U.S. patent application number 13/160566 was filed with the patent office on 2011-12-15 for high speed modular jack.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to ZHI-CHENG ZHANG.
Application Number | 20110306242 13/160566 |
Document ID | / |
Family ID | 44139739 |
Filed Date | 2011-12-15 |
United States Patent
Application |
20110306242 |
Kind Code |
A1 |
ZHANG; ZHI-CHENG |
December 15, 2011 |
HIGH SPEED MODULAR JACK
Abstract
A modular jack (100) comprising a housing (200) defining an
upper port and a lower port vertically stacked under the upper
port, and a contact module (400) assembled to the housing. The
contact modules each comprises a first vertical PCB (46) and a
second vertical PCB (47) extending along a front-to-rear direction,
a vertical shield plate (50) disposed between the first vertical
PCB and the second vertical PCB, a mating module, and a horizontal
shield plate (418) disposed between the upper contact module and
the lower contact module. The horizontal shield plate is disposed
below the upper row of ports and above the lower row of ports and
connecting the vertical shield plate.
Inventors: |
ZHANG; ZHI-CHENG; (Kunshan,
CN) |
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
New Taipei
TW
|
Family ID: |
44139739 |
Appl. No.: |
13/160566 |
Filed: |
June 15, 2011 |
Current U.S.
Class: |
439/607.01 |
Current CPC
Class: |
H01R 13/6658 20130101;
H01R 13/518 20130101; H01R 13/6586 20130101; H01R 24/64
20130101 |
Class at
Publication: |
439/607.01 |
International
Class: |
H01R 13/648 20060101
H01R013/648 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 15, 2010 |
CN |
201020226109.4 |
Claims
1. A modular jack adapted to be mounted onto a horizontal mother
printed circuit board (PCB), comprising: a housing defining an
upper row of ports and a lower row of ports vertically stacked in
columns; and a plurality of contact modules each comprising: a
first vertical PCB and a second vertical PCB extending along a
front-to-rear direction; a vertical shield plate disposed between
the first vertical PCB and the second vertical PCB; a mating module
having an upper set of mating contacts electrically connecting one
port in the upper row to the first vertical PCB and a lower set of
mating contacts electrically connecting a lower port stacked in the
same column to the second vertical PCB; and a horizontal shield
plate disposed between the upper contact module and the lower
contact module, the horizontal shield plate being disposed below
the upper row of ports and above the lower row of ports and
connecting the vertical shield plate.
2. The modular jack according to claim 1, wherein the contact
module further comprises a bracket supporting the first vertical
PCB and the second vertical PCB and encapsulating a main part of
the vertical shield plate.
3. The modular jack according to claim 2, wherein the bracket has a
first plastic body and a second plastic body sandwiching opposite
side of the vertical shield plate.
4. The modular jack according to claim 1, wherein the contact
module has a top face, the vertical shield plate having an upper
edge extending upwardly to the top face.
5. The modular jack according to claim 4, wherein the housing
defines a top slot and the upper edge of the vertical shield plate
is received in the top slot.
6. A modular jack adapted to be mounted onto a horizontal mother
PCB, comprising: a housing defining an upper row of ports and a
lower row of ports vertically stacked in columns; and a plurality
of contact modules each comprising: a bracket having a vertical
shield plate extending along a front-to-rear direction, a first
plastic body and a second plastic body on opposite sides of the
vertical shield plate; a first vertical PCB and a second vertical
PCB being arranged on opposite sides of the bracket and parallel to
the vertical shield plate; and a mating module having an upper set
of mating contacts electrically connecting one port in the upper
row to the first vertical PCB and a lower set of mating contacts
electrically connecting a lower port stacked in the same column to
the second vertical PCB.
7. The modular jack according to claim 6, wherein the contact
module has a top face and the vertical shield plate extends to said
top face.
8. The modular jack according to claim 6, wherein the contact
module has a transferring module electrically connecting the first
vertical PCB and the second vertical PCB to the horizontal mother
PCB, the transferring module defining a slot, the vertical shield
plate having a bottom edge extending downwardly through the
transferring module.
9. The modular jack according to claim 8, wherein a plurality of
ground tails continually extend from the bottom edge of the
vertical shield plate.
10. The modular jack according to claim 6, wherein the mating
module has an upper horizontal PCB bearing the upper set of mating
contacts and a lower horizontal PCB bearing the lower set of mating
contacts.
