U.S. patent application number 12/822294 was filed with the patent office on 2011-12-29 for heat-dissipating body having radial fin assembly and heat-dissipating device having the same.
This patent application is currently assigned to CELSIA TECHNOLOGIES TAIWAN, I. Invention is credited to Chieh-Ping Chen, Hsien-Tsang Liu, George Anthony. Meyer, IV, Chien-Hung Sun.
Application Number | 20110315356 12/822294 |
Document ID | / |
Family ID | 45351415 |
Filed Date | 2011-12-29 |
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United States Patent
Application |
20110315356 |
Kind Code |
A1 |
Meyer, IV; George Anthony. ;
et al. |
December 29, 2011 |
HEAT-DISSIPATING BODY HAVING RADIAL FIN ASSEMBLY AND
HEAT-DISSIPATING DEVICE HAVING THE SAME
Abstract
A heat-dissipating device includes a heat-dissipating body, a
vapor chamber and a fan assembly. The heat-dissipating body
includes a thermal-conductive element and a radial fin assembly.
The thermal-conductive element includes a solid post and extending
arms extending therefrom. The radial fin assembly includes
radially-arranged heat-dissipating fins that form a central hole to
enclose the sold post, engaging troughs inserted by the extending
arms, and an airflow space. An air channel is formed between any
two heat-dissipating fins. The vapor chamber is provided at one end
of the solid post, while the fan assembly is arranged on the other
end and received in the airflow space to correspond to the
respective air channels. Thus, the mobility of air and the
heat-dissipating efficiency can be increased, thereby conforming to
the requirements for compact design.
Inventors: |
Meyer, IV; George Anthony.;
(San Jose, CA) ; Sun; Chien-Hung; (Zhongli City,
TW) ; Chen; Chieh-Ping; (Zhongli City, TW) ;
Liu; Hsien-Tsang; (Zhongli City, TW) |
Assignee: |
CELSIA TECHNOLOGIES TAIWAN,
I
|
Family ID: |
45351415 |
Appl. No.: |
12/822294 |
Filed: |
June 24, 2010 |
Current U.S.
Class: |
165/121 ;
165/185 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/467 20130101; H01L 23/427 20130101; F28D 15/0233 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/121 ;
165/185 |
International
Class: |
F28F 13/00 20060101
F28F013/00; F28F 7/00 20060101 F28F007/00 |
Claims
1. A heat-dissipating body having a radial fin assembly,
comprising: a thermal-conducting element comprising a solid post
and a plurality of extending arms extending from the periphery of
the solid post; and a radial fin assembly constituted of a
plurality of heat-dissipating fins radially arranged at intervals,
the heat-dissipating fins forming a central hole to enclose the
solid post, and a plurality of engaging troughs surrounding the
central hole and inserted by the extending arms.
2. The heat-dissipating body having a radial fin assembly according
to claim 1, wherein the extending arm is formed into a
trapezoid.
3. The heat-dissipating body having a radial fin assembly according
to claim 2, wherein the thermal-conductive element further
comprises a plurality of heat-dissipating pieces, and the
heat-dissipating pieces extend from the outer periphery of the
solid post to be arranged between the extending arms
respectively.
4. A heat-dissipating device having a heat-dissipating body,
comprising: a heat-dissipating body having a radial fin assembly,
comprising: a thermal-conductive element comprising a solid post
and a plurality of extending arms extending from the periphery of
the sold post; and a radial fin assembly constituted of a plurality
of heat-dissipating fins arranged radially at intervals, the
heat-dissipating fins forming a central hole to enclose the sold
post, a plurality of engaging troughs surrounding the central hole
and inserted by the extending arms, and an airflow space provided
over the central hole, an air channel being formed between any two
heat-dissipating fins in communication with the airflow space; a
vapor chamber provided at one end of the solid post; and a fan
assembly positioned at the other end of the solid post and received
in the airflow space to correspond to the air channels.
5. The heat-dissipating device having a heat-dissipating body
according to claim 4, wherein the extending arm is formed into a
trapezoid.
6. The heat-dissipating device having a heat-dissipating body
according to claim 5, wherein the thermal-conductive element
further comprises a plurality of heat-dissipating pieces, and the
heat-dissipating pieces extend from the outer periphery of the
solid post to be arranged between the extending arms
respectively.
7. The heat-dissipating device having a heat-dissipating body
according to claim 4, wherein the fan assembly comprises a support
fixedly connected to the extending arms, and a blade pivotally
connected to the support.
8. The heat-dissipating device having a heat-dissipating body
according to claim 4, further comprising a fixing base connected to
the heat-dissipating fins for allowing the vapor chamber to be
mounted thereon, the vapor chamber being sandwiched between the
fixing base and the heat-dissipating fins.
