U.S. patent application number 13/153558 was filed with the patent office on 2011-09-29 for sacrificial nitride and gate replacement.
This patent application is currently assigned to SPANSION LLC. Invention is credited to Kuo-Tung Chang, Fred Cheung, Hiroyuki Kinoshita, Chungho Lee, Huaqiang Wu.
Application Number | 20110237060 13/153558 |
Document ID | / |
Family ID | 39764937 |
Filed Date | 2011-09-29 |
United States Patent
Application |
20110237060 |
Kind Code |
A1 |
Lee; Chungho ; et
al. |
September 29, 2011 |
SACRIFICIAL NITRIDE AND GATE REPLACEMENT
Abstract
Methods of forming a top oxide around a charge storage material
layer of a memory cell and methods of improving quality of a top
oxide around a charge storage material layer of a memory cell are
provided. The method can involve providing a charge storage layer
on a semiconductor substrate, a nitride layer on the charge storage
layer, and a first poly layer on the nitride layer, and converting
at least a portion of the nitride layer to a top oxide. By
converting at least a portion of a nitride layer to a top oxide
layer, the quality of the resultant top oxide layer can be
improved.
Inventors: |
Lee; Chungho; (Sunnyvale,
CA) ; Chang; Kuo-Tung; (Saratoga, CA) ;
Kinoshita; Hiroyuki; (San Jose, CA) ; Wu;
Huaqiang; (Mountain View, CA) ; Cheung; Fred;
(San Jose, CA) |
Assignee: |
SPANSION LLC
Sunnyvale
CA
|
Family ID: |
39764937 |
Appl. No.: |
13/153558 |
Filed: |
June 6, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11847507 |
Aug 30, 2007 |
7981745 |
|
|
13153558 |
|
|
|
|
Current U.S.
Class: |
438/591 ;
257/E21.21 |
Current CPC
Class: |
H01L 29/42348 20130101;
H01L 29/7923 20130101; H01L 21/3185 20130101; H01L 29/40117
20190801; H01L 27/115 20130101; H01L 27/11568 20130101 |
Class at
Publication: |
438/591 ;
257/E21.21 |
International
Class: |
H01L 21/28 20060101
H01L021/28 |
Claims
1. A method of forming a memory device comprising memory cells and
bit line openings therebetween, comprising: forming charge storage
layers on a semiconductor substrate, nitride layers on the charge
storage layers, first poly layers on the charge storage layers, and
bit line dielectrics in the bit line openings; removing the first
poly layers to expose at least portions of upper surfaces of the
nitride layers; and oxidizing the nitride layers to form top
oxides.
2. The method of claim 1 further comprising forming a second poly
layer or a word line over the top oxides.
3. The method of claim 1, wherein forming charge storage layers
comprises: forming dielectric layers on the semiconductor
substrate; forming openings between the semiconductor substrate and
the nitride layers by removing end portions of the dielectric
layers; and forming charge storage material layers in the
openings.
4. The method of claim 1, wherein oxidizing the nitride layers
comprises a slot plane antenna process.
5. The method of claim 1, wherein the nitride layer comprises
silicon nitrides.
6. The method of claim 3, wherein the memory cell comprises two
charge storage nodes that are separated from each other by the
dielectric layers.
7. The method of claim 6, wherein the two charge storage nodes
comprise an ORPRO layer.
8. A method of forming a memory device comprising memory cells and
bit line openings therebetween, comprising: forming charge storage
layers on a semiconductor substrate, nitride layers on the charge
storage layers, first poly layers on the charge storage layers, and
bit line dielectrics in the bit line openings; removing the first
poly layers to expose at least portions of upper surfaces of the
nitride layers; oxidizing the nitride layers to form top oxides;
and forming a second poly layer over the top oxides.
9. The method of claim 8, wherein forming charge storage layers
comprises: forming dielectric layers on the semiconductor
substrate; forming openings between the semiconductor substrate and
the nitride layers by removing end portions of the dielectric
layers; and forming charge storage material layers in the
openings.
10. The method of claim 8, wherein oxidizing the nitride layers
comprises a slot plane antenna process.
11. The method of claim 8, wherein the nitride layer comprises
silicon nitrides.
12. The method of claim 9, wherein the memory cell comprises two
charge storage nodes that are separated from each other by the
dielectric layers.
13. The method of claim 12, wherein the two charge storage nodes
comprise an ORPRO layer.
14. A method of forming a memory device comprising memory cells and
bit line openings therebetween, comprising: forming charge storage
layers on a semiconductor substrate, nitride layers on the charge
storage layers, first poly layers on the charge storage layers, and
bit line dielectrics in the bit line openings; removing the first
poly layers to expose at least portions of upper surfaces of the
nitride layers; oxidizing the nitride layers to form top oxides;
and forming a word line over the top oxides.
15. The method of claim 14, wherein forming charge storage layers
comprises: forming dielectric layers on the semiconductor
substrate; forming openings between the semiconductor substrate and
the nitride layers by removing end portions of the dielectric
layers; and forming charge storage material layers in the
openings.
16. The method of claim 14, wherein oxidizing the nitride layers
comprises a slot plane antenna process.
17. The method of claim 14, wherein the nitride layer comprises
silicon nitrides.
18. The method of claim 15, wherein the memory cell comprises two
charge storage nodes that are separated from each other by the
dielectric layers.
19. The method of claim 18, wherein the two charge storage nodes
comprise an ORPRO layer.
20. The method of claim 15, wherein the nitride layer comprises
silicon nitrides.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a Divisional of application Ser. No.
11/847,507 filed Aug. 30, 2007, the entire contents of which is
hereby incorporated by reference.
TECHNICAL FIELD
[0002] Described are methods of forming a top oxide of a memory
cell and/or improving quality of a top oxide of a memory cell using
a sacrificial nitride layer with or without a gate replacement.
BACKGROUND
[0003] Modern computing devices utilize a variety of kinds of
memory devices to store and access information. Memory devices
include the general classes of random access memories (RAM) and
read only memories (ROM). These classes further contain static RAM
(SRAM), dynamic RAM (DRAM), programmable ROM (PROM), electrically
programmable ROM (EPROM), electrically erasable PROM (EEPROM), as
well as FLASH memory, or the like. Most memory devices employ an
internal architecture in the form of an array memory of bit cells,
containing plural rows and plural intersecting columns.
[0004] A memory cell is placed at each intersecting row and column
in the array. Typically, a particular memory cell is accessed by
activating its row and then reading or writing the state of its
column. Memory sizes are defined by the row and column
architecture. For example, a 1024 row by 1024 column memory array
defines a memory device having one megabit of memory cells. The
array rows are referred to as word lines and the array columns are
referred to as bit lines.
[0005] In memory cells, single bits of data are stored in and read
from respective memory cells. The cells are generally programmed by
hot electron injection and erased by Fowler-Nordheim tunneling. The
erase, program, and read operations are commonly performed by
application of appropriate voltages to certain terminals of the
memory cell. In an erase or write operation the voltages are
applied so as to cause a charge to be removed or stored in a charge
storage layer of the memory cell.
[0006] The trend in semiconductor memory devices has been toward
higher circuit density with higher numbers of bit cells per device,
lower operating voltages, and higher access speeds. To achieve
these high densities there have been, and continue to be, efforts
toward scaling down device dimensions (e.g., at sub-micron levels).
However, as scaling down device dimensions, the gate dielectric
scaling is getting more difficult, due to the top and bottom oxide
leakage increase. Thus, the requirement of small features with
close spacing between adjacent features requires sophisticated
manufacturing techniques.
