U.S. patent application number 13/258113 was filed with the patent office on 2012-01-26 for method for storing resin solution, and method for producing prepreg and laminate.
This patent application is currently assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC.. Invention is credited to Yoshihiro Kato, Takeshi Nobukuni, Masayoshi Ueno.
Application Number | 20120018072 13/258113 |
Document ID | / |
Family ID | 42780557 |
Filed Date | 2012-01-26 |
United States Patent
Application |
20120018072 |
Kind Code |
A1 |
Ueno; Masayoshi ; et
al. |
January 26, 2012 |
METHOD FOR STORING RESIN SOLUTION, AND METHOD FOR PRODUCING PREPREG
AND LAMINATE
Abstract
This invention relates to a method for storing a naphthol
aralkyl type cyanate ester resin solution, which is difficult to
precipitate due to long term storage in a solution state, and
particularly relates to a method for storing a naphthol aralkyl
type cyanate ester resin solution (AB), which comprises: preparing
(i) a naphthol aralkyl type cyanate ester resin solution (AB)
comprising a naphthol aralkyl type cyanate ester resin (A), a
maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type
cyanate ester resin solution (AB) comprising a prepolymer of a
naphthol aralkyl type cyanate ester resin (A), a maleimide compound
(B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester
resin solution (AB) comprising a prepolymer of a naphthol aralkyl
type cyanate ester resin (A) and a maleimide compound (B), and a
solvent, and; storing the resin solution (AB).
Inventors: |
Ueno; Masayoshi; (Tokyo,
JP) ; Kato; Yoshihiro; (Tokyo, JP) ; Nobukuni;
Takeshi; (Tokyo, JP) |
Assignee: |
MITSUBISHI GAS CHEMICAL COMPANY,
INC.
Tokyo
JP
|
Family ID: |
42780557 |
Appl. No.: |
13/258113 |
Filed: |
March 24, 2010 |
PCT Filed: |
March 24, 2010 |
PCT NO: |
PCT/JP2010/002088 |
371 Date: |
September 21, 2011 |
Current U.S.
Class: |
156/60 ; 264/239;
523/425; 524/104 |
Current CPC
Class: |
C08L 79/04 20130101;
C08J 5/24 20130101; H05K 1/0271 20130101; C08L 79/085 20130101;
Y10T 156/10 20150115; C08K 5/3415 20130101; C09D 163/00 20130101;
Y10T 428/31511 20150401; C08L 79/04 20130101; C08L 79/085 20130101;
C08L 83/00 20130101; C08K 3/36 20130101; C08L 79/04 20130101; C09D
179/00 20130101; C08G 73/0655 20130101; C09D 163/00 20130101; C08L
79/085 20130101; H05K 3/0058 20130101; C08J 2379/00 20130101 |
Class at
Publication: |
156/60 ; 524/104;
523/425; 264/239 |
International
Class: |
B32B 37/14 20060101
B32B037/14; B29C 51/00 20060101 B29C051/00; C09D 183/04 20060101
C09D183/04; C09D 179/00 20060101 C09D179/00; C08K 5/3415 20060101
C08K005/3415; C09D 163/00 20060101 C09D163/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 27, 2009 |
JP |
2009-078929 |
Claims
1. A method for storing a naphthol aralkyl type cyanate ester resin
solution (AB), which comprises: preparing (i) a naphthol aralkyl
type cyanate ester resin solution (AB) comprising a naphthol
aralkyl type cyanate ester resin (A), a maleimide compound (B) and
a solvent, (ii) a naphthol aralkyl type cyanate ester resin
solution (AB) comprising a prepolymer of a naphthol aralkyl type
cyanate ester resin (A), a maleimide compound (B) and a solvent, or
(iii) a naphthol aralkyl type cyanate ester resin solution (AB)
comprising a prepolymer of a naphthol aralkyl type cyanate ester
resin (A) and a maleimide compound (B), and a solvent, and; storing
the resin solution (AB).
2. A method for storing a naphthol aralkyl type cyanate ester resin
solution (AB) according to claim 1, wherein a storage period of the
naphthol aralkyl type cyanate ester resin solution (AB) is 1 day to
2 years.
3. A method for storing a naphthol aralkyl type cyanate ester resin
solution (AB) according to claim 1, wherein the naphthol aralkyl
type cyanate ester resin (A) is represented by the following
general formula (1): ##STR00006## (wherein Rs independently
represent hydrogen atom or methyl group, and n represents an
integer of not less than 1).
4. A method for storing a naphthol aralkyl type cyanate ester resin
solution (AB) according to claim 1, wherein the naphthol aralkyl
type cyanate ester resin solution (AB) further comprises: a cyanate
ester resin (G) other than the naphthol aralkyl type cyanate ester
resin (A); a prepolymer of the naphthol aralkyl type cyanate ester
resin (A) and a cyanate ester resin (G) other than the naphthol
aralkyl type cyanate ester resin (A); or a prepolymer of the
naphthol aralkyl type cyanate ester resin (A), the maleimide
compound (B) and a cyanate ester resin (G) other than the naphthol
aralkyl type cyanate ester resin (A).
5. A method for producing a prepreg, which comprises: preparing a
varnish comprising a naphthol aralkyl type cyanate ester resin
solution (AB) stored by the method according to claim 1, a
non-halogen epoxy resin (C), a silicone rubber powder (D) and an
inorganic filler (E), and; impregnating a substrate (F) with the
varnish.
6. A method for producing a prepreg according to claim 5, wherein
the inorganic filler (E) is a molten silica.
7. A method for producing a laminate, which comprises heat-molding
a prepreg produced by the method according to claim 5.
8. A method for producing a metal foil clad laminate, which
comprises curing a laminate of a prepreg produced by the method
according to claim 5 and a metal foil.
Description
TECHNICAL FIELD
[0001] This invention relates to a method for storing a solution of
a raw resin used for an electrical printed wiring board, and
methods for producing a prepreg for a printed wiring board, and a
laminate and a metal foil clad laminate using the prepreg.
BACKGROUND ART
[0002] Conventionally, as a laminate for a printed wiring board, an
FR-4 type laminate obtained by curing an epoxy resin with
dicyandiamide has been widely used. However, this method had a
limitation in response to the demand for high heat resistance.
Also, a cyanate ester resin is known as a resin for a printed
wiring board with excellent heat resistance, and a prepreg using a
resin composition of a bisphenol A type cyanate ester resin and
other thermosetting resins or thermoplastic resins has been widely
used for a laminate for a semiconductor plastic package in recent
years.
[0003] Moreover, high integration, high function and high density
implementation of semiconductors widely used for electronic
devices, communication instruments, personal computers and the like
have recently been increasingly accelerated, and the form of a
semiconductor plastic package is getting to be diverse as seen in
development from QFP to the area implementation type such as BGA
and CSP, and additionally appearance of the high function type such
as MCP and SIP. Therefore, the demand for high reliability of a
laminate for a semiconductor plastic package has increased more
than ever.
[0004] A semiconductor element has a coefficient of thermal
expansion of 3 to 6 ppm/.degree. C., which is smaller than the
coefficient of thermal expansion of a typical printed wiring board
for a semiconductor plastic package. Therefore, when a thermal
shock is added to a semiconductor plastic package, warpage is
generated in a semiconductor plastic package due to the difference
in the coefficient of thermal expansion between a semiconductor
element and a printed wiring board for a semiconductor plastic
package, and poor connection may occur between the semiconductor
element and the printed wiring board for the semiconductor plastic
package, and between the semiconductor plastic package and the
printed wiring board implemented therewith. Thus, in order to
reduce the warpage to ensure connection reliability, development of
a printed wiring board with a small coefficient of thermal
expansion in the surface direction is required.
