U.S. patent application number 12/859281 was filed with the patent office on 2012-02-02 for heat dissipation apparatus.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to Xiao-Zhu Chen, Zhen-Xing Ye.
Application Number | 20120024495 12/859281 |
Document ID | / |
Family ID | 45525518 |
Filed Date | 2012-02-02 |
United States Patent
Application |
20120024495 |
Kind Code |
A1 |
Chen; Xiao-Zhu ; et
al. |
February 2, 2012 |
HEAT DISSIPATION APPARATUS
Abstract
A heat dissipation apparatus includes a heat sink, a resilient
pressing member, and two fasteners. The pressing member includes an
abutting portion to press the heat sink, and two locking portions
extending from opposite ends of the abutting portion. The fasteners
are respectively latched to the locking portions. When the heat
sink is mounted to a heat-generating component by the fasteners,
the abutting portion is stretched to be resiliently flexed by the
locking portions latched by the fasteners. The abutting portion
abuts against the heat sink toward the heat-generating component,
thereby urging the heat sink to be in intimate thermal contact with
the heat-generating component.
Inventors: |
Chen; Xiao-Zhu; (Shenzhen
City, CN) ; Ye; Zhen-Xing; (Shenzhen City,
CN) |
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD.
Shenzhen City
CN
|
Family ID: |
45525518 |
Appl. No.: |
12/859281 |
Filed: |
August 19, 2010 |
Current U.S.
Class: |
165/67 |
Current CPC
Class: |
H01L 23/4093 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/67 |
International
Class: |
F28F 9/007 20060101
F28F009/007 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 2, 2010 |
CN |
201010242516.9 |
Claims
1. A heat dissipation apparatus comprising: a heat sink; a
resilient pressing member comprising an abutting portion to press
the heat sink, and two locking portions extending from opposite
ends of the abutting portion; and two fasteners latched to the
locking portions, respectively; wherein when the heat sink is
mounted to a heat-generating component by the fasteners, the
abutting portion is stretched to be resiliently flexed by the
locking portions latched by the fasteners, the abutting portion
abuts against the heat sink toward the heat-generating component,
thereby urging the heat sink to be in intimate thermal contact with
the heat-generating component.
2. The heat dissipation apparatus of claim 1, wherein each of the
fasteners comprises a body and a catch extending from a first end
of the body; the catches of the fasteners are hollowed to be
readily flexed.
3. The heat dissipation apparatus of claim 2, wherein two opposite
cutouts are defined in a conjunction of the body and the catch of
each of the fasteners.
4. The heat dissipation apparatus of claim 2, wherein a latching
hole is defined in a second end of the body opposite to the first
end of each of the fasteners, and the locking portions are latched
in the latching holes of the fasteners, respectively.
5. The heat dissipation apparatus of claim 1, wherein the heat sink
comprises a thermal-conductive base, and a plurality of
thermal-conductive fins extending from a top of the base; two
fixing holes are respectively defined in the base, the fasteners
respectively extend through the fixing holes.
6. The heat dissipation apparatus of claim 5, wherein two support
portions are respectively formed at opposite ends of the base, the
fixing holes are respectively defined in the support portions.
7. The heat dissipation apparatus of claim 5, wherein a receiving
groove is transversely defined in the fins and extends along a
length direction of the base, the abutting portion is received in
the receiving groove.
8. The heat dissipation apparatus of claim 1, wherein the abutting
portion is arc-shaped, with the opposite ends of the abutting
portion tilted relative to a center of the abutting portion.
9. The heat dissipation apparatus of claim 1, wherein the locking
portions are substantially V-shaped.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a heat dissipation
apparatus.
[0003] 2. Description of Related Art
[0004] Finned heat sinks have been found to be particularly
effective for transferring heat through conduction from a
heat-generating component such as a semiconductor chip and rapidly
dissipating such heat to the environment. However, in the past,
various means used to attach a heat sink to the heat-generating
component does not allow the heat sink to be in intimate thermal
contact with the heat-generating component. As a result, it is
difficulty to remove heat generated by the heat-generating
component.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, all the views
are schematic, and like reference numerals designate corresponding
parts throughout the several views.
