U.S. patent application number 12/562546 was filed with the patent office on 2011-03-24 for electronic device enclosures having improved ventilation to dissipate heat.
Invention is credited to Laura Avery, Kent A. Burr, Mark William Foohey, Vincent Lam, Gary Law, Garrett Lewis, Arlyn Earl Miller, Paul Noble-Campbell, Kevin Sloan.
Application Number | 20110069449 12/562546 |
Document ID | / |
Family ID | 43065390 |
Filed Date | 2011-03-24 |
United States Patent
Application |
20110069449 |
Kind Code |
A1 |
Miller; Arlyn Earl ; et
al. |
March 24, 2011 |
ELECTRONIC DEVICE ENCLOSURES HAVING IMPROVED VENTILATION TO
DISSIPATE HEAT
Abstract
Electronic device enclosures providing improved heat dissipation
are described herein. An example enclosure for holding an
electronic circuit board includes a housing having a first portion
coupled to a second portion to form a cavity to hold the electronic
circuit board. Each of the first and second portions comprises
openings to direct convention airflow across opposing faces of the
electronic circuit board at the same time. A baffle is coupled to
the housing to substantially visually obscure the openings and to
define a gap between the housing and the baffle to direct the
convection airflow across the opposing faces of the electronic
circuit board.
Inventors: |
Miller; Arlyn Earl;
(Leander, TX) ; Law; Gary; (Georgetown, TX)
; Burr; Kent A.; (Round Rock, TX) ;
Noble-Campbell; Paul; (Austin, TX) ; Lam;
Vincent; (Austin, TX) ; Avery; Laura; (Austin,
TX) ; Lewis; Garrett; (Austin, TX) ; Sloan;
Kevin; (Austin, TX) ; Foohey; Mark William;
(Austin, TX) |
Family ID: |
43065390 |
Appl. No.: |
12/562546 |
Filed: |
September 18, 2009 |
Current U.S.
Class: |
361/692 |
Current CPC
Class: |
H05K 7/20145
20130101 |
Class at
Publication: |
361/692 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. An enclosure for holding an electronic circuit board, the
enclosure comprising: a body having a first face, a second face
opposite the first face, and an exterior peripheral surface
separating the first and second faces, wherein the electronic
circuit board is to be disposed between the first and second faces
so that a first side of the electronic circuit board faces the
first face and the second side of the electronic circuit board
faces the second face, wherein a first portion of the exterior
peripheral surface includes at least one opening for at least one
electrical connector to electrically couple the electronic circuit
board to another electronic device, wherein a second portion of the
exterior peripheral surface includes a first air vent to be
oriented in a downwardly facing direction, and wherein a third
portion of the exterior peripheral surface includes a second air
vent opposite the first air vent and which is to be oriented in an
upwardly facing direction; and a baffle coupled to the body
adjacent at least the second and third portions of the exterior
peripheral surface, wherein the baffle is configured to direct
airflow into the first air vent and out the second air vent, and
wherein the baffle is to be coupled adjacent the second and third
portions of the exterior peripheral surface to at least partially
visually cover the air vents.
2. The enclosure of claim 1, wherein at least one of the first air
vent or the second air vent comprises openings to enable the baffle
to direct the airflow across the first side and the second side of
the electronic circuit board.
3. The enclosure of claim 2, wherein the openings are distributed
in a first row and a second row parallel to the first row, each of
the rows being adjacent a respective one of the faces of the
body.
4. The enclosure of claim 2, wherein the baffle is coupled to the
body to define a gap between the baffle and the openings, wherein
the gap is dimensioned to substantially visually cover the openings
and to facilitate the direction of the airflow across the first and
second sides of the electronic circuit board.
5. The enclosure of claim 1, wherein the body comprises a first
portion and a second portion that is coupled to the first portion
to form a cavity to hold the electronic circuit board.
6. The enclosure of claim 1, wherein the body is made of a plastic
material and the baffle is made of a metal material.
7. The enclosure of claim 1, wherein the baffle comprises a unitary
band or spine that covers a substantial portion of the exterior
peripheral surface.
8. The enclosure of claim 7, wherein the baffle does not cover the
first portion of the exterior peripheral surface.
9. The enclosure of claim 7, wherein the baffle is mechanically
coupled to the body to be a structural member of the body.