[0005] A method for reducing the coefficient of thermal expansion
in the surface direction of a laminate for a printed wiring board
includes a method of filling a resin composition with an inorganic
filler. However, a large filling amount of an inorganic filler has
problems of making a resulting resin composition fragile,
deteriorating drilling quality for forming a through hole required
for interlayer connection of a printed wiring board, and also
quickening wear of a drill bit used for machining to significantly
decrease productivity of machining. As another method for reducing
a coefficient of thermal expansion in the surface direction, it is
known to blend an organic filler with rubber elasticity in a
varnish containing an epoxy resin (Patent Documents 1-5), and when
this varnish is used, a bromine-based flame retardant has sometimes
been used for flame retardance of a laminate.
[0006] As described above, conventionally, in order to impart flame
retardance to a laminate, a formulation using a bromine-based flame
retardant in combination has been used. However, in concert with
the recently heightened environmental issues, a resin composition
using no halogen-based compound has been demanded, and in response
to this demand, the use of a phosphorous compound as a substitute
for a halogen-based flame retardant has been considered. However,
since a phosphorous compound is liable to generate a toxic compound
such as phosphine upon combustion, development of a laminate having
flame retardance without using a halogen-based compound or a
phosphorous compound has been desired.
[0007] With the aim of developing a laminate having flame
retardance without using a halogen-based compound or a phosphorous
compound, a cyanate ester resin has been considered, and a novolac
type cyanate ester resin (Patent Document 6) and a naphthol aralkyl
type cyanate ester resin are known. However, a phenol novolac type
cyanate ester resin, in which a cyanate group equivalent is small,
and many unreacted cyanate groups tend to remain upon curing due to
its rigid framework structure, is not satisfying in properties such
as adhesion to a metal foil, water resistance and heat resistance
under moisture absorption. On the other hand, by utilizing a
characteristic that the resin framework is a rigid structure, a
resin composition comprising a naphthol aralkyl type cyanate ester
resin can maintain heat resistance, as well as reducing reaction
inhibition factors to enhance curing property, and has a
characteristic of being excellent in water resistance and heat
resistance under moisture absorption (Patent Document 7).
PRIOR ART DOCUMENTS
Patent Documents
[0008] Patent Document 1: JP-B-3173332
[0009] Patent Document 2: JP-A-H8-48001
[0010] Patent Document 3: JP-A-2000-158589
[0011] Patent Document 4: JP-A-2003-246849
[0012] Patent Document 5: JP-A-2006-143973
[0013] Patent Document 6: JP-A-H11-124433
[0014] Patent Document 7: JP-A-2007-45984
SUMMARY OF THE INVENTION
Problem to be Solved by the Invention
[0015] Meanwhile, a prepreg for a printed wiring board is generally
produced by impregnating a glass cloth with a varnish. This varnish
is generally prepared by mixing an inorganic filler and the like to
a mixed resin solution of a cyanate ester resin solution, a
maleimide compound solution, an epoxy resin solution and the like,
and a resin solution of a cyanate ester resin solution, a maleimide
compound solution, an epoxy resin solution and the like is required
not to precipitate a cyanate ester resin, a maleimide compound, an
epoxy resin and the like due to long term storage. A metal foil
clad laminate formed by laminating a prepreg produced with a
varnish using a solution having precipitation occurred with a metal
foil and curing it has a problem of deteriorating properties such
as heat resistance under moisture absorption and adhesion to a
metal foil. Particularly, when the naphthol aralkyl type cyanate
ester resin described above is dissolved in a solvent and stored
for a long term at a low temperature, a naphthol aralkyl type
cyanate ester resin is precipitated, and a metal foil clad laminate
obtained by curing a laminate of a prepreg produced with a varnish
having this naphthol aralkyl type cyanate ester resin precipitated
and a metal foil has a problem of deteriorating properties such as
heat resistance under moisture absorption and adhesion to a metal
foil.
[0016] Therefore, the object of the invention is to provide a
prepreg being excellent in heat resistance under moisture
absorption and adhesion to a metal foil even when produced with a
varnish using a naphthol aralkyl type cyanate ester resin having
been stored for a long term in a solution state, retaining high
flame redardance without using a halogen compound or a
phosphorous-based compound, and being capable of producing a
printed wiring board material with a small coefficient of thermal
expansion in the surface direction, and a laminate obtained by
curing the same.
Means for Solving the Problem
[0017] The inventors have found out that a resin composition
comprising a particular cyanate ester, a maleimide compound,
silicone rubber powder, and an inorganic filler is excellent in
flame retardance even without halogen, and that a laminate with a
small coefficient of thermal expansion in the surface direction can
be obtained by using the resin composition. In that regard, they
discovered that by storing a solution prepared by a method of
mixing a maleimide compound to a solvent solution using a naphthol
aralkyl type cyanate ester as a particular cyanate ester, a method
of mixing a maleimide compound and a solvent after prepolymerizing
the naphthol aralkyl type cyanate ester, a method of mixing a
maleimide compound after prepolymerizing a solvent solution
containing the naphthol aralkyl type cyanate ester, a method of
mixing a solvent after prepolymerizing the naphthol aralkyl type
cyanate ester and a maleimide compound, a method of prepolymerizing
a solvent solution containing the naphthol aralkyl type cyanate
ester and a maleimide compound or the like, a prepreg not having
precipitation due to long term storage in a solution state and
being capable of producing a printed wiring board material
retaining excellent heat resistance under moisture absorption and
adhesion to a metal foil even when a naphthol aralkyl type cyanate
ester solution having been stored for a long term can be obtained,
and completed the invention. More specifically, the invention is as
follows.
[0018] (1) A method for storing a naphthol aralkyl type cyanate
ester resin solution (AB), which comprises: preparing (i) a
naphthol aralkyl type cyanate ester resin solution (AB) comprising
a naphthol aralkyl type cyanate ester resin (A), a maleimide
compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate
ester resin solution (AB) comprising a prepolymer of a naphthol
aralkyl type cyanate ester resin (A), a maleimide compound (B) and
a solvent, or (iii) a naphthol aralkyl type cyanate ester resin
solution (AB) comprising a prepolymer of a naphthol aralkyl type
cyanate ester resin (A) and a maleimide compound (B) and a solvent,
and; storing the resin solution (AB).
[0019] (2) The storage method, wherein a storage period of the
naphthol aralkyl type cyanate ester resin solution (AB) is 1 day to
2 years.
[0020] (3) The storage method, wherein the naphthol aralkyl type
cyanate ester resin (A) is represented by the following general
formula (1):
##STR00001##
(wherein Rs independently represent hydrogen atom or methyl group,
and n represents an integer of not less than 1).
[0021] (4) The storage method, wherein the naphthol aralkyl type
cyanate ester resin solution (AB) further comprises a cyanate ester
resin (G) other than the naphthol aralkyl type cyanate ester resin
(A), a prepolymer of the naphthol aralkyl type cyanate ester resin
(A) and a cyanate ester resin (G) other than the naphthol aralkyl
type cyanate ester resin (A), or a prepolymer of the naphthol
aralkyl type cyanate ester resin (A), the maleimide compound (B)
and a cyanate ester resin (G) other than the naphthol aralkyl type
cyanate ester resin (A).
[0022] (5) A method for producing a prepreg, which comprises:
preparing a varnish comprising a naphthol aralkyl type cyanate
ester resin solution (AB) stored by the method, a non-halogen epoxy
resin (C), silicone rubber powder (D) and an inorganic filler (E),
and; impregnating a substrate (F) with the varnish.
[0023] (6) The production method for the prepreg, wherein the
inorganic filler (E) is a molten silica.
[0024] (7) A method for producing a laminate, which comprises
heat-molding a prepreg obtained by the production method for the
prepreg.
[0025] (8) A method for producing a metal foil clad laminate, which
comprises curing a laminate of a prepreg obtained by the production
method for the prepreg and a metal foil.