SUMMARY
[0007] The following presents a simplified summary of the
innovation described herein in order to provide a basic
understanding of some aspects of the innovation. This summary is
not an extensive overview of the innovation. It is intended to
neither identify key or critical elements of the innovation nor
delineate the scope of the innovation. Its sole purpose is to
present some concepts of the innovation in a simplified form as a
prelude to the more detailed description that is presented
later.
[0008] One aspect of the subject innovation provides methods of
forming a top oxide on a charge storage material layer of a memory
cell. Another aspect of the subject innovation provides methods of
improving quality of a top oxide of a memory cell. The methods can
involve providing a charge storage layer on a semiconductor
substrate, a nitride layer on the charge storage layer, and a first
poly layer on the nitride layer, and converting at least a portion
of the nitride layer to a top oxide. By converting at least a
portion of a nitride layer to a top oxide, the quality of the
resultant top oxide can be improved.
[0009] To the accomplishment of the foregoing and related ends, the
innovation, then, comprises the features hereinafter fully
described and particularly pointed out in the claims. The following
description and the annexed drawings set forth in detail certain
illustrative embodiments of the innovation. These embodiments are
indicative, however, of but a few of the various ways in which the
principles of the innovation may be employed. Other objects,
advantages and novel features of the innovation will become
apparent from the following detailed description of the innovation
when considered in conjunction with the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 illustrates a top view of an exemplary flash memory
device in accordance with an aspect of the subject innovation.
[0011] FIG. 2 is a schematic illustration of a portion of a memory
core such as may include at least part of one of the cores depicted
in FIG. 1 in a virtual ground type configuration in accordance with
a first aspect of the subject invention.
[0012] FIG. 3 is a top view of at least a portion of a memory core,
such as may include at least part of one of the cores depicted in
FIG. 1 in accordance with a first aspect of the subject
invention.
[0013] FIG. 4 is a cross-sectional isometric illustration of
exemplary memory cells, such as that taken along line A-A of FIG. 3
in accordance with a first aspect of the subject invention.
[0014] FIGS. 5-10 illustrate an exemplary method of forming a top
oxide of a memory cell in accordance with a second aspect of the
subject innovation.
[0015] FIGS. 11-16 illustrate another exemplary method of forming a
top oxide of a memory cell in accordance with a third aspect of the
subject innovation.
[0016] FIGS. 17-19 illustrate exemplary methodologies of forming a
top oxide of a memory cell in accordance with other aspects of the
subject innovation.
DETAILED DESCRIPTION
[0017] In memory cells, erase, program, and read operations are
commonly performed by application of appropriate voltages to
certain terminals of the memory cells. In an erase or write
operation the voltages are applied so as to cause a charge to be
removed or stored in the memory cell. In a read operation,
appropriate voltages are applied so as to cause a current to flow
in the memory cell, wherein the amount of such current is
indicative of the value of the data stored in the cell. A memory
device includes appropriate circuitry to sense the resulting cell
current in order to determine the data stored therein, which is
then provided to data bus terminals of the memory device for access
by other devices in a system in which the memory device is
employed.
[0018] Memory cells can contain a charge storage layer over a
semiconductor substrate and a first poly gate around the charge
storage layer. The charge storage layer can contain a bottom
tunnelling oxide, a charge storage element, and a top oxide. The
top oxide can function to isolate the transfer of charges between
the storage element and the first poly, permitting scaling of the
storage element to realize low programming voltages. To achieve
efficient program and erase, the current through a bottom oxide
needs to be much larger than a current through a top oxide during
the program and erase operations. However, the lower the quality of
the top oxide, the more charge may leak through such a layer. For
this reason, the quality of the top oxide is an important feature
in a memory device.
[0019] The innovation disclosed herein provides methods of forming
a top oxide on a charge storage material layer of a memory cell
and/or improving quality of a top oxide of a memory cell. To
improve the quality of the top oxide, a sacrificial nitride layer
can be formed in an intermediate memory cell, and the sacrificial
nitride layer is converted to an oxide layer by, for example,
oxidization. The methods can be performed on the memory devices
before finally defining poly word lines by lithography and etching
techniques.
[0020] One advantage of the methods is improving quality of a top
oxide of a memory device by converting a sacrificial nitride layer
to a top oxide layer. In one embodiment, by oxidizing a sacrificial
nitride layer, the quality of the resulting top oxide can be
improved. For example, a high F-N field of the top oxide can be
achieved. Charge leakage paths can be reduced and/or minimized at
the interface between the top oxide and the charge storage layer.
In another embodiment, by converting a sacrificial nitride layer to
a top oxide, any suitable height of the resulting top oxide can be
achieved. The methods described herein therefore effectively
addresses the concerns raised by the trend towards the
miniaturization of memory devices.
[0021] The top oxide formation/improvement described herein can be
applied to any suitable type of memory cell. For example, the top
oxide formation/improvement can be applied to single-level memory
cells, multi-level memory cells, single bit memory cells, dual bit
memory cells, quad bit memory cells, or the like. The dual bit
memory is a relatively modern memory technology and allows multiple
bits to be stored in a single memory cell. The dual bit memory cell
is essentially split into two identical (mirrored) parts, each of
which is formulated for storing one of two independent bits. Each
dual bit memory cell, like a traditional cell, has a gate with a
source and a drain. However, unlike a traditional stacked gate cell
in which the source is always connected to an electrical source and
the drain is always connected to an electrical drain, respective
dual bit memory cells can have the connections of the source and
drain reversed during operation to permit storage of two bits.
[0022] A dual bit memory cell can have a semiconductor substrate
with implanted conductive bit lines. A charge storage layer can
contain one or more layers and can be formed over the semiconductor
substrate. For example, the charge storage layer can contain three
separate layers: a first insulating layer, a charge storage
dielectric layer, and a second insulating layer. Word lines are
formed over the charge storage layer substantially perpendicular to
the bit lines. Programming circuitry controls two bits per cell by
applying a signal to the word line, which acts as a control gate,
and changing bit line connections such that one bit is stored by
source and drain being connected in one arrangement and a
complementary bit is stored by the source and drain being
interchanged in another arrangement.
[0023] The innovation is now described with reference to the
drawings, wherein like reference numerals are used to refer to like
elements throughout. In the following description, for purposes of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of the innovation. It may be
evident, however, that the innovation can be practiced without
these specific details. In other instances, well-known structures
and devices are shown in block diagram form in order to facilitate
describing the innovation.
[0024] Although the top oxide formation/improvement can be applied
to any type of memory cell, the innovation is hereinafter
illustrated and described in the context of an exemplary
semiconductor device having one or more memory arrays containing
dual bit memory cells arranged in a virtual ground type array
architecture. FIG. 1 illustrates atop view of an exemplary dual bit
flash memory device 100. The memory device 100 generally includes a
semiconductor substrate 102 in which one or more high-density core
regions 104 and one or more lower-density peripheral regions are
formed. The high-density core regions 104 typically include one or
more M by N arrays of individually addressable, substantially
identical dual bit memory cells. The lower-density peripheral
regions on the other hand typically include input/output (I/O)
circuitry 106 and programming circuitry for selectively addressing
the individual memory cells. The programming circuitry is
represented in part by and includes one or more x-decoders 108 and
one or more y-decoders 110 that cooperate with the I/O circuitry
106 for selectively connecting a source, gate, and/or drain of
selected addressed memory cells to predetermined voltages or
impedances to effect designated operations on the respective memory
cells (e.g., programming, reading, and erasing, and deriving
necessary voltages to effect such operations).
