U.S. patent application number 12/830587 was filed with the patent office on 2011-07-14 for heat-dissipating plate.
This patent application is currently assigned to COOLER MASTER CO., LTD.. Invention is credited to CHANG-YIN CHEN, CHUN-HUNG LIN.
Application Number | 20110168359 12/830587 |
Document ID | / |
Family ID | 44257612 |
Filed Date | 2011-07-14 |
United States Patent
Application |
20110168359 |
Kind Code |
A1 |
LIN; CHUN-HUNG ; et
al. |
July 14, 2011 |
HEAT-DISSIPATING PLATE
Abstract
A heat-dissipating plate includes a casing and partition insert.
The casing has surrounding walls with wick structures therein, and
the inner surface of the walls defines a receiving compartment. The
partition is disposed in the receiving compartment. The partition
has a plurality of hole, a plurality of flanges protruding from an
edge of the holes respectively. Each of flanges has a plurality of
arc-shaped flange-rim extending outward to support the inner
surface of the surrounding wall.
Inventors: |
LIN; CHUN-HUNG; (TAIPEI
HSIEN, TW) ; CHEN; CHANG-YIN; (TAIPEI HSIEN,
TW) |
Assignee: |
COOLER MASTER CO., LTD.
TAIPEI HSIEN
TW
|
Family ID: |
44257612 |
Appl. No.: |
12/830587 |
Filed: |
July 6, 2010 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28F 1/40 20130101; F28D 15/046 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 8, 2010 |
TW |
99200301 |
Claims
1. A heat-dissipating plate, comprising: a casing having
surrounding walls, wherein the walls are formed with wick structure
therein, wherein the inner surface of the walls defines a receiving
compartment; and a partition being disposed in the receiving
compartment, wherein the partition has a plurality of holes and a
plurality of flanges protruding from an edge of the holes
respectively, wherein each of the flanges has at least one
arc-shaped flange-rim expanded outward therefrom to prop the inner
surface of the surrounding wall of the casing.
2. The heat-dissipating plate of claim 1, wherein the casing is
flattened-shaped.
3. The heat-dissipating plate of claim 1, wherein the partition is
a copper plate having a net-structure on the surface.
4. The heat-dissipating plate of claim 1, wherein the flanges are
formed by a punching method to the partition.
5. The heat-dissipating plate of claim 1, wherein the flanges
protrude toward either side of the partition surface.
6. A heat-dissipating plate, comprising: a casing having
surrounding walls, wherein the walls are formed with wick structure
therein, wherein the inner surface of the walls defines a receiving
compartment; a partition being disposed in the receiving
compartment, wherein the partition has a plurality of holes and a
plurality of flanges protruding from an edge of the holes
respectively, wherein each of the flanges has at least one
arc-shaped flange-rim expanding outward therefrom; and a plurality
of conductive-columns assembled in the holes, wherein each
conductive column has a top and a bottom end to respectively prop
the walls of the casing.
7. The heat-dissipating plate of claim 6, wherein the casing is
flattened-shaped.
8. The heat-dissipating plate of claim 6, wherein the partition is
a copper plate having a net-structure.
9. The heat-dissipating plate of claim 6, wherein the flanges are
formed by a punching method on the partition.
10. The heat-dissipating plate of claim 6, wherein the flanges
protrude toward either side of the partition surface.
11. The heat-dissipating plate of claim 6, wherein the
conductive-columns are formed with wick structure.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat-dissipating plate,
and more particularly to a novel heat-dissipating device including
flattened tube coupled to a plate structure having stamped holes to
achieve good thermal conductivity.
[0003] 2. Description of Related Arts
[0004] A Flat heat pipe is usually made of copper sheet and
configured into closed hollow casing, in which the hollow portion
is vacuum and filled with working fluids. A wick structure is
formed on an inner wall of the casing. However, during the
vacuuming process, it is difficult to control the plane surface of
the heat pipe. Thus, a supporting structure is usually inserted
into the hollow casing to maintain the plane surface of the heat
pipe. Some conventional supporting structure uses a copper net
having a wavy-shaped supporting surface formed thereon to support
the upper and the bottom walls of the hollow casing. Other
conventional supporting structures employ a plurality of supporting
columns fixed therein.
