U.S. patent application number 12/894533 was filed with the patent office on 2011-09-22 for heat dissipation device.
This patent application is currently assigned to MAN ZAI INDUSTRIAL CO., LTD.. Invention is credited to Su-Chen Hu, Hao-Hui Lin, Cheng-Feng Wan.
Application Number | 20110226456 12/894533 |
Document ID | / |
Family ID | 44646288 |
Filed Date | 2011-09-22 |
United States Patent
Application |
20110226456 |
Kind Code |
A1 |
Wan; Cheng-Feng ; et
al. |
September 22, 2011 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device has an inlet pipeline, an outlet
pipeline, at least one heat-dissipating unit and at least one
actuator. Each of the at least one heat-dissipating unit is
connected to the inlet pipeline and the outlet pipeline and
includes multiple heat-dissipating elements being connected to each
other. The at least one actuator is mounted on the inlet pipeline.
The heat dissipation device is mounted around a large-sized
electronic appliance to absorb and dissipate the heat generated by
the large-sized electronic appliance so as to effectively reduce
the working temperature of the electronic appliance to normal
level. Therefore, the large-sized electronic appliance can work
safely and is power-saving and environmental friendly.
Inventors: |
Wan; Cheng-Feng; (Tainan,
TW) ; Lin; Hao-Hui; (Tainan, TW) ; Hu;
Su-Chen; (Tainan, TW) |
Assignee: |
MAN ZAI INDUSTRIAL CO.,
LTD.
Tainan
TW
|
Family ID: |
44646288 |
Appl. No.: |
12/894533 |
Filed: |
September 30, 2010 |
Current U.S.
Class: |
165/181 |
Current CPC
Class: |
F28D 2021/0031 20130101;
H05K 7/20763 20130101; F28D 1/05366 20130101; F28F 27/02
20130101 |
Class at
Publication: |
165/181 |
International
Class: |
F28F 1/12 20060101
F28F001/12 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 16, 2010 |
TW |
099204539 |
Claims
1. A heat dissipation device comprising: an inlet pipeline; an
outlet pipeline; at least one heat-dissipating device connected
between the inlet and outlet pipelines, and each one of the at
least one heat-dissipating unit comprising multiple
heat-dissipating elements connected with each other via tubes; an
inlet tube connected to the inlet pipeline and at least one of the
heat-dissipating elements; an outlet tube connected to the outlet
pipeline and at least one of the heat-dissipating elements; and at
least one actuator mounted in the inlet pipeline.
2. The heat dissipation device as claimed in claim 1, wherein each
one of the at least one heat-dissipating unit comprising a first
heat-dissipating element comprising multiple cooling fins and
having a first inlet end and a first outlet end; and a second
heat-dissipating element comprising multiple cooling fins and
having a second inlet end and a second outlet end.
3. The heat dissipation device as claimed in claim 2, wherein the
first heat-dissipating element of each one of the at least one
heat-dissipating unit is connected to the second heat-dissipating
element of the at least one heat-dissipating unit in parallel; the
first inlet end of the first heat-dissipating element and the
second inlet end of the second heat-dissipating element of each one
of the at least one heat-dissipating unit are connected to the
inlet tube of the heat-dissipating unit; and the first outlet end
of the first heat-dissipating element and the second outlet end of
the second heat-dissipating element of each one of the at least one
heat-dissipating unit are connected to the outlet tube of the
heat-dissipating unit.
4. The heat dissipation device as claimed in claim 2, wherein the
first heat-dissipating element of each one of the at least one
heat-dissipating unit is connected to the second heat-dissipating
element of the heat-dissipating unit in series; the first inlet end
of the first heat-dissipating element of each one of the at least
one heat-dissipating unit is connected to the inlet tube of the
heat-dissipating unit; the first outlet end of the first
heat-dissipating element of each one of the at least one
heat-dissipating unit is connected to the second inlet end of the
second heat-dissipating element of the heat-dissipating unit; and
the second outlet end of the second heat-dissipating element of
each one of the at least one heat-dissipating unit is connected to
the outlet tube of the heat-dissipating unit.
5. The heat dissipation device as claimed in claim 2, wherein the
heat dissipation device comprises multiple heat-dissipating
units.
6. The heat dissipation device as claimed in claim 5, wherein the
first heat-dissipating element of each heat-dissipating unit is
connected to the second heat-dissipating element of the
heat-dissipating unit is connected in parallel; the first inlet end
of the first heat-dissipating element and the second inlet end of
the second heat-dissipating element of each heat-dissipating unit
is connected to the inlet pipeline; and the first outlet end of the
first heat-dissipating element and the second outlet end of the
second heat-dissipating element of each heat-dissipating unit is
connected to the outlet pipeline.
7. The heat dissipation device as claimed in claim 6, wherein the
first heat-dissipating element of each heat-dissipating unit is
connected to the second heat-dissipating element of the
heat-dissipating unit is connected in series; the first inlet end
of the first heat-dissipating element of each heat-dissipating unit
is connected to the inlet pipeline; the first outlet end of the
first heat-dissipating element of each heat-dissipating unit is
connected to the second outlet end of the second heat-dissipating
element of the heat-dissipating unit; and the second outlet end of
the second heat-dissipating element of each heat-dissipating unit
is connected to the outlet pipeline.
8. The heat dissipation device as claimed in claim 2, wherein each
one of the at least one heat-dissipating unit further comprises a
third heat-dissipating element having a third inlet end and a third
outlet end.
9. The heat dissipation device as claimed in claim 8, wherein the
first heat-dissipating element, the second heat-dissipating element
and the third heat-dissipating element of each one of the at least
one heat-dissipating unit are connected to each other in parallel;
the first inlet end, the second inlet end and the third inlet of
each one of the at least one heat-dissipating unit end are
connected to the inlet tube of the heat-dissipating unit; and the
first outlet end, the second outlet end and the third outlet end of
each one of the at least one heat-dissipating unit are connected to
the outlet tube of the heat-dissipating unit.
10. The heat dissipation device as claimed in claim 8, wherein the
first heat-dissipating element, the second heat-dissipating element
and the third heat-dissipating element of each one of the at least
one heat-dissipating unit are connected to each other in series;
and the inlet tube of each one of the at least one heat-dissipating
unit is connected to the first inlet end of the first
heat-dissipating element of the heat-dissipating unit; the first
outlet end of the first heat-dissipating element of each one of the
at least one heat-dissipating unit is connected to the second inlet
end of the second heat-dissipating element of the heat-dissipating
unit; the second outlet end of the second heat-dissipating element
of each one of the at least one heat-dissipating unit is connected
to the third inlet end of the third heat-dissipating element of the
heat-dissipating unit; and the third outlet end of the third
heat-dissipating element of each one of the at least one
heat-dissipating unit is connected to the outlet tube of the
heat-dissipating unit.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a heat dissipation device, and more
particularly to a heat dissipation device for cooling a large-sized
electronic appliance.
[0003] 2. Description of Related Art
[0004] Large-sized electronic appliances, such as workstations or
servers produce heat during operation to cause the working
temperature of the electronic appliances becoming high. When the
working temperature of a large-sized electronic appliance achieves
a high level, the electronic appliance is easily damaged.
Therefore, how to keep the working temperature of the large-sized
electronic appliance at a controlled level is a very important
issue.
[0005] To reduce the working temperature of a large-sized
electronic appliance, an air conditioner is always used to make the
large-sized electronic appliance working at a good condition and
release hot air with carbon dioxide to cause acceleration of global
warming.
SUMMARY OF THE INVENTION
[0006] An objective of the invention is to provide a heat
dissipation device to dissipate the heat produced by a large-sized
electronic appliance.
[0007] The heat dissipation device is filled with a coolant and
comprises an inlet pipeline, an outlet pipeline, at least one
heat-dissipating unit and at least one actuator. Each of the at
least one heat-dissipating unit includes multiple heat-dissipating
elements, an inlet tube and an outlet tube. The heat-dissipating
elements are connected to each other via tubes. The inlet tube is
connected with the inlet pipeline and the outlet tube is connected
with the outlet pipeline. The at least one actuator is mounted on
the inlet pipeline to drive the coolant flowing through the heat
dissipation device.