Effect of the Invention
[0026] The naphthol aralkyl type cyanate ester resin solution (AB)
according to the invention hardly precipitates due to long term
storage and is stable. A prepreg produced with a varnish using the
naphthol aralkyl type cyanate ester resin solution (AB) having been
stored for a long term is excellent in heat resistance under
moisture absorption. Also, a laminate using the prepreg, which has
high flame retardance without using a halogen compound or a
phosphorus compound, has a small thermal expansion, and can produce
a cured product being excellent in heat resistance under moisture
absorption and adhesion to a metal foil, is preferred as a material
for a semiconductor plastic package, for which high heat resistance
and high reliability are demanded.
MODE FOR CARRYING OUT THE INVENTION
[0027] The invention is a method for storing a naphthol aralkyl
type cyanate ester resin solution (AB) prepared by a method of
adding a solvent and a maleimide compound (B) to a naphthol aralkyl
type cyanate ester resin (A), and mixing, a method of adding a
maleimide compound to a solvent solution containing a prepolymer of
a naphthol aralkyl type cyanate ester resin (A), and mixing, a
method of adding a solvent to a prepolymer of a naphthol aralkyl
type cyanate ester resin (A) and a maleimide compound (B), and
mixing, a method of prepolymerising a solvent solution containing a
naphthol aralkyl type cyanate ester resin (A) and a maleimide
compound (B), or the like.
[0028] The naphthol aralkyl type cyanate ester resin (A) used in
the invention is not particularly limited, as long as it is a
cyanate esterified naphthol aralkyl resin having naphthol and
aralkylene groups mutually coupled. In addition, from the aspects
of solvent solubility of a cyanate ester and flame retardance of a
laminate, a naphthol aralkyl type cyanate ester resin represented
by the above general formula (1) or a prepolymer thereof is
preferable. A cyanate ester resin (A) represented by the general
formula (1) is obtained by condensing a naphthol aralkyl type
cyanate ester resin obtained by reaction of naphthols such as
.alpha.-naphthol or .beta.-naphthol, with p-xylylene glycol,
.alpha.,.alpha.'-dimethoxy-p-xylene,
1,4-di(2-hydroxy-2-propyl)benzene and the like, with a cyanic acid.
The production method is not particularly limited, and any
production methods existing as cyanate ester synthesis may be used.
Specifically, it can be obtained by reacting a naphthol aralkyl
resin represented by the following general formula (2):
##STR00002##
(wherein Rs independently represent hydrogen atom or methyl group,
and n represents an integer of not less than 1) and a cyanogen
halide in an inert organic solvent in the presence of a basic
compound. Moreover, a synthesis method of forming a salt of a
similar naphthol aralkyl resin and a basic compound in a solution
containing water, and then conducting two phase system interface
reaction with a cyanogen halide can be also adopted. In addition, n
in the general formula (1) is further preferable to be not more
than 10. When n is not more than 10, a resin viscosity does not
increase, impregnation to a substrate is good, and performance as a
laminate does not decrease. Also, intramolecular polymerization
hardly occurs upon synthesis, liquid separation upon water washing
improves, and decrease in yield can be prevented.
[0029] The maleimide compound (B) used in the invention is not
particularly limited, as long as it is a compound having one or
more maleimide groups per molecule. Specific examples of the
maleimide compound (B) include N-phenyl maleimide, N-hydroxy phenyl
maleimide, bis(4-maleimidephenyl)methane,
2,2-bis{4-(4-maleimidephenoxy)-phenyl}propane,
bis(3-ethyl-5-methyl-4-maleidephenyl)methane,
bis(3,5-dimethyl-4-maleimidephenyl)methane, polyphenyl methane
maleimide, prepolymers of these maleimide compounds, prepolymers of
a maleimide compound and an amine compound, or the like, and it is
also possible to mix one or two kinds or more accordingly to use.
More preferable maleimide compounds include
bis(4-maleimidephenyl)methane,
2,2-bis{4-(4-maleimidephenoxy)phenyl}propane, and
bis(3-ethyl-5-methyl-4-maleimidephenyl)methane.
[0030] The additive amount of the above maleimide compound (B) is
preferably within a range from 5 to 75% by weight of the total
amount of the naphthol aralkyl type cyanate ester resin (A) and the
maleimide compound (B). The heat resistance of a resulting laminate
may decrease with the additive amount of less than 5% by weight,
while the moisture absorption property may decrease with more than
75% by weight. Also, in solutions having the additive amount of the
maleimide amount (B) less than 5% by weight and more than 75% by
weight of the total amount of the naphthol aralkyl type cyanate
ester resin (A) and the maleimide compound (B), precipitation may
occur due to long term storage.
[0031] In the naphthol aralkyl type cyanate ester resin solution
(AB) of the invention, it is also possible to use a cyanate ester
resin (G) other than the above naphthol aralkyl type cyanate ester
resin (A) in combination to mix or even prepolymerize, within the
range that a desired property is not deteriorated. As the cyanate
ester resin (G) other than the naphthol aralkyl type cyanate ester
resin (A), those that are publicly known can be used. For example,
a bisphenol A type cyanate ester resin, a bisphenol F type cyanate
ester resin, a bisphenol M type cyanate ester resin, a bisphenol P
type cyanate ester resin, a bisphenol E type cyanate ester resin, a
phenol novolac type cyanate ester resin, a cresol novolac type
cyanate ester resin, a dicyclopentadiene novolac type cyanate ester
resin, a tetramethyl bisphenol F type cyanate ester resin, a
biphenol type cyanate ester resin and the like, and prepolymers
thereof and the like are included, and it is also possible to mix
one or two kinds or more accordingly to use. In addition, the above
naphthol aralkyl type cyanate ester resin solution (AB) may
comprise the cyanate ester resin (G) as it is, may comprise a
prepolymer of the naphthol aralkyl type cyanate ester resin (A) and
the cyanate ester resin (G), or may comprise a prepolymer of the
naphthol aralkyl type cyanate ester resin (A), the maleimide
compound (B) and the cyanate ester resin (G).
[0032] The method for mixing the naphthol aralkyl type cyanate
ester resin (A) and the maleimide compound (B), and the cyanate
ester resin (G) if required, is not particularly limited, as long
as it is a method for preparing a mixed solution of resins not for
the purpose of homopolymerizing or copolymerizing the naphthol
aralkyl type cyanate ester resin (A), the maleimide compound (B)
and the cyanate ester resin (G), and for example, a method of
stirring a mixture containing the naphthol aralkyl type cyanate
ester resin (A), the maleimide compound (B) and a solvent while
heating, a method of using an ultrasonic washing machine with a
heating function and the like are included.
[0033] The solvent used in a mixed solution of the naphthol aralkyl
type cyanate ester resin (A) and the maleimide compound (B) is not
particularly limited, as long as it is compatible with a mixture of
the naphthol aralkyl type cyanate ester resin (A), the maleimide
compound (B) and the non-halogen epoxy resin (C). Specific examples
include ketones such as acetone, methyl ethyl ketone, methyl
isobutyl ketone and cyclohexanone, aromatic hydrocarbons such as
benzene, toluene and xylene, amides such as dimethylformamide and
dimethylacetoamide, and the like.