[0006] FIG. 1 is an exploded, isometric view of an exemplary
embodiment of a heat dissipation apparatus.
[0007] FIG. 2 is an enlarged, isometric view of a fastener of the
heat dissipation apparatus of FIG. 1.
[0008] FIG. 3 is an assembled, isometric view of the heat
dissipation apparatus of FIG. 1.
[0009] FIG. 4 is a side plan view showing the heat dissipation
apparatus of FIG. 3 fixed to a circuit board.
DETAILED DESCRIPTION
[0010] The present disclosure, including the accompanying drawings,
is illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0011] Referring to FIG. 1, an exemplary embodiment of a heat
dissipation apparatus 1 includes a heat sink 10, a resilient
pressing member 20, and two fasteners 30.
[0012] The heat sink 10 includes an elongated, thermal-conductive
base 12, and a plurality of thermal-conductive fins 14 extending
substantially perpendicularly from a top of the base 12. A
receiving groove 142 is transversely defined in the fins 14 and
extends along the length direction of the base 12. Two support
portions 16 are respectively formed at opposite ends of the base
12. A fixing hole 162 is defined in each support portion 16.
[0013] The pressing member 20 includes an abutting portion 22, and
two locking portions 24 respectively extending from opposite ends
of the abutting portion 22. The abutting portion 22 is
substantially arc-shaped, with the opposite ends of the abutting
portion 22 tilted relative to a center of the abutting portion 22.
Each locking portion 24 is substantially V-shaped.
[0014] Referring to FIG. 2, each fastener 30 includes a columnar
body 32 and a catch 34 extending from a first end of the body 32. A
latching hole 322 is radially defined in a second end of the body
32 opposite to the first end, corresponding to one locking portion
24 of the pressing member 20. The catch 34 is hollowed to be
readily flexed. Two opposite cutouts 36 are defined in a
conjunction of the body 32 and the catch 34.
[0015] Referring to FIGS. 1-3, in assembly, the locking portions 24
of the pressing member 20 are respectively latched in the latching
holes 322 of the fasteners 30, and the pressing member 20 is
received in the receiving groove 142 of the heat sink 10. When the
catches 34 of the fasteners 30 are in alignment with the fixing
holes 162 of the corresponding support portions 16 of the heat sink
10, the catches 34 are urged to extend through the corresponding
fixing holes 162. Thus, the abutting portion 22 of the pressing
member 20 is substantially positioned at a center of the top of the
base 12 of the heat sink 10.
[0016] Referring to FIG. 4, in mounting the heat dissipation
apparatus 1 to a circuit board 40 for transferring heat from a
heat-generating component 42 mounted on the circuit board 40, the
catches 34 of the fasteners 30 are in alignment with two through
holes 44 defined in the circuit board 40. The catches 34 are urged
again to be resiliently flexed and inserted in the corresponding
through holes 44. Meanwhile, the abutting portion 22 of the
pressing member 20 is stretched to be resiliently flexed by the
locking portions 24, which are latched in the latching holes 322 of
the fasteners 30.
[0017] Thus, the abutting portion 22 abuts against the center of
the top of the base 12 to urge a center of a bottom of the base 12
to be in intimate thermal contact with the heat-generating
component 42.
[0018] When the catches 34 extend through the corresponding through
holes 44, the catches 34 are restored to catch the circuit board
40. Sides bounding the though holes 44 are respectively held in the
corresponding cutouts 36. Thus, the heat sink 10 is firmly secured
to the circuit board 40, with the center of the bottom of the base
12 in intimate thermal contact with the heat-generating component
42, for quickly and efficiently dissipating heat from the
heat-generating component 42.
[0019] It is to be understood, however, that even though numerous
characteristics and advantages of the embodiments have been set
forth in the foregoing description, together with details of the
structure and function of the embodiments, the present disclosure
is illustrative only, and changes may be made in details,
especially in matters of shape, size, and arrangement of parts
within the principles of the embodiments to the full extent
indicated by the broad general meaning of the terms in which the
appended claims are expressed.
* * * * *