[0008] The heat dissipation device is mounted on a large-sized
electronic appliance to absorb and dissipate the heat generated by
the large-sized electronic appliance with the at least one
heat-dissipating unit. Thus, the heat dissipation device can
effectively reduce the working temperature of the electronic
appliance to an optimal level and is power-saving and environmental
friendly.
[0009] Other objectives, advantages and novel features of the
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is an operational perspective view of the
heat-dissipating elements of a first embodiment of a heat
dissipation device in accordance with the present invention;
[0011] FIG. 2 is a schematic diagram of the heat dissipation device
in FIG. 1, showing a first heat-dissipating element and a second
heat-dissipating element connected in parallel;
[0012] FIG. 3 is an operational schematic diagram of the heat
dissipation device in FIG. 1, showing flow path of the coolant;
[0013] FIG. 4 is a schematic diagram of the heat dissipation device
in FIG. 1, showing a first heat-dissipating element and a second
heat-dissipating element connected in series;
[0014] FIG. 5 is a schematic diagram of the heat dissipation device
in FIG. 1, showing flow path;
[0015] FIG. 6 is a schematic diagram of the heat dissipation device
in FIG. 1, showing a first heat-dissipating element, a second
heat-dissipating element and a third heat-dissipating element
connected in parallel;
[0016] FIG. 7 is a schematic diagram of the heat dissipation device
in FIG. 1, showing a first heat-dissipating element, a second
heat-dissipating element and a third heat-dissipating element
connected in series; and
[0017] FIG. 8 is a schematic diagram of the heat dissipation device
in FIG. 1, showing the heat dissipation device used around a
large-sized electronic appliance.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0018] With reference to FIGS. 1 and 2, a heat dissipation device
in accordance with the present invention comprises an inlet
pipeline 10, an outlet pipeline 20, at least one heat-dissipating
unit 30 and at least one actuator 40.
[0019] Each of the at least one heat-dissipating unit 30 includes
multiple heat-dissipating elements 31,32, an inlet tube 33 and an
outlet tube 34. The heat-dissipating elements 31,32 filled with
coolant are connected with each other in parallel via tubes 70. The
inlet tube 33 is connected to the heat-dissipating units 31,32 with
the tubes 70 and the inlet pipeline 10. The outlet tube 34 is
connected to the heat-dissipating units 31,32 with the tubes 70 and
the outlet pipeline 20. The inlet pipeline 10 and the outlet
pipeline 20 are further connected to a chiller to form a coolant
cycle.
[0020] The at least one actuator 40 is mounted on the inlet
pipeline 10 and drives the coolant to flow through the
heat-dissipating elements 31,32 of the at least one
heat-dissipating unit 30.
[0021] With reference to FIGS. 1 and 2, in a preferred embodiment,
each of the at least one heat-dissipating unit 30 includes a first
heat-dissipating element 31 and a second heat-dissipating element
32. Each heat-dissipating element 31,32 comprises multiple cooling
fins 35. The first heat-dissipating element 31 has a first inlet
end 36 and a first outlet end 37. The second heat-dissipating
element 32 has a second inlet end 38 and a second outlet end
39.
[0022] With reference to FIGS. 2 and 3, the first heat-dissipating
element 31 is connected to the second heat-dissipating element 32
in parallel via tubes 70. The first inlet end 36 of the first
heat-dissipating element 31 is connected to the inlet tube 33 and
the second inlet end 38 of the second heat-dissipating element 32.
The first outlet end 37 of the first heat-dissipating element 31 is
connected to the second outlet end 39 of the second
heat-dissipating element 32 and the outlet tube 34. The at least
one actuator 40 drives the coolant in the inlet pipeline 10 to flow
through the first heat-dissipating element 31 and the second
heat-dissipating element 32 simultaneously and into the outlet
pipeline 20.