[0034] Also, the prepolymerization method is not particularly
limited, as long as it is a method for homopolymerizing or
copolymerizing the naphthol aralkyl type cyanate ester resin (A)
and the maleimide compound (B), and the cyanate ester resin (G)
other than the naphthol aralkyl type cyanate ester resin (A) which
is blended if required, and specific examples include a method of
dissolving the naphthol aralkyl type cyanate ester resin (A) by
heating at a high temperature, and stirring it while heating, a
method of heating a solution of the naphthol aralkyl type cyanate
ester resin (A) dissolved in a solvent, and refluxing it, a method
of heating a solution of the naphthol aralkyl type cyanate ester
resin (A) and the maleimide compound (B) dissolved in a solvent,
and refluxing it, a method of dissolving the naphthol aralkyl type
cyanate ester resin (A), the maleimide compound (B) and the cyanate
ester resin (G) by heating at a high temperature, and stirring it
while heating, a method of heating a solution of the naphthol
aralkyl type cyanate ester resin (A), the maleimide compound (B)
and the cyanate ester resin (G) dissolved in a solvent, and
refluxing it, and the like, which are not particularly limited, as
long as they are methods capable of preparing a solution of a
cyanate ester resin and a maleimide compound. In addition, a curing
accelerator can also be used so as to adjust the curing speed
accordingly. These curing accelerators used include acids such as a
mineral acid and a Lewis acid, bases such as sodium alcoholate and
tertiary amines, salts such as sodium carbonate, and the like.
[0035] The storage conditions for the naphthol aralkyl type cyanate
ester resin solution (AB) prepared are not particularly limited,
but the temperature is preferably within a range from -20.degree.
C. to 40.degree. C., and also it is preferable to store it in a
solution with a solid content of 40% by weight to 90% by weight.
Moreover, the storage period is not particularly limited, but a
range from 1 day to 2 years is preferable.
[0036] The invention discloses a prepreg formed by storing the
naphthol aralkyl type cyanate ester resin solution (AB), then
preparing a varnish blending a non-halogen epoxy resin (C), a
silicone rubber powder (D) and an inorganic filler (E) to the resin
solution (AB), and impregnating a substrate (F) with the
varnish.
[0037] The non-halogen epoxy resin (C) used in the invention is not
particularly limited, as long as it is a compound having two or
more epoxy groups per molecule and not intentionally having any
halogen atom within the molecular frame. For example, these
non-halogen epoxy resins (C) include a bisphenol A type epoxy
resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy
resin, a cresol novolac type epoxy resin, a bisphenol A novolac
type epoxy resin, a trifunctional phenol type epoxy resin, a
tetrafunctional phenol type epoxy resin, a naphthalene type epoxy
resin, a biphenyl type epoxy resin, an aralkyl novolac type epoxy
resin, a cycloaliphatic epoxy resin, a polyol type epoxy resin, a
compound obtained by epoxidizing a double bond of glycidylamine,
glycidylester, butadiene or the like, a compound obtained by the
reaction of hydroxyl group-containing silicone resins and
epichlorohydrin, and so on, and particularly an aralkyl novolac
type epoxy resin is preferable in order to improve flame
retardance. Here, these aralkyl novolac type epoxy resins can be
represented by the following general formula (3), and specifically
include a phenol phenyl aralkyl type epoxy resin, a phenol biphenyl
aralkyl type epoxy resin, a naphthol aralkyl type epoxy resin and
the like. It is possible to use these non-halogen epoxy resins (C)
by mixing one or two kinds or more accordingly.
##STR00003##
(In the formula, G represents a glycidyl group, Ar.sub.1 represents
a quadrivalent aromatic group in which a monocyclic or polycyclic
aromatic hydrocarbon becomes a substituent group such as a
benzenetetrayl group, a naphthalenetetrayl group and a
biphenyltetrayl group, Are represents a trivalent aromatic group in
which a monocyclic or polycyclic aromatic hydrocarbon becomes a
substituent group such as a benzenetriyl group, a naphthalenetriyl
group and a biphenyltriyl group, Rx and Ry independently represent
hydrogen atom, an alkyl group, or an aryl group, m represents an
integer of 1 to 5, and n represents an integer of 1 to 50.)
[0038] The naphthol aralkyl type cyanate ester resin (A) and the
non-halogen epoxy resin (C) used in the invention are preferably
blended at the ratio (CN/Ep) of the number of cyanate groups (CN)
of the naphthol aralkyl type cyanate ester resin (A) and the number
of epoxy groups (Ep) of the non-halogen epoxy resin (C) in the
resin composition of 0.3 to 2.5. When CN/Ep is less than 0.3, the
flame retardance of a laminate may decrease, while when it is more
than 2.5, the curing property and the like may decrease.
[0039] The silicone rubber powder (D) used in the invention is a
fine powder of an addition polymerization product of a vinyl
group-containing dimethyl polysiloxane and a methyl hydrogen
polysiloxane. Since silicone rubber powder has strong aggregability
and tends to have poor dispersibility within a resin composition,
it is preferable to use silicone rubber powder having the surface
coated with a silicone resin to improve dispersibility. This
silicone resin to coat the surface is a polymethyl silsesquioxane
having a siloxane bond crosslinked in the form of three-dimensional
network. The average particle size (D50) of the silicone rubber
powder (D) is not particularly limited, but the average particle
size (D50) is preferably 1 to 15 .mu.m in consideration of
dispersibility. Here, the average particle size (D50) is a median
size, in which when the particle size distribution of the measured
powder is divided into two, the amounts of the large side and the
small side are equal, and is generally measured by the wet laser
diffraction/scattering method. Also, the blending amount of the
silicone rubber powder (D) is not particularly limited, but a range
from 3 to 30 parts by weight, based on 100 parts by weight of the
total blending amount of the naphthol aralkyl type cyanate ester
resin (A), the maleimide compound (B) and the non-halogen epoxy
resin (C) is preferable, and a range from 3 to 25 parts by weight
is particularly preferable. The effect of reducing a thermal
expansion in the surface direction may not be sufficiently obtained
when the blending amount of the silicone rubber powder (D) is less
than this range, while moldability and dispersibility may decrease
when it is more than this range.
[0040] As the inorganic filler (E) used in the invention, for
example, silicas such as natural silica, molten silica, amorphous
silica and hollow silica, boehmite, molybdenum compounds such as
molybdenum oxide and zinc molybdate, alumina, talc, calcined tare,
mica, a glass short fiber, a spherical glass (fine glass powder
such as an E-glass, a T-glass and a D-glass) and the like are
included. Among them, the molten silica is preferable since it is
excellent in low-thermal expansion. It is possible to use these
inorganic fillers (E) by mixing one or two kinds or more
accordingly. Also, the average particle size (D50) of the inorganic
filler (E) is not particularly limited, but the average particle
size (D50) is preferably 0.2 to 5 .mu.m in consideration of
dispersibility. Moreover, the blending amount of the inorganic
filler (E) is preferably within a range from 50 to 150 parts by
weight, based on 100 parts by weight of the total blending amount
of the naphthol aralkyl type cyanate ester resin (A), the maleimide
compound (B) and the non-halogen epoxy resin (C). Furthermore,
since moldability may decrease when the blending amount of the
inorganic filler (E) is too much, the blending amount of the
inorganic filler (E) is particularly preferable to be within a
range from 50 to 140 parts by weight.
[0041] In association with the above inorganic filler (E), it is
also possible to use a silane coupling agent and a wet dispersant
in combination. These sialne coupling agents are not particularly
limited, as long as they are silane coupling agents generally used
in surface treatment of inorganic substances. Specific examples
include amino silane-based compounds such as
.gamma.-aminopropyltriethoxysilane and
N-.beta.-(aminoethyl)-.gamma.-aminopropyltrimethoxysilane, epoxy
silane-based compounds such as
.gamma.-glycidoxypropyltrimethoxysilane, vinyl silane-based
compounds such as .gamma.-methacryloxypropyltrimethoxysilane,
cationic silane-based compounds such as
N-.beta.-(N-vinylbenzylaminoethyl)-.gamma.-aminopropyltrimethoxysilane
hydrochloride, phenyl silane-based compounds, and the like, and it
is also possible to use them in combination of one or two kinds or
more accordingly. Also, the wet dispersant is not particularly
limited, as long as it is a dispersion stabilizer used for
painting. For example, wet dispersers such as Disperbyk-110, 111,
180, 161, BYK-W996, W9010 and W903 made by BYK-Chemie Japan are
included.
[0042] In the resin composition of the prepreg used in the
invention, it is also possible to use various polymer compounds
such as other thermosetting resins, thermoplastic resins, and
oligomers and elastomers thereof, other flame retardant compounds,
additives, and the like in combination within the range that a
desired property is not deteriorated. These are not particularly
limited, as long as they are generally used. For example, these
flame retardant compounds include nitrogen-containing compounds
such as melamine and benzoguanamine, oxazine ring-containing
compounds, and the like. Also, these additives include a UV
absorber, an antioxidant, a photo polymerization initiator, a
fluorescent brightener, a photosensitizer, a dye, a pigment, a
thickener, a lubricant, a defoamer, a disperser, a leveling agent,
a brightener, a polymerization inhibitor and the like, and it is
also possible to use in combination accordingly as desired.
[0043] In the resin composition of the prepreg used in the
invention, it is also possible to use a curing accelerator in
combination, if required, so as to adjust the curing speed
accordingly. These curing accelerators are not particularly
limited, as long as they are generally used as a curing accelerator
for the naphthol aralkyl type cyanate ester resin (A) and the
non-halogen epoxy resin (C). Specific examples of these curing
accelerators include organic metal salts of copper, zinc, cobalt,
nickel or the like, imidazoles and derivatives thereof, tertiary
amines, and the like.
[0044] As the substrate (F) used in the invention, those used for
various printed wiring board materials that are publicly known can
be used. For example, glass fibers of an E-glass, a D-glass, an
S-glass, an NE-glass, a T-glass or the like, inorganic fibers of
those other than glasses, and organic fibers of polyimide,
polyamide, polyester or the like are included, and can be selected
based on a desired application or performance accordingly. The
forms include a woven cloth, a nonwoven cloth, a roving, a chopped
strand mat, a surfacing mat, and the like. The thickness is not
particularly limited, but those with about 0.01 to 0.30 mm are
generally used.
[0045] The preparation method for the varnish used in production of
the prepreg of the invention is not particularly limited, as long
as it is a preparation method of storing the naphthol aralkyl type
cyanate ester resin solution (AB) for 1 day to 2 years, and then
adding the non-halogen epoxy resin (C), the silicone rubber powder
(D), and the inorganic filler (E). The cyanate ester resin (G) may
be blended during the preparation of the varnish. In the invention,
since the naphthol aralkyl type cyanate ester resin solution (AB)
is used in the varnish, the naphthol aralkyl type cyanate ester
resin (A), which tends to be precipitated in a single solution, is
not precipitated in the varnish. Therefore, a metal foil clad
laminate comprising a prepreg produced from this varnish is
excellent in heat resistance under moisture absorption and adhesion
to a metal foil.
[0046] The production method for a prepreg of the invention is not
particularly limited, as long as it is a production method of
impregnating the substrate (F) with the varnish comprising the
naphthol aralkyl type cyanate ester resin solution (AB). For
example, a method of impregnating or applying the above varnish to
the substrate (F), removing a solvent present if required, and then
semi-curing it by heating in a drier at 100 to 200.degree. C. for 1
to 60 minutes or the like to produce a prepreg and the like are
included. The adhered amount of the resin composition to the
substrate (F) is preferably within a range from 20 to 90% by weight
of the resin composition content (including the inorganic filler
(E)) in the prepreg.
[0047] The production method for a laminate of the invention is,
for example, a production method for a laminate obtained by curing
a prepreg obtained by the method described in any of the following
(1) to (5). [0048] (1) A method for producing a prepreg, which
comprises: [0049] storing a naphthol aralkyl type cyanate ester
resin solution (AB) prepared by [0050] a method of adding a solvent
and a maleimide compound (B) to a naphthol aralkyl type cyanate
ester resin (A), and mixing, [0051] a method of adding a solvent to
a naphthol aralkyl type cyanate ester resin (A), prepolymerizing
the naphthol aralkyl type cyanate ester resin (A), then further
adding a maleimide compound (B), and mixing, [0052] a method of
prepolymerizing a naphthol aralkyl type cyanate ester resin (A),
then further adding a solvent and a maleimide compound (B), and
mixing, [0053] a method of prepolymerizing a naphthol aralkyl type
cyanate ester resin (A) and a maleimide compound (B), then adding a
solvent, and mixing, [0054] a method of adding a solvent and a
maleimide compound (B) to a naphthol aralkyl type cyanate ester
resin (A), mixing, and prepolymerizing the naphthol aralkyl type
cyanate ester resin (A) and the maleimide compound, or the like;
[0055] then preparing a varnish comprising the resin solution (AB),
a non-halogen epoxy resin (C), silicone rubber powder (D) and an
inorganic filler (E), and; [0056] impregnating a substrate (F) with
the varnish. [0057] (2) A method for producing a prepreg according
to the above item (1), wherein the storage period of the naphthol
aralkyl type cyanate ester resin solution (AB) is from 1 day to 2
years. [0058] (3) A method for producing a prepreg according to the
above item (1), wherein the naphthol aralkyl type cyanate ester
resin (A) is represented by the above general formula (1). [0059]
(4) A method for producing a prepreg according to the above item
(1), wherein the naphthol aralkyl type cyanate ester resin solution
(AB) is prepared by [0060] a method of adding a solvent, a
maleimide compound (B) and a cyanate ester resin (G) other than the
naphthol aralkyl type cyanate ester resin (A) to the naphthol
aralkyl type cyanate ester resin (A), and mixing, [0061] a method
of prepolymerizing the naphthol aralkyl type cyanate ester resin
(A), then further adding a solvent, a maleimide compound (B) and a
cyanate ester resin (G) other than the naphthol aralkyl type
cyanate ester resin (A), and mixing, [0062] a method of adding a
solvent to the naphthol aralkyl type cyanate ester resin (A),
prepolymerizing the naphthol aralkyl type cyanate ester resin (A),
then adding a maleimide compound (B) and a cyanate ester resin (G)
other than the naphthol aralkyl type cyanate ester resin (A), and
mixing, [0063] a method of adding a maleimide compound (B) to the
naphthol aralkyl type cyanate ester resin (A), mixing,
prepolymerizing the naphthol aralkyl type cyanate ester resin (A)
and the maleimide compound (B), then further adding a solvent and a
cyanate ester resin (G) other than the naphthol aralkyl type
cyanate ester resin (A), and mixing, [0064] a method of adding a
solvent and a maleimide compound (B) to the naphthol aralkyl type
cyanate ester resin (A), mixing, prepolymerizing the naphthol
aralkyl type cyanate ester resin (A) and the maleimide compound
(B), then further adding a cyanate ester resin (G) other than the
naphthol aralkyl type cyanate ester resin (A), and mixing, [0065] a
method of adding a cyanate ester resin (G) other than the naphthol
aralkyl type cyanate ester resin (A) to the naphthol aralkyl type
cyanate ester resin (A), mixing, prepolymerizing the naphthol
aralkyl type cyanate ester resin (A) and the cyanate ester resin
(G) other than the naphthol aralkyl type cyanate ester resin (A),
then further adding a solvent and a maleimide compound (B), and
mixing, [0066] a method of adding a solvent and a cyanate ester
resin (G) other than the naphthol aralkyl type cyanate ester resin
(A) to the naphthol aralkyl type cyanate ester resin (A), mixing,
prepolymerizing the naphthol aralkyl type cyanate ester resin (A)
and the cyanate ester resin (G) other than the naphthol aralkyl
type cyanate ester resin (A), then further adding a maleimide
compound (B), and mixing, [0067] a method of adding a maleimide
compound (B) and a cyanate ester resin (G) other than the naphthol
aralkyl type cyanate ester resin (A) to the naphthol aralkyl type
cyanate ester resin (A), mixing, prepolymerizing the naphthol
aralkyl type cyanate ester resin (A), the maleimide compound (B)
and the cyanate ester resin (G) other than the naphthol aralkyl
type cyanate ester resin (A), then adding a solvent, and mixing,
[0068] a method of adding a solvent, a maleimide compound (B) and a
cyanate ester resin (G) other than the naphthol aralkyl type
cyanate ester resin (A) to the naphthol aralkyl type cyanate ester
resin (A), mixing, and prepolymerizing the naphthol aralkyl type
cyanate ester resin (A), the maleimide compound (B) and the cyanate
ester resin (G) other than the naphthol aralkyl type cyanate ester
resin (A), or the like. [0069] (5) A method for producing a prepreg
according to the above item (1), wherein the inorganic filler (E)
is a molten silica.