10. The enclosure of claim 1, wherein the body comprises another
air vent to direct airflow adjacent a respective one of the sides
of the electronic circuit board.
11. The enclosure of claim 10, wherein the at least one of the
first or second faces includes another baffle to at least partially
cover the other air vent.
12. The enclosure of claim 11, wherein the other baffle provides
indicia associated with a characteristic of the electronic circuit
board.
13. An enclosure for holding an electronic circuit board, the
enclosure comprising: a housing having a first portion coupled to a
second portion to form a cavity to hold the electronic circuit
board, wherein each of the first and second portions comprises
openings to direct convection airflow across opposing faces of the
electronic circuit board at the same time; and a baffle coupled to
the housing to substantially visually obscure the openings and to
define a gap between the housing and the baffle to direct the
convection airflow across the opposing faces of the electronic
circuit board.
14. The enclosure of claim 13, wherein the baffle comprises a
unitary band or spine that wraps around at least a portion of a
peripheral exterior surface of the housing between opposing faces
of the housing.
15. The enclosure of claim 13, wherein the baffle is made of metal
and the housing is made of plastic.
16. The enclosure of claim 13, wherein the baffle is coupled to the
housing to be a structural member of the housing.
17. An enclosure for holding an electronic circuit board, the
enclosure comprising: a housing having a cavity to hold the
electronic circuit board, wherein the housing has first openings on
a first side of the housing to be oriented in a downwardly facing
direction and second openings on a second side of the housing to be
oriented in an upwardly facing direction; and a baffle coupled to
the housing and spaced from the openings to visually obscure the
openings and to direct airflow into the first openings, adjacent
opposing faces of the electronic circuit board at the same time,
and out the second openings.
18. The enclosure of claim 17, wherein the baffle comprises a
unitary band or spine that wraps around at least a portion of a
peripheral exterior surface of the housing between opposing faces
of the housing.
19. The enclosure of claim 17, wherein the baffle is made of metal
and the housing is made of plastic.
20. The enclosure of claim 17, wherein the baffle is coupled to the
housing to be a structural member of the housing.
Description
FIELD OF THE DISCLOSURE
[0001] This disclosure relates generally to enclosures and, more
particularly, to electronic device enclosures having improved
ventilation to dissipate heat.
BACKGROUND
[0002] Process control systems are widely used, for example, in
factories and/or plants in which products are manufactured or
processes are controlled (e.g., chemical manufacturing, power plant
control, etc.). Most modern process control systems include smart
field devices and other process control components that are
communicatively coupled to each other and/or to one or more
controllers, Ethernet switches, and/or other electronic
devices.
[0003] Electronic devices include electronic components or
circuitry (e.g., an electronic circuit board) disposed within a
housing or enclosure. During operation, the electronic components
can generate significant amounts of heat, which may cause the
electronic components to overheat and become damaged or otherwise
impaired. To prevent overheating of the electronic devices, the
heat generated by electronic components should be properly
dissipated via the enclosure. Proper heat dissipation can improve
reliability and prevent premature damage and failure of the
electronic devices and/or components.
SUMMARY
[0004] In one example, an enclosure for holding an electronic
circuit board includes a body having a first face, a second face
opposite the first face, and an exterior peripheral surface
separating the first and second faces. The electronic circuit board
is to be disposed between the first and second faces so that a
first side of the electronic circuit board faces the first face and
the second side of the electronic circuit board faces the second
face. A first portion of the exterior peripheral surface includes
at least one opening for at least one electrical connector to
electrically couple the electronic circuit board to another
electronic device. A second portion of the exterior peripheral
surface includes a first air vent to be oriented in a downwardly
facing direction and a third portion of the exterior peripheral
surface includes a second air vent opposite the first air vent and
which is to be oriented in an upwardly facing direction. A baffle
is coupled to the body adjacent at least the second and third
portions of the exterior peripheral surface such that the baffle is
configured to direct airflow into the first air vent and out the
second air vent. Also, the baffle is to be coupled adjacent the
second and third portions of the exterior peripheral surface to at
least partially visually cover the air vents.
