U.S. patent application number 12/553184 was filed with the patent office on 2011-04-07 for temperature controlled head gear.
Invention is credited to Cecil D. McKinney.
Application Number | 20110078845 12/553184 |
Document ID | / |
Family ID | 43822019 |
Filed Date | 2011-04-07 |
United States Patent
Application |
20110078845 |
Kind Code |
A1 |
McKinney; Cecil D. |
April 7, 2011 |
TEMPERATURE CONTROLLED HEAD GEAR
Abstract
A thermoregulatory unit, with a preferred use in combination
with headwear, thereby defining a temperature controlled head gear
comprising an article of headwear, and a thermally conductive pad
in conductive association with the thermoregulatory unit.
Inventors: |
McKinney; Cecil D.;
(Kissimmee, FL) |
Family ID: |
43822019 |
Appl. No.: |
12/553184 |
Filed: |
September 3, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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61094389 |
Sep 4, 2008 |
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Current U.S.
Class: |
2/422 |
Current CPC
Class: |
A42B 3/285 20130101 |
Class at
Publication: |
2/422 |
International
Class: |
A42B 1/24 20060101
A42B001/24 |
Claims
1. A temperature controlled head gear device, comprising: an
article of headwear; a thermally conductive pad positioned for
direct contact with the device wearer; a thermoregulatory unit,
said thermoregulatory unit in conductive association with said
thermally conductive pad; a power source for said thermoregulatory
unit; a heat sink and fan assembly carried by said article of
headwear; and a control unit for said thermoregulatory unit, said
control unit further comprising a temperature sensor.
2. A thermoregulatory unit, comprising: at least one peltier chip;
a power source; and a control unit.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present U.S. Non-Provisional patent application claims
priority to and all benefit of U.S. Provisional Patent Application
entitled "A Temperature Controlled Head Gear," filed on Sep. 4,
2008, on behalf of inventor Cecil D. McKinney, and having assigned
Ser. No. 61/094,389.
INTRODUCTION
[0002] Head gear is often used by individuals either to protect
themselves against physical injury, whether a result of playing
sports (i.e. footballer, motor bike rider) or due to an
occupational hazard (i.e. fire fighter or army personnel). Head
gear is also worn by individuals as protection against the sun's
rays. Regardless of the type of head gear chosen, these head gear
by itself still does not provide comfortable temperature regulation
for the wearer, particularly during more extreme weather
conditions, or when the head gear is worn during arduous physical
activity. Thus, there is a need for a head gear that allows for
temperature regulation inside the head gear in either hot or cold
climates.
[0003] A thermoregulatory system for cooling or heating head gear
is described. The system can regulate the temperature of a helmet
or other head gear, providing increased comfort and safety. The
primary preferred focus of the temperature regulation is directed
at brain stem temperature, rather than at core body
temperature.
DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is a partial cross-sectional view of a headgear in
accordance with one embodiment;
[0005] FIG. 2 is a bottom plan view of the inside back of a helmet,
in accordance with another embodiment;
[0006] FIG. 3 is a bottom plan view of the inside back of another
helmet, in accordance with another embodiment;
[0007] FIG. 4 is a perspective view of the outside back of a
helmet, in accordance with a further embodiment;
[0008] FIG. 5A is a side view of a temperature regulation device,
according to a preferred embodiment;
[0009] FIG. 5B is a cross-sectional view of the device of FIG. 5A;
and
[0010] FIG. 6 is a perspective view of the device of FIG. 5A, shown
installed on a helmet strap.
DESCRIPTION OF TEMPERATURE CONTROLLED HEAD GEAR
[0011] The present invention provides a thermoregulatory system for
a head gear for cooling or warming the head of the wearer.
