U.S. patent application number 13/030757 was filed with the patent office on 2011-08-25 for manufacturing method of functional film and functional film.
This patent application is currently assigned to FUJIFILM CORPORATION. Invention is credited to Eijirou IWASE.
Application Number | 20110206900 13/030757 |
Document ID | / |
Family ID | 44476746 |
Filed Date | 2011-08-25 |
United States Patent
Application |
20110206900 |
Kind Code |
A1 |
IWASE; Eijirou |
August 25, 2011 |
MANUFACTURING METHOD OF FUNCTIONAL FILM AND FUNCTIONAL FILM
Abstract
A manufacturing method of functional film comprising the steps
of: a first step of feeding a lengthy substrate with self-support
including a first laminate film on a back side, forming an organic
film on a front side of the substrate while transferring the
substrate, providing a second laminate film on a surface of the
organic film, and taking up the substrate into a film roll; and a
second step of loading the film roll on a vacuum deposition
apparatus, continuously feeding the substrate including the first
laminate film and the second laminate film from the film roll,
removing the second laminate film while transferring the substrate,
forming an inorganic film over the organic film of the substrate,
and taking up the substrate into a film roll.
Inventors: |
IWASE; Eijirou;
(Ashigarakami-gun, JP) |
Assignee: |
FUJIFILM CORPORATION
Tokyo
JP
|
Family ID: |
44476746 |
Appl. No.: |
13/030757 |
Filed: |
February 18, 2011 |
Current U.S.
Class: |
428/141 ;
427/177; 428/212; 428/411.1; 428/457; 428/696; 428/698;
428/702 |
Current CPC
Class: |
Y10T 428/24942 20150115;
C23C 14/562 20130101; Y10T 428/24983 20150115; B05D 7/04 20130101;
B32B 27/36 20130101; B32B 2307/402 20130101; B32B 9/04 20130101;
C23C 14/081 20130101; B32B 2457/20 20130101; B32B 2307/7246
20130101; B32B 2307/732 20130101; C23C 16/545 20130101; Y10T
428/24355 20150115; B32B 2255/20 20130101; Y10T 428/31678 20150401;
B32B 15/20 20130101; B32B 2307/538 20130101; Y10T 428/31504
20150401; B32B 2307/54 20130101; B32B 2457/202 20130101; Y10T
428/265 20150115; B32B 2307/7242 20130101; B32B 2307/416 20130101;
B32B 27/365 20130101; B32B 7/12 20130101; B32B 27/08 20130101; B32B
9/041 20130101; B32B 27/32 20130101; B32B 2255/102 20130101; B32B
2307/546 20130101; B32B 15/08 20130101; B32B 2457/206 20130101 |
Class at
Publication: |
428/141 ;
427/177; 428/411.1; 428/212; 428/457; 428/696; 428/698;
428/702 |
International
Class: |
B32B 9/00 20060101
B32B009/00; B05D 1/00 20060101 B05D001/00; B05D 1/36 20060101
B05D001/36; C23C 16/00 20060101 C23C016/00; C23C 14/00 20060101
C23C014/00; B32B 7/02 20060101 B32B007/02; B32B 7/04 20060101
B32B007/04 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 19, 2010 |
JP |
2010-034813 |
Mar 30, 2010 |
JP |
2010-078479 |
Claims
1. A manufacturing method of functional film comprising the steps
of: a first step of feeding a lengthy substrate with self-support
including a first laminate film on a back side, forming an organic
film on a front side of the substrate while transferring the
substrate, providing a second laminate film on a surface of the
organic film, and taking up the substrate into a film roll; and a
second step of loading the film roll on a vacuum deposition
apparatus, continuously feeding the substrate including the first
laminate film and the second laminate film from the film roll,
removing the second laminate film while transferring the substrate,
forming an inorganic film over the organic film of the substrate,
and taking up the substrate into a film roll.
2. The manufacturing method of functional film according to claim
1, wherein a total thickness of the first laminate film and the
substrate is 75 .mu.m or more.
3. The manufacturing method of functional film according to claim
1, wherein adhesion of the first laminate film is 0.01 N/25 mm or
more.
4. The manufacturing method of functional film according to claim
1, wherein adhesion of the second laminate film is 0.06 N/25 mm or
less.
5. The manufacturing method of functional film according to claim
1, wherein a pass roller supports edges of at least one of the back
side of the substrate and the front side of the substrate to
transfer the substrate in the first and second steps.
6. The manufacturing method of functional film according to claim
1, further comprising: a step of improving adhesion between the
substrate and the first laminate film before deposition of the
inorganic film on the substrate.
7. The manufacturing method of functional film according to claim
1, wherein thickness of the inorganic film is 5 nm or more and 200
nm or less.
8. The manufacturing method of functional film according to claim
1, wherein the inorganic film contains a material selected from the
group consisting of metal, metal oxide, metal nitride, metal
carbide, metal fluoride, and composites of the metal, metal oxide,
metal nitride, metal carbide, and metal fluoride.
9. The manufacturing method of functional film according to claim
1, wherein the organic film contains one of radiation-curing
monomer and oligomer.
10. A functional film comprising: a substrate; a functional layer
including at least one organic film and at least one inorganic film
that are alternately arranged on one side of the substrate; a first
laminate film arranged on the other side of the substrate; and a
second laminate film arranged on a top layer of the functional
layer, wherein adhesion between the second laminate film and the
top layer is less than adhesion between the first laminate film and
the substrate.
11. The functional film according to claim 10, wherein Young's
modulus of the second laminate film is less than Young's modulus of
the first laminate film.
12. The functional film according to claim 10, wherein the adhesion
between the second laminate film and the top layer is in a range of
0.02 to 1.0 (N/25 mm), and the adhesion between the first laminate
film and the substrate is in a range of 0.03 to 1.5 (N/25 mm).
13. The functional film according to claim 10, wherein center line
average roughness (Ra) of the second laminate film is 5 to 50 nm,
and center line average roughness (Ra) of the first laminate film
is 5 to 80 nm.
14. The functional film according to claim 10, wherein thickness of
the inorganic film is 200 nm or less.
15. The functional film according to claim 10, wherein the
inorganic film contains a material selected from the group
consisting of metal, metal oxide, metal nitride, metal carbide,
metal fluoride, and composites of the metal, metal oxide, metal
nitride, metal carbide, and metal fluoride.
16. The functional film according to claim 10, wherein the organic
film contains one of radiation-curing monomer and oligomer.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a manufacturing method of
functional film and a functional film, and particularly, to a
manufacturing method of functional film, on which an organic film
and an inorganic film are deposited on a substrate, and a
functional film.
[0003] 2. Description of the Related Art
[0004] Various functional films, such as gas barrier films,
protective films, optical filters, anti-reflective films, and other
optical films, are used in various apparatuses, such as optical
elements, display devices such as liquid crystal displays and
organic EL displays, semiconductor devices, and thin-film solar
cells.
[0005] Deposition techniques based on vacuum deposition methods,
such as sputtering and plasma CVD, are used to manufacture the
functional films. A so-called roll-to-roll technique for continuous
deposition on a lengthy substrate is implemented to efficiently
manufacture the functional films with high productivity. Japanese
Patent Application Laid-Open No. 8-92727 discloses an example of a
manufacturing method of functional film (for example, barrier
film), in which acrylate monomer, etc., is applied to a substrate
that is continuously driven, the film is taken up into a roll after
drying and curing, the roll including an organic film is fed to a
vacuum deposition apparatus, and an inorganic film is deposited on
the organic film.
[0006] Japanese Patent Application Laid-Open No. 2009-86022
discloses heating at least one of protective films at a
predetermined temperature range in a polarizing plate including the
protective films on both sides of a polarizing film. As a result, a
polarizing plate with excellent dimensional stability can be
obtained for a long time.
[0007] The protective films of Japanese Patent Application
Laid-Open No. 2009-86022 is used to protect a completed product
(polarizing plate).
[0008] Japanese Patent Application Laid-Open No. 8-92727 discloses
a method of setting a film roll of roll hardness 70 to 95 on a
feeding unit of a vacuum deposition apparatus and continuously
depositing inorganic films on a substrate to uniform the quality of
the functional films by preventing a roll gap in the deposition of
inorganic films.
[0009] However, even if the film roll including the organic films
is taken up at the roll hardness 70 to 95, the film roll takes in
entrained air when the substrate is taken up. If the film roll with
the entrained air is set to the feeding unit of the vacuum
deposition apparatus with reduced pressure, the entrained air in
the film roll comes out.
[0010] As a result, the balance of stress (tension and friction)
inside the film roll during take-up is lost, and the film roll
makes a motion of "tight winding (roll diameter shrinkage)".
[0011] When the "tight winding" occurs, the organic film on the
substrate may be rubbed against the back side of the substrate on
the upper side or may touch the dust attached on the back side of
the substrate in the film roll. Therefore, minute explosions of
film occur in the organic film, and the smoothness is lost. If the
substrate is transferred and the inorganic film is deposited on the
organic film, a deposition failure occurs, and there is a problem
of cracks or holes in the inorganic film.
[0012] Furthermore, the performance of the functional film is
affected if the organic film or the inorganic film touches the
guide roller when the guide roller transfers the substrate
including the organic film or the inorganic film deposited in the
vacuum deposition apparatus. Since there is no entrained air in the
vacuum deposition apparatus as opposed to the atmosphere, the
contact, i.e. friction, with the guide roller is large. Minute film
destructions occur if the organic film touches the guide roller
before the deposition of the inorganic film. If the inorganic film
touches the guide roller after the deposition of the inorganic
film, minute scratches occur because the inorganic film is
significantly thin, and there is a problem that the barrier
performance is lost.
[0013] If the used substrate is thin and soft, deflections and
vertical wrinkles easily occur in a width direction depending on
the tension necessary for the transfer. As a result, force is
applied to a location where the guide roller and the substrate
locally contact, and the organic films and the inorganic films are
easily broken. Furthermore, if a fold occurs in the substrate,
there is a problem that a crack easily occurs in the organic film
and the inorganic film.
[0014] To solve the problems, there can be a method of supporting
only the edges of the substrate and transferring the substrate
without touching the deposition surface. The vertical wrinkles of
the substrate increase due to the tension if the substrate is thin.
Therefore, the productivity needs to be significantly reduced by
very slowly transferring the substrate or by enlarging the area of
the supported part.
[0015] Meanwhile, in view of the productivity, cost, and use
applications, the reduction in the thickness is strongly demanded
in relation to the type and thickness of the substrate. In the
deposition method of the inorganic film, such as a barrier film,
there is also a step of exposing the substrate to a heat source.
Therefore, the substrate needs to be cooled from the opposite side
(back side) of the deposition side. A cooling drum and the
substrate are adhered to cool the substrate, and it is important to
control the tension of the substrate during transfer.
[0016] A problem of the thin functional film, such as a barrier
film, using the roll-to-roll technique is that the functional layer
of the functional film needs to be protected during a
deposition/transfer process, during a storage/transport process,
and during an assembly process.
[0017] As for the characteristics of laminate films to be used,
vertical wrinkles or folds of the substrate during transfer,
take-up to the film roll, prevention of scratches on the inorganic
films, etc., need to be taken into consideration when a plurality
of organic films and inorganic films are laminated on the substrate
to form the functional layer. Protection of the functional layer
also needs to be taken into consideration when the completed
functional film is laminated on another product.
SUMMARY OF THE INVENTION
[0018] The present invention has been made in view of the
circumstances, and the present invention provides a manufacturing
method of a high-quality functional film with high
productivity.
[0019] Furthermore, the present invention has been made in view of
the circumstances, and the present invention provides a functional
film including laminate films capable of solving the problems in
the deposition/transfer process, the storage/transport process, and
the assembly process.
[0020] To attain the objects, the present invention provides a
manufacturing method of functional film comprising the steps of: a
first step of feeding a lengthy substrate with self-support
including a first laminate film on a back side, forming an organic
film on a front side of the substrate while transferring the
substrate, providing a second laminate film on a surface of the
organic film, and taking up the substrate into a film roll; and a
second step of loading the film roll on a vacuum deposition
apparatus, continuously feeding the substrate including the first
laminate film and the second laminate film from the film roll,
removing the second laminate film while transferring the substrate,
forming an inorganic film over the organic film of the substrate,
and taking up the substrate into a film roll.
[0021] According to the present invention, since the substrate
includes the first laminate film on the back side, the substrate is
self-supported. Vertical wrinkles and folds are unlikely to be
generated on the substrate because of the self-support even if the
substrate is transferred under tension. Therefore, defects, such as
holes and cracks, of the organic film and the inorganic film caused
by the vertical wrinkles and the folds can be prevented.
Furthermore, local contact between the substrate and the guide
roller caused by the vertical wrinkles and the folds can be
prevented. High-quality functional films with fewer defects can be
obtained.
[0022] According to the present invention, after the organic film
is formed on the substrate, the second laminate film is provided to
the surface of the organic film, and the substrate is taken up as
the film roll. The film roll including the second laminate film is
set to the vacuum deposition apparatus. Even if there is tight
winding in the film roll after the evacuation, the organic film is
not damaged because of the protection by the second laminate film.
The substrate is transferred to the vacuum deposition apparatus
while the second laminate film protects the organic film until the
deposition of the inorganic film. Therefore, the organic film is
not damaged by the transfer. As a result, the inorganic film can be
formed on a smooth organic film.
[0023] Preferably, the present invention provides the manufacturing
method of functional film, wherein a total thickness of the first
laminate film and the substrate is 75 .mu.m or more.
[0024] Preferably, the present invention provides the manufacturing
method of functional film, wherein adhesion of the first laminate
film is 0.01 N/25 mm or more.
[0025] Preferably, the present invention provides the manufacturing
method of functional film, wherein adhesion of the second laminate
film is 0.06 N/25 mm or less.
[0026] Preferably, the present invention provides the manufacturing
method of functional film, wherein a pass roller supports edges of
at least one of the back side of the substrate and the front side
of the substrate to transfer the substrate in the first and second
steps.
[0027] Preferably, the present invention provides the manufacturing
method of functional film, further comprising a step of improving
adhesion between the substrate and the first laminate film before
deposition of the inorganic film on the substrate.
[0028] Preferably, the present invention provides the manufacturing
method of functional film, wherein thickness of the inorganic film
is 5 nm or more and 200 nm or less.
[0029] Preferably, the present invention provides the manufacturing
method of functional film, wherein the inorganic film contains a
metal selected from the group consisting of metal, metal oxide,
metal nitride, metal carbide, metal fluoride, and composites
thereof.
[0030] Preferably, the present invention provides the manufacturing
method of functional film, wherein the organic film contains one of
radiation-curing monomer and oligomer.
[0031] An aspect of the present invention provides a functional
film comprising: a substrate; a functional layer including at least
one organic film and at least one inorganic film that are
alternately arranged on one side of the substrate; a first laminate
film arranged on the other side of the substrate; and a second
laminate film arranged on a top layer of the functional layer,
wherein adhesion between the second laminate film and the top layer
is less than adhesion between the first laminate film and the
substrate.
[0032] The first laminate film prevents vertical wrinkles and folds
of the substrate during a deposition/transfer process using
roll-to-roll. The second laminate film prevents the top layer of
the functional layer during a storage/transport process. Since the
adhesion of the second laminate film is weaker than the adhesion of
the first laminate film, the second laminate film can be easily
removed upon attachment to another product (during assembly
process).
[0033] Preferably, according to another aspect of the present
invention, Young's modulus of the second laminate film is less than
Young's modulus of the first laminate film. Since the Young's
modulus of the second laminate film is low, wrinkles are not
generated on the first laminate film due to an influence of the
tension of the second laminate film being removed when the second
laminate film is peeled off first.
[0034] In the step of peeling off the second laminate film, the
substrate and the first laminate film provided to the substrate are
held (fixed) by something. If the Young's modulus of the second
laminate film is greater than the Young's modulus of the first
laminate film stretched to obtain the self-support of the
substrate, the first laminate film with low Young's modulus may be
pulled (tension of being peeled off) and bent. Since the Young's
modulus of the second laminate film is low, the destruction of the
first laminate film can be prevented.
[0035] Preferably, according to another aspect of the present
invention, the adhesion between the second laminate film and the
top layer is in a range of 0.02 to 1.0 (N/25 mm), and the adhesion
between the first laminate film and the substrate is in a range of
0.03 to 1.5 (N/25 mm).
[0036] As a result of setting the adhesion of the second laminate
film within the range, removal during the storage/transport process
can be prevented, and the second laminate film can be removed
during the assembly process. As a result of setting the adhesion of
the first laminate film within the range, removal during the
deposition/transfer process can be prevented, and folds, wrinkles,
etc., upon the removal can also be prevented.
[0037] Preferably, according to another aspect of the present
invention, center line average roughness (Ra) of the second
laminate film is 5 to 50 nm, and center line average roughness (Ra)
of the first laminate film is 5 to 80 nm.
[0038] As a result of setting the center line average roughness
(Ra) of the second laminate film within the range, scratches on the
top layer of the functional layer by the second laminate film can
be prevented in the storage/transport process. As a result of
setting the center line average roughness (Ra) of the first
laminate film within the range, scratches on the inorganic film by
the first laminate film can be prevented when the substrate is
taken up into a film roll in the deposition/transfer process.
