 10 nm, 3 nm and 10 nm, respectively. By comparing with the
coercivity, the magnetic stack structure without annealing has the
maximum coercivity. The coercivity is decreased by increasing the
annealing temperature. However, when the magnetic stack structure
is annealed under 250.degree. C., the hysteresis loops disappeared.
Thus, the annealing temperature range is 100-200.degree. C.
[0032] FIG. 6 illustrates the hysteresis loops of magnetic stack
structure of FIG. 1 that is annealed under various temperatures.
The material of the magnetic stack structure, the annealing
temperature, and the coercivity are shown in Table 4. In FIG. 6 and
Table 4, the material of the free layer was changed to DyFeCo.
TABLE-US-00004 TABLE 4 The first The second Annealing metal The
free metal temper- Coer- layer layer layer ature civity Example 11
Al DyFeCo Al 2332 Oe Example 12 Al DyFeCo Al 150.degree. C. 1602 Oe
Example 13 Al DyFeCo Al 200.degree. C. 744 Oe Comparison Al DyFeCo
Al 250.degree. C. Example 6
[0033] In FIG. 6 and Table 4, the hysteresis loop of Example 11 is
shown as line 600, which is without annealing. The hysteresis loops
of Examples 12-13 and Comparison Example 6 are shown as lines
610-630. The thickness of the first metal layer, the free layer and
the second metal layer, in all examples and the comparison example
6, are 10 nm, 5 nm and 10 nm, respectively. The higher temperature
the magnetic stack structure is annealed, the lower the coercivity
is. Therefore, the magnetic moment of the free layer can be altered
easily. However, when the magnetic stack structure is annealed
under 250.degree. C., the hysteresis loops disappeared. Thus, the
annealing temperature range is 150-200.degree. C.
[0034] FIG. 7 is a cross-sectional view of a magnetic tunneling
stack structure according to another embodiment of the present
invention. In FIG. 7, magnetic tunneling stacked-structure includes
a substrate 700, an electric conductive layer 710, a pinned layer
720, a buffer metal layer 730, a tunneling barrier layer 740, a
first metal layer 110, a free layer 120 and a second metal 130 are
stacked on the substrate 700 in order. The first metal layer 110
the free layer 120 and the second metal 130 are the magnetic stack
structure in FIG. 1.
[0035] When the structure of FIG. 1 and the method of FIG. 2 are
applied to the magnetic tunneling stack structure of FIG. 7, there
are some advantages as following.
[0036] 1. The squareness of the magnetic stack structure can be
increased to maintain the magnetization (Mr) in a particular
direction after removing an external field.
[0037] 2. The coercivity of the magnetic tunneling stack structure
can be decreased by annealing. Therefore, the magnetic moment can
be easily altered by a lower external magnetic field to avoid
altering the magnetization of other neighbor magnetic devices and
decrease the power loss of the magnetic tunneling stack
structure.
[0038] 3. Annealing is used to rearrange the crystal structure of
the magnetic stack structure. It can relieve the internal stresses
of the crystal structure and the coercivity of the magnetic stack
structure can be decreased. Therefore, the magnetic moment can be
altered easily.
* * * * *