U.S. patent application number 13/001355 was filed with the patent office on 2011-05-12 for light-emitting device and method for producing same.
This patent application is currently assigned to SHARP KABUSHIKI KAISHA. Invention is credited to Nobuaki Aoki, Masashi Takemoto, Yasuji Takenaka.
Application Number | 20110108875 13/001355 |
Document ID | / |
Family ID | 41444357 |
Filed Date | 2011-05-12 |
United States Patent
Application |
20110108875 |
Kind Code |
A1 |
Takenaka; Yasuji ; et
al. |
May 12, 2011 |
LIGHT-EMITTING DEVICE AND METHOD FOR PRODUCING SAME
Abstract
There is provided a light emitting device highly resistant to
the environment, and having good heat resistance, light resistance
and gas barrier property, and a method for producing same. With the
light emitting device, a substrate 2 and interconnect patterns 5A,
5B formed on the surface thereof are covered with an acrylic resin
primer 10 having better gas barrier property than a silicone resin
sealing resin part 3. Light resistance is ensured by the silicone
resin sealing resin portion 3 and the gas barrier property can be
ensured by the acrylic resin primer 10.
Inventors: |
Takenaka; Yasuji; (Osaka,
JP) ; Takemoto; Masashi; (Osaka, JP) ; Aoki;
Nobuaki; (Osaka, JP) |
Assignee: |
SHARP KABUSHIKI KAISHA
Osaka-shi, Osaka
JP
|
Family ID: |
41444357 |
Appl. No.: |
13/001355 |
Filed: |
June 5, 2009 |
PCT Filed: |
June 5, 2009 |
PCT NO: |
PCT/JP2009/060332 |
371 Date: |
December 23, 2010 |
Current U.S.
Class: |
257/98 ;
257/E21.503; 257/E33.059; 438/26; 438/27 |
Current CPC
Class: |
H01L 27/156 20130101;
H01L 2224/45144 20130101; H01L 2224/48227 20130101; H01L 2224/48247
20130101; H01L 2224/48091 20130101; H01L 2224/45144 20130101; H01L
2224/48235 20130101; H01L 2224/8592 20130101; H01L 2924/12041
20130101; H01L 33/486 20130101; H01L 2924/12041 20130101; H01L
33/60 20130101; H01L 33/44 20130101; H01L 33/56 20130101; H01L
2924/181 20130101; H01L 33/62 20130101; H01L 2224/45144 20130101;
H01L 2924/181 20130101; H01L 33/502 20130101; H01L 2224/48091
20130101; H01L 2924/00 20130101; H01L 2924/00014 20130101; H01L
2924/00014 20130101; H01L 24/45 20130101; H01L 2924/00 20130101;
H01L 2924/00012 20130101 |
Class at
Publication: |
257/98 ; 438/27;
438/26; 257/E33.059; 257/E21.503 |
International
Class: |
H01L 33/60 20100101
H01L033/60; H01L 21/56 20060101 H01L021/56 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 25, 2008 |
JP |
2008-165897 |
Claims
1. A light emitting device comprising: a substrate; a metal portion
formed on a surface of the substrate; an LED chip mounted on the
substrate; a primer made of resin which covers at least part of the
metal portion; and a sealing resin portion which covers the LED
chip and at least part of the primer to seal the LED chip, wherein
the primer is made from a resin which is higher in gas barrier
property than the sealing resin portion.
2. The light emitting device as claimed in claim 1, wherein the
primer is formed into a layer shape.
3. The light emitting device as claimed in claim 1, wherein the
primer is made from an acrylic resin.
4. The light emitting device as claimed in claim 1, wherein the
metal portion includes an interconnect pattern.
5. The light emitting device as claimed in claim 1, wherein the
metal portion includes a lead frame.
6. The light emitting device as claimed in claim 1, wherein the
metal portion includes a metal reflection coating.
7. The light emitting device as claimed in claim 4, wherein a
surface of the metal portion is made from Ag, or AgBi-based alloy,
or AgNd-based alloy, or an Ag alloy containing 0.5 to 5.0 wt % of
at least one kind of metal selected from Pt, Au, Cu, Pd, Mg, Ti and
Ta.
8. The light emitting device as claimed in claim 1, wherein the
substrate is made from any one of a light-reflective resin, metal
and ceramic.
9. The light emitting device as claimed in claim 1, wherein at
least a top face of the LED chip is exposed from the primer made of
resin.
10. The light emitting device as claimed in claim 1, wherein the
LED chip has its top face and side face coated with the primer made
of resin.
11. The light emitting device as claimed in claim 1, wherein the
primer covers a top face of the substrate.
12. The light emitting device as claimed in claim 1, wherein the
primer covers an entire surface of the substrate.
13. The light emitting device as claimed in claim 1, wherein the
primer covers a top face of the substrate, and the LED chip is
mounted on the primer covering the top face of the substrate.
14. The light emitting device as claimed in claim 6, wherein the
metal reflection coating is formed on the substrate, the primer is
formed on the metal reflection coating, and the interconnect
pattern is formed on the primer.
15. The light emitting device as claimed in claim 1, wherein the
primer has a thickness of 0.01 .mu.m to 100 .mu.m.
16. The light emitting device as claimed in claim 1, wherein the
sealing resin portion is in close contact with a surface of at
least part of the primer.
17. The light emitting device as claimed in claim 1, wherein the
LED chip is placed within a recess portion of the substrate, the
primer covers a bottom face of the recess portion of the substrate,
the sealing resin portion is in close contact with the surface of
the primer and seals the LED chip, and the primer is not
exposed.
18. The light emitting device as claimed in claim 1, wherein the
sealing resin portion is made from silicone resin.
19. The light emitting device as claimed in claim 1, wherein the
sealing resin portion contains a fluorophor.
20. The light emitting device as claimed in claim 1, wherein a
refractive index of the sealing resin portion and a refractive
index of the primer, both being within a range of 1.2 to 1.8, are
generally equal to each other.
21. The light emitting device as claimed in claim 1, further
comprising a reflector which is placed around the LED chip and
which reflects light emitted by the LED chip.
22. The light emitting device as claimed in claim 21, wherein the
reflector and the substrate are made from one identical base
material.
23. The light emitting device as claimed in claim 21, wherein a
surface of the reflector is made from Ag, or AgBi-based alloy, or
AgNd-based alloy, or an Ag alloy containing 0.5 to 5.0 wt % of at
least one kind of metal selected from Pt, Au, Cu, Pd, Mg, Ti and
Ta.
24. The light emitting device as claimed in claim 21, wherein the
primer covers the surface of the reflector.
25. The light emitting device as claimed in claim 1, wherein a
coefficient of thermal expansion of the sealing resin portion and a
coefficient of thermal expansion of the primer are generally equal
to each other.
26. A method for producing the light emitting device as claimed in
claim 24, comprising the step of: applying the primer onto the
surface of the reflector before placing the reflector around the
LED chip.
27. A method for producing the light emitting device, comprising
the steps of: applying a resin-made primer onto a substrate in
which a metal portion is formed on its surface and on which an LED
chip is mounted so that the resin-made primer covers at least part
of the metal portion; and coating the LED chip and at least part of
the resin-made primer with a sealing resin and curing the sealing
resin, thereby forming a sealing resin portion, wherein the primer
is made from a resin higher in gas barrier property than the
sealing resin portion.
28. A method for mounting the light emitting device as claimed in
claim 1 onto a printed board onto which a primer made from a resin
material identical to that of the primer has been applied.
Description
TECHNICAL FIELD
[0001] The present invention relates to a light emitting device, as
well as a method for producing the same, on which an LED (Light
Emitting Diode) chip is mounted.
BACKGROUND ART
[0002] In 1990's, blue LEDs were developed and marketed, and white
LEDs in combination with YAG (yttrium-aluminum-garnet) fluorophor
that emits yellow light at high efficiency upon reception of light
from the blue LED chip were also developed. In response to this,
development directed toward stabler chromaticity of white color or
higher brightness has been being advanced in view of applications
and progresses for general lighting using LEDs and backlight light
sources of LEDs for TV use. A large challenge in making such
development is to improve the thermal resistance and light
resistance of the sealing resin for sealing the LED chip.
