U.S. patent application number 13/094188 was filed with the patent office on 2011-11-03 for mounting base.
This patent application is currently assigned to ABB Oy. Invention is credited to Timo KOIVULUOMA, Risto Laurila.
Application Number | 20110265975 13/094188 |
Document ID | / |
Family ID | 42651162 |
Filed Date | 2011-11-03 |
United States Patent
Application |
20110265975 |
Kind Code |
A1 |
KOIVULUOMA; Timo ; et
al. |
November 3, 2011 |
MOUNTING BASE
Abstract
The disclosure relates to a mounting base for an electric
component, including, for example, first surface for receiving the
electric component, and for receiving a heat load generated by the
electric component, and a second surface for dissipating heat from
the mounting base. The mounting base can include evaporator
channels arranged in the vicinity of the first surface, condenser
channels in the vicinity of the second surface and a first and
second connecting part for passing fluid between the condenser
channels and evaporator channels.
Inventors: |
KOIVULUOMA; Timo; (Vantaa,
FI) ; Laurila; Risto; (Espoo, FI) |
Assignee: |
ABB Oy
Helsinki
FI
|
Family ID: |
42651162 |
Appl. No.: |
13/094188 |
Filed: |
April 26, 2011 |
Current U.S.
Class: |
165/67 |
Current CPC
Class: |
H01L 2924/0002 20130101;
F28D 15/0266 20130101; H01L 23/427 20130101; F28F 9/26 20130101;
F28D 15/0275 20130101; F28D 15/0233 20130101; H01L 2924/00
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/67 |
International
Class: |
F28F 9/00 20060101
F28F009/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 29, 2010 |
EP |
10161436.0 |
Claims
1. A mounting base for an electric component, comprising: a first
surface for receiving the electric component and for receiving a
heat load generated by the electric component; a second surface for
dissipating heat from the mounting base; evaporator channels
arranged in a vicinity of the first surface for transferring
received heat load to a fluid in the evaporator channels; condenser
channels in a vicinity of the second surface for transferring heat
from fluid in the condenser channels to the second surface; a first
connecting part for passing fluid from the condenser channels to
the evaporator channels; and a second connecting part for passing
fluid from the evaporator channels to the condenser channels.
2. A mounting base according to claim 1, wherein the second surface
comprises: at least one of a heat sink and a fin structure for
dissipating heat into air.
3. A mounting base according to claim 1, wherein the evaporator
channels and the condenser channels are grouped together into at
least a first group and a second group, each group including at
least one evaporator channel and at least one condenser
channel.
4. A mounting base according to claim 3, wherein the first
connecting part is arranged for conducting fluid from one or more
condenser channels of the first group into one or more evaporator
channels of the at least first and second groups; and the second
connecting part is arranged for conducting fluid from one or more
evaporator channels of the first group into one or more condenser
channels of the at least first and second groups.
5. A mounting base according to claim 1, wherein the mounting base
formed with an aluminum alloy or a copper alloy.
Description
RELATED APPLICATION
[0001] This application claims priority under 35 U.S.C. .sctn.119
to European Patent Application No. 10161436.0 filed in Europe on
Apr. 29, 2010, the entire content of which is hereby incorporated
by reference in its entirety.
FIELD
[0002] This disclosure relates to a mounting base for an electric
component, for example, a mounting base which can conduct heat away
from an electric component.
BACKGROUND INFORMATION
[0003] In known devices an electric component is attached to a
first surface of a mounting base. In order to avoid heat generated
by the electric component during use from raising the temperature
excessively, a second surface of the mounting base is cooled. In
this way heat generated by the electric component can be dissipated
via the mounting base.
[0004] However, the heat load may not be evenly distributed over
the mounting base. Therefore different parts of the base can have
different temperatures.
[0005] In case the heat load is localized on the first surface of
the base, for example, restricted to only a part of the surface
area, the entire dissipation capacity of the second surface may not
be efficiently utilized because of an uneven heat distribution.
[0006] U.S. Patent Application Publication No. 2003/0155102 A1
discloses a mounting base with a thermosyphon or a planar heat pipe
which is used for distributing heat in various directions. A
chamber is provided where a fluid can boil and condense. The
pressure inside the chamber can increase to an extent than the
mounting base bulges. In that case an electric component attached
to the mounting base may be bent to an extent where damage occurs
to the component.
