U.S. patent application number 12/811037 was filed with the patent office on 2011-03-03 for hydrophobic cutting tool and method for manufacturing the same.
This patent application is currently assigned to SHINHAN DIAMOND IND. CO., LTD.. Invention is credited to Kee Jung Cheong, Jeong Bin Jeon, Shin Kyung Kim, Tae Jin Kim, Byung Ju Min, Mun Seak Park, Brian Song.
Application Number | 20110053479 12/811037 |
Document ID | / |
Family ID | 40824470 |
Filed Date | 2011-03-03 |
United States Patent
Application |
20110053479 |
Kind Code |
A1 |
Kim; Shin Kyung ; et
al. |
March 3, 2011 |
HYDROPHOBIC CUTTING TOOL AND METHOD FOR MANUFACTURING THE SAME
Abstract
A method of manufacturing a cutting tool is disclosed. An object
of the manufacturing method of a cutting tool is to reduce
contamination of an abrasive layer surface, particularly,
agglomeration contamination due to slurry by improving
hydrophobicity maintaining performance of an abrasive layer. A
cutting tool according to the method of manufacturing comprises an
abrasive layer on a base member, the abrasive layer having
abrasives bonded to a surface thereof; and a coating on the surface
of the abrasive layer that is a hydrophobic material film.
Inventors: |
Kim; Shin Kyung; (Seoul,
KR) ; Cheong; Kee Jung; (Seoul, KR) ; Song;
Brian; (Seoul, KR) ; Kim; Tae Jin; (Incheon,
KR) ; Park; Mun Seak; (Incheon, KR) ; Min;
Byung Ju; (Incheon, KR) ; Jeon; Jeong Bin;
(Chungbuk, KR) |
Assignee: |
SHINHAN DIAMOND IND. CO.,
LTD.
Incheon
KR
|
Family ID: |
40824470 |
Appl. No.: |
12/811037 |
Filed: |
May 19, 2008 |
PCT Filed: |
May 19, 2008 |
PCT NO: |
PCT/KR2008/002794 |
371 Date: |
October 26, 2010 |
Current U.S.
Class: |
451/548 ;
51/295 |
Current CPC
Class: |
B24D 7/06 20130101 |
Class at
Publication: |
451/548 ;
51/295 |
International
Class: |
B24D 7/06 20060101
B24D007/06; B24D 18/00 20060101 B24D018/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 28, 2007 |
KR |
10-2007-0140889 |
Claims
1. A method of manufacturing a cutting tool, comprising the steps
of: forming an abrasive layer on a base member, the abrasive layer
having a plurality of abrasives bonded to a top surface of the
abrasive layer; and coating the top surface of the abrasive layer
and the plurality of abrasives with a hydrophobic material film,
the hydrophobic material film having a thickness smaller than a
height of the plurality of abrasives.
2. The method as claimed in claim 1, wherein in the coating step
with the hydrophobic material film, the hydrophobic material film
is a self assembled molecular monolayer in which a tail group of
molecules is hydrophobic.
3. The method as claimed in claim 1, wherein the coating step with
the hydrophobic material film is performed using a deposition
process.
4. The method as claimed in claim 1, wherein the coating step with
the hydrophobic material film is performed by forming a self
assembled molecular monolayer on the surface of the abrasive layer
using a deposition process, the self assembled molecular monolayer
having a tail group of molecules that is hydrophobic.
5. The method as claimed in claim 4, wherein a precursor used in
the deposition process has molecules of which a tail group is one
of a CF (fluorocarbon) group and a CHF (fluorohydrocarbon)
group.
6. The method as claimed in claim 1, wherein the step of forming
the abrasive layer is performed using an Ni electrodeposition
process.
7. A cutting tool, comprising: a base member; an abrasive layer
formed on the base member, the abrasive layer having a plurality of
abrasives bonded to a top surface of the abrasive layer; and a
hydrophobic material film formed on the top surface of the abrasive
layer and the plurality of abrasives, the hydrophobic material film
having a thickness smaller than a height of the plurality of
abrasives.
8. The cutting tool as claimed in claim 7, wherein the hydrophobic
material film is a self assembled molecular monolayer in which a
tail group of molecules is hydrophobic.
9. The cutting tool as claimed in claim 8, wherein the self
assembled molecular monolayer is formed by using trichlorosilane as
a precursor.