[0070] Specifically, it is produced by laminating and forming the
structure of one or a superimposed plurality of the prepreg
described above with a metal foil of copper, aluminum or the like
disposed on one side or both sides, as desired. These metal foils
used are not particularly limited, as long as they are those used
for printed wiring board materials, and include a copper foil and
the like, for example. As laminating and forming conditions, a
method for a normal laminate and multilayer board for a printed
wiring board and can be applied. For example, a multi-daylight
press, a multi-daylight vacuum press, a continuous forming machine,
an autoclave forming machine and the like are used, and typical
ranges of temperature is 100 to 300.degree. C., pressure is 2 to
100 kgf/cm.sup.2, and heating time is 0.05 to 5 hours. In addition,
post-curing may be conducted at a temperature of 150 to 300.degree.
C. if required.
EXAMPLES
[0071] Although Synthesis Examples, Examples and Comparative
Examples are shown below to describe the invention in detail, the
invention is not limited thereto.
Synthesis Example 1
Synthesis of .alpha.-Naphthol Aralkyl Type Cyanate Ester
Resin-1
[0072] 103 g (OH group: 0.47 mole) of an .alpha.-naphthol aralkyl
resin (SN485, OH group equivalent: 219 g/eq., softening point:
86.degree. C., made by Nippon Steel Chemical) represented by the
following formula (4):
##STR00004##
was dissolved in 500 ml of chloroform, then 0.7 mole of
triethylamine was added and mixed, which was added dropwise to 0.93
mole of cyan chloride in 300 g of chloroform solution at
-10.degree. C. for 1.5 hours and stirred for 30 minutes, and a
mixed solution of 0.1 mole of triethylamine and 30 g of chloroform
was further added dropwise and stirred for 30 minutes to complete
the reaction. A hydrochloride salt of triethylamine produced was
filtered and separated, the obtained filtrate was washed with 500
ml of 0.1 N hydrochloric acid and then washed with 500 ml of water
four times. Then, a chloroform phase of the chloroform/water mixed
solution was extracted by separation treatment, and dehydration
treatment was conducted by adding sodium sulfate to the chloroform
solution. After filtering and separating sodium sulfate, by
evaporating at 75.degree. C. and further deaerating under vacuum at
90.degree. C., an .alpha.-naphthol aralkyl type cyanate ester resin
represented by the following formula (5):
##STR00005##
as a brown solid was obtained. In the infrared spectrum, absorption
of cyanate ester groups in the proximity of 2264 cm.sup.-1 was
confirmed. Moreover, as the structure was identified by
.sup.13C-NMR and .sup.1H-NMR, the conversion from OH groups to OCN
groups was not less than 99%. Furthermore, by differential
refractive index detection in GPC, the percentage of compounds with
n of 1 to 4 was 93% by weight.
Synthesis Example 2
Synthesis of .alpha.-Naphthol Aralkyl Type Cyanate Ester
Resin-2
[0073] An .alpha.-naphthol aralkyl type cyanate ester resin
represented by the above formula (5) was synthesized by the same
method as Synthesis Example 1, except that 102 g (OH group: 0.45
mole) of an .alpha.-naphthol aralkyl resin (SN4105, OH group
equivalent: 226 g/eq., softening point: 105.degree. C., made by
Nippon Steel Chemical) was used as a substitute for the
.alpha.-naphthol aralkyl resin (SN485, OH group equivalent: 219
g/eq., softening point: 86.degree. C., made by Nippon Steel
Chemical) and that the used amount of cyan chloride was 0.90 mole.
In the infrared spectrum, absorption of cyanate ester groups in the
proximity of 2264 cm.sup.-1 was confirmed. Moreover, as the
structure was identified by .sup.13C-NMR and .sup.1H-NMR, the
conversion from OH groups to OCN groups was not less than 99%.
Furthermore, by differential refractive index detection in GPC, the
percentage of compounds with n of 1 to 4 was 75% by weight.
Synthesis Example 3
Prepolymerization of Naphthol Aralkyl Type Cyanate Ester Resin and
Maleimide Compound
[0074] A mixed solution (prepolymerized solution) of a naphthol
aralkyl type cyanate ester resin and a maleimide compound was
obtained by melting 60 parts by weight of the .alpha.-naphthol
aralkyl type cyanate ester (cyanate equivalent: 237 g/eq.) prepared
in Synthesis Example 1 and 40 parts by weight of
bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70, made by KI
Chemical Industry) by heating at 160.degree. C., reacting it for 6
hours with stirring, adding 80 parts by weight of methyl ethyl
ketone after cooling, and stirring it for 1 hour.
Comparative Synthesis Example 1
Prepolymerization of .alpha.-Naphthol Aralkyl Type Cyanate Ester
Resin
[0075] A prepolymer solution of an .alpha.-naphthol aralkyl type
cyanate ester resin was obtained by heating a solution having 20
parts by weight of methyl ethyl ketone added to 50 parts by weight
of the .alpha.-naphthol aralkyl type cyanate ester resin prepared
in Synthesis Example 1 for 30 hours, and conducting reflux
treatment.
Example 1
[0076] A uniform mixed solution was prepared by adding 50 parts by
weight of methyl ethyl ketone to 50 parts by weight of the
a-naphthol aralkyl type cyanate ester (cyanate equivalent: 237
g/eq.) prepared in Synthesis Example 1 and 20 parts by weight of
bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70, made by KI
Chemical Industry), and stirring it at 60.degree. C. for 1 hour. A
varnish was obtained by leaving the above mixed solution at room
temperature for 1 month, and further adding 30 parts by weight of a
phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy
equivalent: 320 g/eq., made by Nippon Kayaku), 2 parts by weight of
a wet disperser (disperbyk-161, made by BYK-Chemie Japan), 90 parts
by weight of spherical molten silica (SC2050MOB, made by
Admatechs), 20 parts by weight of silicone rubber powder (KMP-600,
made by Shin-Etsu Chemical) having the surface coated with a
silicone resin to improve dispersibility, and 0.02 parts by weight
of zinc octoate. This varnish was diluted with methyl ethyl ketone,
impregnated and coated to an E-glass woven cloth with a thickness
of 0.1 mm, and dried at 160.degree. C. for 4 minutes to obtain a
prepreg with a resin content of 50% by weight.
Example 2
[0077] A prepreg was obtained as same as Example 1, except that the
storage period of the uniform mixed solution was changed from 1
month to 6 months in Example 1.
Example 3
[0078] A prepreg was obtained as same as Example 1, except that the
storage period of the uniform mixed solution was changed from 1
month to 12 months in Example 1.
Example 4
[0079] A prepreg was obtained as same as Example 1, except that 50
parts by weight of the .alpha.-naphthol aralkyl type cyanate ester
(cyanate equivalent: 237 g/eq.) prepared in Synthesis Example 1 was
substituted with 50 parts by weight of the .alpha.-naphthol aralkyl
type cyanate ester resin (cyanate equivalent: 244 g/eq.) obtained
in Synthesis Example 2 in Example 1.
Example 5
[0080] A uniform mixed solution was prepared by adding 52 parts by
weight of methyl ethyl ketone to 52 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 1 and 20 parts by weight
of bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70, made by
KI Chemical Industry), and stirring it at 60.degree. C. for 1 hour.
