U.S. patent application number 12/773265 was filed with the patent office on 2011-11-10 for server and cooler moduel arrangement.
Invention is credited to Po-Ching Chen.
Application Number | 20110273840 12/773265 |
Document ID | / |
Family ID | 44801404 |
Filed Date | 2011-11-10 |
United States Patent
Application |
20110273840 |
Kind Code |
A1 |
Chen; Po-Ching |
November 10, 2011 |
SERVER AND COOLER MODUEL ARRANGEMENT
Abstract
A server and cooler module arrangement includes a server
accommodating a stack of an operating system and an electronic
device in an accommodation chamber therein at one side and an
access device unit in the accommodation chamber at an opposite
side, and a cooler module, which comprises a rack mounted in a
partition way in the accommodation chamber between the stack of
operating system and electronic device and the access device unit
and a plurality of fans respectively adjustably mounted in
respective open frames at different elevations and adapted for
drawing air or sending air toward different heat sources in the
operating system, the electronic device and the access device unit
for quick dissipation of waste heat.
Inventors: |
Chen; Po-Ching; (Hsichih
City, TW) |
Family ID: |
44801404 |
Appl. No.: |
12/773265 |
Filed: |
May 4, 2010 |
Current U.S.
Class: |
361/679.48 |
Current CPC
Class: |
H05K 7/20727
20130101 |
Class at
Publication: |
361/679.48 |
International
Class: |
G06F 1/20 20060101
G06F001/20 |
Claims
1. A server and cooler module arrangement, comprising: a server,
said server comprising an accommodation chamber, a partition way
defined in said accommodation chamber, an operating system and an
electronic device arranged in a stack in said accommodation chamber
at one side relative to said partition way, an access device unit
arranged in said accommodation chamber at an opposite side relative
to said partition way, and a plurality of thermal zones located on
an outer side of said operating system in communication with the
space outside said server; and a cooler module, said cooler module
comprising a rack mounted in said partition way, said rack having a
plurality of open frames, and a plurality of fans respectively
adjustably mounted in said open frames at different elevations and
respectively aimed at said operating system and said electronic
device.
2. The server and cooler module arrangement as claimed in claim 1,
wherein said operating system comprises a circuit board carrying a
circuit layout, a power supply device and an isolation frame
covering said circuit board and said power supply device.
3. The server and cooler module arrangement as claimed in claim 1,
wherein said electronic device is stacked on said operating system,
comprising at least one hard disk drive and at least one
CD-ROM.
4. The server and cooler module arrangement as claimed in claim 1,
wherein said access device unit comprises at least one hard disk
drive, at least one CD-ROM and at least one multimedia access
device.
5. The server and cooler module arrangement as claimed in claim 1,
wherein said open frames of said rack are rectangular open frames;
said cooler module further comprises a plurality of baffles affixed
to said rectangular open frames of said rack outside said fans.
6. The server and cooler module arrangement as claimed in claim 1,
wherein said rectangular open frames are formed integrally with one
another.
7. The server and cooler module arrangement as claimed in claim 1,
wherein said open frames are separately made and then fastened
together to form said rack.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to server cooling technology
and more particularly, to a server and cooler module arrangement,
which has fans arranged at different elevations to aim at different
heat sources for quick dissipation of waste heat during operation
of the server.
[0003] 2. Description of the Related Art
[0004] Following fast development of semiconductor technology, the
packaging density of electronic devices is comparatively higher,
and the size of electronic devices is comparatively smaller.
High-speed electronic devices consume much electric energy, and
release much heat energy during operation. If waste heat is not
quickly carried away, the problems of electron ionization and
thermal stress may occur, lowering system stability and reliability
and shortening the lifespan of the electronic components.
Therefore, heat dissipation is an important issue to be
settled.