[0005] In another example, an enclosure for holding an electronic
circuit board includes a housing having a first portion coupled to
a second portion to form a cavity to hold the electronic circuit
board. Each of the first and second portions comprises openings to
direct convection airflow across opposing faces of the electronic
circuit board at the same time. A baffle is coupled to the housing
to substantially visually obscure the openings and to define a gap
between the housing and the baffle to direct the convection airflow
across the opposing faces of the electronic circuit board.
[0006] In yet another example, an enclosure for holding an
electronic circuit board includes a housing having a cavity to hold
the electronic circuit board. The housing having first openings on
a first side of the housing to be oriented in a downwardly facing
direction and second openings on a second side of the housing to be
oriented in an upwardly facing direction. A baffle is coupled to
the housing and spaced from the openings to visually obscure the
openings and to direct airflow into the first openings, adjacent
opposing faces of the electronic circuit board at the same time,
and out the second openings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIGS. 1A and 1B illustrate an electronic module implemented
with an example enclosure described herein.
[0008] FIGS. 2A-2D illustrate different views of the example
enclosure illustrated in FIGS. 1A and 1B.
[0009] FIG. 3 illustrates an exploded view of the example enclosure
shown in FIGS. 1A, 1B and 2A-2D.
[0010] FIGS. 4A and 4B illustrate respective first and second
portions of an example housing of the example enclosure of FIGS.
1A, 1B and 2A-2D.
[0011] FIGS. 5A and 5B illustrate the example housing of FIGS. 1A,
1B and 2A-2D.
[0012] FIG. 6 illustrates an example baffle described herein of the
example enclosure of FIGS. 1A, 1B and 2A-2D.
[0013] FIG. 7 is another illustration showing the example baffle of
FIG. 2A-2D, 3 and 6 coupled to the example housing of FIGS. 2A-2D,
3, 5A and 5B.
[0014] FIG. 8 is a schematic cross-sectional illustration showing
the example baffle of FIG. 2A-2D, 3 and 6 coupled to the example
housing of FIGS. 2A-2D, 3, 5A and 5B.
DETAILED DESCRIPTION
[0015] The example enclosures described herein may hold an
electronic circuit board of an electronic device (e.g., an Ethernet
switch). In particular, the example enclosures described herein
provide improved ventilation to dissipate heat generated by an
electronic device more efficiently. Ventilation is provided by the
example enclosures via a natural convection and passive cooling
configuration that does not require the use of fans, liquid cooling
systems, heat sinks, etc. In this manner, the example enclosures
described herein can be used to properly dissipate heat to improve
the overall reliability and prevent premature damage and failure of
electronic device components (e.g., an electronic circuit board)
mounted within or held by the enclosures.
[0016] In one example, an enclosure described herein includes a
housing having a cavity to hold one or more electronic circuit
boards. The housing includes air vents or openings to direct
convection or passive airflow across opposing faces of the
electronic circuit board(s) at the same time. The enclosure also
includes a baffle coupled to the housing to visually obscure the
openings and to define a gap between the housing and the baffle to
direct or channel the convection airflow across the opposing faces
of the electronic circuit board. Also, the air vents are recessed
relative to outer surfaces of the housing and the baffle at least
partially covers the air vents to help prevent or substantially
reduce the ingress of debris, dirt, air-borne particles, and/or
other contaminates or objects to an interior surface of the
enclosure via the air vents or openings.
[0017] Additionally, the example enclosure is shaped and/or sized
to provide improved passive airflow (e.g., increased airflow
velocity) as air flows between the air vents or openings (e.g., to
provide a chimney effect or a stack effect). For example, the
housing may be configured such that a height of the housing is
larger than a width of the housing. The air vents are located
adjacent the substantially vertical ends of the enclosure (e.g.,
adjacent top and bottom ends of an enclosure) to provide
cross-ventilation across all surfaces of the electronic components
disposed within the housing at the same time. In some examples, the
housing may include a curved surface or profile to facilitate the
channeling of air flow between the air vents.
[0018] In contrast, some known electronic devices may include heat
sinks, fans, and/or liquid cooling systems to dissipate heat from
one or more electronic devices. However, heat sinks, liquid cooling
systems, fans, etc., significantly increase manufacturing costs.
Additionally, such heat dissipation systems typically increase the
overall physical or dimensional envelope or footprint of the
enclosure. Further, in some instances, space may be limited. Thus,
natural convection ventilation may be the only means available to
dissipate heat from an electronic circuit board.