[0003] White LEDs have a problem of deterioration of peripheral
members due to blue light, which is emitted from the LED chip in
use and which is short in wavelength and large in energy. When
epoxy resin is used as the sealing resin, there occur such
deteriorations as discoloring of the sealing resin due to the short
wavelength and large energy of the emission of the LED chip, so
that high-brightness light emission cannot be maintained for long
time. As sealing resins that can meet the desire for that long-time
high-brightness light emission, silicone-based resins have been
being in use.
[0004] However, silicone-based resins, although excellent in light
resistance, are poor at gas barrier property in not a few cases.
Poor gas barrier property of the sealing resin causes occurrence of
condensations at the interface between the sealing resin and the
substrate or package due to permeation of steam as an example,
leading to deteriorations or short-circuits of interconnect
patterns or chip electrodes. Also, while sealing resins for vehicle
use need to have corrosive-gas resistance, poor gas barrier
property of the sealing resin causes occurrence of deteriorations
or short-circuits of the interconnect patterns or chip electrodes,
as in the case of condensations, making it impossible to satisfy
the reliability.
[0005] Meanwhile, some silicone-based resins are denatured with
resins of good gas barrier property, but those are lowered in light
resistance. Under the current circumstances, it is quite difficult
to find out an optimum sealing resin.
[0006] Besides, since silicone-based resins are so weak in adhesion
that heat generation of the chip or the like causes resin peeling
to occur at interfaces with peripheral members due to differences
in coefficient of thermal expansion. This leads to characteristic
deteriorations as a light emitting device such as degradation of
light-emission brightness.
[0007] Thus, as it stands, even adopting silicone-based resins can
hardly meet the desires for thermal resistance, light resistance
and gas barrier property.
[0008] In this connection, Patent Literature 1 (JP 2004-339450 A)
discloses an LED package for improving the light resistance of the
sealing resin. This LED package, including an opening portion
composed of a bottom face and a side wall, is integrally formed
from formation resin so that the bottom face of the opening portion
has end portions of a positive external electrode and a negative
external electrode exposed with specified distances, respectively.
It is also described that in this LED package, a primer layer is
provided on the LED package surface before providing mold resin
(sealing resin). Further, in this LED package, used as the primer
layer are primer compositions characterized by including acrylic
polymers, silanol condensation catalysts, silane coupling agent
and/or epoxy group-containing compounds as an essential component
in a solution. As a result of this, peeling after the light
resistance test is suppressed, and the bonding reliability between
the LED package and the sealing resin is improved.
[0009] In the prior art shown above, although improvement of the
adhesion property during the thermal resistance test and the light
resistance test by the primer layer is fulfilled, yet improvement
of the gas barrier property is not disclosed.
CITATION LIST
Patent Literature
[0010] PATENT LITERATURE 1: JP 2004-339450 A
SUMMARY OF INVENTION
Technical Problem
[0011] Accordingly, an object of the present invention is to
provide a light emitting device, as well as a method for producing
the same, which is high in thermal resistance, light resistance and
gas barrier property and high in environment resistance.
Solution to Problem
[0012] In order to achieve the above object, there is provided a
light emitting device comprising:
[0013] a substrate;
[0014] a metal portion formed on a surface of the substrate;
[0015] an LED chip mounted on the substrate;
[0016] a primer made of resin which covers at least part of the
metal portion; and
[0017] a sealing resin portion which covers the LED chip and at
least part of the primer to seal the LED chip, wherein
[0018] the primer is made from a resin which is higher in gas
barrier property than the sealing resin portion.
[0019] According to the light emitting device of this invention,
since the primer made of a resin higher in gas barrier property
than the sealing resin portion covers the metal portion formed on
the surface of the substrate, the gas barrier property can be
improved.
[0020] In an embodiment, the primer is formed into a layer
shape.
[0021] According to the light emitting device of this embodiment,
the gas barrier property can be improved securely with the layered
primer.
[0022] In an embodiment, the primer is made from an acrylic
resin.
[0023] According to the light emitting device of this embodiment,
the gas barrier property can particularly be improved.
[0024] In an embodiment, the metal portion includes an interconnect
pattern.
[0025] According to the light emitting device of this embodiment,
the gas barrier property for the interconnect patterns formed on
the substrate surface can be improved.
[0026] In an embodiment, the metal portion includes a lead
frame.
[0027] According to the light emitting device of this embodiment,
the gas barrier property for the lead frame can be improved.
[0028] In an embodiment, the metal portion includes a metal
reflection coating.
[0029] According to the light emitting device of this embodiment,
the gas barrier property for the metal reflection coating can be
improved.
[0030] In an embodiment, a surface of the metal portion is made
from Ag, or AgBi-based alloy, or AgNd-based alloy, or an Ag alloy
containing 0.5 to 5.0 wt % of at least one kind of metal selected
from Pt, Au, Cu, Pd, Mg, Ti and Ta.
[0031] According to the light emitting device of this embodiment, a
particularly effective gas barrier property for the surface of the
metal portion containing silver, which is indeed high in
reflectivity but liable to blackening, can be provided with
protection by the primer.
[0032] In an embodiment, the substrate is made from any one of a
light-reflective resin, metal and ceramic.
[0033] According to the light emitting device of this embodiment,
since light irradiated from the LED chip is reflected by the
substrate, light emitted from the LED chip can be blocked from
being attenuated.
[0034] In an embodiment, at least a top face of the LED chip is
exposed from the primer made of resin.
[0035] According to the light emitting device of this embodiment,
since the top face of the chip, which becomes higher in
temperature, is exposed from the resin-made primer, influences of
heat on the primer can be reduced.
[0036] In an embodiment, the LED chip has its top face and side
face coated with the primer made of resin.
[0037] According to the light emitting device of this embodiment,
the primer applying step becomes simple to achieve, allowing a spin
coat process or other processes to be selected in addition to
dispensing process, which gives an advantage for an easier
achievement of cost reduction.
[0038] In an embodiment, the primer covers a top face of the
substrate.
[0039] In an embodiment, the primer covers an entire surface of the
substrate.
[0040] In an embodiment, the primer covers a top face of the
substrate, and the LED chip is mounted on the primer covering the
top face of the substrate.
[0041] According to the light emitting device of this embodiment,
the light emitting device is suitable for cases in which electrodes
are provided on the top face of the substrate. In this case,
forming the primer before die bonding or wire bonding allows the
primer application to be done by brush, roller or the like, so that
the primer can be formed more simply. In addition, in cases where
the primer is applied over the entire surface of the substrate,
dipping process or the like can also be selected for the formation
of the primer, allowing further cost reduction and higher
throughput to be realized.
[0042] In an embodiment, the metal reflection coating is formed on
the substrate,
[0043] the primer is formed on the metal reflection coating,
and
[0044] the interconnect pattern is formed on the primer.
[0045] According to the light emitting device of this embodiment, a
gas barrier for the metal reflection coating can be fulfilled by
the primer.
[0046] In an embodiment, the primer has a thickness of 0.01 .mu.m
to 100 .mu.m.
[0047] According to the light emitting device of this embodiment,
gas barrier property of the primer can be ensured, and decreases of
brightness due to optical losses caused by discoloration
(yellowing) with heat or light can be reduced. It is noted that
when the thickness of the primer is less than 0.01 .mu.m, there can
occur an abrupt increase in gas permeation amount due to coating
irregularities or the like. Further, when the thickness of the
primer is over 100 .mu.m, there occurs decreases of the brightness
due to optical losses caused by discoloration (yellowing) with heat
or light.
[0048] In an embodiment, the sealing resin portion is in close
contact with a surface of at least part of the primer.
[0049] In an embodiment, the LED chip is placed within a recess
portion of the substrate,
[0050] the primer covers a bottom face of the recess portion of the
substrate,
[0051] the sealing resin portion is in close contact with the
surface of the primer and seals the LED chip, and
[0052] the primer is not exposed.
[0053] According to the light emitting device of this embodiment,
the sealing resin for sealing the LED chip is in close contact with
the surface of the primer that covers the bottom face of the recess
portion of the substrate. Therefore, when gas contained in the
sealing resin is bled out, the gas can be allowed to escape upward
without obstruction of the primer. In addition, in a case where the
primer is formed on the sealing resin, when gas contained in the
sealing resin is bled out, there is no escape place, causing a
possibility that the primer may be damaged.
[0054] In an embodiment, the sealing resin portion is made from
silicone resin.
[0055] According to the light emitting device of this embodiment,
the light resistance can be improved by the sealing resin made from
silicone resin.
[0056] In an embodiment, the sealing resin portion contains a
fluorophor.