[0005] Nowadays, computer has been intensively used as tool means
in many different fields for different purposes. The life cycle of
computer becomes short to meet marketing requirement. In
consequence, the replacement rate and culling rate of computer
electronic components, such as CPU (central processing unit) and
GPU (graphic processing unit), are high. During operation of a
computer, the CPU(s), IC chips, power supply device, CD-ROM and
other electronic components of the operating system will release
waste heat. If waste heat from the CPU(s), IC chips, power supply
device, CD-ROM and other electronic components of the operating
system is not quickly dissipated, it will be accumulated in the
computer, affecting normal functioning of the CPU(s), IC chips,
power supply device, CD-ROM and electronic components of the
operating system. In order to prevent accumulation of waste heat in
a computer, for example, server computer, multiple cooling fans are
usually used. Cooling fans use air as a medium to dissipate heat
without damaging electronic component parts. Subject to a
reasonable design, cooling fans can effectively carry waste heat
away from a server computer, avoiding accumulation of waste
heat.
[0006] According to the prior art, as shown in FIG. 7, a bracket B
is mounted inside a server A to support a plurality of cooling fans
B1 that are operable to send cooling air toward a circuit board A1,
a power supply device A2 and electronic devices A3 (mobile HDD,
CD-ROM, and etc.). The cooling fans B1 are fixedly mounted on the
bracket B at fixed locations to send air in predetermined
directions. According to this design, the positions of the cooling
fans B1 cannot be separately adjusted to aim at the respective heat
sources at the circuit board A1, power supply device A2 and
electronic devices A3. Thus, the cooling fans B1 cannot accurately
send air toward the respective heat sources at the circuit board
A1, power supply device A2 and electronic devices A3 to effectively
carry waste heat away from the internal space of the server A to
the outside open air.
[0007] Therefore, the aforesaid prior art design has drawbacks as
follows:
[0008] 1. To fit different operation and control requirements, the
server A may have new electronic parts and electronic devices A3
installed therein. When new electronic parts and electronic devices
A3 are installed in the server A, the cooling fans B1 cannot be
adjusted to send cooling air toward the new heat sources, causing
accumulation of waste heat in the server A.
[0009] 2. The circuit board A1 and the power supply device A2 may
be respectively equipped with a respective mini fan for cooling.
The working directions of the cooling fans B1 may be unable to
effectively carry exhaust air of the mini fans of the circuit board
A1 and the power supply device A2 away from the internal space of
the server A, causing accumulation of waste heat in the server
A.
[0010] Therefore, it is desirable to provide a server and cooler
module arrangement, which dissipates waste heat rapidly during
operation of the server, preventing accumulation of waste heat in
the server.
SUMMARY OF THE INVENTION
[0011] The present invention has been accomplished under the
circumstances in view. It is one object of the present invention to
provide a server and cooler module arrangement, which allows
adjustment of the positions of cooling fans subject to the
locations of the heat sources so that waste heat can be quickly
carried away from the server during operation of the server.
[0012] To achieve this and other objects of the present invention,
a server and cooler module arrangement comprises a server, and a
cooler module mounted in the server for carrying waste heat out of
the server efficiently. The server comprises an accommodation
chamber, a partition way defined in the accommodation chamber, an
operating system and an electronic device arranged in a stack in
the accommodation chamber at one side relative to the partition
way, an access device unit arranged in the accommodation chamber at
an opposite side relative to the partition way, and a plurality of
thermal zones located on an outer side of the operating system in
communication with the space outside the server. The cooler module
comprises a rack mounted in the partition way and having a
plurality of open frames, and a plurality of fans respectively
adjustably mounted in the open frames and respectively aimed at the
operating system, the electronic device and the access device unit
for drawing air or sending air toward the operating system, the
electronic device and the access device unit to dissipate waste
heat.
[0013] Further, the fans are adjustably mounted in the open frames
of the rack at different elevations and respectively aimed at the
operating system, the electronic device and the access device unit
for drawing air or sending air toward different heat sources at the
operating system, the electronic device and the access device unit
for quick dissipation of waste heat.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is an elevational view of a server and cooler module
arrangement according to the present invention.
[0015] FIG. 2 illustrates the internal structure of the server and
cooler module arrangement in accordance with the present invention
after opening of the top cover panel.
[0016] FIG. 3 is a perspective view of the server and cooler
arrangement according to the present invention.
