U.S. patent application number 12/753098 was filed with the patent office on 2011-08-11 for pixel structure, method of fabricating the same, and method of fabricating electronic device.
This patent application is currently assigned to AU OPTRONICS CORPORATION. Invention is credited to Chia-Yu Chen, Cheng-Wei Chou, Hsueh-Hsing Lu, Tsung-Hsiang Shih, Hung-Che Ting.
Application Number | 20110193089 12/753098 |
Document ID | / |
Family ID | 44352975 |
Filed Date | 2011-08-11 |
United States Patent
Application |
20110193089 |
Kind Code |
A1 |
Chou; Cheng-Wei ; et
al. |
August 11, 2011 |
PIXEL STRUCTURE, METHOD OF FABRICATING THE SAME, AND METHOD OF
FABRICATING ELECTRONIC DEVICE
Abstract
A pixel structure including a substrate, a gate, an insulation
layer, a metal oxide semiconductor (MOS) layer, a source and a
drain, at least one film layer, and a first electrode layer is
provided. The gate is disposed on the substrate. The insulation
layer covers the gate. The MOS layer is disposed on the insulation
layer above the gate. The source and the drain are disposed on the
MOS layer. The film layer covers the MOS layer and includes a
transparent photocatalytic material, wherein the transparent
photocatalytic material blocks ultraviolet light from reaching the
MOS layer. The first electrode layer is electrically connected to
the source or the drain.
Inventors: |
Chou; Cheng-Wei; (Tainan
County, TW) ; Lu; Hsueh-Hsing; (Hsinchu County,
TW) ; Ting; Hung-Che; (Taipei City, TW) ;
Shih; Tsung-Hsiang; (Yilan County, TW) ; Chen;
Chia-Yu; (Hsinchu County, TW) |
Assignee: |
AU OPTRONICS CORPORATION
Hsinchu
TW
|
Family ID: |
44352975 |
Appl. No.: |
12/753098 |
Filed: |
April 1, 2010 |
Current U.S.
Class: |
257/59 ; 257/43;
257/E21.411; 257/E33.013; 257/E33.053; 438/158; 438/29;
977/773 |
Current CPC
Class: |
H01L 27/1225 20130101;
H01L 29/7869 20130101 |
Class at
Publication: |
257/59 ; 438/29;
438/158; 977/773; 257/43; 257/E33.013; 257/E33.053;
257/E21.411 |
International
Class: |
H01L 33/00 20100101
H01L033/00; H01L 21/336 20060101 H01L021/336 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 10, 2010 |
TW |
99104156 |
Claims
1. A pixel structure, comprising: a substrate; a gate, disposed on
the substrate; an insulation layer, covering the gate; a metal
oxide semiconductor (MOS) layer, disposed on the insulation layer
above the gate; a source and a drain, disposed on the MOS layer; at
least one film layer, covering the MOS layer, wherein the film
layer comprises a photocatalytic material, and the photocatalytic
material blocks a ultraviolet light from reaching the MOS layer;
and a first electrode layer, electrically connected to the source
or the drain.
2. The pixel structure according to claim 1, wherein the film layer
comprises a first passivation layer, the first passivation layer
covers the source and the drain, the first electrode layer is
disposed on the first passivation layer, and the first passivation
layer comprises the photocatalytic material.
3. The pixel structure according to claim 1, wherein the film layer
comprises: a first passivation layer, covering the source and the
drain; and a second passivation layer, disposed on the first
passivation layer, and exposing the first electrode layer, wherein
at least one of the first passivation layer and the second
passivation layer comprises the photocatalytic material.
4. The pixel structure according to claim 1, wherein the film layer
comprises: an etch stop layer, disposed on a surface of the MOS
layer; a first passivation layer, covering the source and the drain
and the etch stop layer; and a second passivation layer, disposed
on the first passivation layer, and exposing the first electrode
layer, wherein at least one of the etch stop layer, the first
passivation layer, and the second passivation layer comprises the
photocatalytic material.
5. The pixel structure according to claim 1, wherein the
photocatalytic material comprises insulating metal oxide or metal
oxide nanoparticles.
6. The pixel structure according to claim 5, wherein the insulating
metal oxide comprises one or a combination of TiOx, TiSiOx, ZnOx,
SnOx, ZrOx, CdS, and ZnS.