[0039] Preferably, according to another aspect of the present
invention, thickness of the inorganic film is 200 nm or less.
[0040] Preferably, according to another aspect of the present
invention, the inorganic film contains a material selected from the
group consisting of metal, metal oxide, metal nitride, metal
carbide, metal fluoride, and composites thereof.
[0041] Preferably, according to another aspect of the present
invention, the organic film contains one of radiation-curing
monomer and oligomer.
[0042] According to the manufacturing method of the present
invention, a high-quality functional film with high productivity
can be obtained.
[0043] Furthermore, according to the present invention, a
high-quality functional film can be obtained during a
deposition/transfer process, during a storage/transport process,
and during an assembly process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0044] FIG. 1 is a configuration diagram of a functional film;
[0045] FIGS. 2A and 2B are diagrams showing an example of an
apparatus that carries out a manufacturing method of functional
film;
[0046] FIGS. 3A and 3B are conceptual diagrams showing states of
transfer by stepped rollers;
[0047] FIG. 4 is a configuration diagram of another functional
film;
[0048] FIG. 5 is a configuration diagram of another functional
film;
[0049] FIGS. 6A and 6B are diagrams showing an example of an
apparatus which performs a manufacturing method of functional
film;
[0050] FIG. 7 is a diagram showing state of peeling a second
laminate film;
[0051] FIG. 8 is a table showing results of Examples; and
[0052] FIG. 9 is a table showing results of Examples.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0053] Preferred embodiments of the present invention will be
described along with the attached drawings. Although the present
invention will be described by the following preferred embodiments,
changes can be made by a multiplicity of methods without departing
from the scope of the present invention, and embodiments other than
the present embodiments can be used. Therefore, all changes within
the scope of the present invention are included in the claims.
Numeric value ranges expressed by "to" in the present specification
denote ranges including numeric values before and after "to".
First Embodiment
[0054] FIG. 1 shows an example of a configuration diagram of a
functional film manufactured by a manufacturing method of the
present invention. As shown in FIG. 1, a functional film 10
includes organic films 14 deposited on the front side of a
substrate 12 and inorganic films 16 deposited on the organic films
14. In the functional film 10 shown in FIG. 1, a combination of two
layers, the organic film 14 and the inorganic film 16, is repeated
three times. The functional film 10 includes an organic film 18 at
the outermost layer. The organic films 14, the inorganic films 16,
and the organic film 18 function as a functional layer 20. The
organic film 18 as the top layer also functions as a protection
layer. The structure of the organic films 14 and the inorganic
films 16 deposited on the front side of the substrate 12 is not
limited to the structure described above. The deposition in the
order of the inorganic film and the organic film on the front side
of the substrate 12 is also possible.
[0055] A first laminate film 21 is attached to the back side of the
substrate 12. The attachment of the first laminate film 21 provides
self-support to the composite of the substrate 12 and the first
laminate film 21. It is preferable that a total thickness t of the
substrate 12 and the first laminate film 21 is 75 .mu.m or more.
The self-support of the composite of the substrate 12 and the first
laminate film 21 can be secured if the total thickness t is 75
.mu.m or more.
[0056] The self-support denotes the elasticity (rigidity) of the
film, and the dimension of the self-support is defined by a product
of the Young's modulus (GPa) and a cube of the film thickness
(.mu.m). In the case of a composite in which the laminate film is
attached to the substrate, the self-support is defined by a product
of an average value (GPa) of the Young's modulus (GPa) of the
substrate and the Young's modulus (GPa) of the laminate film and a
cube of the total thickness (.mu.m) of the composite. The range of
the self-support necessary in the present embodiment is 2
(GPa).times.100 (.mu.m).sup.3 to 6 (GPa).times.200
(.mu.m).sup.3.
[0057] The substrate 12 is not particularly limited if the
deposition of the organic films 14 and the inorganic films 16 by
vacuum deposition is possible. Various substrates used in
functional films, such as PET films and various other resin films
as well as aluminum sheets and various other metal sheets, can be
used.
[0058] PE, PET, PEN, PC, COP, etc., can be used as the first
laminate film 21 if the self-support can be provided to the
substrate 12. As described below, the first laminate film 21 can be
included on the back side of the substrate 12 at the deposition of
the inorganic films 16 by vacuum deposition. When the first
laminate film 21 is removed from the substrate 12, it is preferable
that the adhesive strength between the substrate 12 and the first
laminate film 21 is weaker than the adhesive strength between the
organic film 14 or the inorganic film 16, which is deposited on the
front side of the substrate 12, and the substrate 12. It is
preferable that the adhesion of the first laminate film 21 is
0.01N/25 mm or more. The first laminate film 21 may be peeled off
during transfer if the adhesion of the first laminate film 21 is
weak, and the transfer may be hindered. The removal of the first
laminate film 21 during transfer can be prevented by setting the
adhesion of the first laminate film 21 equal to or greater than the
value.
[0059] Examples of the organic films 14 include all films, such as
an anchor coat layer for improving the adhesion, an oxide film
deposited by atmospheric pressure plasma, and a thermosetting or
UV-curing organic film, that are deposited before the deposition of
the inorganic films.
[0060] It is preferable that the inorganic films 16 include at
least one of or a composite of metal, metal oxide, metal nitride,
metal carbide, and metal fluoride.
[0061] The functional film 10 with a predetermined function can be
obtained by forming the inorganic film 16 or a laminated body (the
functional layer 20) of the inorganic films 16 and the organic
films 14 on the front side of the substrate 12.
[0062] A manufacturing method of functional film according to the
embodiment will be described. A manufacturing apparatus that
manufactures the functional film includes, for example, an organic
film deposition apparatus 23 that deposits an organic film on the
front side of the substrate 12 and a vacuum deposition apparatus 24
that deposits an inorganic film on the organic film.
[0063] FIG. 2A conceptually shows an example of the organic film
deposition apparatus 23. The organic film deposition apparatus 23
includes a coating device 26, a heating device 28, and a UV
irradiation apparatus 30. The organic film deposition apparatus 23
deposits the organic film by roll-to-roll. A film roll 40 is first
loaded on a feeding device 32. A take-up roller 36 then transfers
the substrate 12 in a longitudinal direction from the film roll 40.
The coating device 26 applies, for example, a coating solution
containing prepared radiation-curing monomer or oligomer to the
substrate 12.
[0064] The heating device 28 dries the coating solution and
evaporates the solvent. The UV irradiation apparatus 30 applies an
ultraviolet ray to the coating solution after drying to start
polymerization reaction. The organic film 14 is hardened and
deposited on the substrate 12. A laminate film feeding device 81
feeds a second laminate film 22. A pair of nip rollers 38 attach
the second laminate film 22 to the surface of the organic film 14.
A take-up device 34 takes up the substrate 12 as a film roll 42. At
this point, the take-up tension of the substrate 12 is
controlled.
[0065] In the present embodiment, the first laminate film 21 is
included on the back side, and the self-supported substrate 12 is
taken up into a roll shape and prepared as the film roll 40. The
first laminate film 21 provides the self-support to the substrate
12. Therefore, vertical wrinkles, folds, etc., are not generated on
the substrate 12 when the substrate 12 is transferred from the
feeding device 32 to the take-up device 34. This can prevent the
organic film deposited on the substrate 12 from being destroyed.
Particularly, the prevention of the destruction of the organic film
before the deposition of the inorganic film can prevent generation
of a deposition failure area (i.e. defect) on the inorganic
film.
[0066] The first laminate film 21 is attached to the substrate
before the application of the organic film in the present
embodiment. The first laminate film 21 can also be attached to the
substrate after the application of the organic film. Once the first
laminate film 21 is attached to the back side of the substrate, the
first laminate film 21 is not removed from the substrate 12 until
required number of organic films and inorganic films are laminated
on the substrate 12.
[0067] The second laminate film 22 is attached after the deposition
of the organic film, and the second laminate film 22 protects the
surface of the organic film. It is preferable that the adhesion of
the second laminate film 22 is 0.06 N/25 mm or less. The second
laminate film 22 is removed before the deposition of the inorganic
film. The second laminate film 22 can be surely removed if the
adhesion is 0.06 N/25 mm or less.
[0068] PE (high-density PE or low-density PE), PET, etc., can be
used as a material of the second laminate film 22. Particularly, it
is preferable to use PE from the viewpoint of price and
productivity.