[0017] FIG. 4 is an exploded view of the server and cooler module
arrangement according to the present invention.
[0018] FIG. 5 is a schematic sectional side view of the server and
cooler module arrangement according to the present invention.
[0019] FIG. 6 is an elevational assembly view of a part of the
server and cooler module arrangement according to the present
invention.
[0020] FIG. 7 illustrates the arrangement of fans in a server
according to the prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0021] Referring to FIGS. 1.about.5, a server and cooler module
arrangement in accordance with the present invention is shown
comprising a server 1 and a cooler module 2.
[0022] The server 1 comprises an accommodation chamber 10, an
operating system 11 and an electronic device 12 arranged in a stack
in the accommodation chamber 10 at one side, an access device unit
13 arranged in the accommodation chamber 10 at an opposite side,
and a partition way 14 defined between the stack of the operating
system 11 and electronic device 12 and the access device unit 13.
The operating system 11 comprises a circuit board 111 carrying a
circuit layout, a power supply device 112 and other requisite
electronic components, an isolation frame 113 covering the circuit
board 111 and the power supply device 112 and a plurality of
thermal zones 114 located on the isolation frame 113 adjacent to
the circuit board 111 in communication between the space inside the
operating system 11 and the space outside the server 1. Further,
the electronic device 12 is stacked on the top side of the
isolation frame 113 of the operating system 11.
[0023] The cooler module 2 comprises a rack 21 having a plurality
of open frames 210, and a plurality of fans 22 respectively
adjustably mounted in the open frames 210 at different elevations.
The mounting arrangement between each fan 22 and the associating
open frame 210 allows adjustment of the fan 22 relative to the rack
21 to the desired elevation and position.
[0024] During installation, the rack 21 of the cooler module 2 is
mounted in the partition way 14 inside the accommodation chamber 10
between the stack of the operating system 11 and electronic device
12 and the access device unit 13, and then the fans 22 are
respectively mounted in the open frames 210 and respectively
adjusted to the respective optimal positions corresponding to the
circuit board 111, the power supply device 112, the electronic
device 12 and the access device unit 13 to draw air or send air,
avoiding accumulation of heat in the server 1.
[0025] The aforesaid electronic device 12 and access device unit 13
include at least one mobile hard disk drive (2.5-inch HDD or
3.5-inch HDD), at least one CD-ROM, at least one multimedia access
device and other electronic tools for server application. The
thermal zones 114 are heat dissipation holes in communication
between the inside space of the server 1 and the atmosphere. The
open frames 210 are rectangular frames spaced on the rack 21. The
fans 22 are respectively mounted in the open frames 210 and
respectively adjusted to the desired elevations and positions and
then respectively affixed to the rack 21 with fastening members,
for example, screws. Further, the open frames 210 can be formed
integral with one another, i.e., the rack 21 is a single-piece
member. Alternatively, the open frames 210 can be separately made
and then fastened together to form the rack 21. After installation
of the fans 22 in the open frames 210 of the rack 21, baffles 211
are affixed to the rack 21 to block the gaps in the open frames 210
outside the fans 22, avoiding air rampant, backflow or air
disturbance, and lowering the noise level.
[0026] Referring to FIG. 6 and FIGS. 3-5 again, the partition way
14 is defined in the server 1 between the stack of the operating
system 11 and electronic device 12 and the access device unit 13 in
the accommodation chamber 10, and the rack 21 of the cooler module
2 is mounted in the partition way 14 inside the accommodation
chamber 10 to hold the fans 22 in the open frames 210 thereof in
the respective optimal positions corresponding to the circuit board
111, the power supply device 112, the electronic device 12 and the
access device unit 13. Thus, the fan 22 can draw air or send air to
carry waste heat away from the heat source (CPU, IC chip, interface
card or electronic component at the circuit board 111 or in the
electronic device 12) of the server 1 through the thermal zones
114. The fans 22 can also carry exhaust air from a system fan 115
of the operating system 11 and the internal fan (not shown) of the
power supply device 12 out of the server 1 through the thermal
zones 114, avoiding accumulation of heat in the accommodation
chamber 10 of the server 1.