10. The cutting tool as claimed in claim 7, wherein the abrasive
layer is an Ni electrodeposition layer to which the plurality of
abrasives are bonded.
11. The cutting tool as claimed in claim 7, wherein the cutting
tool is a CMP conditioner.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The presently disclosed subject matter relates to a cutting
tool, and more specifically, to a hydrophobic cutting tool having
high hydrophobicity maintaining performance of a surface thereof
and a method for manufacturing the same. In particular, the
disclosed subject matter relates to a CMP (Chemical Mechanical
Polishing) conditioner, i.e., cutting tool used in a CMP pad
conditioning process and suitable for reducing accumulation of
slurry thereon.
[0003] 2. Description of Related Art
[0004] A cutting tool is a tool that cuts a work piece using
abrasives, i.e., cutting particles. Cutting may include grinding
such as a cylinder grinding, an inner surface grinding, or a plane
grinding to grind a part of a work piece. For instance, grinding
may include all kinds of machining works capable of being performed
using abrasives such as diamond particles.
[0005] In general, a cutting tool comprises a substrate and an
abrasive layer formed on a surface of the substrate, and has a
structure wherein a plurality of abrasives is bonded to the surface
of the abrasive layer. The bonding of the abrasives is performed by
various methods including electrodeposition, sintering, and
brazing. The abrasives include diamond, CBN (cubic boron nitride),
alumina, and silicon carbide particles.
[0006] In a machining work using a cutting tool, a phenomenon that
a surface of an abrasive holding layer is contaminated occurs, and
the surface is more and more contaminated as the working time
increases. Generally, that phenomenon occurs particularly in
machining with cutting solutions including abrasive particles.
During conditioning the CMP pad with CMP conditioner, slurry
particles and residues are accumulated on the surface of the CMP
conditioner, thus causing a serious contamination problem on that
surface.
[0007] As well known, a CMP pad is used in global planarization of
a semiconductor wafer, and a CMP conditioner is a type of cutting
tool for improving performance and life span of the CMP pad by
removing clogging of micro pores formed in a surface of the CMP
pad.
[0008] FIG. 1 shows optical microscope images illustrating changes
in the magnitude of surface contamination as a function of CMP
conditioning time at several test conditions. The images in FIG. 1
show the changes in the surface contamination before CMP
conditioning (i.e., the reference point), and 30, 60, 90, 120, and
150 minutes after the CMP conditioning, respectively. Referring to
FIG. 1, it can be confirmed that a considerable amount of slurry
contaminants appears 30 minutes after the CMP conditioning, and
such contaminants increase while they are continuously agglomerated
as the conditioning time increases.
[0009] The surface contamination of an abrasive layer of a CMP
conditioner due to slurry deteriorates the efficiency of the CMP
conditioning process. The deteriorated efficiency of the CMP
conditioning process causes a wafer to be scratched during
polishing of the wafer using a CMP pad, and lowers the production
efficiency by increasing the number of particles on the wafer after
the polishing.
BRIEF SUMMARY
[0010] One reason for contaminating a CMP conditioner is that a
surface of an abrasive layer changes to hydrophilic as CMP pad
conditioning time increases. More specifically, the CMP conditioner
is easily contaminated as CMP pad conditioning time increases since
the surface of the abrasive layer of the CMP conditioner changes to
hydrophilic. A hydrophilic surface on the abrasive layer of the CMP
conditioner cannot reject water containing slurry as the CMP pad
conditioning process proceeds. Such a problem is not limited to the
CMP conditioner alone but may occur in cutting tools of wide
meaning comprising abrasives which are used in cutting including
cutting, grinding or polishing.
[0011] The disclosed subject matter solves the aforementioned
problems by providing a cutting tool, wherein deterioration of
cutting performance due to agglomeration of an abrasive layer
surface and contamination of the abrasive layer surface is greatly
suppressed by improving hydrophobicity maintaining performance of
an abrasive layer, and a manufacturing method of the cutting
tool.
[0012] According to one embodiment of the disclosed subject matter,
there is provided a method of manufacturing a cutting tool, which
comprises the steps of forming an abrasive layer on a substrate,
the abrasive layer having abrasives bonded to a surface thereof;
and coating the surface of the abrasive layer with a hydrophobic
material film.
[0013] In a preferred embodiment, the hydrophobic material film may
be a self assembled molecular monolayer in which a tail group of
molecules is hydrophobic. The coating step with the hydrophobic
material film is preferably performed using a deposition process.
At this time, a precursor used in the deposition process has
molecules of which a tail group may be hydrophobic, preferably, a
CF (fluorocarbon) group or CHF (fluorohydrocarbon) group. As the
precursor, FOTS (fluorooctyltrichlorosilane), DDMS
(dichlorodimethylsilane), FDA (perfluorodecanoic acid), FDTS
(perfluorodecyltrichlorosilane), and OTS (octadecyltrichlorosilane)
may be used. In addition, the deposition process using the
precursor may include a V-SAM (vapor-SAM) process, an L-SAM
(liquid-SAM) process, and a bulk polymerization process using
plasma.
[0014] The step of forming an abrasive layer may be performed using
an Ni electrodeposition process or a brazing process. The cutting
tool is preferably a CMP conditioner. However, the cutting tool is
not limited thereto, but may be a cutting tool having a hydrophobic
material film formed on a surface of the abrasive layer.
[0015] According to another embodiment, there is provided a cutting
tool, which comprises a substrate; an abrasive layer formed on the
substrate, the abrasive layer having abrasives bonded to a surface
thereof; and a hydrophobic material film formed on the surface of
the abrasive layer.
[0016] Preferably, the hydrophobic material film is a self
assembled molecular monolayer in which a tail group of molecules is
hydrophobic. More preferably, the self assembled molecular
monolayer is formed by using a CF (fluorocarbon) group or CHF
(fluorohydrocarbon) group as a precursor.
[0017] According to the disclosed subject matter, accumulation of
contaminants generated on an abrasive layer and performance
deterioration of a cutting tool due to the accumulation of the
contaminants are suppressed by a hydrophobic material film formed
on a surface of the abrasive layer of the cutting tool.
Particularly, contaminants on a CMP conditioner, that is a cutting
tool used together with slurry in conditioning a CMP pad, may be
effectively suppressed. Thus, it is possible to reduce defects such
as scratches or particles generated on a processing surface of the
wafer in a wafer polishing process using a CMP pad that is
subjected to the CMP conditioning process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 shows optical microscope images illustrating a
process in which a contamination level of a conventional cutting
tool varies according to cutting time of the cutting tool.
[0019] FIG. 2 shows a CMP conditioner illustrated as an embodiment
of a cutting tool according to the disclosed subject matter.
[0020] FIGS. 3 and 4 show optical microscope images illustrating a
surface of a CMP conditioner after CMP pad conditioning process for
30 minutes and 60 minutes respectively, wherein the surface is
coated with a hydrophobic material film.
[0021] FIG. 5 shows optical microscope images illustrating a
surface of a CMP conditioner not coated with hydrophobic material
film after CMP pad conditioning process for 30 minutes.
[0022] FIG. 6 is an optical microscope image showing a
hydrophobicity (or hydrophilicity) test result of a CMP conditioner
coated with a hydrophobic material film before a cutting
process.
[0023] FIG. 7 is an optical microscope image showing a
hydrophobicity (or hydrophilicity) test result of a CMP conditioner
not coated with a hydrophobic material film before a cutting
process.
[0024] FIG. 8 is an optical microscope image showing a
hydrophobicity test result of a CMP conditioner coated with a
hydrophobic material film after a cutting process.
[0025] FIG. 9 is an optical microscope image showing a
hydrophobicity test result of a CMP conditioner not coated with a
hydrophobic material film after a cutting process.
[0026] FIGS. 10 to 13 show optical microscope images illustrating a
surface of CMP conditioner coated with a hydrophobic material film
after CMP pad conditioning process for 20 hours under the same
condition as in an actual working environment.
[0027] FIGS. 14 to 17 show optical microscope illustrating a
surface of CMP conditioner not coated with a hydrophobic material
film after CMP pad conditioning process for 20 hours under the same
condition as in an actual working environment.
DETAILED DESCRIPTION
[0028] Hereinafter, a CMP conditioner, as an example of a cutting
tool according to the present invention, will be described. The
following embodiments are provided only for illustrative purposes
so that those skilled in the art can fully understand the spirit of
the disclosed subject matter. Therefore, the disclosed subject
matter is not limited to the following embodiments but may be
implemented in other forms. In the drawings, the widths, lengths,
thicknesses and the like of elements may be exaggerated for
convenience of illustration. Like reference numerals indicate like
elements throughout the specification and drawings.