[0019] FIGS. 1A and 1B illustrate an example electronic module 100
described herein. Referring to FIGS. 1A and 1B, the example
electronic module 100 described herein can be used, for example,
with a process control system. For example, the electronic module
100 can be used to implement a network device such as, for example,
an Ethernet switch. The example electronic module 100 may be
communicatively coupled to a second electronic module 101, a
controller, and/or or any other device. In this example, the
electronic module 100 includes an enclosure 102 that removably
couples to a base 104 via a latching mechanism 106. The base 104
includes ports 108a-d such as, for example, a power port, a data
transmission port, an uplink port, and/or any other suitable ports
to receive power lines and/or transmission lines to communicate
data to a desired location and/or device. The base 104 may be
mounted within and/or to, for example, a cabinet, a rack, a field
device, and/or any other suitable mounting surface(s).
[0020] The enclosure 102 provides an improved passive cooling or
natural convection ventilation to provide more efficient
dissipation of heat. In particular, as shown in FIG. 1B, the
enclosure 102 may include air passages or vents 110 along a
peripheral external surface 112 of the enclosure 102 to provide
ventilation between the air passages or vents 110. The enclosure
102 also includes a baffle or spine 114 to at least partially
visually cover the air passages or vents 110. Alternatively, the
enclosure 102 may include an air passage or vent 116 along a body
portion 118 of the enclosure 102. A second baffle 120 may be
coupled to the enclosure 102 to at least partially visually cover
the air passage or vent 116. The second baffle 120 may provide
indicia 122 associated with a characteristic of the electronic
module 100. Although not shown, the air passage or vent 116 may be
projected inwardly (e.g.,) recessed relative to the body portion
118 via a beveled edge 124 to provide a gap between the air passage
or vent 116 and the second baffle 120 to enable air flow through
the air passage or vent 116. The enclosure 102 may be configured to
include the air passages or vents 110, the air passage or vent 116
and/or other air passages disposed along other portions of the
external peripheral edge 112 and/or the body 102.
[0021] FIGS. 2A-2D illustrate another example enclosure 200
described herein that may be used to implement the example
electronic module 100 of FIGS. 1A and 1B. Referring to FIGS. 2A-2D,
the example enclosure 200 includes a housing or body 202 having a
cavity 204 to hold, for example, one or more electronic circuit
boards 206. The housing 202 includes a first or right face 208 and
a second or left face 210 opposite the first face 208. The housing
202 also includes an exterior peripheral surface 212 separating the
first and second faces 208 and 210.
[0022] In this example, a first electronic circuit board 214a is
electrically coupled to (e.g., via a connector) and disposed
adjacent a second electronic circuit board 214b to provide a
smaller dimensional footprint. In other examples, the first
electronic circuit board 214a may not be electrically coupled to
the electronic second circuit board 214b and may function
independently from the second electronic circuit board 214b. In yet
other examples, more than two electronic circuit boards may be
disposed within the housing 202.
[0023] The first and second electronic circuit boards 214a and 214b
are disposed within the housing 202 such that respective first
sides 216a and 216b of the first and second electronic circuit
boards 214a and 214b face the first face 208 of the housing 202 and
respective second sides 218a and 218b of the first and second
circuit boards 214a and 214b face the second face 210 of the
housing 202. The first and second electronic circuit boards 214a
and 214b are disposed within the housing 202 such that a space 220
is defined between the first side 216b of the second electronic
circuit board 214b and the second side 218a of the first electronic
circuit board 214a. Additionally, in this example, the first and
second electronic circuit boards 214a and 214b are substantially
vertically orientated when the electronic module 100 is in use.
[0024] In this example, the enclosure 200 includes racks, brackets
or holders 222 and 224a-b to retain the electronic circuit boards
214a-b within the housing 202. In other examples, the housing 202
may include pins to help retain the electronic circuit board(s) 206
within the housing 202. A light bar 226 may be coupled to the
electronic circuit board(s) 206 to provide indicator or status
lights 228 (e.g., LED lights) to display the operational status of
the electronic module 100 (FIGS. 1A and 1B). For example, one or
more of the status lights 228 may be illuminated to indicate, for
example, a power status, a speed status, a connection status,
and/or any other operational status of the electronic module 100
and/or a network system to which the electronic module 100 is
operatively coupled.