[0069] Like the organic film deposition apparatus 23, the vacuum
deposition apparatus 24 is an apparatus that forms an inorganic
film by roll-to-roll as shown in FIG. 2B. The vacuum deposition
apparatus 24 includes a feed chamber 50, a deposition chamber 52,
and a take-up chamber 54. A feeding device 56 of the feed chamber
50 feeds the substrate 12 from the film roll 42. The inorganic film
16 is deposited on the organic film 14 of the substrate 12 in the
deposition chamber 52 while the substrate 12 is transferred in the
longitudinal direction. A take-up device 58 of the take-up chamber
54 takes up the substrate 12, on which a laminated body including
the organic film 14 and the inorganic film 16 is deposited, into a
film roll 48.
[0070] A deposition method of the inorganic film will be described.
The feed chamber 50 of the vacuum deposition apparatus 24 includes
the feeding device 56, a guide roller 60, an evacuation device 61,
and a laminate film take-up device 83. The film roll 42 formed by
winding the substrate 12 is loaded on the feeding device 56. The
organic film deposition apparatus 23 deposits the organic film 14
on the front side of the substrate 12, while the first laminate
film 21 is attached to the back side of the substrate 12. The
evacuation device 61 reduces the pressure of the feed chamber 50.
The reduction in the pressure causes tight winding of the film roll
42. Since the second laminate film 22 is attached to the surface of
the organic film 14 in the present embodiment, the organic film 14
can be protected from scratches of rubbing caused by the tight
winding.
[0071] The feeding device 56 feeds the substrate 12 from the film
roll 42. The laminate film take-up device 83 takes up the second
laminate film 22 from the substrate 12 before the substrate 12 is
transferred to the deposition chamber 52. The guide roller 60
guides the substrate 12 including the exposed organic film 14 to
pass through a predetermined path and through a slit 74a of a
partition 74, and the substrate 12 is transferred to the deposition
chamber 52. A driving source not shown rotates the feeding device
56 counter-clockwise in FIG. 2B in the feed chamber 50. Since the
first laminate film 21 is attached to the back side of the
substrate 12, the substrate 12 is self-supported.
[0072] The inorganic film 16 is deposited on the front side of the
substrate 12, i.e. on the surface of the organic film 14, in the
deposition chamber 52. As shown in FIG. 2B, the deposition chamber
52 includes a drum 62, deposition devices 64a, 64b, 64c, and 64d,
guide rollers 68 and 70, and an evacuation device 72. If the
deposition chamber 52 is designed to form a film by sputtering,
plasma CVD, etc., a high-frequency power source, etc., is further
installed in the deposition chamber 52.
[0073] A driving source not shown rotates the drum 62 of the
deposition chamber 52 counterclockwise in FIG. 2B around the center
line. The substrate 12 guided to a predetermined path by the guide
roller 68 is wound around a predetermined area in the peripheral
surface of the drum 62, and the drum 62 supports and guides the
substrate 12 to transfer the substrate 12 through a predetermined
transfer path. The deposition devices 64a to 64d deposit an
inorganic film on the organic film 14. It is preferable that the
thickness of the inorganic film 16 deposited at this time is 5 nm
to 200 nm.
[0074] The deposition devices 64a to 64d are devices that deposit
an inorganic film on the front side of the substrate 12 by a vacuum
deposition method. The deposition device is not limited, and all
known vacuum deposition methods (vapor deposition methods), such as
CVD, plasma CVD, sputtering, vacuum deposition, and ion plating,
can be used.
[0075] Therefore, the deposition devices 64a to 64d are constituted
by various members corresponding to the implemented vacuum
deposition method. For example, if the deposition chamber 52 is
designed to form the inorganic film 16 by the ICP-CVD method
(inductively coupled plasma CVD), the deposition devices 64a to 64d
include an induction coil that forms an inductive field, a gas
feeding device that feeds a reaction gas to the deposition area,
etc.
[0076] If the deposition chamber 52 is designed to form the
inorganic film 16 by the CCP-CVD method (capacitively coupled
plasma CVD), the deposition devices 64a to 64d include a shower
electrode, etc. The shower electrode is hollow and includes a
multiplicity of small holes on the surface opposing the drum 62.
The shower electrode is connected to a source of the reaction gas
and functions as a high-frequency electrode and a reaction gas
feeding device.
[0077] If the deposition chamber 52 is designed to form the
inorganic film 16 by vapor phase deposition based on the CVD
method, the deposition devices 64a to 64d include an introduction
device of the reaction gas, etc.
[0078] If the deposition chamber 52 is designed to form the
inorganic film 16 by sputtering, the deposition devices 64a to 64d
include a target holding device, a high-frequency electrode, a
feeding device of a sputter gas, etc.
[0079] The evacuation device 72 evacuates the deposition chamber 52
to set a degree of vacuum corresponding to the deposition of the
inorganic film 16 based on the vacuum deposition method. The
evacuation device 72 is not particularly limited, and various
vacuum pumps, such as a turbo pump, a mechanical booster pump, and
a rotary pump, as well as known (vacuum) evacuation devices used in
the vacuum deposition apparatus using an auxiliary device, such as
a cryogenic coil, an adjustment device of the attained degree of
vacuum or emission, etc., can be used.
[0080] After the deposition of the inorganic film 16 by the
deposition devices 64a to 64d, guide rollers 70 and 78 guide the
substrate 12 to a slit 75a of the partition 75, and the substrate
12 is transferred to the take-up chamber 54. An evacuation device
80 is arranged in the take-up chamber 54. The evacuation device 80
reduces the pressure to set a predetermined pressure in the take-up
chamber 54. The take-up device 58 arranged in the take-up chamber
54 takes up the substrate 12 into the film roll 48.
[0081] In addition to the illustrated members, transfer devices
that transfer the substrate 12 in a predetermined path may be
arranged in the feed chamber 50, such as a pair of transfer rollers
and a guide member that restricts the position of the substrate 12
in the width direction.
[0082] Providing the first laminate film 21 to the back side of the
substrate 12 allows the substrate 12, on which the inorganic film
16 is deposited, to have appropriate rigidity. The substrate 12 can
be transferred without the generation of vertical wrinkles and
folds when the vacuum deposition apparatus 24 is transferred (or
moved back and forth for a plurality of times). A defect of the
inorganic film 16 caused by a deposition failure can be prevented,
and the inorganic film 16 with excellent quality can be
obtained.
[0083] FIGS. 3A and 3B show states of transfer of the substrate in
the vacuum deposition apparatus. In the vacuum deposition
apparatus, it is preferable to transfer the substrate 12 by a
stepped guide roller that touches only the edges of the substrate
12 (edges in a direction (width direction) orthogonal to the
transfer direction). In general, not everything up to the edges of
the functional film 10 including various films on the substrate 12
is used as a product. Sections near the edges are cut, or the edges
do not have to function as the functional film 10 even if the edges
are used. This is because there is no problem as a product even if
the performance or characteristics of the edges of the functional
film 10 are deteriorated or degraded.
[0084] FIG. 3A shows a state of transfer of the substrate 12 before
the deposition of the inorganic film in the feed chamber 50. The
diameters at both ends of the stepped guide roller 60 are greater
than the diameter at the center. The second laminate film 22
attached to the organic film 14 is in contact only at both ends of
the guide roller 60 and the area (function expression section) that
is actually used as the product is not in contact with the guide
roller 60. Particularly, since the laminate film 21 is attached to
the back side of the substrate 12, vertical wrinkles and folds are
unlikely to be generated on the substrate 12 even if tension is
applied. The performance and characteristics of the organic film 14
at the function expression section are not degraded, and excellent
surface smoothness and surface property are attained. Therefore,
the performance of the inorganic film 16 deposited on the organic
film 14 is not lost. The second laminate film 22 protects the
organic film 14, and damage of the organic film 14 during transfer
of the substrate 12 can be prevented.
[0085] FIG. 3B shows a state of transfer of the substrate 12 after
the deposition of the inorganic film. The diameters at both ends of
the stepped guide rollers 70 and 78 are greater than the diameters
at the centers. The inorganic film 16 is in contact only at both
ends of the guide rollers 70 and 78, and the function expression
section of the inorganic film 16 is not in contact with the guide
rollers 70 and 78. Since the first laminate film 21 is attached to
the back side of the substrate 12, vertical wrinkles and folds are
unlikely to be generated on the substrate 12. Therefore, the
performance and characteristics of the inorganic film 16 at the
function expression section is not degraded due to a crack,
etc.
[0086] Since the first laminate film 21 provides the self-support
to the substrate 12, the transfer speed of the substrate 12 can be
increased even if the substrate is supported only at the edges of
the stepped guide rollers. Furthermore, the stability can be
significantly improved.
[0087] In general, when the stepped guide rolls are used, the
tension of the transfer cannot be increased because of the steps.
Particularly, the center is easily deflected if there is no
self-support in the substrate, and the upper limit of the tension
becomes lower. Meanwhile, the tension needs to be increased to
prevent slips to speed up the transfer. Increasing the self-support
by the first laminate film 21 on the back side of the substrate 12
can prevent the deflection when the tension is applied and can
increase the transfer speed of the substrate 12. Since the
self-support is high, there is less deformation at the stepped
sections. Meandering and tension variations are not generated, and
the stability (accuracy) of transfer improves.