[0027] Further, the stack of the operating system 11, the
electronic device 12 and the access device unit 13 are arranged in
the accommodation chamber 10 subject to their heat energy releasing
characteristics so that high energy heat sources and low energy
heat sources are arranged at different elevations. Further, the
fans 22 are vertically adjustably mounted in the open frames 210 of
the rack 21 to draw air or send air toward the respective heat
sources, thereby carrying waste heat away from the respective heat
sources of the server 1 to the outside open air through the thermal
zones 114 rapidly and efficiently. Thus, the effective utilization
of the space of the accommodation chamber 10 for the arrangement of
different heat sources of the server 1 avoids accumulation of waste
heat in a particular place inside the accommodation chamber 10,
facilitating heat dissipation.
[0028] Further, the access device unit 13, which is mounted in the
accommodation chamber 10 at one side of the partition way 14
opposite to the stack of the operating system 11 and electronic
device 12, comprises a casing 131 that defines therein a plurality
of compartments 130, and at least one mobile hard disk drive
(2.5-inch HDD or 3.5-inch HDD) and at least one CD-ROM and/or at
least one multimedia access device respectively mounted in the
compartments 130 inside the casing 131. The modularized design of
the access device unit 13 the casing 131 in facilitates its
installation in the accommodation chamber 10. Thus, the
installation of the access device unit 13 requires less
installation time and labor.
[0029] It is to be understood that the disclosure of the aforesaid
preferred embodiment is simply an example of the present invention
but not a limitation. In general, the server and cooler module
arrangement comprises a server 1, which defines therein an
accommodation chamber 10 and a partition way 14 in the
accommodation chamber 10 and accommodates a stack of an operating
system 11 and an electronic device 12 in the accommodation chamber
10 at one side relative to the partition way 14 and an access
device unit 13 in the accommodation chamber 10 at an opposite side
relative to the partition way 14, and a cooler module 2, which
comprises a rack 21 mounted in the partition way 14 in the
accommodation chamber 10 of the server 1 and a plurality of fans 22
respectively adjustably mounted in respective open frames 210 at
two opposite sides at different elevations and adapted for drawing
air or sending air toward different heat sources in the operating
system 11, the electronic device 12 and the access device unit 13
for quick dissipation of waste heat. The positions of the fans 22
are adjustable so that the fans 22 can draw air or send air to
carry waste heat away from the operating system 11, the electronic
device 12 and the access device unit 13 efficiently, avoiding
accumulation of waste heat in the server 1 and assuring smooth
functioning of the operating system 11, the electronic device 12
and the access device unit 13.
[0030] As indicated above, the server and cooler module arrangement
of the present invention has the following advantages and
features:
[0031] 1. The operating system 11 and the electronic device 12 are
arranged in a stack in the accommodation chamber 10, and the
positions of the fans 22 are adjustable subject to the elevations
of the heat sources in the operating system 11 and the electronic
device 12 so that the fans 22 can draw air or send air to carry
waste heat away from the operating system 11 and the electronic
device 12 efficiently.
[0032] 2. During operation of the system fan 115 of the operating
system 11 and the internal fan of the power supply device 12 to
dissipate waste heat, the fans 22 of the cooler module 2 are
operated to carry exhaust air from the system fan 115 of the
operating system 11 and the internal fan of the power supply device
12 out of the server 1 through the thermal zones 114, avoiding
accumulation of waste heat in the accommodation chamber 10 of the
server 1.
[0033] In conclusion, the operating system and the electronic
device are arranged in a stack in the accommodation chamber of the
server at one side, the access device unit is arranged in the
accommodation chamber at an opposite side, and the rack of the
cooler module is set in the accommodation chamber between the stack
of operation system and electronic device and the access device
unit with the fans respectively adjustably mounted in respective
open frames at different elevations for drawing air or sending air
toward different heat sources in the operating system, the
electronic device and the access device unit for quick dissipation
of waste heat.
[0034] Although a particular embodiment of the invention has been
described in detail for purposes of illustration, various
modifications and enhancements may be made without departing from
the spirit and scope of the invention.
* * * * *