U.S. patent application number 12/661535 was filed with the patent office on 2011-09-22 for efficient heat pump.
This patent application is currently assigned to AIR GENERATE INC. Invention is credited to Sunil Kumar Sinha.
Application Number | 20110225990 12/661535 |
Document ID | / |
Family ID | 44646119 |
Filed Date | 2011-09-22 |
United States Patent
Application |
20110225990 |
Kind Code |
A1 |
Sinha; Sunil Kumar |
September 22, 2011 |
Efficient heat pump
Abstract
An efficient heat pump is disclosed, the heat content of the
refrigerant flowing out of an existing condenser is reduced by
sub-cooling using an additional condenser. The heat reduced during
the sub-cooling phase is added to the evaporator to superheat the
refrigerant during evaporation phase. Removing heat from
condensation phase (which is otherwise wasted) of the refrigeration
cycle and adding that heat to the evaporation phase (which requires
additional heat) may enhance the efficiency of the heat pump.
Inventors: |
Sinha; Sunil Kumar;
(Houston, TX) |
Assignee: |
AIR GENERATE INC
|
Family ID: |
44646119 |
Appl. No.: |
12/661535 |
Filed: |
March 19, 2010 |
Current U.S.
Class: |
62/79 ;
62/238.7 |
Current CPC
Class: |
F25B 40/02 20130101;
F25B 30/02 20130101; F25B 40/00 20130101 |
Class at
Publication: |
62/79 ;
62/238.7 |
International
Class: |
F25B 7/00 20060101
F25B007/00; F25B 27/00 20060101 F25B027/00 |
Claims
1. A heat pump comprising: an existing condenser, wherein the
existing condenser includes an inlet, an outlet and a condenser
pipe, wherein the existing condenser is to generate a first
refrigerant at first temperature by dissipating a first portion of
heat from a refrigerant flowing through the condenser pipe to a
medium surrounding the existing condenser, an additional condenser
comprising an input side, an output side and a condenser element,
wherein the input side is coupled to the outlet of the existing
condenser and the output side is coupled to the first input of a
heat exchanger, wherein the additional condenser is to generate a
second refrigerant at a second temperature by further reducing a
second portion of heat of the first refrigerant by dissipating the
second portion of heat of the first refrigerant flowing through the
condenser element to a substance flowing over the condenser
element, a heat exchanger including a first and second input and a
first and second output, wherein the heat exchanger is to receive
the second refrigerant through the first input and a third
refrigerant through the second input, wherein a third portion of
heat content is transferred from the second refrigerant to the
third refrigerant, an expansion valve is to generate a fourth
refrigerant by performing adiabatic expansion in response to
receiving the second refrigerant from the heat exchanger, and an
evaporator to generate the third refrigerant in response to
receiving the fourth refrigerant, wherein the heat content of the
substance is added to the third refrigerant by passing the
substance over the evaporator, wherein dissipating the second
portion of heat of the first refrigerant flowing through the
condenser element to a substance flowing over the condenser element
and adding the heat content of the substance to the third
refrigerant by passing the substance over the evaporator is to
enhance the performance of the heat pump.
2. The heat pump of claim 1, wherein reducing the second portion of
heat of the first refrigerant by dissipating the second portion of
heat of the first refrigerant flowing through the condenser element
to a substance flowing over the condenser element is to increase an
area of a refrigeration cycle by a first value.
3. The heat pump of claim 1, wherein transferring the third portion
of heat content from the second refrigerant to the third
refrigerant is to increase the area of the refrigeration cycle by a
second value.
4. The heat pump of claim 1, wherein the condenser pipe of the
existing condenser is made of a metal, which is a good conductor of
heat.
5. The heat pump of claim 1, wherein the condenser element of the
additional condenser is made of metal, which is a good conductor of
heat.
6. The heat pump of claim 4, wherein the existing condenser is
submerged in a first liquid tank to use the first portion of heat
to increase the temperature of the liquid in the first liquid
tank.
7. The heat pump of claim 1 further comprises an air blower,
wherein the air blower is to blow the air on the additional
condenser to dissipate the second portion of heat from the first
refrigerant.
8. The heat pump of claim 1 further comprises a sprinkler, wherein
the sprinkler is to sprinkle a liquid on the additional condenser
to dissipate the second portion of heat from the first
refrigerant.
9. The heat pump of claim 1 further comprises a second liquid tank,
wherein the additional condenser is submerged into the second
liquid tank, wherein the second portion of heat is dissipated to
the liquid in the second liquid tank from the first
refrigerant.
10. The heat pump of claim 1, wherein the second portion of heat
extracted from the first refrigerant in the additional condenser is
added to the third refrigerant to increase the temperature of the
third refrigerant generated by the evaporator.
11. The heat pump of claim 10, wherein the second portion of heat
is absorbed by an ambient air blown over the additional
condenser.
12. The heat pump of claim 11, wherein the ambient air, which has
absorbed the second portion of heat, is blown over the evaporator
to increase the temperature of the third refrigerant.
13. The heat pump of claim 1, wherein the heat pump is placed in an
open space outside the enclosed space, wherein the temperature of
the open space is substantially lesser than that of the enclosed
space.
14. The heat pump of claim 13, wherein ambient air from the open
space that is cold is used to extract the second portion of heat
from the first refrigerant while passing through the additional
condenser during a second condensation phase.
15. The heat pump of claim 14, wherein the extracted second portion
of heat is utilized to increase the temperature of the third
refrigerant during evaporation phase.
16. The heat pump of claim 9, wherein the liquid in the second
liquid tank is allowed to flow over the evaporator to add second
portion of heat to the third refrigerant.
17. The heat pump of claim 1, wherein the heat exchanger is used to
further increase the temperature of the third refrigerant by
allowing the third portion of heat of the second refrigerant to be
transferred to the third refrigerant within the heat exchanger.
18. The heat pump of claim 17, wherein the heat exchanger is
tube-in-tube heat exchanger.
19. The heat pump of claim 1, wherein the extracting the second
portion of heat from the first refrigerant in the additional
condenser is to enhance the refrigeration effect of the fourth
refrigerant.
20. The heat pump of claim 19, wherein the enhanced refrigeration
effect of the fourth refrigerant is use to provide cooling effect
by passing ambient air over the fourth refrigerant, wherein the
ambient air that is passed over the fourth refrigerant is
distributed in a closed industrial and domestic space.
21. The heat pump of claim 17, wherein the first portion of the
heat and the second portion of heat is channelized to provide
heating effect in a closed industrial and domestic space.