[0025] As shown in FIG. 2B, the enclosure 200 includes a rear
portion 230. The rear portion 230 includes at least one opening 232
and/or other connectors 234 to electrically couple the electronic
circuit boards 214a-b to, for example, the base 104 (FIGS. 1A and
1B) and/or other electronic devices. In yet other examples, the
rear portion 230 may include communication ports, power supply
ports, or any other suitable ports to receive, for example, data
transmission lines or cables so that the base 104 is not
required.
[0026] As noted above, the enclosure 200 provides an improved
passive cooling or natural convection ventilation to provide more
efficient dissipation of heat generated by the electronic circuit
boards 214a-b disposed within the housing 202. In particular, the
housing 202 includes a first air vent 238 along a first portion 240
of the exterior peripheral surface 212 of the housing 202 and a
second air vent 242 along a second portion 244 of the exterior
peripheral surface 212 of the housing 202 to direct convection
airflow across opposing faces (e.g., the first sides 216a-b and
second sides 218a-b) of the electronic circuit boards 214a-b. Thus,
the airflow is directed between the space 220 formed between the
electronic circuit boards 214a-b and along respective interior
portions or surfaces (e.g., of the opposing faces 208 and 210) of
the housing 202 at the same time.
[0027] In this example, the first air vent 238 is to be oriented in
a downwardly facing direction and the second vent 242 is to be
oriented in an upwardly facing direction and opposite the first
vent 238. As shown, the air vents 238 and 242 are adjacent the
first and second faces 208 and 210 of the housing 202.
Additionally, the housing 202 is shaped and/or sized (e.g., has a
greater height relative to its width) to provide improved air flow
(e.g., increased airflow velocity) as the air flows between the
first and second air vents 238 and 242.
[0028] The enclosure 200 also includes a baffle or spine 246
coupled (e.g., mechanically coupled) to the housing 202 to be a
structural member of the enclosure 200. In general, the baffle 246
is coupled to the housing 202 adjacent at least the first portion
240 of the exterior peripheral surface 212 and the second portion
244 of the exterior peripheral surface 212 adjacent the respective
first and second air vents 238 and 242. When coupled to the housing
202, the baffle 246 at least partially visually obscures or covers
the first and second air vents 238 and 242. The baffle 246 is
coupled to the housing 202 such that the baffle 246 directs the
convection airflow across the opposing faces of the electronic
circuit board 206. In other words, the baffle 246 is configured to
direct airflow into the first air vent 238, across the surfaces
216a-b, 218a-b of the electronic circuit boards 214a-b, and out of
the second air vent 242.
[0029] In other examples, a third vent may be provided along a
third portion (e.g., a front portion) of the exterior peripheral
surface 212 of the housing 202. The baffle may included openings
(e.g., downwardly angled openings) to at least partially cover the
third vent. In other examples, at least one of the first or second
faces 208 and 210 may include another air vent to direct airflow
adjacent a respective one of the sides (e.g., 216a-b and 218a-b) of
the electronic circuit boards 214a-b. Additionally, a second baffle
(not shown) may be coupled to the first or second faces 208 and 210
to at least partially cover the other air vent (e.g., similar to
the air vent 116 and the baffle 120 of FIG. 1B).
[0030] FIG. 3 illustrates an exploded view of the example enclosure
200 of FIGS. 2A-2D. The housing 202 includes a first portion or
panel 302 and a second portion or panel 304. In this example, a
latch release mechanism 306 is coupled to the baffle 246 to enable
the enclosure 200 to be coupled to and/or released from, for
example, the base 104. The latch release mechanism 306 includes a
rocking arm 308, a button portion 310, and a retaining clip 312.
The baffle 246 includes a slot or opening 314 to receive the
rocking arm 308, and the rocking arm 308 pivotally couples to the
baffle 246 via a pivot 316. The button portion 310 couples (e.g.,
via snap fit) to the rocking arm 308 and is retained adjacent a
first end 318 of the rocking arm 308 via the retaining pin 312.
