U.S. patent application number 12/964374 was filed with the patent office on 2011-06-16 for light-emitting device.
Invention is credited to Myung Hoon Jung, Sung Hoon Jung, DAE SUNG KANG.
Application Number | 20110140132 12/964374 |
Document ID | / |
Family ID | 43602350 |
Filed Date | 2011-06-16 |
United States Patent
Application |
20110140132 |
Kind Code |
A1 |
KANG; DAE SUNG ; et
al. |
June 16, 2011 |
Light-Emitting Device
Abstract
Provided are a light-emitting device, a light-emitting device
package, and a method for fabricating the light-emitting device.
The light-emitting device includes a first light-emitting
structure; an insulation layer having non-conductivity, in which a
current does not flow, on the first light-emitting structure; a
second light-emitting structure on the insulation layer; and a
common electrode simultaneously and electrically connected to the
first light-emitting structure and the second light-emitting
structure.
Inventors: |
KANG; DAE SUNG; (Seoul,
KR) ; Jung; Myung Hoon; ( Seoul, KR) ; Jung;
Sung Hoon; (Seoul, KR) |
Family ID: |
43602350 |
Appl. No.: |
12/964374 |
Filed: |
December 9, 2010 |
Current U.S.
Class: |
257/88 ;
257/E33.062 |
Current CPC
Class: |
H01L 25/0756 20130101;
H01L 2224/73265 20130101; H01L 33/38 20130101; H01L 33/08 20130101;
H01L 33/385 20130101; H01L 2224/49107 20130101; H01L 2224/48247
20130101; H01L 2224/48091 20130101; H01L 2924/00014 20130101; H01L
2224/48091 20130101 |
Class at
Publication: |
257/88 ;
257/E33.062 |
International
Class: |
H01L 33/08 20100101
H01L033/08 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 10, 2009 |
KR |
10-2009-0122752 |
Claims
1. A light-emitting device comprising: a substrate; a first
light-emitting structure on the substrate, the first light-emitting
structure comprising a first conductive type semiconductor layer, a
first active layer on the first conductive type semiconductor
layer, and a second conductive type semiconductor layer on the
first active layer; an insulation layer on the first light-emitting
structure, the insulation layer being disposed on the second
conductive type semiconductor layer; a second light-emitting
structure on the insulation layer, the second light-emitting
structure comprising a third conductive type semiconductor layer on
the insulation layer, a second active layer on the third conductive
type semiconductor layer, and a fourth conductive type
semiconductor layer on the second active layer; and a common
electrode commonly and electrically connected to the second
conductive type semiconductor layer and the third conductive type
semiconductor layer.
2. The light-emitting device of claim 1, wherein the insulation
layer includes a semiconductor material having a low carrier
concentration.
3. The light-emitting device of claim 1, further comprising a first
electrode on the first conductive type semiconductor layer and a
second electrode on the fourth conductive type semiconductor
layer.
4. The light-emitting device of claim 1, wherein the common
electrode is disposed on at least portions of top and side surfaces
of the second conductive type semiconductor layer, a side surface
of the insulation layer, and at least one portion of a side surface
of the third conductive type semiconductor layer.
5. The light-emitting device of claim 3, wherein the common
electrode is further disposed on at least one portion of a top
surface of the third conductive type semiconductor layer.
6. The light-emitting device of claim 1, wherein the common
electrode comprises a first common electrode on the second
conductive type semiconductor layer and a second common electrode
on the third conductive type semiconductor layer.
7. The light-emitting device of claim 1, wherein the common
electrode is at least one selected from the group consisting of Cu,
Au, Al, Ti, and Cr.
8. The light-emitting device of claim 1, wherein the common
electrode is connected to an external terminal having an electrical
ground state.
9. The light-emitting device of claim 3, wherein the first and
second electrodes are commonly and electrically connected to an AC
power source.
10. The light-emitting device of claim 1, wherein the first
conductive type semiconductor layer and the third conductive type
semiconductor layer comprise an N-type dopant, and the second
conductive type semiconductor layer and the fourth conductive type
semiconductor layer comprise a P-type dopant.
11. The light-emitting device of claim 1, wherein the insulation
layer has a thickness of about 10 nm to about 1,000 nm.
12. A light-emitting device comprising: a conductive support
member; a first light-emitting structure on the conductive support
member, the first light-emitting structure comprising a first
conductive type semiconductor layer on the conductive support
member, a first active layer on the first conductive type
semiconductor layer, and a second conductive type semiconductor
layer on the first active layer; an insulation layer on the first
light-emitting structure, the insulation layer being disposed on
the second conductive type semiconductor layer; a second
light-emitting structure on the insulation layer, the second
light-emitting structure comprising a third conductive type
semiconductor layer on the insulation layer, a second active layer
on the third conductive type semiconductor layer, and a fourth
conductive type semiconductor layer on the second active layer; and
a common electrode commonly and electrically connected to the
second conductive type semiconductor layer and the third conductive
type semiconductor layer.
13. The light-emitting device of claim 12, further comprising a
reflective layer containing a material, which reflects light,
between the first conductive type semiconductor layer and the
conductive support member.
14. The light-emitting device of claim 12, wherein the common
electrode is disposed on at least one portion of a side surface of
the second conductive type semiconductor layer, a side surface of
the insulation layer, and at least portions of top and side
surfaces of the third conductive type semiconductor layer.
15. The light-emitting device of claim 12, further comprising an
electrode on the fourth conductive type semiconductor layer,
wherein the conductive support member and the electrode are
commonly and electrically connected to an AC power source.
16. A light-emitting device comprising: a substrate; a first
light-emitting structure on the substrate; a common electrode layer
on the first light-emitting structure; an insulation layer on the
common electrode layer; a second light-emitting structure on the
insulation layer; and a plurality of common electrodes passing
through the insulation layer to contact a conductive type
semiconductor layer of the second light-emitting structure.
17. The light-emitting device of claim 16, wherein the common
electrode layer is disposed on an entire region of the first
light-emitting structure.
18. The light-emitting device of claim 16, wherein the common
electrodes are positioned between a bottom surface of the
conductive type semiconductor layer and a top surface of the
conductive type semiconductor layer.
19. The light-emitting device of claim 16, wherein top and side
surfaces of each of the common electrodes contact the conductive
type semiconductor layer.
20. The light-emitting device of claim 16, wherein the common
electrodes extend from the common electrode layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority under 35 U.S.C.