[0029] FIG. 2 shows a CMP conditioner illustrated as an embodiment
of a cutting tool according to the disclosed subject matter.
Referring to FIG. 2, a CMP conditioner 1 comprises a substrate 10
and an abrasive layer 20. The substrate 10 is made of a metallic
material and has a generally disc-shaped structure. The abrasive
layer 20 is formed on the substrate 10 and has a plurality of
abrasives 21. In this embodiment, the abrasive layer 20 is an Ni
electrodeposition layer formed by being plated with Ni to hold the
abrasives 21, and the abrasives 21 protrude from a surface of the
abrasive layer 20.
[0030] As illustrated from an enlarged view of FIG. 2, a
hydrophobic material layer 30 is formed on the surface of the
abrasive layer 20. The hydrophobic material layer 30 is a film
having a hydrophobic surface of which a surface contact angle to
water is large, and the hydrophobic material layer 30 serves to
prevent the surface of the abrasive layer 20 from tending to be
hydrophilic according to an increase in use time of the CMP
conditioner 1.
[0031] The hydrophobic material layer 30 is a coating film, which
may be formed by a deposition process or other processes, and
covers both the electrodeposition material and abrasives 21. At
this time, since the hydrophobic material layer 30 is a thin film
with a thickness smaller than a protruding height of the abrasives
21, the performance of the CMP conditioner 1 is not deteriorated
although the hydrophobic material layer 30 is formed on the
abrasives 21.
[0032] Although an extremely small portion of the hydrophobic
material layer 30 formed on the abrasives 21 may be eliminated if
using the CMP conditioner 1 in conditioning of a CMP pad, another
large portion of the surface of the abrasive layer 20, such as a
surface of an electrodeposition material holding the abrasives 21,
can be always maintained at its position unless the abrasives 21
are removed or worn out.
[0033] The hydrophobic material layer 30 is preferably formed as a
self assembled molecular monolayer in which a tail group of
molecules is hydrophobic. Hereinafter, one embodiment of the
disclosed subject matter, in which a hydrophobic self assembled
molecular monolayer is formed on the surface of the abrasive layer,
will be described.
[0034] A technique of forming a self assembled molecular monolayer
(also referred to as self assembled monolayer), which is included
in a nano technology, is a technique for changing surface
properties of an arbitrary material by a nano-based micro thin
film. The self assembled molecular monolayer comprises a head group
reacting with a surface of an arbitrary material, a body for
determining a length of the arbitrary material, and a tail group
for determining the surface properties of the arbitrary material.
When the tail group is hydrophobic, the surface properties of the
self assembled molecular monolayer become hydrophobic.
[0035] A process for vaporizing a material and depositing the
vaporized material on a surface of an abrasive layer 20 of a CMP
conditioner 1 is used in the present embodiment, and one
exemplification of the process will be described in the following
Embodiment 1.
Embodiment 1
Process of Forming Hydrophobic Material Film
[0036] A hydrophobic material film including a self assembled
molecular monolayer is deposited on a surface of an abrasive layer
of the CMP conditioner by charging a CMP conditioner, on which a
hydrophobic material film was not formed, into a process chamber.
At this time, trichlorosilane with formula
C.sub.8H.sub.4Cl.sub.3F.sub.13Si is used as a precursor for the
hydrophobic material film. The deposition conditions were,
preferably: a vacuum degree of 10 to 21 torr; a process temperature
of 150.degree. C.; and a reaction time of 10 minutes.
[0037] Determining whether the hydrophobic material film is formed
or not is confirmed through a contamination degree varying test and
a hydrophobic (or hydrophilic) test during processing of the CMP
conditioner.
Embodiment 2
Contamination Degree Varying Test (Slurry Agglomeration Varying
Test)
[0038] A process for conditioning an actual CMP pad is performed
using the CMP conditioner that was subjected to the process of
Embodiment 1, and the contamination degree of the CMP conditioner
is inspected at time intervals of 30 minutes during the
process.