When the button portion 310 is depressed toward a surface 320 of
the baffle 246, the first end 318 of the rocking arm 308 rotates
about the pivot 316 to actuate or release, for example, the
latching mechanism 106 of the base 104 (FIGS. 1A and 1B). Also, in
this example, the rear portion 230 (FIG. 2B) of the enclosure 200
(FIG. 2B) is a third portion or panel 322. The third panel 322
couples to the first and second panels 302 and 304 and includes at
least one opening 324 for at least one electrical connector to
electrically couple the electronic circuit boards 214a-b (FIGS.
2C-D) to at least one other electronic device.
[0031] FIGS. 4A and 4B depict the first and second panels 302 and
304 of FIG. 3, respectively. Referring to FIGS. 4A and 4B, in this
example, the first panel 302 includes grill or air vent portions
402a-b about a peripheral edge 404 of the first panel 302. The
second panel 304 includes grill or air vent portions 406a-b about a
peripheral edge 408 of the second panel 304. The grill portions
402a-b and 406a-b project inwardly relative to the respective first
and second sides 410 and 412 via beveled edges 414 and 416.
Additionally, the grill portions 402a-b and 406a-b protrude or
extend from the respective peripheral edges 404 and 408 of the
first and second panels 302 and 304. As shown, each of the grill
portions 402a-b and 406a-b includes apertures 418 or slots 420.
[0032] Although not shown, in other examples, the first panel 302
may be configured to only include the grill portion 402a having at
least one aperture 418 and the second panel 304 may be configured
to only include the grill portion 406b having at least one aperture
418. In yet other examples, only the first panel 302 may include
the grill portions 402a-b having apertures 418. In yet other
examples, the first panel 302 and/or the second panel 304 may
include additional grill portions having apertures 418 and/or slots
420 disposed along other portions of the respective peripheral
edges 404 and 408. For example, additional grill portions may be
provided along a front portion 436 of the edges 404 and 408.
[0033] In this example, the first and second panels 302 and 304
couple together via snap fit to define the housing 202. As shown,
the second panel 304 includes flexible members 424 having edges 426
and tapered portions 428, and the first panel 302 includes
receiving members 430 having apertures 432. When coupled together,
the receiving members 430 receive respective ones of the flexible
members 424 such that the edges 426 of the flexible members 424
engage respective surfaces 434 adjacent the apertures 432 to couple
the first and second panels 302 and 304. In other examples, the
first and second panels 302 and 304 may be coupled together via
mechanical fasteners, chemical fasteners, and/or any other
fastening mechanism(s). Each of the first and second panels 302 and
304 is made of a plastic material via, for example, injection
molding or any other suitable manufacturing process(es). However,
in other examples, the first and second panels 302 and 304 may be
made of any other suitable material.
[0034] FIGS. 5A and 5B illustrate the example first and second
panels 302 and 304 coupled together to define the housing 202. When
coupled together, the first panel 302 defines the first face 208 of
the housing 202 and the second panel 304 defines the second face
210 of the housing 202. Also, when the first and second panels 302
and 304 are coupled together, the grill portions 402a-b and 406a-b
matably engage to define at least a part of the exterior peripheral
surface 212 of the housing 202 separating the first and second
faces 208 and 210. In this example, the exterior peripheral surface
212 includes a first or top face or side 502, a second or bottom
face or side 504, and a third or front face or side 506.
[0035] When coupled together, the apertures 418 and/or the slots
420 (FIGS. 4A and 4B) of the first and second panels 302 and 304
provide openings 508 to define the first and second air vents 238
and 242. More specifically, the housing 202 includes a first
plurality of openings 510a to be oriented in a first or downwardly
facing direction and a second plurality of openings 510b to be
oriented in a second or upwardly facing direction opposite the
first plurality of openings 510a. The first plurality of openings
510a is distributed in first and second parallel rows and the
second plurality of openings 510b is also distributed in third and
fourth parallel rows. However, in other examples, the first
plurality of openings 510a may be oriented in a different direction
and/or configuration than the second plurality of openings
510b.