22. A method to enhance coefficient of performance of a heat pump,
comprising: receiving an initial refrigerant, generating a first
refrigerant at a first temperature by dissipating a first portion
of heat from the initial refrigerant in a first condensation phase,
generating a second refrigerant at a second temperature by further
reducing a second portion of heat from the first refrigerant by
dissipating the second portion of heat of the first refrigerant in
a second condensation phase, transferring a third portion of heat
from the second refrigerant to a third refrigerant in a
superheating phase in response to receiving the second refrigerant
and the third refrigerant in a superheating phase, generating a
fourth refrigerant by performing adiabatic expansion in response to
receiving the second refrigerant after the superheating phase, and
generating the third refrigerant in response to receiving the
fourth refrigerant, wherein the second portion of heat extracted in
the second condensation phase is added to the third refrigerant in
an evaporation phase, wherein dissipating the second portion of
heat of the first refrigerant in second condensation phase and
adding the second portion of heat to the third refrigerant in
evaporation phase is to enhance the performance of the heat
pump.
23. The method of claim 22, wherein dissipating the second portion
of heat of the first refrigerant in second condensation phase is to
increase an area of a refrigeration cycle by a first value.
24. The method of claim 22, wherein transferring the third portion
of heat content from the second refrigerant to the third
refrigerant is to increase the area of the refrigeration cycle by a
second value.
25. The method of claim 22 further comprises using a first liquid
to extract the first portion of heat from the initial refrigerant,
which increases the temperature of the first liquid.
26. The method of claim 22 further comprises blowing ambient air to
extract second portion of heat from the first refrigerant in the
second condensation phase.
27. The method of claim 22 further comprises sprinkling a second
liquid to extract the second portion of heat from the first
refrigerant in the second condensation phase.
28. The method of claim 22 further comprises passing the first
refrigerant through the second liquid to extract the second portion
of heat from the first refrigerant in the second condensation
phase.
29. The method of claim 22 further comprises increasing the
temperature of the third refrigerant generated in the evaporation
phase by adding the second portion of heat extracted from the first
refrigerant in the second condensation phase to the third
refrigerant.
30. The method of claim 26 further comprises increasing the
temperature of the third refrigerant in the evaporation phase by
blowing the ambient air, which has absorbed the second portion of
heat from the first refrigerant.
31. The method of claim 22 further comprises provisioning the heat
pump in an open space outside the enclosed space, wherein the
temperature of the open space is substantially lesser than that of
the enclosed space.
32. The method of claim 31 further comprises using the cold air
from open space to extract the second portion of heat from the
first refrigerant while passing through the additional condenser
during a second condensation phase.
33. The method of claim 33 further comprises increasing the
temperature of the third refrigerant by utilizing the extracted
second portion of heat during evaporation phase.
34. The method of claim 28 further comprises adding the second
portion of heat to the third refrigerant in the evaporation phase
by allowing the second liquid to flow over third refrigerant.
35. The method of claim 22 further comprises increasing the
temperature of the third refrigerant by transferring the third
portion of heat of the second refrigerant to the third refrigerant
in the superheating phase.
36. The method of claim 22 further comprises extracting the second
portion of heat from the first refrigerant is to enhance the
refrigeration effect of the fourth refrigerant.
37. The method of claim 36, wherein using the enhanced
refrigeration effect of the fourth refrigerant to provide cooling
effect by passing ambient air over the fourth refrigerant, wherein
the ambient air that is passed over the fourth refrigerant is
distributed in a closed industrial and domestic space.
38. The method of claim 22 further comprises channelizing the first
portion of the heat and the second portion of heat to provide
heating effect in a closed industrial and domestic space.
Description
FIELD OF INVENTION
[0001] The present invention in general relates to heat pumps and
in particular relates to enhancing performance of a heat pump.
BACKGROUND OF INVENTION
[0002] Typically, a cooling system such as refrigeration and
air-conditioning systems include a heat pump to maintain the
temperature (here degree of coldness) of the cooling system at a
preset level. The heat pump absorbs the heat generated within the
cooling system and dissipates the heat to an outside area (open
space, for example). The heat pump includes a compressor, a
condenser, an expansion valve and an evaporator. The heat pump uses
the condenser to dissipate the heat of the refrigerant to the
outside area. The heat dissipated to the outside area through the
condenser may be advantageously used to heat matter such as liquids
and gases. The heat content of the refrigerant entering the
condenser from the compressor may be "X".degree. F. (for example,
"X" may be around 180.degree. F. to 220.degree. F.). The condenser
may dissipate heat from the refrigerant to the outside area or to
the matter to reduce the heat content of the refrigerant and
generally the refrigerant may lose Y.degree. F. The heat content of
the refrigerant at the outlet of the condenser (provided as input
to the expansion valve) may be "X-Y".degree. F. ("X-Y" may be
around 130.degree. F. to 150.degree. F.).
[0003] The low temperature (for example, 130.degree. F. to
150.degree. F.), high pressure vapor refrigerant is then passed
through the expansion valve. As a result of the adiabatic expansion
in the expansion valve, the temperature and pressure of the
refrigerant decreases substantially. If the temperature of the
refrigerant entering the expansion valve is higher (say X-Y=130 to
150.degree. F.), after adiabatic expansion the temperature of the
refrigerant may not drop to a level required to cause efficient
refrigeration effect or cooling. On the other hand, the work load
or the effort made by the expansion valve to bring the temperature
of refrigerant to a desired level may be more if the temperature of
the refrigerant entering the expansion valve is high. Also, the
heat lost by the refrigerant is unnecessarily wasted. The higher
work load on the expansion valve and the unnecessary wastage of
heat may decrease the efficiency or performance of the heat pump.
It is therefore desirable to reduce the temperature of the
refrigerant entering the expansion valve.
BRIEF DISPRIPTION OF DRAWINGS
[0004] The invention herein described is by the way of example and
not by the way of limiting by supplementing to the figures drawn.
For clarity and simplicity of illusions, the elements in the figure
are not necessarily drawn to the scale. For instance, dimension of
some of the elements magnified when compared to other elements for
clarity.
[0005] FIG. 1 illustrates a heat pump 100.
[0006] FIG. 2 illustrates a heat pump 200 including an air-cooled
condenser in which the coefficient of performance is enhanced in
accordance with a first embodiment.
[0007] FIG. 3 illustrates a heat pump 300 including a liquid cooled
condenser in which the coefficient of performance is enhanced in
accordance with a second embodiment.
[0008] FIG. 4 illustrates a heat pump 400 including a liquid cooled
condenser, which enhances the efficiency of a liquid heating
apparatus coupled to the heat pump 400 in accordance with one
embodiment.
[0009] FIG. 5 illustrates the constructional details of sprinkler
used in liquid cooled condenser in accordance with an
embodiment.
[0010] FIG. 6 illustrates an arrangement 600, in which the liquid
cooled sub-cooling apparatus is attached with the heat pump to
enhance the efficiency in accordance with an embodiment.
[0011] FIG. 7 illustrates a heat pump 700 including an air-cooled
condenser in which geothermal energy may be utilized to enhance the
coefficient of performance in accordance to one embodiment.
[0012] FIG. 8 illustrates the constructional details of a condenser
pipe in accordance with an embodiment.
[0013] FIG. 9 illustrates an arrangement 900 of an air-cooling
system including a heat pump to enhance the efficiency of the
air-cooling system in accordance with an embodiment.
