U.S. patent application number 12/573477 was filed with the patent office on 2011-04-07 for grinding tool and method of manufacturing the grinding tool.
Invention is credited to Chia-Pei CHEN.
Application Number | 20110081848 12/573477 |
Document ID | / |
Family ID | 43823544 |
Filed Date | 2011-04-07 |
United States Patent
Application |
20110081848 |
Kind Code |
A1 |
CHEN; Chia-Pei |
April 7, 2011 |
GRINDING TOOL AND METHOD OF MANUFACTURING THE GRINDING TOOL
Abstract
A manufacturing method for grinding tool includes following
steps. Step 1 is providing a substrate. Step 2 is fixing diamond or
abrasive grit in a predetermined position or base by DIAMAP
(Diamond Implant Array Mapping & Arrangement Process). The last
step is providing a second fixing layer onto the first fixing base
and the exposed surface of the substrate. The first fixing base and
the second fixing layer are used for fixing the abrasive grits on
the substrate. Moreover, a grinding tool is provided in the present
invention.
Inventors: |
CHEN; Chia-Pei; (Taipei
City, TW) |
Family ID: |
43823544 |
Appl. No.: |
12/573477 |
Filed: |
October 5, 2009 |
Current U.S.
Class: |
451/443 ;
451/444; 51/295 |
Current CPC
Class: |
B24D 7/066 20130101;
B24D 18/0009 20130101 |
Class at
Publication: |
451/443 ; 51/295;
451/444 |
International
Class: |
B24B 53/02 20060101
B24B053/02; B24D 7/00 20060101 B24D007/00; B24D 3/00 20060101
B24D003/00 |
Claims
1. A manufacturing method of a grinding tool, comprising: providing
a substrate, the substrate having a plurality of receiving
portions; fixing abrasive grits on the receiving portions of the
substrate; forming a first fixing base in each of the receiving
portions for fixing the abrasive grits on the substrate, and then
removing the receiving portions; and forming a second fixing layer
to cover the first fixing base and the exposed substrate, wherein
the first fixing base and the second fixing layer are used for
fixing and arranging the abrasive grits on the substrate.
2. The manufacturing method of a grinding tool of claim 1, wherein
the receiving portions is formed by semi-conductor manufacturing
method, micro electro mechanical method, press-printing,
screen-printing, inking, laser-forming or electrical discharge
machining.
3. The manufacturing method of a grinding tool of claim 1, wherein
the receiving portions is formed by a step of forming an auxiliary
layer with the receiving portions on the substrate.
4. The manufacturing method of a grinding tool of claim 3, wherein
the receiving portions are formed on the auxiliary layer by
semi-conductor manufacturing method or micro electro mechanical
method, or by applying physical and chemical properties of the
auxiliary layer.
5. The manufacturing method of a grinding tool of claim 1, wherein
in the step of fixing abrasive grits on the receiving portions,
micro or nano diamond grits are provided into the receiving
portions, and each of the receiving portion has at least one
diamond grit thereinside.
6. The manufacturing method of a grinding tool of claim 1, wherein
in the step of forming a first fixing base, the first fixing base
is formed on a contact position of the abrasive grit and the
substrate by electro-forming, electro-plating, electroless-plating,
physical vapor deposition or chemical vapor deposition so that the
abrasive grits are fixed on the substrate.
7. The manufacturing method of a grinding tool of claim 6, wherein
in the step of forming a first fixing base, the first fixing base
of a metal layer, a ceramic layer, a composite material layer or a
diamond layer is formed on the contact position of the abrasive
grit and the substrate by electro-forming, electro-plating,
electroless-plating, physical vapor deposition or chemical vapor
deposition.
8. The manufacturing method of a grinding tool of claim 1, wherein
in the step of forming a second fixing layer, the second fixing
layer is formed on the substrate by electro-plating,
electroless-plating, physical vapor deposition or chemical vapor
deposition so that the second fixing layer covers the first fixing
base and the exposed substrate.
9. The manufacturing method of a grinding tool of claim 8, wherein
in the step of forming a second fixing layer, the second fixing
layer of a metal layer, a ceramic layer, a composite material
layer, or a diamond layer is formed on the substrate by
electro-plating, electroless-plating, physical vapor deposition or
chemical vapor deposition.
10. A grinding tool, comprising: a substrate and a plurality of
abrasive grits regularly arranged on the substrate, each of the
abrasive grits contacting the substrate on a contact position, a
first fixing base disposed on the contact position, a second fixing
layer covered the first fixing base and the exposed substrate,
wherein the abrasive grits are regularly fixed and arranged on the
substrate to form a grinding surface pattern.
11. The grinding tool of claim 10, wherein the substrate is made of
metal materials, ceramic materials or high hardness plastics.