11. The modular jack according to claim 10, wherein the mating
module has a front plastic body supporting the upper horizontal PCB
and the lower horizontal PCB.
12. A modular jack comprising: a housing defining plural pairs of
upper and lower ports; a plurality of contact modules disposed in
the housing, each of said contact modules corresponding to one
corresponding pair of upper and lower ports, and including a
bracket sandwiched by a pair of vertical PCBs (printed circuit
board) and sandwiching a center vertical shielding plate, and a
transferring module located below the bracket and including a
plurality of contacts electrically and mechanically connected to
bottom portions of the vertical PCBs, and further including an
opening to allow a grounding leg of the center vertical shielding
plate to extend therethrough downwardly; wherein each of said
contact modules further includes a mating module with terminals
thereon to electrically connect to the corresponding vertical
PCBs.
13. The modular jack as claimed in claim 12, wherein the shielding
plate defines grounding arms respectively mechanically and
electrically connected to the corresponding vertical PCBs.
14. The modular jack as claimed in claim 12, wherein the mating
module electrically connects to the corresponding vertical PCBs via
a pair of horizontal PCBs.
15. The modular jack as claimed in claim 14, wherein a horizontal
shielding plate is located between said pair of horizontal PCBs and
electrically and mechanically connected to the shielding plate.
16. The modular jack as claimed in claim 14, wherein coupling
between the horizontal PCB and the vertical PCB is made via a slot
vs. edge structure.
17. The modular jack as claimed in claim 14, wherein said mating
module further includes a bracket to separate the pair of
horizontal PCBs.
18. The modular jack as claimed in claim 14, wherein the center
vertical shielding plate defines a cutout in which the pair of
horizontal PCBs and the horizontal shielding plate are
received.
19. The modular jack as claimed in claim 14, wherein said pair of
horizontal PCBs and said pair of vertical PCBs are coupled in a one
by one condition.
20. The modular jack as claimed in claim 14, wherein said pair of
horizontal PCBs are at upper and lower levels corresponding to the
upper and lower ports, and configured to be transversely offset
from each other for complying and coupling with the corresponding
vertical PCBs, respectively.
Description
[0001] This application is one of three patent applications having
a same title of "HIGH SPEED MODULAR JACK" and being filed on a same
date.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to modular jack, and
particularly, to a high speed modular jack having stacked mating
ports.
[0004] 2. Description of Related Art
[0005] U.S. Pat. No. 6,655,988, issued to Simmons et al. on Dec. 2,
2003, discloses a stacked jack modular jack assembly having a
multi-port housing. The assembly includes the housing, a plurality
of jack modules, a plurality of LEDs, and a plurality of LED
modules. The jack module 10 includes an outer insulating housing
holding a jack subassembly. The jack subassembly comprises an upper
jack portion, an intermediate shield, and a lower jack portion, a
lower housing portion, two vertical component boards, and a
vertical shield member disposed between the two vertical component
boards.
[0006] U.S. Pat. No. 6,659,807, issued to Zheng et al. on Dec. 9,
2003, discloses another multiport modular jack. The modular jack
has an insulating housing and a plurality of jack subassemblies.
Each jack subassembly has a base member, a first and second
horizontal printed circuit boards (PCB), a pair of insert portions
mounted on corresponding PCBs, and a plurality of terminals insert
molded in the insert portions. One of the insert portions has a
plurality of first positioning posts and first mounting holes, the
other insert portion has a plurality of second positioning posts
and mounting holes second stably engaging with the first mounting
holes and the first positioning posts.
[0007] U.S. Pat. No. 6,511,348, issued to Wojtacki et al. on Jan.
28, 2003, discloses another multiport modular jack. The modular
jack comprises an outer housing and a plurality of modular jack
subassemblies. The modular jack subassemblies are comprised of an
elongate beam support having a plurality of modular jack contacts
on both sides thereof. The contacts extend into printed circuit
board contacts and extend to and beyond the side edges of the
elongate beam support, leaving the space above and below the
printed circuit board contacts and the beam support free, to
accommodate signal conditioning component. Two printed circuit
board modules are mounted orthogonally to the side edges of the
beam support and include signal conditioning components. A vertical
shield plate is interposed between two adjacent subassemblies.