7. The pixel structure according to claim 5, wherein the metal
oxide nanoparticles comprises one or a combination of TiOx
nanoparticles, TiSiOx nanoparticles, ZnOx nanoparticles, SnOx
nanoparticles, ZrOx nanoparticles, CdS nanoparticles, and ZnS
nanoparticles.
8. The pixel structure according to claim 1 further comprising; a
light-emitting material layer, disposed on the first electrode
layer; and a second electrode layer, disposed on the light-emitting
material layer.
9. The pixel structure according to claim 1, wherein the
photocatalytic material blocks light with a wavelength of about 170
to about 350 nm.
10. A method of fabricating a pixel structure, comprising: forming
a gate on a substrate; forming an insulation layer on the gate;
forming a MOS layer on the insulation layer above the gate; forming
a source and a drain on the MOS layer; forming at least one film
layer on the source and the drain, and covering the MOS layer,
wherein the film layer comprises a photocatalytic material, and the
photocatalytic material blocks an ultraviolet light from reaching
the MOS layer; and forming a first electrode layer, electrically
connected to the source or the drain.
11. The fabricating method according to claim 10, wherein the
photocatalytic material blocks light with a wavelength of about 170
to about 350 nm.
12. The fabricating method according to claim 10 further comprising
performing an ultraviolet cleaning procedure on a surface of the
first electrode layer.
13. The fabricating method according to claim 12, wherein the
ultraviolet cleaning procedure comprises supplying ozone and
irradiating with an ultraviolet light, and a wavelength of the
ultraviolet light is about 172 nm.
14. The fabricating method according to claim 10, wherein the step
of forming the film layer comprises: forming a first passivation
layer on the source and the drain, and covering the MOS layer,
wherein the first passivation layer comprises the photocatalytic
material; and patterning the first passivation layer to form a
contact window opening in the first passivation layer to expose the
source or the drain, wherein the first electrode layer is filled in
the contact window opening to be electrically connected to the
source or the drain.
15. The fabricating method according to claim 10, wherein the step
of forming the film layer comprises: forming a first passivation
layer on the source and the drain, and covering the MOS layer;
patterning the first passivation layer to form a contact window
opening in the first passivation layer to expose the source or the
drain, wherein the first electrode layer is filled in the contact
window opening to be electrically connected to the source or the
drain; forming a second passivation layer on the first passivation
layer, and covering the first electrode layer; and patterning the
second passivation layer to expose the first electrode layer,
wherein at least one of the first passivation layer and the second
passivation layer comprises the photocatalytic material.
16. The fabricating method according to claim 10, wherein the step
of forming the film layer comprises: forming an etch stop layer on
a surface of the MOS layer; forming a first passivation layer on
the source and the drain, and covering the MOS layer; patterning
the first passivation layer to form a contact window opening in the
first passivation layer to expose the source or the drain, wherein
the first electrode layer is filled in the contact window opening
to be electrically connected to the source or the drain; forming a
second passivation layer on the first passivation layer, and
covering the first electrode layer; and patterning the second
passivation layer to expose the first electrode layer, wherein at
least one of the etch stop layer, the first passivation layer, and
the second passivation layer comprises the photocatalytic
material.
17. The fabricating method according to claim 10, wherein the
photocatalytic material comprises insulating metal oxide or metal
oxide nanoparticles.
18. The fabricating method according to claim 17, wherein the
insulating metal oxide comprises one or a combination of TiOx,
TiSiOx, ZnOx, SnOx, ZrOx, CdS, and ZnS.
19. The fabricating method according to claim 17, wherein the metal
oxide nanoparticles comprises one or a combination of TiOx
nanoparticles, TiSiOx nanoparticles, ZnOx nanoparticles, SnOx
nanoparticles, ZrOx nanoparticles, CdS nanoparticles, and ZnS
nanoparticles.
20. The fabricating method according to claim 10 further
comprising: forming a light-emitting material layer on the first
electrode layer; and forming a second electrode layer on the
light-emitting material layer.
21. A method of fabricating an electronic device, comprising:
forming a plurality of pixel structures on a substrate, wherein
each of the pixel structures is fabricated through the fabricating
method in claim 10; forming a sealant on a surface of the
substrate; forming a cover on the substrate, wherein the cover
shelters the pixel structures and is in contact with the sealant;
and performing an ultraviolet curing procedure to cure the
sealant.
22. The fabricating method according to claim 21, wherein a
wavelength of an ultraviolet light used in the ultraviolet curing
procedure is about 313 nm.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 99104156, filed on Feb. 10, 2010. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention generally relates to a pixel
structure, and more particularly, to a pixel structure, a method of
fabricating the pixel structure, and a method of fabricating an
electronic device having the pixel structure.
[0004] 2. Description of Related Art
[0005] An electroluminescence apparatus is a self-emissive
apparatus. The electroluminescence apparatus offers unlimited
viewing angles, low fabricating cost, high response rate (over a
hundred times of that of liquid crystal), low power consumption,
adaptability to direct current (DC) driving of portable equipments,
large operating temperature range, and light weight, and the size
and thickness thereof can be reduced according to those of the
corresponding hardware equipment. Accordingly, the
electroluminescence apparatus is a very promising technique and is
about to become one of the next-generation flat panel displays.
[0006] For example, an active electroluminescence apparatus
includes a plurality of pixel structures, and each of the pixel
structures includes an active device and a light emitting device
electrically connected to the active device. The active device may
be a thin film transistor (TFT), and which includes a gate, a
source and a drain, and a semiconductor layer. The light emitting
device is composed of an upper electrode layer, a lower electrode
layer, and a light emitting layer disposed between the two
electrode layers. The lower electrode layer of the light emitting
device is electrically connected to the source or the drain of the
active device so that the active device is served as a switch that
controls the light emitting device.
[0007] During the fabrication of a pixel structure, after the lower
electrode layer is formed on the active device, the surface of the
lower electrode layer is usually cleaned to remove contaminant by
using ultraviolet light and ozone. However, the device
characteristics of the active device may be deteriorated when the
ultraviolet light is irradiated on the semiconductor layer of the
active device. As a result, the device characteristics of the pixel
structure and the electroluminescence apparatus are also
affected.
SUMMARY OF THE INVENTION
[0008] Accordingly, the present invention is directed to a pixel
structure, wherein the pixel structure is prevented from
deteriorating when it is irradiated by ultraviolet light.
[0009] The present invention is also directed to a method of
fabricating a pixel structure, wherein the pixel structure is
prevented from deteriorating when it is irradiated by ultraviolet
light.
[0010] The present invention is further directed to a method of
fabricating an electronic device, wherein the electronic device has
good device characteristics.
[0011] The present invention provides a pixel structure including a
substrate, a gate, an insulation layer, a metal oxide semiconductor
(MOS) layer, a source and a drain, at least one film layer, and a
first electrode layer. The gate is disposed on the substrate. The
insulation layer covers the gate. The MOS layer is disposed on the
insulation layer above the gate. The source and the drain are
disposed on the MOS layer. The film layer covers the MOS layer. The
film layer includes a transparent photocatalytic material, wherein
the transparent photocatalytic material blocks an ultraviolet light
from reaching the MOS layer. The first electrode layer is
electrically connected to the source or the drain.
[0012] The present invention also provides a method of fabricating
a pixel structure. First, a gate is formed on a substrate. Then, an
insulation layer is formed on the gate. Next, a MOS layer is formed
on the insulation layer above the gate. After that, a source and a
drain are formed on the MOS layer. Next, at least one film layer is
formed. The film layer covers the MOS layer and includes a
transparent photocatalytic material, wherein the transparent
photocatalytic material blocks an ultraviolet light from reaching
the MOS layer. Thereafter, a first electrode layer is formed,
wherein the first electrode layer is electrically connected to the
source or the drain.
[0013] The present invention further provides a method of
fabricating an electronic device. First, a plurality of pixel
structures is formed on a substrate, wherein each of the pixel
structures is fabricated through the method described above. Then,
a sealant is formed on the surface of the substrate. Next, a cover
is formed on the substrate, wherein the cover shelters the pixel
structures and is in contact with the sealant. After that, an
ultraviolet curing procedure is performed to cure the sealant.
[0014] As described above, in the present invention, a film layer
including a transparent photocatalytic material is formed on a MOS
layer so that the MOS layer is protected from the irradiation of
ultraviolet light. Thereby, the pixel structure is prevented from
deteriorating under the irradiation of the ultraviolet light, and
accordingly the pixel structure and an electronic device having the
same can have good device characteristics.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0016] FIG. 1 is a cross-sectional diagram of a pixel structure
according to an embodiment of the present invention.
[0017] FIG. 2 is a cross-sectional diagram of a pixel structure
according to another embodiment of the present invention.
