U.S. patent application number 13/026279 was filed with the patent office on 2011-06-09 for image sensor module for camera device.
This patent application is currently assigned to PREMIER IMAGE TECHNOLOGY(CHINA) LTD.. Invention is credited to XIANG HUANG, WEN-HWA LIN, SHAO-GUANG MO, WAN-CHENG XIE, CHEN-KUANG YEH.
Application Number | 20110134314 13/026279 |
Document ID | / |
Family ID | 40346115 |
Filed Date | 2011-06-09 |
United States Patent
Application |
20110134314 |
Kind Code |
A1 |
LIN; WEN-HWA ; et
al. |
June 9, 2011 |
IMAGE SENSOR MODULE FOR CAMERA DEVICE
Abstract
An image sensor module includes a circuit board, an image
sensor, and a supporting board. The image sensor is electrically
connected to the circuit board. The circuit board defines a through
opening therein. The supporting board is arranged on one side of
the circuit board and includes a protrusion. The protrusion extends
outwardly from the supporting board and includes a square-shaped
block no larger than the image sensor. The square-shaped block
passes through the through opening. The image sensor is mounted on
the block and spaced from the circuit board.
Inventors: |
LIN; WEN-HWA; (Tu-Cheng,
TW) ; YEH; CHEN-KUANG; (Tu-Cheng, TW) ; HUANG;
XIANG; (Foshan, CN) ; XIE; WAN-CHENG; (Foshan,
CN) ; MO; SHAO-GUANG; (Foshan, CN) |
Assignee: |
PREMIER IMAGE TECHNOLOGY(CHINA)
LTD.
Foshan City
CN
HON HAI PRECISION INDUSTRY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
40346115 |
Appl. No.: |
13/026279 |
Filed: |
February 13, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12013916 |
Jan 14, 2008 |
|
|
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13026279 |
|
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Current U.S.
Class: |
348/374 ;
348/E5.024 |
Current CPC
Class: |
H05K 3/0064 20130101;
H05K 3/0061 20130101; H05K 3/303 20130101; H05K 2201/10121
20130101; H01L 27/14618 20130101; H04N 5/2253 20130101; H01L
2924/0002 20130101; Y02P 70/613 20151101; H05K 2201/10727 20130101;
H05K 2201/09045 20130101; H05K 1/189 20130101; H05K 2201/2036
20130101; H04N 5/2257 20130101; Y02P 70/50 20151101; H05K
2201/09054 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
348/374 ;
348/E05.024 |
International
Class: |
H04N 5/225 20060101
H04N005/225 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 9, 2007 |
CN |
200710201326.0 |
Claims
1. An image sensor module comprising: a circuit board defining a
through opening therein; an image sensor electrically connected to
the circuit board; and a supporting board arranged on one side of
the circuit board and comprising a protrusion extending outwardly
from the supporting board, the protrusion comprising a
square-shaped block having a size no larger than that of the image
sensor, the block passing through the through opening of the
circuit board, the image sensor being mounted on the block and
spaced from the circuit board.
2. The image sensor module of claim 1, wherein the block has a
planar top mounting surface, the image sensor is positioned on the
planar top mounting surface.
3. The image sensor module of claim 1, wherein an adhesive layer is
applied between the image sensor and the block, the adhesive layer
being one of thermosetting adhesive, UV adhesive and black
adhesive.
4. The image sensor module of claim 1, wherein the protrusion
extends from a central portion of the supporting surface, a concave
is defined in a bottom side of the supporting board corresponding
to the protrusion.
5. The image sensor module of claim 1, wherein the through opening
is the same size or larger than the block, and smaller than the
image sensor.
6. An image sensor module comprising: a supporting board comprising
a supporting surface and a protrusion, the protrusion extending
upwardly from the supporting surface, the protrusion comprising at
least one square-shaped block; a circuit board arranged on the
supporting surface of the supporting board, the circuit board
defining at least one through opening for extension of the at least
one square-shaped block therethrough, a thickness of the circuit
board being smaller than that of the at least one square-shaped
block; and an image sensor arranged on the at least one
square-shaped block, the image sensor being spaced from the circuit
board and being electrically connected to the circuit board, the
image sensor covering the at least one square-shaped block.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of patent
application Ser. No. 12/013,916, filed on Jan. 14, 2008, entitled
"IMAGE SENSOR MODULE FOR CAMERA DEVICE".
BACKGROUND
[0002] 1. Technical Field
[0003] The present disclosure relates generally to a camera device,
and particularly to an image sensor module of the camera device
having improved position precision.
[0004] 2. Description of Related Art
[0005] In recent years, digital cameras and digital video cameras
are in widespread use and are provided with an image sensor module
to provide an image-capturing function.
[0006] Referring to FIG. 7, a general image sensor module includes
a circuit board 90 and an image sensor 91 arranged on the circuit
board 90. A plurality of circuits 92 are printed on the circuit
board 90. The image sensor 91 is either a charge coupled device
(CCD) sensor or a complementary metal oxide semiconductor (CMOS)
sensor. A light receiving section is formed on a top side of the
image sensor 91. Contact terminals 93 of the image sensor 91 are
electrically connected to the circuits of the circuit board 90 by
soldering. A number of pads (not shown) thus are formed between the
contact terminals 93 of the image sensor 91 and the circuit board
90. During operation of the camera, circuits of the light receiving
section of the image sensor 91 are driven at a high speed frequency
to transform image signals into electrical signals. The electrical
signals are then transferred to the circuit board 90 through the
contact terminals 93 of the image sensor 91 and the pads of the
circuit board 90 to control focusing of the camera.
[0007] However, the pads formed on the circuit board 90 usually are
different from each other. In other words, the pads have various
thicknesses. Thus the image sensor 91 arranged on the pads is
usually aslant. When the image sensor module is mounted to a lens
module, the light receiving section formed on the top side of the
image sensor 91 is aslant. An optical axis of the image sensor
module is offset from an optical center of the lens. Thus the image
of the image sensor 91 usually generates coma aberration, which
results in distortion of the image.
[0008] Therefore, a new image sensor module for the camera device
is desired to overcome the above described shortcomings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The present disclosure is described in greater detail
hereinafter, by way of example only, through description of a
preferred embodiment thereof and with reference to the accompanying
drawing in which:
[0010] FIG. 1 is an isometric, exploded view of a first embodiment
of an image sensor module.
[0011] FIG. 2 is an assembled view of the image sensor module of
FIG. 1.
[0012] FIG. 3 is a cross-sectional view of the image sensor module
of FIG. 2 taken along line
[0013] FIG. 4 is an isometric, exploded view of a second embodiment
of an image sensor module.
[0014] FIG. 5 is an isometric, exploded view of a third embodiment
of an image sensor module.
[0015] FIG. 6 is an isometric, exploded view of a fourth embodiment
of an image sensor module.
[0016] FIG. 7 is an isometric, assembled view of a related image
sensor module.
DETAILED DESCRIPTION
[0017] Referring to FIGS. 1-3, a first embodiment of an image
sensor module 100 includes a circuit board 20, an image sensor 10,
and a supporting board 30. The image sensor module 100 can be used
in a digital camera or a digital video camera to provide an
image-capturing function.
[0018] The image sensor 10 is either a charge coupled device (CCD)
sensor or a complementary metal oxide semiconductor (CMOS) sensor,
which is controlled by a central processing unit (CPU, not shown).
The image sensor 10 includes a top surface 13 and an opposite
bottom surface 12. A light receiving section 11 is formed on the
top surface 13 of the image sensor 10. A number of signal output
terminals (not shown) are formed on the bottom surface 12 of the
image sensor 10. When the image sensor module 100 is mounted to a
camera, during focusing of the camera, circuits of the light
receiving section 11 of the image sensor 10 are driven at a high
speed frequency to transform image signals into electrical signals.
The electrical signals are then transferred to the CPU. The CPU
compares the image from a lens of the camera with the image in the
image sensor 10. As the lens moves to a position where the image is
the clearest, a stop signal is simultaneously sent to stop movement
of the lens of the camera. Thus focusing of the camera is
achieved.
[0019] The supporting board 30 is made of metal or plastic. A top
side of the supporting board 30 forms a planar-shaped supporting
surface 34. A protrusion extends upwardly from a central portion of
the supporting surface 34. A concave 33 is defined in a bottom side
of the supporting board 30 corresponding to the protrusion. In this
embodiment, the protrusion is a block 31. The block 31 has a planar
and square shaped top mounting surface 35. An area of the mounting
surface 35 is smaller than that of the bottom surface 12 of the
image sensor 10.
[0020] The circuit board 20 has a plurality of circuits printed
thereon. The image sensor 10 is electrically connected to the
circuits of the circuit board 20. A square-shaped through opening
22 is defined in a central portion of the circuit board 20
corresponding to the block 31 of the supporting board 30. The
through opening 22 is the same size or a little larger than the
mounting surface 35 of the block 31, and smaller than the bottom
surface 12 of the image sensor 10.
[0021] When assembled, the circuit board 20 is mounted on the
supporting surface 34 of the supporting board 30. The block 31
extends through the through opening 22 of the circuit board 20. A
height of the block 31 is greater than a thickness of the circuit
board 20, and thus the mounting surface 35 of the supporting board
30 is higher than the circuit board 20. The image sensor 10 is
arranged on the mounting surface 35 of the block 31, and the signal
output terminals of the image sensor 10 are electrically connected
to the circuits of the circuit board 20 through wire bonding or
surface mount technology (SMT). Before mounting the image sensor 10
to the block 31, an adhesive layer 40 is applied on the mounting
surface 35 of the block 31. The adhesive layer 40 can be made of
thermosetting adhesives, ultraviolet (UV) light sensitive adhesives
or black adhesives. The image sensor 10 is thus adhered to the
block 31 by the adhesive layer 40. Because the block 31 of the
supporting board 30 is higher than the circuit board 20, the image
sensor 10 mounted on the block 31 is higher than and spaced from
the circuit board 20, and the connection of the image sensor 10 and
the circuit board 20 no longer affects positioning of the image
sensor 10. When the image sensor module 100 mounted to a camera
device, the light receiving section 11 formed on the top surface 13
of the image sensor 10 is horizontal. An optical axis of the image
sensor module 100 overlaps an optical center of the lens of the
camera. Thus coma aberration of the conventional image sensor
module is avoided, resulting in accurate image-capturing.
[0022] FIG. 4 shows a second embodiment of the image sensor module
200. Similar to the first embodiment, the image sensor module 200
includes an image sensor 10, a circuit board 50, and a supporting
board 60. The difference between the second embodiment and the
first embodiment is that the protrusion formed on the supporting
board 60 includes a pair of supporting members 61. The two
supporting members 61 are identical to each other, and are arranged
on a central portion of the supporting board 60 parallel to each
other. A distance between the two supporting members 61 is less
than a width of the image sensor 10. A top of each supporting
member 61 is at the same level as that of the other supporting
member 61, and thus the supporting members 61 have the same height
relative to the supporting board 60. The circuit board 50 defines a
pair of elongated through openings 52 corresponding to the
supporting members 61. Each through opening 52 is the same size or
a little larger than the supporting member 61. When assembled, each
supporting member 61 extends through one corresponding through
opening 52 to support the image sensor 10 thereon. A height of each
supporting member 61 is higher than the thickness of the circuit
board 50, and thus the tops of the supporting members 61 are higher
than the circuit board 50. The image sensor 10 mounted on the
supporting members 61 is higher than the circuit board 50 and thus
is spaced from the circuit board 50. The connection of the image
sensor 10 and the circuit board 50 no longer affects positioning of
the image sensor 10, and thus the image senor 10 can be accurately
mounted to the circuit board 50.
[0023] Referring to FIG. 5, the image sensor module 300 according
to a third embodiment is shown. The difference between the third
embodiment and the first embodiment is that the protrusion formed
on the supporting board 70 includes three supporting members 73,
and the circuit board 85 defines three through openings 75 for
extension of the supporting members 73 therethrough. The three
supporting members 73 include a pair of parallel first supporting
members 731, and a second supporting member 732 arranged between
and non-parallel to the parallel first supporting members 731. A
front end of the second supporting member 732 is located near a
front end of one first supporting member 73, and a rear end of the
second supporting member 732 is located near a rear end of another
first supporting member 73. The three through openings 75 of the
circuit board 85 also include a pair of parallel first through
openings 751 and a second non-parallel through opening 753. After
assembling the image sensor module 300, the image sensor 10 is
arranged on the three supporting members 73 and thus is spaced from
the circuit board 85. The second supporting member 732 is
configured for increasing contact area between the image sensor 10
and the supporting board 70, and thus improve stability of the
image sensor 10.
[0024] FIG. 6 shows the image sensor module 400 according to a
fourth embodiment. Similar to the third embodiment, the image
sensor module 400 includes a circuit board 87, an image sensor 10
being electrically connected to the circuit board 87, and a
supporting board 70 arranged under the circuit board 87 for
supporting the image sensor 10. The supporting board 70 forms three
supporting members 73, which include a pair of parallel first
supporting members 731 and a second non-parallel supporting member
732. The difference between the fourth embodiment and the third
embodiment is that the circuit board 87 only defines one
square-shaped through opening 77 for all of the supporting members
73 extending therethrough. It is to be understood that the block
31, the supporting members 61, 73 are configured for supporting the
image sensor 10 thereon, the shape or number of the block 31 and
the supporting members 61, 73 can be varied according to the size
of the image sensor 10.
[0025] It can be understood that the above-described embodiment are
intended to illustrate rather than limit the disclosure. Variations
may be made to the embodiments and methods without departing from
the spirit of the disclosure. Accordingly, it is appropriate that
the appended claims be construed broadly and in a manner consistent
with the scope of the disclosure.
* * * * *