[0008] Such multi-port connectors are used for networks and
operated at high rates of one gigabyte and higher so that excellent
conditioning of the signals to be transferred is required.
Shielding is therefore normally necessary in order for example to
provide a so-called Common Mode Rejection (CMR) and to guarantee a
specified electromagnetic compatibility (EMC) and/or resistance to
electromagnetic disturbance. For the purpose of conditioning the
signals it is therefore further necessary to incorporate within the
arrangement corresponding components such as particularly magnet
coils but also capacitive components in order to correspondingly
condition the signals.
[0009] An object of the invention consequently consists of
providing a new and substantially improved modular jack connector
structure with respect to the prior art and particularly for use in
the case of Ethernet networks so as to provide a modular jack
connector with complete shielding between any two adjacent ports
and required signals conditioning.
SUMMARY OF THE INVENTION
[0010] In accordance with the invention, a modular jack connector
is therefore provided adapted to be mounted onto a horizontal
mother PCB. The modular jack comprises a housing and a plurality of
contact modules assembled to the housing. The housing defining an
upper row of ports and a lower row of ports vertically stacked in
columns. The plurality of contact modules each comprises a first
vertical PCB and a second vertical PCB extending along a
front-to-rear direction, a vertical shield plate disposed between
the first vertical PCB and the second vertical PCB, a mating module
having an upper set of mating contacts electrically connecting one
port in the upper row to the first vertical PCB and a lower set of
mating contacts electrically connecting a lower port stacked in the
same column to the second vertical PCB, and a horizontal shield
plate disposed between the upper contact module and the lower
contact module. The horizontal shield plate is disposed below the
upper row of ports and above the lower row of ports and connecting
the vertical shield plate.
[0011] In accordance with the invention, another modular jack
connector is therefore provided to be mounted onto a horizontal
mother PCB. The modular jack comprises a housing defining an upper
port and a lower port vertically stacked under the upper port; and
a contact module assembled to the housing. The housing defines an
upper row of ports and a lower row of ports vertically stacked in
columns. The plurality of contact modules each comprises a bracket
having a vertical shield plate extending along a front-to-rear
direction, a first plastic body and a second plastic body on
opposite sides of the vertical shield plate, a first vertical PCB
and a second vertical PCB being arranged on opposite sides of the
bracket and parallel to the vertical shield plate, and a mating
module having an upper set of mating contacts electrically
connecting one port in the upper row to the first vertical PCB and
a lower set of mating contacts electrically connecting a lower port
stacked in the same column to the second vertical PCB.
[0012] Other objects, advantages and novel features of the
invention will become more apparent from the following detailed
description of a preferred embodiment when taken in conjunction
with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] For a more complete understanding of the present invention,
and the advantages thereof, reference is now made to the following
descriptions taken in conjunction with the accompanying drawings,
in which:
[0014] FIG. 1 is a perspective view of a stacked modular jack
according to the present invention, mounted on a horizontal mother
PCB;
[0015] FIG. 2 is a partly exploded view of the modular jack shown
in FIG. 1;
[0016] FIG. 3 is another partly exploded view of the modular jack
shown in FIG. 1;
[0017] FIG. 4 is a partly exploded view of the contact module shown
in FIG. 2;
[0018] FIG. 5 is another partly exploded view of the contact module
shown in FIG. 2;
[0019] FIG. 6 is a partly exploded view of the mating contact
module shown in FIG. 4;
[0020] FIG. 7 is a side view of the contact module shown in FIG. 4,
with part of components removed therefrom;
[0021] FIG. 8 is still another partly exploded view of the contact
module shown in FIG. 2;
[0022] FIG. 9 is a perspective view of the housing shown in FIG.
2;
[0023] FIG. 10 is a scaled view of a circled portion shown in FIG.
9;
[0024] FIG. 11 is a scaled view of a circled portion shown in FIG.
2;
[0025] FIG. 12 is a back view of two contact modules and a shield
module shown in FIG. 2, with each aligned separated position in a
horizontal direction;
[0026] FIG. 13 is a perspective view of the shield module shown in
FIG. 12; and
[0027] FIG. 14 is a cross-section view of the modular jack shown in
FIG. 1, with the outer shell and the gasket removed.
DETAILED DESCRIPTION OF THE INVENTION
[0028] Reference will now be made to the drawing figures to
describe the present invention in detail.