.sctn.119(a) of Korean Patent Application No. 10-2009-0122752 filed
on Dec. 10, 2009, which is hereby incorporated by reference in its
entirety as if fully set forth herein.
BACKGROUND
[0002] Light emitting diodes (LEDs) are semiconductor
light-emitting devices that convert current into light. As
luminance of LEDs has been recently increased, the LEDs are being
used as light sources for displays, vehicles, and illumination.
Also, LEDs emitting highly efficient white light may be realized by
using a fluorescent substance or combining LEDs having various
colors.
[0003] Since such a LED has general diode characteristics, when the
LED is connected to an alternative current (AC) power source, the
LED is repeatedly turned on/off according to a direction of the
current. Thus, the LED does not continuously generate light. In
addition, the LED may be damaged by the reverse current.
[0004] Thus, various researches are conducted in cases which an LED
is directly connected to an AC power source to facilitate use of
the LED.
SUMMARY
[0005] Exemplary embodiments may provide a light-emitting device
having a new structure.
[0006] Exemplary embodiments may also provide a light-emitting
device having an electrode structure, which is commonly connected
to at least two light-emitting structures.
[0007] Exemplary embodiments may also provide a light-emitting
device, which receives an AC power to continuously generate
light.
[0008] In one exemplary embodiment, a light-emitting device
includes: a substrate; a first light-emitting structure on the
substrate, the first light-emitting structure including a first
conductive type semiconductor layer, a first active layer on the
first conductive type semiconductor layer, and a second conductive
type semiconductor layer on the first active layer; an insulation
layer on the first light-emitting structure, the insulation layer
being disposed on the second conductive type semiconductor layer; a
second light-emitting structure on the insulation layer, the second
light-emitting structure including a third conductive type
semiconductor layer on the insulation layer, a second active layer
on the third conductive type semiconductor layer, and a fourth
conductive type semiconductor layer on the second active layer; and
a common electrode commonly and electrically connected to the
second conductive type semiconductor layer and the third conductive
type semiconductor layer.
[0009] In another exemplary embodiment, a light-emitting device
includes: a conductive support member; a first light-emitting
structure on the conductive support member, the first
light-emitting structure including a first conductive type
semiconductor layer on the conductive support member, a first
active layer on the first conductive type semiconductor layer, and
a second conductive type semiconductor layer on the first active
layer; an insulation layer on the first light-emitting structure,
the insulation layer being disposed on the second conductive type
semiconductor layer; a second light-emitting structure on the
insulation layer, the second light-emitting structure including a
third conductive type semiconductor layer on the insulation layer,
a second active layer on the third conductive type semiconductor
layer, and a fourth conductive type semiconductor layer on the
second active layer; and a common electrode commonly and
electrically connected to the second conductive type semiconductor
layer and the third conductive type semiconductor layer.
[0010] In further another embodiment, a light-emitting device
includes: a substrate; a first light-emitting structure on the
substrate; a common electrode layer on the first light-emitting
structure; an insulation layer on the common electrode layer; a
second light-emitting structure on the insulation layer; and a
plurality of common electrodes passing through the insulation layer
to contact a conductive type semiconductor layer of the second
light-emitting structure.
[0011] The details of one or more exemplary embodiments are set
forth in the accompanying drawings and the description below. Other
features will be apparent from the description and drawings, and
from the claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a sectional view of a light-emitting device
according to a first exemplary embodiment.
[0013] FIG. 2 is a plan view of the light-emitting device according
to the first exemplary embodiment.
[0014] FIG. 3 is a schematic equivalent circuit diagram
illustrating the light-emitting device of FIG. 1.
[0015] FIGS. 4 to 7 are views illustrating a process for
fabricating the light-emitting device according to the first
exemplary embodiment.
[0016] FIG. 8 is a sectional view of a light-emitting device
according to a second exemplary embodiment.
[0017] FIG. 9 is a sectional view of a light-emitting device
according to a third exemplary embodiment.
[0018] FIG. 10 is a sectional view of a light-emitting device
according to a fourth exemplary embodiment.
[0019] FIG. 11 is a sectional view of a light-emitting device
according to a fifth exemplary embodiment.
[0020] FIG. 12 is a sectional view of a light-emitting device
package including a light-emitting device according to an exemplary
embodiment.
[0021] FIG. 13 is an exploded perspective view of a display device
according to an exemplary embodiment.
[0022] FIG. 14 is a view of a display device according to an
exemplary embodiment.
[0023] FIG. 15 is a perspective view of a lighting device according
to an exemplary embodiment.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0024] Hereinafter, a light-emitting device, a light-emitting
device package, and a lighting system according to exemplary
embodiments will be described with reference to accompanying
drawings.
[0025] In the description of embodiments, it will be understood
that when a layer (or film) is referred to as being `on` another
layer or substrate, it can be directly on another layer or
substrate, or intervening layers may also be present. Further, it
will be understood that when a layer is referred to as being
`under` another layer, it can be directly under another layer, and
one or more intervening layers may also be present. In addition, it
will also be understood that when a layer is referred to as being
`between` two layers, it can be the only layer between the two
layers, or one or more intervening layers may also be present.
[0026] FIG. 1 is a sectional view of a light-emitting device
according to a first exemplary embodiment, and FIG. 2 is a plan
view of the light-emitting device according to the first
embodiment.
[0027] Referring to FIGS. 1 and 2, a light-emitting device 100 may
include a substrate 110, a base layer 120, a first conductive type
semiconductor layer 130, a first active layer 140, a second
conductive type semiconductor layer 150, an insulation layer 160, a
third conductive type semiconductor layer 170, a second active
layer 180, a fourth conductive type semiconductor layer 190, a
first electrode 131, a second electrode 191, and a common electrode
165.
[0028] The first conductive type semiconductor layer 130, the first
active layer 140, and the second conductive type semiconductor
layer 150 constitute a first light-emitting structure A, and the
third conductive type semiconductor layer 170, the second active
layer 180, and the fourth conductive type semiconductor layer 190
may constitute a second light-emitting structure B.
[0029] The light-emitting device 100 may receive an AC power from
an external AC power source to generate continuous light. The AC
power source alternately supplies a positive (+) voltage and a
negative (-) voltage to the light-emitting device 100. The first
light-emitting structure A may emit light by the positive (+)
voltage and the negative (-) voltage, and the second light-emitting
structure B may emit light by the positive (+) voltage and the
negative (-) voltage to continuously generate light.