[0018] FIG. 3 is an equivalent circuit diagram of a pixel array
according to an embodiment of the present invention.
[0019] FIG. 4 is a diagram of an electronic device according to an
embodiment of the present invention.
[0020] FIG. 5 is a diagram of an electronic device according to
another embodiment of the present invention.
[0021] FIGS. 6A-6F are cross-sectional diagrams illustrating a
method of fabricating the pixel structure in FIG. 2.
[0022] FIGS. 7A-7C are cross-sectional diagrams illustrating a
method of fabricating an electronic device.
DESCRIPTION OF THE EMBODIMENTS
[0023] Reference will now be made in detail to the present
preferred embodiments of the invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0024] FIG. 1 is a cross-sectional diagram of a pixel structure
according to an embodiment of the present invention. Referring to
FIG. 1, the pixel structure 100 includes a substrate 102, a gate
112, an insulation layer 120, a metal oxide semiconductor (MOS)
layer 130, a source 134 and a drain 136, a first passivation layer
140, and a first electrode layer 162. The gate 112, the MOS layer
130, the source 134, and the drain 136 form an active device 110.
To be specific, the gate 112 is disposed on the substrate 102. The
insulation layer 120 covers the gate 112. The MOS layer 130 is
disposed on the insulation layer 120 above the gate 112. The source
134 and the drain 136 are disposed on the MOS layer 130. The first
passivation layer 140 is disposed on the source 134 and the drain
136 and covers the MOS layer 130. In the present embodiment, the
MOS layer 130 may be made of indium-gallium-zinc oxide (IGZO),
indium-zinc oxide (IZO), gallium-zinc oxide (GZO), zinc-tin oxide
(ZTO), or zinc oxide (ZnO).
[0025] As shown in FIG. 1, in the present embodiment, the pixel
structure 100 further includes a light-emitting material layer 164,
a second electrode layer 166, and a second passivation layer 150.
The first electrode layer 162, the light-emitting material layer
164, and the second electrode layer 166 form a light emitting
device 160. To be specific, the first electrode layer 162 is
disposed on the first passivation layer 140, and the first
electrode layer 162 may be electrically connected to the source 134
through a contact window opening 142 in the first passivation layer
140. The second passivation layer 150 is disposed on the first
passivation layer 140 and has an opening 152 for exposing the first
electrode layer 162. The light-emitting material layer 164 may be
disposed on the first electrode layer 162 exposed by the opening
152. The second electrode layer 166 covers the light-emitting
material layer 164 and is extended onto the surface of the second
passivation layer 150. It should be noted that in the present
embodiment, the first electrode layer 162 is electrically connected
to the source 134 through the contact window opening 142 in the
first passivation layer 140. However, in other embodiments, the
first electrode layer 162 may also be electrically connected to the
drain 136 through a contact window opening (not shown) in the first
passivation layer 140.
[0026] In the present embodiment, the first electrode layer 162 may
be a metal electrode layer or a transparent conductive layer. The
light-emitting material layer 164 may be an organic light emitting
layer or an inorganic light emitting layer. For example, the
light-emitting material layer 164 may be a red organic light
emitting pattern, a green organic light emitting pattern, a blue
organic light emitting pattern, or a light emitting pattern of
other color (for example, white, orange, and purple, etc) produced
by mixing lights of various wavelengths. The second electrode layer
166 may be a metal electrode layer or a transparent conductive
layer.
[0027] It should be noted that in the present embodiment, at least
one of the first passivation layer 140 and the second passivation
layer 150 includes a transparent photocatalytic material, wherein
the transparent photocatalytic material blocks an ultraviolet light
with a wavelength of about 170 to about 350 nm from reaching the
MOS layer 130. The transparent photocatalytic material includes
insulating metal oxide or metal oxide nanoparticles, wherein the
insulating metal oxide may be TiOx, TiSiOx, ZnOx, SnOx, ZrOx, CdS,
or ZnS, and the metal oxide nanoparticles may be TiOx
nanoparticles, TiSiOx nanoparticles, ZnOx nanoparticles, SnOx
nanoparticles, ZrOx nanoparticles, CdS nanoparticles, or ZnS
nanoparticles. Namely, the film layer containing the transparent
photocatalytic material may be insulating metal oxide or an
insulating material containing metal oxide nanoparticles.
