U.S. patent application number 13/183439 was filed with the patent office on 2011-11-03 for light emitting diode package structure and manufacturing method therefor.
This patent application is currently assigned to EVERLIGHT ELECTRONICS CO., LTD.. Invention is credited to Cheng-Yi Chang, Ming-Kuei Lin, Chih-Chia Tsai.
Application Number | 20110266589 13/183439 |
Document ID | / |
Family ID | 41052691 |
Filed Date | 2011-11-03 |
United States Patent
Application |
20110266589 |
Kind Code |
A1 |
Tsai; Chih-Chia ; et
al. |
November 3, 2011 |
Light Emitting Diode Package Structure and Manufacturing Method
Therefor
Abstract
A light emitting diode (LED) package and a manufacturing method
therefor are disclosed. In one aspect, a manufacturing method of a
light emitting diode package may: heat a first light transmission
insulation material to cause the first light transmission
insulation material to become a sticky member; connect a lead frame
to the sticky member; perform a chip-bonding step that bonds at
least one light-emitting diode chip on the sticky member using a
light transmission glue; encapsulate the at least one
light-emitting diode chip with a second light transmission
insulation material; and perform a drying step that forms the
sticky member and the second light transmission insulation material
into shape.
Inventors: |
Tsai; Chih-Chia; (New Taipei
City, TW) ; Chang; Cheng-Yi; (New Taipei City,
TW) ; Lin; Ming-Kuei; (New Taipei City, TW) |
Assignee: |
EVERLIGHT ELECTRONICS CO.,
LTD.
New Taipei City
TW
EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD.
Shanghai
CN
|
Family ID: |
41052691 |
Appl. No.: |
13/183439 |
Filed: |
July 15, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12398174 |
Mar 4, 2009 |
8008100 |
|
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13183439 |
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Current U.S.
Class: |
257/99 ;
257/E33.056; 257/E33.059; 438/26 |
Current CPC
Class: |
H01L 2924/00014
20130101; H01L 23/3121 20130101; H01L 2224/73265 20130101; H01L
2224/92247 20130101; H01L 33/54 20130101; H01L 2224/32245 20130101;
H01L 24/48 20130101; H01L 2924/12041 20130101; H01L 2924/12041
20130101; H01L 23/49861 20130101; H01L 2924/181 20130101; H01L
33/62 20130101; H01L 2924/00014 20130101; H01L 2224/73265 20130101;
H01L 2224/48091 20130101; H01L 2224/48091 20130101; H01L 2224/92247
20130101; H01L 2224/45099 20130101; H01L 2924/00 20130101; H01L
2224/73265 20130101; H01L 2924/00014 20130101; H01L 33/483
20130101; H01L 2224/48247 20130101; H01L 23/49506 20130101; H01L
2924/207 20130101; H01L 2224/32245 20130101; H01L 2924/00012
20130101; H01L 2924/00 20130101; H01L 2224/48247 20130101; H01L
2924/00014 20130101; H01L 2224/48247 20130101; H01L 2924/181
20130101; H01L 2224/32245 20130101; H01L 2224/45015 20130101; H01L
2924/00 20130101 |
Class at
Publication: |
257/99 ; 438/26;
257/E33.059; 257/E33.056 |
International
Class: |
H01L 33/48 20100101
H01L033/48; H01L 33/52 20100101 H01L033/52 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 4, 2008 |
TW |
097107548 |
Claims
1. A manufacturing method of a light emitting diode package,
comprising: heating a first light transmission insulation material
to cause the first light transmission insulation material to become
a sticky member; connecting a lead frame to the sticky member;
performing a chip-bonding step that bonds at least one
light-emitting diode chip on the sticky member using a light
transmission glue; encapsulating the at least one light-emitting
diode chip with a second light transmission insulation material;
and performing a drying step that forms the sticky member and the
second light transmission insulation material into shape.
2. The manufacturing method as recited in claim 1, wherein the
first light transmission insulation material comprises transparent
epoxy or silicone.