[0030] Hereinafter, components of the light-emitting device 100
will be described in detail.
[0031] The substrate 110 may include at least one selected from the
group consisting of sapphire (Al.sub.2O.sub.3), SiC, GaAs, GaN,
ZnO, Si, GaP, InP, and Ge, but is not limited thereto.
[0032] The base layer 120 may be disposed on the substrate 110. The
base layer 120 may reduce a lattice constant difference between the
substrate 110 and the first conductive type semiconductor layer 130
to allow the first conductive type semiconductor layer 130 to be
grown with good crystalline.
[0033] For example, the base layer 120 may include a plurality of
layers including at least one of a buffer layer and an undoped
semiconductor layer. Also, the base layer 120 may be formed of a
semiconductor material having a compositional formula of
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.1,
0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1), but is not limited
thereto.
[0034] The first light-emitting structure A may be disposed on the
base layer 120. The first light-emitting structure A may include
the first conductive type semiconductor layer 130, the first active
layer 140 on the first conductive type semiconductor layer 130, and
the second conductive type semiconductor layer 150 on the first
active layer 140.
[0035] For example, the first conductive type semiconductor layer
130 may be an N-type semiconductor layer. The N-type semiconductor
layer may be formed of a semiconductor material having a
compositional formula of In.sub.xAl.sub.yGa.sub.1-x-yN
(0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1),
e.g., one of InAlGaN, GaN, AlGaN, InGaN, AlN, InN, and AlInN. The
N-type semiconductor layer may be doped with an N-type dopant such
as Si, Ge, Sn, or C.
[0036] The first active layer 140 may be disposed on the first
conductive type semiconductor layer 130. The first active layer 140
may have a single quantum well structure or a multi quantum well
(MQW) structure. The first active layer 140 may emit light using
carriers (electrons and holes) supplied by the first and second
conductive type semiconductor layers 130 and 150.
[0037] For example, the first active layer 140 may be formed of a
semiconductor material having a compositional formula of
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.1,
0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1).
[0038] The second conductive type semiconductor layer 150 may be
disposed on the first active layer 140. For example, the second
conductive type semiconductor layer 150 may be a P-type
semiconductor layer. The P-type semiconductor layer may be formed
of a semiconductor material having a compositional formula of
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.1,
0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1), e.g., one of InAlGaN,
GaN, AlGaN, InGaN, AlN, and InN. The P-type semiconductor layer may
be doped with a P-type dopant such as Mg, Zn, Ca, Sr, or Ba.
[0039] Also, an N-type clad layer (not shown) may be disposed under
the first active layer 140, i.e., between the first conductive type
semiconductor layer 130 and the first active layer 140. Also, a
P-type clad layer (not shown) may be disposed on the first active
layer 140, i.e., between the first active layer 140 and the second
conductive type semiconductor layer 150. Each of the clad layers
may be formed of one of AlGaN or InAlGaN.
[0040] The insulation layer 160 may be disposed on the second
conductive type semiconductor layer 150. That is, the insulation
layer 160 may be disposed between the second conductive type
semiconductor layer 150 and the third conductive type semiconductor
layer 170, i.e., between the first light-emitting structure A and
the second light-emitting structure B.
[0041] The insulation layer 160 may be formed of a semiconductor
material having a compositional formula of
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.1,
0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1), but is not limited
thereto.
[0042] Since the insulation layer 160 has a carrier concentration
significantly less than those of the first, second, third, and
fourth conductive type semiconductor layers 130, 150, 170, and 190,
for example, a carrier concentration of less than about 10.sup.16
cm.sup.-2, a current does not substantially flow. Thus, the
insulation layer 160 may insulate the first light-emitting
structure A from the second light-emitting structure B.
[0043] For example, the insulation layer 160 may have a thickness
of about 10 nm to about 1,000 nm. When the insulation layer 160 has
a thickness of less than about 10 nm, a leakage current may occur
between the first light-emitting structure A and the second
light-emitting structure B by a tunneling phenomenon. As a result,
the light-emitting device 100 may be abnormally operated. Also,
when the insulation layer 160 has a thickness of greater than about
1,000 nm, a thickness of the common electrode 165 commonly
contacting the second and third conductive type semiconductor
layers 150 and 170 may be increased. As a result, there are
limitations that a process for forming the common electrode 165 may
be difficult and complicated.
[0044] The second light-emitting structure B may be disposed on the
insulation layer 160. The second light-emitting structure B may
include the third conductive type semiconductor layer 170, the
second active layer 180 on the third conductive type semiconductor
layer 170, and the fourth conductive type semiconductor layer 190
on the second active layer 180.
[0045] For example, the third conductive type semiconductor layer
170 may be an N-type semiconductor layer. The N-type semiconductor
layer may be formed of a semiconductor material having a
compositional formula of In.sub.xAl.sub.yGa.sub.1-x-yN
(0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1),
e.g., one of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN. The N-type
semiconductor layer may be doped with an N-type dopant such as Si,
Ge, Sn, or C.
[0046] The second active layer 180 may be disposed on the third
conductive type semiconductor layer 170. The second active layer
180 may have a single quantum well structure or a multi quantum
well (MQW) structure. The second active layer 180 may generate
light using carriers (electrons and holes) supplied by the third
and fourth conductive type semiconductor layers 170 and 190.
[0047] For example, the second active layer 180 may be formed of a
semiconductor material having a compositional formula of
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.1,
0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1).
[0048] The fourth conductive type semiconductor layer 190 may be
disposed on the second active layer 180. For example, the fourth
conductive type semiconductor layer 190 may be a P-type
semiconductor layer. The P-type semiconductor layer may be formed
of a semiconductor material having a compositional formula of
In.sub.xAl.sub.yGa.sub.1-x-yN (0.ltoreq.x.ltoreq.1,
0.ltoreq.y.ltoreq.1, 0.ltoreq.x+y.ltoreq.1), e.g., one of InAlGaN,
GaN, AlGaN, InGaN, AlN, and InN. The P-type semiconductor layer may
be doped with a P-type dopant such as Mg, Zn, Ca, Sr, or Ba.
[0049] Also, an N-type clad layer (not shown) may be disposed under
the second active layer 180, i.e., between the third conductive
type semiconductor layer 170 and the second active layer 180. Also,
a P-type clad layer (not shown) may be disposed on the second
active layer 180, i.e., between the second active layer 180 and the
fourth conductive type semiconductor layer 190. Each of the clad
layers may be formed of one of AlGaN or InAlGaN.
[0050] The first and third conductive type semiconductor layers 130
and 170 may be used as a P-type semiconductor layer doped with the
P-type dopant, and the second and fourth conductive type
semiconductor layers 150 and 190 may be used as an N-type
semiconductor layer doped with the N-type dopant, but are not
limited thereto.
[0051] The base layer 120, the first light-emitting structure A,
the insulation layer 160, and the second light-emitting structure B
may be formed using one of a metal organic chemical vapor
deposition (MOCVD) process, a chemical vapor deposition (CVD)
process, a plasma-enhanced chemical vapor deposition (PECVD)
process, a molecular beam epitaxy (MBE) process, and a hydride
vapor phase epitaxy (HVPE) process, but is not limited thereto.
[0052] The common electrode 165 may be electrically connected to
the second conductive type semiconductor layer 150 and the third
conductive type semiconductor layer 170. That is, the common
electrode 165 may be electrically connected to both the first
light-emitting structure A and the second light-emitting structure
B.
[0053] For example, as shown in FIG. 1, the common electrode 165
may be disposed on at least one portion of a side surface of the
third conductive type semiconductor layer 170 and a side surface of
the insulation layer 160 and at least portions of top and side
surfaces of the second conductive type semiconductor layer 150.
[0054] Also, as shown in FIG. 2, the common electrode 165 may
surround at least three side surfaces of four side surfaces of each
of the third conductive type semiconductor layer 170, the
insulation layer 160, and the second conductive type semiconductor
layer 150 to improve a current spreading effect of the
light-emitting device 100. However, the common electrode 165 is not
limited to a configuration thereof.
[0055] A mesa etching process may be performed on the
light-emitting device 100 to expose the second conductive type
semiconductor layer 150, thereby forming the common electrode 165,
but is not limited thereto.
[0056] Since the common electrode 165 is electrically connected to
an external terminal having an electrical ground state through a
third wire 166, the second conductive type semiconductor layer 150
and the third conductive type semiconductor layer 170 may become
ground states by the common electrode 165.
[0057] The common electrode 165 may include at least one selected
from the group consisting of Cu, Au, Al, Ti, and Cr through a
deposition process or/and a plating process.
[0058] The first electrode 131 may be disposed on the first
conductive type semiconductor layer 130, and the second electrode
191 may be disposed on the fourth conductive type semiconductor
layer 190. A mesa etching process may be performed on the
light-emitting device 100 to expose the first conductive type
semiconductor layer 130, thereby forming the first electrode
131.
[0059] The first and second electrodes 131 and 191 may include at
least one selected from the group consisting of Cu, Au, Al, Ti, and
Cr through a deposition process or/and a plating process.
[0060] The first electrode 131 provides a power to the first
light-emitting structure A, and the second electrode 191 provides a
power to the second light-emitting structure B.
[0061] The first electrode 131 and the second electrode 191 may be
electrically connected to the same AC power source. For example,
the first electrode 131 and the second electrode 191 may be
connected to a first wire 132 and a second wire 192, respectively.
Here, the same AC power may be supplied to the first and second
wires 132 and 192 at the same time.
[0062] The AC power may have a peak-to-peak voltage adequate for
operating the light-emitting device 100. For example, when the
light-emitting device 100 has an operation voltage of about 3.3 V,
the external AC power source may have a peak-to-peak voltage of
about -3.3 V to about 3.3 V. However, the present disclosure is not
limited thereto.
[0063] Thus, when the AC power source supplies a negative (-)
voltage to the first and second electrodes 131 and 191, a light may
only be emitted from the first light-emitting structure A. Also,
when the AC power source supplies a positive (+) voltage to the
first and second electrodes 131 and 191, a light may only be
emitted from the first light-emitting structure B. Thus, since the
first and second light-emitting structures A and B may alternately
emit the light, the light-emitting device 100 may continuously
generate light.
[0064] Also, since the light-emitting device 100 may emit light
using both the positive (+) voltage and the negative (-) voltage, a
risk of damage due to a reverse current as described in the
existing light-emitting device may be reduced.
[0065] The AC power may be supplied to the common electrode 165,
and the first and second electrodes 131 and 191 may become ground
states, but are not limited thereto.
[0066] FIG. 3 is a schematic equivalent circuit diagram
illustrating the light-emitting device of FIG. 1.
[0067] Referring to FIG. 3, each of the first and second
light-emitting structures A and B constituting the light-emitting
device 100 has one side connected to the AC power source and the
grounded other side.
[0068] The AC power source alternately supplies the positive (+)
voltage and the negative (-) voltage. When the negative (-) voltage
is supplied, the first light-emitting structure A may emit light.
Also, when the positive (+) voltage is supplied, the second
light-emitting structure B may emit light. Thus, the light-emitting
device 100 may continuously generate light.
[0069] Alternatively, according to a design of the light-emitting
device 100, the first light-emitting structure A may emit light
when the positive (+) voltage is supplied, and the second
light-emitting structure B may emit light when the negative (-)
voltage is supplied, but are not limited thereto.
[0070] Hereinafter, a process for fabricating the light-emitting
device according to the first embodiment will be described.
However, the descriptions overlapping with those of the foregoing
embodiment will be omitted.
[0071] FIGS. 4 to 7 are views illustrating a process for
fabricating the light-emitting device according to the first
embodiment. However, the present disclosure is not limited to the
process for fabricating the light-emitting device and an order of
the process.
[0072] Referring to FIG. 4, a base layer 120, a first
light-emitting structure A, an insulation layer 160, and a second
light-emitting structure B may be sequentially formed on a
substrate 110.
[0073] The first light-emitting structure A may include a first
conductive type semiconductor layer 130, a first active layer 140
on the first conductive type semiconductor layer 130, and a second
conductive type semiconductor layer 150 on the first active layer
140. The second light-emitting structure B may include a third
conductive type semiconductor layer 170, a second active layer 180
on the third conductive type semiconductor layer 170, and a fourth
conductive type semiconductor layer 190 on the second active layer
180.
[0074] The base layer 120, the first light-emitting structure A,
the insulation layer 160, and the second light-emitting structure B
may be formed using one of a metal organic chemical vapor
deposition (MOCVD) process, a chemical vapor deposition (CVD)
process, a plasma-enhanced chemical vapor deposition (PECVD)
process, a molecular beam epitaxy (MBE) process, and a hydride
vapor phase epitaxy (HVPE) process, but is not limited thereto.
[0075] For example, the base layer 120 may be formed by injecting
trimethylalluminum gas (TMAl), trimethylgallium gas (TMGa), ammonia
gas (NH.sub.3), and hydrogen gas (N.sub.2) into a chamber, but is
not limited thereto.
[0076] For example, the first and third conductive type
semiconductor layers 130 and 170 may be formed by injecting TMGa,
NH.sub.3, N.sub.2, and silane gas (SiH.sub.4) containing N-type
impurities such as silicon (Si) into the chamber, but is not
limited thereto.
[0077] For example, the first and second active layers 140 and 180
may be formed into a multi quantum well structure having an
InGaN/GaN structure by injecting TMGa, NH.sub.3, N.sub.2, and
trimethylindium gas (TMIn) into the chamber, but is not limited
thereto.
[0078] For example, the second and fourth conductive type
semiconductor layers 150 and 190 may be formed by injecting TMGa,
NH.sub.3, N.sub.2, and bis-ethyl-cyclopentadienyl-magnesium
(EtCp.sub.2Mg){Mg(C.sub.2H.sub.5C.sub.5H.sub.4).sub.2} containing
P-type impurities such as magnesium (Mg) into the chamber, but is
not limited thereto.
[0079] For example, the insulation layer 160 may be formed by
injecting TMGa, NH.sub.3, and N.sub.2 into the chamber, but is not
limited thereto.
[0080] Referring to FIG. 5, a mesa etching process may be performed
to expose the first conductive type semiconductor layer 130, a
first electrode 131 may be formed on the first conductive type
semiconductor layer 130, and a second electrode 191 may be formed
on the fourth conductive type semiconductor layer 190.
[0081] Referring to FIG. 6, a mesa etching process may be performed
to expose the second conductive type semiconductor layer 150, and a
common electrode 165 may be commonly and electrically connected to
the second conductive type semiconductor layer 150, the insulation
layer 160, and the third conductive type semiconductor layer
170.
[0082] For example, as shown in FIG. 6, the common electrode 165
may be disposed on at least one portion of a side surface of the
third conductive type semiconductor layer 170 and a side surface of
the insulation layer 160 and at least portions of top and side
surfaces of the second conductive type semiconductor layer 150.
[0083] Referring to FIG. 7, the first and second electrodes 131 and
191 may be connected to first and second wires 132 and 192,
respectively. Also, a third wire 166 may be connected to the common
electrode 165 to connect the light-emitting device 100 to an
external AC power source. An AC power may be supplied to the first
and second electrodes 131 and 191, and the common electrode 165 may
become a ground state.
[0084] Thus, the light-emitting device 100 according to the first
embodiment may receive AC power to continuously emit light.
[0085] Hereinafter, a light-emitting device according to a second
exemplary embodiment and a process for fabricating the same will be
described in detail. In description of the second embodiment, the
same part as those of the first embodiment will be described with
reference to the first embodiment and their duplicated descriptions
will be omitted.
[0086] The light-emitting device according to the second embodiment
may be equal to the light-emitting device according to the first
embodiment except a configuration of a common electrode.
[0087] FIG. 8 is a sectional view of a light-emitting device
according to a second exemplary embodiment.
[0088] Referring to FIG. 8, a light-emitting device 100B may
include a substrate 110, a base layer 120 on the substrate 110, a
first light-emitting structure A on the base layer 120, an
insulation layer 160 on the first light-emitting structure A, a
second light-emitting structure B on the insulation layer 160, a
first electrode 131 supplying a power to the first light-emitting
structure A, a second electrode 191 supplying a power to the second
light-emitting structure B, and a common electrode 165b
electrically connecting the first and second light-emitting
structures A and B to an external terminal having a ground
state.
[0089] The common electrode 165b may be disposed on top and side
surfaces of a third conductive type semiconductor layer 170, a side
surface of the insulation layer 160, and top and side surfaces of a
second conductive type semiconductor layer 150.
[0090] A mesa etching process may be performed on the
light-emitting device 100B to expose the second conductive type
semiconductor layer 150 and the third conductive type semiconductor
layer 170, thereby forming the common electrode 165b, but is not
limited thereto.
[0091] Also, the common electrode 165b may be designed in various
shapes to improve a current spreading effect of the light-emitting
device 100B, but is not limited thereto.
[0092] Hereinafter, a light-emitting device according to a third
exemplary embodiment and a process for fabricating the same will be
described in detail. In description of the third embodiment, the
same part as those of the first embodiment will be described with
reference to the first embodiment and their duplicated descriptions
will be omitted.
[0093] The light-emitting device according to the third embodiment
is equal to the light-emitting device according to the first
embodiment except a configuration of a common electrode.
[0094] FIG. 9 is a sectional view of a light-emitting device
according to a third exemplary embodiment.
[0095] Referring to FIG. 9, a light-emitting device 100C may
include a substrate 110, a base layer 120 on the substrate 110, a
first light-emitting structure A on the base layer 120, an
insulation layer 160 on the first light-emitting structure A, a
second light-emitting structure B on the insulation layer 160, a
first electrode 131 supplying a power to the first light-emitting
structure A, a second electrode 191 supplying a power to the second
light-emitting structure B, and first and second common electrodes
165c and 165d electrically connecting the first and second
light-emitting structures A and B to an external terminal having a
ground state.
[0096] The first common electrode 165c may be disposed on a second
conductive type semiconductor layer 150. Also, the second common
electrode 165d may be disposed on a third conductive type
semiconductor layer 170.
[0097] For example, the first and second common electrodes 165c and
165d may be electrically connected to the external terminal having
the ground state by fourth and fifth wires 166c and 166d,
respectively, but is not limited thereto.
[0098] Hereinafter, a light-emitting device according to a fourth
exemplary embodiment and a process for fabricating the same will be
described in detail. In description of the fourth embodiment, the
same part as those of the first embodiment will be described with
reference to the first embodiment and their duplicated descriptions
will be omitted.
[0099] The light-emitting device according to the fourth embodiment
may be equal to the light-emitting device according to the first
embodiment except that a vertical type light-emitting device in
which an electrode is vertically disposed may be provided.
[0100] FIG. 10 is a sectional view of a light-emitting device
according to a fourth exemplary embodiment.
[0101] Referring to FIG. 10, a light-emitting device 100D may
include a conductive support member 195 having conductivity, a
reflective layer 194 on the conductive support member 195, a second
light-emitting structure B on the reflective layer 194, an
insulation layer 160 on the second light-emitting structure B, a
first light-emitting structure on the insulation layer 160, an
electrode 131 on the first light-emitting structure A, and a common
electrode 165 electrically connecting the first and second
light-emitting structures A and B to an external terminal having a
ground state. An AC power source may be commonly and electrically
connected to the electrode 131 and the conductive support member
195.
[0102] The second light-emitting structure B may include a fourth
conductive type semiconductor layer 190, a second active layer 180
on the fourth conductive type semiconductor layer 190, and a third
conductive type semiconductor layer 170 on the second active layer
180.
[0103] The first light-emitting structure A may include a second
conductive type semiconductor layer 150 on the insulation layer
160, a first active layer 140 on the second conductive type
semiconductor layer 150, and a first conductive type semiconductor
layer 130 on the first active layer 140.
[0104] The common electrode 165 may be disposed on at least one
portion of a side surface of the second conductive type
semiconductor layer 150, a side surface of the insulation layer
160, and at least one portion of top and side surfaces of the third
conductive type semiconductor layer 170.
[0105] The conductive support member 195 together with the first
electrode 131 may provide an AC power to the light-emitting device
100D. That is, the conductive support member 195 and the first
electrode 131 may be commonly connected the AC power source to
receive the same AC power from the outside.
[0106] The conductive support member 195 may include at least one
selected from the group consisting of Ti, Cr, Ni, Al, Pt, Au, W,
Cu, and Mo, or may be a semiconductor substrate in which impurities
are injected.
[0107] The reflective layer 194 may include at least one selected
from the group consisting of Ag, Al, Pt, and Pd.
[0108] In the light-emitting device 100 of FIG. 1, the reflective
layer 194 and the conductive support member 195 may be formed on
the second light-emitting structure B. Then, the base layer and the
substrate (not shown) attached to the first light-emitting
structure A may be removed to form the first electrode 131 on the
first conductive type semiconductor layer 130, thereby
manufacturing the light-emitting device 100D.
[0109] Hereinafter, a light-emitting device according to a fifth
embodiment and a process for fabricating the same will be described
in detail. In description of the fifth embodiment, the same part as
those of the first embodiment will be described with reference to
the first embodiment and their duplicated descriptions will be
omitted.
[0110] The light-emitting device according to the fifth embodiment
may be equal to the light-emitting device according to the first
embodiment except that a common electrode 210 is disposed between
an insulation layer 150 and a first light-emitting structure A, and
a plurality of common electrodes 211, 212, 213, and 214 contact a
second light-emitting structure B passing through the insulation
layer 150.
[0111] FIG. 11 is a sectional view of a light-emitting device
according to a fifth exemplary embodiment.
[0112] Referring to FIG. 11, a light-emitting device 100E according
to a fifth embodiment may include a substrate 110, a base layer
120, a first conductive type semiconductor layer 130, a first
active layer 140, a second conductive type semiconductor layer 150,
a common electrode layer 210, an insulation layer 160, a third
conductive type semiconductor layer 170, a second active layer 180,
a fourth conductive type semiconductor layer 190, a first electrode
131, and a second electrode 191.
[0113] The first conductive type semiconductor layer 130, the first
active layer 140, and the second conductive type semiconductor
layer 150 may constitute a first light-emitting structure A, and
the third conductive type semiconductor layer 170, the second
active layer 180, and the fourth conductive type semiconductor
layer 190 may constitute a second light-emitting structure B.
[0114] The common electrode layer 210 may be disposed on a top
surface of the second conductive type semiconductor layer 150 of
the first light-emitting structure A. The common electrode layer
210 may be disposed on an entire region of the second conductive
type semiconductor layer 150. That is, the common electrode layer
210 may have the same area as that of the second conductive type
semiconductor layer 150. Thus, the first light-emitting structure A
may emit light by the first electrode 131 and the common electrode
layer 210. Since the common electrode layer 210 may have the same
area as the second conductive type semiconductor layer 150, a
current supplied into the common electrode layer 210 may flow into
an entire region of the common electrode layer 210. Thus, the
current flowing into the entire region of the common electrode
layer 210 may flow into the second conductive type semiconductor
layer 150 contacting the common electrode layer 210 with the same
area. Therefore, uniform light may be emitted from an entire region
of the active layer 140 by the spreading current flowing into the
entire region of the second conductive type semiconductor layer
150.
[0115] The common electrode layer 210 may include a plurality of
upwardly protruding common electrodes 211, 212, 213, and 214. The
common electrodes 211, 212, 213, and 214 may pass through the
insulation layer 160 to contact the third conductive type
semiconductor layer 170 of the second light-emitting structure
B.
[0116] The common electrodes 211, 212, 213, and 214 may be spaced
from each other with a predetermined distance or random
distance.
[0117] The common electrodes 211, 212, 213, and 214 may have top
surfaces having the same height as that of a top surface of the
insulation layer 160. Alternatively, the top surfaces may have
heights greater than that of the top surface of the insulation
layer 160.
[0118] Thus, at least portions of top and side surfaces of the
common electrodes 211, 212, 213, and 214 may contact the third
conductive type semiconductor layer 170 of the second
light-emitting structure B.
[0119] The top surfaces of the common electrodes 211, 212, 213, and
214 may have heights equal to or greater than that of the
insulation layer 160 and heights at least less than that of the
third conductive type semiconductor layer 170 of the second
light-emitting structure B. That is, the common electrodes 211,
212, 213, and 214 may be positioned between a bottom surface of the
third conductive type semiconductor layer 170 and a top surface of
the third conductive type semiconductor layer 170 contacting the
second active layer 180.
[0120] The side and top surfaces of each of the common electrodes
211, 212, 213, and 214 may contact the third conductive type
semiconductor layer 170.
[0121] The common electrodes 211, 212, 213, and 214 may protrude
from the common electrode layer 210. Alternatively, the common
electrodes 211, 212, 213, and 214 may be formed of a material
different from that of the common electrode layer 210 and
individually formed from the common electrode layer 210. In this
case, the electrodes 211, 212, 213, and 214 may electrically
contact the common electrode layer 210.