[0028] In the present embodiment, at least one of the first
passivation layer 140 and the second passivation layer 150 includes
the transparent photocatalytic material. However, the pixel
structure 100 may have another film layer that includes the
transparent photocatalytic material. For example, as shown in FIG.
2, according to another embodiment of the present invention, the
pixel structure 100 further includes an etch stop layer 132. The
etch stop layer 132 is disposed on the surface of the MOS layer
130, and the first passivation layer 140 covers the source 134 and
the drain 136 and the etch stop layer 132. In the embodiment
illustrated in FIG. 2, at least one of the etch stop layer 132, the
first passivation layer 140, and the second passivation layer 150
includes the transparent photocatalytic material. Moreover, in
other embodiments, the film layer including the transparent
photocatalytic material may also be other insulating film layer
that covers the MOS layer 130. Furthermore, even though a pixel
structure 100 having the light-emitting material layer 164 is
described as an example in foregoing embodiments, in other
embodiments, the pixel structure may also come without the
light-emitting material layer and be applied in a device requiring
no light-emitting material layer, such as a device in the active
array substrate of a liquid crystal display (LCD).
[0029] In the embodiment described above, deterioration of device
characteristics (for example, increase of an off current and
shifting of a threshold voltage, etc) when ultraviolet light is
irradiated on the MOS layer is prevented by forming a film layer
including a transparent photocatalytic material on the MOS layer.
Accordingly, the pixel structure can have good device
characteristics.
[0030] It should be mentioned that substantially the pixel
structure 100 illustrated in FIG. 1 and FIG. 2 can be further
integrated with an active device and a capacitor to form a pixel
unit, and a plurality of the pixel units can form a pixel array.
FIG. 3 is an equivalent circuit diagram of a pixel array according
to an embodiment of the present invention.
[0031] Referring to FIG. 3, the pixel array 20 is disposed on the
substrate 102. The pixel array 20 includes a plurality of pixel
units 22. Each of the pixel units 22 includes the pixel structure
100 as shown in FIG. 1 or FIG. 2, an active device T, and a
capacitor CS. According to an embodiment of the present invention,
the pixel array 20 further includes a plurality of scan lines SL, a
plurality of data lines DL, and a plurality of power lines PL. Each
of the pixel units 22 is electrically connected to the
corresponding scan line SL, the corresponding data line DL, and the
corresponding power line PL. To be specific, in the present
embodiment, each pixel unit 22 includes the active devices 110 and
T, the light emitting device 160, and the capacitor CS. The active
device 110 includes a gate 112, a MOS layer 130, a source 134, and
a drain 136 (referring to FIG. 1 and FIG. 2). The light emitting
device 160 includes a first electrode layer 162, a light-emitting
material layer 164, and a second electrode layer 166 (referring to
FIG. 1 and FIG. 2). The active device T and the capacitor CS have
the structures well known to those having ordinary knowledge in the
art therefore will not be described herein. Additionally, in the
present embodiment, each pixel unit 22 has two active devices and
one capacitor (2T1C). However, the present invention is not limited
thereto, and the numbers of active devices and capacitors in each
pixel unit 22 are not limited in the present invention.
[0032] In the present embodiment, in each pixel unit 22 having the
2T1C structure, the source S of the active device T is connected to
a data line DL, the gate G thereof is electrically connected to a
scan line SL, and the drain D thereof is connected to the gate 112
of the active device 110. The gate 112 of the active device 110 is
electrically connected to the drain D of the active device T, the
source 134 thereof is electrically connected to a power line PL,
and the drain 136 thereof is electrically connected to the light
emitting device 160. One end of the capacitor CS is electrically
connected to the drain D of the active device T and the gate of the
active device 110, and the other end of the capacitor CS is
electrically connected to the source 134 of the active device 110
and a power line PL.
[0033] Generally speaking, a sealing procedure is performed to form
an electronic device after the pixel array 20 is fabricated on the
substrate 102. FIG. 4 is a diagram of an electronic device
according to an embodiment of the present invention. Referring to
FIG. 4, the electronic device 10 includes a pixel array 20
including a plurality of the pixel structure 100 illustrated in
FIG. 1 and FIG. 2, a sealant 30, and a cover 32. In the electronic
device 10 of the present embodiment, the sealant 30 may be an
ultraviolet curing adhesive, and the cover 32 may be a glass cover,
a plastic cover, or a cover in other transparent material. In the
present embodiment, since the pixel structure 100 has the
light-emitting material layer 164, the electronic device 10 having
the pixel structure 100 may be an electroluminescence apparatus.