[0057] According to the light emitting device of this embodiment,
wavelength conversion of light can be done by the fluorophor to
emit fluorescent light.
[0058] In an embodiment, a refractive index of the sealing resin
portion and a refractive index of the primer, both being within a
range of 1.2 to 1.8, are generally equal to each other.
[0059] According to the light emitting device of this embodiment,
since the refractive index of the sealing resin portion and the
refractive index of the primer are generally equal to each other,
optical losses due to the total reflection at the interface between
the sealing resin and the primer can be eliminated.
[0060] In an embodiment, the light emitting device comprises a
reflector which is placed around the LED chip and which reflects
light emitted by the LED chip.
[0061] According to the light emitting device of this embodiment,
since light from the LED chip is reflected by the reflector, the
light attention can be suppressed.
[0062] In an embodiment, the reflector and the substrate are made
from one identical base material.
[0063] According to the light emitting device of this embodiment,
the reflector can be made with simplicity.
[0064] In an embodiment, a surface of the reflector is made from
Ag, or AgBi-based alloy, or AgNd-based alloy, or an Ag alloy
containing 0.5 to 5.0 wt % of at least one kind of metal selected
from Pt, Au, Cu, Pd, Mg, Ti and Ta.
[0065] In an embodiment, the primer covers the surface of the
reflector.
[0066] According to this embodiment, although the surface of the
reflector contains silver that is high in reflectivity but liable
to blackening, yet the protection with the primer makes it possible
to provide an effective gas barrier.
[0067] In an embodiment, a method for producing the light emitting
device comprises the step of:
[0068] applying the primer onto the surface of the reflector before
placing the reflector around the LED chip.
[0069] According to this embodiment, the primer can easily be
applied uniformly on the surface of the reflector.
[0070] There is provided a method for producing a light emitting
device, comprising the steps of:
[0071] applying a resin-made primer onto a substrate in which a
metal portion is formed on its surface and on which an LED chip is
mounted so that the resin-made primer covers at least part of the
metal portion; and
[0072] coating the LED chip and at least part of the resin-made
primer with a sealing resin and curing the sealing resin, thereby
forming a sealing resin portion, wherein
[0073] the primer is made from a resin higher in gas barrier
property than the sealing resin portion.
[0074] According to the production method of this embodiment, at
least part of the metal portion formed on the surface of the
substrate is covered with the primer made from a resin higher in
gas barrier property than the sealing resin portion. Therefore, the
gas barrier property can be improved.
[0075] In an embodiment, the light emitting device is mounted onto
a printed board onto which a primer made from a resin material
identical to that of the primer has been applied.
[0076] According to the mounting method of this embodiment, a light
emitting device having a good gas barrier property can be mounted
on a printed board having a good gas barrier property.
[0077] In an embodiment, a coefficient of thermal expansion of the
sealing resin portion and a coefficient of thermal expansion of the
primer are generally equal to each other.
[0078] According to the light emitting device of this embodiment,
impairment of the close contact between the sealing resin and the
primer due to influences of heat can be avoided.
Advantageous Effects of Invention
[0079] According to the light emitting device of this invention,
the LED chip and the primer are sealed with the sealing resin, and
moreover the primer, which is made from a resin higher in gas
barrier property than the sealing resin portion, covers the metal
portion formed on the surface of the substrate. Thus, the gas
barrier property can be improved even under heat- or
light-susceptible environments.
BRIEF DESCRIPTION OF DRAWINGS
[0080] FIG. 1 is a longitudinal sectional view showing a main-part
construction of a light emitting device according to a first
embodiment of the present invention;
[0081] FIG. 2A is a schematic sectional view for explaining
production process of the light emitting device according to the
first embodiment;
[0082] FIG. 2B is a schematic sectional view for explaining
production process of the light emitting device according to the
first embodiment;
[0083] FIG. 2C is a schematic sectional view for explaining
production process of the light emitting device according to the
first embodiment;
[0084] FIG. 2D is a schematic sectional view for explaining
production process of the light emitting device according to the
first embodiment;
[0085] FIG. 2E is a schematic sectional view for explaining
production process of the light emitting device according to the
first embodiment;
[0086] FIG. 3A is a longitudinal sectional view showing a main-part
construction of a light emitting device according to a second
embodiment of the invention;
[0087] FIG. 3B is a longitudinal sectional view showing a
modification of the light emitting device according to the second
embodiment;
[0088] FIG. 4A is a longitudinal sectional view showing a main-part
construction of a light emitting device according to a third
embodiment of the invention;
[0089] FIG. 4B is a longitudinal sectional view showing a
modification of the light emitting device according to the third
embodiment;
[0090] FIG. 5A is a longitudinal sectional view showing a main-part
construction of a light emitting device according to a fourth
embodiment of the invention;
[0091] FIG. 5B is a longitudinal sectional view showing a
modification of the light emitting device according to the fourth
embodiment;
[0092] FIG. 6 is a longitudinal sectional view showing a main-part
construction of a light emitting device according to a fifth
embodiment of the invention;
DESCRIPTION OF EMBODIMENTS
[0093] Hereinbelow, the present invention will be described in
detail by way of embodiments thereof illustrated in the
accompanying drawings.
First Embodiment
[0094] FIG. 1 is a longitudinal sectional view showing an example
of the main-part construction of a light emitting device according
to a first embodiment of the invention.
[0095] As shown in FIG. 1, the light emitting device 1 of this
first embodiment includes an LED (Light Emitting Diode) chip 6
mounted on a substrate 2. The LED chip 6 has an anode electrode
(not shown) connected to an interconnect pattern 5A formed on the
substrate 2, and a cathode electrode (not shown) connected with a
bonding wire 7 to another interconnect pattern 5B formed on the
substrate 2. The LED chip 6 is a blue LED chip having a primary
emission peak in a blue wavelength range of 400 nm to 500 nm
wavelengths as an example.
[0096] This light emitting device 1 also has a layered primer 10
that covers the LED chip 6, the interconnect patterns 5A, 5B and
the substrate 2. The light emitting device 1 further has a sealing
resin portion 3 that covers the primer 10 in close contact with the
primer 10 to provide a resin sealing of the LED chip 6. In this
embodiment, unshown fluorophor and filler for wavelength conversion
of light derived from the blue LED chip 6 are added in the sealing
resin portion 3. In this first embodiment, an alumina substrate
having high optical reflectance for visible light was used as the
substrate 2. The thickness of this substrate 2 was set to 0.3 mm as
an example. The interconnect patterns 5A, 5B formed on the surface
of the substrate 2 were Ag interconnect patterns. It is noted that
these interconnect patterns 5A, 5B may also be made from Ag, or
AgBi-based alloy, or AgNd-based alloy. The interconnect patterns
5A, 5B may also be made from an Ag alloy containing 0.5 to 5.0 wt %
of at least one kind of metal selected from Pt, Au, Cu, Pd, Mg, Ti
and Ta.
[0097] Further, an external connection electrode 8A is formed on
the bottom face side of the substrate 2, and the external
connection electrode 8A is electrically connected to the
interconnect pattern 5A under the LED chip 6 via a through
conductive layer 9A provided so as to extend through the substrate
2 in its thicknesswise direction. Another external connection
electrode 8B is also formed on the bottom face side of the
substrate 2, and the external connection electrode 8B is
electrically connected to the interconnect pattern 5B via a through
conductive layer 9B provided so as to extend through the substrate
2 in its thicknesswise direction.
[0098] Also in this first embodiment, the primer 10 formed on the
substrate 2 so as to cover the LED chip 6, which is made from
acrylic resin, is formed to a thickness of 1 .mu.m by application
onto the entire surface of the substrate 2 by spin coating process.
The thickness of the primer 10 is desirably set within a range of
0.01 .mu.m to 100 .mu.m.
[0099] The sealing resin portion 3 covering the primer 10, which is
about 0.4 mm thick, seals the LED chip 6 with resin. The sealing
resin portion 3 was provided, as an example, by adding silicone
resin particles (not shown) having a mean particle size of 5 .mu.m
as a filler into dimethyl silicone resin.
[0100] In the sealing resin portion 3, an unshown fluorophor that
converts wavelength of the light from the blue LED chip 6 to emit
fluorescent light is further added. In this first embodiment, as
the fluorophor, a yellow fluorophor having a high luminous efficacy
and a mean particle size of 5 .mu.m such as Eu:BOSE or ROSE
(europium-activated strontium barium orthsilicate,
(Ba.Sr).sub.2SiO.sub.4:Eu) was used. This yellow fluorophor absorbs
blue light emitted from the blue LED chip 6 and emits yellow
fluorescent light having an emission peak in a wavelength range of
550 nm to 600 nm wavelengths.
[0101] A surface of the sealing resin portion 3, parallel to the
surface of the substrate 2, is a generally flat surface. A side
face of the light emitting device 1 in this first embodiment is
flat-surface shaped, where the sealing resin portion 3 and moreover
the substrate 2 thereunder are cut vertical to the surface of the
substrate 2, so that the light emitting device 1 is formed into a
rectangular parallelopiped shape, as a whole shape, which is thick
in thickness and larger in an area in in-surface directions of the
substrate 2. More specifically, the light emitting device 1 has a
thickness of 0.7 mm, a lateral width of 1.6 mm and a longitudinal
width of 2.6 mm as an example. It is noted that the lateral width
is a width in a direction parallel to the drawing sheet of FIG. 1
and the longitudinal width is a width in a direction vertical to
the drawing sheet of FIG. 1.
[0102] In the first embodiment, the acrylic resin used as the
primer 10 is a material which is, although as good as generally
100% at gas barrier property in comparison to dimethyl silicone
resin of good light resistance used for the sealing resin portion
3, yet cannot be regarded as so good at light resistance. For this
reason, the primer 10 using acrylic resin is discolored when
subjected to long-time irradiation of short-wavelength, high-energy
light such as blue light emitted from the blue LED chip 6, and this
causes an optical loss. Therefore, it is desirable that the primer
10 made from the acrylic resin is formed as thin as possible so as
to minimize the optical loss.
[0103] As described above, applying the primer 10 by spin coating
makes it possible to provided a smaller thickness of the primer,
yet depressions and projections, if present on the surface of the
substrate 2, cause the primer 10 to be thicker at and near those
depressions and projections. Therefore, the interconnect patterns
5A, 5B forming the interconnect layer are desirably thinner in
layer thickness than the primer 10. Also, the LED chip 6 is
preferably one which does not need a bonding wire, such as flip
chips, and besides it is desirable that the LED chip 6 has a
trapezoidal upper surface as an example so that the substrate
surface with the LED chip 6 mounted thereon can be made more
flattened.
[0104] In addition, the substrate 2 is desirably made from any one
of optically reflective resin, metal and ceramic. In this case,
since light irradiated from the LED chip 6 is reflected by the
substrate 2, the light irradiated from the LED chip 6 can be
prevented from attenuating.
[0105] Next, a method for producing the light emitting device 1 of
the first embodiment is explained in detail with reference to FIG.
1 and FIGS. 2A to 2E. It is noted that FIGS. 2A to 2E are schematic
sectional views for explaining individual production steps of the
production method for the light emitting device 1 of the first
embodiment.
[0106] First, FIG. 2A shows the substrate 2. Although not shown in
FIG. 2A, the interconnect patterns 5A, 5B, the blue LED chip 6 and
the bonding wire 7 shown in FIG. 1 are formed on the top face 2A
side of the substrate 2. Also, the interconnect patterns 5A, 5B,
the blue LED chip 6 and the bonding wire 7 are provided in
plurality on the top face 2A of the substrate 2 longitudinally and
laterally in an array. Also although not shown in FIG. 2A, the
external connection electrodes 8A, 8B and the through conductive
layers 9A, 9B electrically connected to the external connection
electrodes 8A, 8B shown in FIG. 1 are formed on the bottom face 2B
side of the substrate 2. It is noted that the interconnect patterns
5A, 5B are designed as appropriate in accordance with the array
pattern or electrode formation of the LED chip 6. As described
before, the interconnect pattern 5A is connected directly to the
anode electrode (not shown) of the blue LED chip 6, and the cathode
electrode of the blue LED chip 6 is connected to the interconnect
pattern 5B by the bonding wire 7.
[0107] Next, as shown in FIG. 2B, a dam sheet 11 made of the
silicone resin is affixed to the substrate 2 on which the LED chip
6 and the bonding wire 7 have been mounted. The dam sheet 11 made
of silicone resin is for use of damming the primer 10 and the
sealing resin portion 3. Thereafter, by air dispensation, the
primer 10 is applied to the surface of the substrate 2, being
allowed to dry. Appropriately diluting the primer 10 allows the
primer 10 to be reduced in thickness after its drying and after the
volatilization of the solvent.
[0108] In addition, the procedure may also be that the dam sheet 11
is affixed to the surface of the substrate 2 after the primer 10 is
applied onto the surface of the substrate 2 by spin coating
process. In this case, the primer 10 can be applied onto the
surface of the substrate more uniformly and thinly, and moreover it
becomes possible to prevent formation of primer accumulation in
recessed corner portions that form border portions between the
primer 10 and the dam sheet 11.
[0109] Next, the substrate 2 is set on a press machine including an
unshown heating plate and, as shown in FIG. 2C, liquid silicone
resin 3a to form the sealing resin portion 3 is injected onto the
surface of the substrate 2 by air dispensation. In this liquid
silicone resin 3a, unshown fluorophor and filler are added and
stirred and defoamed by a stirring and defoaming machine. In this
case, the weight ratio of the filler to the liquid silicone resin
to the fluorophor was set to 60:100:62 as an example.
[0110] Further, in FIG. 2D, a flat metal mold 12 is pressed onto
the surface of the sealing resin 3a to achieve a press. The metal
mold 12 has a function of serving as a lid of a mold container to
flatten the surface of the sealing resin 3a. Thereafter, the
sealing resin 3a is cured by 10-minute heating and pressing at
100.degree. C., by which the sealing resin portion 3 is formed.
[0111] Further, in FIG. 2E, dicing of the substrate 2 and the
sealing resin portion 3 on the substrate 2 into a specified size so
that individual light emitting devices 1 are cut apart. This dicing
is performed in accordance with the above-described interconnect
patterns. Through the steps described above, the individual light
emitting devices 1 diced into chips are formed.
[0112] As shown above, the production method for the light emitting
device 1 of the first embodiment includes a step for applying the
primer 10 to the substrate 2 on which the LED chip 6 as a light
emitting element and the bonding wire 7 have been mounted, a step
for mixing and stirring the sealing resin 3a with fluorophor and
filler added thereto, a step for covering the surface 2A of the
substrate 2, on which the LED chip 6 has been mounted, with the
sealing resin 3a with fluorophor and filler added thereto, a step
for flattening and heating the surface by a press to make the
sealing resin material 3a cured, and a dicing step for cutting
apart individual light emitting devices 1.
[0113] The light emitting device 1 fabricated in this way was
subjected to a sulfuration accelerated test under 40.degree. C.,
80% RH, H.sub.2S 3 ppm and 80-hour leaving conditions, after which
almost no discoloration of the Ag interconnect patterns 5A, 5B was
seen. On the other hand, a light emitting device of a comparative
example fabricated without applying the primer 10 was discolored
black by the sulfuration accelerated test. As to a ratio based on
an initial value, the light emitting device 1 of this embodiment
resulted in an axial luminosity of 88%, while the comparative
example (with no primer) resulted in an axial luminosity of
60%.
[0114] In addition, the primer 10 desirably has a thickness within
a range of 0.01 .mu.m to 100 .mu.m. The upper-limit value 100 .mu.m
of the thickness of the primer 10 depends on a limit value of
brightness lowering rate due to light loss by discoloration-induced
yellowing caused by heat and light, while the lower-limit value
0.01 .mu.m depends on coating irregularities and an upper limit of
gas permeation amount. This is applicable in common to the
following individual embodiments.
[0115] The primer 10 typified by acrylic resins is high in gas
barrier property, particularly compared with dimethyl-based
silicone resin. On the other hand, such primers as acrylic resins
are, in general, inferior in light resistance to the sealing resin
portion 3. Therefore, combining the smaller-in-thickness primer 10
with the sealing resin portion 3 makes it possible to provide a
structure superior in both gas barrier property and light
resistance.
[0116] According to the light emitting device 1 of the first
embodiment, blackening of the interconnect patterns 5A, 5B formed
of silver patterns can be prevented so that decreases of the
reflectivity and decreases of the luminosity and chromaticity can
be prevented. Also, according to the above-described production
process shown in FIGS. 2A to 2E, the process is the same as the
conventional one except that the application and drying step of the
primer 10 is executed before the formation of the sealing resin
portion 3, thus the production process being simple and
cost-increase suppressed. Further, the primer 10 has a refractive
index generally equal to that of the sealing resin portion 3 (1.4
to 1.5 in both cases), and is excellent in light transmissivity. It
is noted that the refractive index of the sealing resin portion 3
and the refractive index of the primer 10 may be set generally
equal to each other within a range of 1.2 to 1.8.
Second Embodiment
[0117] Next, a light emitting device 21 according to a second
embodiment of the invention is described with reference to FIG. 3A.
FIG. 3A is a longitudinal sectional view showing a main-part
construction of the light emitting device 21.
[0118] As shown in FIG. 3A, in the light emitting device 21 of the
second embodiment, a first LED chip 26 is mounted on a first
portion 25A of a first lead frame 25 so that a lower electrode of
the first LED chip 26 is electrically connected to the first
portion 25A. Also, a second portion 25B of the first lead frame 25
is placed so as to be apart from the first portion 25A, and the
second portion 25B is electrically connected to an upper electrode
of the first LED chip 26 by a gold wire 27. Further, the first,
second portions 25A, 25B of the first lead frame 25 are fixed by a
resin portion 22 which surrounds the periphery of the LED chip 26
and which is formed by insert molding. The first portion 25A of the
first lead frame 25, which extends outward from the surface on
which the LED chip 26 is mounted, is formed so as to surround one
end portion 28 of a base portion 22A of the resin portion 22. That
is, the first portion 25A is bent over a top face 22A-1, a side
face 22A-2 and a bottom face 22A-3 of the base portion 22A, by
which an external connection terminal 31 to be electrically
connected to a mount board or the like is provided. The base
portion 22A forms a base substrate. Also, the second portion 25B of
the first lead frame 25 is similar in shape to the first portion
25A. That is, the second portion 25B, which extends outward from
the surface on which the LED chip 26 is mounted, is formed so as to
surround the other end portion 29 of the base portion 22A. The
second portion 25B is bent over a top face 22A-4, a side face 22A-5
and a bottom face 22A-6 of the base portion 22A, by which an
external connection terminal 32 to be electrically connected to a
mount board or the like is provided. The resin portion 22 has wall
portions 22B, 22B protruding from both ends of the base portion
22A.
[0119] The first, second portions 25A, 25B of the first lead frame
25 may have, on their surfaces, a surface layer (not shown) for
enhancing the reflectivity of light emitted from the LED chip 26,
where the surface layer may be made from, for example, Ag or
AgBi-based alloy, or AgNd-based alloy. Also, the surface layer may
be made from an Ag alloy containing 0.5 to 5.0 wt % of at least one
kind of metal selected from among Pt, Au, Cu, Pd, Mg, Ti and Ta.
With an Ag alloy used, the optical reflectance, although somewhat
lower than that of pure Ag, is yet even a little improved in terms
of deteriorations due to corrosive gas or moisture. The surface
layer, particularly with Ag used therefor, is covered with the
primer only within the LED chip mounting surface as described
later, thus providing deterioration countermeasures for the surface
layer. Therefore, the surface layer is preferably provided only
within the LED chip mounting surface, and desirably not formed at
portions that extend along the side faces and the bottom faces of
the resin portion 22 within the first, second portions 25A, 25B of
the lead frame so as to be exposed outside.
[0120] In this second embodiment, in addition to the first LED chip
26 shown in FIG. 3A, second, third LED chips (not shown) are
mounted on second, third lead frames (not shown), respectively, on
a deeper side beyond the drawing sheet of FIG. 3A. Anode electrodes
and cathode electrodes of these second, third LED chips are
connected to the second, third lead frames (not shown) formed on
the base portion 22A of the resin portion 22 independent of the
first lead frame 25 on which the first LED chip 26 is mounted. The
first LED chip 26 is a blue LED chip having a primary emission peak
in a blue wavelength range of 400 nm to 500 nm wavelengths. The
second LED chip is a green LED chip having a primary emission peak
in a green wavelength range of 480 nm to 580 nm wavelengths. The
third LED chip is a red LED chip having a primary emission peak in
a red wavelength range of 600 nm to 700 nm wavelengths.
[0121] These first to third LED chips are coated with a layered
primer 30. Further, a sealing resin portion 23 with silica and an
anti-settling additive added thereto is formed so as to cover the
top of the primer 30 and come into close contact with the primer
30, so that the first to third LED chips are resin-sealed by the
sealing resin portion 23.
[0122] As the insert-molded resin portion 22, a white resin that
reflects light is preferably adoptable, and PPA (polyphthalamide)
was adopted in this second embodiment. Whereas its use with high
brightness may involve a phenomenon that the surface layer made
from Ag or Ag alloy on the surfaces of the first, second portions
25A, 25B reacts with moisture absorbed by the sealing resin portion
23 so as to be blackened, this blackening can also be prevented by
the coating with the primer 30. The thickness of the resin portion
22 was set to 1.4 mm. Also, the second, third lead frames, like the
first lead frame 25, also extend from side faces 22A-1, 22A-2 to
bottom faces 22A-3, 22A-6 of the base portion 22A to form third
external connection electrodes 31, 32.
[0123] As shown in FIG. 3A, a metal reflection coating 33 is formed
by Ag plating on an inner wall surface 22D of the wall portion 22B
in the resin portion 22. The metal reflection coating 33 and the
wall portion 22B constitute a reflector. It is noted that the metal
reflection coating 33 may also be made from Ag or AgBi-based alloy,
or AgNd-based alloy. The metal reflection coating 33 may also be
made from an Ag alloy containing 0.5 to 5.0 wt % of at least one
kind of metal selected from Pt, Au, Cu, Pd, Mg, Ti and Ta.
[0124] Then, the primer 30 of silane-based resin is applied by air
dispensation process at thicknesses of 1 to 10 .mu.m so as to cover
the metal reflection coating 33, the first to third lead frames,
the first to third LED chips and the base portion 22A.
[0125] In this second embodiment, the primer 30 is smallest in
thickness as thin as 1 .mu.m in the first portion 30A covering the
metal reflection coating 33, largest in thickness as thick as 10
.mu.m in the second portion 30B on the interconnect pattern, and 4
.mu.m thick at the third portion 30C on the base portion 22A. The
sealing resin portion 23 covering the primer 30 is 0.7 mm thick. In
the sealing resin portion 23, silica and an anti-settling additive
having a mean particle size of 5 .mu.m are added into the silicone
resin.
[0126] The light emitting device 21 of this second embodiment has
sizes of a thickness of 1.4 mm, a lateral width of 3.2 mm and a
longitudinal width of 2.8 mm. It is noted that the lateral width
means a width in a direction parallel to the drawing sheet in FIG.
3A, and the longitudinal width means a width in a direction
vertical to the drawing sheet in FIG. 3A.
[0127] In addition, in the second embodiment, the metal reflection
coating 33 formed on the inner wall surface 22D of the wall portion
22B in the resin portion 22 may be omitted.
[0128] In this second embodiment, combining the thin primer 30 with
the sealing resin portion 23 makes it possible to provide a
structure superior in both gas barrier property and light
resistance. As a result of this, blackening of the interconnect
patterns formed of silver patterns and the metal reflection coating
33 can be prevented so that decreases of the reflectivity and
decreases of the luminosity and chromaticity can be prevented.
Also, in this second embodiment, the fabrication process can be
achieved by the same process as the conventional one except that
the application and drying step of the primer 30 is executed before
the formation step of the sealing resin portion 23, thus the
production process being simple and cost-increase suppressed.
Further, the primer 30 has a refractive index generally equal to
that of the sealing resin portion 23 (1.4 to 1.5 in both cases),
and decreases of light extraction efficiency can be suppressed
without occurrence of refraction or scattering at the interface
between the primer 30 and the sealing resin portion 23. Also, since
the primer 30 is applied also on the surface of the base portion
22A of the resin portion 22 and the metal reflection coating 33,
close contact between the resin portion 22 or the metal reflection
coating 33 and the sealing resin portion 23 can be enhanced.
[0129] Next, a modification of the second embodiment is described
with reference to FIG. 3B. This modification differs from the
second embodiment in that a primer 35 which covers not only places
covered with the primer 30 in FIG. 3A but also the side faces of
the resin portion 22 and the first to third lead frame portions
formed along the side faces is included instead of the primer 30 of
FIG. 3A. Besides, this modification differs from the second
embodiment in that no metal reflection coating 33 is formed on the
wall surface 22D of the wall portion 22B in the resin portion
22.
[0130] In a light emitting device 21A of this modification, the
primer 35 is formed by dip coating on surfaces of the resin portion
22, the first to third LED chips and the first to third lead
frames. As shown in FIG. 3B, the primer 35 covers not only the
inner wall surface 22D but also an outer wall surface 22E of the
wall portion 22B of the resin portion 22, and further covers the
side portions 25A-1, 25B-1 of the first lead frame 25 and side
portions of the second, third lead frames.
[0131] Desirably, the primer 35 serves as coating of all the
portions where the metal surface is exposed on the surface except
the external connection electrodes 31, 32 that form mounting
surfaces of the first, second portions 25A, 25B of the first lead
frame 25 as well as except the external connection electrodes (not
shown) that form mounting surfaces of the second, third lead
frames.
[0132] The light emitting device 21A of this modification has side
light emitting LEDs as the first to third LED chips, and has sizes
of a thickness of 1.2 mm, a lateral width of 3.8 mm and a
longitudinal width of 0.6 mm.
[0133] In this modification, since a narrow recess portion U is
between the wall portion 22B of the resin portion 22 and the first
to third LED chips, coating of the primer 35 was fulfilled by
dipping process. In the coating by dipping process, the primer 35
tends to vary in thickness, and therefore a difference between the
refractive index of the primer 35 and the refractive index of the
sealing resin portion 23 causes the light scattering lost to
increase. Accordingly, in the case of this modification, it is
desirable that the refractive index of the primer 35 and the
refractive index of the sealing resin portion 23 are, in
particular, of an equivalent level.
[0134] Also, as shown in FIG. 3B, preferably, the sealing resin
portion 23 is formed so as to be in close contact with the surface
of at least part of the primer 35. Particularly, when there is a
side face surrounding the periphery of the primer 35 (inner wall
surface 22D of wall portion 22B) as shown in FIGS. 3A and 3B, it is
preferable to form first the primer 35 and then the sealing resin
portion 23. In the case where the primer 35 is formed on the
sealing resin portion 23 conversely, when gas contained in the
sealing resin portion 23 is bled out, there is no escape place
sideways from within the light emitting device (package) 1 so that
the gas is inevitably directed upward, causing a possibility that
the primer 35 may be damaged. Thus, it is preferable to form the
primer 35 before forming the sealing resin portion 23.
Third Embodiment
[0135] FIG. 4A is a longitudinal sectional view showing a main-part
construction of a light emitting device according to a third
embodiment of the invention.
[0136] As shown in FIG. 4A, in the light emitting device of the
third embodiment, an LED chip 46 is mounted on a first portion 45A
of a lead frame 45 so that a lower electrode of the LED chip 46 is
electrically connected to the first portion 45A. The LED chip 46 is
a blue LED chip having a primary emission peak in a blue wavelength
range of 400 nm to 500 nm wavelengths. Also, a second portion 45B
of the lead frame 45 is placed so as to be apart from the first
portion 45A, and the second portion 45B is electrically connected
to an upper electrode of the LED chip 46 by a gold wire 47.
Further, the first, second portions 45A, 45B of the lead frame 45
are fixed by a resin portion 42 which surrounds the periphery of
the LED chip 46 and which is formed by insert molding. The first
portion 45A of the lead frame 45, which extends outward from the
surface on which the LED chip 46 is mounted, is formed so as to
surround one end portion 48 of a base portion 42A of the resin
portion 42. That is, the first portion 45A is bent over a top face
42A-1, a side face 42A-2 and a bottom face 42A-3 of the base
portion 42A, by which an external connection terminal 51 to be
electrically connected to a mount board or the like is provided.
The base portion 42A forms a base substrate. Also, the second
portion 45B of the lead frame 45 is similar in shape to the first
portion 45A. That is, the second portion 45B, which extends outward
from the surface on which the LED chip 46 is mounted, is formed so
as to surround the other end portion 49 of the base portion 42A.
The second portion 45B is bent over a top face 42A-4, a side face
42A-5 and a bottom face 42A-6 of the base portion 42A, by which an
external connection terminal 52 to be electrically connected to a
mount board or the like is provided. The resin portion 42 has wall
portions 42B, 42B protruding from both ends of the base portion
42A.
[0137] The first, second portions 45A, 45B of the lead frame 45 may
have, on their surfaces, a surface layer (not shown) for enhancing
the reflectivity of light emitted from the LED chip 46, where the
surface layer may be made from, for example, Ag or AgBi-based
alloy, or AgNd-based alloy. Also, the surface layer may be made
from an Ag alloy containing 0.5 to 5.0 wt % of at least one kind of
metal selected from among Pt, Au, Cu, Pd, Mg, Ti and Ta. With an Ag
alloy used, the optical reflectance, although somewhat lower than
that of pure Ag, is yet even a little improved in terms of
deteriorations due to corrosive gas or moisture. The surface layer,
particularly with Ag used therefor, is covered with the primer only
within the LED chip mounting surface as described later, thus
providing deterioration countermeasures for the surface layer.
Therefore, the surface layer is preferably provided only within the
LED chip mounting surface, and desirably not formed at portions
that extend along the side faces and the bottom faces of the resin
portion 42 within the first, second portions 45A, 45B of the lead
frame 45 so as to be exposed outside.
[0138] In this third embodiment, a layered primer 40 is applied on
the first, second portions 45A, 45B of the lead frame 45 and the
base portion 42A of the resin portion 42. Also, a sealing resin
portion 43 is formed so as to cover the primer 40, the LED chip 46
and the inner wall surface of the wall portion 42B. This sealing
resin portion 43 is in close contact with the surface of the primer
40. The sealing resin portion 43 is made from a sealing resin to
which added is a fluorophor (not shown) that performs wavelength
conversion of light derived from the blue LED chip 46.
[0139] As the insert-molded resin portion 42, a white resin that
reflects light is preferably adoptable, and PPA (polyphthalamide)
was adopted in this third embodiment. Whereas its use with high
brightness may involve a phenomenon that the surface layer made
from Ag or Ag alloy on the surfaces of the first, second portions
45A, 45B reacts with moisture absorbed by the sealing resin portion
so as to be blackened, this blackening can also be prevented by the
coating with the primer 40. The thickness of the resin portion 42
was set to 1.4 mm.
[0140] In this third embodiment, the primer 40 is formed by
applying and drying an acrylic modified resin by dispensing process
to a mean thickness of 2 .mu.m. Also, the primer 40 is formed with
selected dispensing places so as to cover surfaces exposed to
around the direct mounting portion for the blue LED chip 46 of the
first portion 45A, but not to cover the LED chip 46, and to cover
the base portion 42A exposed from the first, second portions 45A,
45B. Further, the sealing resin portion 43 that covers the primer
40, the LED chip 46 and the wall portion 42B is formed at a
thickness of 0.4 mm.
[0141] In this sealing resin portion 43, a fluorophor (not shown)
that performs wavelength conversion of light derived from the blue
LED chip 46 to emit fluorescent light is added in a silicone resin.
In this third embodiment, as an example of the fluorophor, a yellow
fluorophor having a high luminous efficacy and a mean particle size
of 6 .mu.m such as Ce:YAG (cerium-activated
yttrium-aluminum-garnet) was used. This yellow fluorophor absorbs
blue light emitted from the blue LED chip 46 and emits yellow
fluorescent light having an emission peak in a wavelength range of
550 nm to 600 nm wavelengths. Also, a surface of the sealing resin
portion 43, parallel to the surface of the base portion 42A forming
the substrate, is a generally flat surface. More specifically, the
light emitting device of this third embodiment has a thickness of
1.5 mm, a lateral width of 5.0 mm and a longitudinal width of 5.0
mm as an example.
[0142] Next, FIG. 4B shows a modification of the third embodiment.
This modification differs from the third embodiment in that a metal
reflection coating 44 by Ag plating is formed on the inner wall
surface of the wall portion 42B of the resin portion 42 and that a
primer 55 which covers this metal reflection coating 44 is
included. The metal reflection coating 44 and the wall portion 42B
constitute a reflector. It is noted that the metal reflection
coating 44 may be made from Ag or AgBi-based alloy, or A Nd-based
alloy. The metal reflection coating 44 may also be made from an Ag
alloy containing 0.5 to 5.0 wt % of at least one kind of metal
selected from Pt, Au, Cu, Pd, Mg, Ti and Ta.