[0088] As shown in FIG. 2B, the substrate 12 including the
deposited inorganic film 16 is taken up into the film roll 48 in
the take-up chamber 54. The film roll 48 is set as the film roll 40
in the feeding device 32 of the organic film deposition apparatus
23, and the organic film 14 is deposited on the inorganic film 16.
The second laminate film 22 is attached to the substrate 12 on
which the organic film 14, the inorganic film 16, and the organic
film 14 are deposited. The second laminate film 22 protects the
front side of the organic film 14 as a top layer. After the
attachment of the second laminate film 22, the take-up device 34
takes up the substrate 12 into the film roll 42.
[0089] The film roll 42 is then loaded on the feed chamber 50 of
the vacuum deposition apparatus 24. The inorganic film 16 is
deposited on the substrate 12. A desired functional film is
manufactured through a plurality of times of the deposition step of
the organic film 14 and the deposition step of the inorganic film
16. The deposition of the organic material and the deposition of
the inorganic material are repeated three times, and the organic
material is further deposited on the outermost layer to manufacture
the functional film 10 shown in FIG. 1.
[0090] After predetermined organic films 14 and inorganic films 16
are deposited on the substrate 12, the first laminate film 21 can
be removed from the substrate 12. This is because the first
laminate film 21 is attached to the back side of the substrate 12
to secure the self-support in the deposition step, not to protect
the substrate 12.
[0091] As compared to a mode of thickening the substrate to provide
the self-support, the first laminate film 21 is attached to provide
the self-support in the present embodiment. Therefore, the first
laminate film 21 can be peeled off during processing of the product
after the creation of the functional film 10, and the thickness of
the substrate 12 can be adjusted. As compared to the mode of
thickening the substrate which leads to an increase in the unit
price, the attachment of the first laminate film 21 to provide the
self-support allows manufacturing the functional film with low
cost, because the substrate 12 is not thickened. Since the first
laminate film 21 is attached to provide the self-support, the
transfer speed can be increased, and the functional film can be
manufactured without reducing the production efficiency when
thinning of the substrate 12 is required.
[0092] Particularly, attachment of foreign matters on a smooth
surface of the substrate 12 before the deposition of the inorganic
film 16 has a large effect on a formation failure of the inorganic
film 16 afterwards. The smooth surface of the substrate 12 denotes
the surface of the organic film 14 when the organic film 14 is
deposited on the substrate 12. An increase in the transfer accuracy
is needed to protect the substrate 12 before the deposition of the
inorganic film 16. To increase the transfer accuracy, the first
laminate film 21 needs to be attached not only from the viewpoint
of protection, but also from the viewpoint of the self-support
(rigidity). The total thickness of the substrate 12 and the first
laminate film 21 is also important. The second laminate film 22
further protects the surface of the organic film 14. Therefore, the
smoothness of the surface of the organic film 14 before the
formation of the inorganic film 16 can be maintained.
[0093] It is preferable that there is a step of improving the
adhesive strength between the substrate 12 and the first laminate
film 21 before the deposition of the inorganic film 16. It is
preferable that the step of improving the adhesive strength
includes a heating zone and an ultraviolet curing zone. The heating
zone and the ultraviolet curing zone for the substrate 12, which
includes the first laminate film 21, to pass through may be
arranged before the vacuum deposition apparatus 24, or the heating
device 28 and the UV irradiation apparatus 30 of the organic film
deposition apparatus 23 shown in FIG. 2A may be used in the
adhesive strength improvement step. In that case, the take-up
device 34 takes up the film, while the transfer apparatus applies
certain tension (about 50 to 500 N/m). The adhesion between the
substrate taken up while applying heat and the first laminate film
21 improves, and removal and deformation during handling in the
vacuum deposition are unlikely to occur.
[0094] On the other hand, the second laminate film 22 is removed in
the vacuum deposition apparatus 24, and it is preferable that the
adhesion of the second laminate film 22 is low. Therefore, it is
preferable to attach the second laminate film 22 after the adhesion
improvement step for the first laminate film 21.
[0095] The material of the organic film 14 can be a material that
allows an anchor coat layer for improving the adhesion, an oxide
film deposited by atmospheric pressure plasma, and a thermosetting
or UV-curing organic film to be used before the deposition of the
inorganic film.
[0096] Specifically, for example, it is preferable that two or more
ethylenic unsaturated double bonds are included as monomers or
oligomers and that the monomers and the oligomers are added and
polymerized by irradiation of light.
[0097] For example, a UV-curing resin can be applied as the organic
film 14 to improve the strength and the surface smoothness. An
example of the ultraviolet-curing resin includes a mixed solution
of a compound of polymerizable monomer BEPGA 15 g of Kyoeisha
Chemical Co., Ltd. and polymerizable monomer V-3PA 5 g of Osaka
Organic Chemical Industry, Ltd., an ultraviolet polymerization
initiator (produced by Lamberti, product name: Esacure KTO-46) 1.5
g, and 2-butanone 190 g, and the solution can be applied to the
substrate to form the organic film.
[0098] In place of BEPGA and V-3PA, acrylic monomers: KAYARAD DPHA
(produced by Nippon Kayaku Co., Ltd.) and KAYARAD TMPTA (produced
by Nippon Kayaku Co., Lid.) can be used.
[0099] For example, the adhesion can be improved by applying a
thermosetting resin for the organic film 14. For example, a
thermosetting resin (epoxy resin EPICLON 840-S of DIC Corporation
(bisphenol A liquid)) can be diluted by methyl ethyl ketone to
adjust the solid content concentration to 5% and can be applied to
the substrate to form the organic film 14. Alternatively, a
polyester resin (Vylon 200 of Toyobo Co., Ltd.) can be used.
[0100] Examples of the deposition method of the organic film
include a normal solution application method and a vacuum
deposition method. Examples of the solution application method
include a dip coating method, an air knife coating method, a
curtain coating method, a roller coating method, a wire bar coating
method, a gravure coating method, a slide coating method, and an
extrusion coating method using a hopper described in U.S. Pat. No.
2,681,294.
[0101] When a gas barrier film (vapor barrier film) is manufactured
as the functional film 10, it is preferable to deposit a silicon
nitride film, an aluminum oxide film, a silicon oxide film, etc. as
the inorganic film.
[0102] It is preferable to deposit a silicon oxide film, etc., as
the inorganic film when a protective film of various devices and
apparatuses, such as an organic EL display, a liquid crystal
display, and other display devices, is manufactured as the
functional film 10.
[0103] Furthermore, it is preferable to deposit a film made of a
material having or expressing target optical characteristics as the
inorganic film to manufacture a functional film, such as an
anti-reflective film, a light reflection film, and various other
filters.
[0104] Although the manufacturing method of functional film of the
present invention has been described in detail, the present
invention is not limited to the embodiment, and various
modifications and changes can be made without departing from the
scope of the present invention.
Second Embodiment
[0105] FIG. 4 shows an example of a configuration diagram of the
functional film of another embodiment. The functional film 10
includes the substrate 12, the organic film 14 arranged on one side
of the substrate 12, the inorganic film 16 arranged on the organic
film 14, and the organic film 18 arranged on the inorganic film 16.
The organic film 14, the inorganic film 16, and the organic film 18
function as the functional layer 20. The organic film 18 as the top
layer also functions as a protection layer. The first laminate film
21 is arranged on the other side of the substrate 12. The second
laminate film 22 is arranged on the organic film 18 as the top
layer of the functional layer 20.
[0106] FIG. 5 shows an example of a configuration diagram of the
functional film of another embodiment. The functional film 10
includes the substrate 12, the organic film 14 arranged on one side
of the substrate 12, and the inorganic film 16 arranged on the
organic film 14. The organic film 14 and the inorganic film 16 are
further arranged on the inorganic film 16 in this order. The
organic film 18 arranged on the inorganic film 16 is also included.
The organic film 14, the inorganic film 16, the organic film 14,
the inorganic film 16, and the organic film 18 function as the
functional layer 20. The organic film 18 as the top layer also
functions as a protection layer. The first laminate film 21 is
arranged on the other side of the substrate 12. The second laminate
film 22 is arranged on the organic film 18 as the top layer of the
functional layer 20.
[0107] Since the first laminate film 21 is arranged on the other
side of the substrate 12 in the functional film, the self-support
is provided to the substrate 12. The self-support denotes
elasticity (rigidity) of film.
[0108] Since the substrate 12 is self-supported, vertical wrinkles,
folds, etc., are not generated during the deposition/transfer
process using roll-to-roll. This can prevent the organic films
and/or inorganic films deposited on the substrate 12 from being
destroyed.