However, as described above, the pixel structure in the present
invention may also come without the light-emitting material layer,
so that the pixel structure may also be applied to other types of
electronic devices. Additionally, in another embodiment, as shown
in FIG. 5, a passivation film 40 may also be formed on the pixel
array 20 illustrated in FIG. 3, so as to form an electronic device
10a.
[0034] In the embodiment described above, deterioration of device
characteristics (for example, increase of an off current and
shifting of a threshold voltage, etc) when ultraviolet light is
irradiated on the MOS layer is prevented by forming a film layer
including a transparent photocatalytic material on the MOS layer.
Accordingly, the pixel structure, a pixel array having such pixel
structures, and an electronic device having such pixel structures
can all have good device characteristics.
[0035] The method of fabricating the pixel structure in the present
invention will be described herein. The method of fabricating the
pixel structure in FIG. 1 is similar to that of fabricating the
pixel structure in FIG. 2, and the major difference between the two
methods is that no etch stop layer is formed in the method of
fabricating the pixel structure in FIG. 1. Below, the method of
fabricating the pixel structure in FIG. 2 will be described as an
example, and the method of fabricating the pixel structure in FIG.
1 will not be described.
[0036] FIGS. 6A-6E are cross-sectional diagrams illustrating a
method of fabricating the pixel structure in FIG. 2. Referring to
FIG. 6A, first, a gate 112 is formed on a substrate 102. Then, an
insulation layer 120 is formed on the gate 112. The substrate 102
may be a rigid substrate (for example, a glass substrate) or a
flexible substrate (for example, a plastic substrate). The gate 112
may be made of a metal material and formed by physical vapor
deposition (PVD). Next, an insulation layer 120 is formed on the
gate 112. The insulation layer 120 may be made of silicon nitride
or silicon oxide.
[0037] Referring to FIG. 6B, next, a MOS layer 130 is formed on the
insulation layer 120 above the gate 112. The MOS layer 130 may be
made of IGZO. After that, an etch stop layer 132 is formed on the
MOS layer 130. Then, a source 134 and a drain 136 are formed on the
MOS layer 130. The source 134 and the drain 136 may be made of a
metal material and formed by PVD.
[0038] Referring to FIG. 6C, thereafter, a first passivation
material layer (not shown) is formed on the source 134 and the
drain 136, and the MOS layer 130 is covered. Next, the first
passivation material layer is patterned to form a first passivation
layer 140 having a contact window opening 142, wherein the contact
window opening 142 may expose the source 134. After that, a first
electrode layer 162 is formed, and the first electrode layer 162 is
filled in the contact window opening 142 to be electrically
connected with the source 134. The first electrode layer 162 may be
a metal electrode layer or a transparent conductive layer.
[0039] Referring to FIG. 6D, next, a second passivation material
layer (not shown) is formed on the first passivation layer 140, and
the first electrode layer 162 is covered. After that, the second
passivation material layer is patterned to form a second
passivation layer 150 having an opening 152, wherein the opening
152 exposes the first electrode layer 162.
[0040] In the present embodiment, at least one of the etch stop
layer 132, the first passivation layer 140, and the second
passivation layer 150 includes a transparent photocatalytic
material, wherein the transparent photocatalytic material blocks an
ultraviolet light with a wavelength of about 170 to about 350 nm
from reaching the MOS layer 130. The transparent photocatalytic
material includes insulating metal oxide or metal oxide
nanoparticles, wherein the insulating metal oxide may be TiOx,
TiSiOx, ZnOx, SnOx, ZrOx, CdS, or ZnS, and the metal oxide
nanoparticles may be TiOx nanoparticles, TiSiOx nanoparticles, ZnOx
nanoparticles, SnOx nanoparticles, ZrOx nanoparticles, CdS
nanoparticles, or ZnS nanoparticles. Namely, a film layer including
the transparent photocatalytic material may be insulating metal
oxide or an insulating material containing metal oxide
nanoparticles.
[0041] Referring to FIG. 6E, thereafter, an ultraviolet cleaning
procedure UV1 is performed on the surface of the first electrode
layer 162 to remove contaminant on the surface. In the present
embodiment, the ultraviolet cleaning procedure UV1 includes
supplying ozone and irradiating with an ultraviolet light, wherein
the wavelength of the ultraviolet light is about 172 nm. However,
the wavelength of the ultraviolet light is not limited thereto, and
which can be changed by a designer according to the actual
requirement. It should be noted that because at least one of the
etch stop layer 132, the first passivation layer 140, and the
second passivation layer 150 includes a transparent photocatalytic
material, the ultraviolet light used during the ultraviolet
cleaning procedure UV1 is prevented from irradiating the MOS layer
130.