[0029] Referring to FIG. 1, a perspective view of a 2.times.4-port
modular jack 100 is shown. The modular jack 100 is used to be
mounted on a horizontal printed circuit board 120 (horizontal
mother PCB). The modular jack 100 has an upper row of ports 204 and
a lower row of ports 204, each of which is used to receive a
modular plug (not shown) with a high speed of 10 Gigbit/second. The
modular jack 100 is covered with an outer metal shell including a
front outer shell 126 and a rear outer shell 128. The front outer
shell 126 is equipped with a bracket board 124 and a gasket 122 of
a conductive rubber supported by the bracket board 124. The gasket
122 surrounds the front end of modular jack 100. When the modular
jack 100 is mounted into a panel (not shown), the gasket 122 is
pressed between the bracket board 124 and the panel.
[0030] Referring to FIGS. 2-4, the modular jack 100 further
comprises a insulating housing 200, four contact modules 400, and
three shield modules 54. It is preferred that two of the contact
modules 400 are assembled into a contact subassembly with a bottom
printed circuit board 401. Each contact module 400 comprises a
center bracket 500, a transferring module 52, a left printed
circuit board 46, a right printed circuit board 47, and a mating
module 41.
[0031] Referring to FIGS. 4-6, the mating module 41 comprises an
upper set of mating contacts 42, a lower set of mating contacts 44,
an upper PCB 43 bearing the upper set of mating contacts 42, a
lower PCB 45 bearing the lower set of mating contacts 44, a front
plastic body 415 bearing the upper PCB 43 and the lower PCB 45, and
a horizontal shield plate 418 forwardly inserted into a slot
defined in the front plastic body 415 between the upper PCB 43 and
the lower PCB 45. The upper PCB 43 and the lower PCB 45 are
designed with circuits for balancing crosstalk between signal
channels in the same port.
[0032] The front plastic body 415 is unitarily injection molded
with a horizontal board 410. The horizontal board 410 has opposite
top face and bottom face. The front plastic body 415 forms two
upper guide slots 414 laterally opening face to face and an upper
post 412 on the top face, and two lower guide slots 414 laterally
opening face to face and a lower post 412 on the bottom face. When
the upper and the lower circuit boards 43, 45 are assembled to the
front plastic body 415, the circuit board 43, 45 are obliquely
sliding onto the top and the bottom face under the guide of the
guide slots 414 and then positioned by the post 412.
[0033] Referring to FIGS. 4-5 and 7-8, the center bracket 500
includes a vertical shield plate 50, a left plastic body 48 and a
right plastic body 49 sandwich the vertical shield plate 50. The
left plastic body 48 has three fastening posts 486 and the right
plastic body 49 and the vertical shield plate 50 define three holes
503 for holding the fastening posts 486. The vertical shield plate
50 forms a pair of spring arms 502 extending forwardly. The spring
arms 502 clip the horizontal shield plate 418. The vertical shield
plate 50 further forms a plurality of grounding tails 504 for
connecting the horizontal mother PCB 120, a left arm 506 connecting
the left PCB 46 and a right arm 506 connecting the right PCB 47.
The vertical shield plate 50 forms a pair of project tips 509
extending rearward through the rear outer shell 128 and then are
riveted oppositely laterally for fixing the rear outer shell 128.
The center bracket 500 has a front slot 560 receiving the mating
module 41 therein. The front slot 560 has a pair of side walls (not
labeled). The side walls have protrusions 485, 495 in front of the
left PCB 46 and the right PCB 47. The protrusions 485, 495 mate
with the mating module 41.
[0034] The vertical shield plate 50 has a marginal edge being
scaled as possible so that the crosstalk is better shielded between
the upper ports 204 and the lower ports 204. In the present
embodiment, the marginal edge extends beyond the marginal edges of
the left PCB 46 and the right PCB 47 in all directions. The
vertical shield plate 50 has an upper edge 501 extending along
upwardly beyond a top face of the contact module 400 and reaching
the outer shell 126, 128. The housing 200 defines a top slot 201 to
receive the upper edge 501 of the vertical shield plate 50.