[0014] FIG. 10 illustrates an arrangement 1000 of an air-heating
system including a heat pump to enhance the efficiency of the
air-heating system in accordance with an embodiment.
[0015] FIG. 11A, FIG. 11B, FIG. 11C and FIG. 11D illustrate the
changes in phases of a refrigeration cycles by decreasing the
temperature of refrigerant provided to the expansion valve and
increasing the temperature of the refrigerant provided to the
compressor in accordance with an embodiment.
[0016] FIG. 12 illustrate a table 1200 for change in temperature of
air blown over second condenser 785 and change in temperature of
liquid in liquid tank 725 with respect to time.
[0017] FIG. 13 depicts a graph 1300 plotted for change in
temperature of air blown over second condenser 785 and change in
temperature of liquid in liquid tank 725 with respect to time.
DETAILED DESCRIPTION
[0018] The following description describes an efficient heat pump
liquid heater. In the following description, numerous specific
details and choices are set forth in order to provide a more
thorough understanding of the present invention. It will be
appreciated, however, by one skilled in the art that the invention
may be practiced without such specific details. In other instances,
constructional details and other such details have not been shown
in detail in order not to obscure the invention. Those of ordinary
skill in the art, with the included descriptions, will be able to
implement appropriate functionality without undue
experimentation.
[0019] References in the specification to "one embodiment", "an
embodiment", "an example embodiment", etc., indicate that the
embodiment described may include a particular feature, structure,
or characteristic, but every embodiment may not necessarily include
the particular feature, structure, or characteristic. Moreover,
such phrases are not necessarily referring to the same embodiment.
Further, when a particular feature, structure, or characteristic is
described in connection with an embodiment, it is submitted that,
it is within the knowledge of one skilled in the art to affect such
feature, structure, or characteristic in connection with other
embodiments whether or not explicitly described.
[0020] Unless otherwise stated, the following terms used in the
specification and claims have the meanings given below:
[0021] (1) "Liquid" used herein means, all types and grades of
water, oil, fuels, gases, chemicals and mixtures thereof. In one
embodiment, the liquid may be water, which may include hard water,
soft water, salt water, distilled water, mineral water or any other
such similar substance. (2) "Metal" used herein does not limit to a
particular kind of metal. The metal may be of any kind, which may
be used as a heat conducting metal. In one embodiment, the metal
used for piping system may be made of copper, aluminum, alloys of
copper, alloys of aluminum or any such other kind of alloyed metal,
which may be a good conductor of heat.
[0022] In one embodiment, the refrigerant used in the heat pump may
be any matter, which provides cooling effect. For example, the
refrigerant may include carbon dioxide, ammonia, water,
hydrofluorocarbons hydrochlorocarbons, hydrochlorodifluoromethane
(R-22), chloropentafluoroethane (R-502), dichlorodifluorometane
(R-12), trichlorofluoromethane (R-11), trichlorotrifluoroethane
(R113), tetrafluoroethane (R-134a), dichlorotrifluoroethane (R123)
and any other such similar refrigerant used in a refrigeration
system.
[0023] In one embodiment, the efficiency of the heat pump may be
enhanced by increasing the area of a conventional refrigeration
cycle. In one embodiment, the efficiency of the heat pump may be
enhanced by decreasing the temperature of the refrigerant
(sub-cooling) flowing out of the condenser. In other embodiment,
the efficiency of the heat pump may also be enhanced by increasing
the temperature of the refrigerant (superheating) at the outlet of
the evaporator. In one embodiment, the efficiency of the heat pump
may be considerably enhanced by decreasing the temperature of the
refrigerant (sub-cooling) flowing out of the condenser and
increasing the temperature of the refrigerant (superheating) at the
outlet of the evaporator. In one embodiment, sub-cooling may
increase the length of the condensation phase and superheating may
increase the length of the evaporation phase to cause an increase
in the area of the refrigeration cycle. However, the compression
phase and the expansion phase may remain unaffected due to
superheating and sub-cooling (ideal cycle). In one embodiment, the
efficiency or the coefficient of performance (COP) may equal the
ratio of the length of condensation phase to the compression phase.
The efficiency or the coefficient of performance (COP) may increase
considerably as the length of the condensation phase (i.e., output)
may be increased by sub-cooling, while maintaining the length of
the compression phase (i.e., input).
[0024] In one embodiment, an additional condenser, which may be
either air-cooled or liquid cooled may be coupled with the existing
condenser to decrease (sub-cooling) the temperature of the
refrigerant at the outlet of the existing condenser. In one
embodiment, the outlet of the existing condenser may be coupled to
the inlet of the additional condenser the refrigerant may be
allowed to flow from the existing condenser to the additional
condenser. In one embodiment, the air may be blown over the
additional condenser, if the additional condenser is an air-cooled
condenser. In one embodiment, the heat may be transferred from
relatively hot refrigerant flowing through the additional condenser
to the air blown over the additional condenser by conduction, or
convection or radiation or any other such processes. In yet another
approach, the additional condenser may be a liquid cooled
condenser. In one embodiment, the additional condenser, which may
be liquid cooled, is submerged into a liquid tank or liquid may be
allowed to flow over the additional condenser or liquid may be
sprinkled over the additional condenser. In one embodiment, the
heat may be transferred from a relatively hot refrigerant flowing
through the additional condenser to the liquid by conduction, or
convection or radiation or any other such processes.
[0025] In one embodiment, the temperature of the refrigerant may be
increased (superheating) at the outlet of the evaporator by adding
additional heat to the refrigerant before providing the refrigerant
to the compressor. In one embodiment, the heat contained in the
refrigerant provided to the expansion valve may be used to
superheat the refrigerant provided to the compressor by using a
heat exchanger. In one embodiment, the heat exchanger may be
tube-in-tube heat exchanger. In one embodiment, the heat may be
transferred from the relatively hot refrigerant from the condenser
to the relatively cold refrigerant from the evaporator flowing
through the heat exchanger by conduction, or convection or
radiation. In this approach heat from the relatively hot
refrigerant may be effectively utilize to increase the temperature
of relatively cold refrigerant.
[0026] In one embodiment, the advantages of using additional
condenser and heat exchanger together in heat pump are as follows:
(1) use to pre heat the liquid or gas or any such other substance;
(2) use to superheat the refrigerant before providing to the
compressor; (3) effective utilization of heat for various other
purposes; (4) helps the compressor to work at lower head pressure;
(5) saves power by using less wattage to compress per ton of
refrigerant; and (6) enhances efficiency of heat pump
substantially.
[0027] An arrangement 100 of a Heat Pump is illustrated in FIG. 1.
The arrangement 100 may comprise a compressor 110, a condenser 120,
an expansion valve 130, an evaporator 140 and an evaporator fan
145. The condenser 120 may be made of metal such as copper,
aluminum, alloys of copper, alloys of aluminum or any other such
metal, which may be good conductor of heat. The heat pump 100 may
be couple to a power source 190. The power source 190 may a
conventional power source or a non conventional power source.
