U.S. patent application number 12/889039 was filed with the patent office on 2011-03-10 for front-to-back cooling system for modular systems with orthogonal midplane configuration.
This patent application is currently assigned to JUNIPER NETWORKS, INC.. Invention is credited to Gunes Aybay, Jean-Marc Frailong, David J. Lima, Sindhu Pradeep.
Application Number | 20110056660 12/889039 |
Document ID | / |
Family ID | 41208645 |
Filed Date | 2011-03-10 |
United States Patent
Application |
20110056660 |
Kind Code |
A1 |
Aybay; Gunes ; et
al. |
March 10, 2011 |
FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL
MIDPLANE CONFIGURATION
Abstract
A front-to-back cooling system allows cooling of an apparatus
containing two orthogonal sets of modules. Each set of modules is
independently cooled. A vertical set of modules is cooled with
vertical air flow across the modules that enters from a front of
the apparatus and exhausts from a back of the apparatus. A
horizontal set of modules is cooled with horizontal front-to-back
air flow. When the horizontal set of modules is at the front of the
apparatus, a plenum extending exterior to the vertical set of
modules allows exhausting horizontally flowing air to the rear of
the apparatus. When the horizontal set of modules is at the rear of
the apparatus, a plenum extending exterior to the vertical set of
modules allows moving air from the front of the apparatus to a
chamber holding the horizontal modules.
Inventors: |
Aybay; Gunes; (Los Altos,
CA) ; Pradeep; Sindhu; (Los Altos Hills, CA) ;
Frailong; Jean-Marc; (Los Altos, CA) ; Lima; David
J.; (Los Altos, CA) |
Assignee: |
JUNIPER NETWORKS, INC.
Sunnyvale
CA
|
Family ID: |
41208645 |
Appl. No.: |
12/889039 |
Filed: |
September 23, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12167604 |
Jul 3, 2008 |
7826222 |
|
|
12889039 |
|
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Current U.S.
Class: |
165/104.33 |
Current CPC
Class: |
H05K 7/20563
20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Claims
1. A method of cooling an apparatus, comprising: forming a plenum
on a side of a first chamber of the apparatus, open to a front of
the apparatus; partitioning the apparatus with an air-permeable
barrier, forming a second chamber separated from the plenum and the
first chamber by the air-permeable barrier; pulling air from the
front of the apparatus via the plenum through the air-permeable
barrier into the second chamber, wherein the air pulled from the
front of the apparatus via the plenum does not contact the first
chamber of the apparatus; and exhausting air from the second
chamber to a rear of the apparatus.
2. The method of claim 1, wherein the first chamber contains a
first plurality of modules, and wherein the second chamber contains
a second plurality of modules, oriented orthogonally to the first
plurality of modules.
3. The method of claim 1, further comprising: cooling the first
chamber independently of the second chamber.
4. The method of claim 1, further comprising: cooling a power
supply for the apparatus independently of the second chamber.
5. A method of cooling an apparatus, comprising: cooling a first
plurality of modules oriented in a first direction, comprising:
pushing air from an edge of each of the first plurality of modules
in the first direction; and pulling air from an opposite edge of
each of the first plurality of modules in the first direction; and
cooling a second plurality of modules oriented in a second
direction, orthogonal to the first direction, comprising: moving
air in the second direction across the second plurality of modules
and through a plenum extending exterior to a first chamber
containing the first plurality of modules, wherein the air moving
across the second plurality of modules does not contact a surface
of the first plurality of modules; and exhausting air from the
apparatus.
6. The method of claim 5, wherein the first direction is vertical
relative to a floor on which the apparatus is positioned.
7. The method of claim 5, wherein the second direction is
horizontal relative to a floor on which the apparatus is
positioned.
8. The method of claim 5, cooling the first plurality of modules
further comprising: exhausting air in the second direction exterior
to a second chamber containing the second plurality of modules.
9. The method of claim 5, wherein the second plurality of modules
is cooled independently of the first plurality of modules.
10. The method of claim 5, wherein cooling the first plurality of
modules pulls air from a front of the apparatus and exhausts air at
a back of the apparatus, and wherein cooling the second plurality
of modules pulls air from the front of the apparatus and exhausts
air at the back of the apparatus.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. Ser. No.
12/167,604, filed on Jul. 3, 2008, entitled "FRONT-TO-BACK COOLING
SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION",
by Gunes Aybay, et al., currently pending [Attorney Docket No.
684735-1018].
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0002] Not applicable.
REFERENCE TO A COMPACT DISK APPENDIX
[0003] Not applicable.
TECHNICAL FIELD
[0004] The present invention relates to the field of cooling
systems, and in particular to cooling of a modular system with
orthogonal modules.
BACKGROUND ART
[0005] Systems that require very high bandwidth any-to-any
connectivity among a set of modules typically use an orthogonal
mid-plane configuration. In this configuration, a set of cards are
plugged into the front side of the mid-plane in vertical
configuration and another set of cards are plugged into the rear
side of the mid-plane in horizontal configuration. This layout
enables each front card to be directly connected to each rear card,
and makes it possible to eliminate the use of PCB signal traces on
the mid-plane to carry high speed signals.
[0006] However, the orthogonal configuration also creates a cooling
challenge, especially in applications where front-to-back cooling
is required. Vertical cards can be cooled using conventional
cooling mechanisms with front air intake and rear air exhaust, but
cooling the horizontal cards while maintaining overall
front-to-back air flow is challenging.
[0007] If front-to-back cooling is not required, the horizontal
card cage can be cooled using side-to-side air flow. However, many
rack mount environments require front-to-back air cooling. One
solution has been to divert air taken from a front intake to the
back and run it up in a column next to the horizontal cards. Such a
mechanism typically uses a set of fans or blowers to create the air
pressure across the horizontal cards. However, the amount of air
flow that is provided in such a system is typically limited due the
number of turns in the air path. Also, the placement of one or two
fan blades along the sides of the horizontal cards can severely
limit the PCB area and panel surface that is available.
SUMMARY OF INVENTION
[0008] In one embodiment, a method of cooling an apparatus
comprises: forming a plenum on a side of a first chamber of the
apparatus, open to a front of the apparatus, partitioning the
apparatus with an air-permeable barrier, forming a second chamber
separated from the plenum and the first chamber by the
air-permeable barrier, pulling air from the front of the apparatus
via the plenum through the air-permeable barrier into the second
chamber, and exhausting air from the second chamber to a rear of
the apparatus.
[0009] In another embodiment, a method of cooling an apparatus
comprises: cooling a first plurality of modules oriented in a first
direction, comprising: pushing air from an edge of each of the
first plurality of modules in the first direction, and pulling air
from an opposite edge of each of the first plurality of modules in
the first direction, and cooling a second plurality of modules
oriented in a second direction, orthogonal to the first direction,
comprising: moving air in the second direction across the second
plurality of modules and through a plenum extending exterior to a
first chamber containing the first plurality of modules, and
exhausting air from the apparatus.
[0010] In yet another embodiment, a method of cooling an apparatus
comprises: forming a plenum on a side of a first chamber containing
a first plurality of modules, moving air from a front of the
apparatus through the plenum into a second chamber containing a
second plurality of modules, the second plurality of modules
mounted orthogonal to the first plurality of modules, and
exhausting air to a rear of the apparatus from the second
chamber.
[0011] In yet another embodiment, a cooling system for an apparatus
comprises: a first chamber, a plenum formed exterior to the first
chamber and fluidly isolated from the first chamber, a second
chamber in fluid communication with the plenum, a cooling system
for the first chamber, comprising: a first fan, configured to push
air across the first chamber, and a second fan, configured to pull
air from the first chamber, and a cooling system for the second
chamber, comprising: a third fan, configured to move air through
the plenum into the second chamber.
[0012] In yet another embodiment, a method of cooling an apparatus
comprises: forming a first plenum on a side of a first chamber
containing a first plurality of modules, moving air from a front of
the apparatus across a second plurality of modules, the second
plurality of modules mounted orthogonal to the first plurality of
modules in a second chamber, and exhausting air from the second
plurality of modules through the first plenum to a rear of the
apparatus.
BRIEF DESCRIPTION OF DRAWINGS
[0013] The accompanying drawings, which are incorporated in and
constitute a part of this specification, illustrate an
implementation of apparatus and methods consistent with the present
invention and, together with the detailed description, serve to
explain advantages and principles consistent with the invention. In
the drawings,
[0014] FIG. 1 is a top perspective view illustrating an apparatus
with orthogonal modules according to one embodiment;
[0015] FIG. 2 is a rear perspective view of the apparatus of FIG.
1;
[0016] FIG. 3 is a front perspective view of the apparatus of FIG.
1;
[0017] FIG. 4 is a side cutaway perspective view of the apparatus
of FIG. 1;
[0018] FIG. 5 is a perspective view illustrating another embodiment
of an apparatus with orthogonal modules;
[0019] FIGS. 6-7 are additional perspective vies of the apparatus
of FIG. 5;
[0020] FIG. 8 is a front perspective view illustrating yet another
embodiment of an apparatus with orthogonal modules;
[0021] FIG. 9 is a rear perspective view of the apparatus of FIG.
8;
[0022] FIG. 10 is a top perspective view of the apparatus of FIG.
8; and
[0023] FIG. 11 is a side cutaway perspective of the apparatus of
FIG. 8.
DESCRIPTION OF EMBODIMENTS
[0024] FIG. 1 is a top perspective view illustrating an apparatus
100 with orthogonal modules according to one embodiment. The
apparatus 100 can be, for example, an enterprise class router, and
the modules are typically circuit boards. But the disclosed
technique can be used in any apparatus with orthogonal modules. In
this embodiment, the apparatus 100 contains a plurality of modules
110 oriented vertically in a front section of the apparatus 100 and
a plurality of modules 130 oriented in a horizontal direction in a
rear section of the apparatus 100. Modules 110 and 130 are
cross-connected through a mid-plane 120. In this embodiment, the
vertical modules 110 are enclosed by an enclosure 170 on either
side forming a plenum 150 on either side of the vertical modules
110 extending from the front of the apparatus 100 past the
mid-plane 120. An air-permeable barrier 160 is placed between each
of the modules 130, forming a rear chamber of the apparatus 100. In
some embodiments, barrier 160 is a perforated rippled material
where the perforation pattern can be figured to create a pressure
difference between the front section on one side of the barrier 160
and the rear section on the other side of the barrier 160. This
pressure difference can achieve a more uniform air flow across more
of the surface area of modules 130. As shown in FIG. 1, fans or
blowers 140 are placed at a rear portion of the modules 130. The
fans or blowers 140 pull air from the front of the apparatus 100
through the plenum 150 and through the barrier 160 across the
modules 130 providing cooling to the modules 130. Heated air is
then exhausted through openings on the rear of the apparatus 100 as
described below. As shown in FIG. 1, in some embodiments, two
blowers 140 are positioned centrally at the rear of each module
130. In other embodiments, a single fan or blower 140 could be
used. Alternately, the fan or fans 140 could be positioned in other
locations on the modules 130 as desirable for uniform air flow
across the surface of the modules 130 or to provide higher air flow
across portions of the surface area of the modules 130 that
generate proportionally more heat than other portions of the
modules 130.
[0025] Turning to FIG. 2, a front view of the apparatus 100 shows
the plenums 150 on either side of the enclosure 170 surrounding the
vertically oriented modules 110. Additionally, FIG. 2 shows an
independent cooling system for the modules 110. A plenum 240 is
formed beneath the vertically oriented modules 110 and a lower fan
tray 220 contains a plurality of fans that push air vertically
across the surfaces of the modules 110 to provide cooling to the
modules 110. An upper fan tray 230 contains a plurality of fans
that pull heated air from the modules 110 and exhaust the heated
air toward the rear of the apparatus 100 as described below. A
plurality of power supplies 210 are shown in FIG. 2 at the bottom
of the apparatus 100. In some embodiments, each of these power
supply units provides its own front-to-back air cooling path from
front openings or inlets in the power supply units 210.
[0026] Turning to FIG. 3, a rear view in perspective of the
apparatus 100 illustrates the outlets where heated air is exhausted
to the rear of the apparatus 100. A collection of power supply
exhaust outlets 310 correspond to the power supply inlets 210 of
FIG. 2. A pair of exhaust outlets 330 is also shown for each of the
modules 130, corresponding to the two fans or blowers 140
illustrated in FIG. 1. Finally, outlets 320 provide exhaust outlets
for heated air that have cooled the vertical modules 110 and is
exhausted from the upper fan tray 230.
[0027] FIG. 4 illustrates the air flow path across the vertical
modules 110. As shown in FIG. 4, an upper plenum 410 is formed
above the upper fan tray 230 and the horizontally oriented modules
130 to provide an air path to the exhaust outlets 320 illustrated
in FIG. 3.
[0028] In another embodiment, instead of pulling air from the front
of the apparatus 100 across the horizontal modules 130, as
illustrated in FIG. 1, apparatus 500 pushes air across horizontal
modules. One or more blowers or fans 510 are positioned toward the
front of the apparatus 500 in a plenum 520. The fans 510 push air
through the plenum 520 formed along the side of vertical modules,
not shown in FIG. 5 for clarity of the drawing. Putting the fans
510 in the plenum 520 can allow for better filtering and cleaner
air throughout the air path across the rear horizontally mounted
modules than the negative pressure system illustrated in FIGS. 1-4.