[0035] The left PCB 46 and the right PCB 47 sandwich opposite sides
of the center bracket 500. The left PCB 46 and the right PCB 47
have interior faces facing to each other and a plurality of
electronic components mounted thereon. The left plastic body 48
defines cavities receiving the electronic components on the left
PCB 46. The left PCB 46 defines a lower slot 464 opening forwardly
and receiving a left edge 451 of the lower PCB 45. A plurality of
conductive pads 453 are disposed on opposite surface of the lower
PCB 45 and lined along the left edge 451. A corresponding number of
conductive pads 466 are disposed along opposite sides of the lower
slot 464 on an exterior face of the left PCB 46. A number of
connecting conductors 468 electrically connect the conductive pads
453 of the lower PCB 45 to the conductive pads 466 of the left PCB
46. The right plastic body 49 defines cavities receiving the
electronic components on the right PCB 47. The right PCB 47 defines
an upper slot 474 opening forwardly and receiving a right edge 431
of the upper PCB 43. A plurality of conductive pads 433 are
disposed on opposite surface of the lower PCB 43 and lined along
the left edge 431. A corresponding number of conductive pads 476
are disposed along opposite sides of the upper slot 474 on an
exterior face of the right PCB 47. A number of connecting
conductors 478 electrically connect the conductive pads 433 of the
upper PCB 43 to the conductive pads 476 of the right PCB 47.
[0036] It is noted that as an alternative embodiment of the present
invention, the upper PCB 45 and the left PCB 46 are redesigned to
be electrically connected, and the lower PCB 43 and the right PCB
47 are redesigned to be electrically connected.
[0037] Referring to FIG. 8, the transferring module 52 comprises a
plurality of left transferring contacts 522 electrically connecting
the left PCB 46 to the horizontal mother PCB 120, a plurality of
right transferring contacts 524 electrically connecting the right
PCB 47 to the horizontal mother PCB 120, and a bottom plastic body
520 fixing the left transferring contacts 522 and the right
transferring contacts 524. The bottom plastic body 520 defines a
slot 526 between the left transferring contacts 522 and the right
transferring contacts 524. The shield plate 50 extends downwardly
through the slot 526 and the ground tails 504 continue extending
there from.
[0038] Referring to FIGS. 9-11, the insulating housing 200 defines
2.times.4 cavities 204 to form the 2.times.4 ports of the modular
jack 100. The upper row of cavities 204 and the lower row of
cavities 204 are separated by a horizontal wall 202. Any adjacent
two columns ports are separated by a vertical wall 203. The
insulating housing 200 forms eight slots 206 behind each of the
cavities 204. The mating contacts 42, 44 are fixed to the
horizontal wall 202. Each of the mating contacts 42, 44 comprises a
contacting arm 420 and a tapered free end 421. The free ends 421
are received in respective slots 206. The mating contacts 42, 44
are formed and punched from a sheet material. Each of the mating
contacts 42, 44 has two smooth surfaces 423 and two punched
surfaces 424. Each of the mating contacts 42, 44 forms two round
front corners 425 connecting a front smooth surface 423 and two
punched surfaces 424, so that when the contact module 400 are
inserted into the insulating housing 200, scratch to the housing
200 and the chance of damage to the mating contacts 42, 44 is
greatly decreased.
[0039] Referring to FIGS. 12-14, each of the three shield modules
54 is disposed between two adjacent contact modules 400. The shield
module 54 comprises a vertical shield 548 and a plastic body 55
over molding the vertical shield 548. The vertical shield 548
extends forwardly beyond the upper mating contacts 43 and the lower
mating contacts 45, so that a more complete electrical shielding is
formed between adjacent contact modules 400. The vertical shield
548 forms a plurality of ground tails 546 for electrically
connecting the horizontal mother PCB 120.
[0040] The plastic body 55 defines a left slot 552 and a right slot
553 extending along a front-to-rear direction on opposite side. The
left slot 552 mates a rib (not shown) of the housing and receives
the right edge 431 of the upper PCB 43. The right slot 553 mates a
rib 207 of the housing and receives the left edge 451 of the lower
PCB 45. The shield plate 548 is bent according to the shape of the
left slot 552 and the right slot 553, so that the plastic body 55
could be easier for injection molding. The plastic body 55 further
forms two ribs 556 extending along the front-to-rear direction and
oppositely protruding below the contact modules 400, which helps to
fix the contact modules 400 and provide a press force when the
modular jack 100 is mounted onto the PCB 120.
[0041] It is to be understood, however, that even though numerous
characteristics and advantages of the present invention have been
set forth in the foregoing description, together with details of
the structure and function of the invention, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *