U.S. patent application number 12/821309 was filed with the patent office on 2011-12-29 for vapor chamber having composite supporting structure.
This patent application is currently assigned to CELSIA TECHNOLOGIES TAIWAN, I. Invention is credited to Chieh-Ping Chen, Mei-Yu Chen, Te-Hsuan Chin, Yung-Tai Lu, George Anthony. Meyer, IV, Chien-Hung Sun.
Application Number | 20110315351 12/821309 |
Document ID | / |
Family ID | 45351411 |
Filed Date | 2011-12-29 |
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United States Patent
Application |
20110315351 |
Kind Code |
A1 |
Meyer, IV; George Anthony. ;
et al. |
December 29, 2011 |
VAPOR CHAMBER HAVING COMPOSITE SUPPORTING STRUCTURE
Abstract
A vapor chamber having a composite supporting structure includes
a flat sealed casing; a wick structure, a working fluid and a
composite supporting structure. The composite supporting structure
has a waved supporting rack and at least one supporting pillar. The
waved supporting rack is configured to support upper and lower
inner walls of the flat sealed casing. The waved supporting rack
has plural separated channels for allowing vapor of the working
fluid to flow through. Both ends of the at least one supporting
pillar are respectively connected to the flat sealed casing or the
wick structure. With this arrangement, compressive strength and
tensile strength of the vapor chamber can be increased
simultaneously without obstructing the circulation of liquid/vapor
phases of the working fluid and reducing the thermal-conducting
efficiency thereof.
Inventors: |
Meyer, IV; George Anthony.;
(San Jose, CA) ; Sun; Chien-Hung; (Zhongli City,
TW) ; Chen; Chieh-Ping; (Zhongli City, TW) ;
Lu; Yung-Tai; (Zhongli City, TW) ; Chin;
Te-Hsuan; (Zhongli City, TW) ; Chen; Mei-Yu;
(Zhongli City, TW) |
Assignee: |
CELSIA TECHNOLOGIES TAIWAN,
I
|
Family ID: |
45351411 |
Appl. No.: |
12/821309 |
Filed: |
June 23, 2010 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28D 15/046 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A vapor chamber having a composite supporting structure,
comprising: a flat sealed casing; a wick structure arranged on
inner walls of the flat sealed casing; a working fluid filled
within the flat sealed casing; and a composite supporting structure
mounted in the flat sealed casing, the composite supporting
structure having a waved supporting rack and at least one
supporting pillar.
2. The vapor chamber having a composite supporting structure
according to claim 1, wherein the waved supporting rack is
configured to support an upper inner wall and a lower inner wall of
the flat sealed casing, the waved supporting rack has a plurality
of separated channels for allowing vapor of the working fluid to
flow through.
3. The vapor chamber having a composite supporting structure
according to claim 2, wherein the waved supporting rack comprises
at least two side plates and a plurality of waved pieces connected
between the two side plates, each of the waved pieces is
constituted of a plurality of wave-crest sections and a plurality
of wave-recess sections, the wave-crest sections of any two
adjacent waved pieces are staggered to each other, the wave-recess
sections are staggered to each other, the wave-crest sections are
located in a level higher than that of a top surface of the side
plate, and the wave-recess sections are located in a level lower
than that of a bottom surface of the side plate, and the separated
channels are formed between any two adjacent waved pieces.
4. The vapor chamber having a composite supporting structure
according to claim 3, wherein both ends of the at least one
supporting pillar are respectively connected to the upper inner
wall and the lower inner wall of the flat sealed casing.
5. The vapor chamber having a composite supporting structure
according to claim 3, wherein both ends of the at least one
supporting pillar are respectively connected to the upper inner
wall of the flat sealed casing and the wick structure.
6. The vapor chamber having a composite supporting structure
according to claim 3, wherein both ends of the at least one
supporting pillar are respectively connected to the lower inner
wall of the flat sealed casing and the wick structure.
7. The vapor chamber having a composite supporting structure
according to claim 3, wherein both ends of the at least one
supporting pillar are respectively connected to the wick
structure.
8. The vapor chamber having a composite supporting structure
according to claim 3, wherein the at least one supporting pillar is
made of metallic materials, the wick structure is made by sintering
metallic powders, the wick structure is connected to the supporting
pillar by any one of a heat fusion process at high temperature,
sintering, brazing or soldering.
9. The vapor chamber having a composite supporting structure
according to claim 3, wherein the at least one supporting pillar is
disposed toward four corners inside the flat sealed casing and away
from the waved supporting rack.
10. The vapor chamber having a composite supporting structure
according to claim 3, wherein the at least one supporting pillar is
disposed in an opening formed inside the waved supporting rack.
11. The vapor chamber having a composite supporting structure
according to claim 3, wherein an outer upper surface of the flat
sealed casing is formed with a recess corresponding to the at least
one supporting pillar.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a vapor chamber, and in
particular to a vapor chamber having a composite supporting
structure.
[0003] 2. Description of Prior Art
[0004] With the advancement of science and technology, the power
and performance of a modern electronic element have been increased
significantly. As a result, a large amount of heat is generated
during the operation of the electronic element. If the heat is not
conducted to the outside but accumulated inside the electronic
element, the temperature of the electronic element will rise to
such an extent that its performance is affected and even the
electronic element may suffer damage. Therefore, it is an important
issue for the manufacturers in this field to develop effective
heat-conducting members to solve the above problem. For example, a
vapor chamber is a common heat-conducting member used nowadays.
[0005] The vapor chamber includes a flat sealed casing, a wick
structure formed in the flat sealed casing, and a working fluid
filled in the flat sealed casing. The flat sealed casing is formed
with a heat-absorbing surface and a heat-releasing surface opposite
to the heat-absorbing surface. The heat-absorbing surface is
brought into thermal contact with an electronic heat-generating
element. The liquid/vapor phase change of the working liquid inside
the vapor chamber thermally conducts the heat generated by the
electronic heat-generating element from the heat-absorbing surface
to the heat-releasing surface.
[0006] Recently, since electronic products are made more and more
compact, the thickness of the vapor chamber provided in the
electronic product has to be reduced accordingly. However, the
reduction in the thickness of the vapor chamber inevitably reduces
the thickness of the flat sealed casing. As a result, the whole
structural strength of the vapor chamber becomes insufficient due
to the thinned casing. When the vapor chamber is evacuated vacuum,
the external atmosphere will exert a compressive force onto the
vapor chamber, thereby making the vapor chamber sunken. In another
case, the portion of the vapor chamber to which an electronic
heat-generating element is adhered will be sunk due to the
compressive force exerted by the electronic heat-generating element
on the vapor chamber.
[0007] Therefore, it is well known to provide a supporting
structure within the vapor chamber. The supporting structure abuts
an upper surface and a lower surface of an inner wall of the vapor
chamber to increase the structural strength of the vapor chamber,
thereby protecting the vapor chamber from getting sunken due to the
external compressive force. If the area and volume of the
supporting structure are too small, the effect of the supporting
structure may be insufficient. However, if the area and volume of
the supporting structure are too large, the supporting structure
may obstruct the phase change between liquid and vapor phases of
the working fluid and thus adversely affect the thermal-conducting
effect of the vapor chamber.
[0008] On the other hand, in practice, since the working fluid in
the vapor chamber is vaporized when heated, the volume of the vapor
phase of the working fluid is significantly larger than that of the
liquid phase of the working fluid. The volume expansion and the
pressure increase of vapor will bulge the casing of the vapor
chamber, which causes unevenness of the vapor chamber. Thus, it is
an important issue to balance the compressive strength and the
tensile strength of the vapor chamber.
[0009] Therefore, it is an important issue for the present inventor
to solve the above problems.
SUMMARY OF THE INVENTION
[0010] The present invention is to provide a vapor chamber having a
composite supporting structure, whereby compressive strength and
tensile strength thereof can be increased simultaneously without
obstructing the circulation of liquid/vapor phases of the working
fluid and reducing the thermal-conducting efficiency thereof.
[0011] The present invention provides a vapor chamber having a
composite supporting structure, comprising: a flat sealed casing; a
wick structure arranged on inner walls of the flat sealed casing; a
working fluid filled within the flat sealed casing; and a composite
supporting structure mounted in the flat sealed casing, the
composite supporting structure having a waved supporting rack and
at least one supporting pillar.
[0012] In comparison with prior art, the present invention has
advantages features as follows:
[0013] According to the present invention, since the waved
supporting rack is configured to support an upper inner wall and a
lower inner wall of the flat sealed casing, the waved supporting
rack can increase the compressive strength of the vapor chamber.
Thus, the vapor chamber may not be sunken due to the compressive
force exerted by an electronic heat-generating element or during a
vacuum evacuation process.
[0014] Furthermore, since the waved supporting rack has therein a
plurality of separated channels for allowing the vapor of the
working fluid to flow through, the waved supporting rack will not
obstruct the circulation of liquid/vapor phases of the working
fluid nor adversely affect the thermal-conducting efficiency of the
vapor chamber.
[0015] Since the composite supporting structure of the present
invention further has at least one supporting pillar, both ends of
the supporting pillar are respectively connected to the flat sealed
casing or the wick structure, the flat sealed casing can be
prevented from bulging, thereby increasing the tensile strength of
the vapor chamber.
BRIEF DESCRIPTION OF DRAWING
[0016] FIG. 1 is an exploded perspective view showing a first
embodiment of the present invention;
[0017] FIG. 2 is an assembled perspective view showing the first
embodiment of the present invention;
[0018] FIG. 3 is an assembled cross-sectional view showing the
first embodiment of the present invention showing that the surface
of the flat sealed casing has not been pressed to form a recess
thereon while its inner wall abutting against the supporting
pillar;
[0019] FIG. 4 is an assembled cross-sectional view showing the
first embodiment of the present invention showing that the surface
of the flat sealed casing has been pressed to form a recess thereon
while its inner wall abutting against the supporting pillar;
[0020] FIG. 5 is a perspective view showing the first embodiment of
the present invention;
[0021] FIG. 6 is an assembled cross-sectional view showing the
first embodiment of the present invention;
[0022] FIG. 7 is an assembled cross-sectional view showing a second
embodiment of the present invention; and
[0023] FIG. 8 is an assembled cross-sectional view showing a third
embodiment of the present invention; and
[0024] FIG. 9 is an assembled cross-sectional view showing a fourth
embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0025] The detailed description and technical contents of the
present invention will become apparent with the following detailed
description accompanied with related drawings. It is noteworthy to
point out that the drawings is provided for the illustration
purpose only, but not intended for limiting the scope of the
present invention.
[0026] Please refer to FIGS. 1 and 6. The present invention
provides a vapor chamber 1 having a composite supporting structure
(referred to as "vapor chamber 1" hereinafter), which is configured
to allow for heat conduction and dissipation of an electronic
heat-generating element (not shown).
[0027] As shown in FIG. 6, the vapor chamber 1 includes a flat
sealed casing 10, a wick structure arranged on an inner surface of
the flat sealed casing 10, a working fluid 30 (indicated by dotted
lines) filled in the flat sealed casing 10, and a composite
supporting structure 40 mounted in the flat sealed casing 10.
[0028] The flat sealed casing 10 is made of metallic materials of
good thermal conductivity. The wick structure 20 is made by
sintering metallic powders or metallic meshes. The interior of the
wick structure 20 has a plurality of tiny pores to thereby generate
a capillary action. The wick structure 20 is arranged on an inner
wall of the flat sealed casing 10. The working fluid 30 is filled
inside the flat sealed casing 10. With the circulation of
liquid/vapor phases of the working fluid 30 in the flat sealed
casing 10, the heat generated by the electronic heat-generating
element (not shown) can be conducted to the outside
continuously.
[0029] According to a first embodiment shown in FIG. 1, the flat
sealed casing 10 of the vapor chamber 1 has a sealing side 11.
After the wick structure 20 and the composite supporting structure
40 are disposed in the flat sealed casing 10, the sealing side 11
is sealed to completely seal the flat sealed casing 10. In
addition, a filling/degassing tube 12 is provided to protrude from
one side of the flat sealed casing 10, by which the working fluid
30 can be filled in the flat sealed casing 10 and then the flat
sealed casing 10 is evacuated vacuum. Finally, the
filling/degassing tube 12 is sealed.
[0030] In the present embodiment, the composite supporting
structure 40 is accommodated in the flat sealed casing 11 and
includes a waved supporting rack 41 and at least one supporting
pillar 42 (seven shown in FIG. 1). The waved supporting rack 41 is
positioned to correspond to the electronic heat-generating element
(not shown) for supporting the upper surface and the lower surface
of the inner wall of the vapor chamber 1. The waved supporting rack
41 is capable of providing a sufficient strength for protecting the
flat sealed casing 10 from getting sunken due to a compressive
force exerted thereon by the electronic heat-generating element or
the external atmosphere.
[0031] The waved supporting rack 41 comprises at least two side
plates 411 and a plurality of waved pieces 412 connected between
the two side plates 411. Each of the waved pieces 412 is
constituted of a plurality of wave-crest sections 4121 and a
plurality of wave-recess sections 4122. The wave-crest sections
4121 of the any two adjacent waved pieces 412 are staggered to each
other. Similarly, the wave-recess sections 4122 of any two adjacent
waved pieces 412 are staggered to each other. Any two adjacent
waved pieces 412 are separated from each other to form a separated
channel 4123 there between. The wave-crest sections 4121 are
located in a level higher than that of the top surface of the side
plate 411, and the wave-recess sections 4122 are located in a level
lower than that of the bottom surface of the side plate 411.