[0025] FIG. 2 is a schematic illustration of a portion 200 of an
exemplary memory core such as may include at least part of one of
the M by N array cores 104 depicted in FIG. 1. The circuit
schematic shows a line of memory cells, which includes memory cells
201 through 204 in a virtual ground type implementation, for
example. The respective memory cells 201 through 204 are connected
to a word line 206, which serves as a control gate, and pairs of
the memory cells share a common bit line. For instance, in the
example shown, the memory cell 201 associates bit lines 208 and
209; the memory cell 202 associates bit lines 209 and 210; the
memory cell 203 associates bit lines 210 and 211; and the memory
cell 204 associates bit lines 211 and 212. As such, cells 201 and
202 share bit line 209, cells 202 and 203 share bit line 210 and
cells 203 and 204 share bit line 211, respectively.
[0026] Depending upon a signal on the word line and the connection
of the bit lines in a memory cell to an electrical source or drain,
the memory cells 201 through 204 are capable of writing, reading,
and erasing bits at locations 215 through 222. For example, control
of the bit at location 215 is achieved through connection of the
drain to the bit line 208 and the source to the bit line 209.
Similarly, control of the bit at location 216 is achieved through
connection of the drain to the bit line 209 and the source to the
bit line 208. It will be appreciated that although adjacent memory
cells share common bit lines, the adjacent memory cells do not
interfere with each other because the memory cells are typically
programmed one at a time and in such instances only one memory cell
is active at a time while programming.
[0027] FIG. 3 illustrates a top view of at least a portion 300 of a
memory core, such as may include at least part of one of the M by N
array cores 104 depicted in FIG. 1. The memory 300 is formed upon a
semiconductor substrate 302 and has a plurality of implanted bit
lines 304 extending substantially parallel to one another, and
further includes a plurality of formed word lines 306 extending
substantially in parallel to one another and at substantially right
angles to the plurality of implanted bit lines 304. The word lines
306 are disposed over and separated from the bit lines 304 by a
dielectric stack (not shown) in a grid arrangement. The memory core
300 can include a bit line contact region (not shown) between word
lines 306. The bit line contact region can be used to establish
electrical connection to the bit lines through the dielectric
stack. It will be appreciated that the bit lines 304 and word lines
306 have contacts and interconnections (not shown) to programming
circuitry such as may be represented, at least in part, by
x-decoders and y-decoders.
[0028] FIG. 4 is a cross-sectional isometric illustration of a
portion of a memory device 400 containing a dual bit memory cell
402 as indicated by a dashed line, such as that taken along line
A-A of FIG. 3. The dual bit memory cell 402 is formed on a
semiconductor substrate 404. The memory cell 402 contains a charge
storage layer 406 containing two charge storage nodes 408, 410 on
the semiconductor substrate 404; a first poly 412 on the charge
storage layer 406; a pair of bit lines 414 in the semiconductor
substrate 404 adjacent the charge storage layer 406 and under a bit
line dielectric 416; and a word line 418. In one embodiment, the
two charge storage nodes 408, 410 are physically separated from
each other by a central dielectric 420 in the charge storage layer
406. In another embodiment, the two charge storage nodes are not
physically separated in a single charge storage layer (not shown).
The memory cell 402 is separated from adjacent memory cells by the
bit line dielectric 416 such as oxides (e.g., silicon oxide, high
temperature oxide (HTO), high density plasma (HDP) oxide).
[0029] The charge storage layer 406 can contain a bottom tunneling
oxide, a charge storage material layer, and a top oxide thereon.
Since the memory cell 402 has the two charge storage nodes 408, 410
in the charge storage layer 406, the memory cell 402 can store two
physically distinct bits. Each bit within the memory cell 402
serves as a binary unit of data (e.g., either 1 or 0) that can be
mapped directly to a memory array. Reading or programming one side
of charge storage nodes 408, 410 can occur independently of
whatever data is stored on the opposite side of the charge storage
nodes 408, 410.
[0030] Two conductive bit lines 414 are depicted in FIG. 4
underlying the charge storage layer 406. It will be appreciated
that any number of such bit lines can be implanted into the
semiconductor substrate 404, and that such bit lines may correspond
to the bit lines 304 depicted in FIG. 3. The bit lines 414
typically contain an implanted n-type material, such as arsenic,
and may include an oxide portion (not shown) in some examples. The
two conductive bit lines 414 are spaced apart and define a channel
region 422 therebetween. The semiconductor substrate 404 can
contain pocket implant regions (not shown) adjacent the charge
storage layer 406. The pocket implant regions typically contain an
implanted p-type material, such as boron. The pocket implant
regions can facilitate controlling a threshold voltage of the
memory cell 402.
[0031] Two conductive word lines 418 are similarly depicted
overlying the charge storage layer 406. It will be appreciated that
any number of such word lines can be formed over the charge storage
layer 406, and that such word lines may correspond to the word
lines 306 depicted in FIG. 3. The word lines 418 can contain a
polysilicon material, for example, where the polysilicon material
may be deposited over the charge storage layer 406 and then
patterned and etched.
[0032] Locations 408 and 410 indicate generally where respective
bits of data can be stored in a memory cell 402. It will be
appreciated that the channel 422 has an effective length and that
the bits will be brought closer together as this length is reduced
(e.g., as a result of scaling).
[0033] Referring to FIGS. 5 to 10 and FIGS. 11 to 17, two of many
possible exemplary embodiments of forming a top oxide of a memory
cell and/or improving the quality of a top oxide of a memory cell
are specifically illustrated. FIG. 5 illustrates a cross sectional
view of an intermediate state of a portion of an exemplary memory
device 500. The memory device 500 can contain one or more features
502 on a semiconductor substrate 504. The features 502 can contain
a dielectric layer 506, a nitride layer 508, a first poly layer
510, and a first mask layer 512. The memory device 500 has bit line
openings 514 between the features 502. A memory cell is formed in
the subsequent processes at a position indicated by a dashed line
516.
[0034] For simplicity of illustration in FIG. 5, two features 502
and three bit line openings 514 are shown. However, the memory
device 500 can have any suitable number of features and bit line
openings. For example, the memory device 500 can have a M.times.N
array of features 502 with M rows and N columns.
[0035] The semiconductor substrate 504 may contain any suitable
semiconductor material on which electric devices such as memory
cell transistors can be formed. Examples of semiconductor materials
include silicon, gallium arsenide, indium phosphide, or the
like.
[0036] The dielectric layer 506 can contain any suitable dielectric
material such as oxide materials. Examples of oxides include
silicon oxide, HTO, or the like. In another embodiment, the
dielectric layer 506 contains an oxide that is formed using a Slot
Plane Antenna (SPA) process. In yet another embodiment, the
dielectric layer 506 contains an oxide that is formed using an
in-site steam generation (ISSG) process.
[0037] The height of the dielectric layer 506 can vary and is not
critical to the subject innovation. The height of the dielectric
layer 506 may depend on, for example, the desired implementations
and/or the memory device 500 being fabricated. In one embodiment,
the height of the dielectric layer 506 is about 10 nm or more and
about 100 nm or less. In another embodiment, the height of the
dielectric layer 506 is about 15 nm or more and about 70 nm or
less. In yet another embodiment, the height of the dielectric layer
506 is about 20 nm or more and about 50 nm or less. In still yet
another embodiment, the height of the dielectric layer 506 is about
30 nm.
[0038] The nitride layer 508 can contain any suitable nitride
material. Any nitride layer can be employed as long as the nitride
layer can be converted to a top oxide by, for example, oxidization
in a subsequent process. The nitride layer 508 can be partially or
entirely oxidized to form a top oxide layer in a subsequent
process. Examples of nitrides include silicon nitride materials
such as silicon nitride (Si.sub.xN.sub.y), silicon rich silicon
nitride, and oxygen rich silicon nitride; or the like. Since the
nitride layer 508 is converted to a top oxide, the nitride layer
508 may be referred to as a sacrificial layer or sacrificial
nitride layer.