[0005] However, the copper net requires treatments to form a
plurality of wavy supporting structure thereon to be used as a
supporting structure. Thus, the required manufacturing process
becomes more complex. On the other had, if supporting columns are
used as the supporting structure, a soldering process is required
to couple the columns to an upper and a lower wall of the heat
pipe. The coupling process is also inconvenient and incurs high
production costs.
[0006] Because of the technical limitations described above, the
applicant strives via experience and academic research to develop
the instant disclosure, which can effectively improve the
limitations described above.
SUMMARY OF THE INVENTION
[0007] The main object of the present invention is to provide a
heat-dissipating plate, which includes a partition being punched,
and a flattened casing received the partition therein.
[0008] Another object of the present invention is to provide the
partition which is punched to form a plurality of arc-shaped
flanges. The flanges are expanded outward to support an inner wall
of the casing for a well thermal-conductivity.
[0009] One more object of the present invention is to provide the
partition having the flanges, which is arc-shaped and expanded
outward, so that it will not damage the casing.
[0010] A further object of the present invention is to provide the
partition having the arc-shaped and outward-expanding flanges,
which assembled with a plurality of conductive-columns to prop the
inner wall of the casing, thus achieving well
thermal-conductivity.
[0011] Through the above-mentioned assembly, the present invention
can alter the specification pattern to achieve the purpose of being
suitable for various mounting holes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an exploded perspective view of first embodiment
according to the present invention;
[0013] FIG. 2 is a partial perspective view of a partition of the
first embodiment according to the present invention;
[0014] FIG. 3 is a side view of the partition of the first
embodiment according to the present invention;
[0015] FIG. 4 is a cross-sectional view of the first embodiment
before flattened according to the present invention;
[0016] FIG. 5 is a cross-sectional view of the first embodiment
after flattened according to the present invention;
[0017] FIG. 6 is an exploded perspective view of second embodiment
according to the present invention;
[0018] FIG. 7 is a partial perspective view of a partition and
conductive-columns of the second embodiment according to the
present invention;
[0019] FIG. 8 is a side view of the partition and the
conductive-columns of the second embodiment according to the
present invention;
[0020] FIG. 9 is a cross-sectional view of the second embodiment
before flattened according to the present invention; and
[0021] FIG. 10 is a cross-sectional view of the second embodiment
after flattened according to the present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0022] The features and technology of the present invention can be
further understood by reference to the following detailed
description when taken in conjunction with the accompanying
drawings, and the accompanying drawings are provided only for
reference and illustration and not for limiting the present
invention.
[0023] FIG. 1 shows a first embodiment according to the instant
disclosure. The instant disclosure is a heat-dissipating plate 1
including a casing 11 and a partition 12.
[0024] The casing 11 has surrounding walls 111. The walls 111 are
formed with a wick structure 111a therein. The inner surface of the
walls 111 defines a receiving compartment 112. A working fluid,
such as water . . . etc., is filled in the receiving compartment
112.
[0025] The partition 12 is a plate-like insert layer disposed in
the receiving compartment 112, and is formed with a plurality of
holes 121 on the surface. The holes 121 are densely distributed on
the surface of the partition 12, forming a net-like structure. The
partition 12 is made of metals of good conductivity, such as
copper.
[0026] Please refer to FIGS. 2 and 3. The partition 12 has a
plurality of flange 122 protruding from the edge of the holes 121.
A preferable way to form the flanges 122 is by punching the
partition 12. The flanges 122 could protrude toward either side of
the partition. Each of the flanges 122 has flange-rims 122a
expanded outward from an outer rim thereof. The flange-rims 122a
are arc-shaped and pressed against the surrounding walls 111 of the
casing upon installation. In the instant embodiment shown in FIGS.
2 and 3, the flanges 122 are protruded from the whole edge of the
holes 121, and is substantially divided into four pieces. However,
the flanges could protrude from partial edge of the holes 121. In
other words, the flanges also could protrude from the edge of the
holes 121 in two or more opposite pieces.
[0027] When the heat-dissipating plate 1 is attached to a
heat-producing element (not shown), the inner wall 111 at a bottom
(one lateral side) can quickly transfer the heat to the flanges 122
on one side of the partition. The heat is then transferred to each
of the flange-rims 122a, and finally to the surrounding walls 111
of the casing 11, achieving good heat-dissipating efficiency.
Further, the holes 121 would provide passage for the working fluid,
such as water vapor. Thus, the structure of the present disclosure
is concise, the manufacturing process is simple, and the production
coast is reduced.