[0143] The primer 55, like the above-described primer 40, is formed
with selected dispensing places so as to cover surfaces exposed to
around the direct mounting portion for the blue LED chip 46 of the
first portion 45A of the lead frame 45, but not to cover the LED
chip 46, and to cover the base portion 42A of the resin portion 42
exposed from the first portion 45A and the second portion 45B of
the lead frame 45.
[0144] In this modification, primer coating may be done
independently for the surface portions of the first portion 45A
other than chip mounting portion and for the inner wall surface of
the wall portion 42B forming the reflector, during the formation
process of the primer 55. In this case, there is an advantage that
the primer 55 can easily be made uniform in thickness among
individual places.
[0145] In the third embodiment and its modification, combining the
thin primer 55 with the sealing resin portion 43 makes it possible
to provide a structure superior in both gas barrier property and
heat resistance. As a result of this, blackening of silver patterns
forming the first, second portions 45A, 45B of the lead frame 45
and the metal reflection coating 44 can be prevented so that
decreases of the reflectivity and decreases of the luminosity and
chromaticity can be prevented. Also, the fabrication process can be
achieved by the same process as the conventional one except that
the application and drying step of the primer 40, 55 is executed
before the formation step of the sealing resin portion 43, thus the
production process being simple and cost-increase suppressed.
Further, since the primer 40, 55 does not cover the LED chip 46,
there occurs neither attenuation nor confusion of light, and
moreover discoloration of the primer 40, 55 due to heat generation
of the LED chip 46 can be prevented. Besides, the primer 40, 55 has
a refractive index generally equal to that of the sealing resin
portion 43 (1.4 to 1.5 in both cases), being excellent in light
transmissivity. Also, since the primer 40, 55 is applied also on
the surface of the base portion 42A of the resin portion 42 and the
metal reflection coating 44, close contact between the resin
portion 42 or the metal reflection coating 44 and the sealing resin
portion 43 can be enhanced.
[0146] Preferably, as shown in FIGS. 4A and 4B, the sealing resin
portion 43 is formed so as to be in close contact with the surface
of at least part of the primer 40, 55. Particularly, when there is
a side face surrounding the periphery of the primer 40, 55 (inner
wall surface of wall portion 42B) as shown in FIGS. 4A and 4B, it
is preferable to form first the primer 40, 55 and then the sealing
resin portion 43. Meanwhile, in the case where the primer 40, 55 is
formed on the sealing resin portion 43, when gas contained in the
sealing resin portion 43 is bled out, there is no escape place
sideways from within the light emitting device (package) so that
the gas is inevitably directed upward, causing a possibility that
the primer 40, 55 may be damaged. Thus, it is preferable to form
the primer 40, 55 before forming the sealing resin portion 43.
Fourth Embodiment
[0147] Next, a light emitting device according to a fourth
embodiment of the invention is described with reference to FIG. 5A.
FIG. 5A is a longitudinal sectional view showing a main-part
construction of the light emitting device according to the fourth
embodiment.
[0148] In the light emitting device of this fourth embodiment, as
shown in FIG. 5A, interconnect patterns 65A-65D are formed on a
substrate 62. It is noted that the interconnect patterns 65A-65D
may be made from Ag or AgBi-based alloy, or AgNd-based alloy. The
interconnect patterns 65A-65D may also be made from an Ag alloy
containing 0.5 to 5.0 wt % of at least one kind of metal selected
from Pt, Au, Cu, Pd, Mg, Ti and Ta.
[0149] Then, a layered primer 70 is applied on the interconnect
patterns 65A-65D and the surface of the substrate 62 exposed from
the interconnect patterns 65A-65D by dipping process. Blue LED
chips 66, 67, 68 having a primary emission peak in a blue
wavelength range of 400 nm to 500 nm wavelengths are mounted on the
primer 70. Further, a sealing resin portion 63 is formed so as to
cover these blue LED chips 66-68 and the primer 70. In this sealing
resin portion 63, a fluorophor (not shown) that performs wavelength
conversion of light derived from the blue LED chips 66-68 is
added.
[0150] In this fourth embodiment, a 96%-alumina substrate having a
high optical reflectance for visible light was used as the
substrate 62. A thickness of the substrate 62 was set to 1.5 mm.
Also, the interconnect patterns 65A-65D formed on the surface of
the substrate 62 are made from Au/Ni/AgPd. The primer 70 is a 5
.mu.m-thick urethane resin-based primer applied on the entire top
surface of the substrate 62 including the interconnect patterns
65A-65D.
[0151] The blue LED chip 66 is mounted on the primer 70 between the
anode-side interconnect pattern 65B and the cathode-side
interconnect pattern 65A via a die-bond paste. In this blue LED
chip 66, its anode-side electrode is connected to the anode-side
interconnect pattern 65B by a gold wire 76B, and its cathode-side
electrode is connected to the cathode-side interconnect pattern 65A
by a gold wire 76A.
[0152] Also, the blue LED chip 67 is mounted on the primer 70
between the anode-side interconnect pattern 65B and the
cathode-side interconnect pattern 65C via a die-bond paste. In this
blue LED chip 67, its anode-side electrode is connected to the
anode-side interconnect pattern 65B by a gold wire 77A, and its
cathode-side electrode is connected to the cathode-side
interconnect pattern 65C by a gold wire 77B.
[0153] Also, the blue LED chip 68 is mounted on the primer 70
between the anode-side interconnect pattern 65D and the
cathode-side interconnect pattern 65C via a die-bond paste. In this
blue LED chip 68, its anode-side electrode is connected to the
anode-side interconnect pattern 65D by a gold wire 78B, and its
cathode-side electrode is connected to the cathode-side
interconnect pattern 65C by a gold wire 78A.
[0154] In this embodiment, those three blue LED chips 66-68 are
arranged and connected in series. In this embodiment also, 11 LED
chips (not shown) similar to the LED chip 66 are arrayed and
connected in parallel on the depth side of the drawing sheet of
FIG. 5A. Also, 11 LED chips (not shown) similar to the LED chip 67
are arrayed and connected in parallel on the depth side of the
drawing sheet of FIG. 5A. Also, 11 LED chips (not shown) similar to
the LED chip 68 are arrayed and connected in parallel on the depth
side of the drawing sheet of FIG. 5A.
[0155] In this embodiment, those individual LED chips including the
LED chips 66-68 are subjected to die bonding and wire bonding in a
state in which the primer 70 has been formed. Also, in FIG. 5A,
both-end interconnect patterns 65A, 65D extend to form external
connection electrodes.
[0156] The mounting of the individual LED chips including the LED
chips 66-68 is performed via die-bond paste as described above.
However, the primer 70 may be used instead of the die-bond paste in
the case where viscosity and adhesion of the primer 70 are tuned as
required and the LED chips are mounted on the substrate 62 before
the curing of the primer 70.
[0157] A sealing resin portion 63 is formed so as to provide a 0.4
mm thick resin sealing of methylsilicone resin on the LED chips and
the primer 70. This sealing resin portion 63 can be fabricated by
injecting and curing the sealing resin onto the substrate 62 with a
dam sheet (not shown) made of Teflon (registered trademark), and
then removing the dam sheet. In the silicone resin that forms the
sealing resin portion 63, a fluorophor (not shown) that performs
wavelength conversion of light derived from the blue LED chips
66-68 to emit fluorescent light is added. The sealing resin portion
63 is in close contact with the primer 70.
[0158] Also in this fourth embodiment, particles of the fluorophor
include a red fluorophor made of europium-activated pure nitride
fluorophor ((Sr.Ca)AlSiN.sub.3:Eu) having a mean particle size of 5
.mu.m, and a green fluorophor made of a europium-activated
fluorophor ((Si.Al).sub.6(O.N).sub.8:Eu). The red fluorophor
performs wavelength conversion of light derived from the blue LED
chips 66-68 to emit red fluorescent light having an emission peak
in a wavelength range of 600 nm to 750 nm wavelengths. Also, the
green fluorophor emits green fluorescent light having an emission
peak in a wavelength range of 490 nm to 600 nm wavelengths.
[0159] A surface of the sealing resin portion 63, parallel to the
surface of the substrate 62, is a generally flat surface. More
specifically, the light emitting device of this fourth embodiment
has a thickness of 1.5 mm, a lateral width of 18.0 mm and a
longitudinal width of 18.0 mm as an example.
[0160] Next, a modification of the fourth embodiment is shown in
FIG. 5B. In this modification, a metal reflection coating 73 by Ag
plating is formed on a surface of the substrate 62. It is noted
that the metal reflection coating 73 may be made from Ag or
AgBi-based alloy, or AgNd-based alloy. The metal reflection coating
73 may also be made from an Ag alloy containing 0.5 to 5.0 wt % of
at least one kind of metal selected from Pt, Au, Cu, Pd, Mg, Ti and
Ta.
[0161] Then, a primer 78 is applied at a thickness of 60 .mu.m so
as to cover the metal reflection coating 73. Further, Au/Ni/W
interconnect patterns 75A, 75B, 75C, 75D are formed on the primer
78. The primer 78 functions as an insulating layer between the
metal reflection coating 73 and the individual interconnect
patterns 75A-75D.
[0162] The blue LED chip 66 is mounted on the primer 78 between the
anode-side interconnect pattern 75B and the cathode-side
interconnect pattern 75A via a die-bond paste. In this blue LED
chip 66, its anode-side electrode is connected to the anode-side
interconnect pattern 75B by a gold wire 76B, and its cathode-side
electrode is connected to the cathode-side interconnect pattern 75A
by a gold wire 76A.
[0163] Also, the blue LED chip 67 is mounted on the primer 78
between the anode-side interconnect pattern 75B and the
cathode-side interconnect pattern 75C via a die-bond paste. In this
blue LED chip 67, its anode-side electrode is connected to the
anode-side interconnect pattern 75B by a gold wire 77A, and its
cathode-side electrode is connected to the cathode-side
interconnect pattern 75C by a gold wire 77B.
[0164] Also, the blue LED chip 68 is mounted on the primer 78
between the anode-side interconnect pattern 75D and the
cathode-side interconnect pattern 75C via a die-bond paste. In this
blue LED chip 68, its anode-side electrode is connected to the
anode-side interconnect pattern 75D by a gold wire 78B, and its
cathode-side electrode is connected to the cathode-side
interconnect pattern 75C by a gold wire 78A.
[0165] In this modification, a sealing resin portion 79 formed in
the same manner as the sealing resin portion 63 of the
above-described fourth embodiment is included. In FIG. 5B, both-end
interconnect patterns 75A, 75D extend to form external connection
electrodes. Also in this modification, the primer 78 may cover not
only the upper surface of the substrate 62 but its entire
surface.
[0166] In the fourth embodiment and its modification, combining the
thin primer 70, 78 with the sealing resin portion 63, 79 makes it
possible to provide a structure superior in both gas barrier
property and heat resistance. As a result of this, corrosion of
AgPd that is the basis of the interconnect pattern 65A-65D,
75A-75D, or Ag of the metal reflection coating 73 portion, can be
prevented so that decreases of the reliability and decreases of the
luminosity and chromaticity can be prevented. Also, in the fourth
embodiment and the modification, the fabrication process can be
achieved by the same process as the conventional one except that
the application and drying step of the primer 70, 78 is executed
before the die-bonding step or the interconnect pattern formation
step, thus the production process being simple and cost-increase
suppressed. Besides, the primer 70, 78 has a refractive index
generally equal to that of the sealing resin portion 63, 79 (1.4 to
1.5 in both cases), being excellent in light transmissivity.
Further, since the primer 70, 78 is not applied on the top surfaces
of the individual LED chips, there occurs neither attenuation nor
confusion of light, so that stable characteristics can be
obtained.
Fifth Embodiment
[0167] Next, a light emitting device according to a fifth
embodiment of the invention is described with reference to FIG. 6.
FIG. 6 is a longitudinal sectional view showing a main-part
construction example of the light emitting device according to the
fifth embodiment.
[0168] As shown in FIG. 6, a plurality of light emitting units 81
mounted on a substrate 82 are included in the light emitting device
of this fifth embodiment. The light emitting units 81 are sealed
with resin at a thickness of 0.3 mm by a resin sealing portion
formed on a 0.3 mm thick alumina substrate.
[0169] Each light emitting unit 81 has a blue LED chip having a
primary emission peak in a blue wavelength range of 400 nm to 500
nm wavelengths. This blue LED chip 86 is mounted on the substrate
82. As shown in FIG. 6, an 0.5 .mu.m thick epoxy resin-based primer
90 is applied over regions of the top surface of the substrate 82
other than its regions over which the LED chip 86 is mounted.
[0170] Also, a reflector member 93 is attached onto the primer 90
so as to surround each LED chip 86. This reflector member 93 has an
Ag-plated reflecting surface 93A, and peripheries of the reflecting
surface 93A are dip coated with a primer 94 of acrylic resin
beforehand. Also, a sealing resin portion 83 is formed so as to
cover the reflector member 93, the primer 90 and the LED chip 86.
The sealing resin portion 83 is made from a sealing resin with a
fluorophor added thereto, and serves for resin sealing of the LED
chip 86. It is noted that the fluorophor may be one which emits
light yellow. Further, it is also possible that the sealing resin
does not contain any fluorophor and a combination of LED chips for
individual RGB (Red, Green, Blue) colors and a sealing resin
portion containing no fluorophor is adopted.
[0171] In this fifth embodiment, a glass epoxy printed board was
used as the substrate 82. A thickness of the substrate 82 was set
to 1.0 mm. Also, unshown Cu interconnect patterns are formed on the
surface of the substrate 82. The light emitting units 81 are
mounted on the Cu interconnect patterns. The sealing resin portion
83 may also be lens-shaped. Further, the above-described reflector
member 93 may also be given by a metal block having a Ag-plated
surface.
[0172] In this fifth embodiment, combining the thin primer 90 with
the sealing resin portion 83 makes it possible to provide a
structure superior in both gas barrier property and heat
resistance. As a result of this, Cu blackening of the Cu
interconnect patterns (not shown) can be prevented so that
decreases of the reliability and decreases of the luminosity and
chromaticity can be prevented. Also, in the fifth embodiment, the
production process can be achieved by a simple, cost-increase
suppressed process because the primer 90 is applied on the entire
surface of the substrate 82 other than the mounting portion of the
LED chip 86.
[0173] Also in this fifth embodiment, since the primer is applied
on the entire surface of the substrate 82 around the LED chips, the
gas barrier property (halogen resistance) of the substrate as a
whole can be enhanced. Therefore, the light emitting device can be
suitably used as LED devices for vehicle and backlight use. Also,
primer coating for the reflector members 93 of the individual light
emitting units 81 is performed independently and separately, there
is an advantage that the primer can easily be made uniform in
thickness among the individual reflector members 93. Besides, the
primer 90, 94 has a refractive index generally equal to that of the
sealing resin portion 83 (1.4 to 1.5 in both cases), being
excellent in light transmissivity. Further, since the primer is not
applied on the sealing resin portion 83, light is transmitted
therethrough without incurring attenuation or confusion of light,
eliminating a fear for explosion of gas contained in the sealing
resin portion.
[0174] In addition, in the first to fifth embodiments, it is
desirable that the coefficient of thermal expansion of the sealing
resin portion and the coefficient of thermal expansion of the
primer are generally equal to each other. In this case, impairment
of close contact between the sealing resin and the primer due to
heat can be avoided.
REFERENCE SIGNS LIST
[0175] 1, 21 . . . light emitting device [0176] 2, 62, 82 . . .
substrate [0177] 3, 23, 43, 63, 79, 83 . . . sealing resin portion
[0178] 3a . . . liquid silicone resin [0179] 5A, 5B, 25A, 65A-65D,
75A-75D . . . interconnect pattern [0180] 6, 26, 46, 66-68, 86 . .
. LED chip [0181] 7, 27, 47, 76A, 76B, 77A, 77B . . . bonding wire
[0182] 8A, 8B . . . external connection electrode [0183] 31, 32,
51, 52 . . . external connection terminal [0184] 9A, 9B . . .
through conductive layer [0185] 10, 30, 35, 55, 70, 78, 90, 94 . .
. primer [0186] 11 . . . dam sheet [0187] 12 . . . metal mold
[0188] 22, 42 . . . resin portion [0189] 22A, 42A . . . base
portion [0190] 22B, 42B . . . wall portion [0191] 25, 45 . . . lead
frame [0192] 25A, 45A . . . first portion [0193] 25B, 45B . . .
second portion [0194] 33, 44, 73 . . . metal reflection coating
[0195] 81 . . . light emitting unit [0196] 93 . . . reflector
member [0197] 93A . . . reflecting surface
* * * * *