[0109] The first laminate film 21 preferably has a center line
average roughness (Ra) of 5 to 80 nm. During the
deposition/transfer process using roll-to-roll, the substrate 12 is
taken up in a roll shape after the deposition of the inorganic film
16. At this point, the first laminate film 21 and the inorganic
film 16 touch each other. Since the first laminate film 21 has the
center line average roughness (Ra) of 5 to 80 nm, the contact area
between the first laminate film 21 and the inorganic film 16 can be
reduced. As a result, the frictional resistance between the first
laminate film 21 and the inorganic film 16 can be reduced, and the
slipping property can be improved. If the center line average
roughness (Ra) of the first laminate film 21 is greater than the
thickness of the inorganic film 16, the inorganic film 16 may be
perforated and destroyed. Therefore, the preferable center line
average roughness (Ra) of the first laminate film 21 is 5 to 80 nm,
which is less than the thickness of the inorganic film.
[0110] A film made of polyethylene (PE), polyethylene terephthalate
(PET), polyethylene naphthalate (PEN), etc., can be used as the
first laminate film 21.
[0111] The second laminate film 22 is arranged at the top layer of
the functional layer 20 in the functional film. Therefore, the
second laminate film 22 protects the top layer of the functional
layer 20 during the storage/transport process. When the functional
layer 20 is formed on the substrate 12, the functional film 10 is
completed. The second laminate film 22 is then attached on the top
layer of the functional layer 20, and the functional film 10 is
stored in a form of a roll or a sheet and transported to another
location. The second laminate film 22 prevents scratches, etc., of
the functional layer 20 during the transport, and the functional
layer 20 can attain a desired function.
[0112] The top layer of the functional layer 20 may be damaged if
the center line average roughness (Ra) of the second laminate film
22 is large. Therefore, the preferable center line average
roughness (Ra) of the second laminate film 22 is 5 to 50 nm.
[0113] The adhesion between the second laminate film 22 and the top
layer of the functional layer 20 is less than the adhesion between
the first laminate film 21 and the substrate 12. The independent
use of the functional film 10 is rare. The second laminate film 22
is removed from the functional layer 20 of the functional film 10.
In the assembly process, the functional layer 20 is attached to
another product, such as a substrate provided with an organic EL
element. In this case, the second laminate film 22 can be easily
removed because the adhesion of the second laminate film 22 is
weaker than the adhesion of the first laminate film 21. Since the
adhesion of the second laminate film 22 is not large, the removal
of the second laminate film 22 does not damage the functional layer
20.
[0114] Preferably, the Young's modulus of the second laminate film
22 is less than the Young's modulus of the first laminate film 21.
The first laminate film is not wrinkled due to the tension of the
second laminate film being removed when the second laminate film is
peeled off first.
[0115] In the step of peeling off the second laminate film, the
substrate and the first laminate film provided to the substrate are
held (fixed) by something. If the Young's modulus of the first
laminate film stretched to obtain the self-support of the substrate
is greater than the Young's modulus of the second laminate film,
the first laminate film with low Young's modulus may be pulled
(tension of being peeled off) and bent. Since the Young's modulus
of the second laminate film is low, the destruction of the first
laminate film can be prevented.
[0116] A film made of polyethylene (PE), polyethylene terephthalate
(PET), polyethylene naphthalate (PEN), etc., can be used as the
second laminate film 22.
[0117] The center line average roughness (Ra) is defined by
measuring the roughness of the surface of the laminate and
averaging the peaks of projections and depressions of the
roughness. The surface roughness of the first laminate film 21 and
the second laminate film 22 are based on the center line average
roughness (Ra) obtained by using an atomic force microscope (AFM)
and measuring the roughness in a range of 10 .mu.m.
[0118] The substrate 12 is not particularly limited if the
deposition of the organic films 14 and the inorganic films 16 by
vacuum deposition is possible. Various substrates used in
functional films, such as PET films and various other resin films
as well as aluminum sheets and various other metals, can be
used.
[0119] Examples of the organic films 14 include all films, such as
an anchor coat layer for improving the adhesion, an oxide film
deposited by atmospheric pressure plasma, and a thermosetting or
UV-curing organic film, that are deposited before the deposition of
the inorganic films.
[0120] It is preferable that the inorganic films 16 include at
least one of or a composite of metal, metal oxide, metal nitride,
metal carbide, and metal fluoride.
[0121] A manufacturing method of functional film
(deposition/transfer process) will be described. The manufacturing
apparatus that manufactures the functional film includes, for
example, the organic film deposition apparatus 23 that deposits an
organic film on the front side of the substrate 12 and the vacuum
deposition apparatus 24 that deposits an inorganic film on the
organic film.
[0122] FIG. 6A conceptually shows an example of the organic film
deposition apparatus 23. The organic film deposition apparatus 23
includes the coating device 26, the heating device 28, and the UV
irradiation apparatus 30. The organic film deposition apparatus 23
deposits the organic film by roll-to-roll. The film roll 40 is
first loaded on the feeding device 32. The take-up roller 36 then
transfers the substrate 12 in a longitudinal direction from the
film roll 40. The coating device 26 applies, for example, a coating
solution containing prepared radiation-curing monomer or oligomer
to the substrate 12. The heating device 28 dries the coating
solution and evaporates the solvent. The UV irradiation apparatus
30 applies an ultraviolet ray to the coating solution after drying
to start polymerization reaction. The organic film 14 is hardened
and deposited on the substrate 12.
[0123] In the present embodiment, the first laminate film 21 is
included on the back side, and the self-supported substrate 12 is
taken up into a roll shape and prepared as the film roll 40. Once
the first laminate film 21 is attached to the back side of the
substrate, the first laminate film 21 is not removed from the
substrate 12 until a functional layer including required number of
organic films 14 and inorganic films 16 is laminated on the
substrate.
[0124] Like the organic film deposition apparatus 23, the vacuum
deposition apparatus 24 is an apparatus that forms an inorganic
film by roll-to-roll as shown in FIG. 6B. The vacuum deposition
apparatus 24 includes the feed chamber 50, the deposition chamber
52, and the take-up chamber 54. The feeding device 56 of the feed
chamber 50 feeds the substrate 12 from the film roll 42. The
inorganic film is deposited on the organic film of the substrate 12
in the deposition chamber 52 while the substrate 12 is transferred
in the longitudinal direction. The take-up device 58 of the take-up
chamber 54 takes up the substrate 12, on which a laminated body
(the functional layer 20) including the organic film 14 and the
inorganic film 16 is deposited, into the film roll 48.
[0125] A deposition method of the inorganic film will be described.
The feed chamber 50 of the vacuum deposition apparatus 24 includes
the feeding device 56, the guide roller 60, and the evacuation
device 61.
[0126] The feeding device 56 feeds the substrate 12 from the film
roll 42. The guide roller 60 guides the substrate 12 including the
exposed organic film 14 to pass through a predetermined path and
through the slit 74a of the partition 74, and the substrate 12 is
transferred to the deposition chamber 52. A driving source not
shown rotates the feeding device 56 clockwise in FIG. 6B in the
feed chamber 50. Since the first laminate film 21 is attached to
the back side of the substrate 12, the substrate 12 is
self-supported.
[0127] The inorganic film 16 is deposited on the front side of the
substrate 12, i.e. on the surface of the organic film 14, in the
deposition chamber 52. As shown in FIG. 6B, the deposition chamber
52 includes the drum 62, the deposition devices 64a, 64b, 64c, and
64d, the guide rollers 68 and 70, and the evacuation device 72. If
the deposition chamber 52 is designed to form a film by sputtering,
plasma CVD, etc., a high-frequency power source, etc. is further
installed in the deposition chamber 52.
[0128] A driving source not shown rotates the drum 62 of the
deposition chamber 52 counterclockwise in FIG. 6B around the center
line. The substrate 12 guided to a predetermined path by the guide
roller 68 is wound around a predetermined area in the peripheral
surface of the drum 62, and the drum 62 supports and guides the
substrate 12 to transfer the substrate 12 through a predetermined
transfer path. The deposition devices 64a to 64d deposit an
inorganic film 16 on the organic film 14. It is preferable that the
thickness of the inorganic film deposited at this time is 5 nm to
200 nm.
[0129] The deposition devices 64a to 64d are devices that deposit
an inorganic film on the front side of the substrate 12 by a vacuum
deposition method. The deposition device is not limited, and all
known vacuum deposition methods (vapor deposition methods), such as
CVD, plasma CVD, sputtering, vacuum deposition, and ion plating,
can be used.