[0039] The nitride layer 508 can be formed by any suitable
technique. For example, the nitride layer 508 is formed by chemical
vapor deposition (CVD) such as plasma enhanced chemical vapor
deposition (PECVD), low pressure chemical vapor deposition (LPCVD),
high pressure chemical vapor deposition (HPCVD), or the like.
[0040] The height of the nitride layer 508 can vary and is not
critical to the subject innovation. The height may depend on, for
example, the desired implementations and/or the memory device 500
being fabricated. In one embodiment, the height of the nitride
layer 508 is about 0.2 nm or more and about 10 nm or less. In
another embodiment, the height of the nitride layer 508 is about
0.5 nm or more and about 7 nm or less. In yet another embodiment,
the height of the nitride layer 508 is about 1 nm or more and about
3 nm or less.
[0041] The first poly layer 510 typically contains polysilicon. The
first poly 510 can be formed over the semiconductor substrate 504
by, for example, CVD. The height of the first poly 510 may vary and
is not critical to the subject innovation. The height may depend
on, for example, the desired implementations and/or the memory
device 500 being fabricated. In one embodiment, the height of the
first poly 510 is about 50 nm or more and about 300 nm or less. In
another embodiment, the height of the first poly 510 is about 60 nm
or more and about 200 nm or less. In yet another embodiment, the
height of the first poly 510 is about 70 nm or more and about 150
nm or less. In still yet another embodiment, the height of the
first poly 510 is about 100 nm.
[0042] The first mask layer 512 may contain any suitable mask
material. Examples of mask materials include oxides such as silicon
oxide (Si.sub.xO.sub.y) and silicon-dioxide (SiO.sub.2); nitrides
such as silicon nitride (Si.sub.xN.sub.y), silicon rich nitride,
and oxygen rich silicon nitride; or the like.
[0043] Although not shown, an anti-reflective coating (ARC) can be
formed on the first mask layer 512 for increasing resolution of a
lithography process to form the features 502. Any suitable ARC
material can be employed. For example, ARC contains oxides such as
silicon oxide (Si.sub.xO.sub.y) and silicon-dioxide (SiO.sub.2);
nitrides such as silicon nitride (Si.sub.xN.sub.y), silicon rich
nitride, and oxygen rich silicon nitride; carbides such as silicon
carbide (Si.sub.xC.sub.y); amorphous carbon; or the like.
[0044] The features 502 can be formed on the semiconductor
substrate by any suitable technique. For example, a dielectric
layer is formed on a semiconductor substrate, a nitride layer is
formed on the dielectric layer, a first poly layer is formed on the
dielectric layer, and a first mask layer is formed on the first
poly layer. The first mask layer is patterned by removing portions
of the first mask layer via, for example, lithography and etching
techniques, thereby forming a patterned first mask layer 512 and
exposing portions of the first poly layer, the nitride layer, and
the dielectric layer. The first poly layer, the nitride layer, and
the dielectric layer are patterned by removing the exposed portions
that are not covered with the patterned first mask layer, thereby
forming the patterned first poly layer 510, the patterned nitride
layer 508, and the patterned dielectric layer 506.
[0045] FIG. 6 illustrates forming an undercut portion 600 of the
dielectric layer 506 and openings 602 between the semiconductor
substrate 504 and the nitride layer 508 by removing end portions of
the dielectric layer 506. By removing the end portions of the
dielectric layer 506, portions of bottom surfaces of the nitride
layer 508 are exposed in the opening 602. The end portions of the
dielectric layer 506 can be removed by, for example, etching.
Charge storage nodes are formed in the openings 602 in subsequent
processes, and the undercut portion 600 of the dielectric layer 506
becomes a center dielectric between the charge storage nodes.
[0046] Portions (e.g., end portions) of the dielectric layer 506
are removed by any suitable etchant. When the dielectric layer 506
contains oxide materials, portions of the dielectric layer 506 can
be removed by contacting the dielectric layer 506 with any suitable
oxide etchant that does not substantially affect or damage the
integrity of other layers in the memory device 500 such as the
first poly layer 510. Examples of oxide etchants include halogen
acids such as hydrofluoric acid. In one embodiment, the oxide
etchant is a hydrofluoric acid solution such as a buffered
hydrofluoric acid (BHF: e.g., hydrofluoric acid-ammonium fluoride
buffered solution). In another embodiment, the oxide etchant is a
vapor of hydrofluoric acid. Other oxide etchants can also be used
as long as they are capable of removing portions of the dielectric
layer 506 selective to other layers such as the first poly layer
510.
[0047] FIG. 6 also illustrates removing the first mask layer 512,
thereby exposing the first poly 510. The first mask layer 512 can
be removed by any suitable technique, for example, etching. For
example, when the first mask layer 512 contains nitride materials,
the first mask layer 512 can be removed by contacting the first
mask layer 512 with any suitable nitride etchant under any suitable
condition that does not substantially affect or damage the
integrity of other layers of the memory device 500. Examples of
nitride etchants include phosphoric acid. Other nitride etchants
can also be used as long as they are capable of removing the first
mask layer 512 under conditions that are selective to other layers
of the memory device 500.
[0048] FIG. 7a illustrates converting the exposed portion of the
nitride layer 508 in the opening 602 to an oxide layer 700. The
oxide layer 700 can be formed by, for example, oxidizing the
exposed portion of the nitride layer 508. The oxide layer 700
becomes a top oxide layer of a subsequently formed charge storage
node. A top oxide is formed by converting the sacrificial nitride
layer 508 to an oxide layer and not by growing an oxide layer on a
surface of a poly layer. As a result, in one embodiment, the method
does not involve growing a top oxide on a surface of a poly layer
by, for example, oxidizing the poly layer. A portion of the
intermediate charge storage node indicated by a dashed line 702 is
exploded in FIG. 7b.
[0049] The nitride layer 508 can be oxidized by any suitable
technique. For example, the nitride layer 508 is oxidized by
thermal oxidation, plasma oxidation, liquid chemical oxidation,
combinations thereof, or the like. In the thermal oxidation, the
nitride layer 508 can be oxidized at elevated temperatures in an
O.sub.2 atmosphere. In one embodiment, the nitride layer 508 is
oxidized at about 600 degrees Celsius or more and about 800 degrees
Celsius or less. In the plasma oxidation, the nitride layer 508 is
oxidized by using a plasma gas containing oxygen (O.sub.2), ozone
(O.sub.3), nitrous oxide (N.sub.2O), or the like at a temperature
of about 200 degrees Celsius or more and about 600 degrees Celsius
or less. A HDP process or SPA process can be employed to oxidize
the nitride layer. In the liquid chemical oxidation, the nitride
layer 508 is contacted with, for example, a liquid mixture of
sulfuric acid and hydrogen peroxide water; ozone water; or the like
at a temperature of about 10 degrees Celsius or more and about 600
degrees Celsius or less. These oxidation processes can be employed
individually or in combination. For example, after the plasma
oxidation is performed, the liquid chemical processing can be
performed.
[0050] In one embodiment, the nitride layer 508 is oxidized by a
low temperature oxidation process such as a low temperature radical
oxidation, a low temperature plasma oxidation process, or the like.
The low temperature oxidation may advantageously not change the
electrical properties of components/layer of the memory device 500.
For example, the low temperature oxidation does advantageously not
change a doping profile of implanted regions in the semiconductor
substrate 500.
[0051] Any suitable oxygen reactant can be employed in the low
temperature oxidation process. For example, atomic oxygen, ozone,
ionized oxygen radicals produced in a plasma can be employed. In
one embodiment, the nitride layer 508 is oxidized at a temperature
of about 200 degrees Celsius or more and about 600 degrees Celsius
or less. In another embodiment, the nitride layer 508 is oxidized
at a temperature of about 220 degrees Celsius or more and about 550
degrees Celsius or less. In yet another embodiment, the nitride
layer 508 is oxidized at a temperature of about 240 degrees Celsius
or more and about 500 degrees Celsius or less.
[0052] In one embodiment, the surfaces of the semiconductor
substrate 504, the dielectric undercut portion 600, the first poly
layer 510, or combinations thereof are oxidized at the same time
that the portions of the nitride layer 508 is oxidized. For
example, when the dielectric undercut portion 600 contains
materials that can be oxidized, an oxide layer 704 can be formed on
the surface of the dielectric undercut portion 600. When the
dielectric undercut portion 600 does not contain materials that can
be oxidized, an oxide layer is not formed on the surface of the
dielectric undercut portion 600 (not shown). When the semiconductor
substrate 504 and/or the first poly layer 510 contain silicon, a
silicon oxide layer 704 can be formed on the surfaces of the
semiconductor substrate 504 and/or the first poly layer 510.
[0053] FIG. 7b illustrates an exploded view of a portion of an
exemplary intermediate charge storage node indicated by a dashed
line 702 in FIG. 7a after converting the nitride layer 508 to a top
oxide layer 700. In this example, an oxide layer 704 is also formed
on the surfaces of the semiconductor substrate 504, the dielectric
undercut portion 600, and the first poly layer 510. When the
nitride layer 508 contains silicon nitride materials (e.g.,
Si.sub.3N.sub.4), the resultant oxide layer 700 can contain silicon
oxide materials (e.g., SiO.sub.2).
[0054] The height of the top oxide 700 can be controlled by, for
example, adjusting oxidation conditions. The height of the top
oxide 700 can vary and is not critical to the subject innovation.
The top oxide 700 has any suitable height that depends on the
desired implementations and/or the memory device 500 being
fabricated. In one embodiment, the height of the top oxide 700 is
about 1 nm or more and about 20 nm or less. In another embodiment,
the height of the top oxide 700 is about 2 nm or more and about 16
nm or less. In yet another embodiment, the height of the top oxide
700 is about 3 nm or more and about 14 nm or less.
[0055] FIG. 8a illustrates forming charge storage nodes 800 in the
openings 602 between the semiconductor substrate 504 and the first
poly layer 510. The charge storage node 800 indicated by a dashed
line 802 is exploded in FIG. 8b. The charge storage nodes 800 and
the undercut dielectric portion 600 may be referred to as a charge
storage layer.
[0056] The configuration and/or constituent of the charge storage
node 800 can vary and are not critical to the subject innovation.
The charge storage node 800 generally can contain any suitable
charge storage dielectric material (e.g., charge storage material
layer). Examples of charge storage dielectric materials include
nitrides (e.g., silicon nitride, silicon oxynitride, and silicon
rich nitride), oxides, silicates, a high-k dielectric, for example,
having a dielectric constant higher than that of silicon dioxide
(SiO.sub.2), or the like. In one embodiment, the charge storage
dielectric material contains silicon nitride, silicon oxynitride,
and/or silicon rich nitride. In another example, the charge storage
material contains oxides or silicates containing Al, Ta, Hf, La,
Zr, Ti, Nb, Cr, V, Y, Ce and/or Pr. The charge storage node 800 can
be formed on the semiconductor substrate 504 by any suitable
technique. For example, the charge storage node 800 can be formed
by CVD, lithography, and etching techniques.
[0057] Specific examples of charge storage node 800 include an
oxide/nitride/oxide tri-layer, an oxide/nitride bi-layer, a
nitride/oxide bi-layer, an oxide/tantalum oxide bi-layer
(SiO.sub.2/Ta.sub.2O.sub.5), an oxide/tantalum oxide/oxide
tri-layer (SiO.sub.2 /Ta.sub.2O.sub.5/SiO.sub.2), an
oxide/strontium titanate bi-layer (SiO.sub.2/SrTiO.sub.3), an
oxide/barium strontium titanate bi-layer (SiO.sub.2/BaSrTiO.sub.2),
an oxide/strontium titanate/oxide tri-layer
(SiO.sub.2/SrTiO.sub.3/SiO.sub.2), an oxide/strontium
titanate/barium strontium titanate tri-layer
(SiO.sub.2/SrTiO.sub.3/BaSrTiO.sub.2), or the like.
[0058] In one embodiment, the charge storage node 800 can contain
three layers: a first insulating layer, a charge storage material
layer, and a second insulating layer. The first and second
insulating layers can contain an oxide dielectric such as silicon
dioxide (SiO.sub.2) and the charge storage material layer can
contain a nitride dielectric such as silicon nitride
(Si.sub.xN.sub.y). The oxide-nitride-oxide configuration may be
referred to as an ONO layer. Especially, when the nitride
dielectric contains silicon rich nitride, the oxide-nitride-oxide
configuration may be referred to as an ORO layer. The
oxide-nitride-oxide layer can be fabricated by forming a first
silicon oxide layer, forming a silicon nitride layer on the first
silicon oxide layer, and forming a second silicon oxide layer on
the silicon nitride layer. In one embodiment, the first and second
insulating layers are made of a single insulating layer and ends of
the first and second insulating layers are connected with each
other.
[0059] In another embodiment, the charge storage node 800 can
contain five layers, for example, first oxide-first
nitride-polysilicon-second nitride-second oxide. The
oxide-nitride-polysilicon-nitride-oxide configuration may be
referred to as an ORPRO layer when the charge storage nitride layer
contains silicon rich nitride. In one embodiment, the first and
second oxide layers are made of a single oxide layer and connected
with each other. In another embodiment, the first and second
nitride layers made of a single nitride layer and connected with
each other.
[0060] By way of illustration, the charge storage nodes 800 of FIG.
8a contain an ORPRO layer containing an oxide layer 700, a charge
storage silicon rich nitride layer 804, and a polysilicon layer
806. The ORPRO layer can be formed by any suitable technique. For
example, a silicon rich nitride layer is formed on the oxide layer
700, 704 by, for example, deposition techniques (e.g., CVD, spin-on
techniques, or the like). A polysilicon layer is formed in an
opening surrounded with the nitride layer by, for example,
deposition techniques (e.g., CVD, spin-on techniques, or the like).
Then, portions of the oxide layer 704, the nitride layer, and the
polysilicon layer that are not covered with the first poly layer
510 and/or suitable masks are removed by, for example, etching. The
removed portions of oxide layer 704 contain, for example, the
portions of the oxide layer 704 on the surfaces of the first poly
510 and/or the semiconductor substrate 504. The portions can be
removed by, for example, etching. For example, portions of the
oxide layer 704 can be removed by contacting the oxide layer with
any suitable oxide etchant that does not substantially affect or
damage the integrity of other components/layers of the memory
device 500. The oxide etching can be dry etching or wet etching.
Examples of oxide etchants include halogen acids such as
hydrofluoric acid. In one embodiment, the oxide etchant is a
hydrofluoric acid solution such as a buffered hydrofluoric acid
(BHF: e.g., hydrofluoric acid-ammonium fluoride buffered solution).
In another embodiment, the oxide etchant is a vapor of hydrofluoric
acid. In yet another embodiment, portions of the oxide layer 704 is
removed by an oxide etchant gas, such as SiCl.sub.4/Cl.sub.2,
BCl.sub.3/Cl.sub.2, CCl.sub.4, mixtures of fluorinated or
chlorinated gases, mixtures of Freon-based gases, or the like.
