U.S. patent application number 13/036583 was filed with the patent office on 2011-09-15 for air conditioning system.
This patent application is currently assigned to FUJITSU LIMITED. Invention is credited to Junichi Ishimine, Ikuro Nagamatsu, Yuji Ohba.
Application Number | 20110223849 13/036583 |
Document ID | / |
Family ID | 44148540 |
Filed Date | 2011-09-15 |
United States Patent
Application |
20110223849 |
Kind Code |
A1 |
Ishimine; Junichi ; et
al. |
September 15, 2011 |
AIR CONDITIONING SYSTEM
Abstract
An air conditioning system includes an air conditioner that
feeds cooling air to a space in which an electronic device is
arranged; and a supplying opening that is provided in a vicinity of
a flow pathway along which hot air discharged from the electronic
device flows to be indrawn into the electronic device and supplies
the cooling air fed by the air conditioner.
Inventors: |
Ishimine; Junichi;
(Kawasaki, JP) ; Ohba; Yuji; (Kawasaki, JP)
; Nagamatsu; Ikuro; (Kawasaki, JP) |
Assignee: |
FUJITSU LIMITED
Kanagawa
JP
|
Family ID: |
44148540 |
Appl. No.: |
13/036583 |
Filed: |
February 28, 2011 |
Current U.S.
Class: |
454/184 |
Current CPC
Class: |
F24F 3/044 20130101;
F24F 11/0001 20130101; H05K 7/20745 20130101; Y02B 30/767 20130101;
Y02B 30/70 20130101 |
Class at
Publication: |
454/184 |
International
Class: |
F24F 3/044 20060101
F24F003/044 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 12, 2010 |
JP |
2010-056582 |
Claims
1. An air conditioning system, comprising: an air conditioner that
feeds cooling air to a space in which an electronic device is
arranged; and a supplying opening that is provided in a vicinity of
a flow pathway along which hot air discharged from the electronic
device flows to be indrawn into the electronic device and supplies
the cooling air fed by the air conditioner.
2. The air conditioning system according to claim 1, further
comprising a partition part that separates a space to which the hot
air discharged from the electronic device is discharged and a space
from which the cooling air is indrawn by the electronic device.
3. The air conditioning system according to claim 1, wherein the
supplying opening is provided over a space from which the cooling
air is indrawn by the electronic device.
4. The air conditioning system according to claim 1, wherein the
supplying opening is provided over a space to which the hot air
discharged from the electronic device is discharged.
5. The air conditioning system according to claim 1, wherein the
supplying opening is provided on a ceiling surface in the vicinity
of the flow pathway along which the hot air discharged from the
electronic device flows to be indrawn into the electronic device,
and the air conditioner feeds via the ceiling the cooling air to a
space over a floor panel on which the electronic device is arranged
and draws in the hot air discharged from the electronic device from
a space under the floor panel.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is based upon and claims the benefit of
priority from Japanese Patent Application No. 2010-056582, filed on
Mar. 12, 2010, the entire contents of which are incorporated herein
by reference.
FIELD
[0002] The embodiments discussed herein are directed to an air
conditioning system in which cooling air fed from an air
conditioner is supplied to an electronic device and hot air
discharged from the electronic device is indrawn by the air
conditioner.
BACKGROUND
[0003] Recently, a data center in which a plurality of racks each
stacking electronic devices such as a server and networking
equipment has been known. An electronic device has functional parts
such as a central processing unit (CPU) and generates heat when the
functional parts consume electric power to fulfill functions.
Therefore, an air conditioning system in which cooling air is fed
from an air conditioner to cool the electronic devices has been
used for cooling the heat generated by the electronic devices.
[0004] Here, a configuration of an air conditioning system will be
explained with reference to FIG. 23. FIG. 23 is an explanatory view
of a conventional air conditioning system. As illustrated in FIG.
23, the air conditioning system has a dual floor structure having
an over-panel floor and an under-panel floor and electronic devices
are arranged on the over-panel floor.