[0130] After the deposition of the inorganic film 16 by the
deposition devices 64a to 64d, the guide rollers 70 and 78 guide
the substrate 12 to the slit 75a of the partition 75, and the
substrate 12 is transferred to the take-up chamber 54. The
evacuation device 80 is arranged in the take-up chamber 54. The
evacuation device 80 reduces the pressure to set a predetermined
pressure in the take-up chamber 54. The take-up device 58 arranged
in the take-up chamber 54 takes up the substrate 12 into the film
roll 48.
[0131] In addition to the illustrated members, transfer devices
that transfer the substrate 12 in a predetermined path may be
arranged in the feed chamber 50, such as a pair of transfer rollers
and a guide member that restricts the position of the substrate 12
in the width direction.
[0132] Providing the first laminate film 21 to the back side of the
substrate 12 allows the substrate 12, on which the inorganic film
16 is deposited, to have appropriate rigidity. The substrate 12 can
be transferred without the generation of vertical wrinkles and
folds when the vacuum deposition apparatus 24 is transferred (or
moved back and forth for a plurality of times).
[0133] As shown in FIG. 6B, the substrate 12 including the
deposited inorganic film 16 is taken up into the film roll 48 in
the take-up chamber 54. Since the first laminate film 21 has the
center line average roughness (Ra) of 5 to 80 nm, the contact area
between the first laminate film 21 and the inorganic film can be
reduced. As a result, the frictional resistance between the first
laminate film 21 and the inorganic film can be reduced, and the
slipping property can be improved.
[0134] The film roll 48 is set as the film roll 40 on the feeding
device 32 of the organic film deposition apparatus 23, and the
organic film is deposited on the inorganic film. The
deposition/transfer process for forming the functional layer
basically ends. The laminate film feeding device 81 feeds the
second laminate film 22. The pair of nip rollers 38 attach the
second laminate film 22 to the surface of the organic film. The
functional film 10 including the substrate 12, the functional layer
20 including the organic film 14, the inorganic film 16, and the
organic film 18 arranged on one side of the substrate 12, the first
laminate film 21 arranged on the other side of the substrate 12,
and the second laminate film 22 arranged on the top layer of the
functional layer 20 is completed.
[0135] Passing through the vacuum deposition apparatus 24 and the
organic film deposition apparatus 23 without the attachment of the
second laminate film 22 is possible. As a result, the functional
layer 20 including the organic film 14, the inorganic film 16, the
organic film 14, the inorganic film 16, and the organic film 18 can
be formed.
[0136] As shown in FIG. 6A, the laminate film feeding device 81
feeds the second laminate film 22, and the pair of nip rollers 38
attach the second laminate film 22 on the surface of the organic
film. The functional film 10 including the substrate 12, the
functional layer 20 including the organic film 14, the inorganic
film 16, the organic film 14, the inorganic film 16, and the
organic film 18 arranged on one side of the substrate 12, the first
laminate film 21 arranged on the other side of the substrate 12,
and the second laminate film 22 arranged on the top layer of the
functional layer 20 is completed.
[0137] The process moves to the storage/transport process when the
functional film 10 is taken up in a film shape after the attachment
of the second laminate film 22. The first laminate film 21 and the
second laminate film 22 protect the substrate 12 and the functional
layer 20.
[0138] The functional film 10 is roll-shaped or sheet-shaped in the
storage/transport process. The shape of the roll denotes an object
obtained by taking up the functional film 10 into the film roll.
The shape of the sheet denotes an object after uncoiling of the
film roll and includes objects cut into a predetermined size.
[0139] The roll-shaped or sheet-shaped functional film 10 is
transported to the assembly process. As shown in FIG. 7, the second
laminate film 22 is removed to attach the functional film 10 to
another product. Since the adhesion of the second laminate film 22
is weaker than the adhesion of the first laminate film 21, the
second laminate film 22 can be easily removed. Since the adhesion
of the second laminate film 22 is not large, the removal of the
second laminate film 22 does not damage the functional layer 20. In
view of the assembly process, what is important is that the
adhesion of the second laminate film 22 is weaker than the adhesion
of the first laminate film 21. The first laminate film 21 is
further removed as necessary after the attachment of the other
product and the functional layer 20.
[0140] The same material as in the first embodiment can be used as
a material of the organic film 14, and the same manufacturing
method can be used.
Example 1
[0141] Specific examples of the present invention will be listed to
describe the present invention in more detail. However, the
examples are not limited to these.
[0142] PET bases with 1000 mm width and different thicknesses are
used as the substrate. The first laminate film 21 with several
thicknesses is prepared to provide the self-support. The first
laminate film is laminated on the back side of the PET base to
prepare the substrate. Acrylate monomer and a photopolymerization
initiator are dissolved by an organic solvent and applied to the
substrate by a die coater. The coating film is dried and further
hardened by ultraviolet curing to deposit an organic film on the
substrate. A film roll is created while controlling the take-up
tension in accordance with the diameter of the roll to make the
tension constant. The fluid flow to the substrate is controlled to
make the thickness of the organic film 1 .mu.m after complete
curing.
[0143] After the formation of the organic film, i.e. after curing,
a second laminate film is laminated on the surface of the organic
film. Specifically, after the UV irradiation apparatus, the
substrate and the second laminate film are placed between a pair of
nip rolls to attach the second laminate film to the surface of the
organic film. In this case, heat is not applied, and the second
laminate film is attached to the surface of the organic film only
by the force of the adhesion layer in the second laminate film.
[0144] A spiral roll is arranged between the pair of nip rolls. The
second laminate film is uniformly attached to the surface of the
organic film while the second laminate film is extended in the
width direction by the spiral roll. This is because if the second
laminate film is not uniformly attached, the air between the second
laminate film and the organic layer does not uniformly come out
when the substrate is exposed in the vacuum. The substrate is
deformed by remaining air, and the substrate is damaged by
wrinkles, etc.
[0145] A plurality of types of second laminate films with different
adhesions are prepared and attached. To remove the air between the
second laminate films and the organic layers as much as possible,
the film roll including the rolled substrate, on which the organic
films formed under various conditions are deposited, is left in the
atmosphere for more than one hour. Leaving the film roll in the
atmosphere can release the air between the second laminate films
and the organic films by the weight of the film roll. The film roll
is then set to a vacuum deposition apparatus. After evacuation of
the vacuum deposition apparatus, the second laminate film is
removed in a feed chamber or immediately before a deposition drum,
and an inorganic film is deposited on the surface of the organic
film. In the removal of the second laminate film, the torque is
controlled in consideration of the improvement of the adhesion in
the vacuum, and the second laminate film is removed from the
substrate. Specifically, the torque is controlled to control the
motion of the film roll by the removal/take-up section.
[0146] Aluminum is the target of the inorganic film, and an alumina
film is formed by reactive sputtering to obtain a functional film.
Water vapor permeability is used to evaluate the performance of the
functional film manufactured this way. The water vapor permeability
is defined by the criteria of Table 1.
TABLE-US-00001 TABLE 1 Performance (Moisture Permeability)
Evaluation Criteria 1.0 .times. 10.sup.-3 g/m.sup.2 day or more D
2.0 .times. 10.sup.-4 g/m.sup.2 day or more and C less than 1.0
.times. 10.sup.-3 g/m.sup.2 day 1.0 .times. 10.sup.-4 g/m.sup.2 day
or more and B less than 2.0 .times. 10.sup.-4 g/m.sup.2 day Less
than 1.0 .times. 10.sup.-4 g/m.sup.2 day A
[0147] A table of FIG. 8 shows a compilation of manufacturing
conditions and evaluation results of Tests 1 to 18.
Test 1
[0148] The thickness of the substrate is 25 .mu.m, and the first
laminate film and the second laminate film are not attached to
either side of the substrate. A non-stepped guide roller is used to
transfer the substrate in the vacuum deposition apparatus. An
inorganic film of 50 nm is deposited on the organic film.
Test 2
[0149] The condition is the same as in Test 1, except that the
thickness of the substrate is 50 .mu.m.
Test 3
[0150] The condition is the same as in Test 1, except that the
thickness of the substrate is 100 .mu.m.
Test 4
[0151] The first laminate film with 5 .mu.m thickness is laminated
on the back side of the substrate with 50 .mu.m thickness before
the application of the organic material, and the film roll is
formed. The thickness of the first laminate film includes the
thickness of the adhesion layer. The film roll is set in the
organic film deposition apparatus. After irradiation of ultraviolet
to the organic material on the substrate and curing of the organic
material (i.e. after deposition of the organic film), the second
laminate film is laminated on the surface of the organic film, and
the film is taken up into a film roll. The adhesion of the first
laminate film on the back side is 0.005 (N/25 mm), and the adhesion
of the second laminate film on the organic film is 0.002 (N/25 mm).