[0032] As shown in FIG. 4, both ends of the supporting pillars 42
are respectively connected to the wick structure 20, thereby
protecting the flat sealed casing 10 from bulging. More
specifically, the supporting pillar 42 is a metallic pillar of any
suitable shape (such as circle, square, rectangle or oval shown in
FIG. 1). The supporting pillars 42 may be arranged towards four
corners inside the flat sealed casing 10 away from the waved
supporting rack 41. By means of any one of a thermal fusion process
at high temperature, sintering, brazing and soldering, the
supporting pillars 42 can be tightly connected to the wick
structure 20. In this way, even though the working fluid 30 inside
the vapor chamber 1 is vaporized, the tight connection between the
supporting pillar 42 and the wick structure 20 can prevent the flat
sealed casing 10 from bulging due to the internal vapor pressure of
the working fluid 30. Thus, the tensile strength of the vapor
chamber 1 can be increased.
[0033] Please refer to FIGS. 4 and 5. Alternatively, a forming tool
(not shown) is used to press the outer surface of the flat sealed
casing 10 against which the supporting pillar 42 abuts, thereby
forming a recess 13. In this way, a preload is exerted at this
location to thereby further increasing the tensile strength of the
vapor chamber 1.
[0034] Please refer to FIG. 7, which shows a second embodiment of
the present invention. The difference between the present
embodiment and the previous embodiment lies in that: a portion of
the wick structure 20 arranged on the inner lower wall of the flat
sealed casing 10 is first sintered. Then, the supporting pillars 42
are disposed in the flat sealed casing 10. Finally, the rest
portion of the wick structure 20 arranged on the upper inner wall
of the flat sealed casing 10 is subjected to a sintering process.
As a result, the upper end of each of the supporting pillars 42
directly abuts against the upper inner wall of the flat sealed
casing 10, and the wick structure 20 is connected to the supporting
pillars 42 after a heat fusion process. In other words, both ends
of the supporting pillar 42 are respectively connected to the upper
inner wall of the flat sealed casing 10 and the wick structure
20.
[0035] Please refer to FIG. 8, which shows a third embodiment of
the present invention. The difference between the present
embodiment and the previous embodiment lies in that: the supporting
pillars 42 are first disposed in the flat sealed casing 10. Then,
the wick structure 20 arranged on the upper and lower inner walls
of the flat sealed casing 10 are sintered, so that both ends of
each of the supporting pillars 42 abut against the upper and lower
inner walls of the flat sealed casing 10 respectively. After a heat
fusion process, the wick structure 20 is connected to the side
edges of the supporting pillar 42.
[0036] Please refer to FIG. 9, which shows a fourth embodiment of
the present invention. The difference between the present
embodiment and the previous embodiment lies in that: the waved
supporting rack 41 occupies substantially the whole internal space
of the flat sealed casing 10. The supporting pillar 42 is disposed
in an opening 43 formed inside the waved supporting rack 41. Like
the previous embodiments, the supporting pillar 42 can be connected
to the flat sealed casing 10 or the wick structure 20. In this way,
even though the working fluid 30 inside the vapor chamber 1 is
vaporized, the tight connection between the supporting pillars 42
and the wick structure 20 can prevent the flat sealed casing 10
from bulging due to the volume expansion of the vapor-phase working
fluid 30. Thus, the tensile strength of the vapor chamber 1 can be
increased.
[0037] In comparison with prior art, the present invention has
advantages features as follows:
[0038] According to the present invention, since the waved
supporting rack 41 is configured to support an upper inner wall and
a lower inner wall of the flat sealed casing 10, the waved
supporting rack 41 can increase the compressive strength of the
vapor chamber 1. Thus, the vapor chamber 1 may not be sunken due to
the compressive force exerted thereon by the electronic
heat-generating element or a vacuum evacuation process.
[0039] Furthermore, since the waved supporting rack 41 has therein
a plurality of separated channels 4123 for allowing the vapor of
the working fluid 30 to flow through, the waved supporting rack 41
will not obstruct the circulation of liquid/vapor phases of the
working fluid 30 nor adversely affect the thermal-conducting
efficiency.
[0040] Since the composite supporting structure 40 of the present
invention further has at least one supporting pillar 42 with its
both ends connected to the flat sealed casing 10 or the wick
structure 20, the flat sealed casing 10 can be prevented from
bulging, thereby increasing the tensile strength of the vapor
chamber 1.
[0041] Although the present invention has been described with
reference to the foregoing preferred embodiments, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
* * * * *