3. The manufacturing method as recited in claim 1, wherein the
second light transmission insulation material comprises transparent
epoxy or silicone.
4. The manufacturing method as recited in claim 1, wherein the
second light transmission insulation material and the first light
transmission insulation material are formed from the same
transparent material.
5. The manufacturing method as recited in claim 1, further
comprising: performing a solder resisting step that coats a solder
mask on a bottom side of the lead frame.
6. The manufacturing method as recited in claim 1, further
comprising: performing a wire-bonding step or a bump-bonding step
that electrically connects the at least one light-emitting diode
chip to the lead frame.
7. A manufacturing method of a light emitting diode package,
comprising: heating a first light transmission insulation material
to cause the first light transmission insulation material to become
a sticky member; connecting a lead frame to the sticky member;
performing a solder resisting step that coats a solder mask on a
bottom side of the lead frame; and performing a chip-bonding step
that bonds at least one light-emitting diode chip on the sticky
member using a light transmission glue.
8. The manufacturing method as recited in claim 7, wherein the
first light transmission insulation material comprises transparent
epoxy or silicone.
9. The manufacturing method as recited in claim 7, further
comprising: encapsulating the at least one light-emitting diode
chip with a second light transmission insulation material.
10. The manufacturing method as recited in claim 9, wherein the
second light transmission insulation material comprises transparent
epoxy or silicone.
11. The manufacturing method as recited in claim 9, wherein the
second light transmission insulation material and the first light
transmission insulation material are formed from the same
transparent material.
12. The manufacturing method as recited in claim 9, further
comprising: performing a drying step that forms the sticky member
and the second light transmission insulation material into
shape.
13. The manufacturing method as recited in claim 7, further
comprising: performing a wire-bonding step or a bump-bonding step
that electrically connects the at least one light-emitting diode
chip to the lead frame.
14. A light emitting diode package, comprising: a light
transmission substrate having a central portion and a peripheral
portion surrounding the central portion; at least one
light-emitting diode chip disposed on the central portion of the
light transmission substrate; a lead frame connecting the
peripheral portion of the light transmission substrate, wherein the
lead frame is electrically connected to the light-emitting diode
chip; and an encapsulant disposed on the light transparent
substrate, wherein the encapsulant covers the at least one
light-emitting diode chip and the lead frame.
15. The light emitting diode package as recited in claim 14,
wherein the light transmission substrate comprises transparent
epoxy or silicone.
16. The light emitting diode package as recited in claim 14,
wherein the encapsulant comprises transparent epoxy or
silicone.
17. The light emitting diode package as recited in claim 14,
wherein the encapsulant and the light transmission substrate are
formed from the same material.
18. The light emitting diode package as recited in claim 14,
further comprising: a light transmission glue that bonds the at
least one light-emitting diode chip on the light transmission
substrate.
19. The light emitting diode package as recited in claim 14,
further comprising: a plurality of conducting wires or bumps
electrically connecting the at least one light-emitting diode chip
to the lead frame.
20. The light emitting diode package as recited in claim 14,
further comprising: a solder mask coated on a first side of the
lead frame opposite from a second side of the lead frame that is on
a same side of the light transmission substrate as the at least one
light-emitting diode chip.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
[0001] This application claims priority to U.S. patent application
Ser. No. 12/398,174, filed on Mar. 4, 2009, which claims priority
to Taiwan Patent Application Number 097107548, filed on Mar. 4,
2008. These patent applications are herein incorporated in their
entirety by reference.
BACKGROUND
[0002] 1. Technical Field
[0003] The present disclosure relates to a light emitting diode
(LED) package structure and a manufacturing method therefor, and
more particularly, to a transparent LED package structure and a
manufacturing method therefor.
[0004] 2. Description of Related Art
[0005] With the advance of science and technologies, various types
of advertising signboards are developed, and LED advertising
signboards are one type of the most popular advertising signboards.
In general, advertising signboards are mounted on elevated and
noticeable areas or people-crowded areas, and thus the advertising
signboards are often mounted on the glass curtain walls of
high-rise buildings. However, since an LED advertising signboard is
generally composed of a plurality of LED units through which very
little light is allowed to pass, the LED advertising signboard will
block the ambient light passing through a glass curtain wall of a
building when being mounted on the glass curtain wall. As a result,
ambient light cannot easily enter the building from the
outside.
SUMMARY
[0006] An objective of the present disclosure is to provide a
transparent LED package structure and a manufacturing method
therefor, thereby overcoming the aforementioned problems.
[0007] In one aspect, a manufacturing method of a light emitting
diode package may: heat a first light transmission insulation
material to cause the first light transmission insulation material
to become a sticky member; connect a lead frame to the sticky
member; perform a chip-bonding step that bonds at least one
light-emitting diode chip on the sticky member using a light
transmission glue; encapsulate the at least one light-emitting
diode chip with a second light transmission insulation material;
and perform a drying step that forms the sticky member and the
second light transmission insulation material into shape.
[0008] In one embodiment, the first light transmission insulation
material may comprise transparent epoxy or silicone.
[0009] In another embodiment, the second light transmission
insulation material may comprise transparent epoxy or silicone.
[0010] In yet another embodiment, the second light transmission
insulation material and the first light transmission insulation
material may be formed from the same transparent material.
[0011] In one embodiment, the manufacturing method may further
perform a solder resisting step that coats a solder mask on a
bottom side of the lead frame.
[0012] In another embodiment, the manufacturing method may further
perform a wire-bonding step or a bump-bonding step that
electrically connects the at least one light-emitting diode chip to
the lead frame.
[0013] In another aspect, a manufacturing method of a light
emitting diode package may: heat a first light transmission
insulation material to cause the first light transmission
insulation material to become a sticky member; connect a lead frame
to the sticky member; perform a solder resisting step that coats a
solder mask on a bottom side of the lead frame; and perform a
chip-bonding step that bonds at least one light-emitting diode chip
on the sticky member using a light transmission glue.
[0014] In one embodiment, the first light transmission insulation
material may transparent epoxy or silicone.
[0015] In another embodiment, the manufacturing method may further
encapsulate the at least one light-emitting diode chip with a
second light transmission insulation material.
[0016] In another embodiment, the second light transmission
insulation material may comprise transparent epoxy or silicone.
[0017] In still another embodiment, the second light transmission
insulation material and the first light transmission insulation
material may be formed from the same transparent material.
[0018] In one embodiment, the manufacturing method may further
perform a wire-bonding step or a bump-bonding step that
electrically connects the at least one light-emitting diode chip to
the lead frame.
[0019] In still another embodiment, the manufacturing method may
perform a drying step that forms the sticky member and the second
light transmission insulation material into shape.
[0020] In yet another aspect, a light emitting diode package may
comprise: a light transmission substrate having a central portion
and a peripheral portion surrounding the central portion; at least
one light-emitting diode chip disposed on the central portion of
the light transmission substrate; a lead frame connecting the
peripheral portion of the light transmission substrate, wherein the
lead frame is electrically connected to the light-emitting diode
chip; and an encapsulant disposed on the light transparent
substrate, wherein the encapsulant covers the at least one
light-emitting diode chip and the lead frame.
[0021] In one embodiment, the light transmission substrate may
comprise transparent epoxy or silicone.
[0022] In one embodiment, the encapsulant may comprise transparent
epoxy or silicone.
[0023] In another embodiment, the encapsulant and the light
transmission substrate may be formed from the same material.
[0024] In one embodiment, the light emitting diode package may
further comprise a light transmission glue that bonds the at least
one light-emitting diode chip on the light transmission
substrate.
[0025] In another embodiment, the light emitting diode package may
further comprise a plurality of conducting wires or bumps
electrically connecting the at least one light-emitting diode chip
to the lead frame.
[0026] In yet another embodiment, the light emitting diode package
may further comprise a solder mask coated on a first side of the
lead frame opposite from a second side of the lead frame that is on
a same side of the light transmission substrate as the at least one
light-emitting diode chip.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The foregoing aspects and many of the attendant advantages
of this present disclosure will become more readily appreciated as
the same becomes better understood by reference to the following
detailed description, when taken in conjunction with the
accompanying drawings.
[0028] FIGS. 1A-1F are cross sectional schematic diagrams showing a
flow process for manufacturing a transparent LED package structure
according to a first embodiment of the present disclosure.
[0029] FIG. 2 is a schematic flowchart showing the manufacturing
method according to the first embodiment of the present
disclosure.
[0030] FIG. 3 is a schematic flow chart showing a manufacturing
method according to a second embodiment of the present
disclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0031] In order to make the illustration of the present disclosure
more explicit and complete, the following description is stated
with reference to FIG. 1A through FIG. 3.
First Embodiment
[0032] FIG. 1A to FIG. 1E are cross sectional schematic diagrams
showing a manufacturing method of an LED package structure
according to a first embodiment of the present disclosure. FIG. 2
is a schematic flowchart showing the manufacturing method according
to the first embodiment of the present disclosure. Referring to
FIGS. 1A and 2, in the manufacturing method 150, a heating step 152
is first performed to heat a first transparent plastic material to
cause it to become a sticky member 102, and the sticky member 102
is used as a substrate in the transparent LED package. In this
embodiment, epoxy or silicone material is placed on a processing
stage to form a board, and then the board is heated. It is noted
that the sticky member 102 is transparent. A connecting step 154 is
then performed in which a lead frame 108 is placed on the sticky
member 102 so as to be connected with the sticky member 102, as
shown in FIG. 1B and FIG. 2. Thereafter, a chip-bonding step 156 is
performed in which transparent chip-bonding glue 106 is used to
bond a transparent LED 104 on the sticky member 102, as shown in
FIG. 10 and FIG. 2. A wire-bonding step 158 is then performed to
electrically connect the lead frame 108 to the transparent LED 104
via a plurality of conducting wires 110, as shown in FIG. 1D and
FIG. 2. Thereafter, an encapsulating step 160 is performed in which
a second transparent plastic material 112 is used to encapsulate
the transparent LED 104 to increase the brightness of the
transparent LED 104, as shown in FIG. 1E and FIG. 2. A drying step
162 is then performed in which the sticky member 102 and the second
transparent plastic material 112 are dried to form a transparent
substrate and an encapsulant, as shown in FIG. 1E and FIG. 2.
[0033] In the structure of the transparent LED package according to
the first embodiment of the present disclosure, the area occupied
by the lead frame 108 is very small, so that the LED package can be
a transparent structure. In addition, when the material of the
second transparent plastic material 112 is the same as that of the
first transparent plastic material, the drying step 162 can be
simplified, and the manufacturing method can be speeded up
thereby.
Second Embodiment
[0034] FIG. 3 is a schematic flow chart showing a manufacturing
method according to a second embodiment of the present disclosure.
The manufacturing method 250 is similar to the manufacturing method
150, but the difference is that the manufacturing method 250
further comprises a solder resisting step 256. Referring to FIG.
1F, FIG. 1F is a cross section diagram showing a transparent LED
package structure in the solder resisting step 256. In the solder
resisting step 256, a solder mask 210 is coated on the bottom side
of the lead frame 108 to prevent defects from being produced in a
soldering step. The solder resisting step 256 may be performed to
connect the transparent LED package to an electronic device. In
addition, the solder resisting step 256 is performed between the
connecting step 154 and the chip-bonding step 156 in this
embodiment. However, the sequence for performing the solder
resisting step 256 in the manufacturing method 250 is not limited
thereto.
[0035] As is understood by a person skilled in the art, the
foregoing embodiments of the present disclosure are strengths of
the present disclosure rather than limiting of the present
disclosure. It is intended to encapsulate various modifications and
similar arrangements included within the spirit and scope of the
appended claims, the scope of which should be accorded the broadest
interpretation so as to encompass all such modifications and
similar structures.
* * * * *