A varnish was obtained by leaving the above mixed solution at room
temperature for 1 month, and further adding 28 parts by weight of a
phenol biphenyl aralkyl type epoxy resin (NC-3000-H, epoxy
equivalent: 290 g/eq., made by Nippon Kayaku), 2 parts by weight of
a wet disperser (disperbyk-161, made by BYK-Chemie Japan), 90 parts
by weight of spherical molten silica (SC2050MOB, made by
Admatechs), 20 parts by weight of silicone rubber powder (KMP-600,
made by Shin-Etsu Chemical) having the surface coated with a
silicone resin to improve dispersibility, and 0.02 parts by weight
of zinc octoate. This varnish was diluted with methyl ethyl ketone,
impregnated and coated to an E-glass woven cloth with a thickness
of 0.1 mm, and dried at 160.degree. C. for 4 minutes to obtain a
prepreg with a resin content of 50% by weight.
Example 6
[0081] A uniform mixed solution was prepared by adding 55 parts by
weight of methyl ethyl ketone to 55 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 1 and 20 parts by weight
of bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70, made by
KI Chemical Industry), and stirring it at 60.degree. C. for 1 hour.
A varnish was obtained by leaving the above mixed solution at room
temperature for 1 month, and further adding 25 parts by weight of a
phenol phenyl aralkyl type epoxy resin (xyloc type epoxy resin,
epoxy equivalent: 240 g/eq., made by Nippon Kayaku), 2 parts by
weight of a wet disperser (disperbyk-161, made by BYK-Chemie
Japan), 90 parts by weight of spherical molten silica (SC2050MOB,
made by Admatechs), 20 parts by weight of silicone rubber powder
(KMP-600, made by Shin-Etsu Chemical) having the surface coated
with a silicone resin to improve dispersibility, and 0.02 parts by
weight of zinc octoate. This varnish was diluted with methyl ethyl
ketone, impregnated and coated to an E-glass woven cloth with a
thickness of 0.1 mm, and dried at 160.degree. C. for 4 minutes to
obtain a prepreg with a resin content of 50% by weight.
Example 7
[0082] A uniform mixed solution was prepared by adding 40 parts by
weight of methyl ethyl ketone to 40 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 1 and 20 parts by weight
of a prepolymer of bis(3-ethyl-5-methyl-4-maleimidepheyl)methane
(BMI-70, made by KI Chemical Industry) prepared in Synthesis
Example 3 and the .alpha.-naphthol aralkyl type cyanate ester, and
stirring it at 60.degree. C. for 1 hour. A varnish was obtained by
leaving the above mixed solution at room temperature for 1 month,
and further adding 30 parts by weight of a phenol biphenyl aralkyl
type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g/eq., made by
Nippon Kayaku), 2 parts by weight of a wet disperser
(disperbyk-161, made by BYK-Chemie Japan), 90 parts by weight of
spherical molten silica (SC2050MOB, made by Admatechs), 20 parts by
weight of silicone rubber powder (KMP-600, made by Shin-Etsu
Chemical) having the surface coated with a silicone resin to
improve dispersibility, and 0.02 parts by weight of zinc octoate.
This varnish was diluted with methyl ethyl ketone, impregnated and
coated to an E-glass woven cloth with a thickness of 0.1 mm, and
dried at 160.degree. C. for 4 minutes to obtain a prepreg with a
resin content of 50% by weight.
Comparative Example 1
[0083] A uniform mixed solution was prepared by adding 50 parts by
weight of methyl ethyl ketone to 50 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 1, and stirring it at
60.degree. C. for 1 hour. Separately, a uniform mixed solution was
prepared by adding 20 parts by weight of methyl ethyl ketone to 20
parts by weight of bis(3-ethyl-5-methyl-4-maleimidepheyl)methane
(BMI-70, made by KI Chemical Industry), and stirring it at
60.degree. C. for 1 hour. These cyanate resin solution and
malaimide compound solution were left at room temperature for 1
month separately. Then, a varnish was obtained by mixing the
cyanate resin solution, the malaimide compound solution, 30 parts
by weight of a phenol biphenyl aralkyl type epoxy resin
(NC-3000-FH, epoxy equivalent: 320 g/eq., made by Nippon Kayaku), 2
parts by weight of a wet disperser (disperbyk-161, made by
BYK-Chemie Japan), 90 parts by weight of spherical molten silica
(SC2050MOB, made by Admatechs), 20 parts by weight of silicone
rubber powder (KMP-600, made by Shin-Etsu Chemical) having the
surface coated with a silicone resin to improve dispersibility, and
0.02 parts by weight of zinc octoate. This varnish was diluted with
methyl ethyl ketone, impregnated and coated to an E-glass woven
cloth with a thickness of 0.1 mm, and dried at 160.degree. C. for 4
minutes to obtain a prepreg with a resin content of 50% by
weight.
Comparative Example 2
[0084] A uniform mixed solution was prepared by adding 50 parts by
weight of methyl ethyl ketone to 50 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 2, and stirring it at
60.degree. C. for 1 hour. Separately, a uniform mixed solution was
prepared by adding 20 parts by weight of methyl ethyl ketone to 20
parts by weight of bis(3-ethyl-5-methyl-4-maleimidepheyl)methane
(BMI-70, made by KI Chemical Industry), and stirring it at
60.degree. C. for 1 hour. These cyanate resin solution and
malaimide compound solution were left at room temperature for 1
month separately. Then, a varnish was obtained by mixing the
cyanate resin solution, the malaimide compound solution, 30 parts
by weight of a phenol biphenyl aralkyl type epoxy resin
(NC-3000-FH, epoxy equivalent: 320 g/eq., made by Nippon Kayaku), 2
parts by weight of a wet disperser (disperbyk-161, made by
BYK-Chemie Japan), 90 parts by weight of spherical molten silica
(SC2050MOB, made by Admatechs), 20 parts by weight of silicone
rubber powder (KMP-600, made by Shin-Etsu Chemical) having the
surface coated with a silicone resin to improve dispersibility, and
0.02 parts by weight of zinc octoate. This varnish was diluted with
methyl ethyl ketone, impregnated and coated to an E-glass woven
cloth with a thickness of 0.1 mm, and dried at 160.degree. C. for 4
minutes to obtain a prepreg with a resin content of 50% by
weight.
Comparative Example 3
[0085] A uniform mixed solution was prepared by adding 20 parts by
weight of methyl ethyl ketone to 20 parts by weight of
bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70, made by KI
Chemical Industry), and stirring it at 60.degree. C. for 1 hour.
The prepolymer solution of .alpha.-naphthol aralkyl type cyanate
ester prepared in Comparative Synthesis Example 1 and the malaimide
compound solution were left at room temperature for 1 month
separately. Then, a varnish was obtained by mixing the cyanate
resin solution, the malaimide compound solution, 30 parts by weight
of a phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy
equivalent: 320 g/eq., made by Nippon Kayaku), 2 parts by weight of
a wet disperser (disperbyk-161, made by BYK-Chemie Japan), 90 parts
by weight of spherical molten silica (SC2050MOB, made by
Admatechs), 20 parts by weight of silicone rubber powder (KMP-600,
made by Shin-Etsu Chemical) having the surface coated with a
silicone resin to improve dispersibility, and 0.02 parts by weight
of zinc octoate. This varnish was diluted with methyl ethyl ketone,
impregnated and coated to an E-glass woven cloth with a thickness
of 0.1 mm, and dried at 160.degree. C. for 4 minutes to obtain a
prepreg with a resin content of 50% by weight.