[0042] Referring to FIG. 6F, a light-emitting material layer 164 is
formed on the first electrode layer 162 and a second electrode
layer 166 is formed on the light-emitting material layer 164. By
now, the fabrication of the pixel structure 100 is completed. The
light-emitting material layer 164 may be an organic light emitting
layer or an inorganic light emitting layer, and which may be filled
in the opening 152 of the second passivation layer 150. The second
electrode layer 166 may be a metal electrode layer or a transparent
conductive layer. The second electrode layer 166 covers the
light-emitting material layer 164 and is extended onto the surface
of the second passivation layer 150.
[0043] Generally speaking, a sealing procedure is further performed
to complete the fabrication of the electronic device after a
plurality of pixel structures 100 is formed on the substrate 102
through the process described above. Below, the process of
fabricating the electronic device will be described with reference
to FIGS. 7A-7C.
[0044] FIGS. 7A-7C are cross-sectional diagrams illustrating a
method of fabricating an electronic device. Referring to FIG. 7A,
first, a plurality of pixel structures 100 is formed on a substrate
102 through the process illustrated in FIGS. 6A-6F, so as to form a
pixel array 20. As illustrated in FIG. 3 and described above, the
pixel array 20 includes a plurality of pixel structures 100 and
capacitors CS, active devices T, data lines DL, scan lines SL, and
power lines PL. Since the techniques of fabricating the capacitors
CS, the active devices T, the data lines DL, the scan lines SL, and
the power lines PL are well known to those having ordinary
knowledge in the art therefore will not be described herein.
[0045] Referring to FIG. 7B, then, a sealant 30 is formed on the
surface of the substrate 102. In the present embodiment, the
sealant 30 may be an ultraviolet curing adhesive.
[0046] Referring to FIG. 7C, next, a cover 32 is formed on the
substrate 102, wherein the cover 32 shelters the pixel structures
(i.e., the pixel array 20) and is in contact with the sealant 30.
The cover 32 may be a glass cover, a plastic cover, or a cover of
other transparent material.
[0047] Thereafter, an ultraviolet curing procedure UV2 is performed
to cure the sealant 30, so as to form the electronic device 10. In
the present embodiment, the ultraviolet light used in the
ultraviolet curing procedure UV2 has a wavelength of about 313 nm.
However, the wavelength of the ultraviolet light is not limited
thereto, and which can be changed by a designer according to the
actual requirement. It should be noted that because at least one of
the etch stop layer 132, the first passivation layer 140, and the
second passivation layer 150 in the pixel structure 100 includes a
transparent photocatalytic material, the ultraviolet light used
during the ultraviolet curing procedure UV2 is prevented from
irradiating the MOS layer 130.
[0048] In the present embodiment, the ultraviolet light used in the
ultraviolet cleaning procedure, the ultraviolet curing procedure,
or other procedures is prevented from irradiating the MOS layer by
forming a film layer including a transparent photocatalytic
material on the MOS layer. Accordingly, deterioration of device
characteristics (for example, increase of an off current and
shifting of a threshold voltage, etc) caused by the irradiation of
the ultraviolet light on the MOS layer is prevented. Thus, the
pixel structure and the electronic device having such pixel
structures can have good device characteristics.
[0049] As described above, in the present invention, a film layer
including a transparent photocatalytic material is formed on a MOS
layer so that the MOS layer is protected from the irradiation of
ultraviolet light. Thereby, the pixel structure is prevented from
deteriorating under the irradiation of the ultraviolet light, and
accordingly the pixel structure and an electronic device having the
same can have good device characteristics.
[0050] In addition, in the present invention, ultraviolet light is
blocked and accordingly the MOS layer is protected by changing the
material of a film layer, such as an etch stop layer or a
passivation layer. Namely, according to the present invention, no
additional structure is to be formed in the pixel structure. Thus,
the pixel structure in the present invention can be applied to an
existing pixel structure layout and can be fabricated by using
existing pixel structure fabricating process and machine. Thereby,
the fabricating cost of the pixel structure in the present
invention is not increased.
[0051] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *