U.S. patent application number 13/016396 was filed with the patent office on 2011-06-02 for modular command structure for memory and memory system.
This patent application is currently assigned to MOSAID TECHNOLOGIES INCORPORATED. Invention is credited to Jin-Ki KIM, HakJune OH, Hong Beom PYEON.
Application Number | 20110131383 13/016396 |
Document ID | / |
Family ID | 39690850 |
Filed Date | 2011-06-02 |
United States Patent
Application |
20110131383 |
Kind Code |
A1 |
KIM; Jin-Ki ; et
al. |
June 2, 2011 |
MODULAR COMMAND STRUCTURE FOR MEMORY AND MEMORY SYSTEM
Abstract
A system including a memory system and a memory controller is
connected to a host system. The memory system has at least one
memory device storing data. The controller translates the requests
from the host system to one or more separatable commands
interpretable by the at least one memory device. Each command has a
modular structure including an address identifier for one of the at
least one memory devices and a command identifier representing an
operation to be performed by the one of the at least one memory
devices. The at least one memory device and the controller are in a
series-connection configuration for communication such that only
one memory device is in communication with the controller for input
into the memory system. The memory system can include a plurality
of memory devices connected to a common bus.
Inventors: |
KIM; Jin-Ki; (Kanata,
CA) ; OH; HakJune; (Kanata, CA) ; PYEON; Hong
Beom; (Kanata, CA) |
Assignee: |
MOSAID TECHNOLOGIES
INCORPORATED
Ottawa
CA
|
Family ID: |
39690850 |
Appl. No.: |
13/016396 |
Filed: |
January 28, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11840692 |
Aug 17, 2007 |
7904639 |
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13016396 |
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60839329 |
Aug 22, 2006 |
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60902003 |
Feb 16, 2007 |
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60892705 |
Mar 2, 2007 |
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Current U.S.
Class: |
711/148 ;
711/E12.078 |
Current CPC
Class: |
Y02D 10/14 20180101;
Y02D 10/00 20180101; G06F 13/1678 20130101; G11C 7/1045 20130101;
G11C 7/10 20130101 |
Class at
Publication: |
711/148 ;
711/E12.078 |
International
Class: |
G06F 12/06 20060101
G06F012/06 |
Claims
1. A modular command structure comprising: a plurality of
separatable commands representing a request for access to at least
one of a plurality of memory devices, the plurality of separate
commands including: an address identifier comprising a device
address for the at least one of the a plurality of memory devices
and a bank address for one of a plurality of memory banks in the at
least one of the plurality of memory devices; and a command
identifier representing an operation to be performed by the at
least one of the plurality of memory devices.
2. The modular command structure of claim 1, wherein the address
identifier comprises an m-byte identifier, m being an integer.
3. The modular command structure of claim 2, wherein the device
address comprises an n-bit address and the bank address comprises a
p-bit address, each of n and p being an integer.
4. The modular command structure of claim 1, wherein the command
identifier comprises a q-byte identifier, q being an integer.
5. The modular command structure of claim 1, further comprising a
row address specifying a row in a memory bank of the at least one
of the plurality of memory devices to which the operation
represented by in the command identifier is to be applied.
6. The modular command structure of claim 1, further comprising a
row address when the operation is of a determined type, the row
address specifying a row in a memory bank of the at least one of
the plurality of memory devices to which the operation represented
by in the command identifier is to be applied.
7. The modular command structure of claim 5, wherein the row
address comprises an r-byte address, r being an integer.
8. The modular command structure of claim 1, further comprising a
column address specifying a column in a memory bank of the at least
one of the plurality of memory devices to which the operation
represented by in the command identifier is to be applied.
9. The modular command structure of claim 1, further comprising a
column address when the operation is of a determined type, the
column address specifying a column in a memory bank of the at least
one of the plurality of memory devices to which the operation
represented by in the command identifier is to be applied.
10. The modular command structure of claim 8, wherein the column
address comprises an s-byte address, s being an integer.
11. The modular command structure of claim 9, wherein the command
identifier comprises a q-byte identifier, q being an integer.
12. The modular command structure of claim 9, further comprising a
row address specifying a row in a memory bank of the at least one
of the plurality of memory devices to which the operation
represented by the command identifier is to be applied.
13. The modular command structure of claim 9, further comprising a
row address when the operation is of a determined type, the row
address specifying a row in a memory bank of the at least one of
the plurality of memory devices to which the operation represented
by in the command identifier is to be applied.
14. The modular command structure of claim 13, wherein the row
address comprises an r-byte address, r being an integer.
15. The modular command structure of claim 1, wherein the modular
structure further comprises a column address specifying a column in
a memory bank of the at least one memory device to which the
operation in the command identifier is to be applied.
16. The modular command structure of claim 1, wherein the modular
structure further comprises a column address when the operation is
of a determined type, the column address specifying a column in a
memory bank of the at least one memory device to which the
operation in the command identifier is to be applied.
17. The modular command structure of claim 3, wherein: the m-byte
identifier comprises a one-byte identifier; the n-bit address
comprises an six-bit address; and the p-bit address comprises a
two-bit address.
18. The modular command structure of claim 7, wherein the r-byte
address comprises a three-byte address
19. The modular command structure of claim 4, wherein the q-byte
identifier comprises a one-byte operation code.
20. A controller for a system having a plurality of memory devices
for storing data, the controller being in a series-interconnection
configuration for communication with the plurality of memory
devices, the controller comprising: a first connection for
receiving a request for access to at least one of the plurality of
memory devices; a translator for translating the request to a
plurality of separatable commands of a modular structure
interpretable by the at least one of the plurality of memory
devices, the plurality of separatable commands comprising an
address identifier for at least one of the plurality of memory
devices and a command identifier representing an operation to be
performed by the at least one of the plurality of memory devices;
and a second connection for communication with one of the plurality
of memory devices for issuing the plurality of separatable
commands.
21. A method for use in a system having a plurality of memory
devices for storing data, the method comprising: receiving a
request for access to at least one of the plurality of memory
devices; determining whether the request includes address
information; identifying a plurality of operations effecting the a
request for access to at least one of the plurality of memory
devices; and providing a plurality of separatable commands of a
modular structure, the plurality of separatable commands including
an address identifier having a device address for the at least one
of the plurality of memory devices and a command identifier
representing an operation to be performed by the at least one of
the plurality of memory devices.
22. The method of claim 21, wherein: the step of determining
comprises determining whether the address information included in
the request identifies at least one of the plurality of memory
devices; the step of identifying comprises identifying the a
plurality of operations that in combination effect the request; the
step of providing comprises providing the plurality of separatable
commands comprising the a device identifier including the memory
device address and a the memory bank address and the a command
identifier comprising one of the plurality of operations, where the
command identifier is interpretable by the at least one of memory
devices, the plurality of separatable commands being issued to the
plurality of memory devices.
23. The method of claim 21, wherein: the step of providing
comprises: generating an m-byte device identifier, m being an
integer. generating an n-bit memory device address and a p-bit
memory bank address, each of n and p being an integer; and
generating a q-byte command identifier, q being an integer, further
comprising interleaving issuance of each of the plurality of
separatable commands having different device identifiers.
24. The method of claim 21, wherein the at least one of the
plurality of memory devices comprises at least two memory banks,
the method controlling the at least two memory banks, the step of
determining comprising determining an address for the at least one
of the plurality of memory devices and an address for each of the
at least two memory banks; the step of identifying comprising
identifying a plurality of operations that in combination effect
the a request for access to each of the at least two memory banks;
the step of providing comprising generating the plurality of
separatable commands for each of the at least two memory banks, the
plurality of separatable commands being issued to the at least one
of memory devices.
25. The method of claim 21, wherein: the step of determining
comprises an address for each of the plurality of memory devices;
the step of identifying comprises identifying a plurality of
operations that in combination effect the request; the step of
providing comprises generating the a plurality of separatable
commands for the request for each of the plurality of memory
devices, the plurality of separatable commands including the
address identifier having the memory device address and the a
command identifier having one of the plurality of operations, where
the command identifier is interpretable by the at least one of
memory devices, the plurality of separatable commands being issued
to the at least one of the plurality of memory devices.
26. Use of a modular command structure to access a plurality of
memory devices, the command structure comprising: an address
identifier comprising an address for one of a plurality of memory
devices and an bank address for one of a plurality of memory banks
in the one of the plurality of memory devices; and a command
identifier comprising an operation code representing an operation
to be performed by the one of the plurality of memory devices.
27. The use of claim 26, wherein the modular command structure
comprises a plurality of separatable commands representing a
request for access to one of a plurality of memory devices, each of
the plurality of separate commands including the address identifier
and a command identifier comprising an operation code representing
an operation to be performed by the one of the plurality of memory
devices.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser.
No. 11/840,692, filed Aug. 17, 2007, claiming the benefit of U.S.
Provisional Patent Application No. 60/839,329 filed Aug. 22, 2006,
U.S. Provisional Patent Application No. 60/902,003 filed Feb. 16,
2007, and U.S. Provisional Patent Application No. 60/892,705 filed
Mar. 2, 2007, the disclosures of which are expressly incorporated
herein by reference in their entirety.
FIELD OF THE INVENTION
[0002] The present invention relates generally to semiconductor
memory devices and in particular to a system having multiple
interconnected semiconductor memory devices and command structure
for memory devices.
BACKGROUND
[0003] Semiconductor memory devices are commonly found in many
industrial and consumer electronics products. An increasing demand
for higher memory capacity coupled with a requirement for smaller
sizes results in a desire for memory with a density that is
difficult to attain. As a result, multiple memory devices are often
connected together to satisfy large memory requirements. Such
multi-device memory systems can be implemented together in a single
package (i.e., a multi chip system) or a multiplicity of memory
device packages grouped together on a printed circuit board.
[0004] When multiple semiconductor memory devices are
interconnected to function as a single system, a controller manages
data flow between the individual memory devices and external
interfaces providing requests for storing data, accessing data and
manipulating data in the system. A command structure is used by the
controller to provide those requests to the individual memory
devices containing the data. The command structure may be dependent
on the configuration of the interconnected memory devices and can
impact performance of the system. For example, if the individual
memory devices are in communication with the controller via a
common bus, then only one of the individual memory devices may be
asserted at any given time. If the individual memory devices are
serially interconnected in a chain configuration with only one
memory device connected to the controller, then commands for memory
devices located later in the chain may be significantly delayed by
earlier memory devices performing commands that cannot be
interrupted. In a configuration of series-connected memory devices,
the processing of a command at one device halts all transmission of
commands onto subsequent memory devices, resulting in a suspension
of any additional processing in the system.
SUMMARY
[0005] In accordance with one aspect of the present invention,
there is provided a modular command structure comprising: a device
identifier comprising an address for one of a plurality of memory
devices and an bank address for one of a plurality of memory banks
in the one of the plurality of memory devices; and a command
identifier comprising an operation code representing an operation
to be performed by the one of the plurality of memory devices.
[0006] In accordance with another aspect of the present invention,
there is provided, a modular command set comprising: a plurality of
separatable commands representing a request from a processor for
access to one of a plurality of memory devices, each of the
plurality of separate commands comprising: a device identifier
comprising an address for the one of a plurality of memory devices
and an bank address for one of a plurality of memory banks in the
one of the plurality of memory devices; and a command identifier
comprising an operation code representing an operation to be
performed by the one of the plurality of memory devices.
[0007] In accordance with another aspect of the present invention,
there is provided a system comprising: a memory system comprising
at least one memory device for storing data; a processor for
managing requests for access to the memory system; and a controller
for translating the requests from the processor to one or more
separatable commands interpretable by the at least one memory
device, each command having a modular structure comprising an
address identifier for one of the at least one memory devices and a
command identifier representing an operation to be performed by the
one of the at least one memory devices, the at least one memory
device and the controller being in a serial configuration for
communication.
[0008] In accordance with another aspect of the present invention,
there is provided a controller for a system having a plurality of
memory devices for storing data, the controller being in a serial
configuration for communication with the plurality of memory
devices, the controller comprising: a first connection for
receiving requests from the processor for access to the plurality
of memory devices; a translator for translating the requests from
the processor to a plurality of separatable commands interpretable
by the plurality of memory devices, each command having a modular
structure comprising an address identifier for one of the plurality
of memory devices and a command identifier representing an
operation to be performed by the one of the plurality of memory
devices; and a second connection in serial communication with one
of the plurality of memory devices for issuing the plurality of
separatable commands.
[0009] In accordance with another aspect of the present invention,
there is provided A method of requesting access to at least one
memory device, the method comprising: determining an address
including an address for the at lest one memory device; identifying
a plurality of operations that in combination effect a request for
access to the at least one memory device; and providing a plurality
of separatable commands to the at least one memory device, each of
the commands including a device identifier comprising the address
and a command identifier comprising one of the plurality of
operations, where the command identifier is interpretable by the
memory device.
[0010] In accordance with one embodiment of the present invention,
there is provided a command structure comprising: a plurality of
separatable commands representing a request for access to one of a
plurality of memory devices. Each of the plurality of separate
commands includes: a device identifier comprising an address for
the one of a plurality of memory devices and an bank address for
one of a plurality of memory banks in the one of the plurality of
memory devices; and a command identifier comprising an operation
code representing an operation to be performed by the one of the
plurality of memory devices.
[0011] In accordance with another embodiment of the present
invention, there is provided a modular command structure
comprising: a device identifier comprising an address for one of a
plurality of memory devices and an bank address for one of a
plurality of memory banks in the one of the plurality of memory
devices; and a command identifier comprising an operation code
representing an operation to be performed by the one of the
plurality of memory devices.
[0012] In accordance with another embodiment of the present
invention, there is provided a system comprising: a memory system
including at least one memory device for storing data; a processor
for managing requests for access to the memory system; and a
controller for translating the requests from the processor to one
or more separatable commands interpretable by the at least one
memory device, each command having a modular structure comprising
an address identifier for one of the at least one memory devices
and a command identifier representing an operation to be performed
by the one of the at least one memory devices; the at least one
memory device and the controller being in a series-connection for
communication.
[0013] For example, the at least one memory device includes at
least one memory bank. The address identifier may include a device
address for one of the at least one memory devices and a bank
address for one of the at least one memory banks. For example, the
memory device is a flash device, such as a NAND-type flash memory
device.
[0014] In a case where the memory system includes a plurality of
memory devices, the devices may be series-connected or connected to
a common bus.
[0015] In accordance with another embodiment of the present
invention, there is provided a controller for a system having a
plurality of memory devices for storing data, the controller being
in a series-interconnection configuration for communication with
the plurality of memory devices. The controller comprising: a first
connection for receiving requests for access to the plurality of
memory devices; a translator for translating the requests to a
plurality of separatable commands interpretable by the plurality of
memory devices, each command having a modular structure comprising
an address identifier for one of the plurality of memory devices
and a command identifier representing an operation to be performed
by the one of the plurality of memory devices; and a second
connection for communication with one of the plurality of memory
devices for issuing the plurality of separatable commands.
[0016] In accordance with another embodiment of the present
invention, there is provided a method comprising: determining an
address including a memory device address; identifying a plurality
of operations effecting a request for access to a memory; and
providing a plurality of separatable commands for the memory, each
of the commands including a device identifier having a memory
device address and a command identifier having one of the plurality
of operations.
[0017] Advantageously, the method is used for translating a request
for access to a memory device into a plurality of separatable
commands interpretable by the memory device. The method may be used
for translating a request for access to a memory device into a
plurality of separatable commands interpretable by the memory
device.
[0018] Other aspects and features of the present invention will
become apparent to those ordinarily skilled in the art upon review
of the following description of specific embodiments of the
invention in conjunction with the accompanying figures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Embodiments of the present invention will now be described,
by way of example only, with reference to the attached Figures,
wherein:
[0020] FIG. 1 is a block diagram illustrating a host system and a
system having a memory system and a memory controller, to which
embodiments of the present invention are applicable;
[0021] FIG. 2 is a block diagram illustrating a memory system
including a plurality of memory devices and a controller connected
to the memory system via a common bus, to which embodiments of the
present invention are applicable;
[0022] FIG. 3 is a block diagram illustrating a memory system
having a plurality of memory devices that are series-interconnected
and a controller connected to the memory devices, to which
embodiments of the present invention are applicable;
[0023] FIG. 4 is a block diagram illustrating an example of a
general configuration of a flash memory device, to which
embodiments of the present invention are applicable;
[0024] FIGS. 5A, 5B and 5C illustrate examples of modular command
structures for use with a NAND flash memory, to which embodiments
of the present invention are applicable;
[0025] FIG. 6A is a block diagram illustrating a configuration of a
flash controller to which embodiments of the present invention is
applicable;
[0026] FIG. 6B is a block diagram illustrating an example of
functional components of a flash command engine shown in FIG.
6A;
[0027] FIG. 7 is a flow chart illustrating a process conducted by a
Page Read command from the controller using the modular command
structure;
[0028] FIG. 8 illustrates a timing of a Page Read operation with a
set wait period from the flash memory device using the modular
command structure;
[0029] FIG. 9 illustrates a timing of a Page Read operation from
the flash memory device with a status request using the modular
command structure;
[0030] FIG. 10 is a flow chart illustrating a process conducted by
a Page Program command from the controller using the modular
command structure;
[0031] FIG. 11 illustrates a timing of a Page Program operation
from the flash memory device with a single data input using the
modular command structure;
[0032] FIG. 12 illustrates a timing of a Page Program operation
from the flash memory device with two data inputs using the modular
command structure;
[0033] FIG. 13 is a flow chart illustrating a process conducted by
a Block Erase command from the controller using the modular command
structure;
[0034] FIG. 14 illustrates a timing of a Block Erase operation with
a single block address to erase from the flash memory device using
the modular command structure;
[0035] FIG. 15 illustrates a timing of a Block Erase operation with
two block addresses to erase from the flash memory device using the
modular command structure;
[0036] FIG. 16 is a flow chart illustrating a process conducted by
concurrent Page Read commands from the controller for two memory
banks in the same flash memory device using the modular command
structure;
[0037] FIG. 17 illustrates a timing from the flash memory of
concurrent Page Read operations for two memory banks in the same
flash memory device using the modular command structure;
[0038] FIG. 18 is a flow chart illustrating a process conducted by
concurrent Page Program commands from the controller for two memory
banks in the same flash memory device using the modular command
structure;
[0039] FIG. 19 illustrates a timing from the flash memory of
concurrent Page Program operations for two memory banks in the same
flash memory device using the modular command structure;
[0040] FIG. 20 is a flow chart illustrating a process conducted by
concurrent Block Erase commands from the controller for two memory
banks in the same flash memory device using the modular command
structure;
[0041] FIG. 21 illustrates a timing from the flash memory of
concurrent Block Erase operations for two memory banks in the same
flash memory device using the modular command structure;
[0042] FIG. 22 is a flow chart illustrating a process conducted by
interleaved Page Read and Page Program commands from the controller
for two memory banks in the same flash memory device using the
modular command structure;
[0043] FIG. 23 illustrates a timing from the flash memory device of
interleaved Page Read and Page Program operations for two memory
banks in the same flash memory device using the modular command
structure;
[0044] FIG. 24 is a flow chart illustrating a process conducted by
suspended and resumed Page Read and Page Program commands from the
controller for two memory banks in the same flash memory device
using the modular command structure;
[0045] FIG. 25 illustrates a timing from the flash memory device of
suspended and resumed Page Read and Page Program operations for two
memory banks in the same flash memory device using the modular
command structure;
[0046] FIG. 26 illustrates an example of interleaved and concurrent
Page Read, Block Erase, Page Program and Page-pair Erase
commands/operations for multiple flash memory devices, each having
multiple memory banks;
[0047] FIG. 27 illustrates an example of interleaved and concurrent
Page Read commands/operations for multiple flash memory devices,
each having multiple memory banks; and
[0048] FIG. 28 illustrates an example of interleaved and concurrent
suspended and resumed Page Read, Block Erase, Page Program and
commands/operations for multiple flash memory devices, each having
multiple memory banks.
DETAILED DESCRIPTION
[0049] In the following detailed description of sample embodiments,
reference is made to the accompanying drawings which form a part
hereof, and in which is shown by way of illustration specific
sample embodiments. These embodiments are described in sufficient
detail to enable those skilled in the art to practice the present
invention, and it is to be understood that other embodiments may be
used and that logical, mechanical, electrical and other changes may
be made without departing from the scope of the present invention.
Therefore, the following detailed description is not to be taken in
a limiting sense.
[0050] Semiconductor memory devices are often interconnected to
form a large capacity memory system. FIG. 1 illustrates a system to
which embodiments of the present invention are applicable.
Referring to FIG. 1, a host system 102 having a processor 103
therein is connected to a system that includes a memory system 106
and a controller 104 for controlling the memory system. The memory
system 106 includes at least one memory device (e.g., two flash
memory devices 107-0 and 107-1). The controller 104 receives
requests from the host system 102 and translates the requests into
commands that are interpretable by the memory system 106. The
controller 104 also translates logical addresses for the memory
system 106 that are used by the host system 102 into physical
addresses of the memory system 106. The controller 104 ensures that
data to be stored in the memory system 106 is distributed among the
memory devices 107-0, 107-1. An error correcting code (ECC) is also
generated by the controller 104 to check for errors in the
execution of commands.
[0051] FIG. 2 shows an example of a system configuration to which
embodiments of the present invention are applicable. Referring to
FIG. 2, a controller 112 communicates with a memory system
including a plurality of memory devices (e.g., four flash memory
devices 108-0-108-3) through a common bus 114. The controller 112
uses the common bus 114 to transfer data into and out of the memory
devices 108-0-108-3. Only a designated flash memory device is
asserted at a time with this configuration by asserting a chip
enable signal.
[0052] FIG. 3 shows another example of a system configuration to
which embodiments of the present invention are applicable. A memory
system includes series-connected memory devices. Referring to FIG.
3, a controller 116 and a memory system including a plurality of
memory devices (e.g., four flash memory devices 109-0-109-3) are
interconnected in a loop configuration. Since the memory devices
109-0-109-3 are series-interconnected, only one of the devices
receives data and messages incoming to the memory system through
the controller 116. Each of the memory devices 109-0-109-3 is
coupled to at most two other memory devices (i.e., prior and next
devices). As such, data and messages coming into the memory system
pass through every other memory device to reach the last device
109-3 in the series connection.
[0053] The flash memory devices can be any type of flash memories,
e.g., NAND-, NOR-, AND-type flash memories. Also, the memory
devices can be random access memories.
[0054] NAND flash memory devices are commonly interconnected to
provide low cost, high density memory. FIG. 4 illustrates the
functional components of a NAND flash device 400. In the NAND flash
device 400, commands, addresses and data are multiplexed via common
I/O pins in a chip of the device. The NAND flash device 400 has a
memory bank 402 which is a cell array structure having a plurality
(n) of erasable blocks. Each of the erasable blocks is subdivided
into a plurality (m) of programmable pages. Each of the pages
consists of (j+k) bytes. The pages are further divided into a
j-byte data storage region in which data is stored and a separate
k-byte are typically used for error management functions. Each page
typically comprises 2,112 bytes of which 2,048 bytes are used to
data storage and 64 bytes are used for error management functions.
The memory bank 402 is accessed by the pages. Although FIG. 4 shows
a single memory bank 402, the NAND flash device 400 may have more
than one memory bank 402. Each such memory bank 402 may be able to
perform concurrent page read, page program, page erase and block
erase operations.
[0055] Commands for accessing the memory bank 402 are received by a
command register 414 and control logic 416 from a controller (e.g.
the controller 116 shown in FIG. 3). The received commands enter
the command register 414 and remain there until execution. The
control logic 416 converts the commands into a form that can be
executed against the memory bank 402. The commands generally enter
the NAND flash device 400 via the assertion of different pins on
the external packaging of the chip, where different pins may be
used to represent different commands. For example, the commands may
include chip enable, read enable, write enable, and write protect.
The read and write commands are executed on a page basis while the
erase commands are executed on a block basis.
[0056] When a command is received by the command register 414 and
the control logic 416, an address for the page in the memory bank
402 to which the command pertains is received by an output driver
412. The address is provided to address buffers and latches 418 and
then control and predecoder 406, sense amplifier (S/A) and data
register 404 and row decoder 408 for accessing the page indicated
by the address. The data register 404 receives the complete page
which is then provided to the I/O (input/output) buffers and
latches 410 and then the output driver 412 for output from the NAND
flash device 400.
[0057] For example, a read command is received by the command
register 414 and the control logic 416 and an accompanying address
is received by the address buffers and latches 418. The address
buffers and latches 418 determine the page in which the address is
located and provide a row address(es) corresponding to the page to
the row decoder 408. The corresponding row is activated. The data
register and S/A 404 sense the page and transfer the data from the
page into the data register 404. Once the data from the entire page
has been transferred to the data register, the data is sequentially
read from the device via the I/O buffers and latches 410 and the
output driver 412.
[0058] A program command is also processed on a page basis. The
program command is received by the command register 414 and the
control logic 416, an accompanying address is received by the
address buffers 418 and input data are received by the output
driver 412. The input data is transferred to the data register 404
through the I/O buffers and latches 410. Once all of the input data
is in the data register 404, the page on which the input data is to
be stored is programmed with the input data.
[0059] An erase command is processed on a block basis. The erase
command is received by the command register 414 and the control
logic 416 and a block address is received by the address buffers
418.
[0060] A typical NAND flash memory command uses two cycles of
command to complete loading of the command. Table 1 shows an
example command set of NAND flash memories.
TABLE-US-00001 TABLE 1 Command Set of NAND Flash Function 1st Cycle
2nd Cycle Read 00h 30h Read for Copy Back 00h 35h Read ID 90h --
Reset FFh -- Page Program 80h 10h Cache Program 80h 15h Copy-Back
Program 85h 10h Block Erase 60h D0h Random Data Input 85h -- Random
Data Output 05h E0h Read Status 70h
[0061] Many of the commands issued to a NAND flash memory in the
two command cycles are considered as one procedure and as such
cannot be broken, interrupted, suspended or resumed. When the NAND
flash memory is receiving these two command cycles, it cannot
accept any additional commands other than reset and read status
commands. In flash memory devices having multiple memory banks,
this command structure restricts the use of banks as one bank
remains inactive while the other bank is processing a command. This
results in low input/output utilization when the commands being
performed having long internal core operations (e.g., page read at
20 .mu.s, page program at 200 .mu.s and block erase at 1.5 ms). In
systems having multiple flash memories being series-interconnected,
this command structure may reduce the processing speed of the
entire system as a flash memory device that is processing a command
cannot forward other commands to subsequent flash memory devices
until that processing is complete.
[0062] An example of a command structure applicable to a system
according to an embodiment of the present invention includes a
command field having a byte(s). For example, the command field has
a first byte for device and bank addresses and a second byte for
operation codes.
[0063] FIG. 5A, shows an example of modular command structure for
use with a NAND flash memory. In this particular example, the
modular command structure is a byte basis. Referring to FIG. 5A, a
modular command structure 500 includes first and second bytes 502
and 508 (Bytes 1 and 2), each having a plurality of bits. In this
particular example, the first and second bytes 502 and 508 of the
command structure include an eight-bit address and an eight-bit
operation code, respectively. The first byte 502 has a six-bit
address 504 for the destination memory device. The six-bit address
504 is used to differentiate among memory devices where the system
includes a plurality of memory devices. The first byte 502 also
includes a two-bit address 506 for a memory bank of the memory
device for use with memory devices having a plurality of memory
banks. The second byte 508 of the command structure includes an
eight-bit operation code 510 indicating the command to be performed
by the memory device. Table 2 illustrates examples of operation
codes.
TABLE-US-00002 TABLE 2 Example Operation Codes for Second Byte
Second Byte Address (OP7-OP0) Command Input 0 0 0 0 0 0 0 0 Page
Read (00h) Row 0 0 0 0 0 0 1 1 Burst Data Read (03h) Column 0 0 0 0
0 1 0 1 Page Read for Copy Row (05h) 0 0 0 0 1 0 0 1 Burst Data
Load Start Column (09h) 0 0 0 0 1 0 1 0 Burst Data Load (0Ah)
Column 0 0 0 0 1 1 1 1 Page Program (0Fh) Row 0 0 0 1 0 0 1 0
Address Input for Block Row Erase (12h) 0 0 0 1 0 1 1 1 Block Erase
(17h) None 0 0 0 1 0 1 0 0 Address Input for Page- Row pair Erase
(14h) 0 0 0 1 1 1 1 0 Page-pair Erase (1Eh) None 0 0 1 1 0 0 1 1
Read Device Status (33h) None 0 0 1 1 0 1 0 1 Read Device ID (35h)
None 0 0 1 1 1 0 0 1 Write Device Address None (39h) 0 0 1 1 1 0 1
0 Write Configuration None Register (3Ah) 0 0 1 1 1 1 1 1 Reset
(3Fh) None
[0064] The command structure has many variations. Another example
of the two-byte command structure is that the first byte has
eight-bit device address (DA) and the second byte has four-bit OP
code and a four-bit bank address (BA).
[0065] FIG. 5B shows another example of modular command structure
for use with a NAND flash memory. Referring to FIG. 5B, a command
structure 520 includes a plurality of bytes. In the illustrated
example, the command structure 520 has a two-byte modular command
structure (Bytes 1 and 2) with a three-byte row address 522 (Bytes
3-5). A partial structure of the two-byte modular command in FIG.
5B is identical to the two-byte modular command structure shown in
FIG. 5A. The first byte 502 has a six-bit address 504 for the
destination memory device and a two-bit address 506 for the memory
bank. The second byte 508 has an eight-bit operation code 510. The
three-byte row address 522 provides a 24-bit address 524 for a
row(s) in the memory bank indicated in the first byte 502. This
24-bit (i.e., three-byte) row address 524 is used for commands for
which a row address is required to specify a row location on which
the command is to be performed.
[0066] FIG. 5C shows another example of modular command structures
for use with a NAND flash memory. Referring to FIG. 5C, a command
structure 540 includes a plurality of bytes. In the illustrated
example, the command structure 540 has a two-byte modular command
structure (Bytes 1 and 2) with a two-byte column address 542 (Bytes
3-4). A partial structure of the two-byte modular command in FIG.
5C is identical to the two-byte modular command in FIG. 5B with the
first byte 502 having a six-bit address 504 for the destination
memory device and a two-bit address 506 for the memory bank. The
second byte 508 has an eight-bit operation code 510. The two-byte
address 542 provides a 16-bit address 544 for a column(s) in the
memory bank indicated in the first byte 502. This 16-bit (i.e.,
two-byte) column address 544 is used for commands for which a
column address is required to specify a column location on which
the command is to be performed.
[0067] The command structures 500, 520 and 540 depend on the
command that is being sent to the memory device. As indicated in
Table 2, some commands require additional addresses to be supplied
with the command (i.e., row or column addresses). Thus, the command
structures 500, 520 and 540 depend on the operation code in the
second byte 508.
[0068] Referring to FIGS. 1 and 5A-5C, the controller 104
translates a request from the host system 102 into one of the
command structures 500, 520 and 540 which can then be interpreted
by the flash memory devices. Based on the operation code 510, the
controller 104 determines whether a row address, column address or
no address will be supplied to the memory device. The controller
104 forms the commands that are used by the memory devices 107-0,
107-1 to perform operations.
[0069] Each of the command structures 500, 520 and 540 includes
both the memory device address 504 and the bank address 506. Thus,
processing of commands can be broken up and suspended by different
memory devices. Further, since the first byte 502 includes all
addressing information, each memory device can assess very quickly
whether the command indicated in the second byte 508 is destined
for them or is to be passed on to the next memory device.
[0070] Although the modular command structures 500, 520 and 540 can
be used in any NAND flash memory device, the following examples
describe the processing of various commands in the modular command
structures 500, 520 and 540 using an HLNAND.TM. (HyperLink NAND)
flash device as am example. The HLNAND.TM. flash device is
described in detail in U.S. Provisional Patent Application No.
60/839,329 filed on Aug. 22, 2006 and incorporated herein by
reference.
[0071] An exemplary input sequence of the modular commands 500, 520
and 540, depending on the particular command in the operation code,
for the HLNAND.TM. flash device, is shown in Table 3. All commands,
addresses and data are shifted in and out of the device, starting
with the most significant bit (MSB). In the HLNAND.TM. flash
device, serial data input (SDn) is sampled at the positive or
negative clock edge while Serial Data-Input Enable (SDE) is "high".
In the particular example shown in Table 3, each command includes
one-byte target address represented as "TDA" (the first byte) as
per the command structures 500. 520 and 540 shown in FIGS. 5A to 5C
and one-byte operation code represented (the second byte). Once SCE
goes to logic "high", the one-byte address is shifted in followed
by the one-byte operation code. The exception to this is the Write
Device Address in which the first byte entering the device is a
page read command. Depending on the command, either a three-byte
row address represented as "R" in Table 3 or a two-byte column
address represented as "C" in Table 3 (the third-fifth bytes). If
data is to be provided to the flash device then the data is input
into the device after any row or column addresses (as appropriate)
and is represented by "D" in Table 3.
TABLE-US-00003 TABLE 3 Modular Command Input Sequence Input Byte
Number Command 1.sup.st 2.sup.nd 3.sup.rd 4.sup.th 5.sup.th
6.sup.th 7.sup.th . . . 2115.sup.th 2116.sup.th Page Read TDA 00h R
R R -- -- -- -- -- Burst Data Read TDA 03h C C -- -- -- -- -- --
Page Read for Copy TDA 05h R R R -- -- -- -- -- Burst Data Load
Start TDA 09h C C D D D . . . D D Burst Data Load TDA 0Ah C C D D D
. . . D D Page Program TDA 0Fh R R R -- -- -- -- -- Address Input
for Block Erase TDA 12h R R R -- -- -- -- -- Block Erase TDA 17h --
-- -- -- -- -- -- -- Address Input for Page-pair Erase TDA 14h R R
R -- -- -- -- -- Page-pair Erase TDA 1Eh -- -- -- -- -- -- -- --
Read Device Status TDA 33h -- -- -- -- -- -- -- -- Read Device ID
TDA 35h -- -- -- -- -- -- -- -- Write Device Address 00h 39h -- --
-- -- -- -- -- -- Write Configuration Register TDA 3Ah D -- -- --
-- -- -- -- Reset TDA 3Fh -- -- -- -- -- -- -- --
[0072] Examples of the operation of the HLNAND.TM. flash device
using the modular command structures 500, 520 and 540 for various
operations are described below. The examples below include timing
diagrams illustrating processing the memory devices (e.g., the
memory devices shown in FIGS. 1-3). The signals in the timing
diagrams are shown for the HLNAND.TM. flash device as an example.
The chip enable (CE#) signal indicates that the memory device is
enabled when this signal is "low". The serial data input (SDn)
signal indicates command, address and input data. The serial data
output (SQn) signal indicates a transmission of output data during
a read operation. The serial data input enable (SDE) signal
controls data input such that when this signal is "high", command
address and input data (SDn) are latched into the device. The
serial data output enable (SQE) signal enables output (SQn) when
this signal is "high".
[0073] In a case where device addresses are assigned to all of
series-connected devices (e.g., the configuration as shown in FIG.
3) at the start of system operation, the first byte of the command
does not need the Write Device Address. The assignment of
sequential device addresses is disclosed in U.S. Provisional Patent
Application No. 60/787,710, filed Mar. 28, 2006 and U.S.
Provisional Patent Application No. 60/802,645, filed May 23, 2006;
all of which are incorporated herein by reference in their
entirety.
[0074] FIG. 6A shows an example of a flash controller to which
embodiments of the present invention are applicable. The flash
controller corresponds to the controllers 104, 112 and 116 shown in
FIGS. 1, 2, and 3.
[0075] Referring to FIG. 6A, a flash controller 310 includes a
central processing unit (CPU) 312; and a memory 314 having a random
access memory (RAM) 316 and a read only memory (ROM) 318. Also, the
flash controller 310 includes a flash command engine 322, an error
correcting code (ECC) manager 324 and a flash device interface 326.
Furthermore, the flash controller 310 includes a host interface
controller 332 and a host interface 334. The CPU 312, the memory
314, the flash command engine 322 and the host interface controller
332 are connected through a common bus 330. The host interface 334
is for connection to an external device through a bus, connection
links, interface or like (e.g., ATA (Advanced Technology
Attachment), PATA (Parallel ATA), SATA (Serial ATA), USB (universal
serial bus). The host interface 334 is controlled by the host
interface controller 332. The CPU 312 operates with instructions
stored in the ROM 318 and processed data is stored in the RAM 316.
The flash command engine 322 interprets the commands and the flash
controller 310 controls the operations of the flash devices through
the flash device interface 326. The ECC manager 324 generates an
ECC and the ECC verification is conducted. In a case of an error,
an error message is generated. The flash controller 310 can be
configured as a system on chip, system in package or multiple
chips.
[0076] FIG. 6B shows an example of functional components of the
flash command engine 322 of FIG. 6A, when issuing a command to
flash devices. Referring to FIGS. 1, 6A and 6B, the flash command
engine 322 interprets the requests from the host system 102 into a
plurality of separatable commands that are interpretable by the
flash memory device. Thus, the flash controller 310 translates a
request for access to flash memory device into at least one command
using the modular command structure shown in FIGS. 5A to C. The
flash controller 310 includes a connection with the bus 330
connected to the host interface controller 332. The connection
enables communication with the host system 102 for receiving
requests from the processor 103 of the host system 102 for access
to the flash memory device. The flash controller 310 also includes
the flash device interface 326 in communication with the flash
memory device. The flash device interface 326 acts as another
connection for issuing commands to the flash memory devices of the
memory system.
[0077] The flash command engine 322 includes a command structure
mechanism 558, a bank interleave mechanism 560, a device interleave
mechanism 562, an address identify mechanism 564, a command
identify mechanism 566, a row address identify mechanism 568, and a
column address identify mechanism 570. The command structure
mechanism 558 processes the modular command structures to be used
by the memory devices (e.g., the modular command structures shown
in FIGS. 5A to C). The address identify mechanism 564 and the
command identify mechanism 566 analyze the request from the host
system 102 to extract the memory device and/or bank address and the
command, respectively, therefrom. The command identify mechanism
566 determines that multiple commands are to be used to implement
the request. Each of the commands is separatable and in combination
effects the request from the host system 102. The command identify
mechanism 566 gathers the information to formulate the command,
including the address from the address identifying mechanism 564.
If any of the commands that form the request respects a row or
column address then the command identify mechanism 566 enlists the
use of the row address identify mechanism 568 or the column address
identify mechanism 570, respectively, to obtain the row or column
address that form part of the command.
[0078] The bank interleave mechanism 560 and the device interleave
mechanism 562 order multiple commands being send through the device
interface 326 to multiple memory banks or memory devices,
respectively. The modular command structure is configured so that a
flash memory device having multiple memory banks can have each
memory bank processing simultaneously. Likewise, the modular
command structure is configured so that the series-connected memory
devices can be simultaneously processing. The bank interleave
mechanism 56Q interleaves commands for different memory banks in
the same memory device (see FIGS. 16-21 for examples of concurrent
operations in multiple memory banks). The device interleave
mechanism 562 interleaves commands for different memory devices in
the same memory system (see FIGS. 22-28).
[0079] The EEC manager 324 generates an error correcting code (ECC)
to verify that certain commands have been performed successfully
and completely.
[0080] FIG. 6B illustrates the functional components of the flash
command engine 322 and may be realized in a number of
configurations that will be recognized by a person of skill in the
art.
[0081] The modular command can include a Page Read command. With a
modular command structure the first cycle of the Page Read command
is input followed by a column address for the start column address
in a target page address and a row address for the target page
address. The second cycle of the Page Read command is in input
after which the device is busy for a time period (e.g., 20 .mu.s)
for completion of the internal page read operation. After such a
wait time period, a Burst Data Read operation is performed to
retrieve the data from buffers of the device. From the time this
operation starts until the Burst Data Read is finished, the device
cannot perform any other operations.
[0082] FIG. 7 shows a flow of the Page Read command. The controller
for the system generates a Page Read command in step 602 including
a destination flash device address, a memory bank address, the Page
Read operation code and a three-byte row address for the row(s)
defining the page to be read. The Page Read command is passed
through the flash devices forming the system until the destination
flash device address matches the flash device receiving the Page
Read command. The Page Read command including the row address(es)
is received by the destination flash device. The Page Read command
is provided to the command register of the destination flash where
the address latch cycles are then started to enter the three-bytes
of row address. Once the address latch cycles are finished, the
Page Read operation is started in the flash device and the data in
the selected page is sensed and transferred to the data registers
in less than time t.sub.R (transfer time from memory bank to data
registers, e.g., 20 .mu.s).
[0083] The controller either waits for t.sub.R to collect the data
from the page or the controller generates and sends a device status
inquiry to the flash device to receive a notification when the page
has been accessed. In the case where the controller generates a
device status command, the command is sent to the flash device in
step 604. The flash device will response to this request with a
continuous busy indication until the page has been accessed, at
which time the flash device indicates that the memory bank is ready
and no longer busy. The controller continuous checks to determine
whether the memory bank is ready in step 606.
[0084] Once the memory bank is ready, or if the controller waits
for t.sub.R, a Burst Data Read command with the device address and
the column address is then issued in step 608. If the controller
does not send a device status inquiry and waits for t.sub.R
instead, then steps 604 and 606 are not performed. Once the device
receives the Burst Data Read then the SQE signal is enabled and the
page data in the data registers is read out in step 610 starting
from the column address given with the command. This reading
continues via SQn until SQE goes low.
[0085] An error correcting code (ECC) is generated by the
controller in step 612 and verified in step 614. If the ECC cannot
be verified then an error message is issued in step 616. If the ECC
is verified then the Page Read operation was successful and the
operation is completed in step 618. For example, the flash device
controller generates ECC parity bits for 2048 byte input data per
page. Thus, 2048 byte data with ECC parity bits are programmed
(typically one-byte ECC per 512 bytes, total four byte ECC per 2048
bytes in a page). The ECC parity bits are programmed in 64 bytes
spare field in a page. During the page read, the flash device
controller reads 2048 bytes data with ECC parity information. The
flash device controller verifies the 2048 data with four byte ECC
information. Therefore, the ECC process is performed by the flash
device controller and the flash memory devices store only ECC
parity information.
[0086] FIG. 8 illustrates a timing diagram for a Page Read
operation from the perspective of the flash device where the
controller waits for the expiration of t.sub.R to obtain the
requested data. If the Burst Data Read command is issued and SQE is
enabled during the Bank Busy period t.sub.R, all output data will
be invalid.
[0087] FIG. 9 illustrates a timing diagram for a Page Read
operation with a device status from the controller from the
perspective of the flash device.
[0088] The modular command can include a Page Program command. With
a modular command structure the first cycle of the Page Program
command is input followed by a column address for the start column
address in a target page address and a row address for the target
page address. The input data is then loaded followed by the second
cycle of the page pate program command. The device is busy for a
time period (e.g., 200 .mu.s) after the second cycle during
completion of an internal Page Program operation. These steps are
all considered as one procedure that cannot be interrupted if the
Page Program operation is to be completed.
[0089] FIG. 10 illustrates a flow of a Page Program command from
the flash device controller. The controller for the system
generates a Burst Data Load Start command in step 902 including a
destination flash device address, a memory bank address, the Burst
Data Load Start operation code and a two-byte column address for
the column(s) that are to be programmed. The Burst Data Load Start
command is passed through the flash devices forming the system
until the destination flash device address matches the flash device
receiving the Burst Data Load Start command. The Burst Data Load
Start command is provided to the command register of the
destination flash device along with the two-byte columns address in
step 904 and then the input data in step 906. The Burst Data Load
Start command resets all data registers in the destination flash
device. If the Burst Data Load Start operation did not input all
data into the flash device then subsequent Burst Data Load commands
may be used to place all data in the device.
[0090] The flash device controller generates a Page Program command
in step 908 again specifying the destination device address and the
memory bank address as well as the Page Program operation code and
a row address(es) that specify the rows that will be written in the
Page Program operation. The Page Program command is generated by
the controller a time t.sub.DDE after the data has been loaded into
the flash device from the Burst Data Load Start command. This will
program the loaded data into the selected page location.
[0091] The controller uses a Device Status command issued in step
910 to monitor the status of the Page Program operation. The flash
device will respond to this request with a continuous busy
indication until the page has been accessed, at which time the
flash device indicates that the memory bank is ready and no longer
busy. The controller continuous checks to determine if the memory
bank is ready in step 912. Once the memory bank is ready the
controller checks to see is the Page Program operation was
successful. If not then an error is output in step 916, otherwise,
the Page Program operation is completed in step 918.
[0092] FIG. 11 illustrates a timing diagram for a Page Program
operation from the perspective of the flash device where the Burst
Data Load Start is sufficient to load all data into the device.
FIG. 12 illustrates a timing diagram for a Page Program operation
where a Burst Data Load operation is required after the Burst Data
Load Start operation in order to load all data into the device.
[0093] The modular command can include a Block Erase command. With
a command structure the first cycle of the Block Erase command is
input followed by a row address for the target block address. The
second cycle of the Block Erase command is input after which the
device is busy for 1.5 ms to complete the internal block erase
operation.
[0094] FIG. 13 is a flow of a Block Erase operation from the
controller. The flash device controller for the system generates an
Address Input for Block Erase command in step 1202 including a
device address, a memory bank address, an operation code and a
three-byte row address in step 1204. If more than one block is to
be erased at a time in step 1206 then additional Address Input for
Block Erase commands are generated by the controller to specify
these additional blocks. When all blocks have been specified, the
controller generates a Block Erase command in step 1208 to start
the flash device performing the Block Erase operation for the
selected blocks. The Block Erase command generated by the
controller includes the device address, the memory bank address and
the operation code.
[0095] The controller issues a Status command in step 1210 that is
used to determine when the memory bank is available and the Block
Erase operation is completed. The controller continuously checks in
step 1212 on the device status until the memory bank is available.
When Block Erase operation is complete, the controller checks to
see if the operation was successful in step 1214. If the operation
was not successful then an error is issued in step 1216, otherwise
the Block Erase operation is completed in step 1218.
[0096] FIG. 14 illustrates a timing diagram for a Block Erase
operation from the perspective of the flash device where only a
single block is being erased. FIG. 15 illustrates a timing diagram
for a Block Erase operation where multiple blocks are being
erased.
[0097] The modular command structures illustrated in FIGS. 5A to C
provide for a memory bank address to be supplied in the first byte
along with the device address. This memory bank address is used in
circumstances where the flash memory device has more than one
memory bank to specify the memory bank to which the command is
directed. Since a command with the modular command structure
specifies the memory bank address in the command, a flash device
having a configuration in which each memory bank operates
independently, will be able to have operations being performed on
more than one of the memory banks in the flash device at a time.
The HLNAND.TM. flash device is an example of one such flash
memory.
[0098] The pin configuration of multiple HLNAND.TM. flash devices
that are cascaded at the top level may be identical to one of the
single devices. With a serial interconnection configuration, each
device introduces an additional half clock cycle latency, for
example, on a cascading path. As such, the number of cascaded
devices determined a total clock latency of operations in the
serial interconnection configuration. With a configuration of
multiple devices having multiple memory banks interconnected, the
controller can effectively schedule many different procedures that
are accessing time consuming core operations by interleaving the
commands.
[0099] FIGS. 16 to 21 illustrate concurrent operations being
performed on two memory banks in a single flash memory device.
[0100] FIG. 16 illustrates a flow for a concurrent Page Read
operation from two memory banks in the same flash memory device. A
Page Read command is given to memory bank 0 in step 1502. Memory
bank 0 then proceeds to process the request by accessing the
requested page. While memory bank 0 is processing the Page Read
command, a second Page Read command is given to memory bank 1 in
step 1504. Memory bank 1 then proceeds to process the request by
accessing the requested page while memory bank 0 is concurrently
processing its own request. A time t.sub.R1 after the Page Read
request is given to memory bank 0 is then allowed to elapse in step
1506 before a Burst Data Read command is given to memory bank 0 in
step 1508 to access the data resulting from the Page Read command
issued in step 1502. A time t.sub.R2 after the Page Read request is
given to memory bank 1 is allowed to elapse in step 1510 before a
Burst Data Read command is given to memory bank 1 in step 1512 to
access the data resulting from the Page Read command issued in step
1504.
[0101] FIG. 17 illustrates a timing of the concurrent Page Read
operation illustrated in FIG. 16.
[0102] FIG. 18 illustrates a flow for a concurrent Page Program
operation in two memory banks of the same flash memory device. A
Burst Data Load Start command is given to memory bank 0 in step
1702 along with data to be programmed into memory bank 0. A Burst
Data Load Start command is given to memory bank 1 in step 1704
along with data to be programmed into memory bank 1. A Page Program
command is given to memory bank 0 1 in step 1706 and a Page Program
command is given to memory bank 1 in step 1708. Read Status
commands are given to memory bank 0 in step 1710 and memory bank 1
in step 1712 to monitor the progress of each memory bank in
completing the Page Program operation. When the status returns a
pass for each memory bank then the Page Program operations are
complete and other operations can be performed by the memory
banks.
[0103] FIG. 18 shows the Burst Data Load Start command being given
to each memory bank before the Page Program command was provided to
each bank. The Burst Data Load Start and the Page Program command
may both be given to memory bank 0 before either of the commands is
given to memory bank 1. FIG. 19 illustrates a timing of the
concurrent Page Program operation in which the Burst Data Load
Start and the Page Program command are given to memory bank 0
before either of the commands is given to memory bank 1.
[0104] FIG. 20 illustrates a flow for a concurrent Block Erase
operation in two memory banks of the same flash memory device. An
Address Input for Block Erase command is given to memory bank 0 in
step 1902 along with the address of the block to be erased. An
Address Input for Block Erase command is given to memory bank 1 in
step 1904 along with the address of the block to be erased. A Block
Erase command is provided to memory bank 0 in step 1906 upon
receipt of which the block indicated in the Address Input for Block
Erase command received in step 1902 is erased. A Block Erase
command is provided to memory bank 1 0 in step 1908 upon receipt of
which the block indicated in the Address Input for Block Erase
command received in step 1904 is erased. A Read Status command is
given to memory bank 0 in step 1910 and also to memory bank 1 in
step 1912 to monitor the progression of the Block Erase operation.
When the status returns a pass for each memory bank then the Block
Erase operations are complete and other operation can be performed
by the memory banks.
[0105] FIG. 20 shows the Address Input for Block Erase command
being given to each memory bank before the Block Erase command was
provided to each bank. The Address Input for Block Erase and the
Block Erase command may both be given to memory bank 0 before
either of the commands is given to memory bank 1. FIG. 21
illustrates a timing of the concurrent Block Erase operation in
which the Address Input for Block Erase and the Block Erase command
are given to memory bank 0 before either of the commands is given
to memory bank 1
[0106] The operations that are concurrently performed by the memory
banks are not necessarily the same operation. FIGS. 22 to 25
illustrate different operations being performed concurrently by two
memory banks of the same flash memory device.
[0107] FIG. 22 illustrates a flow for concurrent Page Read and Page
Program operations in two memory banks of the same flash memory
device. A Page Read command is given to memory bank 0 in step 2102.
While memory bank 0 is accessing the page indicated in the Page
Read command, a Burst Data Load Start command is given to memory
bank 1 in step 2104 along with data that is to be programmed into
memory bank 1. A Page Program command is given to memory bank 1 in
step 2106 to start programming of the data into memory bank 1. A
time t.sub.R is allowed to elapse in step 2108 after the Page Read
command is given in step 2102 to allow memory bank 0 to retrieve
the requested data before a Burst Data Read command is given in
step 2110 to memory bank 0 to access the data retrieved from the
Page Read operation. A Read Status command is given to memory bank
1 in step 2112 to monitor the progression of the Page Program
operation. When the status returns a pass for memory bank 1 then
the Page Program operation is complete and other operations can be
performed by memory bank 1.
[0108] FIG. 23 illustrates a timing of the concurrent Page Read and
Page Program operations from FIG. 22.
[0109] FIG. 24 illustrates a flow for a suspending and resuming
operations being performed in two memory banks of the same flash
memory device where a Page Read operation is being performed at
memory bank 0 and a Page Program operation is being performed at
memory bank 1. A Burst Data Load Start is given to memory bank 1 in
step 2302 along with data to the programmed into memory bank 1.
Before all of the data in the Burst Data Load Start operation is
loaded into memory bank 1, this operation is suspended when a Page
Read command is given to memory bank 0 in step 2306. After the Page
Read command has been completely received by memory bank 0, and
while memory bank 0 is accessing the requested page, the operation
on memory bank 1 is resumed in step 2308 using a Burst Data Load
operation with the remaining data. Once the data has been provided
to memory bank 1, a Page Program command is given to memory bank 1
in step 2310 to start programming of the data therein. A time
t.sub.R is allowed to elapse in step 2312 after the Page Read
command is given to memory bank 1 in step 2306. Once t.sub.R has
elapsed, a Burst Data Read command is given to memory bank 0 in
step 2314 to start the extraction of the requested data from memory
bank 0. The Burst Data Read command is suspended in step 2316 when
a Read Status command is given to memory bank 1 in step 2318 to
monitor the status of the memory bank. The Burst Data Read command
is resumed in step 2320 once the Read Status command has been
received. Memory bank 1 returns a pass to the Read Status command
when the Page Program operation is complete and other operations
can be performed by memory bank 1.
[0110] FIG. 25 illustrates a timing of the suspended and resumed
Page Read and Page Program operations from FIG. 24.
[0111] FIGS. 26 to 28 show interleaving of operations between
multiple devices. FIG. 26 shows Page Read operations at both memory
bank 0 and memory bank 1 of flash device 0 and flash device 1, a
Block Erase operation at memory bank 0 of flash device 2, Page
Program operations at memory bank 1 of flash device 2 and at memory
bank 0 of flash device 3 and a Pair-pair Erase operation at memory
bank 1 of flash device 3. FIG. 27 shows Page Read operations at
memory banks 0 and 1 of flash devices 0, 1, 2 and 3. FIG. 28 shows
a Page Program operation at memory bank 0 of flash device 0
followed by a Page Read operation, a Page Read operation followed
by a Block Erase operation at memory bank 1 of flash device 0,
Block Erase operations at memory bank 0 of flash devices 1 and 3
and at memory bank 1 of flash devices 2 and 3, a Page Program
operation at memory bank 1 of flash device 1, and a Page Read
operation followed by a Page Program operation at memory bank 0 of
flash device 2.
[0112] In the above described embodiments, the memory devices have
been described as flash memory devices. It will be apparent to
those of ordinary skill in the art that the memory devices can be
random access memory devices: e.g., dynamic random access memories
(DRAMs), static random access memories (SRAMs), magnetoresistive
random access memories (MRAMs). Also, the plurality of memory
devices included in a memory system can be devices having identical
device type or mixed device types. A configuration of
series-connected multiple devices of mixed type is disclosed in
U.S. Provisional Patent Application No. 60/868,773 filed Dec. 6,
2006, the disclosure of which is incorporated herein by reference
in its entirety.
[0113] In the embodiments described above, the device elements and
circuits are connected to each other as shown in the figures for
the sake of simplicity. In practical applications these devices,
elements circuits, etc., may be connected directly to each other or
indirectly through other devices elements, circuits, etc. Thus, in
an actual configuration, the elements, circuits and devices are
coupled either directly or indirectly with each other.
[0114] The above-described embodiments of the present invention are
intended to be examples only. Alterations, modifications and
variations may be effected to the particular embodiments by those
of skill in the art without departing from the scope of the
invention, which is defined solely by the claims appended
hereto.
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