U.S. patent application number 12/854503 was filed with the patent office on 2011-08-25 for resin-sealed electronic control device and method of fabricating the same.
This patent application is currently assigned to MITSUBISHI ELECTRIC CORPORATION. Invention is credited to Fumiaki Arimai, Shinji HIGASHIBATA, Shozo Kanzaki, Hiroyoshi Nishizaki, Mikihiko Suzuki.
Application Number | 20110205706 12/854503 |
Document ID | / |
Family ID | 44356837 |
Filed Date | 2011-08-25 |
United States Patent
Application |
20110205706 |
Kind Code |
A1 |
HIGASHIBATA; Shinji ; et
al. |
August 25, 2011 |
RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING
THE SAME
Abstract
Provided is a resin-sealed electronic control device reduced in
size, which includes a double-sided mounting board as at least one
of a plurality of electronic boards obtained by division so that a
large mounting surface with a small plane area is ensured. Each of
a first electronic board (30A) and a second electronic board (40A)
bonded onto an upper surface and a lower surface of each of a pair
of separate beam members (20A) includes two surfaces on which outer
circuit components (31, 32, 41, 42) and an inner circuit component
(33, 43) are respectively mounted. A height of each of the inner
circuit components is equal to or less than a thickness of each of
the separate beam members (20A). Heat-generating components (32,
42) in the outer circuit components are provided to be adjacent to
and opposed to the separate beam members (20A).
Inventors: |
HIGASHIBATA; Shinji;
(Chiyoda-ku, JP) ; Kanzaki; Shozo; (Chiyoda-ku,
JP) ; Nishizaki; Hiroyoshi; (Chiyoda-ku, JP) ;
Arimai; Fumiaki; (Chiyoda-ku, JP) ; Suzuki;
Mikihiko; (Chiyoda-ku, JP) |
Assignee: |
MITSUBISHI ELECTRIC
CORPORATION
Tokyo
JP
|
Family ID: |
44356837 |
Appl. No.: |
12/854503 |
Filed: |
August 11, 2010 |
Current U.S.
Class: |
361/699 ;
361/784 |
Current CPC
Class: |
B60R 16/0239 20130101;
H01L 2224/45124 20130101; Y10T 29/49117 20150115; H01L 21/565
20130101; H01L 2224/45124 20130101; H01L 23/49531 20130101; H01L
25/162 20130101; H01L 23/3677 20130101; H01L 2224/48091 20130101;
H05K 5/065 20130101; H01L 2924/181 20130101; H01L 23/473 20130101;
H01L 2224/48091 20130101; H01L 23/49575 20130101; H01L 23/3107
20130101; H01L 2924/00012 20130101; H01L 2924/181 20130101; H01L
2924/00014 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
361/699 ;
361/784 |
International
Class: |
H05K 7/20 20060101
H05K007/20; H05K 1/14 20060101 H05K001/14 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 25, 2010 |
JP |
2010-040566 |
Claims
1. A resin-sealed electronic control device, comprising: a first
electronic board and a second electronic board, to each of which a
plurality of external connection terminals are connected, each of
the first electronic board and the second electronic board carrying
a plurality of circuit components mounted thereon; a thermally
conductive support member comprising an upper surface and a lower
surface, on which the first electronic board and the second
electronic board are respectively bonded to be fixed; and a
synthetic resin serving as an exterior covering material for
integrally molding the entire first electronic board, the entire
second electronic board, a portion of each of the plurality of
external connection terminals, and a portion of the support member,
wherein: the support member is formed of a pair of thermally
conductive separate beam members for retaining the first electronic
board and the second electronic board at a distance from each
other; a pair of opposite side end portions of the first electronic
board and a pair of opposite side end portions of the second
electronic board opposed to each other, the pair of opposite side
end portions of the first electronic board being bonded to be fixed
onto one of upper surfaces and lower surfaces of the pair of
separate beam members with an adhesive, the pair of opposite side
end portions of the second electronic board being bonded to be
fixed onto another of the upper surfaces and the lower surfaces of
the pair of separate beam members with an adhesive; at least one of
the first electronic board and the second electronic board is a
double-sided board comprising an inner surface on which an inner
circuit component is mounted and an outer surface on which outer
circuit components are mounted, the outer circuit components
comprising heat-generating components being mounted on an outer
surface of at least one of the first electronic board and the
second electronic board; the heat-generating components are
adjacent to and opposed to the pair of separate beam members with
the adhesives interposed therebetween; the inner circuit component
is arranged between the pair of separate beam members and has a
smaller height size than a distance between the first electronic
board and the second electronic board opposed to each other; and
the exterior covering material fills a narrow space surrounded by
the first electronic board, the second electronic board, and the
pair of separate beam members.
2. A resin-sealed electronic control device according to claim 1,
wherein the pair of separate beam members are connected to each
other by one of welding, brazing, and bonding with a thermally
conductive connection plate having a window hole for insertion of
the inner circuit component.
3. A resin-sealed electronic control device according to claim 1,
wherein each of the pair of separate beam members is formed of a
hollow cylindrical member inside which a cooling medium resides and
flows.
4. A resin-sealed electronic control device according to claim 3,
wherein: an end of one of the pair of separate beam members is
brought into communication with an end of another of the pair of
separate beam members by a connection portion; and the cooling
medium flows from the one of the pair of separate beam members back
to the one of the pair of separate beam members through the another
of the pair of separate beam members.
5. A resin-sealed electronic control device according to claim 3,
wherein: at least one of the pair of separate beam members is
provided with a small window, into which a cooling-medium sensor
for detecting one of a temperature and a pressure of the cooling
medium is inserted; and the cooling-medium sensor fixed into the
small window is electrically connected to at least one of the first
electronic board and the second electronic board.
6. A resin-sealed electronic control device according to claim 3,
wherein: a temperature sensor is provided in an area of at least
one of the first electronic board and the second electronic board,
the area being adjacent to and opposed to one of the pair of
separate beam members with one of the adhesives interposed
therebetween; and the temperature sensor indirectly detects a
temperature of the cooling medium.
7. A resin-sealed electronic control device according to claim 3,
wherein: at least one of the pair of separate beam members is
provided with a small window, through which a hot wire serving as a
flow rate sensor for detecting a flow rate of the cooling medium
passes; and the hot wire passing through the small window is
provided so that the hot wire bridges the first electronic board
and the second electronic board.
8. A resin-sealed electronic control device according to claim 5,
wherein: the cooling medium is one of hydraulic working oil used
for an automobile transmission, cooling water flowing back to a
radiator of a water-cooled automobile engine, and intake
atmospheric air for an automobile engine; and the cooling-medium
sensor is a temperature sensor for detecting a temperature of the
one of the hydraulic working oil, the cooling water, and the intake
atmospheric air.
9. A resin-sealed electronic control device according to claim 5,
wherein: the cooling medium is one of hydraulic working oil used
for an automobile transmission, cooling water flowing back to a
radiator of a water-cooled automobile engine, and intake
atmospheric air for an automobile engine; and the cooling-medium
sensor is a pressure sensor for detecting a pressure of one of the
hydraulic working oil, the cooling water, and the intake
atmospheric air.
10. A resin-sealed electronic control device according to claim 7,
wherein: the cooling medium is one of hydraulic working oil used
for an automobile transmission, cooling water flowing back to a
radiator of a water-cooled automobile engine, and intake
atmospheric air for an automobile engine; and the cooling-medium
sensor is a flow rate sensor for detecting a flow rate of the one
of the hydraulic working oil, the cooling water, and the intake
atmospheric air.
11. A resin-sealed electronic control device according to claim 1,
wherein: the plurality of external connection terminals are located
outside the pair of separate beam members and are arranged in
parallel to the pair of separate beam members; and the first
electronic board and the second electronic board are electrically
connected to each other at a position inside the pair of separate
beam members.
12. A resin-sealed electronic control device according to claim 1,
wherein: the plurality of external connection terminals are located
inside the pair of separate beam members and are arranged
vertically to the pair of separate beam members; the plurality of
external connection terminals are grouped into at least a first
group and a second group, and a resin injection port through which
the synthetic resin is injected between dies is located at an
intermediate position between the first group and the second group;
and the first electronic board and the second electronic board are
electrically connected to each other at a position any one of
inside and outside the pair of separate beam members.
13. A method of fabricating the resin-sealed electronic control
device according to claim 1 comprising: connecting the first
electronic board and the second electronic board to each other;
connecting the plurality of external connection terminals to the
first electronic board and the second electronic board; and molding
the exterior covering material by injecting the heated and melted
synthetic resin under pressure between dies along a longitudinal
direction of the pair of separate beam members after heating and
curing the adhesives.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a resin-sealed electronic
control device used as an on-vehicle electronic control device, and
a method of fabricating the same.
[0003] 2. Description of the Related Art
[0004] As a control device for an automobile transmission, an
integrated electronic control device mounted inside the
transmission is widely put into practical use.
[0005] The on-vehicle electronic control device as described above
includes any one of a ceramic board and a polyimide board bonded to
a support member serving as a thermal diffuser plate. The entire
on-vehicle electronic control device except for a part of external
connection terminals and a part of the support member is integrally
formed with a thermosetting resin.
[0006] For example, the invention entitled "Electronic Circuit
Apparatus and Method of Manufacturing the Same", which is described
in Japanese Patent Application Laid-open No. 2004-281722 (FIG. 1
and Abstract), discloses a resin-sealed electronic circuit
apparatus with a high heat-dissipating property and a high
packaging density in applications where high hermetic-sealing
property and durability are required. In the electronic circuit
apparatus, at least two wiring boards, on which electronic
components are mounted, are fixedly bonded to a highly thermally
conductive thermal diffuser plate through an intermediation of an
adhesive. The entire wiring boards, the entire thermal diffuser
plate, and a part of an external connection terminal are
hermetically sealed by and integrally molded with a thermosetting
resin composition. In this manner, the small and highly reliable
electronic circuit apparatus can be provided at low cost.