[0061] In one embodiment, the charge storage nodes 800 have
relatively a sloping side surface that extends perpendicular to the
topological surface of the semiconductor substrate 504. In another
embodiment, the charge storage nodes 800 have a relatively vertical
side surface (not shown).
[0062] FIG. 8a also illustrates forming first bit lines 808 in the
semiconductor substrate 504 under the bit line openings 514. The
first bit lines 808 can be formed within the semiconductor
substrate 504 adjacent the charge storage nodes 800 and under the
bit line opening 514 by any suitable technique. For example, the
first bit line 808 is formed via implantation of one or more
dopants. The dopants pass through the bit line opening 514 and are
implanted into the semiconductor substrate 504 under the bit line
opening 514, leaving a channel region 810 of the semiconductor
substrate 504 between the first bit lines 808. Any suitable implant
compositions and concentrations can be employed for the first bit
lines 808. For example, the first bit lines 808 include one or more
n-type dopants (e.g., arsenic, phosphorous, antimony). Such dopants
can be implanted at a dose of about 0.2E15 atoms/cm.sup.2 or more
and about 4E15 atoms/cm.sup.2 or less and at an energy level of
about 2 KeV or more and about 40 KeV or less, for example. In one
embodiment, the semiconductor substrate 504 can contain other bit
line implants (not shown). The buried first bit lines 808 can act
as respective sources and drains for corresponding memory cells. As
such, respective channels 810 are defined between corresponding
pairs of buried first bit lines 808.
[0063] The first bit lines 808 can be formed at any suitable time.
For example, the first bit lines 808 are formed at any suitable
time after forming the bit line openings 514 and before forming bit
line dielectrics in the bit line openings 514. In one embodiment,
the first bit lines 808 are formed after forming the bit line
openings 514 and before forming the openings 602 between the
nitride layer 508 and the semiconductor substrate 504 or before
forming the charge storage nodes 800 (not shown).
[0064] FIG. 8b illustrates an exploded view of an exemplary storage
node 800 indicated by a dashed line 802 in FIG. 8a. In this
example, the storage node 800 contains a top oxide 700, a charge
storage nitride layer 804, and a polysilicon layer 806.
[0065] FIG. 9 illustrates forming bit line dielectrics 900 in the
bit line openings 514. The bit line dielectric 900 can contain any
suitable dielectric material such as oxides. Examples of oxides
include silicon oxide, tetraethylorthosilicate (TEOS) oxide, high
aspect ratio plasma (HARP) oxide, HTO, HDP oxide, or the like. The
bit line dielectric 900 can be formed by any suitable technique.
For example, a bit line dielectric layer is formed over the
semiconductor substrate 504 and an upper portion of the bit line
dielectric layer is removed, thereby leaving bit line dielectrics
900 in the bit line openings 514.
[0066] The bit line dielectric layer can be formed by any suitable
technique. In one embodiment, the bit line dielectric layer is
formed by a HTO deposition process. For example, the HTO is formed
by low pressure chemical vapor deposition (LPCVD) using nitrous
oxide (N.sub.2O) and dichlorosilane (SiH.sub.2Cl.sub.2) gasses at a
temperature of about 600 degrees Celsius or more and about 900
degrees Celsius or less and a pressure of about 100 mTorr or more
and about 500 mTorr or less. In another embodiment, the bit line
dielectric layer is grown in plasma at low temperatures, e.g.,
plasma-grown oxide. For example, the bit line dielectric layer
contains plasma-grown oxide that is grown at a temperature of about
250 degrees Celsius or more and about 600 degrees Celsius or less.
The bit line dielectric layer may be formed by a HDP deposition
process. The bit line dielectric layer can be optionally subjected
to an anneal in, for example, a nitrogen ambient at about 1,000
degrees Celsius for about thirty minutes.
[0067] An upper portion of the bit line dielectric layer can be
removed by any suitable technique. For example, the upper portion
of the bit line dielectric layer is removed by chemical-mechanical
polishing (CMP) and/or etching. For example, the upper portion of
the bit line dielectric layer is polished by CMP down to the upper
surface of the first poly layer 510 under any suitable condition to
facilitate removing/polishing the upper portion. The conditions
generally depend upon, for example, the thickness of the bit line
dielectric layer, the composition of the bit line dielectric layer,
the desired implementations and/or the memory device 500 being
fabricated, or the like.
[0068] The upper portion of the bit line dielectric layer can be
removed by etching. For example, when the bit line dielectric layer
contains oxide materials, the upper portion of the bit line
dielectric layer can be removed by contacting the bit line
dielectric layer with any suitable oxide etchant that does not
substantially affect or damage the integrity of other layers in the
memory device 500 such as the first poly layer 510. Any suitable
oxide etchant can be used as long as it is capable of removing
portions of the bit line dielectric layer selective to other layers
such as the first poly layer 510.
[0069] Any suitable amount of the upper portion of the bit line
dielectric layer can be removed. In one embodiment, the upper
surface of the first poly layer 510 is higher than the resultant
upper surface of the bit line dielectric 900. In another
embodiment, the upper surface of the first poly layer 510 is
substantially coplanar with the resultant upper surface of the bit
line dielectric 900 (not shown). In yet another embodiment, the
upper surface of the first poly layer 510 is lower than the
resultant upper surface of the bit line dielectric 900 (not shown).
Due to the removal of the upper portion of the bit line dielectric
layer, the upper surface of the first poly layer 510 can be
exposed.
[0070] FIG. 10 illustrates forming a second poly layer or a word
line 1000 over the semiconductor substrate 504, thereby forming a
memory cell 1002 on the semiconductor substrate 504. The word line
1000 can contain any suitable conductive material such as
polysilicon. The word line 1000 can be formed by, for example,
forming a layer of word line material over the semiconductor
substrate 504 and patterning (e.g., etching) the layer to establish
the word line 1000 over the first bit lines 808. The first bit
lines 808 and the word line 1000 are oriented at substantially
right angles relative to one another.
[0071] The memory cell 1002 contains the two charge storage nodes
800 on a semiconductor substrate 504 and the first poly gate 510 on
the charge storage nodes 800. The memory cell 1002 contains the
first bit lines 808 in the semiconductor substrate 504 under the
bit line openings 514. The two charge storage nodes 800 are
separated from each other by the dielectric undercut portion 600.
The top oxide layer 700 of the charge storage node 800 can be
formed by oxidizing a sacrificial nitride layer 508. In this
embodiment, the top oxide 700 is formed without replacing a first
poly gate. The memory cells 1002 are separated from each other by
the bit line dielectrics 900. The upper surface of the bit line
dielectric 900 can be lower than the upper surface of the first
poly gate 510.
[0072] The charge storage nodes 800 can store at least a bit of
information, respectively. For example, the memory cell 1002 is
capable of storing two spatially separated binary data bits,
including a left bit represented by the dashed circle A and a right
bit represented by the dashed circle B. When the memory cell 1002
is such a dual-bit memory cell, the dual-bit memory cell is
generally symmetrical, wherein a drain and a source are
interchangeable, although asymmetric implementations are possible
within the scope of the innovation. In the exemplary memory cell
1002, the left first bit lines 1004 may serve as the source
terminal and the right first bit lines 1006 as the drain terminal
with respect to the right bit. Likewise, the right first bit lines
1006 may serve as the source terminal and the left first bit lines
1004 as the drain terminal for the left bit. The subject innovation
may be implemented in association with various single or multi-bit
memory cell types including a SONOS cell. In addition, the
innovation is applicable to such dual-bit memory devices wherein
both bits are used for data or information storage, as well as
those in which only one bit (e.g., bit A) of the dual-bit cell is
so used.