[0036] As shown, the first plurality of openings 510a is adjacent
the bottom face 504 of the exterior peripheral surface 212 of the
housing 202 and the second plurality of openings 510b is adjacent
the top face 502 of the exterior peripheral surface 212. Further,
the rows of openings making up each of the plurality of openings
510a and 510b are adjacent respective ones of the faces 208 and 210
of the housing 202. The first and second plurality of openings 510a
and 510b provide the first and second air vents 238 and 242 to
enable airflow to pass through the housing 202 to provide a passive
cooling or natural convection ventilation to cool the electronic
circuit board(s) 206 (FIGS. 2C and 2D) disposed within the housing
202. In other examples, the first plurality of openings 510a may
include a greater number of openings 508 than the second plurality
of openings 510b. In yet other examples, the openings 508 of the
first plurality of openings 510a may be sized larger than the
openings 508 of the second plurality of openings 510b, or the
second plurality of openings 510b may be sized larger than the
openings 508 of the first plurality of openings 510a.
[0037] The front face 506 of the exterior peripheral surface 212
also includes openings 512 to receive, for example, the light bar
226 (FIG. 2D). A rear face 514 of the housing 202 includes at least
one opening 516 to receive at least one electrical connector to
electrically couple the electronic circuit board(s) 206 (FIGS. 2C
and 2D) to at least one other electronic device. As described
above, in this example, the rear face 514 of the housing 202
receives the third panel 322 (FIG. 3), which includes the opening
or port 324 to electrically couple the electronic circuit board(s)
206 to at least one other electronic device.
[0038] FIG. 6 illustrates the baffle 246. In this example, the
baffle 246 is depicted as a unitary band or spine structure.
However, in other examples, the baffle 246 may be separate pieces
or structures that couple to the housing 202. In this example, the
baffle 246 includes a top face 602, a front face 604 and a bottom
face 606. As noted above, the top face 602 includes the slot 314 to
receive the latch release mechanism 306 (FIG. 3). The baffle 246
also provides indicia associated with a characteristic of the
electronic circuit board 206. For example, the front face 604
includes a plurality of openings 608 to display the status lights
228 of the light bar 226. Additionally, the front face 604 may
include an opening 610 (e.g., a V-shaped opening) to receive an
indicator light to indicate, for example, that electrical power is
being supplied to the electronic module 100 (FIGS. 1A and 1B). The
baffle 246 may also include a curved surface or profile 612 that
may help channel the airflow through the housing 202 when the
baffle 246 is coupled to the housing 202.
[0039] Additionally, the baffle 246 includes protruding members or
clips 614 (e.g., hook-like members) that engage (e.g., interlock)
with portions of the housing 202 to mechanically couple the baffle
246 to the housing 202 via snap-fit. In other examples, the baffle
246 may be coupled to the housing 202 via mechanical fasteners,
chemical fasteners, and/or any other suitable fastener(s). In this
example, the baffle 246 is made of a metallic material. However, in
other examples, the baffle 246 may be made of a plastic material, a
plastic-metal laminate, and/or any other suitable material.
[0040] FIG. 7 illustrates a side view of the enclosure 200 showing
the baffle 246 coupled to the housing 202. As shown, the housing
202 may include a curved portion or profile 702 between the first
and second plurality of openings 510a and 510b. The curved portion
702 may facilitate or help channel the airflow between the first
and second plurality of openings 510a and 510b. Also, when coupled
to the housing 202, the baffle 246 substantially surrounds or wraps
around a substantial portion of the exterior peripheral surface 212
of the housing 202. More specifically, the baffle 246 substantially
surrounds the top face 502, the front face 506, and the bottom face
504 of the exterior peripheral surface 212 of the housing 202.
Thus, in this example, the baffle 246 does not cover the opening or
rear face 514 of the housing 202 when the baffle 246 is coupled to
the housing 202. Additionally, the baffle 246 covers or at least
partially visually obscures the plurality of openings 510a and 510b
to provide a guard or shield, but does not inhibit airflow between
the baffle 246 and the plurality of openings 510a and 510b.
[0041] FIG. 8 is a schematic cross-sectional illustration of the
example baffle 246 coupled to the housing 202. As shown, the baffle
246 is mechanically coupled or captured between the first and
second panels 302 and 304 when the first and second panels 302 and
304 are coupled together. When coupled to the housing 202, the
baffle 246 is spaced away from the first plurality of openings 510a
of the first air vent 238 and the second plurality of openings 510b
of the second air vent 242 to define a gap 802 between the baffle
246 and the housing 202. The gap 802 enables airflow between the
baffle 246 and the plurality of openings 510a and 510b as indicated
by respective arrows 804 and 806.