[0005] With this configuration, cooling air fed from a not
illustrated air conditioner to a space over the under-panel floor
is supplied to the electronic devices on the over-panel floor by
way of a floor panel opening part and hot air discharged from the
electronic devices is indrawn into the air conditioner by way of a
ceiling opening part in the air conditioning system. Here in FIG.
23, a white arrow indicates a flow of the cooling air and a black
arrow indicates a flow of the discharged hot air.
[0006] In the data center with this configuration, a "discharged
air ingression" which means that electronic devices draw in the hot
air discharged from the electronic devices occurs when an air
volume coming out of the air conditioner is insufficient. In the
example of FIG. 23, the discharged air ingression occurs in the
electronic device placed on the far left in the data center.
[0007] Here, a flow of the cooling air and the discharged hot air
in the data center will be explained specifically by using an
example illustrated in FIG. 24. FIG. 24 is an explanatory view of
an air volume, a supplied air temperature, and a discharged air
temperature in the conventional air conditioning system. The
example of FIG. 24 is configured such that cooling air at
20.degree. C. is supplied from the space over the under-panel floor
to an electronic device intake air/discharged air temperature
difference of which is 8.degree. C. (the electronic device being
illustrated in FIG. 24 as "electronic device .DELTA.T=8.degree.
C.") with an air volume equivalent to 80% of an air volume required
by the electronic device and there is an insufficiency in volume of
the cooling air by 20%.
[0008] As illustrated in FIG. 24, the electronic device to which
the cooling air at 20.degree. C. is supplied from the space over
the under-panel floor discharges hot air at 28.degree. C. Here in
the example of FIG. 24, since a cooling air volume required by the
electronic device is insufficient by 20%, the "discharged air
ingression" occurs, and an air volume equivalent to 20% required by
the electronic device out of the hot air discharged by the
electronic device goes to an air intake surface of the electronic
device and supplied to the electronic device.
[0009] As a result of this, hot air at 38.degree. C. is discharged
from the electronic device, a temperature of the discharged hot air
to be indrawn at an upper part of the rack becomes as high as
30.degree. C., a temperature of functional parts in an inside of
the electronic device goes up, and a reliability of the electronic
device deteriorates. Therefore, a method of increasing a cooling
air volume to be fed from an air conditioner is adopted to prevent
the discharged air ingression. Detailed information of the
conventional technique will be obtained in Japanese Laid-open
Patent Publication No. 2006-64303, Japanese Laid-open Patent
Publication No. H8-303815, and Japanese Laid-open Patent
Publication No. 2004-184070.
[0010] However, there has been a problem of causing a large
electric power consumption as a result of increasing a cooling air
volume to be fed from an air conditioner for supplying sufficient
cooling air to the electronic device in the method of preventing
the discharged air ingression described above.
SUMMARY
[0011] According to an aspect of an embodiment of the invention, an
air conditioning system includes an air conditioner that feeds
cooling air to a space in which an electronic device is arranged;
and a supplying opening that is provided in a vicinity of a flow
pathway along which hot air discharged from the electronic device
flows to be indrawn into the electronic device and supplies the
cooling air fed by the air conditioner.
[0012] The object and advantages of the invention will be realized
and attained by means of the elements and combinations particularly
pointed out in the claims.
[0013] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory and are not restrictive of the invention, as
claimed.
BRIEF DESCRIPTION OF DRAWINGS
[0014] FIG. 1 is a block diagram of a configuration of an air
conditioning system according to a first embodiment;
[0015] FIG. 2 is a block diagram of an arrangement of racks and air
conditioners in a data center according to a second embodiment;
[0016] FIG. 3 is a block diagram of a configuration of the data
center according to the second embodiment;
[0017] FIG. 4 is an explanatory view of an air volume, a supplied
air temperature, and a discharged air temperature in a data
center;
[0018] FIG. 5 is an explanatory view of an air volume, a supplied
air temperature, and a discharged air temperature in a data
center;
[0019] FIG. 6 is an explanatory view of a discharged air ingression
preventive structure provided at a lower part of a rack;
[0020] FIG. 7 is an explanatory view of a rack side partition in a
hot aisle;
[0021] FIG. 8 is an explanatory view of a configuration of a data
center including air conditioners;
[0022] FIG. 9 illustrates a result of a simulation;
[0023] FIG. 10 is a block diagram of a configuration of a data
center according to a third embodiment;
[0024] FIG. 11 illustrates a result of a simulation;
[0025] FIG. 12 illustrates a result of a simulation;
[0026] FIG. 13 illustrates a result of a simulation;
[0027] FIG. 14 is a block diagram of a cross section of a
configuration of a data center according to a fourth embodiment,
the cross section being along a line A-A illustrated in FIG.
16;
[0028] FIG. 15 is a block diagram of a cross section of the
configuration of the data center according to the fourth
embodiment, the cross section being along a line B-B illustrated in
FIG. 14;
[0029] FIG. 16 is a block diagram of a cross section of the
configuration of the data center according to the fourth
embodiment, the cross section being along a line C-C illustrated in
FIG. 14;
[0030] FIG. 17 is a side view of an air conditioner in a data
center;
[0031] FIG. 18 is a front view of the air conditioner in the data
center;
[0032] FIG. 19 is an explanatory view of a rack side partition in a
hot aisle;
[0033] FIG. 20 is an explanatory view of a rack side partition in a
hot aisle;
[0034] FIG. 21 is a block diagram of a configuration of a data
center in which a partition plate is provided at an upper part of a
rack;
[0035] FIG. 22 is a block diagram of a configuration of a data
center provided with temperature sensors;
[0036] FIG. 23 is an explanatory view of a conventional air
conditioning system; and
[0037] FIG. 24 is an explanatory view of an air volume, a supplied
air temperature, and a discharged air temperature in the
conventional air conditioning system.
DESCRIPTION OF EMBODIMENTS
[0038] Preferred embodiments of an air conditioning system
according to the present invention will be explained in detail
below with reference to the accompanying drawings.
[a] First Embodiment
[0039] A configuration of an air conditioning system according to a
first embodiment will be explained below and advantages according
to the first embodiment will be explained last. FIG. 1 is a block
diagram of a configuration of an air conditioning system according
to a first embodiment. A white arrow indicates a flow of cooling
air and a black arrow indicates a flow of discharged hot air. As
illustrated in FIG. 1, an air conditioning system 1 according to
the first embodiment is provided with an electronic device 2, an
air conditioner 3, and a supplying opening 4.
[0040] The electronic device 2 draws in cooling air fed from the
air conditioner 3 and discharges hot air into a space at the same
time. The air conditioner 3 feeds cooling air to the space in which
the electronic device 2 is arranged. The supplying opening 4 is
provided in the vicinity of a flow pathway (see a point "(a)" in
FIG. 1) along which hot air discharged from the electronic device 2
flows to be indrawn into the electronic device 2 and supplies the
cooling air fed from the air conditioner 3 into the space.
[0041] To put it another way, the hot air discharged from the
electronic device 2 and the cooling air fed from the air
conditioner 3 are mixed and the mixed air of the discharged hot air
and the cooling air is supplied to the electronic device 2, so that
a cooling air volume to be fed by the air conditioner 3 can be
reduced and an electric power consumption can be reduced in the air
conditioning system 1.
[b] Second Embodiment
[0042] A configuration and a flow of processes of an air
conditioning system according to a second embodiment will be
explained in sequence below and advantages according to the second
embodiment will be explained last. As for arrows in FIG. 2, a white
arrow indicates a flow of cooling air and a black arrow indicates a
flow of discharged hot air.
[0043] Configuration of Air Conditioning System
[0044] First, a configuration of an entirety of a data center 100
will be explained with reference to FIG. 2. FIG. 2 is a block
diagram of an arrangement of racks and air conditioners in the data
center according to the second embodiment. As illustrated in FIG.
2, the data center 100 is provided with a plurality of air
conditioners 10 and a plurality of racks 20.
[0045] In the data center 100, a plurality of rack rows each of
which has a plurality of arranged racks 20 are provided and
arranged such that front surface sides thereof face with each other
and back surface sides thereof face with each other. The rack 20,
on which an electronic device is mounted, draws in air from a front
surface and discharges air from a back surface. Here, the
electronic device is mounted on the rack 20 so that a front surface
of the electronic device is the front surface of the rack 20 and a
back surface of the electronic device is the back surface of the
rack 20. The air conditioners 10 are arranged at predetermined
intervals and feed cooling air to the space in which the racks 20
are arranged. The air conditioners 10 are separated via a not
illustrated wall from the area in which the racks 20 are arranged,
the cooling air fed from the air conditioners 10 is supplied from a
not illustrated ceiling duct to a space over the over-panel floor
on which the racks 20 are arranged, and the air conditioners 10
take up hot air from a not illustrated underfloor plenum.
[0046] Here, a configuration and an air flow of the data center 100
will be explained with reference to FIG. 3. FIG. 3 is a block
diagram of a configuration of the data center according to the
second embodiment. As illustrated in FIG. 3, a ceiling opening part
30 is arranged on a ceiling over an aisle in which front surfaces
of the racks 20 face with each other and a floor panel opening part
40 is arranged on a floor panel forming a dual floor in an aisle in
which back surfaces of the racks 20 face with each other in the
data center 100. The air conditioner 10 has an outlet part on an
upper surface thereof and an inlet part on a bottom surface
thereof.
[0047] In the data center 100, there are an air discharge area in
the aisle in which the air discharge surfaces of the racks 20 face
with each other, an air intake area formed in the aisle in which
the air intake surfaces of the racks 20 face with each other, and a
shunt part formed in an upper space of the racks 20, the air
discharge area being filled with discharged air and the shunt part
connecting the air discharge area and the air intake area. The
ceiling opening part 30 which supplies the over-panel floor space
with the cooling air fed from the air conditioner 10 is provided in
the vicinity of the shunt pathway. Here, an air flow will be
explained with reference to FIG. 3. As illustrated in FIG. 3,
cooling air coming out of the outlet part on upper surface of the
air conditioner 10 passes in the ceiling and flows out to a space
over the over-panel floor from the ceiling opening part 30 arranged
over a cool aisle in which front surfaces of racks face with each
other in the data center 100.
[0048] Then, the cool air flowing out to the over-panel floor space
is indrawn from the front surface of the rack, becomes heated by
cooling the electronic device, and is discharged from the back
surface of the rack. After that, a part of the heated air
discharged from the rack 20 is indrawn from the floor panel opening
part 40 arranged on a bottom part of the hot aisle in which the
back surfaces of the racks face with each other, passes in the
underfloor plenum of the dual floor, and is indrawn from the inlet
part on the bottom surface of the air conditioner 10.
[0049] When an air flow volume required by the rack 20 is more than
a flow volume of the cooling air supplied from the ceiling duct,
i.e., when a volume of supplied cooling air is insufficient, a
phenomenon in which a part of hot air discharged from the back
surface of the rack 20 goes to the front surface of the rack 20 by
way of the shunt part formed in the upper space of the rack 20
occurs.
[0050] Since the ceiling opening part 30 is provided immediately
above the air intake area between the front surfaces of racks,
i.e., in the vicinity of the shunt pathway in the second
embodiment, the cooling air coming out of the ceiling opening part
30 is mixed in a mixture part with the air discharged at high
temperature from the air discharge surface of the rack and thereby
air the temperature of which is lower than a target is indrawn by
all racks. Hence, an air volume to be fed from the air conditioner
in the data center 100 can be reduced by using the air discharged
from the rack 20 when a temperature of the air coming out from the
air conditioner 10 is below a tolerance of an intake air
temperature of the rack.
[0051] Next, an air volume, a supplied air temperature, and a
discharged air temperature in the data center will be explained
with reference to FIGS. 4 and 5. FIGS. 4 and 5 are explanatory
views of an air volume, a supplied air temperature, and a
discharged air temperature in the data center. FIG. 4 represents
that air at relatively low temperature can be supplied to an
entirety of the racks with an air volume equivalent to 80% of an
air volume required by the electronic device.
[0052] In the example illustrated in FIG. 4, cooling air at
20.degree. C. is fed from a not illustrated air conditioner with an
air volume equivalent to 80% of an air volume required by the rack
and supplied to the over-panel floor space by way of the ceiling
opening part provided in the vicinity of the shunt part which is
from the air discharge surface to the air intake surface of the
rack. An air volume equivalent to 20% of the discharged air
eventually having reached as high as 30.degree. C. goes to the
front surface side of the rack as an insufficiency, and is mixed
with the cooling air at 20.degree. C. to be 22.degree. C., and is
indrawn by the rack. The temperature of the air indrawn by the rack
at 22.degree. C. goes up by 8.degree. C. in the rack to be
30.degree. C. and discharged air equivalent to 80% returns to the
not illustrated air conditioner by way of the underfloor plenum
from the floor panel opening part.
[0053] FIG. 5 represents that an air volume to be fed from the air
conditioner which feeds air at 20.degree. C. can be suppressed to
50% of the air volume required by the rack when the intake air
temperature of the rack is tolerated up to 28.degree. C. The
cooling air at 20.degree. C. is ejected from the not illustrated
air conditioner with an air volume equivalent to 50% of the air
volume required by the rack and supplied to the over-panel floor
space through the ceiling opening part provided in the vicinity of
the shunt part from the air discharge surface to the air intake
surface of the rack. An air volume equivalent to 50% of the
discharged air eventually having reached as high as 36.degree. C.
goes to the front surface side of the rack as an insufficiency, is
mixed with the cooling air at 20.degree. C. to be 28.degree. C.,
and is indrawn by the rack. The temperature of the air indrawn by
the rack at 28.degree. C. goes up by 8.degree. C. in the rack to be
36.degree. C. and the discharged air equivalent to 50% returns to
the not illustrated air conditioner by way of the underfloor plenum
from the floor panel opening part.
[0054] Next, a discharged air ingression preventive structure
provided at a lower part of the rack will be explained with
reference to FIG. 6. FIG. 6 is an explanatory view of the
discharged air ingression preventive structure provided at a lower
part of the rack. As illustrated in FIG. 6, a discharged air
ingression preventive structure 50 is arranged to prevent an
ingression of the air discharged from the rack through a gap
present at a lower part of the rack 20. This structure allows
preventing a "phenomenon in which the air discharged from the rack
at high temperature goes directly to the air intake surface of the
rack" which occurs at a position away from the ceiling opening part
30 from which cooling air is supplied.
[0055] Next, a rack side partition in a hot aisle will be explained
with reference to FIG. 7. FIG. 7 is an explanatory view of a rack
side partition in a hot aisle. Besides, FIG. 7 is a view seen from
the ceiling side. Here, the hot aisle indicates a space between
neighboring rack rows, back sides of the racks 20 arranged in the
neighboring rack rows facing with each other in the space.
[0056] As illustrated in FIG. 7, a partition 60 is provided at a
rack end in the hot aisle in the data center 100. Thus, hot air
discharged from the back surface of the rack can be prevented from
being discharged from the hot aisle and cool air to be supplied via
the ceiling opening part 30 can be prevented from being discharged
from the floor space directly through the floor panel opening part
40 without being indrawn from the front surface of the rack 20.
Here, a height of the partition 60 is configured to be the same as
that of the rack 20. A configuration of the data center including
air conditioners is illustrated in FIG. 8.
[0057] In this manner, the hot air discharged from the rack 20 and
the cooling air fed from the air conditioner 10 are mixed by
providing a supplying opening for cool air in the vicinity of the
shunt part connecting the air discharge area and the air intake
area in the data center 100, so that an air volume from the air
conditioner can be reduced while keeping an intake air temperature
which can be tolerated in the electronic device mounted on the
rack. Here, a result of a thermal fluid simulation by which whether
or not a temperature distribution in the entirety of the data
center 100 is realized similarly to the simple models illustrated
in FIGS. 4 and 5 is verified will be explained. FIG. 9 illustrates
a temperature distribution as a result of the simulation. In the
simulation model illustrated in FIG. 9, the data center 100
includes two rack rows and the back surfaces of the rack rows face
with each other. Cool air is supplied from the ceiling opening part
30 provided over the cool aisle to the front surface of the
rack.
[0058] In the example of FIG. 9, an air volume equivalent to 80% of
the air volume required by the rack is supplied from the ceiling.
In the hot air discharged from the rack, an air volume equivalent
to 80% returns to the air conditioner by way of the underfloor
plenum through the floor panel opening part provided in the hot
aisle and an air volume equivalent to the rest 20% heads for the
cool aisle by way of the upper part of the rack. Here, the
temperature of the air to be fed from the air conditioner is set to
20.degree. C. and the temperature to go up through the rack is set
to 10.degree. C. While, when the hot air and the cool air are mixed
to be an even temperature under this condition, the intake air
temperature of the rack is expected to be 22.5.degree. C., the
simulation result reveals that air the temperature of which is from
22.degree. C. to 24.degree. C. is indrawn by the rack, which is not
exactly to the ideal illustrated in FIGS. 4 and 5 though, and that
the configuration still work sufficiently.
[0059] Advantages of Second Embodiment
[0060] As described so far, the data center 100 is provided with
the air conditioner 10 which feeds cooling air to the space in
which the racks 20 are arranged and an electronic device 20 which
draws in the cooling air fed by the air conditioner 10 and
discharges hot air to the air discharge area. In addition, the data
center 100 is provided with the ceiling opening part 30 which is
arranged in the vicinity of the shunt part along which the hot air
discharged from the rack 20 flows to be indrawn into the rack 20
and supplies the cooling air fed by the air conditioner 10 to the
space. When the temperature of the air from the air conditioner 10
is lower than the tolerance of the intake air temperature of the
rack 20, discharged air from the rack 20 is used and mixed with the
cooling air fed from the air conditioner 10, so that a volume of
the cooling air from the air conditioner 10 can be suppressed and
an electric power consumption can be reduced while keeping the
tolerance of the intake air temperature of the rack 20.
[0061] It should be noted that the second embodiment is configured
to have the partition 60 which prevents discharged air from flowing
into a space of a side surface of the rack 20, the space being a
shunt part not having an opening part for supplying the cooling air
from the air conditioner 10 among shunt parts connecting the air
discharge area to which hot air is discharged from the rack 20 and
the air intake area from which air is indrawn by the rack 20. This
configuration results in allowing preventing hot air discharged
from the back surface of the rack 20 from being discharged from the
air discharge area and from going into the air intake area without
being mixed with the cooling air.
[c] Third Embodiment
[0062] While the case of providing a ceiling opening part over the
air intake area which is a space surrounded by front surfaces,
i.e., air intake surfaces of the rack in the second embodiment, the
present invention is not limited thereto. The ceiling opening part
may be arranged over the air discharge area which is a space in
which hot air discharged from the rack flows in the present
invention.
[0063] In a third embodiment to be explained below, a case of
providing a ceiling opening part over the hot aisle will be
explained. A configuration of a data center 100A according to the
third embodiment will be explained with reference to FIG. 10. As
illustrated in FIG. 10, a ceiling opening part 30A which supplies
cooling air is arranged over the floor panel opening part 40
compared to the data center 100 illustrated in FIG. 3 in the data
center 100A according to the third embodiment. Specifically, the
ceiling opening part 30A is arranged over the air discharge area
which is a space between rack rows, air discharge surfaces of the
racks 20 arranged in the rack rows facing with each other in the
space.
[0064] In the data center 100A, a temperature of air going towards
the front surface of the rack 20 is decreased by providing the
ceiling opening part 30A in the vicinity of the shunt part as a
flow path which connects the air discharge surface and the air
intake surface and to which discharged hot air goes and by making
the hot air discharged from the rack 20 and the cooling air fed
from the air conditioner 10 mixed.
[0065] Here, a temperature distribution in an entirety of the data
center 100A will be explained. FIGS. 11 to 13 illustrate simulation
results. When the air coming out of the ceiling opening part 30A
highly tends to travel in a straight line, a plate 70 which blocks
a flow of cool air which comes in the hot aisle from the ceiling
opening part 30A as illustrated in FIG. 12 may be provided since
the cool air coming from the ceiling opening part 30A is indrawn
directly into the floor panel opening part 40 arranged on the hot
aisle and thereby an efficiency deteriorates adversely. By
arranging the plate 70, the cool air coming from the ceiling
opening part 30A can be prevented from being directly indrawn into
the floor panel opening part 40 arranged on the hot aisle, so that
the temperature of the intake air of the rack 20 can be suppressed
to around 28.degree. C.
[0066] Besides, a partition may be provided at a rack end in the
hot aisle similarly to the second embodiment as illustrated in FIG.
13. By arranging the partition, hot air discharged from the back
surface of the rack can be prevented from being discharged from the
hot aisle. In addition, the cool air supplied from the ceiling
opening part 30A can be prevented from being indrawn into the floor
panel opening part 40 without passing through the rack 20. Hence,
the intake temperature of the rack 20 can be suppressed to
22.degree. C. to 24.degree. C. Besides in the third embodiment, the
temperature distribution in the air intake surface of the rack 20
becomes even compared to the second embodiment since the air
mixture is performed from a position in the shunt part farther away
from the air intake area.
[0067] As described, the ceiling opening part 30 is provided in the
vicinity of the flow pathway along which the hot air discharged
from the rack 20 flows to be indrawn into the rack 20 and above the
space to which the hot air is discharged by the rack 20 in the
third embodiment. Therefore, discharged air the temperature of
which is decreased by being mixed with the cooling air can be
supplied to the rack 20, a volume of the cooling air to be fed by
the air conditioner 10 can be reduced, and an electric power
consumption can be reduced.
[d] Fourth Embodiment
[0068] While the case of providing a supplying opening for cooling
air in the vicinity of the shunt part at an upper part of the data
center is explained in the first to the third embodiments described
above, the present invention is not limited thereto and a supplying
opening for cooling air may also be provided in the vicinity of a
shunt part located at an end of a rack row.
[0069] Then, as a case of providing a supplying opening for cooling
air in the vicinity of a flow pathway of discharged air coming from
an end of a rack row, a configuration of a data center 100B
according to a fourth embodiment will be explained below with
reference to FIGS. 14 to 16. FIGS. 14 to 16 are block diagrams of a
configuration of the data center according to the fourth
embodiment. FIG. 14 illustrates a cross section along a line A-A
illustrated in FIG. 16, FIG. 15 illustrates a cross section along a
line B-B illustrated in FIG. 14, and FIG. 16 illustrates a cross
section along a line C-C illustrated in FIG. 14.
[0070] As illustrated in FIG. 14, a supplying opening 30B which
supplies the cooling air fed from an air conditioner 10A to an
over-panel floor space is arranged on a wall surface in the data
center 100B. As illustrated in FIGS. 14 and 15, when an air flow
volume required by the rack 20 is more than the flow volume of the
cooling air fed from the air conditioner, i.e., when a volume of
supplied cooling air is insufficient, a phenomenon in which hot air
discharged from the back surface of the rack 20 goes to the air
intake surface of the rack 20 by way of a side and an above of the
rack 20 occurs.
[0071] As illustrated in FIG. 16, cooling air fed from the air
conditioner 10A, in addition to being supplied from the ceiling
similarly to the first to the third embodiments, is supplied to the
rack rows from the supplying opening 30B arranged on the wall
surface in the data center 100B. Besides, discharged hot air is,
similarly to the first to the third embodiments, drawn into the
under-panel space in the data center 100B.
[0072] Here, the air conditioner 10A in the data center 100B will
be explained with reference to FIGS. 17 and 18. FIG. 17 is a side
view of the air conditioner in the data center. FIG. 18 is a front
view of the air conditioner in the data center. As illustrated in
FIGS. 17 and 18, the air conditioner 10A is provided with two
blowers 11 and one heat exchanger 12 under the blowers 11. The
blowers 11 feed cooling air from opening parts provided at an upper
part and a front surface of a housing of the air conditioner 10A to
the space in which the racks 20 are arranged via the ceiling
opening part and the supplying opening 30B on the wall surface in
the data center 100B. The heat exchanger 12 cools discharged hot
air indrawn from the space under the floor panel.
[0073] As described, since the supplying opening for cooling air is
arranged in the vicinity of the flow pathway of the discharged air
coming from the end of rack rows, the discharged air coming from
the end of rack rows can be mixed with the cooling air. As a result
of this, a volume of the cooling air to be fed by the air
conditioner 10 can be reduced and an electric power consumption can
be reduced by supplying the mixed cooling air and discharged air to
the rack 20.
[e] Fifth Embodiment
[0074] While embodiments of the present invention are explained so
far, the present invention may be achieved in various forms
different from the embodiments described above. So, other
embodiments included in the present invention will be explained
below as a fifth embodiment.
[0075] Partition
[0076] While the case of arranging the partition at a rack end in a
hot aisle is explained in the second embodiment, the present
invention is not limited thereto and a partition which can be
opened and closed may be arranged at a rack end in a hot aisle.
[0077] Specifically, partitions 80 are arranged at rack ends in a
hot aisle as illustrated in FIG. 19 and each partition 80 is
arranged so as to be opened and closed. Besides, when the
partitions 80 are in a closed state as illustrated in FIG. 20, the
two partitions 80 alongside block the hot aisle.
[0078] In other words, hot air discharged from the back surface of
the rack can be prevented from being discharged from a hot aisle
and cool air supplied from the ceiling opening part 30 can be
prevented from being indrawn from the floor panel opening part 40
without passing through the rack 20 in the data center. Moreover,
since the partition 80 can be opened and closed, the partition 80
can be easily opened when a maintenance person and the like enter
the hot aisle.
[0079] Cooling Air from Underfloor Space
[0080] While the case of supplying cooling air from a ceiling is
explained in the first to the fourth embodiments, the present
invention is not limited thereto and cooling air may be supplied
from an underfloor space. Specifically, a space between an upper
part of the rack and a ceiling is separated by partition plates 50A
as illustrated in FIG. 21. Then, the cooling air supplied from the
underfloor plenum is supplied to the over-panel floor space by way
of the floor panel opening part 40 and indrawn, by way of a shunt
part provided at a lower part of the rack 20 after being mixed with
the discharged air from the rack 20, by the rack 20. The shunt part
provided at the lower part of the rack 20 is realized by a frame
structure which allows a passage of air. Besides, the discharged
hot air from the rack 20 returns upward to the air conditioner by
way of the ceiling opening part 30 and a part of the discharged hot
air goes downward to be mixed with cooling air.
[0081] Here, since the floor panel opening part 40 is provided in
the vicinity of the shunt pathway in the data center as illustrated
in FIG. 21, cooling air coming out of the floor panel opening part
40 is mixed in a mixture part with the air discharged at high
temperature from the air discharge surface of the rack and thereby
air the temperature of which is lower than a target is indrawn by
all racks. Besides, an air volume to be fed from the air
conditioner in the data center can be reduced by using the air
discharged from the rack 20 when a temperature of the air coming
out from the air conditioner is lower than a target value of an
intake air temperature of the rack.
[0082] Temperature Sensor
[0083] In addition, a temperature sensor may be provided in the
rack as the fifth embodiment. Specifically, a temperature sensor 90
is provided at an upper part of each rack 20 as illustrated in FIG.
22. Then, the temperature sensor 90 measures a temperature of a
mixture part in which the cooling air coming out of the ceiling
opening part 30 is mixed with the air discharged at high
temperature from the air discharge surface of the rack and notifies
the measured temperature to a not illustrated air conditioner.
[0084] For example, when the temperature of the mixture part
notified from the temperature sensor 90 exceeds 28.degree. C. which
is a tolerance of an intake air temperature of the rack, the air
conditioner controls to increase a volume of cooling air. By
providing the temperature sensor in the rack, the volume of cooling
air can be controlled appropriately.
[0085] All examples and conditional language recited herein are
intended for pedagogical purposes to aid the reader in
understanding the invention and the concepts contributed by the
inventor to furthering the art, and are to be construed as being
without limitation to such specifically recited examples and
conditions, nor does the organization of such examples in the
specification relate to a showing of the superiority and
inferiority of the invention. Although the embodiments of the
present inventions have been described in detail, it should be
understood that the various changes, substitutions, and alterations
could be made hereto without departing from the spirit and scope of
the invention.
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