[0012] Referring to FIG. 1 showing a partial cross-sectional view
of one embodiment of the thermoregulatory system, a temperature
controlled head gear comprises a protective helmet 10 and a pad
containing a thermally conductive material, such as synthetic oil
or a thermal gel. Examples of thermal gels include, but are not
limited to, gels such as those found in various reusable gel packs
or hot and cold packs. Such gels can retain a cold or hot
temperature, and remain pliable after being subjected to freezing
temperatures or microwave radiation in a conventional microwave
oven for a sufficient period of time. Other gels are those based on
the gelation of xanthan gum, locust bean gum, gum tragacanth, guar
gum, hydroxypropyl methylcellulose, absorbent polymers, and the
like. For example, the gel can be based on a high molecular weight
polyacrylic acid cross-linked with a polyalkenyl ether, or comprise
an absorbent cross-linked sodium polymer and water. Preferably, the
gel is one that can be repeatedly heated and cooled, with no
appreciable decrease in performance. In the embodiment shown in
FIG. 1 the thermally conductive pad is a gel pad 12.
[0013] The gel pad 12 can be positioned and attached at the rear,
front, a side, or roof of the helmet. In preferred embodiments, the
gel pad is located at the rear of the helmet where it can cool/heat
the hack of the wearer's neck. The gel pad allows heat to be
conducted from the surface of the wearer's head to a
thermoregulatory unit 14, and is permanently or reversibly attached
to the thermoregulatory unit to allow heat to be conducted from the
gel pad to the environment. The protective helmet can be, but is
not limited to, a helmet used by footballer players, motor bike
riders, pedal bike riders, race car drivers, construction workers,
army personnel, police personnel, or the like.
[0014] In other embodiments, a sport cap or brimmed hat can be used
as a head gear. As with a helmet, a pad of thermally conductive
material can he positioned either at the rear, front, side, or roof
of the cap or hat. A thermoregulatory unit is situated in close
proximity with the pad to allow conduction of heat between pad and
the environment. Examples of sport caps include, but are not
limited to, golf caps, baseball caps, fashion caps, or the like,
which can be made of conventional cloth or other well known
materials. Examples of brimmed hats can include, but are not
limited to, golf hats, hiking hats, fashion hats, or the like,
which can be made of materials such as cloth, plastic, leather,
straw-like material, or other well known materials.
[0015] As shown in FIG. 1, the thermoregulatory unit comprises a
thermoelectric in the form of a peltier chip 16 which is located on
the inside of the helmet, and a heat sink and fan assembly 18 on
the outside of the helmet for dissipation of the heat/cold exhaust.
In this embodiment, the heat sink and fan assembly is placed over
an exhaust port or vent cut into the helmet, which provides a
passageway for air to or from the environment. Preferably, the
pettier chip and gel pad are also located near or over the exhaust
port or vent. FIG. 2 is an underside view showing the inside of the
helmet, and showing the heat sink and fan assembly on the outside
back of helmet FIG. 3 is an underside view a peltier chip 16
attached to the inside of a helmet.
[0016] A pettier chip is a thermoelectric based on semiconductor
materials that utilize the Peltier effect, in which heat is
radiated or absorbed at the junction of two dissimilar metals
depending upon the direction of a small current that passes through
the junction. When DC is applied to one direction, a first surface
of the peltier chip serves as a cooling surface for absorbing heat
and second surface of the chip serves as a radiating surface for
radiating heat. When the current is reversed, the first surface
becomes the heating surface while the second surface becomes the
cooling surface. Using a thermoelectric in the heating mode is very
efficient because all the internal heating (Joulian heat) and the
load from the cold side are pumped to the hot side. This reduces
the power needed to achieve the desired heating.
[0017] Thermoelectric elements can be stacked one on top of the
other to achieve even lower temperatures. Thus, certain embodiments
have multiply stacked peltier chips arranged in a thermoregulatory
unit. In other embodiments, two or more thermoregulatory units are
arranged at various locations inside a head gear, with each unit
containing a single pettier chip or multiply stacked pettier chips.
In general, the size and the number of the thermoregulatory unit
can be selected to match the requirements of the type of head gear
worn. For instance, a larger thermoregulatory unit could be used to
regulate the temperature of a fire-fighter's helmet.
[0018] A thermoregulatory unit can be powered by various means. For
example, a head gear can be powered by one or more batteries, such
as a 9 volt battery or two AA sized batteries (see FIG. 4 showing a
9 volt battery attached to the outside back of a helmet and
powering a thermoregulatory unit). In such embodiments, each
battery can be releasably attached to the head gear, allowing ready
battery replacement, and can be rechargeable. In other embodiments,
the thermoregulatory unit can be powered by solar energy, via the
solar panels/strips, which can be located on the outside of the
head gear. In yet other embodiments, the thermoregulatory unit can
he powered via a cigarette lighter outlet or other power outlets
found in a motor vehicle. As shown in FIG. 1, a power cord 20 can
connect a thermoregulatory unit to its power source.
[0019] In accordance with the present invention, thermoregulatory
unit can be manually controlled by the wearer of the head gear, or
automatically controlled using a control unit.
[0020] It is understood that the position of the control unit can
be at various locations in or on the head gear. In a preferred
embodiment, the control unit is releasably attached to the
thermoregulatory unit. The control unit can comprise a temperature
sensor (sensor 22 in FIG. 1), such as a thermistor or solid-state
sensor, and a closed-loop control circuit to control/regulate the
temperature. Using a thermistor, or example, the regulatory unit
can be designed to determine the current temperature within the
head gear enclosure, and then determine if the thermoelectric unit
should he placed in a COOL, HEAT or OFF mode. When the sensor
detects an over temperature condition within the enclosure, the
thermoregulatory unit can be activated to begin cooling the air
inside the enclosure. Alternatively, when the sensor detects an
under temperature condition within the enclosure, the unit can he
activated to begin heating, the air. In another embodiment, a
temperature can be selected and the unit will turn itself on and
off accordingly.
[0021] The control unit can include LED type indicators or other
indicators for indicating variables including, but not limited to,
internal and external temperature, mode, and settings, and battery
condition for full charge, low charge and discharged. The control
unit can also include one or more switches for overriding the
controller and manually setting temperature, and for turning the
thermoregulatory unit on and off. The switches associated with the
control unit can take on a variety of forms, such as a
three-position switch, which can he set to COOL, HEAT, or OFF
positions, with the current being constant, but the direction being
alterable. In a more complex scheme, the switch can be in the form
of a temperature dial, including electronic logic controls through
which the user can select a desired temperature range. In certain
embodiments, the switches can adjust the amount of current flowing
to vary the amount of heat transfer. In other embodiments, the
control unit can include a timer which allows a user to set the
thermoregulatory unit to automatically start-up or shut-down at a
desired time.
[0022] A cover can be included over any or all external elements of
the thermoregulatory unit, such as the heat sink and fan assembly,
battery pack, power cord, and thermistor. The cover preferably has
vents to provide heat exchange with the fan. In the preferred
embodiments, the cover measures 4 inches by 4 inches, with a vent
for heat exchange.
[0023] In a preferred embodiment, the peltier chip is a 3 volt
chip, and the control unit has LED indicators on the exterior of
the helmet displaying battery conditions for full charge, low
charge and discharge.
[0024] It should he noted that a preferred application for the
present device is directed to the cooling of the blood flow to the
brain through utilization of a light weight cooling device attached
to, for example, the helmet strap of military personnel, such as
depicted in FIG. 6. In such manner, cooling a small area at the
back of the neck can effectively keep the brain cooler, reducing
stress and maintaining a normal reflex response time, even in high
temperature environments where reflex deterioration can be a
disadvantageous occurrence. Similarly, and inversely, another
preferred application for the present device is directed to warming
of the blood flow to the brain, such as in extreme cold
environments. The brain stem is adjoined structurally with the
spinal cord, such that the direct application of cooling proximate
the juncture can assist in maintaining the functionality of related
motor and sensory systems, cardiac and respiratory function, as
well as regulation of the central nervous system.
[0025] Preferably, contact with the wearer is delivered at 75
degrees; however, it is preferred that the device temperature be
adjustable, and be able to be set by the wearer to heat or cool, as
desired. The preferred manner of installation and carriage
proximate a strap facilitates proper positioning relative to the
brain stern, and easy adaptation of existing headgear and
eliminates the need for introduction of any additional apertures in
protective headgear. This feature beneficially eliminates an
increased risk of potential head injury by avoiding breach of the
headgear protective surface and shell. The preferred structure of
the device that enables this benefit is a cold pack in bonded
contact with a cooling chip, wherein the heat side of the chip is
preferably in contact with a dynamic heat assembly that transfers
the heat to a small fan and heat sink assembly mounted on the year.
This structure is generally depicted in FIGS. 5A and 5B.
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