[0023] With reference to FIGS. 4 and 5, the first heat-dissipating
element 31 is connected to the second heat-dissipating element 32
in series. The first inlet end 36 of the first heat-dissipating
element 31 is connected to the inlet tube 33. The first outlet end
37 of the first heat-dissipating element 31 is connected to the
second inlet end 38 of the second heat-dissipating element 32. The
second outlet end 39 of the second heat-dissipating element 32 is
connected to the outlet tube 34. The at least one actuator 40
drives the coolant in the inlet pipeline 10 to flow through the
first heat-dissipating element 31, the second heat-dissipating
element 32 in sequence and into the outlet pipeline 20.
[0024] Moreover, the heat dissipation device comprises multiple
heat-dissipating devices 30. In some of the heat-dissipating
devices 30, the first heat-dissipating element 31 is connected to
the second heat-dissipating element 32 in parallel. In the other
heat-dissipating devices 30, the first heat-dissipating element 31
is connected to the second heat-dissipating element 32 in
series.
[0025] With reference to FIG. 6, in another preferred embodiment,
each of the at least one heat-dissipating unit 30 further comprises
a third heat-dissipating element 80. The third heat-dissipating
element 80 has a third inlet end 81 and a third outlet end 82.
[0026] The first heat-dissipating element 31, the second
heat-dissipating element 32 and the third heat-dissipating element
80 are connected to each other in parallel via tubes 70. The inlet
tube 33 is connected to the first inlet end 36, the second inlet
end 38 and the third inlet end 81 via tubes 70. The outlet tube 34
is connected to the first outlet end 37, the second outlet end 39
and the third outlet end 82 via tubes 70.
[0027] With reference to FIG. 7, the first heat-dissipating element
31, the second heat-dissipating element 32 and the third
heat-dissipating element 80 are connected to each other in series
via tubes 70. The inlet tube 33 is connected to the first inlet end
36 of the first heat-dissipating element 31. The first outlet end
37 of the first heat-dissipating element 31 is connected to the
second inlet end 38 of the second heat-dissipating element 32. The
second outlet end 39 of the second heat-dissipating element 32 is
connected to the third inlet end 81 of the third heat-dissipating
element 80, and the third outlet end 82 of the third
heat-dissipating element 80 is connected to the outlet tube 34.
[0028] With reference to FIG. 8, in use, the heat dissipation
device in accordance with the present invention is mounted on a
large-sized electronic appliance 50. At least one fan 60 is mounted
between the heat dissipation device and the large-sized electronic
appliance 50 to increase a convection of heat generated by the
large-sized electronic appliance 50. The coolant in the inlet
pipeline 10 is driven by the at least one actuator 40 and flows
through the first heat-dissipating element 31 and the second
heat-dissipating element 32. The at least one fan 60 blows air to
flow through the large-sized electronic appliance 50 and to absorb
the heat generated by the large-sized electronic appliance 50, and
the air at a high temperature is then blown toward and through the
heat-dissipating elements 31,32 of the at least one
heat-dissipating unit 30. Accordingly, the heat in the high
temperature air can be absorbed by the coolant in the at least one
heat-dissipating unit 30, and the air can be cooled down. The
coolant that absorbs the heat generated by the large-sized
electronic appliance 50 can be cooled by the chiller that is
connected to the outlet pipeline 20 and then is led into the inlet
pipeline 10 again.
[0029] Accordingly, the heat dissipation device in accordance with
the present invention can absorb and dissipate the heat generated
by the large-sized electronic appliance 50 by the heat-dissipating
elements 31,32,80 of the at least one heat-dissipating unit 30
mounted on the large-sized electronic appliance 50 to reduce
effectively the working temperature of the electronic appliance 50
to an optimal level. Thus, the large-sized electronic appliance 50
can work at a good condition. Furthermore, the heat dissipation
device in accordance with the present invention is power-saving and
environmental friendly.
[0030] Even though numerous characteristics and advantages of the
present invention have been set forth in the foregoing description,
together with details of the structure and function of the
invention, the disclosure is illustrative only. Changes may be made
in detail, especially in matters of shape, size, and arrangement of
parts within the principles of the invention to the full extent
indicated by the broad general meaning of the terms in which the
appended claims are expressed.
* * * * *