[0042] The gap 802 between the baffle 246 and the openings 508
enables the baffle 246 to direct convection airflow into the first
air vent 238 across all internal surfaces of the housing 202. More
specifically, the baffle 246 directs airflow through the first air
vent 238 adjacent the sides 216a-b and 218a-b (e.g., opposing
faces) of the electronic circuit board(s) 206 as indicated by
arrows 808 at the same time and out of the second air vent 242.
Specifically, the first and second air vents 238 and 242 are spaced
at opposite ends of the housing 202 to provide cross ventilation
across the electronic circuit boards 214a-b.
[0043] As noted above, the gap 802 is dimensioned to enable the
baffle 246 to direct or facilitate the direction of airflow across
the first and second sides 216a-b and 218a-b of the electronic
circuit boards 214a-b. Additionally, a first edge 810 of the baffle
extends beyond the grill portions 402a-b of the first panel 302
adjacent the first face 208 of the housing 202 and a second edge
812 of the baffle 246 extends beyond the grill portions 406a-b of
the second panel 304 adjacent the second face 210 of the housing
202. By recessing the grill portions 402a-b and 406a-b, the edges
810 and 812 extend beyond the recessed portions 402a-b and 406a-b
so that the baffle 246 at least partially covers or shields and
visually obscures the openings 508 of the housing 202 to prevent
the ingress of debris, dirt, air-borne particles, and/or other
contaminates or objects within the cavity 204 (e.g., the electronic
circuit board 206) of the housing 202 via the openings 508. Also,
when coupled to the housing 202, the baffle 246 helps channel the
air flow through the housing 202 between the first air vent 238 and
the second air vent 242.
[0044] In operation, electrical power is applied to the electronic
circuit boards 214a-b disposed within the housing 202. The status
lights 228 indicate whether electrical power is provided to the
electronic circuit boards 214a-b. Also, the status lights 228 of
the light bar 226 are visually displayed via the openings 608 of
the baffle 246 when the baffle 246 is coupled to the housing 202.
During operation, the electronic circuit boards 214a-b generate
heat. The heat generated by the electronic circuit boards 214a-b
increases the temperature of the air adjacent the electronic
circuit boards 214a-b within the housing 202. In turn, the density
of the warmer air is less when the temperature of the air increases
relative to the surrounding air mass, causing the air to rise
within the housing 202. As the air temperature within the housing
202 increases, air flows between the openings 508 of the first air
vent 238 and the openings 508 of the second air vent 242.
[0045] More specifically, the baffle 246 directs the airflow
through the first air vent 238 adjacent opposing faces of the
electronic circuit boards 214a-b at the same time as indicated by
arrows 808. In this manner, airflow is provided to substantially
all sides (e.g., the first sides 216a-b and the second sides
218a-b) of the electronic circuit boards 214a-b to substantially
prevent a hot spot condition that may otherwise occur if the
airflow is not distributed (e.g., evenly) across all surfaces of
the electronic circuit boards 214a-b. Also, the baffle 246 channels
the air flow such that the warmer air exiting the second air vent
242 draws or pulls the cooler air from the first air vent 238
providing a chimney or stack effect. For example, a height 814 of
the housing 202 may be sized significantly larger than a width 816
of the housing 202. In other words, the housing is configured
(e.g., shaped and sized) and/or the baffle 246 is positioned to
duct the warmer air rising toward the second air vent 242 more
rapidly and efficiently (e.g., a passive cooling
configuration).
[0046] Although not shown, in other examples, forced convection
airflow may be provided toward or adjacent the first air vent 238
and/or the second air vent 242. Such forced convection may be
provided via, for example, a cooling fan. In yet other examples,
heat sinks may be disposed within the housing 202 to further
improve dissipation of the heat from within the housing 202. In
other words, the airflow provided through the housing 202 between
the first and second air vents 238 and 242 may flow across heat
sinks disposed within the housing 202 and/or the electronic circuit
board 206 to further dissipate heat from within the housing
202.
[0047] Although certain example apparatus and articles of
manufacture have been described herein, the scope of coverage of
this patent is not limited thereto. On the contrary, this patent
covers all apparatus and articles of manufacture fairly falling
within the scope of the appended claims either literally or under
the doctrine of equivalents.
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