Comparative Example 4
[0086] A uniform mixed solution was prepared by adding 40 parts by
weight of methyl ethyl ketone to 40 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 1 and 8 parts by weight of
2,2-bis(4-cyanatephenyl)propane, and stirring it at 60.degree. C.
for 1 hour. Separately, a uniform mixed solution was prepared by
adding 12 parts by weight of methyl ethyl ketone to 12 parts by
weight of bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70,
made by KI Chemical Industry), and stirring it at 60.degree. C. for
1 hour. A varnish was obtained by leaving the above mixed solutions
at room temperature for 1 month, and mixing 30 parts by weight of a
phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy
equivalent: 320 g/eq., made by Nippon Kayaku), 2 parts by weight of
a wet disperser (disperbyk-161, made by BYK-Chemie Japan), 90 parts
by weight of spherical molten silica (SC2050MOB, made by
Admatechs), 20 parts by weight of silicone rubber powder (KMP-600,
made by Shin-Etsu Chemical) having the surface coated with a
silicone resin to improve dispersibility, and 0.02 parts by weight
of zinc octoate. This varnish was diluted with methyl ethyl ketone,
impregnated and coated to an E-glass woven cloth with a thickness
of 0.1 mm, and dried at 160.degree. C. for 4 minutes to obtain a
prepreg with a resin content of 50% by weight.
Comparative Example 5
[0087] A prepreg was obtained as same as Example 1, except that 20
parts by weight of silicone rubber powder (KMP-600, made by
Shin-Etsu Chemical) having the surface coated with a silicone resin
to improve dispersibility was excluded in Example 1.
Comparative Example 6
[0088] A prepreg was obtained as same as Example 1, except that 50
parts by weight of a prepolymer of 2,2-bis(4-cyanatephenyl)propane
(BT2070, cyanate equivalent: 139 g/eq., made by Mitsubishi Gas
Chemical) was used as a substitute for 50 parts by weight of the
.alpha.-naphthol aralkyl type cyanate ester (cyanate equivalent:
237 g/eq.) prepared in Synthesis Example 1 in Example 1.
Comparative Example 7
[0089] A prepreg was obtained as same as Example 1, except that a
mixed solution prepared by adding 50 parts by weight of methyl
ethyl ketone to 70 parts by weight of the .alpha.-naphthol aralkyl
type cyanate ester (cyanate equivalent: 237 g/eq.) prepared in
Synthesis Example 1 and stirring at 60.degree. C. for 1 hour was
used as a substitute for the uniform mixed solution prepared by
adding 50 parts by weight of methyl ethyl ketone to 50 parts by
weight of 50 parts by weight of the .alpha.-naphthol aralkyl type
cyanate ester (cyanate equivalent: 237 g/eq.) prepared in Synthesis
Example 1 and 20 parts by weight of
bis(3-ethyl-5-methyl-4-maleimidepheyl)methane (BMI-70, made by KI
Chemical Industry) and stirring at 60.degree. C. for 1 hour in
Example 1.
[0090] <Production of Metal Foil Clad Laminate>
[0091] 4 prepregs obtained in each of Examples 1 to 7 and
Comparative Examples 1 to 7 were superimposed, electrolyte copper
foils (3EC-III, made by Mitsui Mining & Smelting) with a
thickness of 12 .mu.m were disposed on top and bottom thereof, and
laminating and forming at a pressure of 30 kgf/cm.sup.2 and a
temperature of 220.degree. C. was conducted for 120 minutes to
obtain a copper clad laminate with an insulating layer thickness of
0.38 to 0.45 mm.
[0092] The evaluation results of storage stability using the
solutions of .alpha.-naphthol aralkyl type cyanate ester and
bis(3-ethyl-5-methyl-4-maleimidepheyl)methane are shown in Table
1.
[0093] In the storage stability test, precipitation of samples of
the mixed solutions of .alpha.-naphthol aralkyl type cyanate ester
and bis(3-ethyl-5-methyl-4-maleimidepheyl)methane having been left
at room temperature was visually evaluated, and those with no
precipitation observed were denoted as .smallcircle. and those
where precipitation occurred were denoted as .times..
[0094] The evaluation results of flame retardance, coefficient of
thermal expansion, copper foil peel strength and heat resistance
under moisture absorption using the obtained metal foil clad
laminates are shown in Table 2.
[0095] The evaluation of flame retardance and the measurements of
coefficient of thermal expansion were conducted by the following
method, after etching the metal foil clad laminates to remove
copper foils.
[0096] Combustion Test: It was evaluated based on the UL94 vertical
combustion test.
[0097] Coefficient of Thermal Expansion: The linear expansion
coefficient in the surface direction at 60.degree. C. to
120.degree. C. was measured with a thermomechanical analysis
instrument (made by TA Instruments) by increasing the temperature
at 10.degree. C. per minute from 40.degree. C. to 340.degree. C.
For the measurement direction, it was measured in both directions
of the warp thread (Y) direction and the weft thread direction (X)
of the glass cloth.
[0098] The copper foil peel strength was measured based on JIS
C6481, the heat resistance under moisture absorption was evaluated
by visually observing change in appearance of a sample piece having
the entire copper foil other than the half in one side of a 50
mm.times.50 mm sample removed by etching, after being treated in a
pressure cooker testing machine (PC-3 model) at 121.degree. C. and
2 atmospheric pressure and immersed in solder at 260.degree. C. for
30 seconds, and the evaluation results are shown in (number of
blisters generated/number of tests).
TABLE-US-00001 TABLE 1 Example 1 Example 2 Example 3 Example 4
Example 5 Example 6 Example 7 Storage stability .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. Comparative Comparative Comparative
Comparative Comparative Comparative Comparative Example 1 Example 2
Example 3 Example 4 Example 5 Example 6 Example 7 Storage stability
X X X X .largecircle. X X
TABLE-US-00002 TABLE 2 Example 1 Example 2 Example 3 Example 4
Example 5 Example 6 Example 7 Flame retardance V-0 V-0 V-0 V-0 V-0
V-0 V-0 Coefficient of 10.8 10.9 10.7 10.6 10.5 10.4 10.4 thermal
expansion in Y direction Coefficient of 11.2 11 11.1 11.1 10.8 10.9
11.2 thermal expansion in X direction Copper foil peel 1 1 1 1 1 1
1 strength Heat resistance under 0/4 0/4 0/4 0/4 0/4 0/4 0/4
moisture absorption Comparative Comparative Comparative Comparative
Comparative Comparative Comparative Example 1 Example 2 Example 3
Example 4 Example 5 Example 6 Example 7 Flame retardance V-0 V-0
V-0 V-0 V-0 V-1 V-1 Coefficient of 10.4 10.6 10.5 10.4 12.3 10.8
10.8 thermal expansion in Y direction Coefficient of 10.9 11 11.1
10.7 12.7 11.4 11.1 thermal expansion in X direction Copper foil
peel 0.8 0.8 0.8 0.8 1 0.9 1 strength Heat resistance under 4/4 4/4
4/4 4/4 0/4 4/4 4/4 moisture absorption Unit: Coefficient of
thermal expansion: ppm/.degree. C. Copper foil peel strength:
kgf/cm
[0099] The results show that Examples 1 to 7 using the mixed resin
solution (AB) prepared by the method of mixing or the method
prepolymerizing the .alpha.-naphthol aralkyl type cyanate ester
resin (A) and the maleimide compound (B) had excellent heat
resistance under moisture absorption and high copper foil peel
intensity, as compared to Comparative Examples 1 to 4 and 6, in
which the vanish was prepared without using the mixed resin
solution (AB) of the cyanate ester resin (A) and the maleimide
compound (B). Also, Comparative Example 5, which did not use
silicone rubber powder having the surface coated with a silicone
resin to improve dispersibility, had a high coefficient of thermal
expansion, as compared to Example 1. Moreover, Comparative Example
6, which did not use the .alpha.-naphthol aralkyl type cyanate
ester resin, had poor flame retardance, as compared to Example
1.
* * * * *