[0028] The heat pump 100 may work on a reverse Carnot's cycle or a
refrigeration cycle, which is depicted in FIG. 11A. The
refrigeration cycle may comprise four phases/stages such as;
compression (A-B), condensation (B-C), expansion (C-D) and
evaporation (D-A). To start the operation of heat pump 100, the
refrigerant may be injected into the heat pump 100 through a
suction valve 133. Before injecting or providing the refrigerant to
the heat pump 100, vacuum may be created inside the heat pump 100.
The refrigerant injected into the heat pump may be at low pressure
and low temperature. During the compression phase (A-B) the
refrigerant may be compressed inside the compressor 110. As a
result of compression, the refrigerant may attain high pressure and
high temperature (superheating). The compression phase (A-B)
illustrated in FIG. 11A represents an increase in pressure and
temperature substantially, which is indicated as an increase in
pressure and temperature from "A" to "B".
[0029] The high pressure and the superheated refrigerant may be
passed through the condenser 120. The condensation (B-C) may be
performed to reduce the temperature of the refrigerant while
maintaining the pressure of the refrigerant constant. The condenser
120 may be liquid cooled or air cooled. In The liquid cooled
condenser may be submerged in the liquid tank. On other hand air
from surrounding space may be blown over the air-cooled condenser.
The high pressure and superheated refrigerant may be allowed to
flow through the condenser 120. The high pressure, high temperature
(superheated) refrigerant may undergo condensation inside the
condenser 120 by which the temperature of the refrigerant may be
reduced, while maintaining pressure constant. During condensation
phase (B-C) the refrigerant may lose its latent heat to the
surrounding space or liquid due to conduction, convection or
radiation. The decrease in temperature of the refrigerant during
the condensation phase may be depicted by a line between points "B"
and "C" as illustrated in FIG. 11A.
[0030] The condensed high pressure, low temperature refrigerant may
be passed through the expansion valve/device 130. The high pressure
low temperature refrigerant may undergo adiabatic expansion
indicated by the expansion phase (C-D). Due to adiabatic expansion,
the pressure may drop substantially indicated by a line between the
points "C" and "D" of FIG. 11A. As a result of adiabatic expansion
the refrigerant flowing out of the expansion valve 130 may be in
liquid form having low pressure and low temperature to provide
refrigeration of cooling effect.
[0031] The evaporator 140 may convert the refrigerant in a liquid
form to a gaseous form by increasing the temperature of the
refrigerant as indicated by a line between "D" and "A" of FIG. 11A.
It may be noted that the pressure of the refrigerant may remain
unaffected during evaporation phase (D-A). The refrigerant in
gaseous form but at a lower pressure may be provided to the
compressor 110. To increase the temperature of the refrigerant in
the evaporator 140, air may be blown over the evaporator 140 using
the evaporator fan 145. In other approach, liquid may be allowed to
flow over the evaporator 140 and latent heat may be added to the
refrigerant during evaporation phase (D-A).
[0032] The temperature of the refrigerant flowing through the
condenser 120 may be in the range of 200 to 220.degree. F. and the
temperature of the refrigerant flowing out of the condenser 120 may
be in the range of 140 to 160.degree. F. Generally, heat
corresponding to a temperature of around 60.degree. F. may be
transferred to the liquid from the refrigerant flowing through the
condenser 120. The cooling effect caused by the adiabatic
expansion, in the expansion valve 130, may not be optimal if the
temperature of the refrigerant entering the expansion valve 130 is
between 140 and 160.degree. F. The mass flow rate of refrigerant,
which enters the compressor 110, may be more if the cooling effect
obtained by the refrigerant due to adiabatic expansion is not
optimal. As a result, more work has to be done by the compressor
110 to handle the mass flow rate of the refrigerant. In addition to
the above disadvantages, the heat pump may work on high head and
may draw more wattage of power from the power source. The above
factors individually or together affect the efficiency of the heat
pump 100.
[0033] In one embodiment, the efficiency of the heat pump 100 may
be enhanced by effectively utilizing the heat content of the
refrigerant to increase the area of the refrigeration cycle. An
embodiment of an efficient heat pump in which an existing condenser
is coupled to an additional air cooled condenser is illustrated in
FIG. 2. In one embodiment, the efficiency of the heat pump 200 may
be enhanced by increasing the condensation phase and evaporation
phase, respectively, as depicted in FIG. 11B and FIG. 11C. In one
embodiment, the length of the condensation phase may be increased
from B-C to B-C.sub.new by adding additional condenser along with
the existing condenser. In other embodiment, the length of the
evaporation phase may be increased from D-A to D-A.sub.new by
adding heat exchanger to transfer at least some quantity of heat
from the refrigerant flowing into the expansion valve to the
refrigerant flowing out of the evaporator. In one embodiment, the
increase in the length of the condensation phase and the
evaporation phase may be combined (as shown in FIG. 11D) to
increase the overall area of the refrigeration cycle without
affecting the length of compression (A-B) and expansion phase
(C-D).
[0034] In one embodiment, the heat pump arrangement 200 may
comprise a compressor 210, an existing condenser 220, an expansion
valve/device 230, an evaporator 240, an evaporator fan 245, a heat
exchanger 250, an additional condenser 285, a blower 281 and a
liquid tank 225. In one embodiment, the air cooled condenser 285
may be coupled plurality to the condenser 220. In one embodiment,
the inlet of the additional condenser 285 may be coupled to the
outlet of the existing condenser 220. In one embodiment, the
existing condenser 220 and additional condenser 285 may be made of
metal such as copper, aluminum, alloys of copper, alloys of
aluminum or any other such metals, which may be good conductor of
heat. In one embodiment, the heat exchanger 250 may be tube-in-tube
heat exchanger. In one embodiment, the heat pump 200 may further
comprise of a temperature control user interface 280. In one
embodiment, the heat pump 200 may be couple to a power source 290.
In one embodiment, the power source 290 may a conventional power
source or a non conventional power source.
[0035] In one embodiment, the liquid tank 225 comprises existing
condenser 220. In one embodiment, the existing condenser 220 may be
submerged into the liquid tank 225. In one embodiment, the high
pressure and superheated refrigerant at a temperature of
"X".degree. F. may be passed through the existing condenser 220. In
one embodiment, the existing condenser 220 may be use to dissipate
the heat from the refrigerant to the liquid in the tank 225. In one
embodiment, the heat content of the refrigerant may be used to heat
the liquid in the liquid tank 225. In one embodiment, the
condensation (B-C) may be performed to reduce the temperature of
the refrigerant while maintaining the pressure of the refrigerant
constant. In one embodiment, during condensation phase (B-C) the
refrigerant may lose its latent heat (=(X-Y).degree. F.) to the
surrounding space or liquid due to conduction, convection, and/or
radiation. The decrease in temperature of the refrigerant during
the condensation phase may be depicted by a line between points "B"
and "C" as illustrated in FIG. 11C.