12. The grinding tool of claim 11, wherein the ceramic materials
include oxide ceramic material, carbide ceramic material, or
nitride ceramic material, the metal materials include stainless
steel, aluminium alloy, titanium alloy, or alloy steel.
13. The grinding tool of claim 10, wherein the first fixing base is
made of metal material, ceramic material, composite material, or
diamond material.
14. The grinding tool of claim 13, wherein the second fixing layer
is made of metal material, ceramic material, composite material, or
diamond material.
15. The grinding tool of claim 10, wherein the grinding surface
pattern includes at least one non-filled area and at least one
working area, the abrasive grits are regularly fixed and arranged
on the working area, and the non-filled area has no abrasive grit
thereon.
16. The grinding tool of claim 10, wherein the abrasive grits are
arranged on substrate with various densities, the abrasive grits
includes diamond powders, carbide ceramic powders, oxide ceramic
powders, or nitride ceramic powder, and particle sizes of the
abrasive grits are ranged from 100 nm to 500 um.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a grinding tool and a
method of manufacturing the grinding tool, and more particularly to
a grinding tool with higher grinding performance and a method of
manufacturing the grinding tool.
[0003] 2. Description of Related Art
[0004] With development of the semiconductor industry, many tools
are used in the manufacturing processes. For example, to obtain
smooth and flat surface of wafer, chemical mechanical polishing
(CMP) process is widely used for achieving the planarization of the
wafer. In the CMP process, the wafer is covered by a disk and
pressed on the rotating polishing pad, and then the acidic or
alkali polishing liquid is injected on the polishing pad to conduct
the polishing process.
[0005] The grinding tool is a metal disk with diamond powders on
the surface thereof and the grinding tool can be used for
conditioning the polishing pad. The grinding tool also called as
diamond disk and the diamond disk is used for conditioning the
polishing pad so as to improve the polishing efficiency.
Furthermore, the diamond disk can be used for removing the polished
particles and sludge from the polishing pad.
[0006] Please refer to FIG. 1; the traditional grinding tool 1a is
formed by brazing 12a the diamond powders 11a onto the metal
substrate 10a. In the traditional method, the diamond powders 11a
are randomly arranged on the metal substrate 10a. Therefore, the
grinding performance can't be designed and controlled.
[0007] Another method is provided to manufacture the grinding tool.
A supporter with meshes is assembled on a substrate and diamond
powders are disposed in the meshes and arranged on the substrate.
Then, a high temperature sintering process is provided to fix the
diamond powder on the substrate. However, the meshes have limited
sizes and it is not suitable for small-sized diamond powders.
Moreover, the temperature of the sintering process is too high to
maintain the quality of diamond powders. Therefore, the diamond
powder has carbonization issue resulted from a high temperature
process and the powders are easily broken during the conditioning
process. Still further, the arrangement of the mesh is not
adjustable so that the distribution of the diamond powders, such as
particle size, arrangement pattern and density, is limited and
non-designable. Thus, the traditional grinding tool cannot be used
in various dressing conditions.
[0008] Therefore, there is a need to provide a novel structure that
can overcome the shortages of the prior art.
SUMMARY OF THE INVENTION
[0009] It is one object of the present invention to provide a
grinding tool and a method of producing the tool. The manufacturing
method has low temperature process so that the carbonization issue
resulted from a high temperature sintering process of the
traditional method can be solved. Furthermore, the arrangement
pattern, the fixing depth and the particle size of the abrasive
grits can be controlled. Therefore, the grinding or conditioning
performance of the grinding tool of the present invention can be
improved.
[0010] To achieve the above-mentioned objectives, the present
invention provides a manufacturing method of a grinding tool. The
manufacturing method includes following steps. Step 1 is providing
a substrate. Step 2 is fixing abrasive grits to the pre-determined
base on substrate by Diamond Implant Array Mapping &
Arrangement Process (DIAMAP). Step 3 is forming a second fixing
layer to cover the first fixing base and the exposed substrate. The
first fixing base and the second fixing layer are used for fixing
the abrasive grits on the substrate.
[0011] The DIAMAP of the present invention includes three steps.
First step is forming the receiving portions on the substrate. Next
step is implanting the abrasive grit(s) into the receiving
portions. Third step is fixing the abrasive grit(s) on the
substrate by the first fixing base and then removing the receiving
portions.
[0012] The present invention further provides a grinding tool. The
grinding tool includes a substrate and a plurality of abrasive
grits regularly arranged on the substrate. The contact positions of
abrasive grits and the substrate are respectively covered by a
first fixing base. Moreover, the first fixing base and the exposed
surface of the substrate are covered by a second fixing layer.