SUMMARY
[0007] A mounting base for an electric component is disclosed
including a first surface for receiving the electric component and
for receiving a heat load generated by the electric component, a
second surface for dissipating heat from the mounting base and
evaporator channels arranged in the vicinity of the first surface
for transferring the received heat load to a fluid in the
evaporator channels, condenser channels in the vicinity of the
second surface for transferring heat from the fluid in the
condenser channels to the second surface, a first connecting part
for passing the fluid from the condenser channels to the evaporator
channels and a second connecting part for passing the fluid from
the evaporator channels to the condenser channels.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Exemplary embodiments will be described in closer detail by
way of example and with reference to the attached drawings, in
which
[0009] FIGS. 1 to 3 illustrate a first exemplary embodiment of a
mounting base;
[0010] FIG. 4 illustrates a second exemplary embodiment of a
mounting base; and
[0011] FIG. 5 illustrates an exemplary fluid distribution in a
mounting base.
DETAILED DESCRIPTION
[0012] In an exemplary embodiment of the disclosure, evaporator
channels and condenser channels can be arranged in the mounting
base to make it possible to utilize a fluid in the mounting base
for receiving and passing on a heat load generated by an electric
component. In this way heat can be efficiently distributed due to
the fluid. Therefore, the dissipation capacity of the second
surface of the mounting base can be utilized efficiently.
[0013] FIGS. 1 to 3 illustrate a first exemplary embodiment of a
mounting base 1. FIG. 1 is a side view of the mounting base 1, and
FIGS. 2 and 3 are partial cross sections of the mounting base. The
illustrated mounting base can be utilized with significant fluid
pressures without any bulging that can damage components attached
to the mounting base.
[0014] The mounting base 1 includes a first surface 2 for receiving
one or more electric components 3 that generate a heat load during
use. The mounting base 1 can be utilized for efficiently cooling a
plurality of electric components that can be freely distributed
over the first surface 2. When implemented in a drive for an
electric motor, such as in a frequency converter, for example, the
electric component (or electric components) may be a power
semiconductor. The generated heat load can be received by the
mounting base 1 via the first surface 2.
[0015] The heat load received by the mounting base 1 can be
dissipated from the mounting base via a second surface 4 of the
mounting base 1. Depending on the implementation, in various
exemplary embodiments this second surface 4 can be provided by an
apparatus or shaped in a way which enhances the dissipation. In
FIGS. 1 to 3, for example, the second surface includes a heat sink
5 for dissipating heat into the ambient surroundings. Instead of a
heat sink, a fin structure capable of dissipating heat into the
ambient surroundings, may be utilized. The heat sink 5 can
additionally include a plurality of fins which pass on heat into
the surrounding air. If desired, in order to increase the cooling
capacity, a fan may be utilized in order to generate an airflow 6
between the fins, as illustrated by way of example. The direction
of the airflow can be as illustrated, or in any suitable
direction.
[0016] In order for the heat load from the electric component 3 to
be evenly distributed over the surface of the mounting base 1, the
mounting base can, for example, include evaporator channels 7,
condenser channels 8, a first connecting part 9 and a second
connecting part 10 in order to circulate fluid in the mounting base
1.
[0017] The evaporator channels 7 can be arranged in the vicinity of
the first surface 2 to receive the heat load from the electric
component 3 via the first surface 2, and to pass the heat load into
the fluid in the evaporator channels 7. The second connecting part
10, shown in the upper end of the mounting base 1 in the example of
FIGS. 1 and 2, can receive the fluid from the evaporator channels 7
and pass the fluid on into the condenser channels 8.
[0018] The condenser channels 8 can be arranged in the vicinity of
the second surface 4 in order to transfer heat from the fluid in
the condenser channels to the second surface 4. The first
connecting part 9, shown in the lower end of the mounting base 1 in
the example of FIGS. 1 and 2, can receive the fluid from the
condenser channels 8 and pass the fluid on into the evaporator
channels 9.
[0019] In FIGS. 1 and 2, the mounting base is utilized in a
position where the second connecting part 10 is located higher than
the first connecting part 9, and the circulation of the fluid will
take place due to gravity and condensation/evaporation of the
fluid. See EP 2 031 332 A1 and EP 2 119 993 A1, for example. No
pump is therefore needed in order to circulate the fluid. The
evaporation in the evaporator channels 7 can cause an upward
movement of the fluid in the evaporator channels 7, and gravity can
cause a downward movement of the fluid in the condenser channels 8.
Such a circulation can be achieved at least as long as the first
connecting part 9 is not located above the level of the second
connecting part 10. In that case, the first and second connecting
parts 9 and 10 can be designed to pass on fluid from any evaporator
channel to any condenser channel and vice versa. Fluid from
different evaporator channels and different condenser channels may
also be permitted to be mixed up with each other in the first and
the second connecting parts before they are passed on.
[0020] From FIG. 3 it can be seen that the evaporator channels 7
and the condenser channels 8 can be grouped together into at least
a first group 11 and a second group 12, though the number of groups
is sixteen in the illustrated example. Each group can include at
least one evaporator channel and at least one condenser channel.
Such a structure can be accomplished by extruding the mounting base
4 of an aluminum alloy, for example, in which case the mounting
base can include a single block having the evaporator channels and
the condenser channels formed in it already after the extrusion
phase. However, in FIG. 3 it is by way of example assumed that the
mounting base 1 includes two plates 13 and 14. The first plate can
be manufactured with grooves, into which pipes can be fitted. The
pipes can include longitudinal internal walls that separate the
evaporator channels and the condenser channels from each other. The
second plate 14 can be attached to the first plate 13 to form the
mounting base 1. The first and second plate 13 and 14, the fins of
the heat sink 5 and the pipes may be attached to each other by
providing for example, a solder on the surfaces of these parts that
come into contact with each other. In this way, after the parts
have been arranged to contact each other in the illustrated
positions, the solder can be melted in an oven, in which case the
solder melts and subsequently, when cooled, attaches the parts to
each other.
[0021] In order to facilitate attachment of the electric component
to the mounting base by screws, for example, some of the evaporator
channels of FIG. 3 can be omitted. In that case the material
thickness of the mounting base is bigger at these locations, which
makes it possible to use these locations for attaching said screws,
for example. The solid base material at these attachment locations
can conduct heat for short distances, and therefore such attachment
locations can be arranged in different parts of the mounting base
in advance (before knowing exactly the components and the sizes of
the components that will be attached to this particularly mounting
base), while only those attachment locations that are actually
needed are subsequently used by providing attachment holes into
them, for example. Consequently the attachment of components to the
mounting base can be very simple and flexible.
[0022] FIG. 4 illustrates a second exemplary embodiment of a
mounting base 1'. The embodiment of FIG. 4 is similar to the one
explained in connection with FIGS. 1 to 3. Therefore, the
embodiment of FIG. 4 will be explained also by pointing out the
differences between these embodiments.
[0023] In FIG. 4, several subsequent pipe structures 15' can be
utilized. The first and second connecting parts 9' and 10' can be
designed to pass on fluid between these different pipe structures.
Similarly to the previous embodiment, a heat sink can be provided
on the second surface 4' of the mounting base 1' for dissipating
heat.
[0024] FIG. 5 illustrates fluid distribution in a mounting base,
such as the one illustrated in FIGS. 1 to 3. In this figure only
the electric component 3, the first connecting part 9 and the
second connecting part 10 are shown. The evaporator channels and
the condenser channels are located on top of each other.
[0025] FIG. 5 illustrates a situation where the first and second
connecting parts 9 and 10 have a structure that allows fluid from
different evaporator channels, and correspondingly, different
condenser channels, to mix up with each other and to be passed on
via any one of the condenser channels, and correspondingly,
evaporator channels. It can be seen that as the fluid also
circulates sideways, the cooling capacity of the entire second
surface can be utilized efficiently. In this way the dimensions of
the mounting base can be increased both longitudinally and
transversally. The spaces between the channels may be dimensioned
in such a way that electric or other components can be attached by
screws, for instance, in the spaces between the channels.
[0026] In the previous explanation the term `fluid` has been used
generally to indicate any medium suitable for use in the described
mounting base. The fluid may be a liquid or a gas, and in many
implementations, the fluid can be in liquid state in certain parts
of the mounting base while it can be in a gas state in other parts
of the mounting base.
[0027] Thus, it will be appreciated by those having ordinary skill
in the art that the present disclosure can be embodied in other
specific forms without departing from the spirit or essential
characteristics thereof. The presently disclosed embodiments are
therefore considered in all respects to be illustrative and not
restricted. The scope of the disclosure is indicated by the
appended claims rather than the foregoing description and all
changes that come within the meaning and range and equivalence
thereof are intended to be embraced therein.
* * * * *