[0036] In one embodiment, the condensed refrigerant at outlet of
the existing condenser 220 (point "C" of FIG. 11B) may comprise a
heat of "Y".degree. F. In one embodiment, the refrigeration effect
provided by the refrigerant in evaporator 240 may be R1 if the
refrigerant at "Y".degree. F. is made to pass through the expansion
valve 230. Also, the mass flow rate of refrigerant to the
compressor 210 (via evaporator 240) may be M1 if the refrigerant at
"Y".degree. F. is made to pass through the expansion valve 230. In
one embodiment, the refrigeration effect may increase from R1 to R2
and the mass flow rate of the refrigerant may decrease from M1 to
M2 if the temperature of the refrigerant is decreased from
"Y".degree. F. to "Y-K".degree. F.
[0037] For example, the refrigerant at the outlet of the compressor
210 may be at high pressure and high temperature. In one
embodiment, the superheated refrigerant may enter the existing
condenser 220 at a temperature of "220".degree. F. In one
embodiment, the existing condenser 220 may be use to dissipate the
heat from the refrigerant to the liquid in the tank 225. In one
embodiment, the heat content of the refrigerant may be used to heat
the liquid in the liquid tank 225. In one embodiment, the
condensation (B-C) may be performed to reduce the temperature of
the refrigerant while maintaining the pressure of the refrigerant
constant. In one embodiment, during condensation phase (B-C) the
refrigerant may lose its latent heat to the surrounding space or
liquid due to conduction, convection, and/or radiation and the
temperature may reduce to 140 to 160.degree. F. In one embodiment,
if the refrigerant may passed to the expansion valve 230 at the
temperature of 140 to 160.degree. F. the refrigeration effect may
be low and the mass flow rate of the refrigerant may be more. In
one embodiment, heat content of the refrigerant may be wasted at
the inlet of the expansion valve 230.
[0038] In one embodiment, the temperature (heat content)
"Y".degree. F. of the refrigerant flowing out of the existing
condenser 220 on the path 213 may be utilized using the additional
condenser 285 coupled to the existing condenser 220. In one
embodiment, the inlet of the additional condenser 285 may be
coupled to the outlet of the existing condenser 220. In one
embodiment, the additional condenser 285 may reduce the heat
content of the refrigerant from "Y" to "Y-K".degree. F. by blowing
outside ambient air (i.e., sub-cooling) utilizing blower 281 over
the additional condenser 285. In the process, the air (indicated by
282) that is blown over the additional condenser 285 may absorb the
heat content from the refrigerant to further reduce the temperature
of the refrigerant to "Y-K".degree. F. In one embodiment, the
outside ambient air that has absorbed the heat of "Y-K".degree. F.
from the refrigerant may be blown over the evaporator 240 as
further described below. In one embodiment, by adding the
additional condenser 285 the length of condensation phase (B-C) may
be increased from BC to BC' as depicted in FIG. 11C. In one
embodiment, the sub-cooling phase (C-C') of the refrigerant is
illustrated in the FIG. 11C.
[0039] For example, the additional condenser 285 may reduce the
temperature of the refrigerant at the outlet of the existing
condenser 220. In one embodiment, the temperature of the
refrigerant in the additional condenser 285 may be reduced from
140-160.degree. F. to 90-110.degree. F. In one embodiment, by
passing the refrigerant to the expansion valve 230 at the
temperature 90-110.degree. F. may increase the refrigeration effect
(R2) and the mass flow rate of the refrigerant may be decreased
(M2). In one embodiment, the refrigerant flowing out of the
additional condenser 285 may be passed through the heat exchanger
250 before providing the refrigerant to the expansion valve
230.
[0040] In one embodiment, the expansion valve 230 may receive the
refrigerant flowing out of the additional condenser 285 at a
temperature of "Y-K".degree. F. In one embodiment, the refrigerant
may undergo adiabatic expansion depicted in by expansion phase
(C'-D') in FIG. 11C. In one embodiment, due to adiabatic expansion,
the pressure may drop substantially indicated by a line between the
points C' and D' of FIG. 11C. As a result of adiabatic expansion
the refrigerant flowing out of the expansion valve 230 may be in
liquid form having low pressure and low temperature to provide
refrigeration or cooling effect of R2 (instead of R1). Also, the
mass flow rate of the refrigerant flowing out of the expansion
valve 230 to the evaporator 240 may decrease from M1 to M2.
[0041] In one embodiment, the evaporator 240 may receive
refrigerant in liquid form having low pressure and low temperature
(T1) flowing out of the expansion valve 230. In one embodiment, the
liquid refrigerant providing refrigeration effect of R2 may undergo
evaporation, which is depicted by evaporation phase (D'-A) in FIG.
11C. In one embodiment, due to evaporation, the temperature of the
refrigerant may increase to T2 from T1 indicated by a line between
the points D' and A of FIG. 11C. As noted above, the air 282 that
blown/passes over the additional condenser 285 may absorb heat
content ((=Y-K).degree. F.) from the refrigerant passing through
the additional condenser 285. In one embodiment, the air 282 that
has absorbed heat content (hot air) from the refrigerant may be
blown over the evaporator 240 to add latent heat and thus increase
the rate of evaporation. In one embodiment, the effect of blowing
the hot air on the evaporator 240 is depicted by D' to D in FIG.
11C. In one embodiment, during evaporation phase (D'-A) temperature
of the refrigerant may be increased from T1 to T2 by maintaining
pressure constant.
[0042] In one embodiment, the heat exchanger 250 may be coupled to
the outlet of the evaporator 240 and the refrigerant from the
evaporator 240 may be allowed to flow through the heat exchanger
250 before providing the refrigerant to the compressor 210. In one
embodiment, the heat exchanger 250 may receive refrigerant in vapor
form having a temperature of T2 flowing out of the evaporator 240
and a refrigerant having a temperature of ((Y-K).degree. F.)
flowing out of the additional condenser 285. In one embodiment, the
temperature ((Y-K).degree. F.) of the refrigerant flowing out of
the additional condenser 285 may be greater than the temperature T2
of the refrigerant flowing out of the evaporator 240. As a result,
the heat may be transferred (by conduction, or convection, or
radiation) from a relatively hot refrigerant (at ((Y-K).degree.
F.)) flowing out of the additional condenser 285 to the relatively
cold refrigerant (T2) flowing out of the evaporator 240. In one
embodiment, the addition of heat to the refrigerant flowing out of
the evaporator 240 in the heat exchanger 250 may be referred to as
superheating and is depicted by line A to A' in FIG. 11B. In one
embodiment, due to superheating, the temperature of the refrigerant
may increase to T3 from T2 indicated by a line between the points
A-A' of FIG. 11B. In one embodiment, the heat gained by the
refrigerant in the heat exchanger 250 may equal (T3-T2). In one
embodiment, the heat exchanger 250 may be tube-in-tube heat
exchanger.
[0043] As a result of heat transfer from the refrigerant flowing
through the heat exchanger 250 the heat content of the refrigerant
may decrease from Y-K to Y-K-(T3-T2). For example, Y-K may be in
the range of 90-110.degree. F. and Y-K-(T3-T2) may be in the range
of 70-90.degree. F.
[0044] In one embodiment, the efficiency or coefficient of
performance (COP) of the heat pump 100 may depend on the area of
the refrigeration cycle A-B-C-D shown in FIG. 11A. The efficiency
or COP of the conventional heat pump 100 is given by equation (1)
below:
COP ( old ) = Output Input = COP ( old ) = length of condensation
length of compression = COP ( old ) = BS AB ( 1 ) ##EQU00001##
In one embodiment, the efficiency or COP of the heat pump 200 may
be enhanced by superheating and sub-cooling techniques described
above. As a result of combining superheating and sub-cooling
techniques in the heat pump 200, the area of the refrigeration
cycle of the heat pump 200 may be equal to A'-B'-C'-D' (which is
greater than the area A-B-C-D) as depicted in FIG. 11D. The area of
the refrigeration cycle may be increased by stretching the length
of the condensation phase (B-C) and stretching the length of the
evaporation phase (D-A). In one embodiment, the length of the
condensation phase (sub-cooling) may be stretched by coupling
additional condenser 285 with the existing condenser 220. In
sub-cooling phase (C-C') the temperature of the refrigerant may be
reduced from C to C' at the outlet of the condenser and before
providing to the expansion device. In one embodiment, the length of
the evaporation phase (superheating) may be stretched by connecting
the heat exchanger at the outlet of the evaporator. In superheating
phase (A-A') the temperature of the refrigerant may be increase
from A to A' at the outlet of the evaporator and before providing
to the compressor. In one embodiment, by combining both
superheating and sub-cooling the efficiency of the heat pump may
increase substantially. The combined and modified refrigeration
cycle A'-B'-C'-D' is depicted in FIG. 11D.
[0045] In one embodiment, by increasing the area of the
refrigeration cycle to A'-B'-C'-D' the efficiency of the heat pump
200 may be enhanced substantially. In one embodiment, the
superheating and sub-cooling techniques may not affect the length
of the compression phase (A-B) and the expansion phase (C-D).
Therefore the length of the compression phase (A-B) and the
expansion phase (C-D) may remain same (i.e., AB=A'B' and CD=C'D').
Removing heat from condensation phase (which is otherwise wasted)
of the refrigeration cycle and adding that heat to the evaporation
phase (which requires additional heat) may enhance the efficiency
of the heat pump. The new efficiency or COP of the heat pump may be
given by equation (2) below:
COP ( new ) = Output Input = COP ( new ) = length of condensation
length of compression = COP ( new ) = B ' S ' AB ( 2 )
##EQU00002##
[0046] However, from equation (1) and equation (2), COP.sub.(new)
may be greater than COP.sub.(old) as B'C' is greater than BC.
Hence, from equation (2) above, it may be illustrated that the
efficiency of the heat pump 200 may be enhanced substantially by
adding additional condenser 285 at the outlet of the existing
condenser 220 and increasing the temperature of the refrigerant by
adding heat in the heat exchanger 250.
[0047] An embodiment of a heat pump 300 in which an existing
condenser is coupled to an additional condenser to enhance the
efficiency is illustrated in FIG. 3. In one embodiment, the
efficiency of the heat pump 300 may be enhanced by increasing the
condensation phase and evaporation phase, respectively, as depicted
in FIG. 11B and FIG. 11C. In one embodiment, the heat pump 300 may
comprise a compressor 301, an existing condenser 305, a heat
exchanger 302, an expansion valve 303, an evaporator 304, an
evaporator fan 308, a liquid heating tank 320, an additional
condenser 340, a sprinkler 350 and a sub-cooling liquid tank 330.
In one embodiment, the existing condenser 305 may be submerged into
the liquid tank 330. In one embodiment, the heat pump 300 may be
coupled to a power source 380. In one embodiment, power source 380
may be a conventional power source or a non conventional power
source. In one embodiment, the temperature sensor 360 may be
coupled to the control unit 385 to maintain the temperature of the
liquid at a preset value. In one embodiment, the user may maintain
the temperature of the liquid by configuring the pre-set value
using a user interface 383. In one embodiment, the heat pump 300
may be similar to heat pump 200 described above with reference to
FIG. 2. To maintain the brevity, only the differences between FIG.
2 and FIG. 3 are described below.
[0048] In one embodiment, the additional condenser 340 may be
coupled to the existing condenser 305 and liquid such as water may
be sprinkled over the additional condenser 340 using the sprinkler
350. In one embodiment, the temperature X-Y (heat content) of the
refrigerant flowing out of the existing condenser 305 on the path
312 may be utilized using the additional condenser 340 to heat the
liquid in the additional liquid tank 330. In the process, the
liquid (indicated by 326) that is sprinkled over the additional
condenser 340 may absorb the heat content of the refrigerant to
further reduce the temperature of the refrigerant. By sprinkling
liquid on the additional condenser 340, the temperature of the
refrigerant may be decreased from (X-Y).degree. F. to
(X-Y-K).degree. F. (i.e., sub-cooling described above) and the
temperature decreased (K) in the process may be used to heat the
liquid in the tank 330. In one embodiment, the refrigerant flowing
out of the additional condenser 340 may be passed through the heat
exchanger 302 to the expansion valve 303 and superheating of the
refrigerant may happen as described above. As a result of
sub-cooling and superheating, the area of the refrigeration cycle
may increase and such an increase in the area of the refrigeration
cycle may lead to enhancement of efficiency as described above
(Illustrated in equation (2)).
[0049] In one embodiment, an outlet of the additional liquid tank
330 may be coupled to an inlet of the liquid tank 320. In one
embodiment, the liquid heated (pre heated) in the tank 330 may then
be passed to the liquid heating tank 320 to quickly heat the liquid
in the tank 320 to a pre-set value.
[0050] An embodiment of an efficient heat pump 400 in which an
existing condenser is coupled to an additional condenser is
illustrated in FIG. 4. In one embodiment, the efficiency of the
heat pump 400 may be enhanced by increasing the condensation phase
and evaporation phase, respectively, as depicted in FIG. 11B and
FIG. 11C. In one embodiment, the heat pump 400 may comprise a
compressor 401, a heat exchanger 402, an expansion valve 403, an
evaporator 404, a condenser 405, an evaporator fan 408, an
additional condenser 440, a liquid heating tank 420, a sprinkler
450, a liquid pump 490, a liquid level control valve 455 and an
additional liquid tank 430. In one embodiment, the heat pump
arrangement 400 may be coupled to a power source 480. In one
embodiment, the power source 480 may be a conventional power source
or a non conventional power source. In one embodiment, user may set
the required temperature by a user interface 483. In one
embodiment, the heat pump 400 may be similar to heat pump 300
described above with reference to FIG. 3. To maintain the brevity,
only the differences between FIG. 3 and FIG. 4 are described
below.
[0051] In one embodiment, the additional condenser 440 may be
coupled to the existing condenser 405 and liquid such as water may
be sprinkled over the additional condenser 440 using the sprinkler
450. In one embodiment, the temperature X-Y (heat content) of the
refrigerant flowing out of the existing condenser 405 on the path
412 may be utilized using the additional condenser 440 to heat the
liquid in the additional liquid tank 430. In the process, the
liquid (indicated by 426) that is sprinkled over the additional
condenser 440 may absorb the heat content of the refrigerant to
further reduce the temperature of the refrigerant. By sprinkling
liquid on the additional condenser 440, the temperature of the
refrigerant may be decreased from (X-Y).degree. F. to
(X-Y-K).degree. F. (i.e., sub-cooling described above) and the
temperature decreased (K) in the process may be used to heat the
liquid in the tank 430. In one embodiment, the refrigerant flowing
out of the additional condenser 440 may be passed through the heat
exchanger 402 to the expansion valve 403. In one embodiment, the
hot liquid stored in the tank 430 may be pumped using pump 490 to
the evaporator 404 to facilitate superheating of the refrigerant.
As a result of sub-cooling and superheating, the area of the
refrigeration cycle may increase and such an increase in the area
of the refrigeration cycle may lead to enhancement of efficiency as
described above (Illustrated in equation (2)). Also, to conserve
utilization of liquid, the liquid may be re-circulated (path 496)
and sprinkled over the additional condenser 440.
[0052] In another embodiment, instead of using the sprinkler 450,
the additional condenser 440 may be submerged into the additional
liquid tank 430. In one embodiment, the additional liquid tank 430
may be provided with a level control valve 455 to control and
maintain the liquid level inside the additional liquid tank 430. In
other embodiment, the additional liquid tank 430 may be attached to
the heat pump 400 to form a single unit as shown in FIG. 6.
[0053] In an embodiment, the constructional detail of the sprinkler
350 is illustrated in FIG. 5A. In one embodiment, the sprinkler 350
may be constructed using the pipe 510, which may be formed in any
shape. In one embodiment, a multiple vents may be drilled in the
pipe 510 such that the liquid flowing through the pipe 510 may be
sprinkled over the additional condenser described above. In one
embodiment, front view of the sprinkler 350 is shown in FIG.
5A.
[0054] In one embodiment, the bottom view of the sprinkler 350 is
illustrated in FIG. 5B. In one embodiment, the vents 540-A to 540-N
formed on the bottom surface of the pipe 510 may allow the liquid
flowing through the pipe 510 to be sprayed. In one embodiment, the
flow of liquid may be continues through the pipe 510 having tiny
vents 540-A to 540-N may create pressure inside the pipe 510 that
may result in spraying effect.
[0055] An embodiment of a heat pump 700 in which an existing
condenser is coupled to an additional condenser to enhance the
efficiency is illustrated in FIG. 7. In one embodiment, the
efficiency of the heat pump 700 may be enhanced by increasing the
condensation phase and evaporation phase, respectively, as depicted
in FIG. 11B and FIG. 11C (which is also depicted in FIG. 11D
(combined refrigeration cycle for sub-cooling and superheating)).
In one embodiment, the heat pump arrangement 700 may comprise a
compressor 710, an existing condenser 720, an expansion
valve/device 730, an evaporator 740, an evaporator fan 745, a heat
exchanger 750, an additional condenser 785, a blower 781 and a
liquid tank 725. In one embodiment, the air cooled condenser 785
may be coupled plurality to the condenser 720. In one embodiment,
the inlet of the additional condenser 785 may be coupled to the
outlet of the existing condenser 720. In one embodiment, the
existing condenser 720 and additional condenser 785 may be made of
metal such as copper, aluminum, alloys of copper, alloys of
aluminum or any other such metals, which may be good conductor of
heat. In one embodiment, the heat exchanger 750 may be tube-in-tube
heat exchanger. In one embodiment, the heat pump 700 may be coupled
to a power source 780. In one embodiment, power source 790 may be a
conventional power source or a non conventional power source. In
one embodiment, the heat pump 700 may be similar to heat pump 200
described above with reference to FIG. 2. To maintain the brevity,
only the differences between FIG. 2 and FIG. 7 are described
below.
[0056] In one embodiment, the liquid supplied at an inlet of the
liquid tank 725 may be at higher temperature (warm liquid), for
example, due to utilization of geothermal energy. In one
embodiment, the higher temperature or warm liquid may not allow
maximum heat to be transferred from the superheated refrigerant
passing through the existing condenser 720. As a result of lower
than maximum heat transfer, the temperature of the refrigerant at
the outlet of the existing condenser 720 may equal X-N.degree. F.
(wherein N<Y). In one embodiment, the refrigerant may carry heat
(of Y-N.degree. F.) to the additional condenser 785. In one
embodiment, the refrigerant may lose "X-N-P".degree. F. (wherein
P<K) in the additional condenser 785 after blowing ambient air
787 (at temperature L1.degree. F.) over the additional condenser
785. In one embodiment, the refrigerant passing out of the
additional condenser 785 at a temperature of X-N-P.degree. F. may
be provided as input to the expansion valve 730. In one embodiment,
the refrigerant at the temperature of X-N-P.degree. F. provided to
the expansion valve 730 (instead of X-Y-K.degree. F.) may cause
lesser refrigeration effect at evaporator 740. Due to less
refrigeration effect provided by the expansion valve 730, a higher
mass flow rate M1 of refrigerant may occur. Due to less
refrigeration effect and higher mass flow rate of refrigerant, the
efficiency of the heat pump 700 may decrease considerably. In one
embodiment, the warm liquid may be obtained by utilizing the
geothermal energy or any such other source, which may be available
very close to the surface of the ground (for example, at a depth of
7 to 10 feet) and the temperature of the environment may be below
0.degree. F.
[0057] In one embodiment, the disadvantages of the above mentioned
scenario may be overcome by placing the heat pump 700 in an
environment (open space) that may be cooler than the enclosed
space. In one embodiment, by placing the heat pump 700 at the
outside environment, heat may be transferred effectively from
refrigerant passing through the additional condenser 785 to the
ambient air 787 blown over the additional condenser 785. In one
embodiment, the temperature of the ambient air 787 may be equal to
L2.degree. F. (L2<L1) if the heat pump 700 is provisioned in an
outside environment (i.e., substantially cooler than the ambient
air 787 in the enclosed temperature). In one embodiment, the
ambient air 787 at L2.degree. F. may absorb more heat from the
refrigerant passing through the additional condenser 785.
[0058] In one embodiment, the heat pump 700 may be placed over the
roof top of a building or at any place such that the heat pump 700
may be substantially exposed to a cooler temperature of the outside
environment. In one embodiment, the ambient air 787 (of temperature
L2 depicted in column 1220 of FIG. 12) in the outside environment
may be blown over the additional condenser 785 using the additional
condenser fan 781. In one embodiment, the heat content of the
refrigerant passing through the additional condenser 785 may be
transferred effectively to ambient air 787. In one embodiment, the
heat transfer from the refrigerant passing through the additional
condenser 785 to the ambient air 787 blown over the additional
condenser 785 may be equal to "X-Y-K".degree. F. In one embodiment,
the change in temperature of the air after passing over the
additional condenser 785 at regular intervals of time is,
respectively, depicted in columns 1230 and 1210 of FIG. 12. In one
embodiment, a change in temperature of the air of column 1230
plotted with reference to change in time of column 1210 is depicted
in a graph 1310 of FIG. 13. In one embodiment, the gain in
temperature of the air blown over the additional condenser 785 is
depicted in column 1240 of FIG. 12.
[0059] It may be observed that as the time increases the
temperature of air blown over the additional condenser 785 may
increase as well. As the temperature of the air (depicted in column
1230) increases, the amount of heat absorbed from the refrigerant
passing through the additional condenser 785 may increase as well
resulting in an increase in the length (from BC to BC') of the
sub-cooling phase of FIG. 11.C. Increase in the length of the
sub-cooling phase from BC to BC' may enhance the coefficient of
performance (COP) of the heat pump 700. Also, the temperature of
the liquid in the liquid tank 725 may increase as well as depicted
in a graph of 1350, however, such an increase may be gradual as
compared to increase in the temperature of the air depicted in
1310. In one embodiment, the gradual increase in the heat may be
attributed to reduced transfer of heat (X-N.degree. F. as compared
to X-Y.degree. F., wherein Y is >N) from the refrigerant flowing
through existing condenser 720.
[0060] In one embodiment, the air blown over the additional
condenser 785, which may extract heat content of the refrigerant,
may be blown over the evaporator 740 to superheat the refrigerant
during the evaporation phase. As a result, the length of the
superheating phase (DA to DA') and the area of the refrigeration
cycle may increase (depicted in FIG. 11D) and hence the efficiency
of the heat pump 700 may also increase.
[0061] An embodiment of the constructional details of the
additional condenser 340 (or 440) is illustrated in FIG. 8A and
FIG. 8B. The top view of the additional condenser 340 (shown in
FIG. 8A) illustrates a pipe 810 comprising an inlet 810 and an
outlet 830. In one embodiment, the pipe 810 may be formed into a
spiral (shown in front view of FIG. 8B), which may have an oval
shape, or circular shape or any other such shapes. In one
embodiment, the additional condenser 340 may contain one or more
coils such as 840-A to 840-D to facilitate effective heat transfer
from the refrigerant flowing through the additional condenser 340
and the liquid or the air, which may come in contact with the coils
840-A to 840-D of the additional condenser 340. In one embodiment,
the pipe 810 may be made of copper, aluminum, copper alloys,
aluminum alloys, steel or its alloys or any other such metal, which
may be good conductor of heat.
[0062] An embodiment of an air-cooling system including a heat pump
900 is illustrated in FIG. 9. In one embodiment, the heat pump 900
may also be used in an air-cooling system. In one embodiment, the
air-cooling system may used to maintain the temperature of a space
such as residential and industrial buildings at a temperature
lesser than the outside temperature. In one embodiment, heat pump
900 may comprise a compressor 910, an existing condenser 920, an
additional condenser 925, an expansion valve 930, an evaporator
940, a heat exchanger 970, an evaporator fan 950 and a condenser
fan 960. In one embodiment, the heat pump 900 may operate in a
manner similar to the heat pump 200 described above in FIG. 2.
[0063] In one embodiment, the refrigeration effect obtained in the
evaporator 940 may be used to maintain the temperature (to provide
air-cooling effect) of the space into which the heat pump 900 may
be attached. In one embodiment, to provide the air-cooling effect
within the space, air from the outside environment may be sucked
and blown over the evaporator 940 by the evaporator fan 950.
However, the refrigerant, which may be provided to the evaporator
940 from the expansion valve 930 may be sub-cooled as described
above in FIG. 2 to enhance the refrigeration effect. In one
embodiment, the air blown over the evaporator 940 may absorb the
coldness of the refrigerant flowing through the evaporator 940 and
provide air-cooling effect with enhanced efficiency. In one
embodiment, the cold air 980 may be channelized or passed through a
duct to the space that may be maintained at lower temperature.
[0064] An embodiment of an air-heating system including a heat pump
1000 is illustrated in FIG. 10. In one embodiment, the heat pump
1000 may also be used in the air-heating system. In one embodiment,
the air-heating system may used to maintain the temperature of a
space such as residential and industrial buildings at a temperature
higher than the outside temperature. In one embodiment, heat pump
1000 may comprise a compressor 1010, an existing condenser 1020, an
additional condenser 1025, an expansion valve 1030, an evaporator
1040, a heat exchanger 1070, an evaporator fan 1050 and a condenser
fan 1060. In one embodiment, the heat pump 1000 may operate in a
manner similar to the heat pump 200 described above in FIG. 2.
[0065] In one embodiment, the heating effect obtained in the
existing condenser 1020 and additional condenser 1025 may be used
to maintain the temperature (to provide air-heating effect) of the
space into which the heat pump 1000 may be attached. In one
embodiment, to provide the air-heating effect within the space, air
from the outside environment may be sucked and blown over the
existing condenser 1020 and additional condenser 1025 by the
condenser fan 1060. However, the refrigerant, which may be provided
to the existing condenser 1020 and additional condenser 1025 may be
sub-cooled as described above to enhance the refrigeration effect.
In one embodiment, the air blown over the existing condenser 1020
and additional condenser 1025 may absorb the heat content of the
refrigerant flowing through the existing condenser 1020 and
additional condenser 1025 and provide air-heating effect with
enhanced efficiency. In one embodiment, the hot air 1085 may be
channelized or passed through a duct to the space that may be
maintained at higher temperature.
[0066] In one embodiment, the heat exchanger 1070 may be placed in
between the evaporator fan 1050 and evaporator 1040. In one
embodiment, the heat content of the refrigerant flowing out of the
additional condenser 1025 through the heat exchanger 1070 may be
utilized to add latent heat to the refrigerant flowing through the
evaporator 1040 during evaporation phase D'-A' as depicted in FIG.
11D. In one embodiment, air may be blown over the heat exchanger
1070. In one embodiment, air may absorb heat content of the
refrigerant flowing through the heat exchanger 1070. In one
embodiment, the hot air passing over the heat exchanger may be then
blown over the evaporator 940 to add latent heat to the
refrigerant.
[0067] While the invention has been described with reference to a
preferred embodiment, it will be understood by one of ordinary
skill in the art that various changes may be made and equivalents
may be substituted for elements thereof without departing from the
scope of the present invention. In addition many modifications may
be made to adopt a particular situation or material to the
teachings of the present invention without departing from the
essential scope thereof. Therefore, it is intended that the
invention not be limited to the particular embodiments disclosed as
the best mode contemplated for carrying out this invention, but
that the invention will include all of the embodiments falling
within the scope of the appended claims.
[0068] The examples demonstrated in the figures and the description
above is set forth to help a reader to understand the invention and
by no means limit the scope of the invention. Various features and
advantages of the present invention are set forth in the following
claims.
* * * * *