[0039] The CMP conditioning process is performed using distilled
water at a slurry flow rate of preferably 200 ml/min, a rotational
speed of 50 rpm of the CMP pad and conditioner and an applied
pressure of 8.5 psi thereof. The foregoing conditions are
conditions in which the applied pressure and the slurry flow rate
was increased as compared with the actual CMP conditioning process
in order to confirm the change in a contamination degree of the CMP
pad for a short time. For reference, a contamination degree varying
test performed under the same conditions as the CMP conditions at
the actual working field is also described in Embodiment 5, which
is described later.
[0040] FIGS. 3 and 4 are optical microscopic images in which a
surface of an abrasive layer of the CMP conditioner is photographed
at magnifying powers of .times.100, .times.200, .times.500, and
.times.1000 after performing the CMP conditioning process using a
CMP conditioner for 30 and 60 minutes, respectively.
[0041] As illustrated in FIGS. 3 and 4, it can be confirmed that a
CMP conditioner in which a hydrophobic material film is formed on
the surface of the abrasive layer according to the process of
Embodiment 1 was hardly contaminated by the slurry except that a
contamination area of approximately 5% is found.
Embodiment 3
Contamination Degree Varying Test (Slurry Agglomeration Varying
Test)
[0042] A CMP pad conditioning process is performed using a CMP
conditioner that is not subjected to the process described in
Embodiment 1, i.e., a CMP conditioner on which a hydrophobic
material film was not formed. The contamination degree of the CMP
conditioner according to Embodiment 3 is inspected at time
intervals of 30 minutes during the process. Test conditions, except
the CMP conditioner used in the test, are identical to those of
Embodiment 2. The CMP conditioning process performed, as in Example
2, using distilled water at a preferred slurry flow rate of 200
ml/min, rotational speed of 50 rpm of the CMP pad and conditioner
and applied pressure of 8.5 psi thereof.
[0043] FIG. 5 shows optical microscopic images in which a surface
of the CMP conditioner is photographed at magnifying powers of
.times.100, .times.200, .times.500, and .times.1000 after
performing the CMP conditioning process for 30 minutes. As
illustrated in FIG. 5, it can be confirmed that a surface of an
abrasive layer is contaminated by slurry. It can also be confirmed
that accumulation of contamination by the slurry is greater as time
goes by. It can be seen from the test results that contaminants are
more accumulated from the slurry on the CMP conditioner not coated
with a hydrophobic material film than on the CMP conditioner coated
with a hydrophobic material film, as described with respect to
Embodiment 4.
Embodiment 4
Hydrophobic Test (Hydrophilic Test)
[0044] FIG. 6 shows an optical microscope image showing a
hydrophobicity test result of a CMP conditioner coated with a
hydrophobic material film The CMP conditioner of FIG. 6 has a
contact angle of preferably 110.degree. or more. FIG. 7 shows an
optical microscope image showing a hydrophobicity test result of a
CMP conditioner not coated with a hydrophobic material film. The
CMP conditioner of FIG. 7 has a contact angle approximately of
70.degree.. FIGS. 6 and 7 show hydrophobicity test results of the
CMP conditioners before the CMP conditioning process is
performed.
[0045] Comparing FIGS. 6 and 7 with each other, it can be seen that
the CMP conditioner coated with the hydrophobic material film has a
better hydrophobicity than the CMP conditioner not coated with the
hydrophobic material film. Since the CMP conditioner coated with
the hydrophobic material film has a larger contact angle than the
CMP conditioner not coated with the hydrophobic material film, it
is determined that the CMP conditioner coated with the hydrophobic
material film has a better hydrophobicity than the CMP conditioner
not coated with the hydrophobic material film.
[0046] FIG. 8 shows an optical microscope image showing a
hydrophobicity test result of the CMP conditioner after performing
a CMP conditioning process using a CMP conditioner coated with a
hydrophobic material film. The hydrophobicity test includes placing
a water drop on the surface of the CMP conditioner to determine the
hydrophobicity of the CMP conditioner. It can be seen in FIG. 8,
there is not a large difference from FIG. 6, i.e., the image
showing a hydrophobicity test result of the CMP conditioner before
the CMP conditioning process is substantially similar to the image
showing the CMP conditioner after the CMP conditioning process.
This shows that hydrophobicity of a surface of the hydrophobic
material film is substantially maintained even after the CMP
conditioning process.