9. The heat-dissipating device having a heat-dissipating body
according to claim 8, wherein the heat-dissipating fins are
provided with an annular groove, and the fixing base is formed with
an annular rib inserted into the annular groove.
10. The heat-dissipating device having a heat-dissipating body
according to claim 8, wherein the vapor chamber is formed with a
protrusion, and the fixing base is provided with an insertion
trough for allowing the vapor chamber to be inserted therein and a
through hole communicating the insertion trough for allowing the
protrusion to pass through.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat-dissipating device,
and in particular to a heat-dissipating body having a radial fin
assembly and a heat-dissipating device having the heat-dissipating
body.
[0003] 2. Description of Prior Art
[0004] Integrated circuits in electronic products inevitably
generate heat in their operation. Nowadays, with the advancement of
the efficiency and performance of electronic product, the amount of
heat generated thereby will be also increased. If the heat
generated is not dissipated immediately but accumulated in the
integrated circuits, their performance will be deteriorated. In
view of this, a heat-dissipating device is mounted in an electronic
product to lower the working temperature of the integrated circuit,
thereby maintaining the stability and safety of the electronic
product during its operation.
[0005] The conventional heat-dissipating device is formed with a
heat-dissipating fin assembly on a metallic thermal-conductive
body. The heat-dissipating fin assembly is constituted of a
plurality of upright heat-dissipating fins. An air channel is
formed between two adjacent heat-dissipating fins. The metallic
thermal-conductive block is adhered to a heat source. The heat
generated during the operation of the integrated circuit is
conducted to the respective heat-dissipating fins. With external
cooling air flowing through the respective air channels, the heat
absorbed by the respective heat-dissipating fins can be taken away.
In order to increase the heat-dissipating capacity, a fan is
usually mounted above the heat-dissipating fin assembly, so that a
compulsive airflow generated by the fan can blow cooler air to the
heat-dissipating fin assembly and the metallic thermal-conductive
block.
[0006] Modern electronic products tend to be made compact and
light-weight. However, in the conventional heat-dissipating device,
the fan is mounted over the heat-dissipating fin assembly, which
makes the thickness of the heat-dissipating device unable to be
reduced and thus restricts the compact design of the electronic
products. On the other hand, the downward airflow blown by the fan
will be obstructed by the metallic thermal-conductive block. As a
result, the hot air is jammed in the heat-dissipating device,
causing the deterioration of the heat-dissipating efficiency.
Furthermore, if the fan is provided outside the heat-dissipating
device, the noise generated thereby is unavoidable.
[0007] Furthermore, the conventional metallic thermal-conductive
block is merely a metallic block with good thermal conductivity.
However, its thermal-conducting effect is limited. In addition, the
heat-dissipating fins of the conventional heat-dissipating fin
assembly are arranged upright with the same orientation, and the
air channels formed between the adjacent two heat-dissipating fins
are also oriented in the same direction, which make the air unable
to flow freely and thus affect the heat-dissipating efficiency
thereof.
[0008] In view of the above, the present inventor proposes a novel
and reasonable structure based on his expert experience and
deliberate researches.
SUMMARY OF THE INVENTION
[0009] The present invention is to provide a heat-dissipating body
having a radial fin assembly, which is capable of enhancing the
mobility of air and the degree of heat dissipation, thereby
increasing the heat-dissipating efficiency thereof.
[0010] The present invention provides a heat-dissipating body
having a radial fin assembly, comprising:
[0011] a thermal-conducting element comprising a solid post and a
plurality of extending arms extending from the periphery of the
solid post; and
[0012] a radial fin assembly constituted of a plurality of
heat-dissipating fins radially arranged at intervals, the
heat-dissipating fins forming a central hole to enclose the solid
post, and a plurality of engaging troughs surrounding the central
hole and inserted by the extending arms.
[0013] The present invention is to provide a heat-dissipating
device having a heat-dissipating body, which is capable of
enhancing the mobility of air and the degree of heat dissipation,
thereby increasing the heat-dissipating efficiency thereof and
conforming to the requirements for compact design.
[0014] The present invention provides a heat-dissipating device
having a heat-dissipating body, comprising:
[0015] a heat-dissipating body having a radial fin assembly,
comprising:
[0016] a thermal-conductive element comprising a solid post and a
plurality of extending arms extending from the periphery of the
sold post; and
[0017] a radial fin assembly constituted of a plurality of
heat-dissipating fins arranged radially at intervals, the
heat-dissipating fins forming a central hole to enclose the sold
post, a plurality of engaging troughs surrounding the central hole
and inserted by the extending arms, and an airflow space provided
over the central hole, an air channel being formed between any two
heat-dissipating fins in communication with the airflow space;
[0018] a vapor chamber provided at one end of the solid post;
and
[0019] a fan assembly positioned at the other end of the solid post
and received in the airflow space to correspond to the air
channels.
[0020] In comparison with prior art, the present invention has
advantageous features as follows.
[0021] The vapor chamber has a high heat-dissipating capacity and
thus it is capable of conducting the heat of a heat source rapidly
to another place. The radial fin assembly has a plurality of air
channels arranged radially at intervals to thereby enhancing the
mobility of air. The fan assembly is arranged in such a manner that
it can reduce the height of the whole heat-dissipating device and
the noise generated by itself.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is an exploded perspective view of a heat-dissipating
device of the present invention;
[0023] FIG. 2 is a perspective view showing some elements of the
heat-dissipating device of the present invention;
[0024] FIG. 3 is an assembled perspective view of the
heat-dissipating device of the present invention;
[0025] FIG. 4 is a schematic view of FIG. 3 from another viewing
angle;
[0026] FIG. 5 is an assembled cross-sectional view of the
heat-dissipating device of the present invention; and
[0027] FIG. 6 is a schematic view showing the operating state of
the heat-dissipating device in FIG. 5.
DETAILED DESCRIPTION OF THE INVENTION
[0028] The detailed description and technical contents of the
present invention will be explained with reference to the
accompanying drawings. However, it should be understood that the
drawings are illustrative only, but not used to limit the present
invention.
[0029] The present invention provides a heat-dissipating body
having a radial fin assembly, and a heat-dissipating device having
such a heat-dissipating body. Please refer to FIGS. 1 to 5. The
heat-dissipating device includes a heat-dissipating body 10, a
vapor chamber 20, a fan assembly 30, and a fixing base 40. The
heat-dissipating body 10 includes a thermal-conductive element 110
and a radial fin assembly 120.
[0030] The vapor chamber 20 has a sealed casing whose inner walls
are distributed with a wick structure. The interior of the vapor
chamber 20 forms a vacuum space for airflow with a working fluid
filled therein. In the present embodiment, the vapor chamber 20 is
formed into a thin rectangular shape, but it is not limited
thereto. The bottom surface of the vapor chamber 20 is formed with
a protrusion 21 for thermally contacting a heat-generating
electronic element. The phase change of the working fluid within
the vapor chamber 20 is utilized to dissipate the heat, so that the
thermal-conducting efficiency or the heat-dissipating efficiency of
the vapor chamber 20 is superior to that of a conventional metallic
thermal-conductive body.
[0031] The radial fin assembly 120 is constituted of a plurality of
heat-dissipating fins 121 that are arranged radially at intervals
on the surface of the vapor chamber 20. The heat-dissipating fins
121 are combined with each other by means of fitting, soldering,
adhesion or the like. Alternatively, the heat-dissipating fins 121
can be integrally formed by an aluminum extrusion process, thereby
preventing the possible detachment of the respective
heat-dissipating fins 121. However, the manufacturing of the radial
fin assembly 120 is not limited to the above methods. Each of the
heat-dissipating fins 121 can be formed into a flat piece, a curved
piece or a plate, but it is not limited thereto.
[0032] One side of the heat-dissipating fins 121 is provided with
an annular groove 122. More specifically, the bottom of each
heat-dissipating fin 121 (i.e. the side adjacent to the vapor
chamber 20) is provided with a notch at the same position, so that
these notches can be connected in series to form the annular groove
122.
[0033] The respective heat-dissipating fins 121 are arranged at
intervals. The inner sides of the respective heat-dissipating fins
121 enclose to form a central hole 123, a plurality of engaging
troughs 124 and an airflow space 125. The engaging troughs 124
surround the central hole 123. The central hole 123 is arranged
below the airflow space 125 and in communication therewith. The
open surface of the central hole 123 is formed on the inner bottom
edge of each heat-dissipating fin 121 while the open surface of the
airflow space 125 is formed on the inner to edges of the respective
heat-dissipating fins 121. The cross section of the central hole
123 and the airflow space 125 may be formed into a circular shape,
a polygonal shape or an irregular shape, but it is not limited
thereto. The width of the engaging trough 124 increases toward the
outside of the central hole 123 to form a trapezoid.
[0034] Further, an airflow channel 126 is formed between any two
heat-dissipating fins 121 in communication with the airflow space
125. The airflow channels 126 are arranged radially to allow the
airflow to flow through in different directions.
[0035] The fixing base 40 is locked to a carrier. The surface of
the fixing base 40 is provided with an insertion trough 41. The
profile of the insertion trough 41 corresponds to that of the vapor
chamber 20. The insertion trough 41 allows the vapor chamber 20 to
be inserted therein. The bottom surface of the fixing base 40 is
provided with a through hole 42 in communication with the insertion
trough 41. The through hole 42 allows the protrusion 21 to pass
through.
[0036] Further, the edge of the fixing babes 40 is formed with an
annular rib 43 that is inserted into the annular groove 122, so
that the fixing base 40 can be fixedly connected to the bottom of
the radial fin assembly 120. That is, the fixing base 40 can be
fixedly connected to the bottom of the respective heat-dissipating
fins 121. In this way, the vapor chamber 20 can be tightly
sandwiched between the radial fin assembly 120 and the fixing base
40 with the vapor chamber 20 abutting the respective
heat-dissipating fins 121. In this way, the thermal resistance
between the vapor chamber 20 and the radial fin assembly 120 can be
reduced to enhance the thermal conductivity.
[0037] The profile of the thermal-conductive element 110
corresponds to that of the central hole 123 and the engaging
troughs 124. The thermal-conductive element 110 is embedded into
the central hole 123 and the respective engaging troughs 124 to be
connected to the radial fin assembly 120. That is, the respective
heat-dissipating fins 121 are arranged radially at intervals to
surround the thermal-conductive element 110. The bottom of the
thermal-conductive element 110 is adhered to the surface of the
vapor chamber 20. With this arrangement, the efficiency of
conducting the heat of the vapor chamber 20 to the respective
heat-dissipating fins 121 can be increased.
[0038] More specifically, the thermal-conducting element 110
comprises a solid post 111, a plurality of extending arms 112 and a
plurality of heat-dissipating pieces 113. The respective extending
arms 112 extend from the outer periphery of the solid post 111 and
are arranged radially at intervals. The respective heat-dissipating
pieces 113 extend from the outer periphery of the solid post 111
and are arranged radially at intervals. The width of the extending
arm 112 increases outwards to form a trapezoid. The
heat-dissipating pieces 113 are disposed between two adjacent
extending arms 112.
[0039] The slid post 111 is disposed in the central hole 123. Each
of the extending arms 112 is engaged into the engaging trough 124.
The shape of the extending arm 112 corresponds to that of the
engaging trough 124, so that they can be assembled together firmly.
The solid post 111, the extending arms 112, and the
heat-dissipating pieces 113 are adhered to the surface of the vapor
chamber 20 to increase the thermal-conducting efficiency. In
addition, the thermal-conductive element 110 serves as a mounting
base for the fan assembly 30.
[0040] The fan assembly 30 is embedded into the airflow space 125.
The fan assembly 30 is connected to the thermal-conductive element
110 to correspond to the respective air channels 126. More
specifically, the fan assembly 30 comprises a support 31 and a
blade 32. The blade 32 is pivotally connected to the support 31.
The blade 32 generates airflow when it rotates. The support 31 is
fixed to the distal end of each extending arm 112, so that the fan
assembly 30 can be firmly mounted on the thermal-conductive element
110. The connection between the fan assembly 30 and the
thermal-conductive element 110 can be achieved by locking, clamping
or engaging, but it is not limited thereto.
[0041] Furthermore, the blade 32 is a centrifugal blade, so that
the airflow generated by the rotation of the blade 32 can flow into
the respective air channels 126. Thus, cool air is sucked by the
fan assembly 30 from the upper space thereof, while hot air is
exhausted laterally from the heat-dissipating fins 121. In this
way, the airflow will not be obstructed by the vapor chamber 20,
thereby enhancing the heat-dissipating efficiency of the whole
device. Since the blade 32 is embedded into the airflow space 125,
the noise generated by the rotation of the blade 32 can be blocked
by the radial fin assembly 120, thereby reducing the noise and the
height of the whole device. Furthermore, since the thickness of the
vapor chamber 20 is very small, the height of the whole
heat-dissipating device can be reduced further, so that the
heat-dissipating device can be mounted in a compact electronic
product more easily.
[0042] Please refer to FIG. 6. When the heat-dissipating device
having the heat-dissipating body is in use, the fixing base 40 is
first locked to a carrier (such as a circuit board P) while the
protrusion 21 is brought into thermal contact with a
heat-generating electronic element (such as a central processor C).
The heat generated by the central processor C is conducted to the
vapor chamber 20, and it is conducted to the thermal-conductive
element 110 by means of the phase change of the working fluid
within the vapor chamber 20. Then, the heat is dissipated to the
outside by the radial fin assembly 120 and the airflow generated by
the fan assembly 30.
[0043] Although the present invention has been described with
reference to the foregoing preferred embodiments, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
* * * * *