The film roll is set in the vacuum deposition apparatus. The second
laminate film on the organic surface is removed immediately before
the deposition of the inorganic film, and an inorganic film of 50
nm is deposited on the exposed organic film. A non-stepped guide
roller is used to transfer the substrate. "Immediately before
Deposition" denotes a position immediately before the drum arranged
in the deposition chamber of the vacuum deposition apparatus.
Test 5
[0152] The condition is the same as in Test 4, except that the
thickness of the first laminate film on the back side is 25
.mu.m.
Test 6
[0153] The condition is the same as in Test 4, except that the
thickness of the first laminate film on the back side is 50
.mu.m.
Test 7
[0154] The condition is the same as in Test 6, except that the
adhesion of the second laminate film on the organic film is 0.01
(N/25 mm).
Test 8
[0155] The condition is the same as in Test 6, except that the
adhesion of the second laminate film on the organic film is 0.04
(N/25 mm).
Test 9
[0156] The condition is the same as in Test 6, except that the
adhesion of the second laminate film on the organic film is 0.06
(N/25 mm).
Test 10
[0157] The condition is the same as in Test 6, except that the
adhesion of the second laminate film on the organic film is 0.07
(N/25 mm).
Test 11
[0158] The condition is the same as in Test 6, except that the
adhesion of the first laminate on the back side is 0.01 (N/25
mm).
Test 12
[0159] The condition is the same as in Test 6, except that the
adhesion of the first laminate film on the back side is 0.02 (N/25
mm).
Test 13
[0160] The condition is the same as in Test 6, except that the
adhesion of the first laminate film on the back side is 0.06 (N/25
mm).
Test 14
[0161] The condition is the same as in Test 6, except that the
removal position of the second laminate film on the organic film is
"Deposition Feeding". "Deposition Feeding" denotes a position
immediately after feeding from the feeding device arranged in the
feed chamber of the vacuum deposition apparatus.
Test 15
[0162] The condition is the same as in Test 6, except that the
attachment position of the first laminate film on the back side is
after the application. "After Application" denotes a position after
passing of the UV irradiation apparatus of the organic film
deposition apparatus.
Test 16
[0163] The condition is the same as in Test 1, except that the
substrate is transferred by a stepped guide roller.
Test 17
[0164] The condition is the same as in Test 6, except that the
substrate is transferred by the stepped guide roller.
Test 18
[0165] The condition is the same as in Test 6, except that the
second laminate film is not laminated on the organic film.
<Evaluation>
[0166] In Tests 1 to 3, the first laminate film and the second
laminate film are not laminated on the substrate. As a result, the
thickness of the substrate is 50 .mu.m or less in Tests 1 and 2,
and the evaluation of the barrier property is D since the laminate
film is not attached to either side. A possible reason is that the
barrier film is broken due to wrinkles in the transfer. The
thickness of the substrate is 100 .mu.m in Test 3, and the
evaluation of the barrier property is C. The thickness of the
substrate is thick in Test 3, and the transfer of the substrate is
more stable than the transfer of the substrate with thinner
thickness. However, the coating surface is not protected, and there
is a problem that minute scratches are generated.
[0167] In Tests 4 to 6, the first laminate film and the second
laminate film are laminated on the substrate. As a result, the
evaluation is C or better. It can be understood from Tests 4 to 6
that the thicker the first laminate film on the back side is, the
better is the evaluation result. Better results are obtained when
the total thickness of the substrate and the first laminate film on
the back side is 75 .mu.m or more.
[0168] Better results are obtained from Tests 6 to 10 when the
adhesion of the second laminate film on the organic film is lower.
A possible reason is that the organic film is not broken when the
second laminate film on the organic film is removed. Since there is
no air in the vacuum as compared to the state of the atmosphere,
the adhesion between the second laminate film and the coated film
(organic film) increases. Therefore, a laminate film with low
adhesion is suitable for the removal in the vacuum.
[0169] Better results are obtained in Tests 6, 11, and 12 when the
adhesion of the first laminate film on the back side is higher. A
possible reason is that the laminate film on the back side is not
peeled off during the transfer of the substrate, and the
self-support of the substrate can be maintained.
[0170] A better result is obtained in Tests 6 and 14 when the
removal position of the second laminate film on the organic film is
immediately before the deposition, i.e. after passing of the entire
pass roller that touches the organic film. This is because the
second laminate film on the organic film prevents direct contact
between the organic film and the pass rollers to prevent
destruction of the organic film.
[0171] A better result is obtained from Tests 6 and 15 when the
first laminate film is on the back side of the substrate before the
application. If the first laminate film is not on the back side
during the application, the self-support of the substrate becomes
low, and a transfer error easily occurs.
[0172] In Tests 1, 2, 6, and 16 to 18, B or better results are
obtained for the barrier property when the first laminate film and
the second laminate film are laminated on the surfaces of the
substrate even if the stepped guide roller is used. According to
Test 16, it can be understood that if the substrate is thin, the
barrier property is degraded by vertical wrinkles, etc., even if
the stepped guide roller is used to make the functional area
noncontact. More specifically, it is important to provide the
self-support to the substrate to improve the barrier property even
if the stepped guide roller is used to make the functional area
noncontact. According to Test 18, it can be understood that even if
the self-support is provided to the substrate by the first laminate
film on the back side, damage during the take-up cannot be
prevented if there is no second laminate film on the organic film,
and the performance is degraded.
[0173] It can be understood that the attachment of the laminate
films (the first laminate film and the second laminate film) to the
surfaces of the substrate is important.
Example 2
[0174] Specific examples of the present invention will be listed to
describe the present invention in more detail. However, the
examples are not limited to these.
[0175] A PET base with 1000 mm width and 100 .mu.m thickness is
used for the substrate. A plurality of types of first laminate
films with different adhesion and Young's modulus are prepared.
Acrylate monomer and a photopolymerization initiator are dissolved
by an organic solvent and applied to the substrate by a die coater.
The coating film is dried and further hardened by ultraviolet
curing to deposit an organic film on the substrate. A film roll is
created while controlling the take-up tension in accordance with
the diameter of the roll to make the tension constant. The fluid
flow to the substrate is controlled to set the thickness of the
organic film to 1 .mu.m after complete curing. The film roll
including the organic film formed under various conditions is set
to a feeding unit of a vacuum deposition apparatus. After the
evacuation of the vacuum deposition apparatus, reactive sputtering
is used to deposit an alumina film with 80 nm thickness, and the
film is taken up into a film roll.
[0176] Water vapor permeability is used to evaluate the performance
of the created functional film. The degree of wrinkles on the roll
formed by the take-up after the deposition of the inorganic film is
checked by visual evaluation. Subsequently, the organic film as a
protection layer is formed on the inorganic film after steps of
film coating, drying, and ultraviolet curing. The second laminate
films with different adhesions are prepared. The second laminate
film is placed between nip rolls on the side of the organic
surface, and the second laminate film is attached to the organic
film as the top layer of the functional layer by the self-adhesion
and by the force of the contact pressure between the substrate and
the rolls.
[0177] A functional film including the first laminate film and the
second laminate film is fed by roll-to-roll. A moisture
permeability measurement is applied while removing the second
laminate film, and the value is measured. The first laminate film
on the back side is then removed.
[0178] The water vapor permeability is used to evaluate the
performance of the manufactured functional film. The water vapor
permeability is defined by the criteria of Table 1.
<Evaluation>
[0179] A table of FIG. 9 shows a compilation of conditions and
evaluation results of the first laminate film and the second
laminate film in relation to Conditions 19 to 31. The adhesion of
the second laminate film is less than the adhesion of the first
laminate film under Conditions 19 to 21, and C or better results
are obtained. The roughness (Ra) of the second laminate film is in
a range of 5 to 50 nm under Conditions 22 and 23, and C or better
results are obtained. The roughness (Ra) of the first laminate film
is in a range of 5 to 80 nm under Conditions 24 to 26, and C or
better results are obtained. It can be understood that better
results can be obtained by setting the thickness equal to less than
the thickness of the inorganic film.
[0180] When the second laminate film is peeled off first under
Conditions 27 to 29, wrinkles are not generated due to an influence
of the tension of the second laminate film being removed. Force can
be uniformly applied to peel off the second laminate film, and C or
better results are obtained.
[0181] The adhesion of the second laminate film is set to 1.0 (N/25
mm) under Condition 30, and there is a limit that the barrier film
(functional layer) is peeled off. Therefore, degradation is
observed in the barrier property, and the evaluation is C.
[0182] The adhesion of the first laminate film is set to 1.5 (N/25
mm) under Condition 31. The first laminate film is not peeled off
from the substrate, and the substrate as a whole has started to
fold when the film is peeled off. Therefore, degradation is
observed in the barrier property, and the evaluation is C.
* * * * *