[0047] On the contrary, it can be seen that a water drop cannot be
found on the CMP conditioner not coated with the hydrophobic
material film as shown in FIG. 9. This shows that the
hydrophobicity of the CMP conditioner is lost while a CMP
conditioning process is performed using the CMP conditioner. The
result is that the CMP conditioner becomes hydrophilic. As a
result, a measured contact angle of the CMP conditioner was less
than 5.degree..
Embodiment 5
Contamination Degree Varying Test (Slurry Agglomeration Varying
Test)
[0048] A CMP pad conditioning process is performed for 20 hours
under the same conditions as the actual labor site using a CMP
conditioner according to Embodiment 1. The contamination degree of
the CMP conditioner is inspected while performing the process. As
compared with Embodiment 2, the CMP conditioning process is
performed at greatly reduced slurry flow rate and pressure applied
to the CMP pad.
[0049] The CMP conditioning process is performed using preferably
distilled water at a slurry flow rate of 60 ml/min, a rotational
speed of 65 rpm of the CMP pad and conditioner, and an applied
pressure of 0.63 psi thereof. The foregoing conditions are
conditions in which the applied pressure was increased as compared
with the actual CMP conditioning process in order to confirm the
change in a contamination degree of the CMP pad for a short
time.
[0050] FIGS. 10 to 13 show optical microscopic images in which a
surface of the CMP conditioner is photographed at magnifying powers
of .times.100, .times.200, .times.500, and .times.1000,
respectively, after performing the CMP conditioning process for 20
hours according to the foregoing conditions.
[0051] It can be seen from the images in FIGS. 10 to 13, that the
CMP conditioner is hardly contaminated by slurry. Therefore, under
the test conditions of the present embodiment, a CMP conditioner
coated with a hydrophobic material film is hardly contaminated,
thus it can be assumed that in the actual process, the CMP
conditioner coated with a hydrophobic material is also hardly
contaminated, and such an effect is sustained for a long time.
Embodiment 6
Contamination Degree Varying Test (Slurry Agglomeration Varying
Test)
[0052] A process for conditioning an actual CMP pad is performed
for 20 hours using a CMP conditioner that was not subjected to the
process described in Embodiment 1, i.e., a CMP conditioner on which
a hydrophobic material film is not formed. Test conditions are
similar to those described in Embodiment 5.
[0053] FIGS. 14 to 17 show optical microscopic images in which a
surface of a CMP conditioner is photographed at magnifying powers
of .times.100, .times.200, .times.500, and .times.1000,
respectively, after performing the CMP conditioning process for 20
hours according to the foregoing conditions using a CMP conditioner
without a hydrophobic material film. As can be seen from the images
shown in FIGS. 14 to 17, it can be confirmed that the entire area
on a surface of an abrasive layer was greatly contaminated by
slurry. Therefore, it can be confirmed again that accumulation of
contaminants by the slurry is more increased in the CMP conditioner
not coated with a hydrophobic material film as compared with the
CMP conditioner coated with a hydrophobic material film.
[0054] Although a coating method of a hydrophobic material film
using FOTS (fluorooctyltrichlorosilane) as a precursor has been
described above, DDMS (dichlorodimethylsilane), FDA
(perfluorodecanoic acid), FDTS (perfluorodecyltrichlorosilane), and
OTS (octadecyltrichlorosilane) may be used as the precursor.
Furthermore, the deposition process using the precursor may include
a V-SAM (vapor-SAM) process, an L-SAM (liquid-SAM) process, and a
bulk polymerization process using plasma.
[0055] The various embodiments described above can be combined to
provide further embodiments. All of the U.S. patents, U.S. patent
application publications, U.S. patent application, foreign patents,
foreign patent application and non-patent publications referred to
in this specification and/or listed in the Application Data Sheet
are incorporated herein by reference, in their entirety. Aspects of
the embodiments can be modified, if necessary to employ concepts of
the various patents, application and publications to provide yet
further embodiments.
[0056] These and other changes can be made to the embodiments in
light of the above-detailed description. In general, in the
following claims, the terms used should not be construed to limit
the claims to the specific embodiments disclosed in the
specification and the claims, but should be construed to include
all possible embodiments along with the full scope of equivalents
to which such claims are entitled. Accordingly, the claims are not
limited by the disclosure.
* * * * *