In some embodiments, filters can be placed at the inlets of the
plenum 520 in front of the fans 510, but are not shown in FIG. 5
for clarity of the drawing. A barrier 530 is placed at the outlets
of the fans 510. As best shown in FIG. 7, openings 710 are formed
in the barrier 530 to better control air flow through the plenum
520. Air pushed through the plenum 520 is then pushed across the
surfaces of the horizontal outlets 540 and exhausted through the
rear of the apparatus 500. As shown in FIGS. 5 and 6, the apparatus
500 has a cooling system for the vertically oriented modules that
is same as illustrated FIGS. 1-4. The only difference between the
embodiments of FIGS. 1-4 and FIGS. 5-7 is that instead of pulling
the air through the plenum and across the cards as in FIGS. 1-4,
the apparatus 500 pushes the air from the front through the plenum
520 and across the cards 540. The numbered configuration and
placement of fans shown in FIGS. 5-7 are exemplary and illustrative
only and other numbers configuration and placement of fans can be
used.
[0029] In apparatus 100, as illustrated in FIGS. 1-4 (and similarly
in apparatus 500, illustrated in FIGS. 5-7), the vertically
oriented modules 110 are in a front section of the apparatus 100
and horizontally mounted modules 130 are positioned in a rear
section of the apparatus 100. In other embodiments, vertically
oriented modules can be placed in the rear, and horizontally
oriented modules can be placed in the front of the apparatus. FIGS.
8-11 illustrate such an apparatus according to one embodiment.
[0030] Turning now to FIG. 8, a front perspective view illustrates
an apparatus 800 that contains front mounted horizontal modules
810. As with apparatus 100, power supplies 830 are cooled from air
flow from the front. Inlets 820 provide air to cool the rear
mounted vertical modules of the apparatus 800. Openings 840 in each
of the horizontal modules 810 provide an air path for cooling the
horizontally mounted modules 810.
[0031] FIG. 9 is a rear perspective view of the apparatus 800 of
FIG. 8. Vertically mounted modules 930 are cooled by an upper fan
tray 920 pulling air from inlets 820 of FIG. 8, then pushing that
air downward across the surfaces of the vertically mounted modules
930. A lower fan tray 910 contains exhaust fans that pull the
heated air from the vertically oriented modules 930, exhausting the
heated air through plenums 960 formed below the lower fan tray to
the rear of apparatus 800. An end closure 940 holding the
vertically oriented modules 930 forms a plenum 950 on either side
of the vertically oriented modules 930 to exhaust heated air from
the horizontally oriented modules 810.
[0032] Turning to FIG. 10, a top view shows the cooling path for
the horizontal modules 810. Cool air is pulled in through the
openings 840 shown in FIG. 8, and pulled across the surface of the
modules 810 to a radial blower 1020 mounted on either side of each
of the modules 810. The radial blowers 1020 then exhaust the heated
air through the plenums 950 to the rear of the apparatus 800. As in
the apparatus 100 of FIG. 1, a mid-plane 1010 connects the
horizontally mounted modules 810 and the vertically mounted modules
930. Although described above as radial blowers, any desirable fan
or blower can be used. The placement, configuration and number of
blowers are exemplary and illustrative only, and other numbers
configurations and placements can be used.
[0033] FIG. 11, a side view in perspective, shows the cooling path
for the vertical rear modules 930 described above and the cooling
path 1110 for power supplies at the bottom of the apparatus 800. A
plenum 1130 provides air passage from the front of the apparatus
800 through inlets 820 to the upper fan tray 920 which then pushes
air vertically downward across the surfaces of the modules 930,
where the lower fan tray 910 exhausts the air through plenum 960 to
the rear of the apparatus 800. A wall 1120 provides a portion of an
enclosure above the horizontally mounted modules 810 to form the
plenum 1130.
[0034] While certain exemplary embodiments have been described in
details and shown in the accompanying drawings, it is to be
understood that such embodiments are merely illustrative of and not
devised without departing from the basic scope thereof, which is
determined by the claims that follow. By way of example and not
limitation, the specific electrical components utilized may be
replaced by known equivalents or other arrangements of components
which function similarly and provide substantially the same
result.
* * * * *