[0122] A metal layer may be patterned by a predetermined depth
using one etching process of a dry etching process and a wet
etching process to form the common electrodes 211, 212, 213, and
214 and the common electrode layer 210 at the same time.
[0123] The common electrode layer 210 and the common electrodes
211, 212, 213, and 214 may include at least one selected from the
group consisting of Ti, Cr, Ni, Al, Pt, Au, W, Cu, and Mo, and
combinations thereof.
[0124] An edge region of a side of the common electrode layer 210
may be exposed to the outside. Thus, a third wire 221 may be
directly connected to the exposed edge region. Therefore, a voltage
(or current) supplied into the third wire 221 may be spread into
the entire region of the common electrode layer 210 to flow into
the plurality of common electrodes 211, 212, 213, and 214 connected
to the common electrode layer 210.
[0125] The fifth embodiment may be identically applied to the
light-emitting structure (vertical LED) of the fourth embodiment
(FIG. 10). That is, the common electrode layer may be disposed
between the third conductive type semiconductor layer 170 and the
insulation layer 160, and the plurality of common electrodes 211,
212, 213, and 214 passes through the insulation layer 160 to
contact the second conductive type semiconductor layer 150.
[0126] FIG. 12 is a sectional view of a light-emitting device
package including a light-emitting device according to an exemplary
embodiment.
[0127] Referring to FIG. 12, a light-emitting device package may
include a body part 20, first and second electrode layers 31 and 32
disposed on the body part 20, a light-emitting device 100 disposed
on the body part 20 and electrically connected to the first and
second electrode layers 31 and 32, and a molding member 40
surrounding the light-emitting device 100.
[0128] The body part 20 may be formed of a silicon material, a
synthetic resin material, or a metal material. An inclined surface
may be disposed around the light-emitting device 100.
[0129] The first electrode layer 31 and the second electrode layer
32 may be electrically separated from each other and provide an AC
power to the light-emitting device 100. Also, the first and second
electrode layers 31 and 32 may reflect light generated in the
light-emitting device 100 to improve light efficiency. In addition,
the first and second electrode layers 31 and 32 may discharge heat
generated in the light-emitting device 100 to the outside.
[0130] The light-emitting device 100 may be disposed on the body
part 20 or the first or second electrode layer 31 or 32.
[0131] First and second wires 132 and 192 of the light-emitting
device 100 may be electrically connected to one of the first
electrode layer 31 and the second electrode layer 32, and a third
wire 166 may be electrically connected to the other one of the
first electrode layer 31 and the second electrode layer 32, but are
not limited thereto. The molding member 40 may surround the
light-emitting device 100 to protect the light-emitting device 100.
Also, a phosphor may be contained in the molding member 40 to
change a wavelength of light emitted from the light-emitting device
100.
[0132] The light-emitting device package according to an embodiment
may be applicable to a lighting unit. The lighting unit may have a
structure in which a plurality of light-emitting devices or
light-emitting device packages is arrayed. Thus, the lighting unit
may include the display device illustrated in FIGS. 13 and 14 and
the lighting device illustrated in FIG. 15. In addition, the
lighting unit may include illumination lamps, traffic lights,
vehicle headlights, and signs.
[0133] FIG. 13 is an exploded perspective view of a display device
according to an exemplary embodiment.
[0134] Referring to FIG. 13, a display device 1000 may include a
light guide plate 1041, a light-emitting module 1031 providing
light to the light guide plate 1041, a reflective member 1022 under
the light guide plate 1041, an optical sheet 1051 above the light
guide plate 1041, a display panel 1061 above the optical sheet
1051, and a bottom cover 1011 receiving the light guide plate 1041,
the light-emitting module 1031, and the reflective member 1022, but
is not limited thereto.
[0135] The bottom cover 1011, the reflective member 1022, the light
guide plate 1041, and the optical sheet 1051 may be defined as the
light unit 1050.
[0136] The light guide plate 1041 may diffuse light provided from
the light-emitting module 1031 to produce planar light. The light
guide plate 1041 may be formed of a transparent material, e.g., one
of an acrylic resin-based material such as polymethyl metaacrylate
(PMMA), a polyethylene terephthalate (PET) resin, a poly carbonate
(PC) resin, a cycloolefin copolymer (COC) resin, and a polyethylene
naphthalate (PEN) resin.
[0137] The light-emitting module 1031 may be disposed on at least
one side surface of the light guide plate 1041 to provide light on
at least one side surface of the light guide plate 1041. Thus, the
light-emitting module 1031 may be used as a light source of the
display device.
[0138] At least one light-emitting module 1031 may be disposed on
one side surface of the light guide plate 1041 to directly or
indirectly provide light. The light-emitting module 1031 may
include a board 1033 and the light-emitting device packages 30
according to the above-described embodiments. The light-emitting
device packages 30 may be arrayed on the board 1033 by a
predetermined distance. The board 1033 may be a printed circuit
board (PCB), but is not limited thereto. Also, the board 1033 may
include a metal core PCB (MCPCB) and a flexible PCB (FPCB), but is
not limited thereto. When the light-emitting device packages 30 are
mounted on a side surface of the bottom cover 1011 or on a heatsink
plate, the board 1033 may be removed. Here, a portion of the
heatsink plate may contact a top surface of the bottom cover 1011.
Thus, heat generated in the light-emitting device packages 30 may
be discharged through the bottom cover 1011 via the heatsink
plate.
[0139] The plurality of light-emitting device packages 30 may be
mounted on the board 1033 to allow a light-emitting surface through
which light is emitted to be spaced a predetermined distance from
the light guide plate 1041, but is not limited thereto. The
light-emitting device packages 30 may directly or indirectly
provide light to a light incident surface that is a side surface of
the light guide plate 1041, but is not limited thereto.
[0140] The reflective member 1022 may be disposed under the light
guide plate 1041. The reflective member 1022 reflects light
incident through an under surface of the light guide plate 1041 to
supply the light to the display panel 1061, thereby improving
brightness of the display panel 1061. For example, the reflective
member 1022 may be formed of one of PET, PC, and PVC, but is not
limited thereto. The reflective member 1022 may be the top surface
of the bottom cover 1011, but is not limited thereto.
[0141] The bottom cover 1011 may receive the light guide plate
1041, the light-emitting module 1031, and the reflective member
1022. For this, the bottom cover 1011 may include a receiving part
1012 having a box shape with a top surface opened, but is not
limited thereto. The bottom cover 1011 may be coupled to a top
cover, but is not limited thereto.
[0142] The bottom cover 1011 may be formed of a metal material or a
resin material. Also, the bottom cover 1011 may be manufactured
using a press molding process or an extrusion molding process. The
bottom cover 1011 may be formed of a metal or non-metal material
having superior heat conductivity, but is not limited thereto.
[0143] For example, the display panel 1061 may be a liquid crystal
display (LCD) panel and include first and second boards formed of a
transparent material and a liquid crystal layer between the first
and second boards. A polarizing plate may be attached to at least
one surface of the display panel 1061. The present disclosure is
not limited to the attached structure of the polarizing plate. The
display panel 1061 may transmit or blocks light provided from the
light-emitting module 1031 to display information. The display unit
1000 may be applied to various portable terminals, monitors for
notebook computers, monitors for laptop computers, televisions,
etc.
[0144] The optical sheet 1051 may be disposed between the display
panel 1061 and the light guide plate 1041 and includes at least one
or more light-transmitting sheets. For example, the optical sheet
1051 may include at least one of sheets such as a diffusion sheet,
a horizontal or vertical prism sheet, and a brightness enhancement
sheet. The diffusion sheet diffuses incident light, and the
horizontal or/and vertical prism sheet(s) collect(s) the incident
light into the display panel 1061. Also, the brightness enhancement
sheet may reuse lost light to improve the brightness. Also, a
protection sheet may be disposed on the display panel 1061, but is
not limited thereto.
[0145] Optical members such as the light guide plate 1041 and the
optical sheet 1051 may be disposed on an optical path of the
light-emitting module 1031, but is not limited thereto.
[0146] FIG. 14 is a view of a display device according to an
exemplary embodiment.
[0147] Referring to FIG. 14, a display unit 1100 may include a
bottom cover 1152, a board 1120 on which the above-described
light-emitting device packages 30 are arrayed, an optical member
1154, and a display panel 1155.
[0148] The board 1120 and the light-emitting device packages 30 may
be defined as the light-emitting module 1060. The bottom cover
1152, at least one light-emitting module 1060, and the optical
member 1154 may be defined as a lighting unit (not shown).
[0149] The bottom cover 1152 may include a receiving part 1153, but
is not limited thereto.
[0150] Here, the optical member 1154 may include at least one of a
lens, a light guide plate, a diffusion sheet, horizontal and
vertical prism sheets, and a brightness enhancement sheet. The
light guide plate may be formed of a PC material or poly methy
methacrylate (PMMA) material. In this case, the light guide plate
may be removed. The diffusion sheet diffuses incident light, and
the horizontal and vertical prism sheets collect the incident light
into the display panel 1155. The brightness enhancement sheet may
reuse lost light to improve brightness.
[0151] The optical member 1154 may be disposed on the
light-emitting module 1060. Thus, light emitted from the
light-emitting module 1060 may be planarized, diffused, or
collected.
[0152] FIG. 15 is a perspective view of a lighting device according
to an exemplary embodiment.
[0153] Referring to FIG. 15, the lighting unit 1500 may include a
case 1510, a light-emitting module 1530 in the case 1510, and a
connection terminal 1520 disposed in the case 1510 to receive a
power from an external power source.
[0154] The case 1510 may be preferably formed of a material having
good heat dissipation characteristics, for example, a metal
material or a resin material.
[0155] The light-emitting module 1530 may include a board 1532 and
a light-emitting device package 30 mounted on the board 1532. The
light-emitting device package 30 may be provided in plurality, and
the plurality of light-emitting device packages 30 may be arrayed
in a matrix shape or spaced a predetermined distance from each
other.
[0156] The board 1532 may be an insulator on which a circuit
pattern is printed. For example, the board may include a general
printed circuit board (PCB), a metal core PCB, a flexible PCB, a
ceramic PCB, FR-4, etc.
[0157] Also, the board 1532 may be formed of a material to
efficiently reflect light, and a surface thereof may be formed in a
color capable of efficiently reflecting light. For example, the
board 1532 may be a coated layer having a white color or a silver
color.
[0158] At least one light-emitting device package 30 may be mounted
on the board 1532. Each of the light-emitting device packages 30
may include at least one light emitting diode (LED) chip. The LED
chip may include an LED emitting light having a visible light band
such as red, green, blue or white light or a UV LED emitting
ultraviolet (UV) rays.
[0159] The light-emitting module 1530 may have a combination of
several light-emitting device packages 30 to obtain desired color
and brightness. For example, the light-emitting module 1530 may
have a combination of a white LED, a red LED, and a green LED to
obtain a high color rendering index (CRI).
[0160] The connection terminal 1520 may be electrically connected
to the light-emitting module 1530 to supply a power. The connection
terminal 1520 may be screwed and coupled to an external power
source in a socket type, but is not limited thereto. For example,
the connection terminal 1520 may be made in a pin type and inserted
into an external power source, or may be connected to the external
power source through a wire.
[0161] A method for fabricating a light-emitting device according
to an embodiment may include forming a first light-emitting
structure on a substrate; forming an insulation layer on the first
light-emitting structure; forming a second light-emitting structure
on the insulation layer; and forming a common electrode commonly
and electrically connected to the first light-emitting structure
and the second light-emitting structure.
[0162] Any reference in this specification to "one embodiment," "an
embodiment," "example embodiment," etc., means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
invention. The appearances of such phrases in various places in the
specification are not necessarily all referring to the same
embodiment. Further, when a particular feature, structure, or
characteristic is described in connection with any embodiment, it
is submitted that it is within the purview of one skilled in the
art to affect such feature, structure, or characteristic in
connection with other ones of the embodiments.
[0163] Although embodiments have been described with reference to a
number of illustrative embodiments thereof, it should be understood
that numerous other modifications and embodiments can be devised by
those skilled in the art that will fall within the spirit and scope
of the principles of this disclosure. More particularly, variations
and modifications are possible in the component parts and/or
arrangements of the subject combination arrangement within the
scope of the disclosure, the drawings and the appended claims. In
addition to variations and modifications in the component parts
and/or arrangements, alternative uses will also be apparent to
those skilled in the art.
* * * * *