[0028] Please refer to FIG. 4. The casing 11 could be a flattened
elliptic tube. The partition 12 can be disposed directly in the
receiving compartment 112 of the flattened elliptic tube. The
elliptic tube is then flattened, vacuumed, filled with working
fluid, and finally sealed to complete the heat-dissipating plate
structure. As shown in FIG. 5, the elliptic tube is processed into
a flat-shaped casing enclosing the partition. Because the
protruding flanges 122 have rounded arc-shaped flange-rims 122a,
the inner walls of the casing 11 will not be damaged when pressed
against the partition 12.
[0029] Please refer to FIG. 6, a second embodiment according to the
present invention is shown. The instant disclosure includes a
casing 11, a partition 12 and a plurality of conductive-columns 13
disposed against the inner wall of the flanges 122.
[0030] The casing 11 has surrounding walls 111. The walls are
formed with a wick structure 111a on an inner surface thereof. The
inner surface of the walls 111 defines a receiving compartment
112.
[0031] As shown in FIGS. 7 and 8, the partition 12 is a plate-like
insert layer disposed in the receiving compartment 112 identical to
the first embodiment. The partition 12 has a plurality of flanges
122 protruding from the edge of the holes 121. A preferable way to
form the flanges 122 is by punching the partition 12. The flanges
122 could protrude toward either side of the partition 12. The
flanges 122 has flange-rims 122a expanded outward from an outer rim
thereof. The flange-rims 122a are arc-shaped.
[0032] The conductive-columns 13 have wick structures around its
periphery thereon, and are disposed respectively into the holes
121. Each of the conductive-columns 13 has a top and bottom end to
prop the walls 111 of the casing 11. Because the flange-rims 122a
are arc-shaped and expanded outward, the conductive-columns 13 can
be conveniently disposed in the holes 121. Further, the
conductive-columns 13 could be disposed in all or part of the holes
121. The quantity of the conductive-columns 13 is not limited.
[0033] Therefore, after the heat-dissipating plate 1 is coupled to
a heat-producing element (not shown), the outer surface of the wall
111 on one side of the casing 11 will quickly conduct the generated
heat through each of the conductive columns 13 to the other side of
the casing, achieving effective heat dissipation.
[0034] When the columns 13 are disposed only in a portion of the
partition holes 121, the holes 121 without the conductive-columns
13 will serve as passageways for the vapor of the working fluid
generated from the heat exchange process. Thus, the structure of
this instant disclosure is simple yet effective, and the
manufacturing cost is reduced.
[0035] Another embodiment of manufacturing process, as shown in
FIG. 9. The casing 11 could be flattened elliptic tube. The
partition 12, which have conductive-columns 13 therein, could be
directly disposed in the receiving compartment 112 of the elliptic
tube. The elliptic tube is then flattened, vacuumed, filled with
working fluid, and finally sealed to complete the heat plate
structure. As shown FIG. 10, the elliptic tube 11 is processed into
a flat-shaped casing enclosing the partition. The protruding
conductive-columns 13 have rounded edges to prevent damaging the
inner walls of the casing 11 when pressed against the partition
12.
[0036] The efficacy and the characteristics of the present
invention are:
[0037] 1. The instant disclosure provides a heat-dissipating plate,
a new kind of flat heat pipe, which is inserted with the partition
to support the casing. It is easily to control the horizontal level
of the surfaces of the heat-dissipating plate. Thus, the
heat-dissipating plate can be mounted with a heat-producing element
well.
[0038] 2. The partition is a good supporter for the casing of
heat-dissipating plate, and can strengthen the heat-dissipating
plate.
[0039] 3. The manufacturing process of the heat-dissipating plate
is easier. It can be easily started from a flattened elliptic tube
as the casing, and insert the partition into the casing. Then, to
proceed to other processes for achieving the heat-dissipating
plate, such as flattening, vacuuming, infusing working fluid, and
sealing openings . . . etc.
[0040] While the present invention has been described in terms of
what is presently considered to be the most practical and preferred
embodiments, it is to be understood that the present invention
needs not be limited to the disclosed embodiment. On the contrary,
it is intended to cover various modifications and similar
arrangements included within the spirit and scope of the appended
claims which are to be accorded with the broadest interpretation so
as to encompass all such modifications and similar structures.
* * * * *