Therefore, the abrasive grits are regularly fixed on the substrate
so as to form a grinding surface pattern.
[0013] The present invention provides the following advantages. The
abrasive grits are fixed on the substrate by the first fixing base
and the second fixing layer. In other words, the method of the
present invention does not include high temperature forming
processes, such as a sintering process. Therefore, the strength of
the abrasive grits is not changed or degraded as the traditional
process so that the abrasive grits are not easily broken. Moreover,
the structures of the receiving portions, such as distribution
density, opening sizes of the receiving portions, can be adjusted
and the distribution density and the size of the abrasive grits are
also adjustable. On the other hand, the receiving portions can be
formed in partial areas of the substrate so that the abrasive grits
can be fixed only in designed working areas. Accordingly, the
grinding or conditioning performance of the tool of the present
invention can be improved.
[0014] In order to further understand the techniques, means and
effects, the present invention takes for achieving the prescribed
objectives, the following detailed descriptions and appended
drawings are hereby referred; such that, through which the
purposes, features, and aspects of the present invention can be
thoroughly and concretely appreciated; however, the appended
drawings are merely provided for reference and illustration,
without any intention to be used for limiting the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a schematic view of a traditional grinding
tool.
[0016] FIG. 2 shows a manufacturing method of a grinding tool
according to the present invention.
[0017] FIG. 3 shows a manufacturing method of the first embodiment
of a grinding tool according to the present invention.
[0018] FIG. 4 is a schematic view of the first embodiment of a
grinding tool according to the present invention.
[0019] FIG. 4A is a schematic view of the second embodiment of a
grinding tool according to the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0020] Referring to FIGS. 2 and 4, the present invention provides a
manufacturing method of a grinding tool 1. The manufacturing method
is applied for arranging and fixing the abrasive grits 20 regularly
on the surface of the substrate 10 so that the grinding tool 1 can
be used in high precision grinding or conditioning process. On the
other hand, the grinding tool 1 is manufactured in low temperature
process so as to solving the high temperature degradation problem
of the abrasive grits 20. The manufacturing method includes the
following steps (please refer to FIG. 3).
[0021] Step S101 is providing a substrate 10. In the embodiment,
the substrate 10 is made of stainless steel, but not restricted
thereby. For example, the substrate 10 can be made of metal
materials, such as aluminium alloy, titanium alloy, or alloy steel,
or be made of ceramic material, such as oxide ceramic material,
carbide ceramic material, or nitride ceramic material, or be made
of high hardness plastics. In other words, the material of the
substrate 10 is not limited and the substrate 10 has a property of
hardness (with a rigid surface) for forcing on the object and for
resisting the reactive force.
[0022] Step S102 is fixing the abrasive grits 20 on the surface of
the substrate 10 by a method of DIAMAP (Diamond Implant Array
Mapping & Arrangement Process). The method of DIAMAP includes
step S1021 to Step 1024. Step S1021 is forming a plurality of
receiving portions on the substrate 10. In other words, the
receiving portions are regularly formed on the surface of the
substrate 10 so that the abrasive grits 20 can be fixed into the
receiving portions. Thus, the abrasive grits 20 can be arranged
regularly on the substrate 10. The receiving portions can be formed
by semi-conductor manufacturing method, micro electro mechanical
method, press-printing, screen-printing, inking, laser-forming or
electrical discharge machining. Alternatively, an auxiliary layer
with the receiving portions can be formed on the substrate 10. The
receiving portions are formed on the auxiliary layer by
semi-conductor manufacturing method or micro electro mechanical
method, or by applying physical and chemical properties of the
auxiliary layer. The receiving portions are regularly arranged and
the shape and the opening size of the receiving portion can be
adjusted. In addition, the distance between the adjacent receiving
portions also can be adjusted. In the embodiment, the opening size
of the receiving portion is ranged from 10 to 500 um and the
receiving portions can have various opening sizes.
[0023] Step S1022 is implanting the abrasive grits 20 into the
receiving portions so that at least one abrasive grit 20 can be
accommodated in a single receiving portion. The abrasive grits 20
are preferably and regularly received inside the receiving
portions. The size of the abrasive grits 20 is chosen according to
the opening size of the receiving portion. In the embodiment, the
abrasive grits 20 are micro or nano diamond grits for providing
into the receiving portions. Alternatively, the abrasive grits 20
can be diamond powders, carbide ceramic powders, oxide ceramic
powders, or nitride ceramic powder, and so on, and particle sizes
of the abrasive grits 20 are ranged from 100 nm to 500 um.
[0024] Step S1023 is forming a first fixing base 30 in each of the
receiving portions for fixing the abrasive grits 20 on the
substrate 10. In the embodiment, the first fixing base 30 of nickel
material is formed on a contact position of the abrasive grit 20
and the substrate 10 by electro-forming method. The first fixing
base 30 of nickel material is used for connecting the bottom of the
abrasive grit 20 with the substrate 10 so that the abrasive grits
20 can be fixed on the substrate 10. On the other hand, the
isolation process of the electro-forming method is well known to
the skilled person. However, another deposition method can be
provided such as PVD or CVD method and the first fixing base 30 can
be made of metal (i.e., titanium, copper, or aluminum), ceramic,
composite materials, or diamond.
[0025] Step S1024 is removing the receiving portions. The receiving
portions are removed and the abrasive grits 20 are fixed on the
substrates without the receiving portions. In the embodiment, the
receiving portions can be removed by a chemical method, but not
restricted thereby.
[0026] Next, Step S103 is providing for forming a second fixing
layer 40 to cover the substrate 10. The second fixing layer 40
covers the first fixing base 30 and the exposed surface of the
substrate 10, which is exposed after the receiving portions being
removed. The second fixing layer 40 is used for improving the
connection strength of the abrasive grits 20 and the substrate 10
so that the abrasive grits 20 can be used against the grinding
force and be applied in the grinding or conditioning process.
Similarly to the first fixing base 30, the second fixing layer 40
can be formed by an electro-plating method, a chemical plating
method, PVD or CVD method. On the other hand, the second fixing
layer 40 is a metal layer, a ceramic layer, a composite-material
layer, or a diamond layer formed by a vapor growth process. By the
second fixing layer 40, the abrasive grits 20 can be attached on
the substrate 10 with high connection strength.
[0027] Accordingly, the grinding tool 1 is manufactured by the
above-mentioned steps. The grinding tool 1 includes a substrate 10
and a plurality of abrasive grits 20 regularly arranged on the
substrate 10. The contact positions of abrasive grits 20 and the
substrate 10 are respectively covered by a first fixing base 30.
Moreover, the first fixing base 30 and the exposed surface of the
substrate 10 are covered by a second fixing layer 40. Therefore,
the abrasive grits 20 are regularly fixed on the substrate 10 so as
to form a grinding surface pattern to conduct the grinding or
conditioning process. The materials and the manufacturing methods
of the substrate 10, the abrasive grits 20, the first fixing base
30, and the second fixing layer 40 are shown in the above-mentioned
description.
[0028] Furthermore, the structure of the grinding surface patterns
can be adjusted in the Step S1021. For example, the receiving
portions are distributed on some portion of the substrate surface
(i.e., the receiving portions are not formed on the entire
substrate surface). Therefore, the abrasive grits 20 can be
arranged on the surface of the substrate 10 with the receiving
portions, but not implanted to the surface of the substrate 10
without the receiving portions in the Step S1022. By the formation
of the receiving portions, the grinding surface pattern can have a
non-filled area 202 and a working area 201. Please refer to FIG.
4A, the grinding surface pattern has there non-filled areas 202
which have no abrasive grit 20 thereon and there working areas 201
which have abrasive grits 20 thereon. In the grinding process, the
non-filled areas 202 are used for improving the material removing
rate of the particles. On the other hand, the receiving portions
can be distributed with different densities or concentration on the
auxiliary layer so that the abrasive grits 20 can also be
distributed with different densities or concentration on the
surface of the substrate 10.
[0029] In light of the foregoing above, the present invention
provides the following advantages.
[0030] 1. The manufacturing steps and methods used in the present
invention are classified as a low-temperature manufacturing
process. Therefore, the carbonization issue resulted from a high
temperature process of the traditional method can be solved. The
grinding tool of the present invention provides improving grinding
or conditioning performance.
[0031] 2. Depending on the DIAMAP method of the present invention,
the receiving portions can be arranged on the substrate in various
distributions. Therefore, the grinding tool of the present
invention can have various grinding surface patterns for applying
to different applications. For example, the distance pitch between
the adjacent abrasive grits can be adjusted, or the smaller
abrasive grits can be fixed on the substrate, or the distribution
of the abrasive grits can have different densities or concentration
and different working areas. The grinding ability of the grinding
tool of the present invention is improved.
[0032] 3. The arrangement of the abrasive grits and the protrusions
of the abrasive grits can be controlled. Therefore, the
grinding/dressing rate and the grinding/dressing efficiency can be
precisely predicted. For the product quality, the grinding
performance is easily controlled.
[0033] The above-mentioned descriptions represent merely the
preferred embodiment of the present invention, without any
intention to limit the scope of the present invention thereto.
Various equivalent changes, alternations, or modifications based on
the claims of present invention are all consequently viewed as
being embraced by the scope of the present invention.
* * * * *