[0007] Specifically, the aforementioned electronic circuit
apparatus includes: a multilayered wiring board on which at least
two electronic components are mounted; a polyimide wiring board on
which heating elements are mounted; and the thermal diffuser plate
having a higher thermal conductivity than those of the multilayered
wiring board and the polyimide wiring board; and an external
connection terminal.
[0008] The electronic circuit apparatus is a control unit for an
automobile, which has the following structure. The multilayered
wiring board is fixedly bonded to one surface of the thermal
diffuser plate through an intermediation of the adhesive, whereas
the polyimide wiring board is fixedly bonded to the other surface
of the thermal diffuser plate through an intermediation of an
adhesive. The polyimide wiring board is bent to be fixedly bonded
so that an upper surface and a lower surface of the thermal
diffuser plate are connected to each other. In this manner, the
polyimide wiring board and the multilayered wiring board are
electrically connected to each other. The multilayered wiring
board, the polyimide wiring board, and the external terminal are
electrically connected to each other. The entire surface of the
multilayered wiring board, the entire surface of the polyimide
wiring board, a part of the thermal diffuser plate, and a part of
the external connection terminal are integrally molded with the
thermosetting resin composition. The multilayered wiring board and
the polyimide wiring board, and the external terminal are connected
to each other by a bonding wire.
[0009] Moreover, the invention entitled "Electronic Circuit Device
and Method of Manufacturing the Same", which is described in
Japanese Patent Application Laid-open No. 2006-135361 (FIG. 1 and
Abstract), discloses the following electronic circuit device. In
the electronic circuit device, wiring boards on which at least two
electronic components are mounted are fixedly bonded to a thermal
diffuser plate having a higher heat conductivity than that of the
wiring boards. In addition, an external connection terminal and the
wiring boards are electrically connected to each other. The entire
surfaces of the wiring boards, a part of the thermal diffuser
plate, and a part of the external connection terminal are
integrally molded with a thermosetting resin composition. In an
outer layer of the electronic circuit device, a part of a flow
path, through which a cooling medium can circulate, is
provided.
[0010] According to the electronic circuit device described above,
by fixedly bonding the electronic circuit boards respectively onto
an upper surface and a lower surface of the thermal diffuser plate
having a high heat-radiating property, a mounting process is
simplified to reduce cost while the heat-radiating property and a
mounting density can be improved. In addition, the entire
electronic circuit device is integrally molded with the
thermosetting resin composition. Thus, an assembly process can be
simplified. Further, the electronic circuit device having a high
hermetic-sealing property and high reliability even when used in a
severe environment can be provided.
[0011] In the electronic circuit apparatus described in Japanese
Patent Application Laid-open No. 2004-281722 cited above, the
wiring board is divided into two pieces so as to be fixedly bonded
onto the two surfaces of the thermal diffuser plate. As a result,
an area of the wiring board is halved, while the heat-dissipating
property is improved. The polyimide wiring board (flexible board)
is used as one of the wiring boards so that the polyimide wiring
board is bent to be connected to the ceramic board which is the
other board.
[0012] However, each of the wiring boards is a one-sided board for
bonding to the thermal diffuser plate. Therefore, in order to
ensure an area on which the circuit components are mounted, the
area of each of the wiring boards is disadvantageously
increased.
[0013] Moreover, if the area of each of the wiring boards is large,
there is another problem in that the wiring board is likely to be
separated from a molded exterior covering material with repeating
changes in temperature due to a difference in linear expansion
coefficient.
[0014] Further, if the heat-generating circuit components are
provided on both the upper surface and the lower surface of the
thermal diffuser plate, there is a further problem in that the
temperature increases in a locally concentrated manner.
[0015] Even in the electronic circuit device described in Japanese
Patent Application Laid-open No. 2006-135361 cited above, each of
the two wiring boards is a one-sided mounting board. Therefore,
there is a problem in that an area of each of the wiring boards is
increased. In addition, a complex cooling-medium flow path for
cooling the entire surfaces of the wiring boards is required. Thus,
there is another problem in that a specific one of the
heat-generating components cannot be cooled in a focused way.
SUMMARY OF THE INVENTION
[0016] The present invention has been made to solve the problems
described above, and therefore, it is an object of the present
invention to provide a low-cost small resin-sealed electronic
control device in which at least one of two electronic boards
serving as wiring boards bonded to two surfaces of a support member
is a double-sided mounting board so as to increase an area on which
circuit components are mounted, and a method of fabricating the
same.
[0017] It is another object of the present invention to provide a
low-cost small resin-sealed electronic control device in which the
electronic boards including the double-sided mounting board are
configured to perform one of thermal diffusion and heat dissipation
through an intermediation of the separate beam members serving as
the support member and a method of fabricating the same.
[0018] A resin-sealed electronic control device according to the
present invention includes: a first electronic board and a second
electronic board, to each of which a plurality of external
connection terminals are connected, each of the first electronic
board and the second electronic board carrying a plurality of
circuit components mounted thereon; a thermally conductive support
member including an upper surface and a lower surface, on which the
first electronic board and the second electronic board are
respectively bonded to be fixed; and a synthetic resin serving as
an exterior covering material for integrally molding the entire
first electronic board, the entire second electronic board, a
portion of each of the plurality of external connection terminals,
and a portion of the support member, in which: the support member
is formed of a pair of thermally conductive separate beam members
for retaining the first electronic board and the second electronic
board at a distance from each other; a pair of opposite side end
portions of the first electronic board and a pair of opposite side
end portions of the second electronic board opposed to each other,
the pair of opposite side end portions of the first electronic
board being bonded to be fixed onto one of upper surfaces and lower
surfaces of the pair of separate beam members with an adhesive, the
pair of opposite side end portions of the second electronic board
being bonded to be fixed onto another of the upper surfaces and the
lower surfaces of the pair of separate beam members with an
adhesive; at least one of the first electronic board and the second
electronic board is a double-sided board including an inner surface
on which an inner circuit component is mounted and an outer surface
on which outer circuit components are mounted, the outer circuit
components including heat-generating components being mounted on an
outer surface of at least one of the first electronic board and the
second electronic board; the heat-generating components are
adjacent to and opposed to the pair of separate beam members with
the adhesives interposed therebetween; the inner circuit component
is arranged between the pair of separate beam members and has a
smaller height size than a distance between the first electronic
board and the second electronic board opposed to each other; and
the exterior covering material fills a narrow space surrounded by
the first electronic board, the second electronic board, and the
pair of separate beam members.
[0019] Further, a method of fabricating the resin-sealed electronic
control device according to the present invention includes:
connecting the first electronic board and the second electronic
board to each other; connecting the plurality of external
connection terminals to the first electronic board and the second
electronic board; and molding the exterior covering material by
injecting the heated and melted synthetic resin under pressure
between dies along a longitudinal direction of the pair of separate
beam members after heating and curing the adhesives.
[0020] According to the resin-sealed electronic control device of
the present invention, the separate beam members serve as the
support member and a thermal diffuser member at the same time. In
addition, the separate beam members ensure the distance between the
first electronic board and the second electronic board to enable
the mounting on two surfaces of each of the electronic boards. The
circuit components mounted on the two surfaces of each of the
electronic boards are arranged between the separate beam members.
As a result, a mounting area is increased without increasing a
plane area of each of the electronic boards. As a result, the
present invention has the effects of reducing a plane area and a
volume of the entire product.
[0021] Moreover, the heat-generating components mounted on the
electronic boards are adjacent to and opposed to the separate beam
members with the adhesives interposed therebetween and have the
effects of preventing the temperature from being locally and
extremely increased by thermal diffusion.
[0022] Moreover, a space between the first electronic board and the
second electronic board is filled with the exterior covering
material to provide a non-hollow structure. As a result, the
electronic boards can be prevented from being deformed at the time
of pressure-molding of the synthetic resin. Moreover, the effects
of preventing the separation of a solder of the mounted circuit
components and the separation between the electronic boards and the
support member or the exterior covering material due to expansion
and shrinkage of the air with a change in environmental temperature
during actual use.
[0023] According to the method of fabricating the resin-sealed
electronic control apparatus of the present invention, the
synthetic resin which is heated and melted is injected under
pressure between the dies along the longitudinal direction of the
separate beam members so as to mold the exterior covering material
after the connection between the first electronic board and the
second electronic board, the connection of the external connection
terminals to the electronic boards, and the heating and curing of
the adhesives. Therefore, the adhesives which bond the first and
second electronic boards and the support member to each other are
not melted and softened by the heat of the melted synthetic resin
at the time of pressure-molding, and hence the first electronic
board, the second electronic board, and the components are reliably
integrated with each other.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In the accompanying drawings:
[0025] FIG. 1A is a top view of a resin-sealed electronic control
device according to a first embodiment of the present invention,
and FIG. 1B is a right side view of FIG. 1A;
[0026] FIG. 2A is another top view of the electronic control device
according to the first embodiment of the present invention, and
FIG. 2B is a right side view of FIG. 2A;
[0027] FIG. 3 is a sectional view illustrating an upper die and a
lower die used for the electronic control device;
[0028] FIG. 4 is a sectional view illustrating a state where the
cooling-medium sensor 80a is mounted;
[0029] FIG. 5 is a sectional view illustrating a state where the
heat-generating components are mounted;
[0030] FIG. 6A is a top view illustrating an example where a
connection plate is provided between the pair of separate beam
members of the electronic control device according to the first
embodiment, and FIG. 6B is a right side view of FIG. 6A;
[0031] FIG. 7A is a view illustrating a state where the electronic
control device is mounted, which is a perspective top view with a
cover 96A removed, and FIG. 7B is a sectional view taken along the
line B-B of FIG. 7A;
[0032] FIG. 8A is a top view of an electronic control device
according to a second embodiment of the present invention before
sealing with a resin, and FIG. 8B is a right side view of FIG.
8A;
[0033] FIG. 9A is a top view of the electronic control device
according to the second embodiment of the present invention, and
FIG. 9B is a right side view of FIG. 9A;
[0034] FIG. 10 is a sectional view illustrating the upper die and
the lower die used for the electronic control device 10B;
[0035] FIG. 11A is a top view illustrating the connection plates
which connect the pair of separate beam members to each other, and
FIG. 11B is a right side view of FIG. 11A;
[0036] FIG. 12A is a view illustrating a state where the electronic
control device is mounted, which is a top perspective view with a
cover removed, and FIG. 12B is a sectional view taken along the
line B-B of FIG. 12A;
[0037] FIG. 13A is a top view of an electronic control device 100
according to a third embodiment of the present invention before
sealing with a resin, and FIG. 13B is a right side view of FIG.
13A;
[0038] FIG. 14A is a top view of the electronic control device
according to the third embodiment of the present invention, and
FIG. 14B is a right side view of FIG. 14A;
[0039] FIG. 15 is a sectional view illustrating the upper die and
the lower die used for the electronic control device;
[0040] FIG. 16A is a top view illustrating the connection plates,
each connecting the pair of separate beam members to each other,
and FIG. 16B is a right side view of FIG. 16A;
[0041] FIG. 17A is a view illustrating a state where the electronic
control device 10C is mounted, which is a top perspective view with
a cover removed, and FIG. 17B is a sectional view taken along the
line B-B of FIG. 17A;
[0042] FIG. 18A is a top view of an electronic control device
according to a fourth embodiment of the present invention before
sealing with a resin, and FIG. 18B is a right side view of FIG.
18A;
[0043] FIG. 19 is a top view of the electronic control device
according to the fourth embodiment of the present invention;
[0044] FIG. 20A is a sectional view illustrating a state where the
electronic control device illustrated in FIG. 19 is mounted, and
FIG. 20B is an enlarged sectional view of a principal part of FIG.
20A.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0045] Hereinafter, a resin-sealed electronic control device
according to each embodiment of the present invention is described
with reference to the drawings. In each of the drawings, the same
or equivalent members and portions are denoted by the same
reference numerals for description.
First Embodiment
[0046] FIG. 1A is a top view of a resin-sealed electronic control
device (hereinafter, abbreviated as "electronic control device")
according to a first embodiment of the present invention, and FIG.
1B is a right side view of FIG. 1A. FIG. 2A is another top view of
the electronic control device according to the first embodiment of
the present invention, and FIG. 2B is a right side view of FIG.
2A.
[0047] An electronic control device 10A, which is a transmission
control device for an automobile transmission, includes: a pair of
separate beam members 20A; a first electronic board 30A; a second
electronic board 40A; a plurality of external connection terminals
52a and 52b; and an exterior covering material 11. The separate
beam members 20A serve as hollow cylindrical thermally-conductive
support members made of, for example, a copper alloy. One end of
one of the separate beam members 20A is connected to one end of the
other separate beam member 20A through a connection portion 21. The
first electronic board 30A is bonded to be fixed to upper surfaces
of the respective separate beam members 20A, whereas the second
electronic board 40A is bonded to be fixed to lower surfaces of the
respective separate beam members 20A. The plurality of external
connection terminals 52a are provided on one side of the first
electronic board 30A and the second electronic board 40A, whereas
the plurality of external connection terminals 52b are provided on
the side of the first electronic board 30A and the second
electronic board 40A, which is opposite to the side on which the
external connection terminals 52a are provided. Both of the entire
first electronic board 30A and the entire second electronic board
40A, a part of each of the separate beam members 20A, and a part of
each of the external connection terminals 52a and 52b are covered
with the exterior covering material 11 which is a thermosetting
resin.
[0048] Each of the separate beam members 20A serving as the support
members has a hollow cylindrical shape. In the hollow, hydraulic
working oil serving as a cooling medium (not shown) resides and
flows.
[0049] For example, outer circuit components 31 and 32 are mounted
on one surface of the first electronic board 30A formed of, for
example, a glass epoxy board, whereas an inner circuit component 33
is mounted on the other surface of the first electronic board 30A.
The outer circuit components 31 and 32 are located outside the pair
of separate beam members 20A opposed to each other, whereas the
inner circuit component 33 is located inside the pair of separate
beam members 20A. The outer circuit components 31 and 32 include
heat-generating components 32.
[0050] Opposite side end portions (two lateral edge portions),
which are a pair of side edge portions of the first electronic
board 30A, are bonded to be fixed to one surfaces of the respective
separate beam members 20A through an intermediation of an adhesive
35 which is, for example, a thermosetting silicon resin
composition. The heat-generating components 32 are mounted on the
opposite side end portions of the first electronic board 30A, and
are adjacent to and opposed to each of the separate beam members
20A with the first electronic board 30A interposed
therebetween.
[0051] The inner circuit components 33 are arranged between the
pair of separate beam members 20A. A height size of the inner
circuit component 33 is smaller than a thickness size of each of
the separate beam members 20A so that the inner circuit component
33 does not abut against at least the second electronic board
40A.
[0052] For example, on two surfaces of the second electronic board
40A formed of a glass epoxy board as in the case of the first
electronic board 30A, outer circuit components 41 and 42 and inner
circuit component 43 are respectively mounted. The outer circuit
components 41 and 42 include heat-generating components 42.
[0053] Opposite side end portions of the second electronic board
40A are bonded to be fixed to a surface of each of the separate
beam members 20A, which is opposite to the surface which is bonded
to be fixed to the first electronic board 30A, through an
intermediation of an adhesive 45 which is, for example, a
thermosetting silicon resin composition. The heat-generating
components 42 are mounted on the opposite side end portions of the
second electronic board 40A, and are adjacent to and opposed to
each of the separate beam members 20A with the second electronic
board 40A interposed therebetween.
[0054] The inner circuit component 43 is arranged between the pair
of separate beam members 20A. A height size of the inner circuit
component 43 is smaller than a thickness size of each of the
separate beam members 20A so that the inner circuit component 43
does not abut against at least the first electronic board 30A.
[0055] A board-to-board connector 38a is mounted on the inner
surface of the first electronic board 30A, whereas a board-to-board
connector 38b is mounted on the inner surface of the second
electronic board 40A. The board-to-board connectors 38a and 38b are
brought into abutment against each other so as to be connected to
each other.
[0056] The plurality of external connection terminals 52a and the
plurality of external connection terminals 52b are connected to
connection lands of the first electronic board 30A and the second
electronic board 40A through an intermediation of bonding wires
39a, 39b, 49a, and 49b which are, for example, thin aluminum
wires.
[0057] The plurality of external connection terminals 52a initially
constitute a terminal-group plate 50a, while the plurality of
external connection terminals 52b initially constitute a
terminal-group plate 50b. At this time, in the terminal-group plate
50a, the plurality of external connection terminals 52a are
connected to each other through a cutout connection portion 51a. In
the same manner, in the terminal-group plate 50b, the plurality of
external connection terminals 52b are connected to each other
through a cutout connection portion 51b. In the final step of
assembly, by cutting out the cutout connection portions 51a and
51b, the plurality of external connection terminals 52a and 52b are
separated into individual pieces.
[0058] A cooling-medium sensor 80a is mounted to one of the
separate beam members 20A. A structure in which the cooling-medium
sensor 80a is mounted is described below referring to FIG. 4.
[0059] A structure in which the heat-generating components 32 and
42 are mounted is described below referring to FIG. 5.
[0060] FIG. 3 is a sectional view illustrating an upper die 61 and
a lower die 62 used for the electronic control device 10A.
[0061] The dies 61 and 62 are integrated through temporary fixtures
(not shown) provided inside the dies 61 and 62. Inside the dies 61
and 62, the electronic control device 10A before molding, in which
the external connection terminals 52a and 52b are connected to each
other, is placed.
[0062] A resin injection port 63 passes from the right to the left
on the paper plane of FIG. 3. Through the resin injection port 63,
a synthetic resin serving as a thermosetting or thermoplastic resin
which is heated and melted is injected under pressure into a space
closed by the upper die 61 and the lower die 62.
[0063] After the injection of the synthetic resin from the resin
injection port 63 under pressure, a flow of the synthetic resin is
split into a stream flowing into a space above the first electronic
board 30A, a stream flowing into an internal space surrounded by
the first electronic board 30A, the second electronic board 40A,
and the pair of separate beam members 20A, and a stream flowing
into a space below the second electronic board 40A, as indicated by
the arrows of FIG. 3. Then, the streams join together in a space on
the side opposite to the resin injection port 63.
[0064] The thermosetting resin has a property of not being softened
and melted by re-heating once cured after heating and melting. The
gel adhesives 35 and 45 including the thermosetting resin
composition are cured after the bonding of the first electronic
board 30A and the second electronic board 40A to the pair of
separate beam members 20A. As a result, the adhesives 35 and 45 are
not softened when the exterior covering material 11 is molded
through heating.
[0065] When the thermoplastic resin is used for the external
covering member 11, the thermoplastic resin is melted by
re-heating. Therefore, the components inside the external covering
member 11 can be collected separately.
[0066] FIG. 4 is a sectional view illustrating a state where the
cooling-medium sensor 80a is mounted. A small window 24 serving as
an opening portion is formed through a wall surface of one of the
separate beam members 20A. In the small window 24, a housing 82
bonded to the one of the separate beam members 20A with the
adhesive 35 is provided. Inside the housing 82, a sensor element 81
serving as a component of the cooling-medium sensor 80a is
hermetically sealed by a filler 83. The sensor element 81 is
connected to the first electronic board 30A or the second
electronic board 40A through an intermediation of connection wires
84a and 84b.
[0067] The sensor element 81 is for measuring a temperature of the
hydraulic working oil which serves as the cooling medium by using,
for example, a thermister which is a temperature-sensitive variable
resistance element.
[0068] Although the cooling-medium sensor 80a is a temperature
sensor using the temperature-sensitive variable resistance element
in this embodiment, the cooling-medium sensor 80a may also be a
pressure sensor for measuring a pressure of the cooling medium by
using a piezoelectric sensor which is a pressure-sensitive
heat-generating element.
[0069] Moreover, as illustrated in FIG. 1, in an area of the first
electronic board 30A, which is adjacent to and opposed to one of
the separate beam members 20A, a thermister can be mounted as a
simplified cooling-medium sensor 80b. In this case, an approximate
temperature of the hydraulic working oil can be indirectly detected
without direct contact with the hydraulic working oil serving as
the cooling medium.
[0070] FIG. 5 is a sectional view illustrating a state where the
heat-generating components 32 are mounted. The heat-generating
components 32 are mounted on an outer-surface pattern 71 of the
first electronic board 30A. The outer-surface pattern 71 and an
inner-surface pattern 72 are thermally connected to each other
through a plurality of plated through-holes 73 provided for heat
transmission.
[0071] The inner-surface pattern 72 is adjacent to and opposed to
one of the surfaces of each of the separate beam members 20A with
the thermally conductive adhesive 35 interposed therebetween.
[0072] Small holes may be formed in the first electronic board 30A
so that projections integrally formed with the separate beam
members 20A are fitted into the small holes. Then, heat-generating
electrodes of the heat-generating components 32 are caused to be
opposed to the projections. A gap formed between the
heat-generating elements and the projections which are opposed to
each other is filled with a thermally conductive adhesive for heat
transmission.
[0073] Even in the case of the heat-generating components 42
mounted on the second electronic board 40A, the same structure as
that of the heat-generating components 32 mounted on the first
electronic board 30A is used. As in the case of the heat from the
heat-generating components 32, the heat from the heat-generating
components 42 is transmitted to the other surface of each of the
separate beam members 20A through the outer-surface pattern 71, the
plated through-holes 73, and the inner-surface pattern 72.
[0074] FIG. 6A is a top view illustrating an example where a
connection plate 22 is provided between the pair of separate beam
members 20A of the electronic control device 10A according to the
first embodiment, and FIG. 6B is a right side view of FIG. 6A.
[0075] The highly thermally conductive connection plate 22 is
integrated with the pair of separate beam members 20A by welding,
brazing, or bonding so that the pair of separate beam members 20A
are thermally connected to each other.
[0076] The connection plate 22 has a plurality of window holes 23
formed therein. Through the window holes 23, the inner circuit
components 33 and 43 are mounted on the first electronic board 30A
and the second electronic board 40A.
[0077] The number of the window holes 23 may be one.
[0078] FIG. 7A is a view illustrating a state where the electronic
control device 10A is mounted, which is a perspective top view with
a cover 96A removed, and FIG. 7B is a sectional view taken along
the line B-B of FIG. 7A.
[0079] The electronic control device 10A is fixed to a mounting
surface 90A of a gear box of the automobile transmission through an
intermediation of a mounting foot 91A and a feed and discharge
fixing base 92A.
[0080] The mounting foot 91A secures the externally exposed
connection portion 21.
[0081] The feed and discharge fixing base 92A fixes an externally
exposed open end of each of the separate beam members 20A through
an intermediation of a packing 95A.
[0082] An inlet pipe (not shown) for the hydraulic working oil
serving as the cooling medium is connected to the upper open end
which is illustrated in the upper part of FIG. 7A, whereas an
outlet pipe 93A for the hydraulic working oil is connected to the
other open end.
[0083] The hydraulic working oil is introduced from the inlet pipe
to pass through one of the separate beam members 20A, the
connection portion 21, and the other separate beam member 20A so as
to be externally discharged through the outlet pipe 93A. Then, the
hydraulic working oil is introduced into the inlet pipe again.
[0084] The cover 96A is fixed to the mounting foot 91A and the feed
and discharge fixing base 92A over the mounting foot 91A and the
feed and discharge fixing base 92A so as to protect the electronic
control device 10A.
[0085] As described above, according to the electronic control
device 10A of the first embodiment of the present invention, the
first electronic board 30A is bonded to one of the surfaces of each
of the separate beam members 20A serving as the thermally
conductive support members, whereas the second electronic board 40A
is bonded to the other surface of each of the separate beam members
20A.
[0086] Therefore, the separate beam members 20A serve as the
support members for supporting the first electronic board 30A and
the second electronic board 40A and thermal diffuser members at the
same time. In addition, the separate beam members 20A ensure a
distance between the first electronic board 30A and the second
electronic board 40A. In this manner, the outer circuit components
31, 32, 41, and 42 and the inner circuit components 33 and 43 are
mounted on the two surfaces of the electronic boards 30A and 40A,
respectively.
[0087] Therefore, a mounting area can be increased without
increasing a plane area of each of the first electronic board 30A
and the second electronic board 40A. As a result, a plane area and
a volume of the entire product can be reduced.
[0088] Moreover, the heat-generating components 32 and 42 mounted
on the first electronic board 30A and the second electronic board
40A are opposed to the pair of separate beam members 20A which are
bonded to each other through the adhesives 35 and 45. The
temperature can be suppressed from being excessively increased
locally because the heat generated from the heat-generating
components 32 and 42 are diffused through the separate beam members
20.
[0089] Moreover, the space between the first electronic board 30A
and the second electronic board 40A is filled with the exterior
covering material 11 made of the synthetic resin to provide a
non-hollow structure. In addition, at the time of pressure-molding
of the synthetic resin, the synthetic resin is injected also into
the space between the first electronic board 30A and the second
electronic board 40A. Therefore, flexural deformation of the first
electronic board 30A and the second electronic board 40A,
specifically, the deformation to bring the first electronic board
30A and the second electronic board 40A close to each other at the
time of pressure-molding of the synthetic resin, can be
suppressed.
[0090] Moreover, the separation of solders on the circuit
components 31, 32, 41, 42, 33, and 43 and the separation of the
first electronic board 30A and the second electronic board 40A from
the pair of separate beam members 20A and the exterior covering
material 11 can be suppressed from occurring due to expansion and
shrinkage of the air, which occurs with a change in environmental
temperature during actual use.
[0091] Further, the weight of the separate beam members 20A is
reduced and the sufficient distance between the separate beam
members 20A can be ensured because each of the pair of separate
beam members 20A is formed of the hollow cylindrical member.
[0092] Moreover, the hydraulic working oil serving as the cooling
medium resides in or flows through the hollow portion of each of
the separate beam members 20A. Therefore, the heat generated from
the heat-generating components 32 and 42 mounted on both the first
electronic board 30A and the second electronic board 40A can be
efficiently diffused. In addition, even if the first electronic
board 30A and the second electronic board 40A are provided close to
each other, the temperature can be prevented from increasing in a
locally concentrated manner in comparison with a single thermal
diffuser plate for a single board on which the heat-generating
components are mounted. Therefore, the electronic control device
can be reduced in size.
[0093] Further, the pair of separate beam members 20A are connected
to each other through the hollow connection portion 21. Therefore,
the cooling member enters and exits the separate beam members 20A
at one position. Therefore, a piping structure can be
simplified.
[0094] Further, when the pair of separate beam members 20A are
connected to each other through the connection plate 22, the
portions of the first electronic board 30A and the second
electronic board 40A, which are bonded to the separate beam members
20A with the adhesives 35 and 45, can be prevented from being
separated even if a large external force is exerted on the exposed
portions of the separate beam members 20A. As a result, the
temperature of both of the electronic boards 30A and 40A can be
suppressed from increasing.
[0095] Moreover, the window holes 23 are formed through the
connection plate 22. Therefore, the inner circuit components 33 and
43 can be mounted respectively onto the first electronic board 30A
and the second electronic board 40A through the window holes 23. As
a result, workability in assembly is improved.
[0096] Further, the cooling-medium sensor 80a is provided to one of
the separate beam members 20A. A signal detected by the
cooling-medium sensor 80a is connected to the first electronic
board 30A. Therefore, the detected signal can be directly fed to
the electronic board 30A without passing through the external
connection terminals. The cooling-medium sensor 80a is built in the
transmission control device for the automobile transmission.
Therefore, a signal wiring can be simplified.
[0097] When the temperature sensor serving as the simplified
cooling-medium sensor 80b connected to the first electronic board
30A is provided in the area of the first electronic board 30A,
which is opposed to one of the separate beam members 20A, the
detected signal can be directly fed to the first electronic board
30A without passing through the external connection terminals. In
addition, the cooling-medium sensor 80b can be built in the
transmission control device for the automobile transmission.
Therefore, the signal wiring can be simplified.
[0098] When the temperature sensor is employed as the
cooling-medium sensor 80b, the small window 24, which is required
for the separate beam members 20A in the case where the
cooling-medium sensor 80a is used, is no longer required.
Therefore, the cooling-medium sensor 80b can be readily applied to
know an approximate temperature of the cooling medium.
[0099] Moreover, the series of external connection terminals 52a
and 52b are located outside the pair of separate beam members 20A
and are arranged in parallel to the separate beam members 20A, each
extending in the longitudinal direction. Therefore, the mounting
foot 91A and the feed and discharge fixing base 92A, which
constitute a fixing and retaining mechanism of the separate beam
members 20A, do not interfere with external wirings connected to
the external connection terminals 52a and 52b. Thus, operability in
connecting the external wirings to the external connection
terminals 52a and 52b is improved.
[0100] Moreover, the first electronic board 30A and the second
electronic board 40A are connected to each other at the position
inside the pair of separate beam members 20A through the
board-to-board connectors 38a and 38b. Thus, the position at which
the external wirings are connected to the external connection
terminals 52a and 52b and the position at which the wiring for
connecting the separate beam members 20A is provided are separated
from each other. Therefore, an outer size of the electronic control
device can be reduced.
Second Embodiment
[0101] FIG. 8A is a top view of an electronic control device 10B
according to a second embodiment of the present invention before
sealing with a resin, and FIG. 8B is a right side view of FIG. 8A.
FIG. 9A is a top view of the electronic control device 10B
according to the second embodiment of the present invention, and
FIG. 9B is a right side view of FIG. 9A.
[0102] The electronic control device 10B is a drive control device
for a radiator fan which constitutes a part of a water-cooled
automobile engine control device. The electronic control device 10B
includes: a pair of separate beam members 20B; connection plates
22a and 22b; a first electronic board 30B; a second electronic
board 40B; the plurality of external connection terminals 52a and
52b; and the exterior covering material 11. The pair of separate
beam members 20B are hollow cylindrical thermally conductive
support members made of, for example, a copper alloy. The
connection plates 22a and 22b are bonded onto surfaces of each of
the separate beam members 20B so as to connect the pair of separate
beam members 20B to each other. The first electronic board 30B is
bonded to be fixed to the upper surfaces of the respective separate
beam members 20B, whereas the second electronic board 40B is bonded
to be fixed to the lower surfaces of the respective separate beam
members 20B. The plurality of external connection terminals 52a are
provided on one side of the first electronic board 30B and the
second electronic board 40B, whereas the plurality of external
connection terminals 23b are provided on the side of the first
electronic board 30B and the second electronic board 40B, which is
opposite to the side on which the external connection terminals 52a
are mounted. The exterior covering material 11 is a thermosetting
resin which covers the entire first electronic board 30B, the
entire second electronic board 40B, a part of each of the separate
beam members 20B, and a part of each of the external connection
terminals 52a and 52b.
[0103] Each of the separate beam members 20B serving as the support
members has a hollow cylindrical shape. In the hollow, cooling
water serving as the cooling medium resides in and flows.
[0104] The outer circuit components 31 and 32 are provided on one
surface of the first electronic board 30B, which is formed of, for
example, a glass epoxy board, whereas the inner circuit component
33 is provided on the other surface of the first electronic board
30B. The outer circuit components 31 and 32 are located outside the
separate beam members 20B, whereas the inner circuit component 33
is located inside the separate beam members 20B. The outer circuit
components 31 and 32 include the heat-generating components 32.
[0105] Opposite side end portions (two lateral edge portions) of
the first electronic board 30B are bonded to be fixed to one
surface of each of the separate beam members 20B with the adhesive
35 which is, for example, a thermosetting silicon resin
composition. The heat-generating components 32 are mounted on each
of the opposite side end portions of the first electronic board
30B. The heat-generating components 32 are adjacent to and opposed
to the separate beam members 20B with the first electronic board
30B interposed therebetween.
[0106] The inner circuit component 33 is arranged between the pair
of separate beam members 20B. A height size of the inner circuit
component 33 is smaller than a thickness size of each of the
separate beam members 20B so that the inner circuit component 33
does not abut against at least the second electronic board 40B.
[0107] As in the case of the first electronic board 30B, the outer
circuit components 41 and 42 are mounted on one of the surfaces of
the second electronic board 40B which is formed of a glass epoxy
board, whereas the inner circuit component 43 is mounted on the
other surface of the second electronic board 40B. The outer circuit
components 41 and 42 include the heat-generating components 42.
[0108] Opposite side end portions of the second electronic board
40B are bonded to be fixed to a surface of each of the separate
beam members 20B, which is opposite to the surface bonded to be
fixed to the first electronic board 30B, through an intermediation
of the adhesive 45 which is, for example, a thermosetting silicon
resin composition. The heat-generating components 42 are mounted on
the opposite side end portions of the second electronic board 40A,
and are adjacent to and opposed to each other with the separate
beam members 20B and the second electronic board 40B interposed
therebetween.
[0109] The inner circuit component 43 is arranged between the pair
of separate beam members 20B. A height size of the inner circuit
component 43 is smaller than the thickness size of the separate
beam members 20B so that the inner circuit component 43 does not
abut against at least the first electronic board 30B.
[0110] In the electronic control device 10B according to this
second embodiment, the first electronic board 30B and the second
electronic board 40B are electrically connected to each other
through bonding wires 53a and 53b instead of being connected
through the board-to-board connectors 38a and 38b used in the first
embodiment.
[0111] Moreover, the cooling-medium sensor 80a is provided to one
of the separate beam members 20B, whereas the simplified
cooling-medium sensor 80b is provided in an area of the first
electronic board 30B, which is opposed to the other separate beam
member 20B.
[0112] FIG. 10 is a sectional view illustrating the upper die 61
and the lower die 62 used for the electronic control device
10B.
[0113] The dies 61 and 62 are integrated through temporary fixtures
(not shown) provided inside the dies 61 and 62. Inside the dies 61
and 62, the electronic control device 10B before molding, in which
the external connection terminals 52a and 52b are connected to each
other respectively through the cutout connection portions 51a and
51b, is placed.
[0114] The resin injection port 63 passes from the right to the
left on the paper plane of FIG. 10. Through the resin injection
port 63, the synthetic resin serving as the thermosetting or
thermoplastic resin which is heated and melted is injected under
pressure into the space closed by the upper die 61 and the lower
die 62.
[0115] After the injection of the synthetic resin from the resin
injection port 63 under pressure, a flow of the synthetic resin is
split into a stream flowing into a space above the first electronic
board 30B, a stream flowing into an internal space surrounded by
the first electronic board 30B, the second electronic board 40B,
and the pair of separate beam members 20B, and a stream flowing
into a space below the second electronic board 40B, as indicated by
the arrows of FIG. 10. Then, the streams join together in a space
on the side opposite to the resin injection port 63.
[0116] The structure in which the cooling-medium sensor 80a is
mounted is the same as that illustrated in FIG. 4, and the
structure in which the cooling-medium sensor 80b is mounted is the
same as that described in the first embodiment.
[0117] However, the cooling medium is the hydraulic working oil
used for the automobile transmission in the first embodiment,
whereas the cooling medium is the cooling water flowing back to the
radiator of the water-cooled automobile engine in this second
embodiment.
[0118] The structure in which the heat-generating components 32 and
42 are mounted is the same as that illustrated in FIG. 5.
[0119] FIG. 11A is a top view illustrating the connection plates
22a and 22b which connect the pair of separate beam members 20B to
each other, and FIG. 11B is a right side view of FIG. 11A.
[0120] The highly thermally conductive connection plates 22a and
22b are integrated with the pair of separate beam members 20B by
welding, brazing, or bonding so that the pair of separate beam
members 20B and 20B are thermally connected to each other.
[0121] Each of the connection plates 22a and 22b has a plurality of
window holes 23 formed therein. Through the window holes 23, the
inner circuit components 33 and 43 are mounted on the first
electronic board 30B and the second electronic board 40B,
respectively.
[0122] The number of the window holes 23 may also be one.
[0123] FIG. 12A is a view illustrating a state where the electronic
control device 10B is mounted, which is a top perspective view with
a cover 96B removed, and FIG. 12B is a sectional view taken along
the line B-B of FIG. 12A.
[0124] The electronic control device 10B is fixed to a mounting
surface 90B of the radiator of the automobile engine through an
intermediation of an outflow-side fixing base 91A and an
inflow-side fixing base 92B.
[0125] The outflow-side fixing base 91B fixes an open end portion
of each of the separate beam members 20B, which is externally
exposed, through a packing 95B. To the outflow-side fixing base
91B, an end of an outflow pipe 93B in communication with the
separate beam members 20B, through which cooling water flows, is
connected.
[0126] The inflow-side fixing base 92B fixes the other open end of
each of the separate beam members 20B, which is externally exposed,
through another packing 95B. To the inflow-side fixing base 92B, an
end of an inflow pipe 94B in communication with the pair of
separate beam members 20B, through which cooling water flows, is
connected.
[0127] The cover 96B is fixed to the outflow-side fixing base 91B
and the inflow-side fixing base 92B over the outflow-side fixing
base 91B and the inflow-side fixing base 92B so as to protect the
electronic control device 10B.
[0128] Next, the functions and effects of the electronic control
device 10B according to the second embodiment of the present
invention are described. Herein, differences of the electronic
control device 10B from the electronic control device 10A described
in the first embodiment are mainly described.
[0129] According to the electronic control device 10B of the second
embodiment, the pair of separate beam members 20B are connected to
each other by the thermally conductive connection plates 22a and
22b which are integrated with each other by welding, brazing, or
bonding. Therefore, the portions of the first electronic board 30B
and the second electronic board 40B, which are bonded with the
adhesives 35 and 45 to the separate beam members 20B, are prevented
from being separated even if a large external force is exerted on
the exposed portions of the separate beam members 20B. As a result,
the temperature of both of the electronic boards 30B and 40B can be
prevented from increasing.
[0130] Moreover, the window holes 23 are formed through the
connection plates 22a and 22b. Thus, the inner circuit components
33 and 43 can be mounted onto the first electronic board 30B and
the second electronic board 40B through the window holes 23. As a
result, workability in assembly is improved.
[0131] Moreover, the series of external connection terminals 52a
and 52b are located outside the pair of separate beam members 20B
and are arranged in parallel to the separate beam members 20B, each
extending in the longitudinal direction. Therefore, the
outflow-side fixing base 91B and the inflow-side fixing base 92B
which retain the separate beam members 20B do not interfere with
the external wirings connected to the external connection terminals
52a and 52b. Thus, operability in connecting the external wirings
to the external connection terminals 52a and 52b is improved.
[0132] Moreover, the first electronic board 30B and the second
electronic board 40B are connected to each other at the position
inside the pair of separate beam members 20B by the bonding wires
53a and 53b. Therefore, the position at which the external wirings
are connected to the external connection terminals 52a and 52b and
the position at which the separate beam members 20B are connected
by the bonding wires 53a and 53b are separated from each other. As
a result, the outer size of the electronic control device 10B can
be reduced.
[0133] Further, the cooling-medium sensor 80a is provided to one of
the separate beam members 20B. A signal detected by the
cooling-medium sensor 80a is connected to the first electronic
board 30B. Therefore, the detected signal can be directly fed to
the electronic board 30B without passing through the external
connection terminals. The cooling-medium sensor 80a is built in the
drive control device for the radiator fan. Therefore, a signal
wiring can be simplified.
[0134] Further, the temperature sensor which is the simplified
cooling-medium sensor 80b connected to the first electronic board
30B is provided in the area of the first electronic board 30B,
which is opposed to one of the separate beam members 20B.
Therefore, the detected signal can be directly fed to the first
electronic board 30B without passing through the external
connection terminals. The signal wiring can be simplified because
the cooling-medium sensor 80b is built in the driving control
device for the radiator fan.
Third Embodiment
[0135] FIG. 13A is a top view of an electronic control device 100
according to a third embodiment of the present invention before
sealing with a resin, and FIG. 13B is a right side view of FIG.
13A. FIG. 14A is a top view of the electronic control device 10C
according to the third embodiment of the present invention, and
FIG. 14B is a right side view of FIG. 14A.
[0136] The electronic control device 10C is a transmission control
device for an automobile transmission. The electronic control
device 10C includes: a pair of separate beam members 20C;
connection plates 22c and 22d; a first electronic board 30C; a
second electronic board 40C; a plurality of external connection
terminals 55c, 55d, 56c, and 56d; flexible boards 54a and 54b; and
the exterior covering material 11. The pair of separate beam
members 20C are hollow cylindrical thermally conductive support
members made of, for example, a copper alloy. The connection plates
22c and 22d are respectively bonded onto two surfaces of each of
the separate beam members 20C so as to connect the pair of separate
beam members 20C to each other. The first electronic board 30C is
bonded to be fixed to the upper surfaces of the respective separate
beam members 20C, whereas the second electronic board 40C is bonded
to be fixed to the lower surfaces of the respective separate beam
members 20C. The plurality of external connection terminals 55c and
56c are provided on one side of the first electronic board 30C and
the second electronic board 40C, whereas the external connection
terminals 55d and 56d are provided on the other side of the first
electronic board 30C and the second electronic board 40C, which is
opposite to the side where the external connection terminals 55c
and 56c are provided. The plurality of external connection
terminals 55c, 55d, 56c, and 56d are located inside and between the
pair of separate beam members 20C. The flexible boards 54a and 54b
electrically connect the first electronic board 30C and the second
electronic board 40C to each other. The exterior covering material
11 is a thermosetting resin which covers the entire first
electronic board 30C, the entire second electronic board 40C, the
separate beam members 20C, and a part of each of the external
connection terminals 55c, 55d, 56c, and 56d.
[0137] Each of the separate beam members 20C has a hollow
cylindrical shape. In the hollow, hydraulic working oil serving as
the cooling medium resides in and flows.
[0138] The outer circuit components 31 and 32 are provided on one
surface of the first electronic board 30C, which is formed of, for
example, a glass epoxy board, whereas the inner circuit component
33 is provided on the other surface of the first electronic board
30C. The outer circuit components 31 and 32 include the
heat-generating components 32.
[0139] Opposite side end portions (two lateral edge portions) of
the first electronic board 30C are bonded to be fixed to one
surface of each of the separate beam members 20C with the adhesive
35 which is, for example, a thermosetting silicon resin
composition. The heat-generating components 32 are mounted on each
of the opposite side end portions of the first electronic board
30C. The heat-generating components 32 are adjacent to and opposed
to the separate beam members 20C with the first electronic board
30C interposed therebetween.
[0140] The inner circuit component 33 is arranged between the pair
of separate beam members 20C. A height size of the inner circuit
component 33 is smaller than a thickness size of each of the
separate beam members 20C so that the inner circuit component 33
does not abut against at least the second electronic board 40C.
[0141] As in the case of the first electronic board 30C, the outer
circuit components 41 and 42 are mounted on one of the surfaces of
the second electronic board 40C which is formed of a glass epoxy
board, whereas the inner circuit component 43 is mounted on the
other surface of the second electronic board 40C. The outer circuit
components 41 and 42 include the heat-generating components 42.
[0142] Opposite side end portions of the second electronic board
40C are bonded to be fixed to a surface of each of the separate
beam members 20C, which is opposite to the surface bonded to be
fixed to the first electronic board 30C, through an intermediation
of the adhesive 45 which is, for example, a thermosetting silicon
resin composition. The heat-generating components 42 are mounted on
the opposite side end portions of the second electronic board 40C,
and are adjacent to and opposed to each other with the separate
beam members 20C and the second electronic board 40C interposed
therebetween.
[0143] The inner circuit component 43 is arranged between the pair
of separate beam members 20C. A height size of the inner circuit
component 43 is smaller than the thickness size of the separate
beam members 20C so that the inner circuit component 43 does not
abut against at least the first electronic board 30C.
[0144] On one of the separate beam members 20C, the cooling-medium
sensor 80a for detecting the temperature or the pressure is mounted
in the same structure as that illustrated in FIG. 4.
[0145] Moreover, the simplified cooling-medium sensor 80b for
indirectly detecting the temperature of the cooling medium is
mounted in an area of the first electronic board 30C, which is
opposed to the other separate beam member 20C.
[0146] In this embodiment, the flexible boards 54a and 54b are used
in place of the board-to-board connectors 38a and 38b used in the
first embodiment. Pairs of copper-foil lands for connecting the
boards (not shown) are provided in side portions of the first
electronic board 30C and the second electronic board 40C, which are
parallel to the separate beam members 20C. Both ends of the
flexible boards 54a and 54b are respectively bonded to the
copper-foil lands for connecting the boards. As a result, the first
electronic board 30C and the second electronic board 40C are
electrically connected to each other.
[0147] The second electronic board 40C is connected to the external
connection terminals 55c, 55d, 56d, and 56d through the flexible
boards 54a and 54b, the first electronic board 30C, and the bonding
wires 39a and 39b.
[0148] The series of external connection terminals 55c, 55d, 56c,
and 56d are arranged vertically to the separate beam members 20C.
The external connection terminals 55c, 55d, 56c, and 56d are
connected to connection lands of the first electronic board 30C
through an intermediation of the bonding wires 39a and 39b which
are, for example, thin aluminum wires.
[0149] The plurality of external connection terminals 55c and 56c
initially constitute a terminal-group plate 50c in which the
external connection terminals 55c and 56c are connected to each
other by a cutout connection portion 51c, whereas the plurality of
external terminals 55d and 56d constitute a terminal-group plate
50d in which the external connection terminals 55d and 56d are
connected to each other by a cutout connection portion 51d. In the
final step of assembly, the cutout connection portions 51c and 51d
are cut out to separate the plurality of external connection
terminals 55c, 56c, 55d, and 56d into individual pieces.
[0150] The plurality of external connection terminals 55c, 55d,
56c, and 56d are grouped into an upper group and a lower group,
that is, a first group including the external connection terminals
55c and 55d and a second group including the external connection
terminals 56c and 56d. For example, at an intermediate position
between the external connection terminals 55c of the first group
and the external connection terminals 56c of the second group, the
resin injection port 63 for the dies, which is described below and
illustrated in FIG. 15, is located.
[0151] The plurality of external connection terminals 55c, 55d,
56c, and 56d may be grouped into three or more groups.
[0152] FIG. 15 is a sectional view illustrating the upper die 61
and the lower die 62 used for the electronic control device
10C.
[0153] The dies 61 and 62 are integrated through temporary fixtures
(not shown) provided inside the dies 61 and 62. Inside the dies 61
and 62, the electronic control device 10C before molding, in which
the external connection terminals 55c, 55d, 56c, and 56d are
connected to each other through the cutout connection portions 51c
and 51d, is placed.
[0154] The resin injection port 63 passes from the right to the
left on the paper plane of FIG. 15. Through the resin injection
port 63, the synthetic resin serving as the thermosetting or
thermoplastic resin which is heated and melted is injected under
pressure into the space closed by the upper die 61 and the lower
die 62.
[0155] After the injection of the synthetic resin from the resin
injection port 63 under pressure, a flow of the synthetic resin is
split into a stream flowing into a space above the first electronic
board 30C, a stream flowing into an internal space surrounded by
the first electronic board 30C, the second electronic board 40C,
and the pair of separate beam members 20C, and a stream flowing
into a space below the second electronic board 40C, as indicated by
the arrows of FIG. 15. Then, the streams join together in a space
on the side opposite to the resin injection port 63.
[0156] FIG. 16A is a top view illustrating the connection plates
22c and 22d, each connecting the pair of separate beam members 20C
to each other, and FIG. 16B is a right side view of FIG. 16A.
[0157] The highly thermally conductive connection plates 22c and
22d are integrated with the pair of separate beam members 20C by
welding, brazing, or bonding so that the pair of separate beam
members 20C are thermally connected to each other.
[0158] A window hole 23c is formed in the connection plate 22c,
whereas a window hole 23d is formed in the connection plate 22d.
Through the window hole 23, the inner circuit components 33 and 43
are mounted on the first electronic board 30C and the second
electronic board 40C.
[0159] The number of each of the window holes 23c and 23d may be
plural.
[0160] FIG. 17A is a view illustrating a state where the electronic
control device 10C is mounted, which is a top perspective view with
a cover 96C removed, and FIG. 17B is a sectional view taken along
the line B-B of FIG. 17A.
[0161] The electronic control device 10C is fixed to a mounting
surface 90C of the gear box of the automobile transmission through
an intermediation of a reflux fixing base 91C and a feed and
discharge fixing base 92C.
[0162] The reflux fixing base 91C fixes an open end portion of each
of the separate beam members 20C, which is externally exposed,
through a packing 95C. In the reflux fixing base 91C, a circulating
flow path 97C in communication with the open end portion of each of
the separate beam members 20C, through which the hydraulic working
oil flows, is formed.
[0163] The feed and discharge fixing base 92C fixes the other open
end portion of each of the separate beam members 20C, which is
externally exposed, through another packing 95C. To one end of the
feed and discharge fixing base 92C, an end of an outflow pipe 93C
in communication with one of the separate beam members 20C, through
which the hydraulic working oil flows, is connected. To the other
end of the feed and discharge fixing base 92C, an end of an inflow
pipe (not shown) in communication with the other separate beam
member 20C, through the hydraulic working oil flows, is
connected.
[0164] The cover 96C is fixed to the reflux fixing base 91C and the
feed and discharge fixing base 92C over the reflux fixing base 91C
and the feed and discharge fixing base 92C so as to protect the
electronic control device 10C.
[0165] In the electronic control device 10A of the first
embodiment, the open end portions of the pair of separate beam
members 20A are connected through an intermediation of the
connection portion 21 as illustrated in FIG. 1. On the other hand,
in the electronic control device 10C of this third embodiment, the
circulating flow path 97C provided in the reflux fixing base 91C
has the function of the connection portion 21.
[0166] However, the electronic control device 10C can be used in
the case where the pair of separate beam members 20B function as
the parallel flow paths as in the case of the electronic control
device 10B of the second embodiment illustrated in FIG. 8.
[0167] Next, the functions and effects of the electronic control
device 10C of the third embodiment of the present invention are
described. Herein, differences of the electronic control device 10C
from the electronic control device 10A of the first embodiment are
mainly described.
[0168] In the electronic control device 10C according to the third
embodiment, the pair of separate beam members 20C are connected to
each other by the thermally conductive connection plates 22c and
22d which are integrated with the separate beam members 20C by
welding, brazing, or bonding. Therefore, even if a large external
force is exerted on the exposed portion of each of the separate
beam members 20C, the portions of the first electronic board 30C
and the second electronic board 40C, which are bonded to the
separate beam members 20C with the adhesives 35 and 45, are
prevented from being separated. As a result, a temperature of both
of the electronic boards 30C and 40C is prevented from
increasing.
[0169] Moreover, the window hole 23c is formed in the connection
plate 22c, whereas the window hole 23d is formed in the connection
plate 22d. Thus, the inner circuit components 33 and 43 can be
mounted respectively on the first electronic board 30C and the
second electronic board 40C through the window holes 23c and 23d.
As a result, operability in assembly is improved.
[0170] Further, in the electronic control device 10A of the first
embodiment and the electronic control device 10B of the second
embodiment, the external connection terminals 52a and 52b are
arranged in parallel to the separate beam members 20A or 20B as
illustrated in FIGS. 1 and 8. On the other hand, in the electronic
control device 10C of the third embodiment, the external connection
terminals 55c, 55d, 56c, and 56d are arranged vertically to the
separate beam members 20C, as illustrated in FIG. 13A.
[0171] Therefore, a longitudinal size of each of the pair of
separate beam members 20C of the electronic control device 10C
according to this third embodiment is reduced as compared with that
of each of the separate beam members 20A of the electronic control
device 10A of the first embodiment and that of the separate beam
members 20B of the electronic control device 10B of the second
embodiment. On the other hand, a distance between the pair of
separate beam members 20C is increased.
[0172] Further, the plurality of external connection terminals 55c,
55d, 56c, and 56d are arranged vertically to the pair of separate
beam members 20C inside the pair of separate beam members 20C. The
external connection terminals 55c, 55d, 56c, and 56d are grouped
into the first group including the external connection terminals
55c and 55d and the second group including the external connection
terminals 56c and 56d. At the intermediate position between the
first group and the second group, the resin is injected through the
resin injection port 63.
[0173] Thus, the reflux fixing base 91C and the feed and discharge
fixing base 92C, which are the fixing and retaining mechanism for
the separate beam members 10C, and the external wirings connected
to the external connection terminals 55c, 55d, 56c, and 56d are
provided in a concentrated manner. Therefore, an operation of
mounting the separate beam members 10C and an operation of
providing the external wirings are facilitated.
[0174] Moreover, the position of the resin injection port 63 for
the dies 61 and 62 is separated away from the external connection
terminals 55c, 55d, 56c, and 56d. Therefore, the structure of the
dies 61 and 62 is simplified.
[0175] Further, the cooling-medium sensor 80a is provided to one of
the separate beam members 20C. A signal detected by the
cooling-medium sensor 80a is connected to the first electronic
board 30C. Therefore, the detected signal can be directly fed to
the electronic board 30C without passing through the external
connection terminals. The cooling-medium sensor 80a is built in the
transmission control device for the automobile transmission.
Therefore, a signal wiring can be simplified.
[0176] Further, the temperature sensor which is the simplified
cooling-medium sensor 80b connected to the first electronic board
30C is provided in the area of the first electronic board 30C,
which is opposed to one of the separate beam members 20C.
Therefore, the detected signal can be directly fed to the first
electronic board 30C without passing through the external
connection terminals. The signal wiring can be simplified because
the cooling-medium sensor 80b is built in the transmission control
device for the automobile transmission.
Fourth Embodiment
[0177] FIG. 18A is a top view of an electronic control device 10D
according to a fourth embodiment of the present invention before
sealing with a resin, and FIG. 18B is a right side view of FIG.
18A. FIG. 19 is a top view of the electronic control device 10D
according to the fourth embodiment of the present invention.
[0178] The electronic control device 10D is an intake-air amount
detection control device as a part of an automobile engine control
device. The electronic control device 10D includes: a pair of
separate beam members 20D; the connection plates 22c and 22d; a
first electronic board 30D; a second electronic board 40D; a
plurality of external connection terminals 55a, 55b, 56a, and 56b;
the bounding wires 53a and 53b; and the exterior covering material
11. The pair of separate beam members 20D are hollow cylindrical
thermally conductive support members made of, for example, a copper
alloy. The connection plates 22c and 22d are respectively bonded
onto two surfaces of each of the pair of separate beam members 20D
so as to connect the pair of separate beam members 20D to each
other. The first electronic board 30D is bonded to be fixed to the
upper surfaces of the respective separate beam members 20D, whereas
the second electronic board 40D is bonded to be fixed to the lower
surfaces of the respective separate beam members 20D. The bounding
wires 53a and 53b electrically connect the first electronic board
30D and the second electronic board 40D to each other. The exterior
covering material 11 is a thermosetting resin which covers the
entire first electronic board 30D, the entire second electronic
board 40D, the separate beam members 20D, and a part of each of the
external connection terminals 55a, 55b, 56a, and 56b.
[0179] Each of the separate beam members 20D has a hollow
cylindrical shape. Inside the separate beam members 20D, intake
atmospheric air for an engine serving as the cooling medium
flows.
[0180] The outer circuit components 31 and 32 are provided on one
surface of the first electronic board 30D, which is formed of, for
example, a glass epoxy board, whereas the inner circuit component
33 is provided on the other surface of the first electronic board
30D. The outer circuit components 31 and 32 include the
heat-generating components 32.
[0181] Opposite side end portions of the first electronic board 30D
are bonded to be fixed to one surface of each of the separate beam
members 20D with the adhesive 35 which is, for example, a
thermosetting silicon resin composition. The heat-generating
components 32 are mounted on each of the opposite side end portions
of the first electronic board 30D. The heat-generating components
32 are adjacent to and opposed to the separate beam members 20D
with the first electronic board 30D interposed therebetween.
[0182] The inner circuit component 33 is arranged between the pair
of separate beam members 20D. A height size of the inner circuit
component 33 is smaller than a thickness size of each of the
separate beam members 20D so that the inner circuit component 33
does not abut against at least the second electronic board 40D.
[0183] As in the case of the first electronic board 30D, the outer
circuit components 41 and 42 are mounted on one of the surfaces of
the second electronic board 40D which is formed of a glass epoxy
board, whereas the inner circuit component 43 is mounted on the
other surface of the second electronic board 40D. The outer circuit
components 41 and 42 include the heat-generating components 42.
[0184] Opposite side end portions (two lateral edge portions) of
the second electronic board 40D are bonded to be fixed to a surface
of each of the separate beam members 20D, which is opposite to the
surface bonded to be fixed to the first electronic board 30D,
through an intermediation of the adhesive 45 which is, for example,
a thermosetting silicon resin composition. The heat-generating
components 42 are mounted on the opposite side end portions of the
second electronic board 40D, and are adjacent to and opposed to
each other with the separate beam members 20D and the second
electronic board 40D interposed therebetween.
[0185] The inner circuit component 43 is arranged between the pair
of separate beam members 20D. A height size of the inner circuit
component 43 is smaller than the thickness size of the separate
beam members 20D so that the inner circuit component 43 does not
abut against at least the first electronic board 30D.
[0186] On one of the separate beam members 20D, the cooling-medium
sensor 80a for detecting the temperature or the pressure is mounted
in the same structure as that illustrated in FIG. 4.
[0187] The simplified cooling-medium sensor 80b for indirectly
detecting a temperature of the intake atmospheric air serving as
the cooling medium may be mounted on an area of the first
electronic board 30D, which is opposed to one of the separate beam
members 20D, in place of the cooling-medium sensor 80a, as
illustrated in FIG. 18A.
[0188] On an area of the first electronic board 30D, which is on
the other separate beam member 20D side, a cooling-medium sensor
80c, which is described below referring to FIGS. 20A and 20B, is
provided.
[0189] In this fourth embodiment, the bonding wires 53a and 53b are
used in place of the board-to-board connectors 38a and 38b used in
the first embodiment.
[0190] The first electronic board 30D is connected to the external
connection terminals 55a, 55b, 56a, and 56b through the bonding
wires 53a and 53b and the second electronic board 40D.
[0191] The plurality of external connection terminals 55a, 55b,
56a, and 56b, which are bonded to an upper part and a lower part of
each of opposite side end portions of the second electronic board
40D by soldering are arranged so as to extend vertically to the
separate beam members 20D.
[0192] The plurality of external connection terminals 55a, 55b,
56a, and 56b are grouped into an upper group and a lower group,
that is, a first group including the external connection terminals
55a and 55b and a second group including the external connection
terminals 56a and 56b. For example, at an intermediate position
between the first group including the external connection terminals
55a and 55b and the second group including the external connection
terminals 56a and 56b, the resin injection port 63 illustrated in
FIG. 15 is located.
[0193] The plurality of external connection terminals 55a, 55b,
56a, and 56b may be grouped into three or more groups.
[0194] The structure in which the heat-generating components 32 and
42 are mounted is the same as that illustrated in FIG. 5.
[0195] A structure of each of the connection plates 22c and 22d is
the same as that illustrated in FIGS. 16A and 16B.
[0196] FIG. 20A is a sectional view illustrating a state where the
electronic control device 10D illustrated in FIG. 19 is mounted,
and FIG. 20B is an enlarged sectional view of a principal part of
FIG. 20A.
[0197] A mounting surface 90D is a wall body of an intake pipe of
an automobile engine, on which the electronic control device 10D is
mounded. A mounting window hole 98D is formed in the intake pipe.
The electronic control device 10D is fitted into the mounting
window hole 98D so as to be fixed to the mounting surface 90D.
[0198] The pair of separate beam members 20D are located inside the
intake pipe so that the intake atmospheric air flows into and
passes therethrough.
[0199] The cooling-medium sensor 80c which is a hot-wire flow rate
sensor is provided to one of the separate beam members 20D.
[0200] The cooling-medium sensor 80c is, for example, a hot wire
made of platinum, which is provided to pass through small windows
25c and 25d formed through one of the separate beam members 20D so
as to bridge the small windows 25c and 25d. Both ends of the
cooling-medium sensor 80c are respectively exposed from the first
electronic board 30D and the second electronic board 40D to be
soldered.
[0201] The hot-wire flow rate sensor includes a wire having an
electric resistance varying depending on the temperature, inside
the intake pipe. A current is allowed to flow through the wire to
heat and keep the wire at a constant temperature. At this time, the
degree of cooling for the wire changes according to the flow rate
of intake air. Therefore, the current value which is required to
keep the wire at the constant temperature also changes. Thus, the
amount of intake air is calculated by measuring the current
value.
[0202] As described above, the electronic control device 10D is the
intake-air amount detection control device for precisely detecting
the amount of intake air by using the intake-air amount sensor,
which constitutes a part of the engine control device. The
detection control device is provided inside the intake pipe of the
engine. Therefore, the intake atmospheric air flows inside the
separate beam members 20D. The cooling-medium sensor 80c is used as
the flow rate sensor for measuring the intake air flow rate.
[0203] The cooling-medium sensor 80a may also be used as a
temperature sensor for measuring a temperature of the intake
atmospheric air or a pressure sensor for measuring a pressure of
the intake atmospheric air.
[0204] Next, the functions and effects of the electronic control
device 10D according to the fourth embodiment of the present
invention are described. Herein, differences of the electronic
control device 10D from the electronic control device 10A described
in the first embodiment are mainly described.
[0205] According to the electronic control device 10D of the fourth
embodiment, the pair of separate beam members 20D are connected to
each other by the thermally conductive connection plates 22c and
22d which are integrated with the separate beam members 20D by
welding, brazing, or bonding. Therefore, the portions of the first
electronic board 30D and the second electronic board 40D, which are
bonded with the adhesives 35 and 45 to the separate beam members
20D, are prevented from being separated even if a large external
force is exerted on the exposed portions of the separate beam
members 20D. As a result, the temperature of both of the electronic
boards 30D and 40D can be prevented from increasing.
[0206] The cooling-medium sensor 80c serving as the flow rate
sensor is provided to one of the separate beam members 20D. A
signal detected by the cooling-medium sensor 80c is connected to
the first electronic board 30D and the second electronic board 40D.
Therefore, the cooling-medium sensor 80c is integrated with the
first electronic board 30D and the second electronic board 40D. As
a result, the detected signal can be directly fed to the electronic
boards 30D and 40D without passing through the external connection
terminals.
[0207] Further, the plurality of external connection terminals 55a,
55b, 56a, and 56b are arranged vertically to the pair of separate
beam members 20D inside the pair of separate beam members 20D. The
external connection terminals 55a, 55b, 56a, and 56b are grouped
into the first group including the external connection terminals
55a and 55b and the second group including the external connection
terminals 56a and 56b. At the intermediate position between the
first group and the second group, the resin is injected through the
resin injection port 63.
[0208] Thus, in the device in which a retaining mechanism for
retaining the separate beam members 20D, and the external wirings
connected to the external connection terminals 55a, 55b, 56a, and
56b are provided in a concentrated manner, an operation of mounting
the separate beam members 20D and an operation of providing the
external wirings are facilitated.
[0209] Moreover, the position of the resin injection port 63 for
the dies 61 and 62 is separated away from the external connection
terminals 55a, 55b, 56a, and 56b. Therefore, the structure of the
dies 61 and 62 is simplified.
[0210] Further, the cooling-medium sensor 80a is provided to one of
the separate beam members 20D. A signal detected by the
cooling-medium sensor 80a is connected to the first electronic
board 30D. Therefore, the detected signal can be directly fed to
the electronic board 30D without passing through the external
connection terminals. The cooling-medium sensor 80a is built in the
intake-air amount detection control device. Therefore, a signal
wiring can be simplified.
[0211] Further, the temperature sensor which is the simplified
cooling-medium sensor 80b connected to the first electronic board
30D is provided in the area of the first electronic board 30D,
which is opposed to one of the separate beam members 20D.
Therefore, the detected signal can be directly fed to the first
electronic board 30D without passing through the external
connection terminals. The signal wiring can be simplified because
the cooling-medium sensor 80b is built in the intake-air amount
detection control device.
[0212] In the electronic control devices 10A to 10D according to
the first to fourth embodiments, each of the first electronic
boards 30A to 30D is the epoxy resin board including the outer
surface on which the heat-generating components 32 and the outer
circuit component 31 are mounted and the inner surface on which the
inner circuit component 33 is mounted, whereas each of the second
electronic boards 40A to 40D is the epoxy resin board including the
outer surface on which the heat-generating components 42 and the
outer circuit components 41 are mounted and the inner surface on
which the inner circuit component 43 is mounted. However, the
present invention is applicable to, for example, an electronic
control device which includes a multilayered high-density
double-sided mounting board having no heat-generating component as
the first electronic board 30A, 30B, 30C, or 30D and a single-sided
mounting board on which the heat-generating components are mounted
as the second electronic board 40A, 40B, 40C, or 40D. The present
invention is also applicable to an electronic control device
including a double-sided mounting board on which the
heat-generating components are mounted as the first electronic
board 30A, 30B, 30C, or 30D and a single-sided mounting board on
which no heat-generating component is mounted as the second
electronic board 40A, 40B, 40C, or 40D.
[0213] As for the material of the electronic boards, if a ceramic
board is used in place of the inexpensive epoxy resin board, higher
heat-conducting performance for the heat-generating components is
obtained and the components can be mounted at higher density.
Therefore, a small electronic control device can be obtained.
[0214] Each of the electronic control device 10A according to the
first embodiment and the electronic control device 10C according to
the third embodiment is the transmission control device for the
automobile transmission and uses the hydraulic working oil as the
cooling medium. However, it is apparent that the electronic control
device and the cooling medium are not limited to those described
above.
[0215] For example, the electronic control device may be a drive
control device for a radiator fan of a water-cooled automobile
engine control device, and the cooling medium may be cooling water
which flows back to the radiator.
[0216] Alternatively, the electronic control device may be an
intake-air amount detection control device for an automobile engine
control device, and the cooling medium may be an intake atmospheric
air for an automobile engine.
[0217] In the cases described above, the cooling-medium sensor 80a
detects the temperature or the pressure of the cooling water or the
intake atmospheric air, whereas the simplified cooling-medium
sensor 80b detects the temperature of the cooling water or the
intake atmospheric air.
[0218] The electronic control device 10B according to the second
embodiment is the drive control device for the radiator fan of the
water-cooled automobile engine control device. In the electronic
control device 10B, the cooling medium is the cooling water flowing
back to the radiator. However, it is apparent that the electronic
control device and the cooling medium are not limited to those
described above.
[0219] For example, the electronic control device may be the
transmission control device for the automobile transmission, and
the cooling medium may be the hydraulic working oil.
[0220] Alternatively, the electronic control device may be the
intake-air amount detection control device for the automobile
engine control device, and the cooling medium may be the intake
atmospheric air introduced into the automobile engine.
[0221] In the cases described above, the cooling-medium sensor 80a
detects the temperature or the pressure of the hydraulic working
oil or the intake atmospheric air, whereas the simplified
cooling-medium sensor 80b detects the temperature of the hydraulic
working oil or the intake atmospheric air.
[0222] The electronic control device 10D according to the fourth
embodiment is the intake-air amount detection control device for
the automobile engine control device and uses the intake
atmospheric air introduced into the automobile engine as the
cooling medium. However, it is apparent that the electronic control
device and the cooling medium in the fourth embodiment are not
limited to those described above.
[0223] For example, the electronic control device 10D may be the
transmission control device for the automobile transmission, and
the cooling medium may be the hydraulic working oil.
[0224] Alternatively, the electronic control device 10D may be the
drive control device for the radiator fan of the water-cooled
automobile engine control device, and the cooling medium may be the
cooling water flowing back to the radiator.
[0225] In the cases described above, the cooling-medium sensor 80a
detects the temperature or the pressure of the hydraulic working
oil or the cooling water, whereas the simplified cooling-medium
sensor 80b detects the temperature of the hydraulic working oil or
the cooling water.
[0226] The cooling sensor 80c detects a flow rate of the hydraulic
working oil or the cooling water.
* * * * *