[0073] FIG. 11a illustrates a cross sectional view of an
intermediate state of a portion of another exemplary memory device
1100. The intermediate state of the memory device 1100 contains an
intermediate state of one or more memory cells 1102. The
intermediate state of the memory cell 1102 contains a feature 1104
on a semiconductor substrate 1106. The features 1104 are separated
from each other on the semiconductor substrate 1106 by bit line
openings 1108. The feature 1104 contains a dielectric undercut
portion 1110 on the semiconductor substrate 1106, a nitride layer
1112 over the undercut portion 1110, a first poly layer 1114 over
the nitride layer 1112, and an oxide layer 1116 over exposed
surfaces of the semiconductor substrate 1106, the dielectric
undercut portion 1110, the nitride layer 1112, the first poly layer
1114, or combinations thereof. The feature 1104 also contains
openings 1118 around the undercut portion 1110 between the nitride
layer 1112 and the semiconductor layer 1106. Charge storage nodes
are formed in the openings 1118 in subsequent processes. A portion
of the intermediate charge storage node indicated by a dashed line
1120 is exploded in FIG. 11b.
[0074] The feature 1104 contains the same structure as the feature
502 in connection with FIG. 6 except the oxide layer 1116. The
oxide layer 1116 can be formed by any suitable technique. For
example, the oxide layer 1116 is formed by oxidation techniques,
deposition techniques such as CVD or spin-on techniques, or the
like. In one embodiment, the oxide layer 1116 is formed by
depositing oxide materials via CVD techniques. In another
embodiment, the oxide layer 1116 is formed by oxidizing the
surfaces of the semiconductor substrate 1106, the dielectric
undercut portion 1110, the nitride layer 1112, the first poly 1114,
or combinations thereof via, for example, SPA process.
[0075] The height of the oxide layer 1116 can be controlled by, for
example, adjusting oxidation conditions and deposition conditions.
The height of the oxide layer 1116 can vary and is not critical to
the subject innovation. The oxide layer 1116 has any suitable
height that depends on the desired implementations and/or the
memory device 1100 being fabricated. In one embodiment, the height
of the oxide layer 1116 is about 0.5 nm or more and about 10 nm or
less. In another embodiment, the height of the oxide layer 1116 is
about 1 nm or more and about 8 nm or less. In yet another
embodiment, the height of the oxide layer 1116 is about 2 nm or
more and about 7 nm or less.
[0076] The height of the nitride layer 1112 may vary and is not
critical to the subject innovation. The height may depend on, for
example, the desired implementations and/or the memory device 1100
being fabricated. In one embodiment, the height of the nitride
layer 1112 is about 0.5 nm or more and about 10 nm or less. In
another embodiment, the height of the nitride layer 1112 is about 1
nm or more and about 8 nm or less. In yet another embodiment, the
height of the nitride layer 1112 is about 2 nm or more and about 7
nm or less.
[0077] FIG. 11b illustrates an exploded view of a portion of an
exemplary intermediate charge storage node indicated by a dashed
line 1120 in FIG. 11a. In this example, an oxide layer 1116 is
formed on the inner surfaces of the opening 1118 (e.g., the
surfaces of the semiconductor substrate 1106, the dielectric
undercut portion 1110, and the nitride layer 1112) by, for example,
oxidation techniques or deposition techniques. In one embodiment,
the oxide layer 1116 is formed by oxidizing the inner surfaces of
the opening 1118. For example, portions of the bottom surface of
the nitride layer 1112 are oxidized to form the oxide layer 1116.
In another embodiment, when the dielectric undercut portion 1110
does not contain materials that can be oxidized, an oxide layer is
not formed on the surface of the undercut portion 1110 by
oxidation.
[0078] FIG. 12a illustrates forming charge storage nodes 1200 in
the openings 1118 between the semiconductor substrate 1106 and the
first poly layer 1114. The charge storage node 1200 indicated by a
dashed line 1202 is exploded in FIG. 12b. The charge storage nodes
1200 and the undercut dielectric portion 1110 may be referred to as
a charge storage layer.
[0079] The configuration and/or constituent of the charge storage
node 1200 can vary and are not critical to the subject innovation.
The charge storage node can contain any suitable charge storage
dielectric material (e.g., charge storage material layer). For
example, the charge storage node 1200 contains any of the materials
of the charge storage node 800 as described above in connection
with FIGS. 8a and 8b. By way of illustration, the charge storage
node 1200 in FIG. 12a contains an ORPRO layer. In this example, the
ORPRO charge storage node contains an oxide insulating layer 1204,
a charge storage silicon rich nitride layer 1206, and a polysilicon
layer 1208. The charge storage node 1200 can be formed by any
suitable technique. For example, the charge storage node 1200 can
be formed in the same manner as described in connection with the
formation of the charge storage node 800 in FIGS. 8a and 8b.
[0080] FIG. 12a also illustrates forming first bit lines 1210 in
the semiconductor substrate 1106 under the bit line openings 1108.
The first bit lines 1210 can be formed within the semiconductor
substrate 1106 adjacent the charge storage nodes 1200 and under the
bit line opening 1108 by any suitable technique. For example, the
first bit line 1210 is formed in the same manner as described in
connection with the formation of the first bit line 808 in FIG.
8a.
[0081] FIG. 12b illustrates an exploded view of an exemplary
storage node 1200 indicated by a dashed line 1202 in FIG. 12a. In
this example, the storage node 1200 contains an ORPRO layer
containing an oxide insulating layer 1204, a charge storage silicon
rich nitride layer 1206, and a polysilicon layer 1208.
[0082] FIG. 13 illustrates forming a bit line dielectric 1300 in
the bit line opening 1108. The bit line dielectric 1300 can contain
any suitable dielectric material such as oxides. For example, the
bit line dielectric 1300 contains any of the materials of the bit
line dielectric 900 as described above in connection with FIG. 9.
The bit line dielectric 1300 can be formed in the same manner as
described in connection with the formation of the bit line
dielectric 900 in FIG. 9.
[0083] FIG. 14 illustrates removing the first poly 1114 from the
memory device 1100, thereby exposing an upper surface of the
nitride layer 1112. The first poly 1114 can be removed by, for
example, etching. For example, the first poly 1114 can be removed
by contacting the first poly 1114 with any suitable poly etchant
that does not substantially affect or damage the integrity of other
components/layers of the memory device 1100. The poly etching can
be dry etching or wet etching. Examples of dry etching include
plasma etching, reactive ion etching (RIE), or the like. For
example, the plasma etching is performed with chlorinating agents
such as Cl.sub.2 or a combination of BCl.sub.3 and a halogenated
hydrocarbon. The poly etch can also be performed with combinations
of, for example, SiCl.sub.4, BCl.sub.3, HBr, Br.sub.2, SF.sub.6,
and CF.sub.4. Additives such as N.sub.2, O.sub.2, Ar, He, or any
other noble gas can be included. Other examples of the poly
etchants include tetraalkylammonium hydroxides (e.g.,
tetramethylammonium hydroxide (TMAH)) and alkali metal hydroxides
(e.g., a potassium hydroxide (KOH) and cerium hydroxide
(CeOH)).
[0084] FIG. 15a illustrates converting the nitride layer 1112 to a
top oxide layer 1500. The charge storage node 1200 containing the
top oxide layer 1500 indicated by a dashed line 1502 is exploded in
FIG. 15b. The top oxide layer 1500 can be formed by, for example,
oxidizing the nitride layer 1112. The nitride layer 1112 can be
oxidized by any suitable technique. For example, the nitride layer
1112 is oxidized in the same manner as described in connection with
the oxidation of the nitride layer 508 in FIG. 7a.
[0085] The top oxide 1500 is formed by converting the sacrificial
nitride layer 1112 to an oxide layer, and not by growing an oxide
layer on a surface of a poly layer. As a result, in one embodiment,
the method does not involve growing a top oxide on a surface of a
poly layer by, for example, oxidizing the poly layer. One advantage
of the resulting top oxide layer formed by converting a sacrificial
layer is that the oxide layer has substantially uniform height over
the semiconductor substrate. In this embodiment, the top oxide 1500
is formed with replacing a first poly gate. In other words, the
method involves removing a first poly 1114 to exposed an underlying
sacrificial nitride layer 1112, converting the nitride layer 1112
to an oxide layer 1500, and then reforming another poly layer on
the oxide layer in a subsequent process.
[0086] The height of the top oxide layer 1500 can vary and is not
critical to the subject innovation. The top oxide layer 1500 has
any suitable height that depends on the desired implementations
and/or the memory device 1100 being fabricated. In one embodiment,
the height of the top oxide layer 1500 is about 1 nm or more and
about 20 nm or less. In another embodiment, the height of the top
oxide layer 1500 is about 2 nm or more and about 16 nm or less. In
yet another embodiment, the height of the top oxide layer 1500 is
about 3 nm or more and about 14 nm or less.
[0087] In one embodiment, the surface of the bit line dielectric
1300 is oxidized at the same time that the nitride layer 1112 is
oxidized (not shown). For example, when the bit line dielectric
1300 contains materials that can be oxidized, an oxide layer can be
formed on the surface of the bit line dielectric 1300. When the bit
line dielectric 1300 does not contain materials that can be
oxidized, an oxide layer is not formed on the surface of the bit
line dielectric by the oxidation.
[0088] FIG. 15b illustrates an exploded view of an exemplary charge
storage node 1200 indicated by a dashed line 1502 in FIG. 15a after
converting the nitride layer 1112 to a top oxide layer 1500. When
the nitride layer 1112 contains silicon nitride materials (e.g.,
Si.sub.3N.sub.4), the resultant top oxide layer 1500 can contain
silicon oxide materials (e.g., SiO.sub.2).
[0089] FIG. 16 illustrates forming a second poly 1600 over the
semiconductor substrate 1106, thereby forming a memory cell 1602
having improved quality of the top oxide 1500 on the charge storage
material layer 1206. The second poly 1600 typically contains
polysilicon. The second poly 1600 can be formed over the
semiconductor substrate 1106 by, for example, CVD. The second poly
1600 may be a word line of the memory device 1100.
[0090] The height of the second poly 1600 may vary and is not
critical to the subject innovation. The second poly 1600 can have
any suitable height that depends on, for example, the desired
implementations and/or the memory device 1100 being fabricated. In
one embodiment, the height of the second poly 1600 is about 20 nm
or more and 200 nm or less. In another embodiment, the height of
the second poly 1600 is about 30 nm or more and 150 nm or less. In
yet another embodiment, the height of the second poly 1600 is about
40 nm or more and 100 nm or less. In still yet another embodiment,
the height of the second poly 1600 is about 60 nm.
[0091] The charge storage nodes 1200 are physically and
electrically separated from each other by the dielectric undercut
portion 1110. Since the charge storage nodes can store at least a
bit of information, respectively, the memory cell 1602 is capable
of storing two spatially separated binary data bits, including a
left bit represented by the dashed circle A and a right bit
represented by the dashed circle B.
[0092] FIG. 17 illustrates an exemplary methodology of forming top
oxides of memory cells and/or improving quality of top oxides of
memory cells. At 1700, dielectric layers, nitride layers, and first
poly layers are formed on a semiconductor substrate. At 1702, end
portions of the dielectric layers are removed, thereby forming
openings between the nitride layers and the semiconductor substrate
and exposing portions of bottom surfaces of the nitride layers in
the openings. At 1704, the exposed bottom portions of the nitride
layers are oxidized to form top oxides. At 1706, charge storage
material layers are formed in the openings.
[0093] FIG. 18 illustrates another exemplary methodology of forming
a memory device containing memory cells and bit line openings
therebetween. At 1800, charge storage layers are formed on a
semiconductor substrate, nitride layers are formed on the charge
storage layers, first poly layers are formed on the charge storage
layers, and bit line dielectrics are formed in the bit line
openings. At 1802, the first poly layers are removed to expose at
least portions of upper surfaces of the nitride layers. At 1804,
the exposed nitride layers are oxidized to form top oxides.
[0094] FIG. 19 illustrates yet another exemplary methodology of
improving quality of a top oxide of a memory cell. At 1900, a
charge storage layer on a semiconductor substrate, a nitride layer
on the charge storage layer, and a first poly layer on the nitride
layer are provided. At 1902, at least a portion of the nitride
layer is converted to a top oxide. In one embodiment, the charge
storage layer is provided by forming a dielectric layer on the
semiconductor; removing end portions of the dielectric layer and
forming openings between the nitride layer and the semiconductor
substrate; and forming a charge storage material layer in the
opening. In another embodiment, at least a portion of the nitride
layer is converted to a top oxide by forming openings under the
nitride layer on the semiconductor substrate to expose portions of
a bottom surface of the nitride layer; and oxidizing the exposed
portions of the bottom surface of the nitride layer. In yet another
embodiment, at least of the nitride layer is converted to a top
oxide by removing the first poly layer to expose an upper portions
of the nitride layer; and oxidizing the exposed upper portions of
the nitride layer.
[0095] Although not shown, the methodologies of FIGS. 17-19 can
include any suitable semiconductor structure fabrication processes.
General examples of semiconductor structure fabrication processes
include masking, patterning, etching, cleaning, planarization,
thermal oxidation, implant, annealing, thermal treatment, and
deposition techniques normally used for making semiconductor
structures.
[0096] The resultant memory devices formed herein can be any
suitable memory devices. Examples of memory devices include
volatile memories and non-volatile memories. Examples of volatile
memories include RAM such as SRAM, dynamic RAM (DRAM), synchronous
DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM
(ESDRAM), Synchlink DRAM (SLDRAM), Rambus direct RAM (RDRAM),
direct Rambus dynamic RAM (DRDRAM), Rambus dynamic RAM (RDRAM), or
the like. Examples of non-volatile memories include ROM, PROM,
electrically programmable ROM (EPROM), electrically erasable
programmable ROM (EEPROM), flash memory, or the like. The memory
device also can be employed for central processing units (CPUs),
input/output devices (I/O chips), or the like.
[0097] The resultant memory devices formed herein are useful in any
electronic device. For example, the resultant memory devices are
useful in computers, appliances, industrial equipment, hand-held
devices, telecommunications equipment, medical equipment, research
and development equipment, transportation vehicles, radar/satellite
devices, or the like. Hand-held devices, and particularly hand-held
electronic devices can achieve improvements in portability due to
the quality, small size, lightweight of the memory devices.
Examples of hand-held devices include cell phones and other two way
communication devices, personal data assistants, Palm Pilots,
pagers, notebook computers, remote controls, recorders (video and
audio), radios, small televisions and web viewers, cameras, or the
like.
[0098] What has been described above includes examples of the
subject innovation. It is, of course, not possible to describe
every conceivable combination of components or methodologies for
purposes of describing the subject innovation, but one of ordinary
skill in the art may recognize that many further combinations and
permutations of the subject innovation are possible. Accordingly,
the subject innovation is intended to embrace all such alterations,
modifications and variations that fall within the spirit and scope
of the appended claims. Furthermore, to the extent that the term
"contain," "includes," and "involves" are used in either the
detailed description or the claims, such terms are intended to be
inclusive in a manner similar to the term "comprising" as
"comprising" is interpreted when employed as a transitional word in
a claim.
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